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ANSYS Multiphysics 8.0
Technology Overview &
Benefits
Dr. Paul Lethbridge - Product Manager
Multiphysics 8.0 Customer 3.0- 1/30/04
Topics Covered
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What is Multiphysics?
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Multiphysics Benefits
Educational Products
Market Applications
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Market segments by Technology
Market Segments by Industry
Multi Field (Coupled Physics) Capabilities
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Direct physics coupling
Sequential physics coupling
Multi-field Solver (New feature at release 8.0)
Other New features
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Enhanced non-linear Piezoelectric & piezoresistive element.
Fluid damping elements
Cyclic Symmetry for Magnetostatics
Low Frequency Electromagnetic Contact
Coupled E-B Particle Tracing
Re-meshing for FSI
Selected Multi-Physics Examples
Product Roadmap & Strategy
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Transition to Workbench Environment
Product Websites
Multiphysics 8.0 Customer 3.0- 1/30/04
The ANSYS Family of Products
ANSYS Multiphysics
ANSYS University
ANSYS Mechanical
ANSYS FLOTRAN
ANSYS Emag
ANSYS Professional
ANSYS Structural
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Extreme functionality
The whole enchilada!
Educational/Non
Commercial Use
Products
High performance
mechanical & Thermal
Powerful tools
for the physics specialist
Ease of use &
Entry level capability
ANSYS MCAD & ECAD Connection products
Multiphysics 8.0 Customer 3.0- 1/30/04
Topics Covered
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What is Multiphysics?
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Multiphysics Benefits
Educational Products
Market Applications
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Market segments by Technology
Market Segments by Industry
Multi Field (Coupled Physics) Capabilities
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Direct physics coupling
Sequential physics coupling
Multi-field Solver (New feature at release 8.0)
Other New features
•
•
•
•
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•
Enhanced non-linear Piezoelectric & piezoresistive element.
Fluid damping elements
Cyclic Symmetry for Magnetostatics
Low Frequency Electromagnetic Contact
Coupled E-B Particle Tracing
Re-meshing for FSI
Selected Multi-Physics Examples
Product Roadmap & Strategy
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Transition to Workbench Environment
Product Websites
Multiphysics 8.0 Customer 3.0- 1/30/04
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What is ANSYS Multiphysics?
A general purpose analysis tool allowing a user to to combine the
effects of two or more different, yet interrelated physics, within one,
unified simulation environment.
Electromagnetic
Thermal
Magnetic
Fluid
Electrostatic
Electrical
Structural
Multiphysics 8.0 Customer 3.0- 1/30/04
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Benefits of Multiphysics
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No other analysis tool provides as many physics under one roof!
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Seamless integration with ANSYS Probabilistic Design System (PDS).
Greatest breadth and technical depth of physics.
Fully parametric models across physics, geometry, materials, loads.
Perform Design Optimization across physics, geometry, materials and
loads.
Extremely sophisticated analysis capability.
Bottom line benefits:
– Analysis closely match reality – bringing reality to the desktop
– Reduced assumptions that question certainty and compromise
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accuracy.
Lower cost: Fewer analysis software tools to purchase,learn &
manage.
Lower cost: R&D process compression
Multiphysics 8.0 Customer 3.0- 1/30/04
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Benefits of Multiphysics
“The use of Multiphysics allows us to return to the basics
of engineering where a model and the predictive solution
closely approximate reality; this allows the engineer to
design with a high degree of confidence that the answers
are correct.”
Dr. Howard Crabb - Ford Motor Company
Multiphysics 8.0 Customer 3.0- 1/30/04
Educational Products – Problem Size Limits
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Multiphysics 8.0 Customer 3.0- 1/30/04
Topics Covered
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What is Multiphysics?
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Multiphysics Benefits
Educational Products
Market Applications
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–
Market segments by Technology
Market Segments by Industry
Multi Field (Coupled Physics) Capabilities
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•
Direct physics coupling
Sequential physics coupling
Multi-field Solver (New feature at release 8.0)
Other New features
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•
•
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Enhanced non-linear Piezoelectric & piezoresistive element.
Fluid damping elements
Cyclic Symmetry for Magnetostatics
Low Frequency Electromagnetic Contact
Coupled E-B Particle Tracing
Re-meshing for FSI
Selected Multi-Physics Examples
Product Roadmap & Strategy
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Transition to Workbench Environment
Product Websites
Multiphysics 8.0 Customer 3.0- 1/30/04
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Market Applications by Technology
Three “broad” Market segments uniquely identified as being inherently Multiphysics
Sensors & Transducers
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Inertial
Actuators
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Pressure
Mass
Proximity
Thermal
Acoustic
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Fluid systems
–Hydraulic
–Pneumatic
–Fuel
–Microfluidics
Electromagnetic
machines
–Pumps
–Generators
–Motors
–Solenoids
Click mouse to progress
Processes
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Induction heating
RF Heating
Heat-exchangers
–Electronics
cooling
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–Automotive
–A/C systems
SEMICON
–Ion implanters
–PVD / CVD
Multiphysics 8.0 Customer 3.0- 1/30/04
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Market Applications by Industry
Multiphysics is not limited to any specific industry.
There are analysis applications and opportunity across the board.
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Electronics
Automotive
Aerospace / Space
Marine
SEMICON
Government / Military
Medical / BioMed
Pharmaceutical
Appliances
Multiphysics 8.0 Customer 3.0- 1/30/04
Topics Covered
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What is Multiphysics?
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Multiphysics Benefits
Educational Products
Market Applications
–
–
Market segments by Technology
Market Segments by Industry
Multi Field (Coupled Physics) Capabilities
•
•
Direct physics coupling
Sequential physics coupling
Multi-field Solver (New feature at release 8.0)
Other New features
•
•
•
•
•
•
Enhanced non-linear Piezoelectric & piezoresistive element.
