pubs.acs.org/acsaelm Letter Rail-to-Rail MoS2 Inverters Jinpeng Tian, Yalin Peng, Qinqin Wang, Yanbang Chu, Zhiheng Huang, Na Li, Xiuzhen Li, Jian Tang, Biying Huang, Rong Yang, Luojun Du, Wei Yang, Dongxia Shi, and Guangyu Zhang* Cite This: ACS Appl. Electron. Mater. 2022, 4, 2636−2640 Downloaded via NATL TAIWAN UNIV on October 3, 2023 at 02:35:25 (UTC). See https://pubs.acs.org/sharingguidelines for options on how to legitimately share published articles. ACCESS Metrics & More Read Online Article Recommendations sı Supporting Information * ABSTRACT: Two-dimensional semiconductors are considered as promising candidates for future electronic circuits thanks to the atomic thickness and no dangling bond surface. Additionally, as one of the most fundamental logic gates, high-performance inverters are crucial for integrated circuits. Here we design railto-rail MoS2 inverters by using bilayer MoS2 and MoO3 doped monolayer MoS2 transistors as load and driver transistors, respectively. The inverters exhibit a good rail-to-rail operation with a switching threshold voltage VM ≈ 2 V at VDD = 4 V, a high peak gain of 344 V/V, and a large noise margin NM ≈ 0.98 × (VDD/2). KEYWORDS: 2D semiconductor, MoS2, inverter, rail-to-rail operation, ring oscillator T W ratios increase the area per device, which is an important indicator of devices scaling down. Here, we propose a strategy to construct rail-to-rail NMOS MoS2 inverters, without introducing any additional materials to increase the fabrication complexity. We use a bilayer MoS2 and a MoO3 doped monolayer MoS2 transistors as the load and the driver transistors of the inverters, respectively. The bilayermonolayer inverters (BM-inverters) exhibit a rail-to-rail operation with a switching threshold voltage VM ≈ 2 V at VDD = 4 V, a high peak gain of 344 V/V, and a large noise margin NM ≈ 0.98 × (VDD/2), which are the best among the reported MoS2 inverters.8,9,13−21,23−26 Besides, this method is also scalable and can be applied to other TMD semiconductors. Experimentally, we first fabricated the Ti/Au/Ti back gate and the 10 nm HfO2 dielectric layer on the sapphire substrate (see Figure S1). Second, a high-quality monolayer MoS213 was transferred to the dielectric layer by a wet transfer process. Then, reactive ion etching (RIE) was performed to selectively oxidize the first layer MoS2 of the driver transistor part with oxygen plasma at 15 °C for 8 s, leading to a formation of the MoO3 layer. The AFM data (Figure S2) show the before and after comparison of oxygen plasma etched MoS2, the height of MoS2 area increases to ∼1.2 nm from the monolayer MoS2 ∼ wo-dimensional (2D) semiconductors, such as transition metal dichalcogenides (TMD)1 and black phosphorus,2 have attracted tremendous interest from the academy and industry. Because the atomically thin channels could facilitate continued transistor scaling down, 2D materials are considered as the promising candidates for future generations of electronic circuits.3−5 In addition, 2D materials are good candidates for flexible electronics thanks to their high mechanical flexibility and stability, excellent optical transparency and optoelectronic properties, which could also be compatible with the standard semiconductor technology.4,6−10 The inverter, a circuit that outputs a opposite logic-level (logic “0” of low voltage and logic “1” of high voltage) corresponding to its input, is the most fundamental logic gate that performs a Boolean operation on a single-input variable.11 To realize a 2D reliable and high density constructing cascaded integrated circuit, it is necessary to fabricate a inverter with railmin max max min min to-rail output swing (Vmin in = Vout , Vin = Vout , where Vin , Vout , max , V are the minimum and maximum of input and output Vmax in out voltages), high noise margin, narrow transition zone with minimal number and area of transistors, and one power supply. There are generally three reported approaches to realize the MoS2 inverters, including MoS2 NMOS inverters with two identical transistors,8,9,12−17 or unidentical transistor channel L/W (L and W are the channel length and width) ratios,18,19 and CMOS inverters with a MoS2 transistor and its p-type counterpart.20−23 However, it is hard to realize rail-to-rail operation by using only two identical n-type MoS 2 transistors,18 while the usage of a p-type semiconductor will introduce fabrication difficulties and compatibility problems. Moreover, the approaches of unidentical transistor channel L/ © 2022 American Chemical Society Received: April 5, 2022 Accepted: May 20, 2022 Published: May 24, 2022 2636 https://doi.org/10.1021/acsaelm.2c00444 ACS Appl. Electron. Mater. 