2024
PRODUCT GUIDE
HIGH PERFORMANCE
LAMINATE & PREPREG
MATERIALS FOR PCB
MANUFACTURING
1
isola-group.com
CONTENTS
MARKETS
MARKETS
The highest quality raw materials, supported by truly global,
holistic teams of professionals.
Isola products are The Base for
Innovation®, and it’s our goal
to foster breakthroughs that
make a difference every day.
ATTRIBUTES
GLOBAL HEADQUARTERS, CHANDLER AZ
06
20
HIGH SPEED
DIGITAL
PRODUCTS
LAMINATE
& PREPREG
GUIDE
COMPANY OVERVIEW
Isola is a leader in global material sciences. We design, develop, manufacture, and qualify copper-clad
laminates and dielectric prepregs used to fabricate multilayer printed circuit boards (PCBs).
GLOBAL PRESENCE
14
21
RADIO FREQUENCY
& MICROWAVE
PRODUCTS
LAMINATE
& PREPREG
DATA
17
23
HIGH THERMAL
RELIABILITY
PRODUCTS
GLOBAL
NETWORK
Isola has manufacturing, research and development, technical support and sales teams across Asia,
Europe, and the United States. Why is that important? It allows us to service customers all around the
world from start to finish. Knowledge sharing and collaboration is at the heart of our values, and our global
teams work closely together to deliver our very best solutions, every single time.
OUR
MISSION
2
3
Enable innovation and technology with valued
products, services, and technological solutions
developed through a deep understanding
of customer needs and investments in a
highly talented, committed and motivated
workforce.
isola-group.com
ATTRIBUTES
MARKETS
Dive into the markets we’ve served the most and
see how we address the priorities of customers in
vastly different worlds with the same consistent,
high-performing products, vetted and tested
before they ever leave our facilities.
We possess an extensive portfolio of patent and
other intellectual property rights covering our
proprietary resin formulations, and have pioneered
the development of several product categories
with ‘‘best in class’’ technology.
NETWORKING
& COMMUNICATION
5G
APPLICATIONS
Isola 5G materials are designed
for low moisture uptake and stable
electrical performance across a
wide range of temperatures to
handle anticipated environmental
conditions.
Isola helps connect the world with
highly reliable and thermally robust
materials.
RADIO FREQUENCY
& MICROWAVE
AUTOMOTIVE
& TRANSPORTATION
AEROSPACE
& DEFENSE
HIGH SPEED
DIGITAL (HSD)
HIGH THERMAL
RELIABILITY
HIGH DENSITY
INTERCONNECT (HDI)
Isola helps designers achieve
smaller, more powerful and
durable and less power hungry
products.
Isola drives innovation into
automobile, railway and aircraft
electronics with thermally reliable
laminate materials.
Isola offers high reliability and
superior performance laminate
materials for extreme conditions
Isola offers a wide range of HSD
materials that deliver superior
performance and CAF resistance.
Isola offers several products
with different levels of electrical
performance that all possess
excellent thermal reliability.
HDI attributes are PCB designs that
employ increased feature density
to achieve lighter weight, reduced
layer count, and thinner stack ups.
COMPUTING, STORAGE
& PERIPHERALS
MEDICAL, INDUSTRIAL
& INSTRUMENTATION
CONSUMER
ELECTRONICS
HALOGEN
FREE
HIGH
TEMPERATURE
RADIO FREQUENCY
& MICROWAVE
Isola’s high-speed digital materials
are the base for the internet of
things.
Isola’s materials help cost savings
for today’s advanced electronics.
Isola’s materials help put the
consumer in control of their
electronic devices.
Isola offers a variety of nonhalogenated materials to meet the
industry’s increased performance
demands for eco-friendly designs.
Isola offers materials designed
for demanding high temperature
printed circuit applications.
Today’s designers are challenged
with the task of achieving an
optimal balance between cost and
performance when selecting base
materials.
4
5
isola-group.com
TERRAGREEN® 400G2
PRODUCTS
Halogen-Free, Extremely Low Loss Material
TerraGreen® 400G2 laminate materials are our most advanced ultra-high
speed, halogen-free extremely-low loss design solution.
PRODUCT AVAILABILITY
TerraGreen® 400G2 is our halogen-free material solution
for next generation 5G infrastructure, data center systems, high end computing, wired & wireless communications and AI applications. Our novel resin system, using
ultra smooth HVLP3 (VLP1) copper foil and 2nd generation
ultra low Dk glass has been engineered for very high data
rates of >100 Gb/s with excellent cost for loss performance.
Standard Material Offering: Laminate
• 2 to 10 mil (0.05 to 0.25 mm)
Copper Foil Type
• HLVP3 (VLP1) ≤1.1 micron Rz JIS
Copper Weight
• ½, 1 oz (18 and 35 μm) available
• Thinner copper foil available
Standard Material Offering: Prepreg
• Tooling of prepreg panels available
• Moisture barrier packaging
The TerraGreen 400G2 resin system has proven superior
CAF performance on tight pitch testing. CAF performance
is enhanced by the resin systems excellent interlaminar
and bond line adhesion strength.
Glass Fabric Availability
•
•
•
•
TerraGreen 400G2 is lead free compatible and sequential
lamination capable and can be processed utilizing standard PCB equipment and processing steps. TerraGreen
400G2 meets UL94 V-0.
