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ELECTRONIC
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SERVICING NC II
Sector
: ELECTRONICS
Qualification Title/ Level
Unit of competency
: ELECTRONICS PRODUCT ASSEMBLY AND
SERVICING NCII
: ASSEMBLE ELECTRONIC PRODUCTS
Module Title
: ASSEMBLING ELECTRONIC PRODUCTS
HOW TO USE THIS COMPETENCY BASED LEARNING MATERIAL
Welcome to the module in “Assembling Electronic Products ”. This module contains training materials and
activities for you to complete.
You are required to go through a series of learning in order to complete each learning outcomes of this module.
In each learning outcomes are Information Sheets, Self Checks, operation sheets and job Sheets. Follow these
activities on your own. If you have questions, please don’t hesitate to ask your trainer for assistance.
The goal of this course is the development of practical skills. To gain these skills, you must learn basic
concepts and terminology. For most part, you’ll get this information from the information sheets and TESDA
website, www.tesda.gov.ph.
This module was prepared to help you achieve the required competency in “Assembling Electronic Products
”This will be the source of information for you to acquire knowledge and skills in this particular competency
independently and at your own pace, with minimum supervision or help from your trainer.
Remember to:
Work through all the information and complete the activities in each section.
Read information sheets and complete the self check. Suggested references are included to supplement the
materials provided in this module.
Most probably your trainer will also be your supervisor or manager. He/She is there to support you and show
you the correct way to do things.
You will be given plenty of opportunity to ask questions and practice on the job. Make sure you practice new
skills during regular working shifts. This way you will improve both your speed and memory and also your
confidence.
Use the Self Checks, Operation Sheets or Job Sheets at the end of each section to test your own progress.
When you feel confident that you have had sufficient practice, ask you trainer to evaluate you. The results of
your assessment will be recorded in your Progress Chart and Accomplishment Chart.
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
September 20, 2016
Developed By:
Document No.
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You need to complete this module before you can perform the next module
Recognition of Prior Learning
If you can demonstrate to your trainer that you are competent in a particular skill, talk to him about
having them formally recognized so you would not have to undergo the same training again. If you have a
qualification or certificate of competency from previous trainings, show it to your trainer. If the skills you have
acquired are still relevant to this module, they may become part of the evidence you can present for RPL. If you
are not sure about the level of your skills, discuss this with your trainer.
ELECTRONICS PRODUCT ASSEMBLY AND SERVICING NCII
COMPETENCY BASED LEARNING MATERIALS
LIST OF COMPETENCIES
No.
Unit of Competency
Assemble Electronic Products
1
Module Title
Assembling Electronic
Products
Code
ELC724335
2
Service consumer electronic
products and systems
Servicing consumer
electronic products and
systems
ELC724336
3
Service industrial electronic
modules, products and systems
Servicing industrial
electronic modules, products
and systems
ELC724337
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
September 20, 2016
Developed By:
Document No.
Issued By:
Page 2 of
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MODULE CONTENT
UNIT OF COMPETENCIES:
ASSEMBLING ELECTRONIC PRODUCTS
MODULE TITLE:
1.
2.
3.
4.
5.
6.
7.
8.
9.
ASSEMBLE ELECTRONIC PRODUCTS
Applied safety rules and procedures
. PCB problems and solutions
. PCB characteristics
. Proper care and use of tools
-Component
- Soldering Technology
- Reflow soldering
- Wave soldering
-Hand soldering
-RoHS and lead-free soldering
-Nonsolder Connections (terminal block
Practicing 3Rs – reduce, re-use, recycle/recover
Managing waste from electrical and electronic equipment (WEEE)
Testing of electronic products
NOMINAL DURATION:
50 hours
LEARNING OUTCOMES:
At the end of this module you MUST be able to:
LO1. Prepare to assemble electronic products
LO2. Prepare/ Make PCB modules
LO3. Mount and solder electronic components
LO4. Perform electronic products assembly
LO5. Test and inspect assembled electronic products
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
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Document No.
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SUMMARY OF ASSESSMENT CRITERIA:
1. Complete check-up of industrial electronic components, products and systems is conducted and defects
are identified, verified and documented against customer description.
2. Repair/maintenance history is verified in line with the company procedures.
3. Service manuals and service information required for repair/maintenance are acquired as per standard
procedure.
4. Workplace is set/prepared for repair job in line with the company requirements.
5. Necessary tools, test instruments and personal protective equipment are prepared in line with job
Requirements
6. Materials necessary to complete the work are obtained in accordance with job requirements.
7. Consumer electronic products and systems are installed in accordance with manufacturer’s instructions,
requirements, and without damage to the surrounding place or environment
8. Devices are tested in accordance with standard procedures.
9. Final inspections are undertaken to ensure that the installed devices conforms to technical requirements.
10. Unplanned events or conditions are responded to in accordance with established procedures
11. Work site is cleaned and cleared of all debris and left safe in accordance with the company requirements
12. Report on installation and testing of equipment is prepared according to company’s procedures/policies.
13. Systematic pre-testing procedure is observed in accordance with manufacturer’s instructions.
14. System defects/Fault symptoms are identified using appropriate tools and equipment and troubleshooting
Techniques and in accordance with safety procedures
15. Test instruments required for the job are used in accordance with user manuals.
16. Circuits are checked and isolated using specified testing procedures
17. Identified defects and faults are explained to the responsible person in accordance with enterprise or
company policy and procedures
19. Control settings/adjustments are checked in conformity with service-manual specifications.
20. Results of diagnosis and testing are documented accurately and completely within the specified time.
21. Customers are advised/informed regarding the status and serviceability of the unit according to
procedures.
22. Personal protective equipment is used in accordance with Occupational Health and Safety practices.
23. Electro-static discharge (ESD) protection procedure is followed in accordance with current industry
standards.
24. Defective parts/components are replaced with identical or recommended appropriate equivalent ratings
25. Repaired or replaced parts/components are soldered/mounted in accordance with the current industry
standards.
26. Control settings/adjustments are performed in conformity with service-manual specifications
27. Repair activity is performed within the required timeframe
28. Care and extreme precaution in handling the unit/product is observed as per procedures
29. Cleaning of unit is performed in accordance with standard procedures
30. Excess components and materials are disposed of based on WEEE directives and 3Rs waste management
Program
31. Repaired units are reassembled according to procedures
32. Reassembled units are subjected to final testing and cleaning in conformity with manufacturer’s
specifications
33. Service completion procedures and documentations are complied with based on manual.
34. Waste materials are disposed of in accordance with environmental requirements.
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
September 20, 2016
Developed By:
Document No.
Issued By:
Page 4 of
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LEARNING OUTCOME SUMMARY
LEARNING OUTCOME 1
PREPARE TO ASSEMBLE ELECTRONIC
PRODUCTS
CONTENTS:

Applied safety rules and procedures
-OH&S policies and procedures
ASSESSMENT CRITERIA:
1.
2.
3.
4.
5.
6.
Assembly workplace is prepared in accordance with OH&S policies and procedures
Established risk control measures for work preparation are followed.
Work instructions are obtained and clarified based on job order or client requirements
Responsible person is consulted for effective and proper work coordination
Required materials, tools and equipment are prepared and checked in accordance with
established procedures
Parts and components needed to complete the work are identified, prepared and obtained
according to requirements
CONDITION:
The students/trainees must be provided with the following:
May include:
Variable power supply
Variable transformer
Soldering iron
Hot air soldering station
Table top reflow oven
Desoldering tools
Screwdriver (assorted)
Wrenches (assorted)
Allen wrench/key
Function/Signal generator
Mufti-testers (analog/digital)
Utility knife/stripper
Pliers (assorted)
ESD-free work bench with mirror
Oscilloscope, digital
High-grade magnifying glass with
lamp
Flashlight/headlamp
Cleaning brush
Soldering wire
SMD soldering paste
Stranded/solid/hook-up wires
Assorted electronic components
Assorted electronic sensors
ASSESSMENT METHOD:



Oral Questioning or Interview
Practical Demonstration
Third-party workplace reports of on-the-job performance by the candidate
LEARNING EXPERIENCES
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
September 20, 2016
Developed By:
Document No.
Issued By:
Page 5 of
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Learning Outcome 1 :
PREPARE TO ASSEMBLE ELECTRONICPRODUCTS
Learning Activities
1. Read Information Sheet 1.1
Applied safety rules and procedures
2. Answer Self Check 1.1
I
Special Instructions
If you have some problems on Information
Sheet 1-1, don’t hesitate to approach your
facilitator. If you feel you are
knowledgeable on the content of
Information Sheet 1-1, you can now
answer Self-Check 1-1.
Compare your answer with the answer key
1-1. If you got 100% correct answer in this
self-check, you can now move to the next
information sheet. If not review the
information sheet and go over the selfcheck again.
INFORMATION SHEET 1.1
APPLIED SAFETY
RULES AND
PROCEDURES
“OH&S POLICIES AND PROCEDURES”
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
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Developed By:
Document No.
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What is occupational health and safety?
1. Occupational health and safety is a discipline with a broad scope involving many specialized
fields. In its broadest sense, it should aim at:
2. The promotion and maintenance of the highest degree of physical, mental and social wellbeing of workers in all occupations;
3. The prevention among workers of adverse effects on health caused by their working
conditions;
4. The protection of workers in their employment from risks resulting from factors adverse to
health;
5. The placing and maintenance of workers in an occupational environment adapted to physical
and mental needs;
6. The adaptation of work to humans.
In other words, occupational health and safety encompasses the social, mental and physical wellbeing of workers, that is the “whole person”.
Successful occupational health and safety practice requires the collaboration and participation of
both employers and workers in health and safety programmes, and involves the consideration of
issues relating to occupational medicine, industrial hygiene, toxicology, education, engineering
safety, ergonomics, psychology, etc.
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
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Developed By:
Document No.
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Occupational health issues are often given less attention than occupational safety issues because
the former are generally more difficult to confront. However, when health is addressed, so is
safety, because a healthy workplace is by definition also a safe workplace. The converse, though,
may not be true - a so-called safe workplace is not necessarily also a healthy workplace. The
important point is that issues of both health and safety must be addressed in every workplace. By
and large, the definition of occupational health and safety given above
encompasses both health and safety in their broadest contexts.
Poor working conditions affect worker health and safety
1. Poor working conditions of any type have the potential to affect a worker's health and safety.
2. Unhealthy or unsafe working conditions are not limited to factories — they can be found
anywhere, whether the workplace is indoors or outdoors. For many workers, such as agricultural
workers or miners, the workplace is “outdoors” and can pose many health and safety hazards.
3. Poor working conditions can also affect the environment workers live in, since the working and
living environments are the same for many workers. This means that occupational hazards can
have harmful effects on workers, their families, and other people in the community, as well as on
the physical environment around the workplace. A classic example is the use of pesticides in
agricultural work. Workers can be exposed to toxic chemicals in a number of ways when spraying
pesticides: they can inhale the chemicals during and after spraying, the chemicals can be
absorbed through the skin, and the workers can ingest the chemicals if they eat, drink, or smoke
without first washing their hands, or if drinking water has become contaminated with the
chemicals.
The workers' families can also be exposed in a number of ways: they can inhale the pesticides
which may linger in the air, they can drink contaminated water, or they can be exposed to residues
which may be on the worker's clothes. Other people in the community can all be exposed in the
same ways as well. When the chemicals get absorbed into the soil or leach into groundwater
supplies, the adverse effects on the natural environment can be permanent.
Overall, efforts in occupational health and safety must aim to prevent industrial accidents and
diseases, and at the same time recognize the connection between worker health and safety, the
workplace, and the environment outside the workplace.
Why is occupational health and safety important?
Work plays a central role in people's lives, since most workers spend at least eight hours a day in
the workplace, whether it is on a plantation, in an office, factory, etc. Therefore, work environments
should be safe and healthy. Yet this is not the case for many workers. Every day workers all over
the world are faced with a multitude of health hazards, such as:
dusts;
gases;
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
September 20, 2016
Developed By:
Document No.
Issued By:
Page 8 of
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noise;
vibration;
extreme temperatures.
Unfortunately some employers assume little responsibility for the protection of workers' health and
safety. In fact, some employers do not even know that they have the moral and often legal
responsibility to protect workers. As a result of the hazards and a lack of attention given to health
and safety, work-related accidents and diseases are common in all parts of the world.
Costs of occupational injury/disease
How much
does an
occupational
disease or
accident cost?
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Work-related accidents or diseases are very costly and can have many serious direct and indirect
effects on the lives of workers and their families. For workers some of the direct costs of an injury
or illness are:
the pain and suffering of the injury or illness;
the loss of income;
the possible loss of a job;
health-care costs.
It has been estimated that the indirect costs of an accident or illness can be four to ten times
greater than the direct costs, or even more. An occupational illness or accident can have so many
indirect costs to workers that it is often difficult to measure them. One of the most obvious indirect
costs is the human suffering caused to workers' families, which cannot be compensated with
money.
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
September 20, 2016
Developed By:
Document No.
Issued By:
Page 9 of
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The costs to employers of occupational accidents or illnesses are also estimated to be enormous.
For a small business, the cost of even one accident can be a financial disaster. For employers,
some of the direct costs are:

payment for work not performed;

medical and compensation payments;

repair or replacement of damaged machinery and equipment;

reduction or a temporary halt in production;

increased training expenses and administration costs;

possible reduction in the quality of work;

negative effect on morale in other workers.

Some of the indirect costs for employers are:

the injured/ill worker has to be replaced;

a new worker has to be trained and given time to adjust;

it takes time before the new worker is producing at the rate of the original worker;
time must be devoted to obligatory investigations, to the writing of reports and filling out of forms;
accidents often arouse the concern of fellow workers and influence labour relations in a negative
way;poor health and safety conditions in the workplace can also result in poor public relations.
Overall, the costs of most work-related accidents or illnesses to workers and their families and to
employers are very high.
On a national scale, the estimated costs of occupational accidents and illnesses can be as high as
three to four per cent of a country's gross national product. In reality, no one really knows the total
costs of work-related accidents or diseases because there are a multitude of indirect costs which
are difficult to measure besides the more obvious direct costs.
Health and safety programmes
For all of the reasons given above, it is crucial that employers, workers and unions are committed
to health and safety and that:
workplace hazards are controlled - at the source whenever possible;
records of any exposure are maintained for many years;
both workers and employers are informed about health and safety risks in the workplace;
there is an active and effective health and safety committee that includes both workers and
management; worker health and safety efforts are ongoing.
Effective workplace health and safety programmes can help to save the lives of workers by
reducing hazards and their consequences. Health and safety programmes also have positive
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
September 20, 2016
Developed By:
Document No.
Issued By:
Page 10 of
92
effects on both worker morale and productivity, which are important benefits. At the same time,
effective programmes can save employers a great deal of money.
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ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
[0#
Date Developed:
September 20, 2016
Developed By:
@
Document No.
Issued By:
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GENERAL SAFETY RULES
By maintaining a safe working practice you will protect not only your own safety but that of others
who will come into contact with your work.

Always ensure grounding straps and leads are intact and securely connected.

Always use the correct fire extinguisher. Water can conduct electric currents, Carbon dioxide
(CO2) and appropriate Halogenated extinguishers should be used and in some cases foam is
appropriate.

Always ensure interlock switches are operating properly

Always ensure your tools and test equipment are kept clean, in good working order and
always use the appropriate tool for the job.

Always discharge capacitors in a circuit. Some capacitors such as those in a power supply will
hold a lethal charge long after the power has been removed.

Always familiarize yourself with the safety precautions associated with any solvents or
chemicals you are about to use. Many give off strong fumes which can ignite or cause
drowsiness.

Always use appropriate tools, equipment and protective clothes, Buy the best you can afford.

Always use the recommended replacement component, many devices have built in safety
measures and narrow tolerance bands.

Always wear protective equipment, protective boots, hard-hats, goggles, overalls etc when
they are needed.

