IConn PLUS ELA
High Performance Ball Bonder
IConn PLUS ELA
Operator’s Guide
98890-10EA-001-00
Revision B
Copyright © 2016 Kulicke & Soffa Industries Inc (www.kns.com) and all subsequent revision dates. All Rights Reserved. Original English language version.
The information contained in this document is the property of Kulicke & Soffa Industries Inc and is subject to change without notice.
This document may not be reproduced or transmitted in any form, nor stored in a retrieval system of any nature, without the written authority from:
Kulicke & Soffa Pte Ltd
23A Serangoon North Avenue 5,
#01-01, Singapore 554 369
IConn PLUS ELA High Performance Ball Bonder
Table of Contents
Table of Contents ...................................................................................................................P-1
Use of This Manual .................................................................................................................P-5
Publication ................................................................................................................................................. P-5
Terms and Conventions Used in Manuals .............................................................................................. P-5
Record of Changes .................................................................................................................P-6
Safety Information ................................................................................................................. P-7
S.1
S.2
S.3
S.4
S.5
S.6
S.7
S.8
S.9
S.10
S.11
S.12
S.13
S.14
S.15
S.16
S.17
General ............................................................................................................................................ P-7
Definitions ....................................................................................................................................... P-7
S.2.1
Warning.............................................................................................................................. P-8
S.2.2
Caution...............................................................................................................................P-8
S.2.3
Note ................................................................................................................................... P-8
Equipment-Specific Warnings....................................................................................................... P-8
General Precautions....................................................................................................................... P-9
Trained Operators and Service Technicians.............................................................................. P-10
Electrical Equipment Servicing ................................................................................................... P-10
S.6.1
Types of Electrical Hazards .............................................................................................P-10
S.6.2
Power Supply Servicing ...................................................................................................P-11
S.6.3
Lockout/Tagout Procedure...............................................................................................P-11
Safe Use of Heated Material and Equipment.............................................................................. P-13
S.7.1
User's Responsibilities for Personal Safety .....................................................................P-13
Potential Ergonomic Hazard – Microscope Use ........................................................................ P-13
S.8.1
Heated Equipment Servicing ...........................................................................................P-14
Fire Safety ..................................................................................................................................... P-14
S.9.1
Fire Suppression..............................................................................................................P-14
S.9.2
Flammable Maintenance Supplies...................................................................................P-14
Emergency Off Switch.................................................................................................................. P-14
S.10.1
Emergency Off Switch Specifications ..............................................................................P-15
S.10.2
Test Emergency Off Switch Operation.............................................................................P-15
Cover Panels ................................................................................................................................. P-15
Machine Emissions ...................................................................................................................... P-16
S.12.1
Ionizing and Non-Ionizing Radiation ................................................................................P-16
S.12.2
Vibration...........................................................................................................................P-16
S.12.3
Noise................................................................................................................................P-16
S.12.4
Gases, Vapor, Dust..........................................................................................................P-16
Warning and Safety Labels.......................................................................................................... P-17
S.13.1
Emergency Off .................................................................................................................P-21
S.13.2
Burn Hazard Warning ......................................................................................................P-21
S.13.3
Pinch Point Hazard Warning............................................................................................P-21
S.13.4
Electrical Hazard Warning ...............................................................................................P-22
S.13.5
General Hazard Warning .................................................................................................P-22
S.13.6
Disconnect Power Label ..................................................................................................P-22
S.13.7
Equipment Grounding IEC ...............................................................................................P-23
S.13.8
Operator ESD Connection Point Label ............................................................................P-23
S.13.9
Beryllium Product Warning ..............................................................................................P-23
S.13.10 Hard Stop Caution ...........................................................................................................P-24
S.13.11 Excessive Load Warning Against Scope Mount ..............................................................P-24
Identification Label Descriptions ................................................................................................ P-25
S.14.1
EFO Box Ordering Notice Label ......................................................................................P-25
S.14.2
Equipment Configuration Tag ..........................................................................................P-25
S.14.3
Equipment Identification/Manufacturer’s Identification Label...........................................P-26
S.14.4
FDA Explanatory/Certification Label ................................................................................P-26