Ultra Low Dk glass
Mechanically spread glass
Square weave glass
Mechanically spread glass
Tachyon VLP2
TerraGreen VLP2
I-TERA MT40 VLP2
Insertion Loss Over Frequency
I-Speed VLP2
CAF Resistance Data - MRTV
I-Speed-IS
0.0
1.E+14
TerraGreen 400G2 VLP1
1.E+12
-0.5
-0.5
1.E+10
-1.0
TerraGreen 400G VLP1
TerraGreen 400GE VLP1
Tachyon 100G VLP2
TerraGreen 400GE VLP2
-1.5
1.E+08
-1.0
-2.0
Symmetric Stripline Example
1.E+06
HOLE O
1.E+04
-1.5
HIGH SPEED
DIGITAL
1.E+02
6
4
0
200
10
8
400
600
Frequency
-GHz
Time @ 65C/87%/100V (hours)
12
PREPREG
COPPER
-3.0
HW - HW
Hole Diameter
Hole Wall to Wall
PCB Thickness
-2.0
1.E+00
2
Isola offers a wide range of High-speed Digital (HSD) materials that
deliver superior performance and CAF resistance. These low-loss
materials are targeted for applications that require high reliability
and signal integrity. Isola also offers halogen-free HSD materials for
green electronics.
-2.5
0.90 mm
0.40 mm
3.3 mm
-3.5
16
-4.0
14
800
1000
Tg
Td
T-260
T-288
Dk
°C
°C
min
min
2GHz
10GHz
2GHz
200
380
≥60
≥60
3.10
3.10
0.0015
LAMINATE
0
7
20
70
60
50
30
40
Frequency [GHz}
TYPICAL PEEL
STRENGTH
MOISTURE
ABSORPTION
UL
CTI
10GHz
LB/IN
%
RTI oC
UL
CLASS
0.0015
4.10
<0.1
140
2
Df
MARKETS
6
1/2 Oz
5 mils
5 mils
Copper Foil
Prepreg Thickness
Laminate Thickness
Line Width Tuned to 50 Ohms
ATTRIBUTES
isola-group.com
TERRAGREEN® 400G
TERRAGREEN® 400GE
TerraGreen® 400G laminate materials are our most advanced ultra high
speed, extremely low loss design solution.
TerraGreen® 400GE laminate materials are our most advanced ultra-high
speed, halogen-free ultra-low loss design solution.
Halogen-Free, Ultra Low Loss Material
Halogen-Free, Extremely Low Loss Laminate and Prepreg
PRODUCT AVAILABILITY
TerraGreen® 400G is our halogen-free material solution
for next generation 5G infrastructure, data center systems, high end computing, wired & wireless communications and AI applications. Our novel resin system using
ultra smooth HVLP3 (VLP1) copper foil and Low Dk glass
has been engineered for very high data rates of >100
Gb/s with excellent cost for loss performance.
Standard Material Offering: Laminate
The TerraGreen 400G resin system has proven superior
CAF performance on tight pitch testing. CAF performance
is enhanced by the resin systems excellent interlaminar
and bond line adhesion strength. TerraGreen 400G is
lead free compatible and sequential lamination capable
and can be processed utilizing standard PCB equipment
and processing steps. TerraGreen 400G meets UL94 V-0.
Standard Material Offering: Prepreg
PRODUCT AVAILABILITY
TerraGreen® 400GE is our halogen-free material solution
for next generation 5G infrastructure, data center systems, high end computing, wired & wireless communications with data rates >100 Gb/s. Our novel resin system
using RTF3 (<2.5 µm Rz JIS) copper foil and e-glass is our
lowest cost member of the TerraGreen® 400G family of
products.
• 2 to 10 mil (0.05 to 0.25 mm)
Copper Foil Type
• HLVP3 (VLP1) ≤1.1 micron Rz JIS
• Advanced RTF ≤2.1 micron Rz JIS
• Copper Weight
• ½, 1 and 2 oz (18, 35 and 70 μm) available
• Thinner copper foil available
• 2 to 10 mil (0.05 to 0.25 mm)
Copper Foil Type
• HVLP3 (VLP1) ≤1.1 micron Rz JIS
• Advanced RTF ≤2.1 micron Rz JIS
• Copper Weight
• ½, 1 and 2 oz (18, 35 and 70 µm) available
• Thinner copper foil available
Standard Material Offering: Prepreg
The TerraGreen 400GE resin system has proven superior
CAF performance on tight pitch testing. CAF performance
is enhanced by the resin systems excellent interlaminar
and bond line adhesion strength.
• Tooling of prepreg panels available
• Moisture barrier packaging
Glass Fabric Availability
• Low Dk glass
• Square weave glass
• Mechanically spread glass
• Tooling of prepreg panels available
• Moisture barrier packaging
Glass Fabric Availability
• E-glass
• Square weave glass
• Mechanically spread glass
TerraGreen 400GE is lead free compatible and sequential
lamination capable and can be processed utilizing standard PCB equipment and processing steps. TerraGreen
400GE meets UL94 V-0.
