IMD series
Iljin Metal bond Diamond
ILJIN DIAMOND Co., Ltd.
Diamond
IMD series
IMD-G
IMD-F
IMD-D
Sawing of granite & ceramic tiles
Core drill of glass
Rough polishing of granite
Crystal & glass
decorating groove
Reinforced glass edge
Ferrite motor core
CMP pad conditioner
Silicon nitride OD
grinding
Middle stage
grinding of Crystal
& granite
IMD-B
Glass (Normal,
TFT-LCD, Motor)
edge
Cut-off wheel for
crystal or glass
Final polishing of
granite
IMD-A
Fired tungsten
carbide
Dental burrs
Beveling of glass
and mirror
Cut-off wheel for
glass & quartz
Ferrite grinding
Diamond
Toughness Index
80
Toughness Index
70
60
G
F
50
D
40
B
30
20
10
A
TP
IGD II
80/100
100/120
120/140
140/170
170/200
200/230
230/270
270/325
325/400
400/500
Mesh Size
Diamond
Grades equivalent
IMD-G
IMD-F
IMD-D
IMD-B
IMD-A
MBG-660
MBS-640
MBG-620
MBG-610
PDA-999
PDA-989
PDA-878
PDA-P768
Diamond
Shape comparison
As-grown Product
IMD-TP
Crushed Products
IGD-II
IGD-V
Diamond
Ti coating
MESH
Weight Percent Spec.
80/100
2wt% ±0.5
100/120
3wt% ±0.5
120/140
4wt% ±0.5
140/170
5wt% ±0.5
170/200
6wt% ±0.5
200/230
7wt% ±0.5
230/270
8wt% ±0.5
270/325
9wt% ±0.5
325/400
10wt% ±0.5
400/500
11wt% ±0.5
Diamond
Ferrite Motor Core Grinding
C
Test Condition
Area :
Wheel Type :
Bond :
Workpiece
Material :
Mesh Size :
Concentration :
Peripheral Speed :
DOC :
Feed rate :
Japan
N/A
Electroplated
Ferrite motor
core
100/120
N/A
N/A
N/A
N/A
A
EA
B
20000
IMD-F
MBG-660
D Company
15000
10000
5000
0
A
B
C
Diamond
Glass Grinding
Test Condition
15000
Area :
Japan
Wheel Type :
N/A
Bond Material :
Bronze (Cu-Sn)
Work piece
Material :
Glass
Mesh Size :
170/200
Concentration :
N/A
Peripheral Speed :
N/A
DOC :
N/A
Feed rate :
N/A
IMD-F
IMD-F Ti
9700 9500
5500
G-ratio
Power Consumption
Diamond
Safety Glass Grinding
Korea
Industry
Automotive
Part Name
Safety Glass
Operation
Glass Edge Grinding (Bando)
Workpiece
Material
Glass
Wheel Specific
Metal Bond
Φ200 x 4w x 75H x 11t
Diamond &
cBN
IMD-F Ti (Ti Coating)
Process
Parameters
Metal Bond
Wheel Vs : 1600m/min
Feed rate : 10~20m/min
Results
Part/hr (ea)
Remark
250
14000
200
Wheel Life (m/wheel)
Area
150
100
50
0
STD
IMD-FTi
12000
10000
8000
6000
4000
2000
0
STD
IMD-FTi
Diamond
Ti coated wheel grit
ILJIN DIAMOND Co., Ltd.
Grit Business Unit
Diamond
1. 코팅 광학 형상
기존
IMD-Fti
170/200
신규
IMD-Fti
170/200
• 광학사진에서 기존 방식은 상당히 어두운 색을 띄고 표면이 거칠어 보임.
• 신규 샘플은 기존 방식의 제품과 비교하여 광택을 띄고 표면이 매끄러움.
Diamond
2. 코팅 SEM 형상
기존
IMD-Fti
170/200
신규
IMD-Fti
170/200
• 기존 제품은 edge가 벗겨지거나 코팅층이 불균일하게 형성되었음.
• 신규 제품은 코팅층이 일관성있게 형성되어 있음.
Diamond
2. 코팅 SEM 형상
기존
IMD-Fti
170/200
신규
sputtering
IMD-Fti
170/200
• 고배율 관찰에서도 기존 제품에 비해 치밀한 코팅층을 유지하고 있고, edge부분도 손상이 없음.
Diamond
3. TRS test result
Kg/mm2
As-is
New coating
#1
1.72
1.32
#2
1.96
1.47
#3
1.75
1.43
#4
1.61
1.50
#5
1.66
1.60
Avg
1.74
1.46
2
Sintering Condition
Bond system: 50%Cu-20%Sn30%Fe
Sintering Temp: 700℃/2min
TRS Test-Kgf/mm
3.0
1.74
Transverse Rupture Strength Test
Dia grade/size: IMD-FTi 170/200
mesh
Concentration: 100
Segment size: 6.4*6.4*40mm
TRS M/C: ZWICK Z050
Test condition: ISO B Type
1.46
0
New coating
As-is
Diamond
4. 소결 후 본드와의 결합 상태
기존
IMD-Fti
170/200
신규
IMD-Fti
170/200
• SEM 관찰 시 신규 제품이 본드층과의 접합성이 기존 제품에 비해 우수한 것으로 관찰됨.
Diamond
5. 소결 후 TIP 파단면 상태
New Coating
As-is
• SEM 관찰 결과 다이아몬드 표면은 모두 Ti 코팅층으로 형성되어 있음.
