Ready For The Future
2015
Streamline Circuit Corp’s Facility
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Manufacturing all levels of technology
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The facility was established in 1982
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Located in Silicon Valley
Delivery convenience for out of state customers
Located in Silicon Valley
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Complete manufacturing process under one roof
1 mile from the San Jose Airport
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New management team installed September 2003
70,000 sq. ft. PCB manufacturing facility
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Time sensitive prototyping through production
Short car ride away for pick up & deliveries
Financially secure in current market
conditions
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Low cost infrastructure
2
The Team & Their Experience
•
Chuck Dimick- CEO | Founder
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Over 33 years of experience in PCB manufacturing. Former CEO of Dynamic Details Inc. and founder of the
company's predecessor, Dynamic Circuits Inc. (1991)
Greg Halvorson- President | Founder
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Over 31 years of experience in PCB manufacturing. Former VP of Operations of Dynamic Details Inc. and
Dynamic Circuits Inc.
Tom Doslak-Vice President of Sales & Marketing | Founder
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Over 23 years of industry experience. Former Director of Sales for Braztek Intl. and Western Regional Sales
Manager for Dynamic Details Inc.
Ed Pitney- Operations Manager
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•
Over with 32 years of PCB manufacturing experience. Ed spent his early career with NTI Inc. as a
Director of Manufacturing Operations later purchased by DDI Global Inc.
Steve Morris – Director of Engineering
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•
Over 27 years of PWB Design & Engineering experiencing. Former VP of Advanced Technology for Multek (a
division of Flextronics) and a key member of the HP PWB Corporate commodity team.
JR Ramirez- Production Manager | Founder
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Over 32 years of experience in the industry. Former Production Manager for both Dynamic Details Inc. and
Dynamic Circuits Inc.
Lorraine Hook - Director of Quality
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Over 43 years of industry experience. Former Director of Quality for many successful companies including DCI
and DDI. She has held dual positions as Corp. Quality Systems Manager.
3
Customer Service Support
• Customer Service (24 hours - 7 days a week)
– Sales, Engineering, Manufacturing and Quality
• Dedicated customer service readily availableour support group’s located onsite in the
facility
• Quick response to all requests such as:
Inside Sales Customer
Support
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Job status
Delivery pull-in
Quantity Increases
Engineering design modification
4
Proactive Engineering Services
• Manufacturing Capabilities
– Prototype though volume
– All time sensitive builds
• DFM (Design for Manufacturability)
Cam Valor Stations
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DFM Software (reviews in 10 minutes)
Net list compare to customer data
Custom Verification programs
Looking for customer design error
In plan Smart data Collection System
• Controlled Impedance Verification
– Stack up assistance
– Copper distribution
– Material verification
4 Laser Direct Imaging units
5
Controlled Impedance Verification
•
DFM Scan & Report
•
Stack up assistance
•
Copper distribution
•
Material verification
•
Sub Panel /Array Support
Go to slide 50
Quality Reassurance
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Net list compare prior to MFG
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Front End DRC (design rule check)
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•
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Verifying inner & outer layers
X-Ray Verification
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After Lam (Inspecta), After Drilling
Cross Section Verification
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Hole Integrity
Controlled Impedance Testing
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TDR test of panel coupons
100% Net List Test On All Product
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Searching for customer design mistakes
AOI Automated Optical Inspection
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Automated Optical Inspection
Matching Net list to Gerber data
Eliminator Tester & flying probe
Coordinate Measurement Machine
– First articles, 100% measurement verification
In house Mil & deliverable Lab
7
On Time Delivery Reassurance
•
100% In-house manufacturing from start to
finish
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Employee Training program
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8 flying Probe Testers
Control delivery & customer flexibility
In-process quality verification system
No out sourcing delivery delays
•
Performance evaluation every 6 months
In-house Chemical Laboratory
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Cross Sections
Chemical analysis
Mil spec verification
Vacuum Lamination press
8
Continuous Improvement
Programs
• Working daily on:
Management meetings
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Research and Development
Pre-Engineering Programs
Improvement Process Program
Department Performance Reviews
Preventative maintenance program
Employee Training Program
Planned Capital expense program
7 Laser drills
9
A Full PCB Solution
•
•
•
•
•
•
•
•
•
•
•
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Multilayer Rigid / Rigid- Flex / Flex
1 to 70 Layers Plus
28:1 High Aspect Ratio
3.23 Mils Hole to Copper
Buried / Blind Vias
9 Sequential Laminations
13+ Stacked Vias
1 Mil Trace & Space
Cavity Constructions
6 oz. + Copper Thickness
Copper Filled Micro Vias
+/- 5% Controlled Impedance Tol.