Tachyon VLP2
Tachyon VLP2
TerraGreen VLP2
TerraGreen VLP2
I-TERA MT40 VLP2
I-TERA MT40 VLP2
Insertion Loss Over Frequency
I-Speed VLP2
CAF Resistance Data - MRTV
Standard Material Offering: Laminate
I-Speed-IS
I-Speed VLP2
CAF Resistance Data - MRTV
Insertion Loss Over Frequency
I-Speed-IS
0.0
1.E+14
0.01.E+14
TerraGreen 400G2 VLP1
1.E+12
TerraGreen 400G2 VLP1
TerraGreen 400G VLP1
-0.5
TerraGreen 400GE VLP1
1.E+12
-0.5
-0.5
1.E+10
-1.0
TerraGreen 400G VLP1
TerraGreen 400GE VLP1
Tachyon 100G VLP2
Tachyon 100G VLP2
TerraGreen 400GE VLP2
-1.0
-1.5
1.E+08
-1.0
-1.0
-2.0
1.E+06
HOLE O
1.E+04
-1.5
1.E+02
-2.0
1.E+00
2
Hole Diameter
Hole Wall to Wall
PCB Thickness
0
4
200
6
10
12
8
400 -GHz
600
Frequency
Time @ 65C/87%/100V (hours)
14
800
0.90 mm
0.40 mm
3.3 mm
-3.5
16
-4.0
1000
Tg
Td
T-260
T-288
°C
°C
min
min
2GHz
10GHz
2GHz
200
380
≥60
≥60
3.15
3.15
0.0017
MARKETS
Dk
Symmetric Stripline Example
PREPREG
1.E+04
-1.5
COPPER
-3.0
HW - HW
-2.0
1.E+06
Symmetric Stripline Example
-2.5
LAMINATE
Copper Foil
Prepreg Thickness
Laminate Thickness
Line Width Tuned to 50 Ohms
0
20
1.E+02
1/2 Oz
5 mils
5 mils
60
50
6
4
0
70
200
10
8
12
0.90 mm
0.40 mm
3.3 mm
-3.5
16
-4.0
14
Frequency
-GHz
400
1000
800
600
Time @ 65C/87%/100V (hours)
MOISTURE
ABSORPTION
UL
CTI
Tg
Td
T-260
T-288
10GHz
LB/IN
%
RTI oC
UL
CLASS
°C
°C
min
min
2GHz
10GHz
2GHz
0.0017
4.10
<0.1
140
2
200
380
≥60
≥60
3.29
3.29
0.0026
ATTRIBUTES
PREPREG
COPPER
-3.0
HW - HW
Hole Diameter
Hole Wall to Wall
PCB Thickness
-2.0
1.E+00
2
30
40
Frequency [GHz}
-2.5
TYPICAL PEEL
STRENGTH
Df
TerraGreen 400GE VLP2
-1.5
1.E+08
HOLE O
-0.51.E+10
Dk
LAMINATE
Copper Foil
Prepreg Thickness
Laminate Thickness
Line Width Tuned to 50 Ohms
0
20
1/2 Oz
5 mils
5 mils
TYPICAL PEEL
STRENGTH
MOISTURE
ABSORPTION
UL
CTI
10GHz
LB/IN
%
RTI oC
UL
CLASS
0.0026
4.10
<0.1
140
2
Df
MARKETS
ATTRIBUTES
I-Tera® MT40 laminate materials exhibit exceptional electrical properties which
are very stable over a broad frequency and temperature range.
8
9
70
60
50
30
40
Frequency [GHz}
isola-group.com
TACHYON® 100G
I-TERA® MT40
Very Low Loss Laminate and Prepreg
Ultra Low Loss Laminate and Prepreg
Tachyon® 100G laminate materials are designed for very high-speed digital
applications up to and beyond data rates of 100 Gb/s.
PRODUCT AVAILABILITY
PRODUCT AVAILABILITY
Standard Material Offering: Laminate
Tachyon® 100G materials exhibit exceptional electrical
properties that are very stable over a broad frequency
and temperature range between -55°C and +125°C up to
100 GHz. These electrical properties provide designers
a scalable solution for next generation designs of backplanes and daughter cards, enabling 10x improvements
from 10 Gb/s data rates.
Copper Foil Type
•
•
•
•
HLVP3 (VLP1) ≤1.1 micron Rz JIS
HVLP (VLP2) ≤2.5 micron Rz JIS
Advanced RTF ≤2.1 micron Rz JIS
Embedded resistor foil
Copper Weight
• ½, 1 and 2 oz (18, 35 and 70 μm) available
• Heavier copper foil available
• Thinner copper foil available
Tachyon 100G has the highest level of thermal performance for high layer count line cards. The very low Z-axis
CTE makes it a perfect choice for fine pitch BGA applications of 0.8 mm or less. The material is optimized with the
use of spread glass to mitigate skew, improve rise times,
reduce jitter, and increase eye width/height and that use
ultra smooth HVLP (VLP2) 2um Rz copper that significantly reduces conductor losses.
• 2 to 24 mil (0.05 to 0.61 mm)
Copper Foil Type
•
•
•
•
• Moisture barrier packaging
• Tooling of prepreg panels available
Glass Fabric Availability
• Low Dk Glass
• Square weave glass
• Mechanically spread glass
Tachyon VLP2
HVLP (VLP2) ≤2.5 micron Rz JIS
Advanced RTF ≤2.1 micron Rz JIS
RTF (Reverse Treat Foil)
Embedded resistor foil
Copper Weight
• ½ to 2 oz (18, 35 and 70 μm) is standard
• Heavier copper foil available
• Thinner copper foil available
I-Tera MT40 laminate materials are currently being offered
in both laminate and prepreg form in typical thicknesses
and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer,
hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-Tera MT40 does not require any special through hole treatments commonly needed when
processing PTFE-based laminate materials.
Standard Material Offering: Prepreg
Standard Material Offering: Prepreg
• Tooling of prepreg panels
• Moisture barrier packaging
Glass Fabric Availability
• E-glass
• Square weave glass
• Mechanically spread glass
Tachyon VLP2
TerraGreen VLP2
CAF Resistance Data - MRTV
0.0 0.4mm H-H MRT6 TV After Reflow
Standard Material Offering: Laminate
I-Tera® MT40 is suitable for many of today’s high speed
digital and RF/microwave printed circuit designs. I-Tera
MT40 features a dielectric constant (Dk) that is stable between -55°C and +125°C up to W-band frequencies. In
addition, I-Tera MT40 offers a lower dissipation factor (Df)
of 0.0031 making it a cost effective alternative to PTFE
and other commercial microwave and high-speed digital
laminate materials.
