IIC-China: BIG on Education
Conferences ▪ Technical Application Courses
Shenzhen  February 28, March 1 & 2, 2013
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The world has seen BIG technological
breakthroughs in the past few years
What is next in the future of electronics design?
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Engineers need your technology to
innovate & design the next BIG thing
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They attend IIC-China to find new
technology and learn the latest trends
*Reasons why engineers attend IIC-China (Source: IIC-China 2012 visitor survey)
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Influence technology selection in
an authoritative environment
5,174 engineers attended
61 educational sessions in 2012
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IIC-China’s educational program helps improve my design skills.
The panel discussion featuring industry experts is very insightful
and thought provoking.
- Yue Jie, Purchasing Manager, Osee Digital Technology Ltd.
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Shape the future of China’s
electronics industry at the Conference
Conference
•Join other experts to discuss new trends
and emerging technologies in China’s
electronics industry
•Position your brand with the influential,
editor-led conferences before, during and
after the event
•Be part of the panel of experts as you
address engineers’ design challenges
•Session time: 40 min presentation +
seat at the panel discussion at the end of the
day
•US$6,000 per session
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Smart Technologies. Smart World.
2013 themes:
• “Connecting Worlds” for Connectivity Conference
Cloud computing, HD data transmission, NFC, RFID, HDMI, HML, WLAN, USB,
Rapid IO, High-speed Interfaces, Security control
• “Switched On!” for Power Conference
AC/DC, DC/DC, LDO, Wireless charge, MOSFET, IGBT, GaN, SiC, Digital Power,
LED lighting, LED Dimming, smart meter
• “Smart, Secure Solutions” for Security and Smart Home
Conference
Gesture identifying; Sensor, Amplifier, MCU, DSP, Processor, Networking, Smart
TV solution, Media/Data Center, Remote control (Zigbee, bluetooth), STB,
home security monitoring, video image processing, video data transmission,
embedded OS
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Smart Technologies. Smart World.
• “Mobility Rules” for Smartphone and Tablet Design
Conference - Hardware and Software track
Memory, MEMS Sensor, 4G/LTE, processor, PA, OS, IP core, Mobile Internet,
Clock
• “Competing Views” for Smartphone and Tablet Design
Conference - Display Technology track
Multi-touch controller, HD, 3D, AMOLED Driver, latest display panel
• “Testing Grounds” for Test & Measurement Conference
Oscilloscope, Signal source generator, thermal test, RF/Microwave test, Virtual
instrument, optical network test, portable instrument
• “Building on Your Ideas” for IC Supply Chain Conference
EDA tools, PCB design tools, Mixed-signal EDA tools, verification workflow, 3D
manufacturing technology, MEMS chips manufacturing
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Instruct engineers on latest solutions
at the Technical Application Courses
Technical Application Courses (TAC)
•Train China’s engineers on your
technology, how it’s applied, and how it
makes a difference to their design work
•Address technologies essential to
engineers in their future design
•Session time: 50 minutes
•US$3,500 per session
*Refer to the latest matrix for time slots
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Educate and build thought leadership
at IIC-China’s Conference Program
Conference
TAC
40 min presentation
+ seat at the panel discussion
50 min
presentation
80-100
50-80
Sound system, video projection system & screen
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Complimentary invitation materials
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Full editorial support to define talking points
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Website,
relevant print ads & eDM
Website
Session duration
Expected attendance
Brand building
Pre-event promotion
Onsite promotion
• Signboard at the conference room • Invitation cards
• Logo on backdrop
• Invitation cards
Lead generation
Access to the attendee list
Rates
Attendee list using scanner
Onsite name card
collection
US$6,000
US$3,500
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Conference
themes
suggested topics
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Connecting Worlds
Keynote
Roundtable
Suggested topics
Connectivity Conference: Connecting Worlds
Cloud computing: How to connect the ‘clouds’ over the China sky?
Prospects & competitive analysis of new connectivity technologies
• Network design for the cloud
• EMI protection strategy for HSDI
• Implementation of near field communication (NFC)
• Application of Serial Rapid IO in high performance embedded system interconnect
• Using chips to ensure data transmission security
• Prospects of NFC in mobile payment
• Overcoming the challenges of HD data transmission
• 802.11ac solutions
• HDMI designs
• Cloud computing: Its requirements for next-generation memory technologies
• How can high-speed connection technology meet needs of cloud computing?
• High-speed interconnect technology for data centers
• HD data transmission solutions for portable devices
• New breakthroughs in high-speed optical connection
• Connectivity: Optimization and innovation for the Internet of Things
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Switched On!
Keynote
Roundtable
Suggested topics
Power Conference: Switched On!
