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CMOS Inverter Static Characteristics Lecture Notes

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3/1/24
Digital Circuits
ECE 212
Lecture 3
CMOS Inverter – Static Characteristics
Mohamed Dessouky
Integrated Circuits Laboratory
Ain Shams University
Cairo, Egypt
Mohamed.Dessouky@eng.asu.edu.eg
Digital Circuits – ECE212 – S24
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Reminder: NMOS and PMOS Transistors
W
L
+ve VGS
+ve VTH
+
−−
−−
+
L
-ve VGS
-ve VTH
L
• nMOS is ON when a +ve voltage is applied between the gate-source.
• pMOS is ON when a -ve voltage is applied between the gate-source.
M. Dessouky
Digital Circuits – ECE212 – S24
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CMOS Inverter Operation
+
−VDD
0
+
pull-up
to VDD
OFF
PMOS
_
_
PMOS
0
VDD
+
NMOS
VDD
+
pull-down
to GND
0
_
NMOS
OFF
_
π’—π’Š = VDD, QN οƒž ON, QP οƒž OFF, 𝒗0 = 0 (pull-down)
π’—π’Š = 0,
QN οƒž OFF, QP οƒž ON, 𝒗0 = VDD (pull-up)
∴ 𝒗0 = 𝒗ΰ΄₯π’Š
Digital Circuits – ECE212 – S24
M. Dessouky
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Inverter: Cross-Section and Top View
V
DD
SiO2
Insulator
p+
p+
n+
V
n+
PMOS
NMOS
Lp=Lmin
Ln=Lmin
DD
M2
PMOS
Gates from
polysilicon
Vin
Metal lines
Lp
Vout
Ln for connections
M1
Wn=Wp
NMOS
Inverter top view - Layout
M. Dessouky
Inverter Schematic
Digital Circuits – ECE212 – S24
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Definition: The  ratio
• Define
=
(W L ) p
(W L )n
(design parameter)
• In digital circuits, we often choose minimum
transistor lengths for lower transistor resistance
and maximum speed
Lp
Lp = Ln = Lmin
  = Wp Wn
• Is the main designer optimization parameter
• Since all transistor parasitic capacitance is
proportional to W
Cdp ο‚» Cdn
Cgp ο‚» Cgn
Ln
Wn=Wp
Digital Circuits – ECE212 – S24
M. Dessouky
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Definition: The r ratio
• Define the resistance ratio of identically-sized PMOS
and NMOS ( =1)
• Remember
Req ο‚»
π‘Ÿ=
π‘…π‘’π‘žπ‘
π‘…π‘’π‘žπ‘›
3 VDD  7
οƒΆ
1 − VDD οƒ·
4 I DSAT  9
οƒΈ
Lp
I DSAT ο‚΅ W 1L , 
π‘Š
𝐼𝐷𝑆𝐴𝑇 = πœ‡πΆπ‘œπ‘₯
𝑉 − 𝑉𝑇𝐻 2
2
𝐿 𝐷𝐷
∴π‘Ÿ=
π‘…π‘’π‘žπ‘ πœ‡π‘›
=
= mobility ratio ο‚» 3 to 3.5
π‘…π‘’π‘žπ‘› πœ‡π‘
• Therefore, r is a constant, technology parameter
• In general:
• In order to have π‘…π‘’π‘žπ‘ = π‘…π‘’π‘žπ‘›, then choose 𝛽 = π‘Ÿ
M. Dessouky
Ln
π‘…π‘’π‘žπ‘ πœ‡π‘› π‘Šπ‘› π‘Ÿ
=
=
π‘…π‘’π‘žπ‘› πœ‡π‘ π‘Šπ‘ 𝛽
Wn=Wp
Digital Circuits – ECE212 – S24
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DC Voltage Transfer Characteristics
• Static Plot of Vout vs. Vin
• Vin varies from 0 to VDD
• Input is changed slowly, and output is
measured after all transients are
settled (DC).
• Obtained analytically by equating the
nMOS and pMOS transistor currents
in different regions of operation.
• Solve graphically?
High
Vout
Low
Vin
Low
High
Digital Circuits – ECE212 – S24
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Load Line – Resistor load
• Find dc bias point: 𝐼𝐷 , 𝑉𝐷𝑆 , 𝑉𝐷𝐺𝑆
• Load line equation:
𝑉𝐷𝐷 = 𝑅𝐷 𝐼𝐷 + 𝑉𝐷𝑆
• Solve Graphically.