• 2 to 20 mil (0.05 to 0.50 mm)
I-TERA MT40 VLP2
TerraGreen VLP2
I-Speed VLP2
I-TERA MT40 VLP2
I-Speed-IS
Insertion Loss Over Frequency
TerraGreen 400GE VLP2
Tachyon 100G VLP2
Insertion Loss Over Frequency
I-Speed VLP2
CAF Resistance Data - MRTV
I-Speed-IS
0.0
1.E+14
1.E+14
1.E+12
I-Speed
0.0
Tachyon 100G VLP2
1.E+12
TerraGreen 400G2 VLP1
IS580G
ARTF
TerraGreen
VLP2
TerraGreen 400G VLP1
-0.5
-0.5
I-TERA MT40 VLP2
I-Tera MT40 VLP2
TerraGreen 400GE VLP1
TerraGreen 400GE VLP2
I-Speed VLP2
-1.0
-0.5
1.E+10
Tachyon 100G VLP2
1.E+10
-1.0
1.E+08
1.E+08
-1.0
2
6
4
0
200
8
10
-2.0
Frequency -GHz
400
600
Time @ 65C/87%/100V (hours)
LAMINATE
14
-2.5
0.90 mm
0.40 mm
3.3 mm 16
Copper Foil
Prepreg Thickness
Laminate Thickness
Line Width Tuned to 50 Ohms
-3.0
1000
800
0
Tg
Td
T-260
T-288
°C
°C
min
min
2GHz
10GHz
2GHz
215
360
≥60
≥60
3.04
3.02
0.0021
MARKETS
1.E+04
-1.5
COPPER
HW - HW
Hole Diameter
Hole Wall to Wall
PCB Thickness
12
Symmetric Stripline Example
PREPREG
Dk
20
1.E+02
1/2 Oz
5 mils
5 mils
30
40
Frequency [GHz}
-2.0
1.E+00 2
0
70
60
50
PREPREG
HOLE O
HOLE O
1.E+02
-2.0
-2.0
1.E+06
Symmetric Stripline Example
-1.5
1.E+04
1.E+00
-1.0
-1.5
1.E+06
HW - HW
Hole Diameter
Hole Wall to Wall
PCB Thickness
4
10
8
400
Frequency -GHz 600
Time @ 65C/87%/100V (hours)
6
200
12
14
16
1000
800
-4.0
Copper Foil
Prepreg Thickness
Laminate Thickness
Line Width Tuned to 50 Ohms
UL
CTI
Tg
Td
T-260
T-288
10GHz
LB/IN
%
RTI oC
UL
CLASS
°C
°C
min
min
2GHz
10GHz
2GHz
0.0021
5.50
<0.1
130
3
215
360
≥60
≥60
3.45
3.45
0.0031
11
40
20
0
Dk
1100
60
TYPICAL PEEL
STRENGTH
MOISTURE
ABSORPTION
UL
CTI
10GHz
LB/IN
%
RTI oC
UL
CLASS
0.0031
5.70
<0.1
130
3
Df
MARKETS
10
1/2 Oz
5 mils
5 mils
Frequency [GHz}
MOISTURE
ABSORPTION
ATTRIBUTES
LAMINATE
0.90 mm
0.40 mm
3.3 mm
TYPICAL PEEL
STRENGTH
Df
COPPER
-3.0
ATTRIBUTES
isola-group.com
IS580G
I-SPEED®
IS580G is a halogen-free 195°C Tg resin system for multilayer PWB applications
where maximum thermal performance and reliability are required.
I-Speed® is a 180°C Tg FR-4 resin system for multilayer PWB applications
where maximum thermal performance and reliability are required.
Halogen-Free, Very Low Loss Material
Low Loss, Epoxy Laminate and Prepreg
PRODUCT AVAILABILITY
PRODUCT AVAILABILITY
Standard Material Offering: Laminate
Standard Material Offering: Laminate
IS580G laminate and prepreg products are manufactured
with Isola’s high performance, low loss, multi-functional
resin system, reinforced with electrical grade (e-glass)
glass fabric. The unique resin system delivers a >25%
improvement in Z-axis expansion while maintaining good
flow and fill properties. These properties, coupled with
superior moisture resistance at reflow, result in a halogen-free product with an industry-leading combination of
thermal and electrical performance.
• 2 to 28 mil (0.05 to 0.71 mm)
I-Speed laminate and prepreg products are manufactured with Isola’s patentable high performance
multi-functional resin system, reinforced with electrical
grade (e-glass) glass fabric. This system delivers a low
Z-axis expansion and offers 25% reduction in loss compared to our mid-loss products. These properties coupled with superior moisture resistance at reflow, result in
a product that bridges the gap from both a thermal and
electrical perspective.
®
• 2 to 30 mil (0.05 to 0.75 mm)
Copper Foil Type
• Advanced RTF ≤2.5 micron Rz JIS
Copper Weight
• ½, 1 and 2 oz (18, 35 and 70 μm) available
Standard Material Offering: Prepreg
• Roll or panel form
• Moisture barrier packaging
• Tooling of prepreg panels
Glass Fabric Availability
• E-glass
• Square weave glass
• Mechanically spread glass
Copper Foil Type
•
•
•
•
HTE Grade 3
HVLP (VLP2) ≤2.5 micron Rz JIS
RTF (Reverse Treat Foil)
Embedded resistor foil
Copper Weight
• ½ to 2 oz (18,35 and 70 μm) is standard
• Heavier copper foil available
• Thinner copper foil available
Standard Material Offering: Prepreg
• Tooling of prepreg panels
• Moisture barrier packaging
The I-Speed resin system is laser fluorescing and UV
blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo imagable solder mask imaging.
