Finite Element Modelling and Analysis on Heat
Transfer From Finned Surface Of Electronic Chip
By: Krish Verma
B-Tech MEC
210390
 Introduction:
Fins are extended surfaces that are added to a base surface to increase
its heat transfer rate. They are commonly used in engineering
applications where heat needs to be dissipated from a surface, such as in
electronic devices or engines.
Various types of fins include: Circular Pin Fins ,Wavy Fins, Plain
Rectangular Fins, Rectangular Pin Fins
 Literature Survey:
The literature survey reflects the interdisciplinary nature of fin research,
incorporating principles from fluid dynamics, thermodynamics, materials
science, and bioengineering. Ongoing studies continue to push the
boundaries of fin design and application, contributing to advancements
in heat transfer technologies across various industries.
The importance of fins lies in their ability to address thermal challenges,
enhance aerodynamic performance, and provide structural support in
diverse engineering applications. Their role in heat dissipation is
particularly critical in maintaining the reliability and efficiency of
electronic devices, machinery, and systems across various industries.
 Problem Statement:
• The project lies in accurately simulating the behaviour of rectangular
finned surface of electronic chip subjected to varying parameters.
• The purpose of this project is to analyse the heat transfer characteristics
of a rectangular finned surface of electronic chip.
•
Specifically, we will be focusing on the design and analysis of the
rectangular surface, as well as discussing the results of our experiments
and simulations.
 Simulation Details:
• Plain Rectangular Fins are used for the 3D Model with each fin of length
80mm,width 200mm and thickness 20mm.
• Transient Flow CFD is used to showcase various parameters on the fins
• Parameters are: number of fins
•
material composition
•
convection coefficient
• Boundary Conditions used: Domain Created , Heat Supplied is 80W
• Ambient Temperature : 25 *C
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Parameters:
Material Used: Stainless Steel
Number of Fins: 6
Transient Flow CFD used
Fluid Used : Air
Ambient Temperature : 25* C
Surface Temperature (max): 81.36 *C
Fluid Temperature (max): 81.22 *C
Surface Plot:
Flow Trajectories:
• Material Used: Aluminium
• Number of Fins :7
• Fluid Used : Air
• Ambient Temperature : 25* C
Surface Temperature (max): 92.28*C
Surface Plots:
Goal Plots:
 Convection Coefficient (h):
 Case 1: Heat supplied : 80 w
h: 20 w/m^2K
It means the fan above Fins is moving at slow speed.
 Case 2: Heat supplied : 80 w
h: 60 w/m^2K
It means the fan above Fins is moving at medium speed.
 Case 3: Heat supplied : 80 w
h: 80 w/m^2K
It means the fan above Fins is moving at high speed.
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Calculations:
 Experimental Results:
This Finite Element Analysis and Modelling is performed in
reference to the pin fin in forced convection experiment in the
Heat transfer Lab.
 Conclusion:
1. So from this we concluded that aluminium fins have higher
efficiency and effectiveness that stainless steel as aluminium
has higher thermal conductivity than that of stainless steel.
2. The convective heat transfer coefficient (h) is a measure of how
effectively a fluid can dissipate heat from a surface. A higher
convective heat transfer coefficient indicates more efficient
heat dissipation, and, consequently, faster heat transfer
between the surface and the fluid.
 References:
1. Yunus A. Cengel (2007), Heat and Mass Transfer, Tata McGrawHill
2. T G Sakthivel, K MAbishek, R Aravindan Yadav, R Arivazhagan, K
Balaji, Design and Analysis Radiator Fins (April, 2021)
3. DK Dixit (2016), Heat and Mass Transfer, Tata McGraw Hill
Publishing Company Limited. ISBN: 978-1-259-06264-3.2. P. K.
Nag (2011),
4. Heat and Mass Transfer, Tata McGraw Hill Publishing Company
Limited. ISBN: 978-0-07-070253-0.