Optimizing power efficiency of portable devices
New approaches to improving efficiency
 Digital power: easy design even for a novice engineer
 Optimizing LED lighting design
 Lowering noise of switch-mode DC-DC convertors
 Challenges & breakthroughs in conversion efficiency for wireless charging
technology
 Improve standby power management of smart terminals (cell phones, tablets)
 Low-power design solutions for smart terminals
 Latest battery technologies
 Breakthroughs and application prospects of new GaN、SiC power devices
 How can power MOSFETs and IGBTs improve efficiency?
 Advanced technologies to improve device efficiency
 New methods to improve efficiency of linear and switching power devices
 Energy-saving solutions for data centers
 High-efficiency, high-integration power modules
 Next-generation smart meter design
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Smart, Secure Solutions
Keynote
Roundtable
Suggested topics
Security and Smart Home Conference: Smart, Secure Solutions
Smart home with multiscreen interaction: when will it be a reality?
Who will win the smart home battle - TV, cell phone or PC manufacturers?
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Three HD video surveillance solutions (IP surveillance, SD-HDI
surveillance, 960H analog surveillance)
SoC chip applications for high-definition IP cameras and video imaging
enhancement technologies
Next-generation image sensor technologies
Solutions for real-time, secure video transmission
Cloud computing and video data storage solutions
3G/4G LTE video surveillance solutions
The future of 3D gesture recognition
Home wireless controls with Zigbee technology
DSP solutions for smart video analysis devices
MEMS applications in smart TVs
Embedded software platforms for smart home control panels
Smart home applications based on wireless sensor networks
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Mobility Rules
Smartphone & Tablet Design Conference -- Hardware & Software track: Mobility Rules
Smartphones: How many CPU cores do we really need?
Keynote
Striking a balance between features and costs
Roundtable
Suggested topics  What advantages do multi-core CPUs bring to your applications?
 Multi-core GPUs for next generation smart devices
 Has the era of x86-based multi-core processors arrived?
 MEMS applications in portable devices
 Applying eMCP and eMMC in smart devices
 HD audio adds value to smart devices
 Speech enhancement in noisy environment
 RF design of multi-mode, multi-band LTE/4G smartphones
 Will ARM+Win8 tablets replace notebooks?
 How can China's OS seize the opportunity in mobile Internet?
 MEMS gyroscopes and gravity accelerometers (inclinometers)
 Prospects of mobile payment in China
 Comparison of various embedded operating systems
 Breaking the bottleneck of large-scale commercial use of MEMS clocks
 Latest IP cores improve performance of cell phones and tablets
 Optimization of memory performance
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Competing Views
Smartphone & Tablet Design Conference: Display Technology track: Competing Views
What display technologies will lead next-generation mobile terminals?
Keynote
3D display technology: the next flash point in smartphone market?
Roundtable
Suggested topics
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HD display design: Design challenges
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Penetration of 3D display technologies into the smartphone market
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Will 720p become a standard feature in high-end smartphones?
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Augmented reality technology injects new life to smartphones
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Will >300ppi pixel density go mainstream in Smartphones
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Flexible screens: The ideals and the reality
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New trends in UI enabled by multi-touch technology
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Supply and demand trends for small and medium OLED panels
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Smartphone boom to drive innovation in tablet display technology
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Trends of efficient backlight technology
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Latest solutions in touch tech
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Realize display differentiation through AMOLED
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Optimizing display technology
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Testing Grounds
Keynote
Roundtable
Suggested topics
Test & Measurement Conference: Testing Grounds
Test technology for the 4G era
How will the T&M industry meet challenges of new applications?
• High-speed, high-precision oscilloscopes
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Test technology for next-generation wireless communication
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Test technologies for high-speed interfaces (Thunderbolt, Displayport1.2)
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Testing energy-efficient computing devices
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Testing near-field detection systems (e.g. NFC)
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Measuring technologies for new applications (e.g. LED driver, electric car)
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New trends in oscilloscopes
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Breakthroughs in signal generators
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Realizing manufacturing automation with virtual instrumentation
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RF/microwave measurement: break through the performance bottleneck
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Improving reliability of portable devices
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Enhancing the accuracy of thermal test analysis
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Building on Your Ideas
Keynote
Roundtable
Suggested topics
IC Supply Chain Conference: Building on Your Ideas
Improving and optimizing production yield
The new roles of Foundry & EDA vendors in China’s nanometer era
• Analog process meeting the needs of China Fabless
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HV Analog process improves yield
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Finding right approach to manufacture MEMS chips
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3D manufacturing technology
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Selecting a right foundry to achieve quick TTM
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EDA tools meet mass production requirements
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Creating new features for Mixed-signal EDA tools
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PCB design tool to improve SI performance
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Emulator speeds up verification workflow
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IIC-China: BIG on Education
Conferences ▪ Technical Application Courses
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