Glass Fabric Availability
• E-glass
• Square weave glass
• Mechanically spread glass
Tachyon VLP2
TerraGreen VLP2
I-TERA MT40 VLP2
I-Speed VLP2
CAF Resistance Data - MRTV
Insertion Loss Over Frequency
Caf Resistance Data - MRTV (6xReflow)
Insertion Loss Over Frequency
I-Speed-IS
0.0
1.E+14
1.E+14
Tachyon 100G VLP2
-0.5
1.E+12
1.E+12
IS580G
ARTF
TerraGreen
VLP2
Tachyon 100G VLP2
-0.5
IS580G
ARTF
TerraGreen
VLP2
I-Tera MT40 VLP2
I-Speed VLP2
-1.0
-1.5
1.E+08
HOLE O
-2.5
Hole Diameter
Hole Wall to Wall
PCB Thickness
0
-4.0
1000
800
200
600
400
Time @ 65C/87%/100V (hours)
Tg
Td
T-260
T-288
°C
°C
min
min
2GHz
10GHz
2GHz
195
385
≥60
≥60
3.80
3.80
0.006
MARKETS
Dk
-1.5
1.E+04
COPPER
LAMINATE
-3.5
1.E+00
Symmetric Stripline Example
PREPREG
-3.0
0.90 mm
0.40 mm
3.3 mm
-2.0
1.E+06
Symmetric Stripline Example
1.E+02
-1.5
-1.0
-2.0
HW - HW
I-Speed VLP2
-1.0
1.E+08
1.E+06
1.E+04
I-Tera MT40 VLP2
-0.5
1.E+10
HOLE O
1.E+10
Copper Foil
Prepreg Thickness
Laminate Thickness
Line Width Tuned to 50 Ohms
0
20
1.E+02
1/2 Oz
5 mils
5 mils
Hole Diameter
Hole Wall to Wall
PCB Thickness
-2.0
1.E+00 2
30
40
Frequency [GHz}
60
50
70
6
4
0
200
HW - HW
10
8
Frequency -GHz 600
400
Time @ 65C/87%/100V (hours)
12
14
16
MOISTURE
ABSORPTION
UL
CTI
Tg
Td
T-260
T-288
10GHz
LB/IN
%
RTI oC
UL
CLASS
°C
°C
min
min
2GHz
10GHz
2GHz
0.006
4.30
<0.1
160
2
180
360
>60
≥60
3.64
3.63
0.0059
Dk
-3.0
LAMINATE
-4.0
1000
TYPICAL PEEL
STRENGTH (HTE)
Df
PREPREG
COPPER
-3.5
0.90 mm
0.40 mm
3.3 mm
800
-2.5
Copper Foil
Prepreg Thickness
Laminate Thickness
Line Width Tuned to 50 Ohms
0
12
13
70
60
50
30
40
Frequency [GHz}
TYPICAL PEEL
STRENGTH
MOISTURE
ABSORPTION
UL
CTI
10GHz
LB/IN
%
RTI oC
UL
CLASS
0.0060
5.50
<0.06
130
2
Df
1100
MARKETS
ATTRIBUTES
20
1/2 Oz
5 mils
5 mils
ATTRIBUTES
isola-group.com
ASTRA®MT77
PRODUCTS
Ultra Low Loss Laminate and Prepreg
Astra® MT77 materials are a breakthrough, very low-loss dielectric constant
(Dk) product for millimeter wave frequencies and beyond.
PRODUCT AVAILABILITY
Standard Material Offering: Laminate
Astra® MT77 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency
and temperature range. Astra MT77 is suitable for many of
today’s commercial RF/microwave printed circuit designs.
It features a dielectric constant (Dk) that is stable between
-40°C and +140°C at up to W-band frequencies. In addition, Astra MT77 offers an ultra-low dissipation factor (Df) of
0.0017, making it a cost-effective alternative to PTFE and
other commercial microwave laminate materials.
• 2.5, 5, 7.5, 10, 12.5, 15, 20, 30, 60 mil ( 0.0635, 0.127,
0.1905, 0.254, 0.3175, 0.381, 0.510, 0.760, 1.50 mm)
Copper Foil Type
• HVLP (VLP2) ≤2.5 micron Rz JIS
• Embedded resistor foil
Copper Weight
• ½ to 2 oz (18,35 and 70 µm) is standard
• Thinner copper foil available
Standard Material Offering: Prepreg
• Tooling of prepreg panels
• Moisture barrier packaging
Key applications include long antennas and radar applications for automobiles, such as adaptive cruise control, precrash, blind spot detection, lane departure warning and
stop and go systems.
Permittivity @60GHz
Permittivity @60GHz
Astra MT77
Astra MT77
Very Low Loss Product 1Very Low Loss Produ
Insertion LossInsertion
Over Frequency
Loss Over Frequency
0.0
Very Low Loss Product 2Very Low Loss Produ
Competing PTFE Product
Competing PTFE Pro
0.0
Astra MT77
Permittivity @60GHz
Very Low Loss Product 1
Insertion Loss Over Frequency
0.0
-0.6
-0.6
-0.6
-1.2
-1.2
-1.8
-1.2
Very Low Loss Product 2
Competing PTFE Product
-1.8
Surface Microstrip Example
COPPER
RADIO FREQUENCY
& MICROWAVE
-2.4
-1.8
-2.4
Copper Foil
Laminate Thickness
Line Width Tuned to 50 Ohms
2575
25
75 125
125150
-3.0
-2.4
150
-3.0
0
1/3 oz
5 mils
Tg75
25
Td
125
T-260
T-288
150
-3.0
Dk
0
Df
20
15
TYPICAL PEEL
40
STRENGTH
MOISTURE
60
ABSORPTION
UL80
CTI
Frequency [GHz}
°C
°C
min
min
2GHz
10GHz
2GHz
10GHz
LB/IN
%
RTI oC
UL
CLASS
200
360
≥60
≥60
3.00
3.00
0.0017
0.0017
5.70
<0.1
130
3
MARKETS
14
6080
Frequency [GHz} Frequency [GHz}
Temperature [ºC]
Today’s RF/Microwave and Millimeter Wave designers are
challenged more than ever with the task of achieving an optimal
balance between cost and performance when selecting base
materials.
4060
2040
0 20
Temperature [ºC] Temperature [ºC]
ATTRIBUTES
isola-group.com
80
I-TERA® MT40 (RF/MW)
PRODUCTS
Very Low Loss Laminate
I-Tera® MT40 laminate materials exhibit exceptional electrical properties which
are very stable over a broad frequency and temperature range.