• Output does not reach ground!!
vout
𝑉𝐷𝐷 − 𝑅𝐷 𝐼𝐷
VGS
𝑖𝐷
𝑉𝐷𝐷
𝑅𝐷
𝑖𝐷
slope=
VDS
vin
1
𝑅𝐷
slope= −
𝑉𝐷𝐷
𝑉𝑅
𝑅𝐷 𝐼𝐷
𝑉𝐷𝑆
Resistor IV characteristics
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π‘‰π‘œπ‘’π‘‘
1
𝑅𝐷
𝑉𝐷𝑆
𝑅𝐷 𝐼𝐷
Transistor 𝐼𝐷 , 𝑉𝐷𝑆 characteristics
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Transfer Characteristics – Transistor load
• Replace the resistor with a fixed-gate pMOS
• Trace π‘‰π‘œπ‘’π‘‘ vs. 𝑉𝑖𝑛 , or the DC Voltage
Transfer Characteristics
• 𝑉𝑖𝑛 = 𝑉𝐺𝑆1 and
π‘‰π‘œπ‘’π‘‘ = 𝑉𝐷𝑆1
• Output does not reach ground!!
ID
Vi4
M1 OFF
M2 Lin.
M1
Vi4
M2
Vi1
Vi3
Vi3
Vi2
Vo4
Vi2
M1 Sat.
M2 Sat.
Vi3
Vi2
Vi1
M1 Sat.
M2 Lin.
Vi1
M1 Lin.
M2 Sat.
Vi4
VVo2o1 VDDVDS
Vo3
Voltage Transfer characteristics
Digital Circuits – ECE212 – S24
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Inverter Transfer Characteristics
• Connect the PMOS gate to 𝑉𝑖𝑛 .
• Trace π‘‰π‘œπ‘’π‘‘ vs. 𝑉𝑖𝑛 , or the DC Voltage
Transfer Characteristics
• 𝑉𝑖𝑛 = 𝑉𝐺𝑆1 = 𝑉𝐷𝐷 − 𝑉𝐺𝑆2
• π‘‰π‘œπ‘’π‘‘ = 𝑉𝐷𝑆1
Vin1
M2
M1
Vin2
Vin3
Vin4
Vin5
Vin5
Vin1
M1 Sat.
M2 Lin.
Vin2
Vin4
Vin3
Vin4
Vin5
M. Dessouky
Vin3
Vin2
Vin2
Vin1
Vin1
Digital Circuits – ECE212 – S24
M1 Lin.
M2 Sat.
Vin3
M1 OFF
M2 Lin.
M1 Sat.
M2 Sat.
Vin4
M1 Lin.
M2 OFF
Vin5
Transfer characteristics
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Inverter Switching Voltage
• Vinv is the input voltage at which Vin = Vout
• Interception with Vout = Vin straight line.
• Analytically, equate both currents in sat.
1
π‘Šπ‘›
πœ‡π‘› πΆπ‘œπ‘₯
𝑉 − 𝑉𝑇𝐻𝑛 2
2
𝐿 𝐺𝑆𝑛
π‘Šπ‘
1
2
= πœ‡π‘ πΆπ‘œπ‘₯
𝑉𝐺𝑆𝑝 − 𝑉𝑇𝐻𝑝
2
𝐿
With
𝑉𝐺𝑆𝑛 = 𝑉𝑖𝑛 , 𝑉𝐺𝑆𝑝 = 𝑉𝑖𝑛 − 𝑉𝐷𝐷
M1 Sat.
M2 Lin.
M1 Lin.
M2 Sat.
Vin = Vout
Solve for 𝑉𝑖𝑛
𝑉𝐷𝐷 − 𝑉𝑇𝐻𝑝 + 𝑉𝑇𝐻𝑛 π‘ŸΤ𝛽
𝑉𝑖𝑛𝑣 =
π‘Ÿ
1 + π‘ŸΤ𝛽
πœ‡ π‘Š
• At 𝛽 = πœ‡π‘›π‘Šπ‘› = 1,
𝑝
•
•
𝑝
𝑉𝑖𝑛𝑣 =
𝑉𝐷𝐷
2
π‘Ÿ
>1
𝛽
M1 OFF
M2 Lin.
π‘Ÿ
=1
𝛽
M1 Sat.
M2 Sat.
π‘Ÿ
<1
𝛽
M1 Lin.