Always remove all rings, bracelets, medallions or anything which could get caught in moving
machinery or may conduct electricity.

Always read the manufacturers data and information sheets. They are an invaluable source of
information and safety procedures for the equipment under test.

Always when working with electricity, keep your left hand in your pocket where possible to
avoid providing an electrical path through your chest and heart.

Do not work when you are tired or taking medicine which makes you drowsy or affects your
reactions and concentration.

Do not work under poor lighting conditions
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
September 20, 2016
Developed By:
Document No.
Issued By:
Page 12 of
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
Do not work in areas which are damp

Never use an extension or adapter to overcome grounding straps or earth leads.

Never work in wet clothing

Never assume a circuit is off. Always check for power with the appropriate instrument.

Never meddle with safety devices

Never override interlock safety switches.

Never remove equipment grounding straps or leads.
Hazard identification, risk assessment and control measures introduction
Hazard identification (HAZID) and risk assessment involves a critical sequence of information
gathering and the application of a decision-making process. These assist in discovering what
could possibly cause a major accident (hazard identification), how likely it is that a major accident
would occur and the potential consequences (risk assessment) and what options there are for
preventing and mitigating a major accident (control measures). These activities should also assist
in improving operations and productivity and reduce the occurrence of incidents and near misses.
There are many different techniques for carrying out hazard identification and risk assessment at
an MHF. The techniques vary in complexity and should match the circumstances of the MHF.
Collaboration between management and staff is fundamental to achieving effective and efficient
hazard identification and risk assessment processes.
Hazard identification
The Regulations require the employer, in consultation with employees, to identify:
all reasonably foreseeable hazards at the MHF that may cause a major accident; and
the kinds of major accidents that may occur at the MHF, the likelihood of a major accident
occurring and the likely consequences of a major accident.
The importance of getting the hazard identification right
Major accidents by their nature are rare events, which may be beyond the experience of many
employers. These accidents tend to be low frequency, high consequence events as illustrated in
Figure 1 below. However, the circumstances or conditions that could lead to a major accident may
already be present, and the risks of such incidents should be proactively identified and managed.
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
September 20, 2016
Developed By:
Document No.
Issued By:
Page 13 of
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Figure 1: HAZID focus on rare events
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is on the high consequence I low frequency incidents
HAZID must address potentially rare events and situations to ensure the full range of major accidents and
their causes. To achieve this, employers should:
identify and challenge assumptions and existing norms of design and operation to test whether they may
contain weaknesses;
think beyond the immediate experience at the specific MHF;
Recognize that existing controls and procedures cannot always be guaranteed to work as expected; and
learn lessons from similar organization and businesses.
Some significant challenges in carrying out an effective HAZID are:
substantial time is needed to identify all hazards and potential major accidents and to understand the
complex circumstances that typify major accidents;
the need for a combination of expertise in HAZID techniques, knowledge of the facility and systematic
tools;
the possibility that a combination of different HAZID techniques may be needed, depending on the nature of
the facility to ensure that the full range of factors (e.g. human and engineering) is properly considered;
obtaining information on HAZID from a range of sources and opinions; and
ensuring objectivity during the HAZID process.
Com care must be satisfied that hazard identification has been comprehensive and the risks are eliminated or
controlled before granting a license or certificate of compliance to operate an MHF.
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
September 20, 2016
Developed By:
Document No.
Issued By:
Page 14 of
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SELF CHECK 1.1
Fill in the Blank Direction:
Choose the correct answer from the choices inside the box.Write your answer in your answer
sheet.
OHS
HAZID
RISK MANAGEMENT
CO2
MHF
COMMON
___________1. Hazard identification (HAZID) and risk assessment involves a critical sequence
of information gathering and the application of a decision-making process
__________ 2.Occupational Health and Safety
___________3.How likely it is that a major accident would occur and the potential
consequences
___________4. Always use the correct fire extinguisher. Water can conduct electric currents,
Carbon dioxide (CO2) and appropriate Halogenated extinguishers should be
used and in some cases foam is appropriate
___________5. Major Hazards Facility
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
September 20, 2016
Developed By:
Document No.
Issued By:
Page 15 of
92
ANSWER KEY TO SELF CHECK 1.1
ANSWER:
1. OHS
2. HAZID
3. RISK MANAGEMENT
4. CO2
5. MHF
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
September 20, 2016
Developed By:
Document No.
Issued By:
Page 16 of
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LEARNING OUTCOME SUMMARY
LEARNING OUTCOME 2
PREPARE/ MAKE PCB MODULES
CONTENTS:


PCB problems and solutions
PCB characteristics
ASSESSMENT CRITERIA:
1. PCB layout is verified for conformity with the schematic diagram in accordance with the
layout rules
2. PCB layout is transferred to copper-cladded board following acceptable methods and
standards
3. Visual inspection is performed based on standards procedures.
4. Thru-hole is drilled based on standards procedures
5. PCB is cleaned based on standards procedures
6. Functionality of PCB is tested and visual inspection is performed based on standards
procedures
CONDITION:
The students/trainees must be provided with the following:
May include:
Variable power supply
Variable transformer
Soldering iron
Hot air soldering station
Table top reflow oven
Desoldering tools
Screwdriver (assorted)
Wrenches (assorted)
Allen wrench/key
Function/Signal generator
Mufti-testers (analog/digital)
Utility knife/stripper
Pliers (assorted)
ASSESSMENT METHOD:
ESD-free work bench with mirror
Oscilloscope, digital
High-grade magnifying glass with lamp
Flashlight/headlamp
Cleaning brush
Soldering wire
SMD soldering paste
Stranded/solid/hook-up wires
Assorted electronic components
Assorted electronic sensors
Oral Questioning or Interview
Practical Demonstration
Third-party workplace reports of on-the-job performance by the candidate
LEARNING EXPERIENCES
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
September 20, 2016
Developed By:
Document No.
Issued By:
Page 17 of
92
Learning Outcome 2 :
PREPARE/ MAKE PCB MODULES
Learning Activities
Read Information Sheet 1.1
Applied safety rules and procedures
2. Answer Self Check 1.1
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
September 20, 2016
Developed By:
Special Instructions
If you have some problems on Information
Sheet 1-1, don’t hesitate to approach your
facilitator. If you feel you are knowledgeable
on the content of Information Sheet 1-1, you
can now answer Self-Check 1-1.
Compare your answer with the answer key 1-1.
If you got 100% correct answer in this selfcheck, you can now move to the next
information sheet. If not review the
information sheet and go over the self-check
again.
Document No.
Issued By:
Page 18 of
92
INFORMATION SHEET 1.2-1
I
PREPARE/ MAKE PCB MODULES
PCB PROBLEMS
AND SOLUTIONS
PCB Assembly problems and its solutions
PCB Assembly problems and its solutions
In PCB Assembly, there is a set of process that is constantly being followed. One process cannot be skipped; one cannot be
switched to be performed over the other. For an SMT component populated PCB, it is always going to be the following processes
(arranged in order):
Solder paste printing
Automatic placement
Reflow
But even if the processes are followed, certain problems arise when a populated PCB is inspected. In here, we are going to tackle
some of the PCB Assembly problems that are commonly encountered and discuss how to solve and prevent from happening
again:
Solder bridging
Solder bridging is a phenomenon where at least two neighboring component pins have short circuited by way of an unnecessary
solder. This phenomenon may be due to the following: excess solder volume, inaccurate placement of the machine, or the plain
mismatch of the PCB footprint. To solve this problem, the engineers or assemblers should do the following: reduce the solder
volume by changing the printing machine settings or go far as changing stencil mask opening.
2. Coplanarity
Coplanarity is a PCB Assembly problem that can be solved easily. This is mainly caused by a physically damaged component. But
the cause of the damage will be difficult to find. It may be due to the damage coming from the component supplier or a damage
induced by the automatic placement machine during the pick and place process. Either way, the focus of the investigation should
only be concentrated on the component itself.
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Document No.
Date Developed:
September 20, 2016
tum .....
Ls.,ii+iii
Developed By:
.,
''
Issued By:
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92
1. De-wetting
De-wetting is a solder anomaly wherein the component pins don’t have enough solder creeping (wetting) around it. It is also a
common PCB Assembly problem. This may be caused by the following: insufficient solder volume or mismatch of PCB footprint
against the component. To solve this problem, the engineer and/or the assembler must do the following: change the solder volume
deposit by changing the solder paste printing machine setting or change the stencil mask opening or change the PCB footprint
itself so it will match with component pins.
If you are in needs of PCB or PCB Assembly Services, feel free to contact me here,we will try our best to help.
Possible Problems and Solutions in the Process of PCB Design
Compared with the development of software system, the hardware design and its optimization of electronics have seen the
practical problems such as long time consumption and high cost. However, in the actual design, engineers tend to pay more
attention to the highly principled issues but what lead to the great influence on the operation of printed circuit boards is just some
detailed errors that we have to correct over and over. It's impossible for the perfect generation of PCBs but gradual optimization
can be obtained. This passage will first list some problems on circuit design, PCB production and maintenance and then provide
some easy to use methods to optimize custom PCB within limited cost.
Withstand Voltage Protection of Multi-Channel Power Rectification LED
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Date Developed:
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Take a corridor public electricity equipartition as an example. In order to ensure the normal operation of the circuit, multi-channel
power is utilized to provide electricity to power module that is AC-DC module with the parameters "Uin=AC85~264V". IN4007
rectification LED that is series with 300?1/2W carbon resistor is utilized by multi-channel input for isolation. Figure 1 is the
circuit diagram of this product.
Theoretically, it is a perfect idea while there are serious problems in the actual use. Without spike voltage considered, in the
normal situations, the voltage between
0
multi-channel power can reach AC400V
4.g
4$
and the withstand voltage of IN4007 can
reach 1000V. The right components are
0o
picked up, right? But the fact is that the
04d t/
short cut blast often happens because of
0
4
the
withstand voltage problem, leading to the
0d 2w
scrap of the whole product. Of course, it
can't be denied that the low quality of
0
er
components and the aging of LEDs also
6.
04t/
$f
contribute to the problem. But even if
8
high-quality LEDs or LEDs with higher
4
withstand voltage are installed instead of
0di/
previous ones, the problem still stands
there.
"'
'
·•-,_
.,
,_ •
•- $•
,_
,_ "•
"
-·--
I
•
"..,
0
404
"'
.,.
w
.,.
Considering the quality problems of early
fatigue within warranty and the existence
0o
of
throughput yield (TPY), it is nearly
0%
4be
impossible for components to reach 100%
TPY. As to this circuit, 24 rectification
00
LEDs are required in this advanced circuit
0d t/
with the scrap rate range from 2.4% to
7.2%. PCBs with such a quality are never
capable of fully realizing customers'
04 t
needs. As a matter of fact, here is an easy
0
to
use way to handle this problem. As long
04d 2w
440$
as
one more IN4007 is placed series in each
loop, this problem will be easily dealt
eel
with. Because at this time, the circuit
0d w
voltage is reduced by 0.7V, it has no
Figure I
effect to output. Only a little increase of
cost brings about the double withstand voltage values and a decrease of error occurrence to 0.5%.
49
0d
"
-
".
••
••
••
Solutions to Electromagnetic Interference by the Frequent Operation of Midget Relay
The electromagnetic interference brought by the midget relays on PCBs since arc discharge will be produced when they are
cutting high current. The interference not only influences the normal operation of CPU, leading to frequent reset, but makes
decoders and drivers produce wrong signals and instructions that result in the error of component implementation as well. All
these influences will cause defective goods and accidents. In order to solve this problem, two aspects can be considered:
increasing the anti-interference capability of CPU and reducing the interference source.
1. Increase the anti-interference capability of CPU
A CPU with high anti-interference capability must be installed. The selection of CPUs also need experiments and test. For