2022, 4, 2636−2640 ACS Applied Electronic Materials pubs.acs.org/acsaelm Letter Figure 1. Bilayer-monolayer rail-to-rail inverters. (a) The schematic of BM-inverters. The load is the depletion mode transistor, and the driver transistor is the enhancement mode transistor. (b) The device diagram of BM-inverters. The load and driver transistors are bilayer and MoO3 doped monolayer MoS2 transistors. (c) The IDS−VGS characteristics of doped monolayer and bilayer MoS2 transistors compared with the prime monolayer MoS2 transistor. Figure 2. Characteristics of BM-inverters. (a) The load-line plot of the BM-inverter. (b) The voltage transfer curve (VTC) of BM-inverter. The VDD is 4 V, and VM ≈ 2 V = VDD/2. The gray dash area is the noise margin area. (c) The gain versus input voltage Vin of the BM-inverter at VDD = 4 V, and the peak gain is 344 V/V at VM. The inset is the optical image of the BM-inverter. monolayer MoS2 transistors show distinct subthreshold voltage Vth of 1.5 and 0.2 V, respectively, which provides a basis of railto-rail operation. When VGS = 0 V, as shown in the Figure 1c, the bilayer MoS2 transistor enters the subthreshold region, yet the doped monolayer MoS2 transistor is still at OFF state. As such, in the BM-inverters, the output voltage Vout = VDD × Rdriver/(Rdriver + Rload) ≈ VDD (Rdriver and Rload are the resistance of driver and load transistor, respectively) at the input voltage of Vin = 0 V. As the Vin increases to a value between 1 and 1.5 V, the driver transistor enters the subthreshold area, but Rdriver is still much larger than Rload, thus the Vout ≈ VDD is still maintained. When Vin > 1.5 V, Rdriver is comparable to Rload, and the Vout begins to decrease. Since the load transistor rapidly enters the saturated regime (VDS > VGS − Vth), Rload starts to increase (almost linearly with (VDD − Vout)) while Rdriver decreases, leading to a fast switching of output voltage. When Rload = Rdriver, one could obtain Vout = VDD/2. Upon further increasing Vin, with Rload ≫ Rdriver, the Vout is almost equal to the ground (i.e., 0 V), finishing the rail-to-rail operation. Figure 2a shows the load-line plot of the BM-inverter, the load transistor saturates quickly with source to drain voltage increases, which ensures fast switching of the inverter and high noise margin. Additionally, the current of the driver at about Vin = 2 V is very close to that of the load, which means the switching point of the BM-inverter is at Vin ≈ 2 V. Figure 2b shows the voltage transfer curve (VTC) of the BM-inverter. At 0 V < Vin < 2 V, Vout ≈ VDD = 4 V and the inverter switches quickly at Vin ≈ VDD/2 = 2 V, leading to Vout ≈ 0 at 2 V < Vin < 4 V, exhibiting a good rail-to-rail operation with switching 0.7 nm after oxidation treatment. The XPS spectra in Figure S3 shows the MoS2 was entirely oxidized after RIE treatment. Next, a second layer MoS2 was transferred to the first layer by wet transfer, and thus, bilayer and hole doped monolayer regimes were defined. Finally, Bi/Au was evaporated as a contact electrode. Figure 1a shows the schematics of the BM-inverters. The load is a depletion mode transistor, and the driver transistor is an enhancement mode transistor. In this circuit, the source and the gate of load transistor are connected (i.e., VGS = 0 V). Therefore, the IDS of load transistor will saturate quickly as the source to drain voltage VDS increases (saturate condition VDS>VGS-Vth), and this ensures the inverters have a fast switching speed and a large noise margin.18 In the BMinverters, a bilayer MoS2 transistor serves as depletion mode load transistor, and a slightly hole doped monolayer MoS2 serves as the enhancement mode driver transistor, as shown in Figure 1b. While the bilayer MoS2 has a more negative threshold voltage compared with prime monolayer MoS2 (Figure 1c), the positive threshold voltage of MoO3 doped monolayer MoS2 is achieved by O2 plasma treatment.27−29 The channel width and length of the load and driver transistors are 20 and 10 μm, respectively, and the capacitance of 10 nm HfO2 is ∼1.2 μF cm−2 (Figure S4). The doped monolayer and bilayer MoS2 transistors exhibit a good switching performance with ON/OFF ratio over 107 and subthreshold swing (SS) of 94 and 104 mV/dec, respectively. The highest carrier density of the doped monolayer and bilayer MoS2 transistors is ∼1.6 × 1013 cm−2 and ∼2.4 × 1013 cm−2 at VGS = 4 V respectively. Importantly, bilayer and doped 2637 https://doi.org/10.1021/acsaelm.2c00444 ACS Appl. Electron. Mater. 