PRODUCT AVAILABILITY
Standard Material Offering: Laminate
I-Tera® MT40 is suitable for many of today’s high speed
digital and RF/microwave printed circuit designs. I-Tera
MT40 features a dielectric constant (Dk) that is stable between -40°C and +140°C up to W-band frequencies. In
addition, I-Tera MT40 offers a very low dissipation factor
(Df) of 0.0028 - 0.0035 making it a cost effective alternative to PTFE and other commercial microwave and highspeed digital laminate materials.
• 5, 10, 20, 30, 40, 60 mil (0.13, 0.25, 0.51, 0.76, 1.02,
1.5 mm)
Copper Foil Type
•
•
•
•
•
Copper Weight
• ½ to 2 oz (18,35 and 70 μm) is standard
• Thinner copper foil available
I-Tera MT40 laminate materials are currently being offered
in both laminate and prepreg form in typical thicknesses
and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer,
hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-Tera MT40 does not require any special through hole treatments commonly needed when
processing PTFE-based laminate materials.
Glass Fabric Availability
• Square weave glass
• Mechanically spread glass
Permittivity @60GHz
Permittivity @60GHz
Insertion
Loss Over Frequency
Insertion Loss Over
Frequency
I-TERA MT40
Very Low Loss Product
0.0
0.0
3.5
@60GHz
HTE Grade 3
HVLP (VLP2) ≤2.5 micron Rz JIS
Advanced RTF ≤2.1 micron Rz JIS
RTF (Reverse Treat Foil)
Embedded resistor foil
Insertion Loss Over Frequency
I-TERA MT40
Very Low Loss Product
I-TERA MT40
Very Low Loss Product
0.0
3.48
-0.6
-0.6
-1.2
-1.2
-1.8
-1.8
-0.6
S21[dB/in]
3.46
-1.2
3.44
Surface Microstrip Example
-1.8
3.42
Copper Foil
Laminate Thickness
Line Width Tuned to 50 Ohms
-2.4
3.4
25
75
25
75
Temperature [ºC]
75
125
Temperature [ºC]
125
150
125
150
-3.0
150
-3.0
1/3 oz
5 mils
-3.0
200
0
4020
Frequency [GHz}
0
40
20
Temperature [ºC]
Tg
Td
T-260
T-288
°C
°C
min
min
2GHz
10GHz
2GHz
215
360
≥60
≥60
3.38, 3.45,
3.60, 3.75
3.38, 3.45,
3.60, 3.75
0.0028 to
0.0035
MARKETS
HIGH THERMAL
RELIABILITY
COPPER
-2.4
-2.4
Dk
6040
Frequency [GHz}
60
80 60
80
Frequency
TYPICAL[GHz}
PEEL
STRENGTH (HTE)
MOISTURE
ABSORPTION
UL
CTI
10GHz
LB/IN
%
RTI oC
UL
CLASS
0.0028 to
0.0035
5.7
<0.1
130
3
Df
80
Thermal reliability requirements can be separated into two categories. The first involves survival of a PCB through assembly
without defects such as blisters or delamination. The second
category involves thermal reliability in the operating environment over a product’s lifetime. Both types of thermal reliability
are critical.
ATTRIBUTES
16
17
isola-group.com
isola-group.com
14
IS550H
370HR
IS550H is our halogen-free laminate solution for high power & voltage
applications that require extreme thermal stability.
370HR is the industry’s “best in class” lead-free compatible product for highreliability applications across a wide range of markets.
High Reliability Laminate and Prepreg
Industry Leading Epoxy Laminate and Prepreg
PRODUCT AVAILABILITY
PRODUCT AVAILABILITY
Standard Material Offering: Laminate
IS550H was developed in conjunction with a consortium
of industry experts for high power & high voltage applications and PEV & HEV automotive electrification. The resulting solution addresses critical application needs for
use in a harsh environment where very demanding, long
term thermal reliability performance, extreme thermal
cycling and very high voltage CAF & electro-migration resistance are required.
Copper Foil Type
• HTE Grade 3
• RTF (Reverse Treat Foil)
Copper Weight
• ½, 1 and 2 oz (18, 35 and 70 μm) is standard
• Heavier copper available
Standard Material Offering: Prepreg
• Tooling of prepreg panels
• Moisture barrier packaging
Glass Fabric Availability
• E-glass
• Square weave glass
• Mechanically spread glass
Tachyon VLP2
• ½ to 2 oz (18,35 and 70 µm) is standard
• Heavier copper available
• Thinner copper foil available
Standard Material Offering: Prepreg
• Tooling of prepreg panels
• Moisture barrier packaging
Glass Fabric Availability
• E-glass
• Square weave glass
• Mechanically spread glass
TerraGreen VLP2
I-Speed VLP2
CAF Resistance Data - MRTV
0.0 0.4mm H-H MRT6 TV After Reflow
I-Speed-IS
I-Speed-IS
Insertion Loss Over Frequency
1.E+14
1.E+12
I-TERA MT40
Very Low Loss Product
0.0
1.E+12
-0.5
-0.5
1.E+10
-0.6
1.E+10
1.E+08
-1.0
-1.2
1.E+08
-1.0
1.E+06
1.E+06
1.E+02
-2.0
6
4
200
8
10
-1.5
1.E+04
HW - HW
Hole Diameter
Hole Wall to Wall
PCB Thickness
12
Frequency
-GHz
800
500
Time @ 85C/85%/100V (hours)
14
0.90 mm
0.40 mm
3.3 mm
1.E+02
-2.0
16
1.E+00 2
1300
1100
-100
Tg
Td
T-260
T-288
°C
°C
min
min
2GHz
10GHz
2GHz
200
400
≥60
≥60
4.50
4.43
0.014
MARKETS
HOLE O
-1.8
HOLE O
-1.5
1.E+04
-100
Copper Weight
I-TERA MT40 VLP2
I-Speed VLP2
1.E+14
1.E+002
• HTE Grade 3
• RTF (Reverse Treat Foil)
• Embedded resistor foil
Tachyon VLP2
TerraGreen VLP2
CAF Resistance Data - MRTV
0.4mm H-H MRT6 TV After Reflow
• 2 to 125 mil (0.05 to 3.2 mm)
Copper Foil Type
370HR is used in thousands of PWB designs and has proven
to be best in class for thermal reliability, CAF performance,
ease of processing and proven performance on sequential
lamination designs.