•
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AS9100 Rev. C / ISO 9001
Mil-Spec 55110 / ITAR
RoHS & Halogen Free Materials
IPC 6012 Rigid / 6013 Flex / 6015 MCM
/ 6016 HDI / 6018 High Frequency
3 Mil Mechanical Drills
24” x 30” Oversize Panel
2 Mil Laser Drill Vias
Up to 345 Mils Board Thickness
Via Under Pad (Conductive & NonConductive Filled)
45+ Materials (Hybrid Constructions)
10
Nadcap
ISO 9001:2000
IPC 6012,13,15,16,18
Class 3
ITAR
AS9100 Rev C
Mil-Spec 55110
Mil-Spec 31032 in process
Q-Pulse
Total Quality Management
• Quality Assurance Systems
• Q-Pulse Quality System
• NCMR’s and Corrective Actions
• Audits
• Training
• Equipment Calibrations
BACK
12
Streamline’s Capital Expenditures
Laser Direct Imaging
• Use advanced equipment technologies to
manufacture today's printed circuit board
requirements
• The future in PCB manufacturing is about
technology and automation
Cuposit & Electroless Line
• Hire and Train equipment operators
• High percentage engineering personnel and
staff
DES Inner Layer Stripline
13
Design Strategies
Epoxy fill with copper Vias
Resin Fill off set Vias
Resin fill/stacked Vias
All Copper Fill process
V-Stacks: Patented MicroVia technology that will change everything
A combination of Streamline's engineering talent created V-Stack, a new MicroVia manufacturing process
that will change everything we know about Via Stacking. This technology allows a manufacturer to create
MicroVia structures greater than 4 layers deep with only 1 lamination cycle. V-Stack technology also
yields finer features and higher layer to layer reliability. Due to the 30% - 60% reduction in processing,
this MicroVia technology is a cost effective route for advanced technology.
15
RIGID-FLEX EXAMPLES
6 Layer
Rigid Flex
6 Layer
Rigid Flex
with Cavity
8 Layer Rigid
Flex Micro via
10 Layer
Micro via
BGA
PCB Equipment Needed
for the Future
Pre Production
Engineering
LDI Image
Processing
Develop Etch
Strip
Laser Drilling
Electroless
Technology
Registration
and Micro Via’s
Solder Mask
Silkscreen
Test
Product Integrity
Quality
Verification
Off-Shore
Solution
Test Cases
Flex / Rigid-Flex
Flex / Rigid-Flex
RIGID-FLEX EXAMPLES
6 Layer
Rigid Flex
6 Layer
Rigid Flex
with Cavity
8 Layer Rigid
Flex Micro via
10 Layer
Micro via
BGA
Flex Capabilities
Standard
Advanced
Layer Count
1L to 6L
8L to 10L
Maximum Panel Size
10”x16” (250x406mm)
10”x35” (250x889mm)
Min. Line/Space (H & ⅓ oz)
0.004" (0.10mm)
0.003" (0.076mm)
Outline Tolerance
+/-.004” (0.10mm)
+/-.002” (0.05mm) by laser
Stiffener Types
PI, FR4+PSA
PI, FR4, Steel, Alum
Polyimide Thickness
0.5, 1 mil (12.5, 25um)
2, 3, 4 mils (50, 75, 100um)
Base Copper Thickness
0.5, 1 oz (17.5, 35um)
¼ to 2 oz (9 to 70um)
HDI Microvias
Yes
Yes
Adhesiveless Materials
Yes
Yes
Flexible Soldermask
Yes
Yes
White Coverlay
Yes
Yes
RA Copper
Yes
Yes
20
Base Material Flex and Rigid Flex
• Other Material Flex and Flex-Rigid
•IPCManufacturer
•4202/1
DuPont
•4203/1
DuPont
•4203/18
DuPont
•4204/1
DuPont
•4204/11