Fluid damping elements
Cyclic Symmetry for Magnetostatics
Low Frequency Electromagnetic Contact
Coupled E-B Particle Tracing
Re-meshing for FSI
Selected Multi-Physics Examples
Product Roadmap & Strategy
–
Transition to Workbench Environment
Product Websites
Multiphysics 8.0 Customer 3.0- 1/30/04
Coupled Physics Capabilities: Methods
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There are two methods to couple physics, Direct & Sequential.
Direct - solves all DOF’s at the FEA coefficient matrix level.
Sequential - solves DOF’s for one physics then passes results as loads &
boundary conditions to the second physics. At least two iterations, one for each
physics, in sequence, are needed to achieve a coupled response.
There are many confusing terms for the two methods:
Coupled Physics Terminology
Preferred ANSYS Inc.
“descriptive usage”
Strict Mathematical usage
Archaic
Use at your peril!
Direct
Sequential
Matrix
Load vector
LHS
RHS
Monolithic
Staggered
Strong
Weak
Tight
Loose
Full
Partial
Multiphysics 8.0 Customer 3.0- 1/30/04
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Direct Coupled Physics Applications
Coupled Physics
Thermal-Structural
Applications
Anything with a structure!
Gas turbines.
Pressure-Structural (Inviscid FSI)
Acoustics, sonar, SAW
Piezoelectric
Microphones, sensors
Piezoresistive
Pressure sensors, strain gauges, Accelerometers
Circuit coupled electromagnetics:
CIRCUIT124
CIRCUIT125
Electrostatic- Structural:
TRANS126
TRANS109
Electro-thermal-structural -magnetic:
SOLID5, PLANE13
SOLID62, SOLID98
Fluid-thermal
Motors, MEMS
MEMS
IC, PCB electro-thermal stress, MEMS actuators
Piping networks, manifolds
Multiphysics 8.0 Customer 3.0- 1/30/04
Sequential Coupled Physics Applications
Thermal-Structural
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Anything with a structure!
Gas turbines.
Electromagnetic-thermal
Induction heating, RF heating
Electromagnetic-thermal-structural
Electrostatic-Structural
Electrostatic-Structural-Fluidic
Electrostatic – Charged particle
Magnetic - Structural
Fluid-Solid:
FLOTRAN based FSI
MpCCI: Bi-directional FSI
CFX-ANSYS unidirectional interface
Electromagnetic-Solid-Fluid
Thermal-CFD
Multi-field Solver
Sigfit: Unidirectional, Structural – Optical
MEMS
Ion Optics, Field Emission Display Technology,
Analytical instruments
Solenoids, electromagnetic machines
Aerospace, automotive fuel, hydraulic systems, fluid
bearing,
MEMS fluid damping, drug delivery pumps, heart
valves.
Fluid handling systems, EFI, hydraulic systems
Electronics cooling
Many! All of the above!
Automotive lighting, astronomy, any optical
instruments
Multiphysics 8.0 Customer 3.0- 1/30/04
Topics Covered
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What is Multiphysics?
•
•
Multiphysics Benefits
Educational Products
Market Applications
–
–
Market segments by Technology
Market Segments by Industry
Multi Field (Coupled Physics) Capabilities
•
•
Direct physics coupling
Sequential physics coupling
Multi-field Solver (New feature at release 8.0)
Other New features
•
•
•
•
•
•
Enhanced non-linear Piezoelectric & piezoresistive element.
Fluid damping elements
Cyclic Symmetry for Magnetostatics
Low Frequency Electromagnetic Contact
Coupled E-B Particle Tracing
Re-meshing for FSI
Selected Multi-Physics Examples
Product Roadmap & Strategy
–
Transition to Workbench Environment
Product Websites
Multiphysics 8.0 Customer 3.0- 1/30/04
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Multi-field Solver - Pretext
Situation Prior to Release 8.0:
• Significant number of multi-physics problems can be addressed with
sequential coupling using core elements.
• Our current tools for sequential coupling require advanced APDL
and domain knowledge to process solution.
• We have out-grown custom-command macros that perform
sequential coupling e.g..:
–FSSOLV
–ESSOLV
• Fluid Solid Interaction (FSI) was a first step towards automated
sequential coupling technology
Multiphysics 8.0 Customer 3.0- 1/30/04
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Multi-field Solver – Why?
There is Growing Market Requirement to:
• Solve multi-physics problems from all industries.
• Often need to incorporate more than two physics.
• Couple more easily to external codes
• Provide an easier to use Multiphysics environment for current
analysts.
In Response:
ANSYS have developed a “multi-field” solver to automate
sequential coupling, and be general enough in the design for
most multi-field solution requirements”
• The multi-field solver is an evolution of our successful FSI solver
Multiphysics 8.0 Customer 3.0- 1/30/04
Multi-field Solver – Implementation
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Model and mesh
– Single model of physical parts.
– Multiple, separate meshes for each “Field”, derived from base solid model.
What is a FIELD ?
– A FIELD is an Finite Element model set up to perform a single solution
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It may solve for a single physics (e.g. a mechanical structure)
It may solve for directly coupled physics (e.g.. piezoelectrics)
– A selection of element types is used to define a FIELD
– Each FIELD has it’s own mesh
– Loads, boundary conditions, solver selection are all part of the FIELD
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definition
A FIELD may be any analysis type (Static, Harmonic, Transient)
Each FIELD creates it’s own results file
A FIELD may be defined (imported) from an external code via a CDB file.
Multiphysics 8.0 Customer 3.0- 1/30/04
Multi-field Solver – Implementation
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Interfacing between Fields
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Fields “talk” to one another through surface or volumetric interfaces
Field coupling is realized by mapping loads from one mesh to another
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Automated mesh “morphing” of non-structural domains is available for all
non-structural element types.
– Support similar or dissimilar meshes
– Supports 1st order and 2nd order elements or mixtures of both
Multifield Solution
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The solver loops through all fields
Supports static, transient and harmonic analysis
Convergence is monitored at the interfaces where loads are transferred.