Laser Safety .................................................................................................................................. P-27
Declaration of Exemption ............................................................................................................ P-29
Shutdown and Start-up Procedures ........................................................................................... P-29
S.17.1
Machine Shutdown Procedure.........................................................................................P-29
S.17.2
Machine Start-up Procedure ............................................................................................P-30
Operator’s Guide
Page P-1
Preface
Table of Contents
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
Chapter 1:Introduction .......................................................................................................... 1-1
1.1
1.2
Overview.......................................................................................................................................... 1-2
1.1.1
Operation Related Manuals ............................................................................................... 1-3
1.1.2
Software Release Notes .................................................................................................... 1-3
Equipment Description .................................................................................................................. 1-4
1.2.1
XY Table ............................................................................................................................ 1-5
1.2.2
Bond Head ......................................................................................................................... 1-5
1.2.3
Material Handling System .................................................................................................. 1-6
1.2.4
Lower Console ................................................................................................................... 1-6
1.2.5
Upper Console ................................................................................................................... 1-7
1.2.5.1
Wire Feed System (part of Upper Console) ..................................................... 1-7
1.2.6
Optics & Vision System...................................................................................................... 1-7
1.2.7
User Interface .................................................................................................................... 1-8
1.2.8
Software............................................................................................................................. 1-8
Chapter 2:Interface ................................................................................................................ 2-1
2.1
2.2
2.3
2.4
2.5
User Interfaces................................................................................................................................ 2-2
2.1.1
Man Machine Interface ...................................................................................................... 2-3
2.1.2
Emergency Off Button........................................................................................................ 2-3
2.1.3
Microscope......................................................................................................................... 2-3
2.1.4
Work Light.......................................................................................................................... 2-3
2.1.5
Light Tower and Audible Alarm.......................................................................................... 2-4
2.1.6
Video Monitor..................................................................................................................... 2-5
Software and Graphic User Interface (GUI).................................................................................. 2-6
2.2.1
Software Version Data ....................................................................................................... 2-6
2.2.2
Monitor Screen and Elements of Screen ........................................................................... 2-7
2.2.3
Man Machine Interface (MMI) .......................................................................................... 2-13
Software Navigation ..................................................................................................................... 2-15
2.3.1
Introduction to the Menu Tree.......................................................................................... 2-17
2.3.2
Example of Navigation between Menus and Dialogs....................................................... 2-18
2.3.3
Dialogs ............................................................................................................................. 2-20
2.3.4
Function Bar (Upper) ....................................................................................................... 2-23
2.3.5
Function Bar (Lower) ....................................................................................................... 2-24
2.3.6
Display Windows.............................................................................................................. 2-25
2.3.7
Chessing .......................................................................................................................... 2-26
Illumination Control and Configuration...................................................................................... 2-27
Abbreviations used in the Software............................................................................................ 2-28
Chapter 3:Operation .............................................................................................................. 3-1
3.1
3.2
3.3
3.4
Machine Start Up Introduction ...................................................................................................... 3-2
Power Up Sequence ....................................................................................................................... 3-3
3.2.1
Software Load and Automatic Test.................................................................................... 3-3
3.2.2
Motor Stop Mode ............................................................................................................... 3-5
Load/Save/Clear Menu ................................................................................................................... 3-9
3.3.1
Load Process Program .................................................................................................... 3-10
3.3.2
Save Process Program .................................................................................................... 3-11
3.3.2.1
Rename MHS Files ........................................................................................ 3-13
3.3.2.2
Rename Device/Wires/Ref Sys...................................................................... 3-14
3.3.3
Clear Process Program.................................................................................................... 3-15
3.3.4
Load Reference (Ref) System ......................................................................................... 3-15
3.3.5
Save Reference (Ref) System ......................................................................................... 3-16
3.3.6
Load Process Program without MHS............................................................................... 3-17
3.3.7
Set Up OLP (Off Line Programming) ............................................................................... 3-18