DuPont
•4101/21
Isola
•4101/24
Isola
•
Arlon PrePreg
•4101B/124
Arlon PrePreg
•4101/26
Isola
•
Isola Prepreg
•
Grace
•4101/41
Arlon
•
Isola Prepreg
•4101/42
Arlon PrePreg
•4101/99
Isola
Material Name
Pyralux FR
Pyralux FR
Pyralux FR, Pyralux
Pyralux FR, Pyralux
Pyralux AP
FR406, FR408, 370
FR406, FR408, 370
49N
51N
FR406, FR408, 370
FR406N
GA-170LL
35N
P26
38N
370HR
•
•
•
•
Name
Conductive Silver Ink
Flex LPI Solder Mask
Manufacture
DuPont
Taiyo
Rogers
Material Name
CB028
PSR-9000FXT, PSR-900
RFLEX 8080 Liquid Coverlay
•
•
•
•
•
•
•
Kapton/Polyimide Stiffener
DuPont
Pyralux, FR, Pyralux
FR4 Stiffener Isola
FR406, FR408, 370
Grace
GA-170LL
Polyimide Stiffener
Arlon
35N
Aluminum Stiffener
Pressure Sensitive Adhesive
3M
467MP, F9469PC, F9460PC
Strain Relief (Epoxy)
Emerson &Cuming
Eccobond 45 Clear, Black
Note: Other materials javailable and have been manufactured, but non standard on per customer request.
2015
Off-Shore Solution
One Stop PCB Solution
•3 million square feet manufacturing Space
•QTA 15-20 days ( based on technology)
•Local Team Support ( US and China)
•24 hours 7 days a week technical support
•Focused Facilities based on Technology &
Quantities
23
Complete Tooling Package
“Build Exact”
24
Integration-Domestic/Offshore
“Build Exact”
25
Time To Market
“Build Exact”
Intellectual Property
 The implementation of strict
protection for intellectual property
of customers, other than the
traditional encryption and
decryption.
 We provide rigorous
authorization and detailed access
logs to our employees, in order to
control the exchange information.
 Move Customers' Logo off and
destroy the unusable boards
completely.
……
Beijing
KaiserstraBe,
Germany
EUROPE
N. AMERICA
Utah
Oregon
ASIA
California
Chongqing
Shanghai
Texas
Zhuhai
AFRICA
Florida
Shenzhen,
Guangdong
Hangzhou
S. AMERICA
OCEANIA
Headquarter
Plants
Offices
Go to Slide 1
BACK
Page28
PCB Capabilities
Maximum Layer Count
Maximum Panel Size
Standard
Advanced
36L
40L
21”x24” (533x610mm) 24”x42” (610x1067mm)
Maximum Finished Thickness
0.126" (3.2mm)
0.256" (6.5mm)
Minimum Finished Thickness
0.006" (0.15mm)
0.004" (0.10mm)
Minimum Core Thickness
0.002” (50um)
.0015” (38um)
Trace/Space (H oz)
0.003”
.0025”
Maximum Aspect Ratio
14:1
25:1
Minimum Mechanical Drill
0.008" (0.20mm)
0.006" (0.15mm)
Minimum Laser Drill
0.004" (0.10mm)
0.003" (0.076mm)
Min. Soldermask Dam
0.003" (76um)
0.0025" (64um)
Max. Base Copper Thickness
5 oz (75um)
6 oz (210um)
Impedance Control
+/- 8%
+/- 5%
29
Technology Development
Continual development of new Technologies, Processes,
and Materials
•Low Dk/Df, Low CTE, CAF resistant, and Halogen Free
FR-4
•High Aspect Ratio Plating (25:1 and 30:1)
•Advanced plating and photo lithography processes
•Advanced tooling systems for registration
•High Technology Radio Frequency (RF) PCB’s
•Metal Backed and Thermal Management PCB’s
•Solid Copper Plating for Through Vias
•Deep Blind Vias and Deep Stacked Microvias
•Embedded Capacitance & Resistance (2015)
•Embedded Heater Circuits (2015)