Multiphysics 8.0 Customer 3.0- 1/30/04
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Multi-field Solver – Implementation
Time loop:
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For transient analysis, refers to solution in time
For static analysis, refers to each load step
For harmonic analysis, refers to harmonic analysis
within time step
Time Loop
Stagger Loop
Field Loop ( i=1,n)
Stagger loop:
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Implicit coupling of various fields in time loop
Number of stagger iterations determined by
convergence of load transfer or max stagger
iterations
Physics Field 1
Physics Field 2
Physics Field n
Field loop:
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Field solution with specific solution options
Load transfer to a particular field occurs before
solution of the field
Dissimilar mesh across surface/ volume interface
between fields
End Field Loop
End Stagger Loop
End Time Loop
Multiphysics 8.0 Customer 3.0- 1/30/04
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Multi-field Solver- Physics Loads
Physics Loads Transferred in Field Loop
PHYSICS
CFD
SEND
RECEIVE
Heat flux, Forces, Temperatures
Displacement, Velocity, Temperature,
Heat rate, Forces
Temperature, heat flux
Temperature, Heat flux, Heat rate,
Displacement
STRUCTURAL
Displacement, Velocity
Forces, Temperature, Displacement
MAGNETIC
Forces, Heat rate
Temperature, Displacement
ELECTRIC
Forces, Heat rate
Temperature, Displacement
High Frequency
ELECTROMAGNETIC
Heat Rate
Temperature, Displacement
THERMAL
Multiphysics 8.0 Customer 3.0- 1/30/04
Multi-field Solver – Multi-user deployment
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No need for a super user to handle all physics, separate physics can be
processed by individual analysis experts in the company:
CAD Model
Physics 1 Engineer
e.g. CFD
Model pre processing
Physics 2 Engineer
e.g. Electromagnetics
Model pre processing
Physics 3 Engineer
e.g. Structural
Model pre processing
(loads, boundary conditions
& mesh)
(loads, boundary conditions
& mesh)
(loads, boundary conditions
& mesh)
Physics 4 Consultant
Engineer
e.g. HF electromagnetics
Model pre processing
(loads, boundary conditions
& mesh)
Multi-field
Analysis
Intra-Company Resource
Multiphysics 8.0 Customer 3.0- 1/30/04
Multi-field Solver – Multi-user deployment
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Each physics has its own CDB and results (*.R*) file.
Solid Model
Physics 1
e.g. CFD
Model pre processing
Physics 2
e.g. Electromagnetics
Model pre processing
Physics 3
e.g. Structural
Model pre processing
Physics 4
e.g. HF electromagnetics
Model pre processing
(loads, boundary conditions
& mesh)
(loads, boundary conditions
& mesh)
(loads, boundary conditions
& mesh)
(loads, boundary conditions
& mesh)
CFD CDB File
Electromagnetics
CDB file
Structural CDB file
HF Emag CDB file
Multi-field Solver
Field1.RFL Results File
Field2.RMG Results file
Field3.RST Results file
Field4.RMG Results file
Multiphysics 8.0 Customer 3.0- 1/30/04
Multi-field Solver - dissimilar mesh interface
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Example of dissimilar mesh between physics:
Thermal-mechanical mesh: 15,000
elements
CFD mesh: 600,000 elements
(Fluid region not shown)
Multiphysics 8.0 Customer 3.0- 1/30/04
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Multi-field Solver- Summary
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Physics is treated as a "field" with an independent model & mesh
Each field is defined by a group of element types
Load transfer regions are identified by surfaces and/or volumes
Sequential (Load vector) coupling between fields
Each field may have:
–Different analysis types
–Different solvers and analysis options
–Different mesh descretization
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Each field can be imported from an external solver (e.g. CFX)
Surface load transfer across fields
Volumetric load transfer across fields
Automated morphing of non-structural elements
Independent results files for each field
Multiphysics 8.0 Customer 3.0- 1/30/04
Multi-field Solver- Physics & Applications
Multi-Field Coupled Solver - Physics
Thermal-Structural
Electromagnetic-thermal
Applications/ Markets
Anything with a structure!
Gas turbines.
Induction heating, RF heating
Electrostatic-Structural - Fluidic:
MEMS
Electrostatic – Charged particle
Ion Optics, Field Emission Display Technology,
Analytical instruments
Magnetic – Structural - Thermal
Solenoids, electromagnetic machines, Bus bars
Fluid-Solid:
Aerospace, automotive fuel, hydraulic systems,
fluid bearing,
MEMS fluid damping, drug delivery pumps,
heart valves.
FLOTRAN based FSI
CFX-ANSYS unidirectional interface
Thermal – CFD
Electronics cooling, engines
Magnetic - CFD
MR fluids, Ferro-fluidics, automotive
Third Party/External Product coupling:
Sigfit: Unidirectional, Structural – Optical
MpCCI: Bi-directional FSI
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Automotive lighting, astronomy, any optical
instruments
Multiphysics 8.0 Customer 3.0- 1/30/04
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Multi-field Solver- Benefits
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Provides an easy to use framework to solve coupled field problems in
ANSYS Multiphysics
Ability to sequentially couple any number of physics fields
Applicable across all physics available in ANSYS Multiphysics
Multiple field specification with different solution option for each field
–Analysis type (Transient/Static/Harmonic)
–Solver options
–Material & geometric non-linearity
Automated surface and volume load transfer across dissimilar mesh
Automated Morphing of field elements
Unidirectional coupling between CFX and ANSYS Multiphysics
Unidirectional coupling between third party solvers and ANSYS
Multiphysics
Provides analysis opportunities in many new market areas where there
have previously been no solutions.
Multiphysics 8.0 Customer 3.0- 1/30/04
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Multi-field Solver- RF Attenuator Example
RF/microwave energy is attenuated through resistive losses in a Nichrome film
attached to the microstripline waveguide. The energy is lost in the form of heat
which is conducted both through the devices ceramic substrate and top insulating
surface film.
Typical Packaged Device:
Solid Model:
Nichrome
film
Ceramic
substrate
RF waveguide
Image from KDI data sheet.
