5G RAN3.0 mmWave Beam Management HUAWEI TECHNOLOGIES CO., LTD. Change History Version Description Date Owner 0.1 Draft July 15, 2019 Wang Dingwei HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 2 Contents • 1. Feature Information • 2. Solution Introduction • 3. Impact Analysis • 4. Usage Instructions • 5. Verification HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 3 1. Feature Information Feature Name Version Basic Beam Management 5G RAN3.0 mmWave basic beam management mmWave 3D Coverage Pattern 5G RAN3.0 mmWave 3D coverage pattern HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Supported Function Page 4 2. Solution Introduction mmWave beam management mainly manages analog beams. The 4TRx module (AAU5213) provides a maximum of two analog beams at a time. 12 H x 8 V 12 H x 8 V 12 H x 8 V 12 H x 8 V mmWave uses the hybrid beamforming (HBF) architecture and weights both the analog domain and digital domain. Digital domain weighting applies only to the PDSCH/PUSCH. Only analog domain weighting can be used for other channels. HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR AAU5213: 768 arrays AAU5222: 384 arrays Page 5 2. Solution Introduction 2.1.1 Cell-level Beam SSB/PRACH beams 2.1.2 UE-level Beams CSI-RS beams 2.1 Basic Beam Management mmWave beam management 2.2 3D Coverage Pattern HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Cell-level beams (SSB/PRACH) Page 6 2.1 Basic Beam Management (HAAU5213) SSB Symbol CSI beam (from the UE perspective): Narrow beam SSB beam (from the UE perspective): Wide beam Top –20 –20 –15 –15 –10 –10 –5 Left Right –5 0 0 15 0 5 5 10 10 15 15 20 20 12 31 47 63 79 Bottom Beam Envelope H-HPBW Beam Envelope V-HPBW Beam Number SSB xx° xx° 16*1 CSI-RS xx° xx° 16 x 4 = 64 HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 7 2.1 Basic Beam Management (HAAU5222) SSB Symbol SSB beam (from the UE perspective): Wide beam CSI Beam (from the UE perspective): Narrow beam 0 0 11 1 24 11 23 35 36 47 12 Beam Envelope H-HPBW Beam Envelope V-HPBW Beam Number SSB xx° xx° 12 x 1 CSI-RS xx° xx° 12 x 4 = 48 HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 8 2.1.1 Cell-level Beam Selection – SSB #0 #1 #2 . . . #N-3 #N-2 #N-1 Time The SSB period is 20 ms, and the message is sent within 5 ms (40 slots). Each downlink slot has two SSBs, that is, two SSB beams. By default, 16 SSB beams are configured in a high frequency band. The 4TRx module uses the 4TRx joint transmission mode, and the 2TRx module uses the 2TRx transmission mode. Different SSB beams are sent at different moments and jointly cover a cell in a high frequency band. The UE scans and measures the SSB beams to obtain the best beams and then completes synchronization and system information reception. HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 9 2.1.1 Cell-level Beam Selection – PRACH There is a mapping between PRACH beam and SSB index. Once determining the best SSB index, the UE determines the PRACH transmission position and the receive beam on the gNodeB side accordingly. SSB index #m PRACH RO #n Example of the association between SSB index and PRACH (PRACH 60 KHz): S: SSB; R: PRACH 1 1 1 1 1 1 1 1 1 1 2 2 0 1 2 3 4 5 6 7 8 9 0 1 2 3 4 5 6 7 8 9 0 1 1 1 1 2 2 2 0 2 8 0 6 8 1 1 1 2 2 2 SSB index 2, 4, 3 5 1 3 9 1 7 9 Slot HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR ... ... (Depending on the UE implementation) 4 4 4 4 5 5 5 5 5 5 5 5 5 5 6 6 6 6 6 6 6 6 6 6 7 7 7 7 7 7 7 7 7 7 6 7 8 9 0 1 2 3 4 5 6 7 8 9 0 1 2 3 4 5 6 7 8 9 0 1 2 3 4 5 6 7 8 9 R R Page 10 R R 2.1.2 UE-level Beam Management P1 procedure: gNodeB/UE rough sweeping P2 procedure: gNodeB precise sweeping SSB beam sweeping; The gNodeB and the UE determine their wide beams separately. CSI-RS beam sweeping periodically; The gNodeB determines the beams for downlink services. (Optional) P3 procedure: UE precise sweeping The gNodeB sends CSI-RS repeatedly, and the UE determines its own narrow beam. Not supported by base stations for the moment HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 11 2.1.2 UE-level Beam – CSI-RS • CSI-RS beams are configured in the last two symbols of downlink slots. • Four Beams are sent in each slot. TX0/1 +45° TX2/3 –45° 64 CSI-RS beams in total; sending period: 20 ms. The UE reports one to four best CSI-RS beams. TTI 0 1 2 3 4 5 6 7 8 9 150 151 152 153 154 155 156 157 158 159 Slot D D D S U D D D S U D D D S U D D D S U CSI-RS ... 