example, 90C52RC SCM is an ideal selection. This type of CPU features 20KV anti-static capability and 4KV anti-fast pulse and
electromagnetic capability.
2. Reduce the interference source
• Relay-driven amplifiers are capable of effectively reducing the interference generated by back electromotive force when coil is
in an outage.
• RC absorption circuit is connected parallel between relay contacts so that noise interference can be rapidly absorbed.
• Circuit boards are copper clad. Copper clad is greatly helpful in reducing the relay interference.
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• Relays must be carefully selected. Relays with the same specification always have selections of different coil power. The basic
principle is that the larger the coil power is, the more quickly the relay contact on-off actions become, the shorter the time of arc
discharge between contacts is, the shorter the electromagnetic interference time becomes.
The Improvement of Pad Off
Neither disassembly nor soldering can be avoided when PCBs are under maintenance. The aging PCBs or PCBs with too small
pads always witness the pad off and soldering layer off on plate hole wall when components are disassembled from PCBs.
1. As to the pin pad off, the nearby pad on the same route can be connected to it with a short line that can be selected according to
the distance and the amount of current it can hold. For the short distance, the trimmed discarded pins or pin header can be used for
soldering; for the long distance, copper wires with outside insulating layer can be used for connection in order to avoid the short
cut caused by the connection between lines and pins of other components. When pad off problem always takes place in this place,
it can be verified that the PCB design here is so irrational that the design of pads must be optimized. Pads can be designed into
long-round or water drop shape within the usable space and short and thick copper clad lines can be added to increase its
absorption capacity towards PCB material.
2. As to the soldering layer off on plate hole wall, the reason lies in the small size of the plate hole. When components are
disassembled from PCBs, comes along with the soldering layer of plate hole wall. So it's suggested that the size of pad hole
should be 0.3 to 0.5mm larger than that of pins in the process of design. When soldering tin layer on the pad hole wall has been
fallen off, this method can be tried. Pins of new components should be installed before tin coating with the soldering tin layer a
little thicker. Next is the pin soldering. The soldering tin layer on the pin is capable of soldering the pads on PCBs easily.
Replacement of Vulnerable Components
As long as the electronic components are used, some parts become vulnerable and need to be changed or replaced. The usual
method of maintaining these components is through soldering that leads to much time consumption, strongly influencing the work
efficiency. It is suggested that bases are added to vulnerable components or connections can be made through plugs or insert rows.
This method helps engineers save a lot of time and effort.
PCB design and optimization is a complicated process, requiring both a design blueprint and trivial details. Optimizing each detail
leads to time consumption and cost decrease in PCB manufacturing process.
ELECTRONIC PRODUCTS
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Date Developed:
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Developed By:
Document No.
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92
r
\...
INFORMATION SHEET 1.2-1
REPARE/ MAKE PCB MODULES
"'
PCB
CHARACTERISTICS
CHARACTERISTICS and USES of PCBs
General characteristics
PCBs are a group of synthetic aromatic compounds which contain a varying number of chlorine atoms substituted on a biphenyl
molecule (Figure 1). In theory, there are 209 possible PCB isomers and congeners (Table 1). It is unlikely that all of them will be
formed in the chlorination process; nevertheless, commercially produced PCBs (e.g., Aroclors) are a complex mixture of
chlorobiphenyls (Table 2).
Several industrialised countries produced PCBs, which were marketed under various trade names (Table 3). By far, most of the
available information in the literature is on Aroclors. These PCB preparations were produced in North America by Monsanto
Corporation; no PCBs have been produced in North America since 1977, although some are still being produced in Europe
(Hutzinger et al., 1974; McDonald and Tourangeau, 1986). All Aroclor formulations are characterised by a four digit number. The
first two digits indicate the type of molecule (e.g., 12 indicates a biphenyl molecule), whereas the last two digits give the percent
of chlorine by weight substituted on the molecule. For instance, Aroclor 1242 (abbreviated as A1242 or A-1242 in the text to
follow) is a mixture of chlorinated biphenyls containing 42% of chlorine by weight. The product Aroclor 1016, which is also a
mixture of chlorinated biphenyls, is an exception to this rule (see Tables 2 and 5 below). There exist other Aroclor products such
as Aroclor 5442 which are mixtures of chlorinated terphenyls, but may contain chlorinated biphenyls as well (Hutzinger et al.,
1974).
Most individual chlorobiphenyls are solids at room temperature, whereas the commercial mixtures are mobile oils (e.g., A-1221,
A-1232, A-1242, and A-1248), viscous fluids (e.g., A-1254), or sticky resins (e.g., A-1260 and A-1262) (Hutzinger et al., 1974).
The outstanding characteristics of PCBs are their (i) thermal stability, (ii) resistance to oxidation, acids, bases, and other chemical
agents, and (iii) excellent dielectric properties. Other important properties of PCBs from an environmental point of view relate to
their solubility and volatility.
FIGURE 1
STRUCTURE AND NOMENCLATURE OF POLYCHLORINATED BIPHENYLS
ELECTRONIC PRODUCTS
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Date Developed:
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TABLE 1
FIGURE I
Systematic (IUPAC) Numbering of Polychlorinated Biphenyl Compounds
(From Ballschmiter andStructure
Zell, 1980) of a biphenyl molecule and
Structure
r
No.
Structure
No.biphenyls
Structure
pol ychlorinated
No.
Structure
Monochlorobiphenyls
51
2,2',4,6'
105
2,3,3',4,4'
159
2,3,3',4,5,5'
1
2
52
2,2',5,5'
106
2,3,3',4,5
160
2,3,3',4,5,6
2
3
53
2,2',5,6'
107
2,3,3',4',5
161
2,3,3',4,5',6
3
__
54
1(),
162
2,3,3',4',5,5'
163
2,3,3',4',5,6
164
2,3,3',4',5',6
165
2,3,3',5,5',6
166
2,3,4,4',5,6
167
2,3',4,4',5,5'
168
2,3',4,4',5',6
3,3',4,4',5,5'
No.
4
Dichlorobiphenyls
,
f
4
2,2'
5
2,3
6
2,3'
7
2,4
8
2,4'
9
2,5
10
para 55
56
meta
ortho
ortho
0
2,2',6,6'
2,3,3',4
108
I
2,3,3',4'
5
6
57
2,3,3',5
meta
ortho
2
nomenclature of
meta
2,3,3',4,5'
109
2,3,3',4,6
110
2,3,3',4',6
58
2,3,3',5'
5
6
111 2,3,3',5,5'
ortho
meta
112 2,3,3',5,6
59
2,3,3',6
113
para
2,3,3',5',6
(a)60 A biphenyl
molecule showing
numbering and
2,3,4,4'
114 2,3,4,4',5
substitution (i.c., ortho, meta, and para) svstem
61
2,3,4,5
115
2,3,4,4',6
169
2,6
62
2,3,4,6
116
2,3,4,5,6
Heptachlorobiphenyls
11
3,3'
63 Cl 2,3,4',5
117
C
2,3,4',5,6
170
2,2',3,3',4,4',5
12
3,4
64
118
2,3',4,4',5
171
2,2',3,3',4,4',6
13
3,4'
' 2,3,4',6
2,3,5,6
119
2,3',4,4',6
172
2,2',3,3',4,5,5'
2,3',4,4'
120
2,3',4,5,5'
173
2,2',3,3',4,5,6
2,3',4,5
121
2,3',4,5',6
174
2,2',3,3',4,5,6'
2,3',4,5'
122
2',3,3',4,5
175
2,2'3,3',4,5',6
123
2',3,4,4',5
176
2,2',3,3',4,6,6'
124
2',3,4,5,5'
177
2,2',3,3',4',5,6
178
2,2',3,3',5,5',6
179
2,2',3,3',5,6,6'
180
c
2,2',3,4,4',5,5'
181
2,2',3,4,4'5,6
182
2,2',3,4,4',5,6'
183
2,2',3,4,4',5',6
14
3,5
15
4,4'
65
C
0
66
67
Trichlorobiphenyls
68
16
2,2',3
69
d 2,3',4,6
17
2,2',4
70
2,3',4',5
18
2,2',5
19
,_
2,2',6
20
2,3,3'
21
2,3,4
fa
r
.
22
' 23
0
c
(IUPAC #126)
3,3,4,4,5-Pentachlorobiphenyl
71
2,3',4',6
125 2',3,4,5,6'
(A true coplanar PCB)
(b)
I
2,3,4'
2,3,5 CI--
't
Lr
'
72
2,3',5,5'
73
2,3',5',6
74
c
l
2,4,4',5
c
75
2,4,4',6
'
o
o)
126
3,3',4,4',5
127
3,3',4,5,5'
C
CT
Hexachlorobiphenyls
128
'
I'
2,2',3,3',4,4'
0)- 0
¢
OR
129 2,2',3,3',4,5
c
76
2',3,4,5
77
3,3',4,4'
\
130
2,2',3,3',4,5'
184
2,2',3,4,4',6,6'
' 78
CI
79
3,3',4,5
131
2,2',3,3',4,6
185
2,2',3,4,5,5',6
3,3',4,5'
132
2,2',3,3',4,6'
186
2,2',3,4,5,6,6'
24
2,3,6
25
2,3',4
26
2,3',5
27
2,3',6
28
2,4,4'
29
2,4,5
Pentachlorobiphenyls
135
2,2',3,3',5,6'
189
2,3,3',4,4',5,5'
30
2,4,6
82
2,2',3,3',4
136
2,2',3,3',6,6'
190
2,3,3',4,4',5,6
31
I2,4',5
83
2,2',3,3',5
137
2,2',3,4,4',5
191
2,3,3',4,4',5',6
32
2,4',6
84
2,2',3,3',6
138
2,2',3,4,4',5'
192
2,3,3',4,5,5',6
33
2',3,4
85
2,2',3,4,4'
139
2,2',3,4,4',6
193
2,3,3',4',5,5',6
34
2',3,5
86