Multiphysics 8.0 Customer 3.0- 1/30/04
Multi-field Solver- RF Attenuator Example
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High-Frequency electromagnetic coupled to a steady-state thermal analysis:
Thermal
Physics Field 2
HF Emag
Physics Field 1
Heat generation rate
HF Emag mesh: 98,175 elements
Thermal Mesh: 6,600 elements
Multiphysics 8.0 Customer 3.0- 1/30/04
Multi-field Solver- RF Attenuator Example
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Analysis results:
E-field
H-field
Resultant temperature
Multiphysics 8.0 Customer 3.0- 1/30/04
Multi-field Solver- MEMS RF Switch Example
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Transient response of MEMS RF Switch to a pulsed voltage excitation:
Beam support post
Beam electrode
Perforation holes to
control fluid damping
Ground electrode
Substrate
Multiphysics 8.0 Customer 3.0- 1/30/04
Multi-field Solver- MEMS RF Switch Example
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Each physics model is prepared independently:
CAD Model
Physics 1: Mechanical Engineer
Physics 2: Electronics Engineer
• Mesh solid model of switch
• Apply clamped BC’s
• Perform squeeze-film damping analysis
using FLUID136, FLUID138.
• Prepare structural dynamics analysis run
• Create Air mesh around switch
• Apply voltage BC’s
• Prepare electrostatics analysis run
• Write CDB file
MFIMPORT
Multi-field
Analysis
Multiphysics 8.0 Customer 3.0- 1/30/04
Multi-field Solver- MEMS RF Switch Example
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Transient, dynamic electrostatics coupled to mechanical analysis:
Mechanical
Physics Field 1
Electrostatics
Physics Field 2
Displacement, Forces
Structural mesh: 1894 elements
Electrostic mesh: 16,353 elements
Multiphysics 8.0 Customer 3.0- 1/30/04
Multi-field Solver- MEMS RF Switch Example
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Analysis Results:
Displacement of switch mid-plane
Under pulse voltage excitation
Multiphysics 8.0 Customer 3.0- 1/30/04
Multi-field Solver Example: CFX Imported field
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Gas turbine with internal cooling example:
• Unidirectional coupling between CFX and ANSYS
• CFX performs conjugate heat transfer fluid solution.
• CFX writes an ANSYS CDB file containing surface forces, volumetric
temperatures; defining an “external field” for the multifield solver
• ANSYS interpolates CFX results onto the ANSYS FE mesh
• ANSYS solves the thermal-stress analysis
• Makes use of Cyclic symmetry (113 blades!)
Multiphysics 8.0 Customer 3.0- 1/30/04
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Multi-field Solver Example: CFX Imported field
Details of field stagger loop:
External
Physics Field
ANSYS Internal Physics Field
Surface
Forces
Interpolated
Surface Forces
CFX Model
Physics Field 1
Structural
Physics Field 2
Volumetric
Temperatures
Interpolated
Volumetric Temperature
Multiphysics 8.0 Customer 3.0- 1/30/04
Multi-field Solver Example: CFX Imported field
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Imported field process:
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Create CFD model in CFX-build,
Pre-process and Solve Conjugate HT problem in CFX-solve.
Use the export utility in CFX-Post create a ANSYS CDB file
CDB file has SUR152/154 elements with force loads and SOLID70 with temperatures
derived from CFX mesh.
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Create solid region in ANSYS Multiphysics and mesh for thermal-stress analysis
Apply boundary conditions (Omega loading, cyclic symmetry)
Read in the cdb file from CFX via the MFIMport command
Create the fluid solid (FSIN) interfaces via SF command for the surface Forces
Create the solid-solid volumetric (FVIN) interface via BFE command for the
temperatures
User defines solid region as "field2" and fluid (CFX) region as "field1"
ANSYS 8.0 multi-field stagger loop algorithm is used to transfer loads from "field2“ mesh
to "field1 mesh and then solves the thermal-stress analysis."
Multiphysics 8.0 Customer 3.0- 1/30/04
Multi-field Solver Example: CFX Imported field
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Field 1: CFD Results
Pressure
Streamlines
Temperature
Multiphysics 8.0 Customer 3.0- 1/30/04
Multi-field Solver Example: CFX Imported field
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Field 2: Thermal Mechanical Results
Displacement
Temperature
Equivalent stress (SEQV)
Multiphysics 8.0 Customer 3.0- 1/30/04
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Multi-field Solver: CFX support
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CFX can export the following to ANSYS Multiphysics
– At surfaces
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Nodal heat flux
Nodal forces
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Nodal temperatures
– Within Solid volumes
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CFX loads can be read only with the ANSYS Multiphysics Multifield Solver
CFX5 export
– Stand-alone CFXExport executable available for CFX5.6 customers
– ANSYS CDB file created from CFX results files
– Works with ANSYS Multiphysics 8.0 and the Multifield solver
Multiphysics 8.0 Customer 3.0- 1/30/04
Topics Covered
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What is Multiphysics?
•
•
Multiphysics Benefits
Educational Products
Market Applications
–
–
Market segments by Technology
Market Segments by Industry
Multi Field (Coupled Physics) Capabilities
•
•
Direct physics coupling
Sequential physics coupling
Multi-field Solver (New feature at release 8.0)
Other New features
•
•
•
•
•
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•
Enhanced non-linear Piezoelectric & piezoresistive elements.
Direct coupled piezoresistive elements
Fluid damping elements
Cyclic Symmetry for Magnetostatics
Low Frequency Electromagnetic Contact
Coupled E-B Particle Tracing
Re-meshing for FSI
Selected Multi-Physics Examples
Product Roadmap & Strategy
–
Transition to Workbench Environment
Product Websites
Multiphysics 8.0 Customer 3.0- 1/30/04
Direct Coupled-Field Elements - Benefits
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Series 22X elements bring consistency and ease of use to our direct
coupled physics:
• Capabilities
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New material models and coupled-field effects
More special features and loads
• Consistency
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Flexible setting of DOFs and reactions - controlled by KEYOPT(1)
Element shapes and orders - match our 18X solid structural elements
Load labels - CHRG vs AMPS
Large deflection capability - available for ALL analyses with structural DOFs
• New code architecture
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Use existing / enhanced ‘core’ legacy elements as building blocks
Inherit the functionality of ‘core’ elements - material models, loads, special features.
