Assembleon's answer to the
changes in the manufacturing value
chain
Marco van Oosterhout
Senior Manager, Product Management and Marketing.
AIMP 2014 “Marketing in a disruptive world”
1. Introduction
2. Market analysis
3. Resulting product portfolio
2
Plaatsen van SMD componenten
IC’s
Discrete halfgeleiders
R & C chips
Apple iPhone 5
3
Een typische flowline …
Soldeerpasta
aanbrengen
Componenten plaatsen
PCB laden
Solderen
PCB ontladen
4
Assembléon’s plaats in de flowline
5
• Meer dan 30 jaar ervaring
• 400 professionals wereldwijd
• 18,000 geinstalleerde units (20kcph equivalent)
Veldhoven, NL
Suzhou
Hong Kong
Alpharetta, GA
Singapore
6
Het leveren van concurrerende oplossingen
voor de elektronische maakindustrie
gebaseerd op onze sterkten in plaatsingsmachines
7
1. Introduction
2. Market analysis
3. Resulting product portfolio
8
Electronics value chain
Source: Prismark partners, 2011
9
World - All applications (Component consumption based)
Autom.
5%
Def./Aero
0%
Med./Industr
.
18%
Consumer
32%
Comm.
19%
Computer
26%
World
Quality (Fit Core Competence)
Personal (Value oriented)
Personal (Price oriented)
Consumer (price oriented)
Other (price oriented?)
Protec 2011 P&P (M$)
Asia
% in region % of world
23%
54%
14%
79%
30%
82%
19%
83%
15%
67%
100%
74%
3,596
Europe
% in
region
% of world
17%
22%
15%
15%
33%
10%
22%
9%
13%
14%
100%
14%
2,881
Americas
% in
region
% of world
37%
24%
15%
6%
21%
8%
12%
8%
15%
19%
100%
13%
365
% in
region
42%
6%
18%
13%
22%
100%
350
10
Smart phones
!
Smart phones
MEMS & sensors in mobile phones
12
Industrial Electronics
Power electronics applications overview
13
Automotive Electronics
Example: Engine control unit (ECU)
•
•
Most important requirement: reliability !
̶ Expected life time: > 12 to 15 years
̶ Large operating temperature variations: -40°C < T < +125°C
̶ Relative humidity variations: 25 % up to 99% RH
Typical connector: ECU interface connector (H = 24 mm)
14
Automotive Electronics
Typical component dimensions
(automotive power electronics)
SMD transformer
(13.5 mm height; m = 9 gr.)
Power storage chokes
15
1. Introduction
2. Market analysis
3. Resulting product portfolio
16
SWOT Analysis (2/2)
O1
S1
S2
O2
O3
+++
O5
+
+
O6
O7
T1
T2
+
+
++
+
+
++
S3
T3
T4
T5
T7
++
+
++
++
S5
++
S6
++
+
++
+
--
W1
W2
---
W3
---
--
---
--
--
W4
++
-
-
--
-
--
-
--
-
--
-
--
--
---
W5
-
-
---
-
W6
--
--
--
--
W7
T6
++
+
++
S4
S7
O4
-
-
--
-
17
Competences analysis
• Core
̶
Intrinsic high quality and accuracy of placement process at high speed
• Competences
̶
̶
̶
̶
Willingness to adapt system to specific needs
Direct sales and service organization
Willingness to adapt system to specific needs
Environment conscious (“Green”) and Ethical business principles
18
Key processes and competences
Robot
Parallel single pick & place concept
Placement
Head
Component
Alignment
Frame
PCB Transport
Component
Feeding
Board
Alignment
19
Assembléon’s Value Chain
1. Research &
Development
2. Design &
Engineering
3. Prototyping &
Industrialization
Using core competences
Core
Partially Core
Assembléon is about
- Strenghtening our own core competences
- Using strong core competences of partners
- Outsourcing non-core activities
Non Core
4. Component
production
5. System integration
6. Sales & Service
20
Resulting into new solutions
SMT
Common SMD
Hybrid
Market
Semicon Backend
0201
01005
008004
Wafer Level
Processing
Wire Bonding
A-Series
Flip Chips
PoP
Flip Chip
Stacking
Q-Driven
Markets
AX-iFlex
SSD
Memory
Pin-inPaste
Modules
Embedded
Devices
Wafer Level
Packaging
(WLP)
Front End
Hybrid Modules
iFlex
Snap-in
connectors
H1
Hybrid WLP
Manual
Insertion
Hybrid Memory
Hybrid Embedded
Clinching
Hand
Mounting
Final Assembly
21
Product Portfolio
Embedded
AX-301 Hybrid Modules
AX-501 Hybrid Modules
AX-301 Hybrid Embedded
DRAM
AX-501SHybrid Embedded
Scale-able
Safety Critical / Industrial
AX-501 Hybrid Memory
Scale-able
Scale-able
AX-501
35µ embedded passive accuracy
18µ embedded active accuracy
High Output (scale-able)
Chip and DRAM shooting
Scale-able
AX-501+iFlex
AX-301+iFlex
iFlex
Scale-able
30
01005: force control, 35µ accuracy
FC: force control, 18µ accuracy
High Output (scale-able)
Medium to large volume
Best in class First Pass Yield
Factory automation
Scale-able
AX-301
SMT
Factory Integration
(e.g. SiP/MCM/PoP)
AX-301 Hybrid Modules - WLP
60
Scale-able
90
> 120
Factory Integration
Modules
Force control, 10µ accuracy
Thin board transport
Advanced PCBA
WLP
Small batch manufacturing
Segmented changeovers
Many Intelligent feeding positions
Fast trolley changeovers
Scheduling / Just in Time
Output (kcph)
22