I-TERA MT40 VLP2
0.0
Standard Material Offering: Laminate
370HR laminates and prepregs, designed by Polyclad, are
made using a patented high performance 180°C Tg FR-4
multifunctional epoxy resin system that is designed for
multilayer Printed Wiring Board (PWB) applications where
maximum thermal performance and reliability are required.
We manufacture 370HR laminates and prepregs with high
quality E-glass glass fabric for superior Conductive Anodic
Filament (CAF) resistance. 370HR provides superior thermal performance with low Coefficient of Thermal Expansion (CTE) and the mechanical, chemical and moisture resistance properties that equal or exceed the performance
of traditional FR-4 materials.
• 2 to 59 mil (0.05 to 1.5 mm)
Dk
6
4
100
8
10
HW - HW
Hole Diameter
Hole Wall to Wall
PCB Thickness
12
-2.4
14
Frequency -GHz
500
300
Time @ 65C/87%/100V (hours)
700
Dk
0.90 mm
0.40 mm
3.3 mm
16
-3.0
900
MOISTURE
ABSORPTION
UL
CTI
Tg
Td
T-260
T-288
10GHz
LB/IN
%
RTI oC
UL
CLASS
°C
°C
min
min
2GHz
10GHz
2GHz
0.016
8.2
<0.25
150
3
180
340
≥60
≥30
4.04
3.92
0.021
ATTRIBUTES
19
40
60
80
TYPICAL PEEL
STRENGTH (HTE)
MOISTURE
ABSORPTION
UL
CTI
10GHz
LB/IN
%
RTI oC
UL
CLASS
0.025
7.00
<0.15
130
3
Df
MARKETS
18
20
Frequency [GHz}
TYPICAL PEEL
STRENGTH (HTE)
Df
0
ATTRIBUTES
isola-group.com
Tg: 200°C
Td: 360°C
Dk: 3.07
Df: 0.0018
RF/MICROWAVE
Dk: 3.00
Df: 0.0017
Tg: 215°C Dk: 3.38/3.45/3.60/3.75
Td: 360°C Df: 0.0028 - 0.0035
HIGH SPEED
DIGITAL
Extremely Low Loss
Laminate and Prepreg
TACHYON® 100G
Very Low Loss
Laminate and Prepreg
I-TERA® MT40
Very Low Loss
Laminate and Prepreg
Dk: 3.10
Df: 0.0015
TERRAGREEN® 400G
THERMAL
RELIABILITY
Extremely Low Loss
Laminate and Prepreg
Extremely Low Loss
Laminate and Prepreg
Tg: 195°C
Td: 385°C
Tg: 200°C
Td: 380°C
Dk: 3.02
Df: 0.0021
TERRAGREEN® 400GE
IS580G
Tg: 200°C
Td: 380°C
Dk: 3.10
Df: 0.0018
SPECIALTY
PRODUCTS
Dk: 3.29
Df: 0.0026
Tg: 200°C
Td: 380°C
Tg: 170°C
Td: 300°C
P95/P25
Polyimide UL HB
Laminate and Prepreg
Tg: 260°C
Td: 416°C
Dk: 3.67
Df: 0.018
≥60
≥60
FR408HR
190 360
≥60
I-SPEED®
180 360
Tg: 180°C
Td: 340°C
Tg: 200°C
Td: 400°C
THERMAL
RELIABLE
Dk: 4.43
Df: 0.016
130
2
290
2.8
3.38 to 3.38 to 0.0028 to 0.0028 to
3.75
3.75
0.0035
0.0035
5.7
0.10%
130
3
50-70
250-350
2.25-3.15
3.00
3.00
0.0017
0.0017
5.7
0.10%
130
3
>30
55
230
2.8
3.68
3.65
0.0092
0.0095
5.5
0.06%
130
2
≥60
≥60
60
230
2.7
3.64
3.63
0.0059
0.006
5.5
0.06%
130
2
195 385
≥60
≥60
30
190
1.8
3.80
3.80
0.006
0.006
4.3
0.05%
160
2
I-TERA® MT40
215 360
≥60
≥60
55
290
2.8
3.45
3.45
0.0031
0.0031
5.7
0.10%
130
3
TACHYON® 100G
215 360
≥60
≥60
45
250
2.5
3.04
3.02
0.0021
0.0021
5.5
0.10%
130
3
●
TERRAGREEN® 400G
●
200 380
≥60
≥60
37
170
1.8
3.15
3.15
0.0017
0.0017
4.1
0.10%
140
2
TERRAGREEN® 400GE
●
200 380
≥60
≥60
37
170
1.8
3.29
3.29
0.0026
0.0026
4.1
0.10%
140
2
TERRAGREEN® 400G2
●
200 380
≥60
≥60
37
170
1.8
3.10
3.10
0.0015
0.0015
4.1
0.10%
140
2
IS400
150 330
≥60
>10
50
250
3.3
3.90
3.80
0.021
0.026
9.0
0.18%
130
3
185HR
180 340
≥60
>15
40
220
2.7
4.01
3.88
0.020
0.024
4.5
0.15%
130
3
370HR
180 340
≥60
≥30
45
230
2.8
4.04
3.92
0.021
0.025
7.0
0.15%
130
3
IS550H
● 200 400
≥60
≥60
38
210
202
4.50
4.43
0.014
0.016
8.2
0.25%
150
3
P95/P25
260 416
≥60
≥60
55
N/A
1.5
3.76
3.73
0.018
0.021
7.0
0.50%
170
2
P96/P26
260 396
≥60
≥60
55
N/A
1.5
3.76
3.73
0.018
0.021
7.0
0.50%
170
4
370HR
Standard Loss, Thermally Robust