Calculate directly coupled-field effects inside the element.
Facilitates infrastructure to rapidly deploy additional directly coupled physics.
Multiphysics 8.0 Customer 3.0- 1/30/04
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Series 22X Coupled Field Elements
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Higher order solid elements for
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Applications
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– Piezoelectric analysis
– Piezoresistive analysis
– Pressure transducers
– Sensors
– Accelerometers
– Microphones
R1
Elements
– PLANE223
– SOLID226
– SOLID227
R4
R2
2-D 8-Node Quad
3-D 20-Node Brick
3-D 10-Node Tetrahedral
R3
Acceleration
Force
Couples to CIRCU124
– Can build Wheatstone bridge etc
Images courtesy Endevco & Fujikura.
Multiphysics 8.0 Customer 3.0- 1/30/04
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Coupled Field Piezoresistive Element
Strain gauge accelerometer principle of operation:
Piezoresistors
Support Frame
R1
R2
R3
R4
Proof mass
piezo-resistor
color key
R1
R1
normal
R1
compression
R1
R4
R2
R3
Acceleration
Force
tension
R4
R1
Force
Acceleration
Multiphysics 8.0 Customer 3.0- 1/30/04
Coupled Field Piezoresistive Element
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Strain gauge accelerometer analysis example:
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Accelerometer uses four piezoresistive sensors per beam in a Wheatstone Bridge
configuration.
Objective is to compute Output voltage and sensitivity with 5 V DC excitation.
SOLID95 for mass, frame, and beam
SOLID226 for Piezoresistors
Voltage coupling used to create Wheatstone bridge.
Frame
Detail of beam:
Beam
Proof Mass
Four Piezoresistor elements
Multiphysics 8.0 Customer 3.0- 1/30/04
Coupled Field Piezoresistive Element
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Analysis results for 1 G acceleration load:
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Stress in beam: 1.6-2.9 MPa
Differential voltage in bridge: 2.79 mV
Sensitivity: 2.84e-4 Vsec2/m
Axial stress contour plots:
Multiphysics 8.0 Customer 3.0- 1/30/04
Damping Elements for Thin Film Applications
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FLUID 136 - 2D 4 or 8 node squeeze film fluid element
FLUID 138 - 3D 2 node viscous fluid link element
FLUID 139 - 2 or more node slide film damper
•
•
•
•
•
•
Applicable to MEMS or macro devices where damping attributed to thin films/ air gaps is
required.
“KEYOPTS” control the flow regime: Continuum, High Knudsen numbers etc.
The fluid environment is defined by a set of real constants.
For FLUID136 & FLUID138: The elements are added to the structure and a static
analysis is used to determine the damping effects at low frequencies, and a harmonic
analysis is used to determine the stiffening and damping effects at high frequencies.
The DMPEXT command is used to extract frequency dependent damping parameters
for use with the MDAMP, DMPRAT, ALPHAD, and BETAD commands for use in
structural dynamics analysis with correct damping.
Accurately extract ALPHA and BETA Rayleigh damping terms for a transient analysis.
Multiphysics 8.0 Customer 3.0- 1/30/04
Damping Elements for Thin Film Applications
50
FLUID 136:
• Models viscous fluid flow behavior in small gaps between fixed surfaces and
structures moving perpendicular to the fixed surfaces.
• Used to determine the stiffening and damping effects that the fluid exerts on the
moving structure.
• Based on the Reynolds squeeze film theory and the theory of rarefied gases.
• A static analysis is used to determine the damping effects at low frequencies. A
harmonic analysis is used to determine the stiffening and damping effects at high
frequencies.
• The DMPEXT command is used to extract frequency dependent damping
parameters for use with the MDAMP, DMPRAT, ALPHAD, and BETAD
commands for use in structural dynamics analysis with correct damping.
• Accurately extract ALPHA and BETA Rayleigh damping terms for a transient
analysis.
Multiphysics 8.0 Customer 3.0- 1/30/04
Damping Elements for Thin Film Applications
51
FLUID 138:
• Models the viscous fluid flow behavior through short channels (i.e., holes) in
microstructures moving perpendicular to fixed surfaces.
• Can be used in conjunction with FLUID136 elements to determine the stiffening
and damping effects that the fluid exerts on the moving perforated microstructure.
• Assumes isothermal flow at low Reynolds numbers.
• Accounts for gas rarefaction effects and fringe effects due to the short channel
length.
• Can be used to model either continuous or high Knudsen number flow regimes.
• Applicable to static, harmonic, and transient analyses.
FLUID 139:
• 139 is a combination of Couette (low frequency) and Stokes flow (inertial effects at
high frequency).
• The viscous flow between surfaces is represented by a series connection of massdamper elements whereby each node corresponds to a local fluid layer
• Applicable to large deflection.
Multiphysics 8.0 Customer 3.0- 1/30/04
Damping Elements for Thin Film Applications
52
Squeeze & damping constants:
Squeeze or Spring dominant
@ higher frequencies
represents compressible fluid
effects
Damping dominant @ low
frequencies represents
fluid displacement effects
Multiphysics 8.0 Customer 3.0- 1/30/04
Damping Elements for Thin Film Applications
53
Computing damping parameters for flexible bodies using the Modal Projection
Technique:
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•
•
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•
•
•
•
Build a structural and thin-film fluid model and mesh.
Perform a modal analysis on the structure.
Extract the desired mode eigenvectors.
Select the desired modes for damping parameter calculations.
Perform a harmonic analysis on the thin-film elements.
Compute the modal squeeze stiffness and damping parameters.
Compute modal damping ratio and squeeze stiffness coefficient.
Display the results: MDPLOT.