3.3.8
Load PP Without Heat Block Reteach ............................................................................. 3-18
Operating Procedures .................................................................................................................. 3-19
3.4.1
Initial Start Up .................................................................................................................. 3-20
3.4.2
Load/Unload Magazines During Bonding ........................................................................ 3-22
3.4.3
Stop Auto Bonding ........................................................................................................... 3-22
3.4.4
Clear Leadframes from Indexer ....................................................................................... 3-22
3.4.5
Remove Magazines From Magazine Handlers................................................................ 3-22
98890-10EA-001-00
Revision B
Preface
Table of Contents
Operator’s Guide
Page P-2
IConn PLUS ELA High Performance Ball Bonder
3.5
3.6
3.7
3.4.6
Bonder/Workholder System Shut Down .......................................................................... 3-23
Product Conversion ..................................................................................................................... 3-24
3.5.1
Replace Clamp Insert and Heat Block Insert ................................................................... 3-25
3.5.2
Load Process Program .................................................................................................... 3-29
3.5.3
Enter/Edit Material Dimensions & MHS Configure Parameters ....................................... 3-30
3.5.4
Teach Bond Position........................................................................................................ 3-32
3.5.5
Set Workholder Rail Height.............................................................................................. 3-33
3.5.6
Optics Focus .................................................................................................................... 3-33
3.5.7
Select the Leadframe Stopper Position ........................................................................... 3-34
3.5.8
Do MHS Operation Check ............................................................................................... 3-35
Recovery Operations.................................................................................................................... 3-36
3.6.1
Correct a Bond Location in Auto Mode ............................................................................ 3-37
3.6.2
Change Bond/ Wire Parameters ...................................................................................... 3-38
3.6.3
Reteach Bond Height....................................................................................................... 3-38
3.6.4
Remove Leadframe(s) from Indexer ................................................................................ 3-38
3.6.5
Remove Magazines from Magazine Handler................................................................... 3-39
Power Failure Recovery (PFR) .................................................................................................... 3-40
3.7.1
Configure Extended Power Supply .................................................................................. 3-41
3.7.2
Extended Power Down Sequence ................................................................................... 3-42
3.7.2.1
Power Down During Auto Mode..................................................................... 3-42
3.7.2.2
Power Down During Program Mode .............................................................. 3-42
3.7.2.3
Resumption of AC Power During Power Down Sequence............................. 3-43
3.7.3
Configure the Quick/Standard Power Failure Recovery (PFR)........................................ 3-44
3.7.3.1
Quick Power Failure Recovery Sequence ..................................................... 3-45
3.7.3.2
Standard Power Failure Recovery (PFR) Sequence ..................................... 3-46
3.7.4
Battery Monitor................................................................................................................. 3-47
Chapter 4:Calibration ............................................................................................................ 4-1
4.1
4.2
4.3
4.4
Calibration Introduction ................................................................................................................. 4-2
4.1.1
Calibration Sequence......................................................................................................... 4-3
Servo Calibration ............................................................................................................................ 4-4
4.2.1
Tune X-axis, Y-axis, and Z-axis ......................................................................................... 4-4
4.2.2
Map Z Encoder .................................................................................................................. 4-5
4.2.3
Tuned Servo Parameters................................................................................................... 4-8
4.2.4
Fine Phasing ...................................................................................................................... 4-9
Vision System Calibration ........................................................................................................... 4-10
4.3.1
Pattern Recognition System (PRS).................................................................................. 4-10
4.3.1.1
PRS Calibration Setup ................................................................................... 4-11
4.3.1.2
Do the PRS Calibration .................................................................................. 4-12
4.3.2
Optics Position ................................................................................................................. 4-13
4.3.2.1
Lookahead Offset Calibration Procedure ....................................................... 4-13
4.3.2.2
Nominal Offset Calibration Procedure............................................................ 4-16
4.3.3
Crosshair Offset ............................................................................................................... 4-20
4.3.3.1
Set the Crosshair Offset Calibration Conditions............................................. 4-20
4.3.3.2
Crosshair Offset Calibration ........................................................................... 4-21
Bond Head Calibrations ............................................................................................................... 4-23
4.4.1
Crosshair Offset ............................................................................................................... 4-23
4.4.2
EFO (Electronic Flame Off) Height Procedure................................................................. 4-24
4.4.2.1
Execute Calibration Sequence....................................................................... 4-25
4.4.3
Z-axis Adjustments .......................................................................................................... 4-27
4.4.3.1
Align Transducer ............................................................................................ 4-28
4.4.3.2
Set Z Reset .................................................................................................... 4-33
4.4.3.3
Loop Height Factor/Offset .............................................................................. 4-34
4.4.4