2022, 4, 2636−2640 ACS Applied Electronic Materials pubs.acs.org/acsaelm Letter Figure 3. Logic gates based on BM-inverters. (a−c) The output characteristics of AND, NOR, and NAND logic gates with input signal level (0,0), (1,0), (0,1), (1,1). The logic “0” and “1” state represent 0 and 4 V voltage, and VDD = 4 V. The insets are optical images of corresponding logic gates. Figure 4. 3-stage ring oscillators. (a) Optical image and schematic of 3-stage ring oscillators. The 3-stage ring oscillators are made of BM-inverters. The dielectric layer is 20 nm Al2O3. (b) The output characteristics of the 3-stage ring oscillator. The oscillation frequency f is 32.5 kHz at VDD = 10 V. (c) Voltage dependence of the oscillation frequency measured from the 3-stage ring oscillator. threshold VM ≈ 2 V = VDD/2. Furthermore, the noise margin of low and high signal level is NML = NMH ≈ 0.98 × (VDD/2) (dashed boxes in Figure 2b), the high peak gain is 344 V/V at VM (Figure 2c), which are the best among the reported MoS2 inverters8,9,13−21,23−26 and necessary for constructing cascaded integrated circuits. Moreover, the hysteresis of the transform curve of the driver transistor could affect the performance of the inverters. Because of the quality of HfO2 layer, the driver transistor exhibits a ∼150 mV hysteresis and induced a ∼110 mV hysteresis in the VTC of inverter (Figure S6). Further improving the quality of dielectric layer could eliminate the hysteresis of inverters. Notably, this BM-inverter has a low direct current (DC) power dissipation of ∼5.5 nW (Figure S7), which is important for low-power dissipation and flexible circuits. We also demonstrate other logic circuits based on BMinverters. The output performance of the logic devices AND, NOR, and NAND are shown in Figure 3a−c. The schematics of the electronic circuit for the AND, NOR, and NAND logic gates are shown in Figure S8. Each of the logic gates exhibits excellent output stability with input signals (0,0), (1,0), (0,1), and (1,1). All the logic states “0” and “1” are corresponding to the voltage 0 and 4 V, respectively, with supply voltage VDD = 4 V. Notably, all the circuits exhibit rail-to-rail outputs with near perfect high and low logic levels, which are attributed to the high noise margin of BM-inverters. The dynamic characteristics and uniformity of the BMinverters can be demonstrated in the performance of the ring oscillator. We fabricated 3-stage ring oscillators based on BMinverters, as shown in Figure 4a. Additionally, to enhance the oscillation frequency, we used a 20 nm Al2O3 as the dielectric layer. Figure 4b shows the output voltage of the 3-stage ring oscillator with stable oscillation frequency 32.5 kHz at a VDD = 10 V. This result demonstrates the good uniformity characteristic of the present BM-inverters. The delay time of each inverter is around 5 μs, estimated by 1/2Nf, where N and f are the number of stages and the oscillation frequency, respectively. The output oscillation frequency can be adjusted by varying the VDD. As Figure 4c shows, the ring oscillator begins to oscillate at VDD ≈ 5 V with a frequency of 16.7 kHz and can reach an oscillation frequency of 50 kHz at VDD = 12 V. Note that the oscillation frequency could be further increased by decreasing the parasitic capacitance or the device size. In summary, we demonstrate a strategy for rail-to-rail NMOS MoS2 inverters. A bilayer and MoO3 doped monolayer MoS2 transistors were used as load and driver transistors in the inverters. The BM-inverters exhibit a good rail-to-rail operation with a switching threshold of VM ≈ 2 V = VDD/2 at VDD = 4 V, high peak gain of 344 V/V, and a large noise margin NM ≈ 0.98 × (VDD/2). Notably, the AND, NOR, and NAND logic gates circuit exhibit rail-to-rail outputs with nearly perfect high and low logic levels, which are attributed to the high noise margin of rail-to-rail BM-inverters. The 3-stage ring oscillators made of BM-inverters begins to oscillate at VDD ≈ 5 V, and oscillation frequency reaches 50 kHz at a VDD of 12 V. Also, this method could be transferable to other 2D semiconductors for rail-to-rail inverters. 2638 https://doi.org/10.1021/acsaelm.2c00444 ACS Appl. Electron. Mater. 