Automated using the DMPEXT
command macro
Multiphysics 8.0 Customer 3.0- 1/30/04
Damping Elements for Thin Film Applications
54
Transient dynamic response of damped MEMS RF Switch:
FEA Model of damping holes:
Viscous
Multiphysics 8.0 Customer 3.0- 1/30/04
Damping Elements – Application Example
55
Results: Transient dynamic response of the switch to a pulsed voltage excitation.
ALPHA and BETA damping parameters were obtained from a squeeze-film
analysis of the structure
Multiphysics 8.0 Customer 3.0- 1/30/04
Damping Elements – Application Example
56
MEMS Accelerometer harmonic response:
Pressure distribution at 100 Hz for
design with matrix of damping
control holes in the plate.
Pressure distribution at 20 Hz for
design with no damping control
holes in the plate.
Multiphysics 8.0 Customer 3.0- 1/30/04
Damping Elements - Application Examples
57
MEMS Accelerometer harmonic frequency response 0.1 – 10 kHz
Shows results of four design iterations:
Final design
(honeycomb plate) has
flattest frequency
response
Initial design
(no plate holes)
is overdamped
Multiphysics 8.0 Customer 3.0- 1/30/04
LF Electromagnetic Cyclic Symmetry
58
Feature:
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Cyclic symmetry (periodicity) for Low Frequency Electromagnetics
Commands: CYCLIC and CYCOPT
Supports: PLANE13, PLANE53, SOLID96, SOLID5, SOLID98, SOLID117
Benefits:
•
•
•
This new feature is applicable to 3D magnetic scalar potential (MSP),
magnetic vector potential (MVP) and edge (SOLID117) formulations .
These commands are also used for cyclic symmetry structural analyses
results greater consistency across physics.
Reduce FEA problem size & faster solution time by making use of
symmetry.
Market applications:
Primarily rotating electromagnetic machines
• Electric motors
• Alternators
• Inductive ignition system sensors
Multiphysics 8.0 Customer 3.0- 1/30/04
LF Electromagnetic Cyclic Symmetry
59
Example: 4 pole variable reluctance machine reduced to 90 degree sector:
Bcircumferential
Multiphysics 8.0 Customer 3.0- 1/30/04
LF Electromagnetic Cyclic Symmetry
60
Multiphysics 8.0 Customer 3.0- 1/30/04
Low Frequency Electromagnetic Contact
61
Feature:
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Contact for Low Frequency Electromagnetic
Commands: TARGET169, CONTAC171
Supports: PLANE13, PLANE53, SOLID96, SOLID5, SOLID98
Benefits:
•
•
This new feature is applicable to 3D magnetic scalar potential (MSP), and
2D magnetic vector potential (MVP).
A lot easier to use than constraint equations!
Market applications:
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Electric motors
Alternators
Inductive ignition system sensors
Linear Motion Systems
Non Destructive Testing
Eddy current braking systems
Multiphysics 8.0 Customer 3.0- 1/30/04
Low Frequency Electromagnetic Contact
62
Example: “In pipe” eddy current based sensor. Sensor slides down pipe
detecting flaw in pipe wall.
B-field contours
Sensor
Pipe
Multiphysics 8.0 Customer 3.0- 1/30/04
63
Ion Optics Enhancements
Ion Optics - An important feature for the SEMICON and Analytical
instrument markets:
• Particle tracing is a post processing feature.
• Can trace charged particle in either a electrostatic field or magnetostatic
field or both.
• Particles initial conditions definable are:
–
–
–
–
Mass
Charge
Starting coordinates (x,y,z)
Velocity vector (Vx,Vy,Vz)
• Can define 50 particles per run.
• Particle trajectory can be plotted in 2D/3D or listed.
• Space charge effects are not accommodated.
• No relativistic effects (velocity is much smaller than speed of light).
Multiphysics 8.0 Customer 3.0- 1/30/04
64
Ion Optics Enhancements
Example of a particle trace through homogenous magnetic field, with a
changing electric field. Animation is a composite of static cases
Multiphysics 8.0 Customer 3.0- 1/30/04
65
Ion Optics Enhancements
Example of a particle trace on a charged particle trace!
PLTRACE command used to slide “visualization particles” along the charged
particle trajectories.
Multiphysics 8.0 Customer 3.0- 1/30/04
FSI – Remeshing Enhancements
66
Coupled fluid-solid (FSI) meshing capability enhanced to handle applications with
large boundary/domain changes.
This feature opens up a broader range of FSI market applications:
•
•
Solid can undergo large deformation or complete rotations. E.g.. Pumps or stirrers.
Detached solid object movement through fluid.
Enhancements:
•
•
•
•
•
•
Moving boundary problem is re-meshed when mesh becomes badly distorted or ALE
mesh morphing scheme fails.
Improved accuracy when the mesh is distorted by ALE mesh moving scheme
Regenerates a new mesh from a selected element group.
– All element based loads (e.g. FSI interface) are updated
– Body loads on the interior nodes are updated
Nodal values are interpolate from old mesh to new mesh
Redesigned FLOTRAN result files, creates new rfl file for each remesh
Animation is possible across multiple result files (anmres)
Multiphysics 8.0 Customer 3.0- 1/30/04
FSI – Remeshing Enhancements
67
New Commands:
•
•
FLDATA39, REMESH, Label, Value
ANMRES, Delay, Min, Max, Inc, Autocntrky, Freq, ’rfl’
Limitations:
•
•
Must keep the same topology for surface (boundary) elements.
Applicable to triangle (2D) and tetrahedral (3D) elements
Example: Rigid body rotation, a flap valve in a tube:
Multiphysics 8.0 Customer 3.0- 1/30/04
FSI – Remeshing Enhancements
68
Cylinder passing through a channel:
Multiphysics 8.0 Customer 3.0- 1/30/04
Topics Covered
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69
What is Multiphysics?
•
•
Multiphysics Benefits
Educational Products
Market Applications
–
–
Market segments by Technology
Market Segments by Industry
Multi Field (Coupled Physics) Capabilities
•
•
Direct physics coupling
Sequential physics coupling
Multi-field Solver (New feature at release 8.0)
Other New features
•
•
•
•
•
•
Enhanced non-linear Piezoelectric & piezoresistive element.