• 기존 제품과 신규 제품과의 소결 후 탈락된 부분을 비교 관찰한 결과 신규 제품에 비해 기존 제품이 약 20% 가 탈락율
이 높은 것으로 분석됨.
Diamond
Diamond
for CMP Pad conditioner
ILJIN DIAMOND Co., Ltd.
Diamond
Trend of CMP Process
Metal vs. Oxide CMP : Million $
CMP growth by material
 Metal CMP의 성장속도가 높으며, 이 중 Cu CMP의 성장율이 높음.
 Cu CMP에서 scratching issue 및 고집적화에 의한 diamond의 fine, narrow 경향 심화
 Metal CMP에서 Diamond의 Shape, Narrow PSD, Diamond purity의 중요성이 강조
Diamond
CMP Process
Logic
Memory
 Memory Semiconductor와 Logic 간에 가공하는 피삭재의 차이에 따라 적용되는 Diamond는 틀리게 적용
Diamond
Tech. Trend of CMP Conditioner
Typical Type of CMP Conditioner
Sintering
Electroplating
Blazing
Pattern, Narrow Size, Special Shape
• CMP Conditioner에서 요구되는 Cutting Rate가 높아지고, 고 집적화 되면서 Diamond는
fine, narrow한 PSD가 요구됨.
• Conditioning 효과를 높이기 위하여 pattern 및 diamond의 돌출높이는 높이기 위한 개발,
적용 진행 중
Diamond
Tech. trend of diamond for CMP
As was
Coarse size
80/90
90/100
Blocky shape
IMD – F,D
PDA 999
MBG 660
As is
Increased number
of particles
(High Density)
Higher Cutting Rate
(CR)
Medium / fine size
100/120
140/170
170/200
200/230
Angular shape
IMD – B,A,TP
PDA 878
MBG 620
Diamond
Special process for CMP only
PSD
Shape
Impurity
Special Treatment – I
Special Treatment – II
 Narrow PSD (Double size → Single mesh → Micron size)
 Over size particle removing process (3 stage sieving at clean room)
 Precision heating control (HPHT)
 Perfect shape sorting and consistency
 Minimized metal inclusions using high magnetic field
 Suitable for electroplating and vacuum brazing process
 Removing the twin, sharp needles and weak crystal
 No damage of normal crystal’s sharp edge
 To prevent the Ni over plating and nodules on diamond crystal
 Perfectly clean and non electric conductivity on the surface of diamond
 De-magnetizing
Diamond
Pressure (GPa)
Shape – HPHT technology
6.5
(100)
(111)+(100)
(111)
6.0
(110)
5.5
1300
1400
1500
Temp (0C)
A
B
C
D
E
F
G
H
I
Diamond
Shape – HPHT technology
IMD-F
IMD-T
Diamond
Shape – Sorting technology
IMD-G
IMD-F
IMD-D
IMD-B
IMD-A
IMD-TP
Diamond
Special treatment I
IMD-NB1
IMD-NA1
IMD-NB2
IMD-NA2
Diamond
Special treatment II
Diamond
Special treatment II
Metal impurities on the surface of diamond grit for CMP
Element
ILJIN
2hrs
4hrs
DI
8hrs
2hrs
(unit : ppb)
E6
4hrs
8hrs
2hrs
4hrs
8hrs
Li
-
-
0.00
0.01
0.01
0.01
0.00
0.01
0.01
Na
1.54
1.28
1.22
1.79
3.37
3.76
13.34
12.39
14.53
Mg
0.80
0.89
1.00
0.13
0.21
0.20
6.66
6.02
6.61
Al
0.42
0.39
0.47
0.34
0.64
0.61
0.33
0.43
0.50
K
0.04
-
-
0.15
-
-
2.17
2.25
2.36
Ca
1.22
1.83
1.94
1.47
2.01
2.12
55.72
54.72
58.23
Cr
0.12
0.36
0.35
0.35
4.71
4.58
0.52
9.80
10.52
Mn
0.21
0.27
0.25
0.10
0.41
0.44
0.07
1.14
1.42
Fe
7.25
23.02
30.47
5.19
31.41
44.57
14.38
97.34
135.27
Co
-
-
-
0.01
0.03
0.04
0.01
0.13
0.15
Ni
1.08
4.30
6.82
1.39
5.79
9.25
4.78
20.64
31.59
Cu
0.92
0.93
0.83
1.96
2.23
2.39
0.28
0.38
0.44
Zn
0.80
1.10
1.29
0.67
0.90
1.15
0.52
1.36
1.92
As
0.01
0.01
0.01
-
-
-
0.01
0.02
0.02
Sr
0.03
0.03
0.03
0.01
0.03
0.03
0.17
0.18
0.18
Cd
0.01
0.01
0.00
0.00
0.00
0.01
0.00
0.05
0.02
Ba
0.03
0.03
0.03
0.01
0.04
0.05
1.05
1.17
1.20
Pb
0.81
0.77
0.69
0.06
0.13
0.14
0.35
0.43
0.48
Diamond
Special treatment II
Metal impurities on the surface of diamond grit
ILJIN
DI
E6
150
135.27
100
58.23
(ppb) 50
44.57
31.59
30.47
14.53
10.52
10
9.25
6.82
4.58
3.76
2
1.94
2.39
2.12
1.22
0.83
0.35
0.44
0
Na
Ca
Cr
Cu
Fe
Ni
Diamond
End of documents
Thank you !
Diamond