2,2',3,4,5
140
2,2',3,4,4',6'
Octachlorobiphenyls
--
I•
80
3,3',5,5'
133 nomenclature
2,2',3,3',5,5'
187 2,2',3,4',5,5',6
(e) 22,3,4-Tetrachlorobiphenyl
(correct
of an arbitrarily
chosen PCB;
sometimes
also
labeled
as
2,3,2
,4-Tetrachlorobiphenyl)
81
3,4,4',5
134 2,2',3,3',5,6
188 2,2',3,4',5,6,6'
ELECTRONIC PRODUCTS
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Date Developed:
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Developed By:
Document No.
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92
-----
---_
-_
---
r
r
L
r
L1
r1
r
r
L
r
L1
r1
r
L
L
r
36
3,3',5
t
r
rd
r
I
37
3,4,4'
38
3,4,5
39
3,4',5
Tetrachlorobiphenyls
40
2,2',3,3'
r1
41
2,2',3,4
t
r
rd
r
LJ
42
2,2',3,4'
43
2,2',3,5
44
2,2',3,5'
45
2,2',3,6
46
2,2',3,6'
r1
47
2,2',4,4'
t
48
2,2',4,5
t
49
2,2',4,5'
rd
r
50
r
r
r1
L1
r
L1
r
r
r1
87
2,2',3,4,5'
r1
35
3,3',4
r1
2,2',4,6
c
88
2,2',3,4,6
89
2,2',3,4,6
90
2,2',3,4',5
91
2,2',3,4',6
92
2,2',3,5,5'
93
2,2',3,5,6
94
2,2',3,5,6'
95
2,2',3,5',6
96
2,2',3,6,6'
97
2,2',3',4,5
98
2,2',3',4,6
99
2,2',4,4',5
100
2,2',4,4',6
101
2,2',4,5,5'
102
2,2',4,5,6'
103
2,2',4,5',6
141
2,2',3,4,5,5'
142
2,2',3,4,5,6
143
2,2',3,4,5,6'
144
2,2',3,4,5',6
145
2,2',3,4,6,6'
146
2,2',3,4',5,5'
147
2,2',3,4',5,6
148
2,2',3,4',5,6'
149
2,2',3,4',5',6
r
r
r
r
r
L
r
r
r
r
r
150 2,2',3,4',6,6'
L1
151 2,2',3,5,5',6
r1
153
2,2',4,4',5,5'
154
2,2',4,4',5,6
155
2,2',4,4',6,6'
195
2,2',3,3',4,4',5,6
196
2,2',3,3',4,4',5',6
197
2,2',3,3',4,4',6,6'
198
2,2',3,3',4,5,5',6
199
2,2'3,3',4,5,6,6'
200
2,2',3,3',4,5',6,6'
201
2,2',3,3',4',5,5',6
202
2,2',3,3',5,5',6,6'
203
2,2',3,4,4',5,5',6
204
2,2',3,4,4',5,6,6'
11Nonachlorobiphenyls
r
r
r
II
156 2,3,3',4,4',5
L1
157 2,3,3',4,4',5'
r1
158 2,3,3',4,4',6
L
104 2,2',4,6,6'
L
2,2',3,3',4,4',5,5'
205 2,3,3',4,4',5,5',6'
L
152 2,2',3,5,6,6'
L1
r
r
r
194
206
2,2',3,3',4,4',5,5',6
207
2,2',3,3',4,4',5,6,6'
208
2,2',3,3',4,5,5',6,6'
Decachlorobiphenyls
209 2,2',3,3',4,4',5,5',6,6'
L
TABLE 2
Approximate molecular composition of Aroclor mixtures (U.S.EPA, 1980)
I
A-1221
A-1232
A-1242
A-1248
A-1254
A-1260
Biphenyl
trace
11.0
6.0
-
-
-
-
Monochlorobiphenyl
1.0
51.0
26.0
1.0
-
-
-
Dichlorobiphenyl
20.0
32.0
29.0
17.0
1.0
-
-
Trichlorobiphenyl
57.0
4.0
24.0
40.0
23.0
-
-
Tetrachlorobiphenyl
21.0
2.0
15.0
32.0
50.0
16.0
-
Pentachlorobiphenyl
1.0
0.5
0.5
10.0
20.0
60.0
12.0
Hexachlorobiphenyl
trace
-
-
0.5
1.0
23.0
46.0
Heptachlorobiphenyl
-
-
-
-
-
1.0
36.0
Octachlorobiphenyl
-
-
-
-
-
-
6.0
Nonachlorobiphenyl
-
-
-
-
-
-
-
Decachlorobiphenyl
-
-
-
-
-
-
-
PCB Formulation
Chlorobiphenyl
A-1016
II--- % ---
TABLE 3
Trade names of PCB formulations (McDonald and Tourangeau, 1986)
Apirolio
Dykanol
Phenoclor (France)
Aroclor (US, Great Britain)
Elemex
Pydraul (US)
Aroclor B
Eucarel
Pyralene (France)
Asbestol
IFenclor (Italy)
I Pyranol (US, Canada)
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Askarel
Hyvol
I Pyroclor (Great Britain)
Chlorestol
IInclor
Chlorinol
Inerteen (US, Canada)
Chlophen (Germany)
IKanechlor (Japan)
DK Decachlorobiphenyl (Italy)
Nepolin
Diaclor
No-flamol
I Saf-t-kuhl
I Santotherm FR (Japan)
I Santovec 1 and 2
Sovol (USSR)
Therminol FR Series
2.2 Uses
The major Canadian use of PCBs was in dielectric fluid for industrial electrical equipment (McDonald and Tourangeau, 1986).
Other products containing PCBs included:
· -waxes
· -adhesives
· -paints
· -heat exchange fluids
· -de-dusting agents
· -vacuum pump oils
· -caulking compounds
· -hydraulic fluids
· -printing inks
· -cutting oils
· -sealants
· -plasticizers
· -carbonless copying paper
· -specialised lubricants
· -bridge bearing
· -fire retardants
· -cable insulating paper
· -lubricants
· -flame-proofing
Some uses of PCBs classified according to the type of Aroclors are shown in Table 4. PCBs mixed with DDT (Lichtenstein et al.,
1969), organophosphorus compounds (Fuhremann and Lichtenstein, 1972), and carbaryl (Plapp, 1972) have been reported to
enhance the insecticidal properties of these compounds. Although recommended for incorporation into pesticide formulations,
PCBs were apparently never used as pesticides (Hutzinger et al.,1974).
TABLE 4
Uses of PCBs Classified to Type of Aroclor
(Moore and Ramamoorthy, 1984)
Base material
Aroclor type
Purpose and Effect
Polyvinyl chloride
A-1248, A-1254,
A-1260
Secondary plasticizers to increase flame retardance
and chemical resistance
Polyvinyl acetate
A-1221, A-1232,
A-1242
Improved quick-track & fibre-tear properties
Polyester resins
A-1260
Polystyrene
A-1221
Stronger fibreglass; reinforced resins & economical
fire retardants
I
Plasticizer
Epoxy resins
A-1221, A-1248
Styrene-butadiene copolymers
A-1254
Increased resistance to oxidation & chemical attack;
better adhesive properties
I
Better chemical resistance
Neoprene
A-1268
Fire retardant; injection moldings
Crepe rubber
A-1262
Plasticizer in paints
I
I
I
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Nitrocellulose lacquers
A-1262
Co-plasticizers
Ethylene vinyl acetate
A-1254
Pressure sensitive adhesives
Chlorinated rubber
A-1254
Enhances resistance, flame retardance, electrical
insulation properties
Varnish
A-1260
Improved water & alkali resistance
Wax
A-1262
Improved moisture & flame resistance
INFORMATION SHEET 1.3-1
MOUNT AND SOLDER ELECTRONIC COMPONENTS
PROPER CARE AND USE
OF TOOLS
Soldering technology
Lead-free soldering for protecting the environment!
Environmental protection is at the top of our agenda. Gigler Elektronik is one of the first suppliers to introduce lead-free soldering
in Eastern Bavaria. Lead-free soldering minimises the heavy metal content in products and waste materials. Thus, we consistently
meet the RoHS requirements for lead-free soldering.
Upon request by a particular sector, for example, aerospace or instrumentation, we are still in a position to solder with lead.
Vapour phase soldering system
Vapour phase soldering is the most
gentle soldering method for
components because the
components are subjected to the
minimum amount of temperature
stress in this method compared to
other soldering methods. Another
advantage of this soldering method
is the uniform heating and profile
design of large and small
components. The soldering process
is carried out in an oxygen-free
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vapour phase, which ensures that the solder joints are optimally and gently fabricated with flux. The process is used for leadcontaining and lead-free soldering at Gigler Elektronik.
Reflow soldering
In reflow soldering, the printed circuit board is transported inline into a nitrogen reflow soldering furnace. Using different heating
zones, the printed circuit board is preheated and soldered in the peak zone. The soldering profiles are computer-controlled and
monitored. The nitrogen for the soldering process is generated in the internal air separation system. The residual oxygen content
of the module can thus be adjusted.
Wave soldering
In wave soldering, a flux is applied to the circuit board using a spray fluxer in selective spraying method. In the process, the
circuit board is held in a solder frame which transports the module through the soldering unit. The module is pre-heated in the preheating station and the flux is activated. The soldering unit consists of a solder pan with hot solder, which is applied to the solder
joint using a solder pump. Then the module is cooled and is ready for final inspection.
Gigler Elektronik can provide lead-containing and lead-free soldering for your products.
Selective soldering
The percentage of SMD components is gradually increasing in modules with a small amount of THT components. In this case,
Gigler Elektronik provides an alternative selective soldering method (lead-containing / lead-free) as well as solderless press fit
technology.
INFORMATION SHEET 1.4-1
PERFORM ELECTRONIC PRODUCTS ASSEMBLY
ELECTRONIC PRODUCTS
ASSEMBLY AND
SERVICING NC II
Date Developed:
September 20, 2016
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Practicing 3Rs – reduce, reuse, recycle/recover
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The Three Rs
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There is a common mantra that many of us were taught as children but do not always think of on a daily basis. The mantra is
reduce, reuse, recycle, otherwise known as the three Rs. Over the last half century, the amount of waste created per person in the
United States has almost doubled. The concept and promotion of the three Rs was created to help combat the drastic increase in
solid waste production.
Reduce
Let's start with the first R, which is reduce. The three Rs are really a waste management hierarchy with reduce being the most