Fluid damping elements
Cyclic Symmetry for Magnetostatics
Low Frequency Electromagnetic Contact
Coupled E-B Particle Tracing
Re-meshing for FSI
Selected Multi-Physics Examples
Product Roadmap & Strategy
–
Transition to Workbench Environment
Product Websites
Multiphysics 8.0 Customer 3.0- 1/30/04
70
Selected Multiphysics
Solid
Mechanics
Heat
Transfer
•
•
Thermal-structural coupling
Needed for any product subjected to changes in
temperature!
– Engines, gas turbines, heat exchangers
– Electronic components, package solder joints
– Cryogenic components and systems
– Test & Measurement Equipment
Multiphysics 8.0 Customer 3.0- 1/30/04
71
Thermal Structural Example
BGA IC Package differential thermal expansion
Image courtesy of MCR.
Multiphysics 8.0 Customer 3.0- 1/30/04
72
Selected Multiphysics
Fluid
Mechanics
Heat
Transfer
•
Thermal-Fluid Coupling (Conjugate heat transfer)
•
Applications:
– Heat is transferred between fluid and solid
– Convection effects.
– Forced flow.
– Heat exchangers
– Electronics device/enclosure temperature management
Multiphysics 8.0 Customer 3.0- 1/30/04
Conjugate Heat Transfer Example
73
Vertical heat sink
Multiphysics 8.0 Customer 3.0- 1/30/04
74
Selected Multiphysics
Electricity
Heat
Transfer
•
Electro- Thermal Coupling
•
Electro-Thermal-Structural coupling
•
Solid
Mechanics
– Resistive (Joule) heating
– Resistive (Joule) heating resulting in thermal expansion
Needed for many electronic power handling
components and systems.
– Current-carrying conductors, bus bars
– Electric motors, generators, transformers
– Electronic components and systems
– Actuators
Multiphysics 8.0 Customer 3.0- 1/30/04
Electro-Thermal-Structural Example
75
Detail of Integrated Circuit via & aluminum trace
Current Density
Electrical Power
Images courtesy of Atila Mertol, LSI Logic.
Thermal Stress
Multiphysics 8.0 Customer 3.0- 1/30/04
76
Selected Multiphysics
Electrostatic
Solid
Mechanics
•
Electrostatic – Structural coupling
•
Electrostatic-structural-Fluid Coupling
•
Fluid
Mechanics
– Piezoelectric effect
– Electrostatic actuated structures incorporating effects of fluid
damping.
The entire MEMS Industry is based on these physics!
– Resonators/Actuators
– Electro-mechanical band pass filters
– Inertial sensors (Accelerometers & gyroscopes)
– Inkjet printer heads
Multiphysics 8.0 Customer 3.0- 1/30/04
MEMS Micromirror Example
77
Multiphysics 8.0 Customer 3.0- 1/30/04
78
Selected Multiphysics
Electromagnetics
•
Electromagnetic-Thermal coupling
•
Applications:
Heat
Transfer
– Eddy current losses (LF Emag)
– Resistive & dielectric losses (HF Emag)
– Required by those that want heat or those that want to minimize it!
– Induction heating systems (LF Emag)
•
•
Heat treating processes
Pre-heating for metal forming operations
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•
Heaters
Attenuators
– RF Microwave systems (HF Emag)
Multiphysics 8.0 Customer 3.0- 1/30/04
Induction Heating Example
79
– Solid model meshed
– Current in coil
– Induced current in plate
– Resultant B-Field
Multiphysics 8.0 Customer 3.0- 1/30/04
Induction Heating Example
80
– Joule heating
– Time averaged joule heating
thermal load
– Resultant temperature
Multiphysics 8.0 Customer 3.0- 1/30/04
81
Selected Multiphysics
Electromagnetics
•
•
Fluid
Mechanics
Electromagnetic - Fluid coupling
Applications
– Magneto-Rheological (MR) devices
•
•
Active structure vibration damping systems
Automotive & biomedical actuators
– Induction furnaces for stirring molten metals
– MHD power systems, EHD pumps
Multiphysics 8.0 Customer 3.0- 1/30/04
Electromagnetic - Fluid coupling Example
82
A.C. Induction furnace:
• Electromagnetic field solution to
compute Lorentz forces
• CFD analysis performed to determine
stirring pattern within furnace core
Multiphysics 8.0 Customer 3.0- 1/30/04
83
Selected Multiphysics
Electromagnetics
•
•
Solid
Mechanics
Electromagnetic – Solid Coupling
– Forces due to magnetic field move/interact with mechanical
–
–
structures.
Magnetic force (linear systems)
Magnetic torque (rotary systems)
Applications:
– Actuators / Solenoids
– Rotating machines
•
•
Alternators
Motors
Multiphysics 8.0 Customer 3.0- 1/30/04
84
Moving Magnetic Probe Example
2D Axi-symmetric model using true moving object, sliding mesh boundary
Animation of flux lines when V = 0.4 m/s
Multiphysics 8.0 Customer 3.0- 1/30/04
85
Magnetic Levitation Example
Flux lines and levitation coil currents:
Multiphysics 8.0 Customer 3.0- 1/30/04
86
Rotating Machine Examples
Images courtesy of CAD-FEM GmbH.
Multiphysics 8.0 Customer 3.0- 1/30/04
87
Selected Multiphysics
Heat
Transfer
•
•
Solid
Mechanics
Electromagnetics
Thermal-Solid-Electromagnetic Coupling
– Thermal-mechanical dimensional changes coupled into HF
Emag or LF Emag analysis.
Many applications require knowledge of the effects of
temperature on electromagnetic performance.