Filled Buried Vias
Stacked Microvias
30
Manufacturing Capabilities
Single-Side Flexible Panel Size
Double-Side Flexible Panel
Size
STANDARD
ADVANCED
12"x18"
18"x24"
20"x26"
24"x36"
18"x24" and
Up
18"x24" and
Up
13+
18"x24" and
Up
28+
12"x18"
Mulilayer Flexible Panel Size
Layer Count
12"x18"
3 to 12
RIGID FLEX PANEL SIZE
Layer Count
12"x18"
2 to 28
Multiple Lamination
Copper Foil Weights
Internal/External
1/4 to 2 ounce
Up to 3 ounce
Kapton Polyimide Stiffener
.001" to .007"
.008" and Up
FR4 Stiffener
.003" to .062"
.063" and Up
Polyimide Rigid Stiffener
.003" to .062"
.063" and Up
.0035"
.0035"
.0035"
.0035"
.010"
10%
.001"
.001"
.001"
.001"
.010"
5%
Lines, spaces & pad diameters
Internal Line Width
Internal Spacing
External Line Width
External Spacing
SMT Pitch
Controlled Impedance
Via hole Finish
Laser Micro Vias
Blind/buried Vias
Laser Pads
Minimum Drilled Hole Size
Drilled Hole to Copper
Castellation
Finish surface
Tin Lead Plating Thickness
Tin Nickel Plating Thickness
Low Stress Nickel
Gold Plating Thickness
Electroless Nickel/Immersion Gold
Immersion Gold
Immersion Silver
Entek 106A HT
HASL
TOLERANCES
Plated Hole Tolerances (+/-)
Non-Plated Hole Tolerances (+/-)
Fabrication Tolerance (+/-)
Vision Rout (+/-)
Laser Rout (+/-)
STANDARD
.004"
.004"
.004"
.012"
.008"
Yes
ADVANCED
.002"
.002"
.002"
.0079"
.007"
Yes
.0003" to .0005"
150 Micro
Inches
100 Micro
Inches
30 Micro Inches
Yes
Yes
Yes
Yes
Yes
Less .0005"
.002"
.001"
.005"
.003"
.002"
250 Micro Inches
250 Micro Inches
As Specified
Yes
Yes
Yes
Yes
Yes
.001"
.001"
.003"
.002"
.001"
Communication
Infrastructure
IT
Our products are used in
于
Communication
Terminal
Other Products:
Consumer/
Office Facilities/
Military/
Vehicle/
Industrial
Equipment
Automobile
electronic
Product Mix
Heavy Copper
Complet
e
PCB
Solution
s
Sequential
Lamination
High
Performance
Materials
33
Certifications
Plant
ISO9001
TS16949
ISO14001
QC080000
OHSAS18001
GJB9001
TL9000
F1
Certified
Certified
Certified
Certified
Certified
Certified
Certified
F2
Certified
Certified
Certified
Certified
Certified
F3
Certified
Certified
Certified
Certified
Certified
F4
Certified
Certified
F5
Certified
Certified
Certified
Certified
F6
Certified
Certified
Certified
Certified
Certified
Certified
AS9100
ISO27001
Certified
Certified
On-going
Certified
Certified
Certified
Certified
Certified
Materials
Material Type
High-Tg FR-4
Mid-Tg FR-4
Low-Tg FR-4
Halogen-Free FR-4
High Speed
Low Loss Materials
Aluminum
Flex Polyimide
Rigid Polyimide
Supplier
Product
Tg (°C)
ShengYi
S1000-2
175
ITEQ
IT180A
175
ISOLA
370HR
175
ShengYi
S1000
150
ShengYi
S1141
140
ITEQ
IT-140TC
140
NanYa
NY1140
140
ShengYi
S1155
130
ShengYi
S1165
170
ISOLA
FR408, FR408HR, IS420, IS620, GETEK
Nelco
N4000-13, -13EP/SI, N4000-29
Panasonic
Megtron4, Megtron6
Rogers
RO3003, RO3006, RO3010, RO4003C, RO4350B
Arlon / Taconic
Yugu
PTFE (RF35, TLX, TLY)
YGA Series
SY/Taiflex/Panasonic
½, 1 mil, 2 mil PI
Ventec
VT901
250
Additional Materials are available.