2022, 4, 2636−2640 ACS Applied Electronic Materials ■ pubs.acs.org/acsaelm Jian Tang − Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China; School of Physical Sciences, University of Chinese Academy of Sciences, Beijing 100190, China Biying Huang − Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China; School of Physical Sciences, University of Chinese Academy of Sciences, Beijing 100190, China Rong Yang − Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China; Songshan Lake Materials Laboratory, Dongguan 523808, China; orcid.org/00000001-5936-6849 Luojun Du − Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China; School of Physical Sciences, University of Chinese Academy of Sciences, Beijing 100190, China Wei Yang − Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China; School of Physical Sciences, University of Chinese Academy of Sciences, Beijing 100190, China; Songshan Lake Materials Laboratory, Dongguan 523808, China; orcid.org/0000-0002-3925-0352 Dongxia Shi − Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China; School of Physical Sciences, University of Chinese Academy of Sciences, Beijing 100190, China ASSOCIATED CONTENT sı Supporting Information * The Supporting Information is available free of charge at https://pubs.acs.org/doi/10.1021/acsaelm.2c00444. Details of device fabrication process and measurement; fabrication process of BM-inverters; optical images and AFM images of the original and after oxygen plasma etched MoS2 on the silicon oxide substrate; XPS spectra of Mo 3d core level of pristine monolayer MoS2 and after O2 plasma etched (RIE) monolayer MoS2; capacitance versus bias of 10 nm HfO2; definition of noise margin and VM; hysteresis of driver transistor and BM-inverter; power and the current of BM-inverter; circuit diagrams of the AND, NOR, and NAND logic gates (PDF) ■ Letter AUTHOR INFORMATION Corresponding Author Guangyu Zhang − Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China; School of Physical Sciences, University of Chinese Academy of Sciences, Beijing 100190, China; Songshan Lake Materials Laboratory, Dongguan 523808, China; orcid.org/0000-0002-1833-7598; Email: gyzhang@iphy.ac.cn Authors Jinpeng Tian − Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China; School of Physical Sciences, University of Chinese Academy of Sciences, Beijing 100190, China Yalin Peng − Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China; School of Physical Sciences, University of Chinese Academy of Sciences, Beijing 100190, China Qinqin Wang − Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China; School of Physical Sciences, University of Chinese Academy of Sciences, Beijing 100190, China Yanbang Chu − Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China; School of Physical Sciences, University of Chinese Academy of Sciences, Beijing 100190, China Zhiheng Huang − Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China; School of Physical Sciences, University of Chinese Academy of Sciences, Beijing 100190, China Na Li − Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China; Songshan Lake Materials Laboratory, Dongguan 523808, China Xiuzhen Li − Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China; School of Physical Sciences, University of Chinese Academy of Sciences, Beijing 100190, China Complete contact information is available at: https://pubs.acs.org/10.1021/acsaelm.2c00444 Author Contributions G.Z. supervised the experiments. J.T. fabricated the devices and carried out the electrical measurements with the assistance from Y.P. Q.W. preformed the growth of high quality MoS2 films with large domain sizes. J.T., W.Y., and G.Z. analyzed data and wrote the manuscript. All authors discussed and commented on the manuscript. Notes The authors declare no competing financial interest. ■ ACKNOWLEDGMENTS This work was supported by the Key-Area Research and Development Program of Guangdong Province (grant no. 2020B0101340001), the Strategic Priority Research Program of Chinese Academy of Sciences (CAS, grant no. XDB30000000), the National Science Foundation of China (NSFC, grant nos. 61888102, 11834017, and 61734001). R.Y. acknowledges the financial supports from the NSFC grant nos. 62122084 and 12074412. ■ REFERENCES (1) Radisavljevic, B.; Radenovic, A.; Brivio, J.; Giacometti, V.; Kis, A. Single-layer MoS2 transistors. Nat. Nanotechnol 2011, 6 (3), 147− 150. (2) Li, L.; Yu, Y.; Ye, G. 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