Multiphysics 8.0 Customer 3.0- 1/30/04
Thermal-Solid-Electromagnetic Coupling Example
88
Thermal Effects on microwave wave guide
Waveguide Bend
Electric Field
@ 20oC
20 oC : S11 = 0.1901, S12 = 0.9817
60 oC : S11 = 0.1895, S12 = 0.9819
Waveguide
Displacement
from 20- 60oC
Waveguide Bend
Electric Field
@ 60oC
Multiphysics 8.0 Customer 3.0- 1/30/04
89
Selected Multiphysics
Viscous Fluid
Mechanics
•
•
Solid
Mechanics
Coupled Fluid – Solid (Fluid Solid Interaction, FSI)
– Fluid pressure deforms mechanical structure which in turn
effects fluid flow. May also include heat transfer.
Applications
– Aero-elastic problems
– Hydraulic / Pneumatic / Fuel systems
– Fluid pumps
– Biomedical
•
•
Blood flow – elastic artery
Heart valves
Multiphysics 8.0 Customer 3.0- 1/30/04
90
FSI Example – Pressure Limiting Valve
•
•
•
•
Pressure-limiting valves are used in
anti-lock brake systems
– Huge liability ramifications
Per VDO, tiny geometric design
changes cause wide variations in valve
response and performance
Without FSI VDO was guessing on
new valve designs.
FSI analysis significantly reduces
overall time to market and improve
reliability.
Ø 4.5 mm
Ø 4.0 mm
55º
0.25
mm
Ø 2.4 mm
Ø 10.0 mm
Courtesy : Siemens VDO
Multiphysics 8.0 Customer 3.0- 1/30/04
FSI Example – Pressure Limiting Valve
91
Mesh detail & dissimilar mesh for solid & fluid
Courtesy : Siemens VDO
Multiphysics 8.0 Customer 3.0- 1/30/04
FSI Example – Results
Courtesy : Siemens VDO
92
Multiphysics 8.0 Customer 3.0- 1/30/04
93
FSI Example – Results
Ball displacement time history, f  875 Hz
Courtesy : Siemens VDO
Multiphysics 8.0 Customer 3.0- 1/30/04
94
Selected Multiphysics
Solid
Mechanics
Inviscid Fluid
Mechanics
•
•
Inviscid fluid-structural coupling (FSI)
– Longitudinal pressure wave travels through fluid causing
displacement of solid structure.
Applications (Primarily acoustics):
– Loudspeaker design
– Microphone
– Sonar / ultrasonics
Multiphysics 8.0 Customer 3.0- 1/30/04
95
Acoustics Example
Response of axisymmetric disc in tube to plane wave.
Multiphysics 8.0 Customer 3.0- 1/30/04
Topics Covered
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96
What is Multiphysics?
•
•
Multiphysics Benefits
Educational Products
Market Applications
–
–
Market segments by Technology
Market Segments by Industry
Multi Field (Coupled Physics) Capabilities
•
•
Direct physics coupling
Sequential physics coupling
Multi-field Solver (New feature at release 8.0)
Other New features
•
•
•
•
•
•
Enhanced non-linear Piezoelectric & piezoresistive element.
Fluid damping elements
Cyclic Symmetry for Magnetostatics
Low Frequency Electromagnetic Contact
Coupled E-B Particle Tracing
Re-meshing for FSI
Selected Multi-Physics Examples
Product Roadmap & Strategy
–
Transition to Workbench Environment
Product Websites
Multiphysics 8.0 Customer 3.0- 1/30/04
97
Product Roadmap - Overview
•
•
•
Target markets:
•
•
•
•
•
Actuator and Sensors
Low Frequency (Actuators and electric machines)
MEMS
High Frequency (RF) devices
Biomedical - FSI
Short/Medium Term (< 2 years):
–
Release 8.1/9.0
•
•
•
•
ROM140 (Damping counterpart to ROM144)
Publish ROM database format & provide additional ports on ROM144 for drive
variable
LinkCAD for ANSYS Process Emulator module
CFX ANSYS integration
Longer Term (2 - 3 years):
–
–
–
Products and technology migrated to ANSYS Workbench Environment.
CFX will take FLOTRAN’s place in the ANSYS Workbench Environment.
MEMS coupled analysis capability in Workbench Environment.
Multiphysics 8.0 Customer 3.0- 1/30/04
Roadmap – Transition to Workbench
•
•
•
•
98
Objective is to migrate ALL physics technology to Workbench
We will not to develop standalone physics products….Products and
physics will instead be more modular and controlled through licensing.
Strategy is to migrate and expose technology into the ANSYS Workbench
Environment creating a general purpose product applicable to a broad
range of markets.
Order of physics exposure is:
–
–
–
–
LF Emag
CFD (CFX technology)
HF Emag
Advanced Physics
Multiphysics 8.0 Customer 3.0- 1/30/04
Topics Covered
•
•
•
•
•
•
•
•
99
What is Multiphysics?
•
•
Multiphysics Benefits
Educational Products
Market Applications
–
–
Market segments by Technology
Market Segments by Industry
Multi Field (Coupled Physics) Capabilities
•
•
Direct physics coupling
Sequential physics coupling
Multi-field Solver (New feature at release 8.0)
Other New features
•
•
•
•
•
•
Enhanced non-linear Piezoelectric & piezoresistive element.
Fluid damping elements
Cyclic Symmetry for Magnetostatics
Low Frequency Electromagnetic Contact
Coupled E-B Particle Tracing
Re-meshing for FSI
Selected Multi-Physics Examples
Product Roadmap & Strategy
–
Transition to Workbench Environment
Product Websites
Multiphysics 8.0 Customer 3.0- 1/30/04
Product Websites
10
0
Multiphysics 8.0 Customer 3.0- 1/30/04
Product Websites – FSI & MEMS
10
1
Multiphysics 8.0 Customer 3.0- 1/30/04
The End!
10
2
Acknowledgements:
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–
–
–
–
–
–
–
–
–
–
Dale Ostergaard
Barry Christenson
Deepak Ganjoo
Ray Browell
Bill Bulat
Achuth Rao
Stephen Scampoli
Daniel Shaw
Mark Troscinski
Miklos Gyimesi
CAD-FEM GmbH
Multiphysics 8.0 Customer 3.0- 1/30/04