3-axis accelerometer and strain sensor readout MEMS-based capacitive sensors Juan Santana Richard van den Hoven Imec-Holst Centre The Netherlands 1st MEMSCON Event - 07 October 2010, Bucharest Imec- Holst Centre Overview Accelerometer Summary • MEMS based charge sensing • Accelerometers & Strain sensors Technical Specifications • Programmable gain by timing control, sensitivity and accuracy read-out • Low-power • TSMC CMOS 0.25m with operating voltage (3.0V) • ±2 g input range, 1mg resolution • High linearity (1%) • Parasitics insensitive Applications • Strain sensor Sensor area Accelerometers, strain sensors for structural assessment, automotive and BAN, industrial and healthcare 1st MEMSCON Event - 07 October 2010, Bucharest Imec- Holst Centre Architecture CONTROL V1 Novel Technique Cs Integration of multiple pulses SW4 Cin OA Variable gain set by number of pulses 26 SW2 Cr SW1 Integrated noise proportional to √N SW5 SW3 Timing allows duty-cycle control V2 VREF1 VREF2 GND Signal-to-noise ratio control Architecture Decouples sensor from amplifier CLK,V1,V2\ 250 160 310 Reset Allows readout of wide range of sensors Integrate Accurate sin(x)/x suppresses artifacts Sample Xvalid 34a Multiplexed output 610 Yout Zout Xout Timing sequence 1st MEMSCON Event - 07 October 2010, Bucharest Imec- Holst Centre ASIC ESD System Level characteristics 3-channel architecture Bias stage Y-channel 1 Analog multiplexed buffered output 1 Analog non-multiplexed (X channel) Synchronization signals available 4mm X-channel Embedded filtering (sin(x)/x response) 1 Bias voltage (VDD) and 1 clock Z-channel Minimum capacitance ESD structures MUX+buffer +digital 2mm 1st MEMSCON Event - 07 October 2010, Bucharest Imec- Holst Centre Results Accelerometer Variable sensitivity ~N Sensitivity (V/g) 25 20 15 10 5 0 0 300 400 Integrated Noise ~√N Total integrated noise (V) 2500 2000 Vout [mV] 1500 1000 500 -10000 0.005 0.004 0.003 0.002 y = 0.0003x0.4206 0.001 0.000 0 -20000 200 Number of pulses Strain sensor -30000 100 0 10000 Strain [µstrain] 20000 30000 0 100 200 300 400 Number of pulses 1st MEMSCON Event - 07 October 2010, Bucharest Imec- Holst Centre Benchmarking Parameter Denison Paavola IMEC-NL Acceleration strain range ~±1g ISSCC2008 ±2g Supply voltage Power Noise Floor 1.7-2.2V 1.5µW 1mg/√Hz 1.0V 1.5µW 704µg/√Hz (accel.) Non-linearity <1% --- Bandwidth FOM 10Hz 1Hz <1% (accelerometer) <0.6% (strain sensor) 100Hz F√(W/Hz) 8.1×10-22 µW·µg/Hz Technology 1400 4.41×10-20 881 0.8µm CMOS 0.25µm CMOS 0.25µm CMOS Area ---- 2.25mm² c 2 mm² (active) 8 mm2 ±2.5g ±20,000µe Variable gain 3.0V 15µW 70µg/√Hz State-of-the-art readout architectures 1st MEMSCON Event - 07 October 2010, Bucharest Imec- Holst Centre Conclusions Versatile architecture for MEMS-based capacitive sensors Cost effective design requires less external components Low Power Sampled output relaxes demands of following stages Embedded filtering Novel technique to control gain and SNR of the readout Can be extended to many other types of capacitive based sensors 1st MEMSCON Event - 07 October 2010, Bucharest Company