160 slots available in 20 ms; CSI-RS beams are configured in the following 16 slots: 0/10/20/30/40/50/60/70/80/90/100/110/120/130/140/150 TX1/3 Beam B TX1/3 Beam D The UE reports the best CSI-RS beam selection result through CSI-Report. The best CSI-RS beams are used for PDCCH/PDSCH/CSIRS for 3I transmission and PUSCH/PUCCH/SRS reception TX0/2 Beam A HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR TX0/2 Beam C on the base station side. Page 12 2.1.2 Periodic UE-level Beam Management to Ensure that Each UE Always Uses the Best Beams for Data Transmission CSI Beam Scanning SSB Beam CSI Serving Beam CSI Serving Beam BS Data transfer Reported 4 best CSI beams @PUCCH Service beam indicator @MAC CE ... Effective cycle Reported 4 best CSI beams @PUCCH Service beam indicator @MAC CE UE • • Before the best CSI-RS beams are determined, PRACH beams are used for data transmission. The best CSI-RS beam selection for each UE is periodically performed in the background to ensure that the UE always uses the best beams. HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 13 Summary: mmWave Beam Management Scope Beam Classification Number of Beams Scanning/Measurement Mode Beam Reporting and Maintenance SSB beam 16 SSB beam sweeping Initial access phase: SSB beams are sent jointly in 4TRx mode. PRACH receive beam The beams have one-to-one mapping with SSB beams and are received by the gNodeB at fixed time-frequency locations. • Msg2 to Msg 5 Before the best beams are reported in CSI-RS beam sweeping: • PDCCH/PDSCH/CSI-RS for 3I • PUCCH/PUSCH CSI-RS beam sweeping Periodic beam sweeping: The period is controlled by a reserved parameter. The default value is 20 ms. After receiving 64 beams, the UE selects and reports one to four best beams. PDSCH, PDCCH, CSI-RS, SRS, PUSCH, PUCCH Celllevel PRACH beam UElevel CSI-RS beam 16 64 HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 14 Application Scope • • SSB Common PDCCH and PDSCH (RMSI/OSI) 2.2 mmWave 3D Coverage Pattern Multiple SSB beam modes can be configured for high frequency bands. The configuration can be modified to meet differentiated capacity or coverage requirements in different scenarios, maximizing the value of sites in high frequency bands. Coverage Case Characteristic Deployment Scenario Both capacity and coverage are important and a trade-off is required. Common hotspot coverage scenario, such as in pedestrian streets and commercial areas Case 2: capacity scenario In target areas, UEs are concentrated, requiring high capacity; however, the coverage distance is relatively short, having low requirements on coverage. Stadiums, squares in front of business centers, etc. Case 3: coverage Scenario Large capacity-oriented hotspot areas that require wide coverage Parking apron or parking lot Case 1: default scenario Constraints: The values of SSB pattern and tilt for all DU cells in a high-frequency sector must be the same. HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 15 2.2 mmWave 3D Coverage Pattern – SSB Beam (HAAU5213) Capacity scenario 0 1 2 3 4 5 Coverage scenario 6 7 SSB Beam Envelope H-HPBW Beam Envelope V-HPBW Beam Number Capacity scenario Xx Xx 8x1 Coverage scenario xx xx 16 x 2 + 4 + 6 = 42 HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 16 2.2 mmWave 3D Coverage Pattern – SSB Beam (HAAU5222) Capacity scenario Coverage scenario 0 6 5 0 5 41 SSB Beam Envelope (H-HPBW) Beam Envelope (V-HPBW) Beam Number Capacity scenario Xx Xx 6x1 Coverage scenario xx xx 12 x 3 + 6 = 42 HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 17 3. Impact Analysis Positive Impact Negative Impact • Basic beam management is a basic function. • Changing the beam pattern will cause cell reestablishment and service interruption. • mmWave 3D coverage pattern can flexibly adapt to operators' deployment scenarios and meet differentiated capacity or coverage requirements of operators through configuration, simplifying network optimization. HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 18 4. Usage Instructions (1) Restriction and Dependency