35
Zeta Certified
Revolutionary ZETA® Material
•Sunshine is a ZETA® Certified Fabricator
•Glass-free Polyimide Film, 13/25 um [0.5/1 mil]
•Low Dk (3.0-3.4) and low Df (.005-.010)
•Ideal for HDI and High Speed Applications
•High peel strength after multiple lam cycles
•Lead-free compatible and Halogen free
•High dielectric strength
•Eliminates Pad Cratering
Zeta® Cap
Copper
C-Stage Polyimide
Zeta® Bond
SE
B-Stage Epoxy
Zeta® Lam
Copper
C-Stage Polyimide
B-Stage Epoxy
Graphics provided by Integral Technology
36
Product Showcase
High Speed Board
•10 Layer HDI
•N4000-13EP
•119x112mm [4.7”x4.4”]
•Thickness 1.6mm [.062”]
•Construction 1+8+1
•Aspect Ratio 10:1
•Via-in-Pad (VIPPO)
•Min L/S .10 mm [.004”]
•Drill/Pad .006”/.016”
•ENIG Finish
•Application: GPS Receiver,
Satellite Positioning System
37
Product Showcase
Telecom Linecard
•16 Layer HDI
•370HR
•376x272mm [14.8”x10.7”]
•Thickness 2.21mm [.087”]
•Construction 1+14+1
•Aspect Ratio 11:1
•Via-in-Pad (VIPPO)
•Min L/S .10mm [.004”]
•Drill/Pad .008”/.018”
•Controlled impedance
•ENIG Finish
•Application: Data Server,
Communications
38
Product Showcase
High Layer Count Board
•30 Layers
•S1000-2 (Hi-Tg FR4)
•7.0” x 7.0”
•Thickness 3.81mm [.150”]
•25:1 Aspect Ratio with 25 um [1.0 mils]
plating required in vias
•Smallest drill .006” on .012” pads
•Via-in-Pad (VIPPO) with maximum dimple
12.5 um [0.5 mils]
•Full body nickel/gold
•Minimum line/space .10 mm [4 mils]
•BGA mounting device positional accuracy
requirement
•Fabrication rout tolerance of +/- 0.20 mm
[.008”]
39
Product Showcase
ATE Board
•34 Layers
•S1000-2 (Hi-Tg FR4)
•368x368mm (14.5”x14.5”)
•Thickness 4.6mm (.180”)
•18:1 Aspect Ratio
•Blind vias from L32-34
•Via-in-Pad (VIPPO)
•Internal Cu: 1 & 2 oz
•Minimum L/S 4 mils
•Drill/Pad .010”/.016”
•Over 20 impedance controlled
lines (SE/Diff)
•Countersink holes
•For semiconductor testing
40
Product Showcase
Rigid-Flex
•14 Layer HDI Rigid-Flex
•Construction:
14R – 2F – 14R
•Min L/S:.10 mm [4 mils]
•Thickness:
1.6 mm [.062”]
•Application:
Medical
•8 Layer Rigid-Flex
•Construction:
3R – 2F – 3R
•Min L/S:.13 mm [5 mils]
•Thickness:
1.0 mm [.040”]
•Application:
Industrial
41
Product Showcase
•RF (Radio Frequency)
•Layer Count:
•Mat’l Options:
2L to 10L boards
Rogers (4350B, 3010, 4003C), Taconic (RF35, TLX,
TLY)
•Hybrid Option:
RO4350B + FR4
•Finishes:ENIG, Thick Wire Bondable Gold, Flash Gold
•Special Process: Selective plating and etching
•Applications:
Radio Trans-receivers, Antennas, Power Amplifiers
42
Comprehensive Quality System Structure
In Process
Quality Control
Incoming
Quality Control
Panel Control
(Traceability)
Outgoing
Quality Control
Quality
Assurance
TQM Activities
(Continuous Improvement)
Regular Reliability
Test
Implemented Routine Reliability Tests(1)
No
1
2
3
4
5
6
7
Description
Test Parameter
Method Reference
Cross Section
Microscope inspection
Solderability
Preconditioning with 2X IR Reflow;
Solder Pot Temp.:232±6 oC, 2-3 sec IPC-TM-650 2.4.12
(Solder Dip)
per Lot
Thermal Stress, PTH
Temp 288±5 oC, Cycle Time: 10+1/IPC-TM-650 2.6.8
0 sec, Solder Float X5 Cycles;
per Lot
1oz copper foil, 25mm sample width,
Peel Strength
vertical pulling @ 50 mm/min for
min. 30 mm distance
Dielectric Withstanding Finished PCB, 500 +15/-0V, 150V/s,
Voltage
for 30+3/-0 sec
Liquid to Liquid
-55 to 125oC, 15 min. dwell and
Thermal Cycling
ramp time, 200 cycles
Plated thickness of 0.05 mm to 0.1
Tensile Strength &
mm; gage length 50 mm; cross head
Elongation
speed 1.2 mm/min; chart speed 500
mm/min
IPC-TM-650 2.1.1
Frequency
per Lot
IPC-TM-650 2.4.8.4
weekly
IPC-TM-650 2.5.7
weekly
IPC-TM-650 2.5.32
monthly
IPC-TM-650
2.4.18.1
monthly
Implemented Routine Reliability Tests(2)
No
Description
Test Parameter