important strategy. In order to reduce the amount of waste produced, it is essential to focus on the source of the waste, or where
the waste is originally coming from. Source reduction is when products are designed, manufactured, packaged, and used in a way
that limits the amount or toxicity of waste created.
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The first goal of source reduction is simply to reduce the overall amount of waste that is produced. The second goal is to conserve
resources by not using raw, virgin materials. In other words, by following source reduction, fewer raw materials will have to be
used to produce products.
Some common industrial examples of source reduction include the creation of merchandise using fewer materials. For example,
the waste created from disposable diapers, which has contributed a large amount of volume to landfills over the years, has been
reduced by making diapers with 50% less paper pulp. As technology increased, absorbent gel was created that was able to replace
the paper pulp.
Aluminum cans are also a good example of source reduction because they are now made with 1/3 less aluminum than they were
twenty years ago. Both of these examples not only reduce the amount of overall waste created, but they also conserve the natural
resources, aluminum and paper pulp, that are used in the manufacturing.
Although most examples of source reduction take place on the manufacturing side, there are several actions an individual can take
to reduce the overall amount of solid waste they produce. Some examples include sending emails instead of tradition mail,
canceling unwanted catalogs subscriptions, and fixing products instead of throwing them out.
Reuse
The second most important strategy of the three Rs is to reuse, which is when an item is cleaned and the materials are used again.
This concept can be difficult because we currently live in a world with many disposable items, and it takes some imagination and
creativity to see how items can be reused.
There are two main ways that the concept of reusing can be applied to reduce waste. First, when purchasing a new item, you can
look for a product that can be used repeatedly instead of a version that is only used once and thrown away. The second way to
reuse is to buy an item secondhand, borrow, or rent an item, instead of buying the product new.
Although the items you reuse may eventually end up being waste, by reusing them you are reducing the overall amount of waste
produced by giving the item a second function and expanding the typical lifespan of the item. The process of reusing can also be
fun because it gives you the opportunity to take an old or used item and turn it into something new to you.
There are many ways that you, as an individual, can reuse items. Some common examples include shopping at thrift stores or yard
sales for second hand items. You can also donate items you no longer need to thrift stores so that someone else can use them.
Another common method of reuse is to bring your own reusable shopping bags instead of using plastic or paper bags provided at
the store.
In addition to individual actions, there are also some industries that implement the process of reuse. Some smaller beverage
companies use glass bottles to hold their products and promote consumers returning the bottles. The company then cleans and
refills the bottles for sale. It is estimated that the average glass beverage bottle can make about 15 round-trips between the
manufacturer and the consumer before it must be recycled due to damage.
Recycle
The third R in the hierarchy is for recycle, which in terms of waste is the reprocessing of disposed materials into new and useful
products. Items that are commonly recycled include glass, plastic, paper, and metal. When recycled, some of these materials are
used to create more of the same original product, while other materials are used to create entirely different products after
recycling.
In the 1960s, the United States only recycled around 6% of waste! As of 2010, the United States recycled approximately 25% of
the municipal solid waste produced. Although this percentage may seem small in comparison to other countries, such as
Switzerland and Japan that recycle around 50% of waste, the current amount recycled in the United States is a drastic
improvement.
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INFORMATION SHEET 1.4-2
PERFORM ELECTRONIC PRODUCTS ASSEMBLY
Managing waste from
electrical and electronic
equipment (WEEE)
The Waste Electrical and Electronic Equipment Directive (WEEE Directive) is the European Community directive 2012/19/EU
on waste electrical and electronic equipment (WEEE) which, together with the RoHS Directive 2002/95/EC, became European
Law in February 2003. The WEEE Directive set collection, recycling and recovery targets for all types of electrical goods, with a
minimum rate of 4 kilograms per head of population per annum recovered for recycling by 2009. The RoHS Directive set
restrictions upon European manufacturers as to the material content of new electronic equipment placed on the market.
The symbol adopted by the European Council to represent waste electrical and electronic equipment comprised a crossed out
wheelie bin with or without a single black line underneath the symbol. The black line indicates that goods have been placed on the
market after 2005, when the Directive came into force.[1][2] Goods without the black line were manufactured between 2002 and
2005. In such instances, these are treated as "historic WEEE" and falls outside
reimbursement via producer compliance schemes.
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Waste of electrical and electronic equipment (WEEE) such as computers, TV-sets, fridges and cell phones is one the fastest
growing waste streams in the EU, with some 9 million tonnes generated in 2005, and expected to grow to more than 12 million
tonnes by 2020.
WEEE is a complex mixture of materials and components that because of their hazardous content, and if not properly managed,
can cause major environmental and health problems. Moreover, the production of modern electronics requires the use of scarce
and expensive resources (e.g. around 10% of total gold worldwide is used for their production). To improve the environmental
management of WEEE and to contribute to a circular economy and enhance resource efficiency the improvement of collection,
treatment and recycling of electronics at the end of their life is essential.
To address these problems two pieces of legislation have been put in place: The Directive on waste electrical and electronic
equipment (WEEE Directive) and the Directive on the restriction of the use of certain hazardous substances in electrical and
electronic equipment (RoHS Directive)
The first WEEE Directive (Directive 2002/96/EC) entered into force in February 2003. The Directive provided for the creation of
collection schemes where consumers return their WEEE free of charge. These schemes aim to increase the recycling of WEEE
and/or re-use.
In December 2008, the European Commission proposed to revise the Directive in order to tackle the fast increasing waste stream.
The new WEEE Directive 2012/19/EU entered into force on 13 August 2012 and became effective on 14 February 2014.
EU legislation restricting the use of hazardous substances in electrical and electronic equipment (RoHS Directive
2002/95/EC)entered into force in February 2003. The legislation requires heavy metals such as lead, mercury, cadmium, and
hexavalent chromium and flame retardants such as polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)
to be substituted by safer alternatives. In December 2008, the European Commission proposed to revise the Directive. The RoHS
recast Directive 2011/65/EU became effective on 3 January 2013 (more information about RoHS is available here).
Categorization of WEEE
The directive places WEEE into numerous categories, the first tier being historic and non-historic. Historic WEEE implies
equipment placed on the market prior to 2005 and the WEEE directive places the onus upon the owner of the equipment to make
provisions for its recycling. Where equipment was placed on the market after 2005, it is known as non-historic WEEE (denoted by
a bar underneath the crossed-out wheeled bin symbol[6]), and it is the responsibility of the producer/distributor to make provisions
for its collection and recycling.
The WEEE directive sets a total of 10 categories of WEEE. for reporting purposes.