Polyimide UL V-0
Laminate and Prepreg
Tg: 150°C
Td: 330°C
●
●
185HR
●
●
●
●
370HR
●
●
●
●
Tg: 180°C
Td: 340°C
HIGH SPEED
DIGITAL
IS415
●
●
●
●
FR408HR
●
●
●
●
I-SPEED®
●
●
●
●
●
●
TERRAGREEN 400GE
●
TERRAGREEN® 400G
●
TERRAGREEN 400G2
●
®
SPECIALTY
PRODUCTS
20
21
●
I-TERA® MT40
●
TACHYON® 100G
●
I-TERA® MT40 (RF/MW)
●
ASTRA® MT77
●
RF/MICROWAVE
●
I-TERA® MT40
®
Dk: 3.76
Df: 0.017
IS580G®
●
TACHYON® 100G
Dk: 3.90
Df: 0.022
IPC-4103
HIGH SPEED DIGITAL
IS580G
Dk: 4.04
Df: 0.021
/140
●
/134
●
/129
/126
/102
ACCORDING TO
IS550H
Dk: 4.01
Df: 0.020
Dk: 3.76
Df: 0.017
P96/26
Tg: 260°C
Td: 396°C
UL CLASS
200 360
0.10%
/101
Standard Loss, Thermally Robust
Epoxy Laminate and Prepreg
Lead Free, Mid Tg Epoxy
Laminate and Prepreg
Tg: 250°C
Td: 383°C
ASTRA® MT77
3.5
/99
185HR
IS400
Polyimide UL HB No Flow
Prepreg
55
0.0018
IS400
Epoxy Laminate and Prepreg
P25N
≥60
0.0018
/98
HIGH TEMPERATURE
Dk: 4.3
Df: 0.025
≥60
3.07
IPC-4101
Low CTE, Very High Thermal
Reliability Laminate and Prepreg
No-Flo® and Lo-Flo®
Specialty Prepreg
215 360
3.07
ACCORDING TO
IS550H
FR406N
I-TERA® MT40 (RF/MW)
3.1
Dk: 3.80
Df: 0.0060
Dk: 3.68
Df: 0.0092
NO FLOW
170
RTI
o
C
/97
Tg: 190°C
Td: 360°C
Tg: 215°C
Td: 360°C
Dk: 3.45
Df: 0.0031
Very Low Loss Material
FR408HR
37
10GHz
o
Pre-Tg Post-Tg 50 to
PPM/
PPM/ 260 oC
o
o
C
C
%
/17
Tg: 215°C
Td: 360°C
Dk: 3.64
Df: 0.0060
Lead Free, Mid Loss
Laminate and Prepreg
≥60
2GHz
C
/41
Tg: 180°C
Td: 360°C
≥60
CTI
10GHz
IS580G
TERRAGREEN 400G2
I-SPEED®
210 400
UL
2GHz
TERRAGREEN® 400G RF/MW
®
Low Loss, Epoxy
Laminate and Prepreg
●
Df
MOISUTRE
ABSORPTION
Very Low Loss Material
min
Dk
TYPICAL PEEL
STRENGTHS
I-TERA MT40 (RF/MW)
min
/40
Isola high-performance laminate products feature proprietary resin formulations that
are engineered to meet your
design specifications and exceed your expectations.
®
Tg: 210°C
Td: 400°C
Z-Axis CTE
C
Extremely Low Loss
Material
ASTRA® MT77
T-260 T-288
o
TERRAGREEN® 400G RF/MW
Ultra Low Loss, RF/MW
Laminate and Prepreg
Td
HALOGEN FREE
MATERIALS
ATTRIBUTES
PCB LAMINATE &
PREPREG
Tg
P95/P25
●
●
P96/P26
●
●
isola-group.com
EXPLORE
MORE
GLOBAL
HYBRID
STACKUPS
NETWORK
Buidling hybrid stackups is easy with
Isola laminate & prepreg materials.
Whether you’re just figuring out what you
need or you’re ready to start building,
we’re here to collaborate and get your
product to market fast.
High Speed Digital + RF/ Microwave
parts of I-Tera® MT40
CONTACT US
North American Global Headquarters
6565 West Frye Road
Chandler, AZ 85226
480-893-6527
amer.customer.service@isola-group.com
European Regional Headquarters
OUR REACH
Isolastrasse 2
D-52353 Düren, Germany
49-2421-8080
emea.customer.service@isola-group.com
Tachyon® 100G + I-Tera® MT40
Asia Pacific Regional Headquarters
Mix Astra® MT77, I-Tera® MT40,
Tachyon® 100G, materials with
370HR
12/F, Kin Sang Commercial Centre,
49 King Yip Street, Kwun Tong,
Kowloon, Hong Kong
852-2418-1318
apac.customer.service@isola-group.com
22
23
isola-group.com
PRODUCT GUIDE
2024
isola-group.com
Isola, the Isola logo, Astra®, I-Speed®,
I-Tera®, Tachyon®, TerraGreen®, and
The Base for Innovation are registered
trademarks or trademarks of ISOLA
USA Corp. in the United States and in
other countries. Copyright © 2023
Isola Group. All rights reserved.
Revisions:
A: Initial release - 1/23
B: NEW Products - TerraGreen®
400G2, TerraGreen® 400GE,
IS580G - 1/24
24