Method Reference
65±2℃, 87+3/-2 %RH, 100V bias,
IPC-TM-650 2.6.3
500 hrs
Metal thickness on the pad at four
IPC-TM-650 2.4.15
corners and center of the board
Frequency
8
CAF Testing
9
Surface Finish
Thickness
10
Solvent Extracted
75% v/v 2-propanol/water; run time:
IPC-TM-650 2.3.25
Contamination (SEC) 30 minutes
per day
11
IR Reflow Simulation
Lead: 230±5℃ @ 20-30 sec;
Lead free: 260±5℃ @ 20-30 sec
per Lot
12
Soldermask Adhesion
3M Brand 600 ½” wide; min. 50 Per IPC-TM-650
mm in length; perpendicular pulling 2.4.1
per Lot
13
Interconnect Stress
Test (IST))
Ambient temperature to 150 oC, min.
IPC-TM-650 2.6.26
300 cycles
monthly
Material Stability
Tg/∆Tg, CTE, T260. Sample is
heated at a rate of 5oC/min until all
IPC-TM-650 2.4.24
desired transitions have been
completed
per day
14
J-STD-020
monthly
per Lot
State of the Art Facilities
Facilities Summary
•25 years of PCB fabrication experience in China
•Strong financial backing
•Market/Product focused factories
•State of the art equipment and processes
•QTA/NPI to volume production capabilities
•No constraints on expansion
•Dedicated research and development institute
•Commitment to be the technology leader
48
Technology Process
Pre-Production Engineering
Services
• “In Plan” planning software
• Customer Specific Rules Based Automation
• Valor front end CAM (Unlimited Seats)
• Industry Standard for front end engineering
• Stack up consultations, Service Offered No Charge $
• Insight Frontline DFM’s, Service Offered No Charge $
• Tech Seminars /Webinars
• Material Science, Latest in Laminates and Pre Preg’s
• R&D, Building the Toughest to Gain the Knowledge
When you need it, we will be ready!
Go to slide 7
50
High Speed Materials Website Page
Hybrid Construction
for low cost
(Meg 6 combined with low cost material
for power layer)
DFM Report
53
Graphical DFM report
BACK
Go to slide 7
54
Imaging System
55
LDI (Laser Direct Imaging)
Orbotech Paragon SM20
LDI Imaging Systems
• 100% Laser Direct Imaging (LDI)
• Repeatable process, computer controlled
• 24/7 consistent imaging regardless of shift
• No film means lower tooling costs
• No repeating defects
• Consistent trace width
• Tighter impedance control (+/- 5 %)
• ¼ Mil Accuracy .0008 Min Line/.0005 Space
• Layer to layer registration within .0004”
• No film growth due to heat expansion
BACK
57
SCHMID Precision DES Line
(Develop – Etch – Strip)
Inner Layer Develop Etch Strip
• January 2012 State of the art Schmid DES line Installed
• Computer controlled for consistent product
• Full automation removes human element
• 2 Micron variation over panel
• 1 mil core capability for substrate, HDI, and Rigid flex
• 4,000 Cores per day capacity based on current copper mix
• Tripled capacity upon installation
• Positions Streamline for future technologies
BACK
59
Precision Laser Drilling
6 High Speed Laser Drills
Laser Drilling
• 6 Laser drills in house (7th has been purchased)
• Daily processing 4-N-4 of means experience
• Higher stacks available
• .0014” Hole, .004” Pad advances technology window
• Aspect Ratio: 3:1
• Positional Accuracy for Hole Location +/- .0005”
61
Via formation, Aspect Ratios
and Stacked Vias for Increased Densities
BACK
62
Electroless Processing
• Completely Automated Line installed January 2012
• Industry leading 28:1 Aspect Ratio: allows for higher density
designs
• Bar coded processing removes operator errors
• Dwell times established in planning for speed & efficiency,
translating to consistent product
• Ultrasonic, knife edge agitation, vibration & thumper
• 36 stations, Oversized tanks (24”x 30” Panels)
• High volume throughput capability
BACK
63
IPS Automatic Electroless
Plating Line
Test Capabilities:
• 100% Flying probe testing (8 Systems)
