WELCOME TO THE
ICOPS 2012
VORPAL WORKSHOP
14:00: INTRODUCTION TO TECH-X AND VORPAL (J
CARY)
14:30: INTRODUCING NAUTILUS (P STOLTZ)
14:50: SIMULATING MEDICAL PLASMAS USING
FDTD (A LIKHANSKII)
15:10: COFFEE BREAK
15:30: AEROSPACE PLASMAS AND
(VORPAL/NAUTILUS CO-SIMULATION) (ALEX
LIKHANSKII)
16:00: VIZUALISATION TECHNIQUES WITH HDF5
FILES (J SMITH)
16:20: CCP CHAMBER SIMULATIONS (P STOLTZ)
16:50: CONCLUDING REMARKS (J SMITH)
AND DAVID SMITHE AND MING-CHIEH LIN
John Cary
CEO
Jonathan Smith
Tech-X UK Ltd &
Cockcroft-Tech-X
Industrial Fellow
SIMULATIONS EMPOWERING YOUR INNOVATIONS
What are the plans for today?
• Show how to get answers using Vorpal
• Work with you on various plasma modeling
problems
• Get your feedback
In this introduction:
• Overview of Tech-X
• Recent additions to Vorpal
• Roadmap for Vorpal
SIMULATIONS EMPOWERING YOUR
INNOVATIONS
www.txcorp.com
With 18 years of experience, Tech-X’s mission is to provide customers with
the best computational software and engineering services to enable their
breakthroughs in research, development, design, and operations
• High-performance
•
computational software
• High-performance
•
visualization and HPC
application front ends
Enhancing code
performance
Other development
including quality and
portability
Partners and Collaborators
Our partners and collaborators are at the leading edge of
science and technology. They represent a broad spectrum of
efforts to discover, describe, predict and exploit the complex
behaviors of matter and energy.
Customers and Commercial Partners
We provide our customers with both off-theshelf and customized solutions addressing
their advanced technology needs.
Tech-X has a history of discovery and
recognition
2008
Crab Cavity Visualization
2011
AVS Innovation Award
Far reaching
discoveries
Tech-X UK Ltd wins
2010 knowledge
business of the year
Laser-Plasma Accelerator
SIMULATIONS EMPOWERING YOUR
INNOVATIONS
Department of Energy
Visualization Awards
Vorpal: Past and Future (Road Map)
• OOPIC Pro
• 5.0 improvements
• 5.2 improvements
• Road Map
6.0 features
 7.0 features

SIMULATIONS EMPOWERING YOUR
INNOVATIONS
OOPIC Pro has reached its end of life
• All OOPIC Pro features will be supported by
Vorpal 6.0, which furthermore has a host of other
features (3D, better parallelism, more solvers, …)
• Support will have to be at a volunteer basis after
December 31, 2012
• XOOPIC remains available
SIMULATIONS EMPOWERING YOUR
INNOVATIONS
Vorpal: Plasma and
EM modeling framework
• Broad range of plasma, EM and ES models
Particle-in-cell, Boltzmann fluid, Euler fluids
 Cut-cell algorithms for accurate electromagnetics
in complex geometries

• Runs on largest-scale parallel supercomputers,
routinely on > 30,000 node concurrently
• Extensive implementations of plasma-material
interaction physics
Sputtering
 Secondary emission,
 Ionization, recombination, nuclear reactions

SIMULATIONS EMPOWERING YOUR
INNOVATIONS
Vorpal: Wide range of
applications
• Widely used in government, industry and academia (all
projects below with involvement of Tech-X personnel)
• High-energy physics: Laser Wakefield Accelerators
• Aerospace: Plasma engines, dielectric barrier
discharges
• Photonics: Bandgap structures, meta-materials
• Surface interaction: Multipactoring, electron cloud
effects
• High-Power Microwave: Cavity optimization,
Magnetrons, Gyrotrons
• Semiconductor manufacturing: Surface deposition
reactors
• Ion sources: Electron cyclotron resonance ion sources
• High energy-density physics: laser fusion, inertial
confinement fusion (ICF)
SIMULATIONS EMPOWERING YOUR
INNOVATIONS
Vorpal 5.0 (Sep 2011)
• Improved Visualization Environment
• Simulations in Cylindrical Coordinates
• Improved Framework for Collisions
• Electromagnetic Simulations on GPUs
• Improved Restart Performance
• Improved Documentation
• VorpalComposer (VisIT based
visualization)
SIMULATIONS EMPOWERING YOUR
INNOVATIONS
Composer Toolkit Approach:
Customizable Workflow bridges the gap to HPC
Vorpal 5.2 (March 2012)
• Inclusion of new, improved port macros.
• More cylindrical examples
• Improvements to particle post-processing
• External circuit improvements
• Further enhancements to visualization tools.
Improved cylindrical visualizations
 Improved phase-space plots

SIMULATIONS EMPOWERING YOUR
INNOVATIONS
Vorpal 6.0 (expected Aug-Sep 2012)
• Remote control and visualization
• Implicit electromagnetics
• Improved parallel performance
• Modularity
• Flexible collision framework to allow
Collisional recombination
 1->2 body decay
• Allow user definition of all process rates/cross sections
 Cross sections
 Field ionization
 Secondary electron yield
 Sputtering
• User definable post analysis

SIMULATIONS EMPOWERING YOUR
INNOVATIONS
Vorpal 7.0 (expected Aug-Sep 2013)
• Constructive Solid Geometry
• Input file generation
Syntax highlighting
 Context sensitive help
 Validation (strong typing)
 Preview of calculated variables
 'Tree view'
More CAD readers (STEP, SAT)
Space-charge limited emission (Child Langmuir)
Coulomb collisions
Embedded boundary electrostatics
Higher-performing particles
 AVX
 GPU
 MIC?
SIMULATIONS
EMPOWERING
YOUR
Neutral fluid flow, with fluid
heated
by the plasma

•
•
•
•
•
•
INNOVATIONS
We are looking for user input
• What do you need?
• What can make your life easier?
jonathan.smith@txcorp.co.uk
Tech-X UK Ltd
Daresbury Innovation Centre
Sci-Tech Daresbury
Keckwick Lane
Warrington WA4 4FS
+44 (0) 1925 320 210
sales@txcorp.com
Tech-X Corporation
5621 Arapahoe Ave.
Boulder, CO 80303
Tel: +1 303 448 0727
SIMULATIONS EMPOWERING YOUR INNOVATIONS