Hardware/NEs/Transmission None Other Features None License Feature ID Feature Name FOFD-030201 mmWave 3D Coverage Pattern HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Model Page 19 NE Sales Unit gNodeB Per Cell 4. Usage Instructions (1) Recommended Scenario Basic beam management is a basic function and needs to be configured during network deployment. It is enabled by default. mmWave 3D coverage pattern is selected as required for sites deployed in high frequency bands. Feature Activation Enabling the capacity scenario for mmWave 3D coverage pattern (using a single sector with four DU cells as an example) DEA NRCELL: NrCellId=0; DEA NRCELL: NrCellId=1; DEA NRCELL: NrCellId=2; DEA NRCELL: NrCellId=3; MOD NRDUCELLTRPMMWAVBEAM: NrDuCellTrpId=0, CoverageScenario=SCENARIO_101; MOD NRDUCELLTRPMMWAVBEAM: NrDuCellTrpId=1, CoverageScenario=SCENARIO_101; MOD NRDUCELLTRPMMWAVBEAM: NrDuCellTrpId=2, CoverageScenario=SCENARIO_101; MOD NRDUCELLTRPMMWAVBEAM: NrDuCellTrpId=3, CoverageScenario=SCENARIO_101; ACT NRCELL: NrCellId=0; ACT NRCELL: NrCellId=1; ACT NRCELL: NrCellId=2; ACT NRCELL: NrCellId=3; HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 20 4. Usage Instructions (2) Feature Activation Enabling the coverage scenario for mmWave 3D coverage pattern (using a single sector with four DU cells as an example) DEA NRCELL: NrCellId=0; DEA NRCELL: NrCellId=1; DEA NRCELL: NrCellId=2; DEA NRCELL: NrCellId=3; MOD NRDUCELLTRPMMWAVBEAM: NrDuCellTrpId=0, CoverageScenario=SCENARIO_102; MOD NRDUCELLTRPMMWAVBEAM: NrDuCellTrpId=1, CoverageScenario=SCENARIO_102; MOD NRDUCELLTRPMMWAVBEAM: NrDuCellTrpId=2, CoverageScenario=SCENARIO_102; MOD NRDUCELLTRPMMWAVBEAM: NrDuCellTrpId=3, CoverageScenario=SCENARIO_102; ACT NRCELL: NrCellId=0; ACT NRCELL: NrCellId=1; ACT NRCELL: NrCellId=2; ACT NRCELL: NrCellId=3; HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 21 4. Usage Instructions (3) Feature Deactivation Disabling mmWave 3D coverage pattern (using a single sector with four DU cells as an example) DEA NRCELL: NrCellId=0; DEA NRCELL: NrCellId=1; DEA NRCELL: NrCellId=2; DEA NRCELL: NrCellId=3; MOD NRDUCELLTRPMMWAVBEAM: NrDuCellTrpId=0, CoverageScenario=DEFAULT; MOD NRDUCELLTRPMMWAVBEAM: NrDuCellTrpId=1, CoverageScenario=DEFAULT; MOD NRDUCELLTRPMMWAVBEAM: NrDuCellTrpId=2, CoverageScenario=DEFAULT; MOD NRDUCELLTRPMMWAVBEAM: NrDuCellTrpId=3, CoverageScenario=DEFAULT; ACT NRCELL: NrCellId=0; ACT NRCELL: NrCellId=1; ACT NRCELL: NrCellId=2; ACT NRCELL: NrCellId=3; HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 22 5. Activation Verification (1) Activation Verification When the capacity scenario is selected, the value of N.DL.PDSCH.Tti.Num increases. When the coverage scenario is selected, the value of N.DL.PDSCH.Tti.Num decreases. Counter Counter Name Counter ID Description N.DL.PDSCH.Tti.Num 1911820492 Total number of downlink PDSCH TTIs N.PRB.DL.Avail.Avg 1911816679 Average number of available downlink PRBs HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 23 5. Activation Verification (2) Cell-level external CHR: The number of UEs using CSI-RS beams and traffic in the uplink and downlink are measured. External CHR Event Name Event & Parameter Description PERIOD_PRIVATE_BEAM_TRAFFIC CELL Downlink traffic volume at the MAC layer, including the traffic volume of initial transmissions and retransmissions, is measured by cell-level beam. The value for unused beams is invalid. PERIOD_PRIVATE_BEAM_SYN_UE_NUM The number of synchronized UEs using static beams are measured. Each UE is counted only in its best beams. Performance monitoring: ID and RSRP of the best CSI-RS beams for each TRX in high frequency bands Performance Monitoring Item (U2020) Feature Name Description TRX0DlOptBeamID TRX0_DlOptBeamID ID of the best downlink beam at the detection reporting time TRX0DlOptBeamRsrp TRX0_DlOptBeamRsrp RSRP of the best downlink beam at the detection reporting time TRX0UlOptBeamID TRX0_UlOptBeamID ID of the best downlink beam at the detection reporting time TRX0UlOptBeamRsrp TRX0_UlOptBeamRsrp RSRP of the best downlink beam at the detection reporting time HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 24 Thank you www.huawei.com Copyright © 2019 Huawei Technologies Co., Ltd. All Rights Reserved.