M2 OFF
π‘Ÿ
𝑉
At 𝛽 > 1, stronger nMOS, 𝑉𝑖𝑛𝑣 < 𝐷𝐷
2
π‘Ÿ
𝑉𝐷𝐷
At 𝛽 < 1, stronger pMOS, 𝑉𝑖𝑛𝑣 > 2
Digital Circuits – ECE212 – S24
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Intermediate (Forbidden) Zone
1
•
•
•
•
•
•
2
𝑉𝑂𝐻 : (inv. 1) min output voltage that is considered HIGH
𝑉𝑂𝐿 : (inv. 1) max output voltage that is considered LOW
𝑉𝐼𝐻 : (inv. 2) min HIGH input voltage to guarantee a LOW output (𝑉𝑂𝐿 )
𝑉𝐼𝐿 : (inv. 2) max LOW input voltage to guarantee a HIGH output (𝑉𝑂𝐻 )
Defined by unity gain points
Inputs between 𝑉𝐼𝐿 and 𝑉𝐼𝐻 are said to be in the indeterminate region or
forbidden zone and do not represent legal digital logic levels
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Noise Margin
1
2
π‘Ÿ
<1
𝛽
• Allows you to determine the allowable noise voltage on the input of a
gate (inverter 2) so that the output will not be corrupted.
• How much noise can be added to the worst-case output of inverter 1
(𝑉𝑂𝐿 or 𝑉𝑂𝐻 ), so that inverter 2 sees a valid worst-case input (𝑉𝐼𝐿 or 𝑉𝐼𝐻 )?
• LOW Noise Margin: 𝑁𝑀𝐿 = 𝑉𝐼𝐿 − 𝑉𝑂𝐿
• HIGH Noise Margin: 𝑁𝑀𝐻 = 𝑉𝑂𝐻 − 𝑉𝐼𝐻
π‘Ÿ
• Note that 𝛽 = 1 maximizes both noise margins at the same time. Why?
Digital Circuits – ECE212 – S24
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Power and Energy
• Power is drawn from a voltage source attached to the VDD pin(s) of a
chip.
• Instantaneous Power:
• Energy:
P(t ) = I (t )V (t )
T
E =  P(t )dt
0
• Average Power:
M. Dessouky
T
E 1
Pavg = =  P(t )dt
T T0
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Power in Circuit Elements
• Instantaneous power delivered by a voltage source:
PVDD (t ) = I DD (t )VDD
• Power dissipated in a resistor:
PR ( t ) =
VR2 ( t )
= I R2 ( t ) R
R
• Energy stored in a capacitor:
ο‚₯
ο‚₯
EC =  I ( t )V ( t ) dt =  C
0
0
dV
V ( t ) dt
dt
VC
= C  V ( t )dV = 12 CVC2
0
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Digital Circuits – ECE212 – S24
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Digital Power Dissipation Sources
• Ptotal = Pdynamic + Pstatic
• Dynamic power: Pdynamic = Pswitching + Pshortcircuit
– Switching load capacitances
– Short-circuit current during transitions
• Static power is consumed even when chip has no transition.
– Leakage draws power from nominally OFF devices
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Charging a Capacitor
• When the gate output rises
– Energy stored in capacitor is
2
EC = 12 CLVDD
– But energy drawn from the supply is
ο‚₯
ο‚₯
EVDD =  I ( t )VDD dt =  CL
0
0
dV
VDD dt
dt
VDD
2
= CLVDD  dV = CLVDD
0
– Half the energy from VDD is dissipated in the pMOS transistor as
heat, other half stored in capacitor
• When the gate output falls
– Energy in capacitor is dumped to GND
– Dissipated as heat in the nMOS transistor
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Switching Power
VDD
iDD(t)
fsw =1/T
C
𝑃switching =
𝐸𝑉𝐷𝐷 𝐢𝑉𝐷𝐷 2
=
= 𝐢𝑉𝐷𝐷 2 𝑓sw
𝑇
𝑇
• If a gate switched only % of the time
𝑃switching = 𝛼𝐢𝑉𝐷𝐷 2 𝑓sw
•  is defined as the activity factor
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Short Circuit Power
During
input
transition
• When transistors switch, both nMOS and pMOS networks may be
momentarily ON at once
• Leads to a blip of “short circuit” current.
• < 10% of dynamic power if rise/fall times are comparable for input and
output
• We will generally ignore this component
Digital Circuits – ECE212 – S24
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Static Power
Gate-leakage current
sub-threshold current
• Static gates during idle time, i.e. no transitions
• Pstatic = (Isub + Igate + Ijunct)VDD
– Subthreshold leakage
– Gate leakage
– Junction leakage
• Important for large digital systems with high number of gates
• Increases with temperature
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