Large household appliances
Small household appliances
IT and telecommunications equipment
Consumer equipment
Lighting equipment
Electrical and electronic tools
Toys, leisure and sports equipment
Medical devices
Monitoring and control instruments
r
INFORMATION SHEET 1.5-2
TEST AND INSPECT ASSEMBLED ELECTRONIC
PRODUCTS
Testing of electronic
products
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Date Developed:
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Date Developed:
September 20, 2016
Developed By:
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Document No.
Issued By:
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92
Environmental Testing To Ensure Reliability Of Electronic Products
Introduction To Environmental Testing
Most design engineers will design a good product that works well during the initial stages of development and testing. However,
how do you ensure that when the product goes into mass production, most of them are still in good working condition
In other words, how do you ensure the quality and reliability of this product when it is operated for an extended period of time
under varying environmental conditions. Environmental testing is the answer to this question.
This testing will help the manufacturer to accelerate the aging process of the product to predict its life cycle analyse the modes of
failure and filtering out those products that are not fit to be shipped out to the customers. In order for the testing to be carried out,
equipment are needed to perform this test. One has to analyse and calculate whether it is worthwhile to invest in the equipment or
to just perform the reliability tests in test houses.
Many of these test houses are able to offer consultancy services as to the standards and test methods that will be used with regards
to the electronic products that will be tested. The reliability testing is one of the secret that makes a world of difference between a
good product to another.
Some of the basic equipment that are needed for the testings are temperature and humidity chambers, thermal shock chambers,
vibration machines and salt-fog chambers. Other more specialized equipment are needed depending on the types of products that
will be tested.
Types Of Testing
The following are the typical type of reliability testing that are done on the electronic products.
1. Tempature Humidity Testing
Temperature and humidity chambers are used to test the influence of temperature and humidity on the products. Tests involved
subjecting the products to the cycling of the temperature and humidity of the chambers.
Temperature Humidity Chambers To Test The Reliability Of Electronic Products
Temperature Humidity chambers are used to perform various tests to determine the reliability of the electronics products that have
been designed before they are allowed to go into mass production.
One of the main usage of the chamber is to do temperature and humidity cycling. This test is to ensure that the electronic device
will survive those environmental conditions expected during the storage, shipping and operational periods of the device.
In the control of humidity, it is not necessary to control it when the temperature is 0 Celcius and below. Allowing the relative
humidity to go below 10% is good enough. At temperature of 50 Celcius and above, the control of relative humidity is needed to
prevent condensation on the electronic devices under test.
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After a period of high
temperature and high
relative humidity, it is
necessary to dry out the
chamber to the lowest
possible RH(relative
humidity) before reducing
the temperature to avoid
any condensation on the
device under test. Some
examples of the test
standard that one can
consider is listed below.
However, it is always
better to check the test
standards and methods
from reliable sources such
as IEC and ASTM.
SHIPPING ENVIRONMENT TESTING
Step
Humidd
Temperature
Duration
f
Low RH
-40 €
168 hours
2
Low RH to 95% RH
-40 Ct0 85 0
2hours
3
95% RH
85 0
168 hours
4
95% RH to Low RH
85 0
05 hours
5
Low RH
86 to .40
2hours
.Relative Humidity
Example of Temp/Humidity Cycle Of Shipping Environment
Table below shows an example of a temperature/humidity settings to test the shipping environment that an electronic products
may be subjected to. The parameters may be changed according to the products that are tested. At the end of the test, a
performance test should be performed to check the operations of the device.
OPERATIONAL ENVIRONMENT TESTING CYCLE
Example of
Temp/Humidity Cycle Of
Operational Environment
Step
luriddv
Temperature
Duration
Low RH
0
2hours
Table below shows an
example of a
2
Low RH to 85% RH
0 "C to 50 "C
2hours
temperature/humidity
cycle to test the
3
86% RH
50 0
15hours
operational environment
that an electronic products
4
85% RH to Low RH
50 0
05 hours
may be subjected to. The
parameters may be
changed according to the
5
Low RH
50 "C to O "C
2hours
products that are tested.
At the end of the test, a
RH.Relative Humidity
performance test should
be performed to check the operations of the device.
The device should be powered up during the entire duration of the test with maximum loading. The input power supply should be
adjusted to input AC power line plus 15% at 50 °C and AC power line minus 15% at 0 °C. The cycle should be repeated for at
least 60 cycles.
'
2. Thermal Shock Testing
Thermal Shock is performed to determine the ability of a part (electronics devices, electronic products, etc) to withstand sudden
changes in temperature.
Thermal Shock Testing For Reliability of Electronic Devices
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Introduction To Thermal Shock Testing
Thermal Shock is performed to determine the ability of a part (electronics devices, electronic products, etc) to withstand sudden
changes in temperature. It is the most severe type of test of all the temperature related tests as it involves a high rate of change of
temperature.
Usually the rate of change is 30 °C/min or higher. Parts that need to be shipped from a warm location to a freezing location during
transportation/shipping or loading/unloading will need to undergo this test to simulate its real life condition.
The part is usually placed in a chamber of which it is exposed to very low temperature and move to a very high temperature within
a short period before going back to room temperature. This is repeated over a few cycles. There are 2 types of system testing used
i.e. air to air or liquid to liquid.
Air to air thermal shock testing used a very high rate of temperature change. In a two chamber design, one chamber temperature is
kept hot and the other chamber is kept cold. A carriage is used to move the part under test between the 2 chambers within few
seconds. Fully enclosed thermal shock test chambers are normally used to avoid unintended exposure to ambient temperature and
the hazards of personnel handling.
In Liquid to liquid systems, a two vat system and a mechanized basket arrangement is used to move the part under test between
the hot and cold sides of the equipment. This system is used when a higher rate of thermal transfer of greater thermal energy is
needed.
In both systems, the equipment must be able to vary the hot chamber temperature, cold chamber temperature, dwelling time or
soak time of the hot chamber, dwelling time of the cold chamber, transition time from one chamber to the other chamber and
setting of the number of cycles.
The number of cycles can vary from 1 to 250 and its setting will depend on the type of device and its application . It is best to try
and draw some analogies to the product lifetime and use.
After the final cycle, external visual examination of the case, leads, and seals shall be performed using magnifier at 10X to 20X.
Its marking shall also be inspected at with at least 3X magnifier. An illegible mark or any evidence of damage to the case, leads,
or seals after the stress test shall be considered a failure.
Electrical testing of the samples to the part specifications must also be performed to detect electrical failures due to the test.
Failure mechanisms accelerated by thermal shock in the electronics industry include die cracking, package cracking, wire breaks
and wire bond being lifted.
Two industry standards that govern temperature cycle testing are the Mil-Std-883 Method 1011 and the JEDEC JESD22-A106.
The Military Standard 883 Method 1011 thermal shock test specifications is as shown below:
Total Transfer Time < 10 seconds
Total Dwell Time > 2 minutes
Specified Temp reached in < 5 minutes
Must be conducted for a minimum of 15 cycles
Low Te
Coron
3. Vibration Testing and
Methodology
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Vibration testing is the shaking or shocking of a component or assembly to see how it will stand up to real life environment
Vibration Testing For Reliability of Electronic Devices
Vibration testing is the shaking or shocking of a component or assembly to see how it will stand up to real life environment. In
electronics, it is used it to test the ability of printed circuit boards and its assembly or electronic components to withstand real life
situation when these devices are shipped by means of air, sea or land.
Real life environment also includes simulating its normal or extreme operational conditions where it is operating. Damaged is
most likely to occur when the device is vibrated at its natural or resonant frequency.
There are typically 3 vibration levels that can be used as a guide for the reliability engineer. However, he may choose to establish
different criteria for any device based on the projected service environment.
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Date Developed:
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The 3 levels are light vibration, medium vibration and heavy vibration. Light vibration is tested for electronic devices that are
mounted on the walls. Medium vibration is tested for equipment that have electronic control boxes mounted into them. Heavy
vibration is for those installation that are used in moving vehicles e.g. truck, trailers or cars.
There are 3 types of tests that are usually performed. They are shipping, performance and endurance vibration. There are
orthogonal axes of the device that will be tested. They are identified as X, Y and Z axis. Tests will be performed on each of the 3
axis. The test methods below are just for references. Always check the specifications and test methods that you would like to use
for your particular device.
Shipping Vibration
This test is used to simulate the vibration levels that occurred when devices are transported using rail or truck. This test is usually
done with the devices packed at its final packaging for shipment. The electronic devices must be able to withstand 1G of random
vibration with frequency sweep from 3 to 50 Hz for 20 minutes in each axis.
After the testing is done, physical checking for internal or external damage will determine whether the product passed the test.
Electrical testing also need to be evaluated after the test.
Performance Vibration
Performance vibration testing is done to examine the functional performance of the device during the test. An example of the
vibration level is as shown in the table below.
EXAMPLE OF PERF OFRMANCE VIBRATION LEVELS
Light Vibration
Medium Vibration
leav Vibration
Vibration Level
0008" P.F
0.4G
0015 P.F
076G
0OA(" p.
20G
ELECTRONIC PRODUCTS
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Date Developed:
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Developed By:
feed
5-31 Hz
31-300 Hz
5-31 h4
31-300 Hz
5-31 l
31300 Hz
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