• Flexibility, no fixtures, less cost
• Allows for testing sub chapters before final book
• Everett Charles Eliminator for faster testing
• Every board 100% Net List Tested
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Everret Charles Flying Probe Testing
With the Eliminator
Pluritec Inspecta X-ray
Registration System
Internal Registration
• In unison with “Xact Software” for
scaling
• Internal Registration is one of the key
attributes in being successful
• X-Ray allows verification in real time
• X-Sections Verify X-Ray
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Xact Scaling Report
Non Conductive Filled
Via Wrap Per IPC 6012 Class III
Electroless
Wrap
Dendrites
(Teeth)
Smooth
Copper
Copper Fill Laser Vias
& Through Hole Solid Copper Vias
Thermal Via Farms for Thermal Management
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Chip Scale Packaging
• Chip Scale Packaging Requires Streamlines Equipment Sets for Success100% LDI
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LSMDP
Laser Solder Mask Defined Pad
Using the LDI’s
• Precise Imaging to .0005” clearance
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Allows reduced solder mask clearance sizes
May reduce layer count
Maximize geometry
Using laser solder mask defined pad (LSMDP)
• You can define a “Pad” on top of a pad
LSMDP
(Laser Solder Mask Defined Pad)
Ink Jet Silkscreen
Orbotech Sprint-8TM
Ink Jet Silkscreen
“Now Engineers can actually read to debug!”
– Ultra Fine Crisp Lines, Down to 3 mil
– Serialization on the fly, BAR Code & QR codes
– Applied over partially cured mask providing for the
mask and legend to be cure simultaneously to reduce
cycle time
– Combination inkjet and laser technology
– Dry's the ink as it’s applied
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Quality Verification
•Verify Expected Results
• 2 X-Section labs on site
• 200 plus sections per day
• Wet processing lab onsite
• CMM For critical measurement reporting
• Two TDR’s for impedance verification
• Single ended & diff pairs (Separate testing for
accuracy)
• Ionic contamination testing
• In process lamination X-ray verification
• XRF Gold thickness verification X-Ray
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Q-Pulse
Total Quality Management
• Quality Assurance Systems
• Q-Pulse Quality System
• NCMR’s and Corrective Actions
• Audits
• Training
• Equipment Calibrations
• Quality Certifications
• IPC Certified Trainers 6012, 13,15,18
• ISO 9001 AS9100C ITAR MIL-P-55110
• Mil-P-31032 In Process
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Future Investments
• New Schmid outer layer etcher
• 2 Orbotech AOI systems with .0005” (1/2 mil) capability
• New Electroless Gold line (Enepig)
• 2 Additional LDI systems
• New Photo plotter for button and silkscreen film
• Additional OEM Press
•Facility Growth Expansion.
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Sample Case #1
Highlights:
1/1 Trace Space
4 N 4 Stacked Micro Vias
.225 mm 1300 Pin BGA
1.6 Mil Via – 4 Mil Pad
.020 Thick
Sub Panel Test
Equipment Set:
LDI, DES
Laser, Inspecta, LDI
LDI, Inspecta, LDI S/M
LDI, Laser, Electroless
LDI, DES, Inspecta
Flying Probe
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Sample Case #2
Speed Test:
• 800ea 10 layers
• 2 Lamination cycles
• Buried vias, 2-9
• Laser Micro Blind 2-3, 8-9
• Laser Micro Blind 1-2, 910 with via in pad
• 3/3 trace and space
• 6.5 PTH to Copper
Delivered in 4 Days
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Extremely Thin
• 4 Layer Buried vias 2 -3
• 2 Lamination cycles
• Laser Micro Blind 1-2, 3-4
• Finished thickness .0054
• Equipment set
Sample Case #3
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