Bond Force Calibration .................................................................................................... 4-35
4.4.4.1
Bond Force Calibration Procedure................................................................. 4-35
4.4.4.2
Bond Force Verification Procedure ................................................................ 4-38
4.4.5
USG (Ultrasonic Generator) Calibration .......................................................................... 4-40
4.4.5.1
USG Calibration Procedure............................................................................ 4-41
4.4.6
Capillary (Cap) Change ................................................................................................... 4-42
Operator’s Guide
Page P-3
Preface
Table of Contents
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
4.5
4.6
4.7
4.8
4.9
4.10
4.11
4.12
Workholder Calibration ................................................................................................................ 4-45
4.5.1
Rail Calibration................................................................................................................. 4-46
4.5.2
Clamp Calibration ............................................................................................................ 4-48
4.5.3
Indexer Calibration........................................................................................................... 4-50
4.5.4
X Registration Sensor Calibration.................................................................................... 4-52
4.5.5
Force Jam Detect Calibration .......................................................................................... 4-55
4.5.6
Wall Calibration................................................................................................................ 4-57
4.5.6.1
Input Wall Calibration ..................................................................................... 4-57
4.5.6.2
Output Wall Calibration .................................................................................. 4-57
4.5.7
Rail Height Adjustment .................................................................................................... 4-58
4.5.7.1
Rail Height Measurement and Adjustment..................................................... 4-59
4.5.8
Puller/Gripper Calibration................................................................................................. 4-60
4.5.8.1
Puller Sensor Calibration ............................................................................... 4-60
4.5.8.2
Index Gripper Sensor ..................................................................................... 4-60
4.5.8.3
Eject Gripper Sensor...................................................................................... 4-61
4.5.8.4
Index Gripper Force ....................................................................................... 4-62
4.5.8.5
Eject Grip Force Calibration ........................................................................... 4-63
4.5.9
Gripper Calibration Result................................................................................................ 4-65
4.5.10
Workholder Calibrations................................................................................................... 4-65
Magazine (Mag) Handler Calibration........................................................................................... 4-66
4.6.1
Input/Output Trays Calibration ......................................................................................... 4-67
4.6.2
Input/Output Slot Calibration............................................................................................ 4-69
4.6.3
Y Sensor Offset................................................................................................................ 4-72
4.6.4
Calibration Results........................................................................................................... 4-74
Incomplete Calibrations ............................................................................................................... 4-75
XY Table Characterization ........................................................................................................... 4-76
On Bonder Personality Factor (OBPF) ....................................................................................... 4-77
4.9.1
Calibration Procedure ...................................................................................................... 4-78
Eyepoint Thermal Drift Calibration ............................................................................................. 4-82
4.10.1
Graph Results .................................................................................................................. 4-83
Crosshair Offset Characterization .............................................................................................. 4-84
4.11.1
Automatic Low Magnification Calibration ......................................................................... 4-84
4.11.2
Calibration Procedure ...................................................................................................... 4-85
Process Program Portability Factors ......................................................................................... 4-87
4.12.1
EFO Current Offset .......................................................................................................... 4-87
4.12.2
Loop Height Factor/Offset................................................................................................ 4-87
4.12.3
Bond Force Offset............................................................................................................ 4-88
4.12.4
USG Personality Values .................................................................................................. 4-89
Chapter 5:Preventive Maintenance and Replacements ..................................................... 5-1
5.1
5.2
40-hour Preventive Maintenance................................................................................................... 5-2
5.1.1
Inspect/Clean Bonder and MHS ........................................................................................ 5-3
5.1.2
Inspect Capillary ................................................................................................................ 5-3
5.1.3
Clean Air Guide.................................................................................................................. 5-3
5.1.4
Clean Wire Clamp Jewels.................................................................................................. 5-6
5.1.5
Check Wire Clamp Gap ..................................................................................................... 5-7
5.1.6
Clean Wire Feed Tensioner ............................................................................................... 5-8
5.1.7
Clean Microscope Lens ................................................................................................... 5-10
Replacement Procedures............................................................................................................. 5-11
5.2.1
Replace Capillary............................................................................................................. 5-12
5.2.1.1
Bond Tool (Capillary) Usage .......................................................................... 5-12
5.2.1.2
Capillary Replacement Procedure ................................................................. 5-13
5.2.2
Replace Wire Spool ......................................................................................................... 5-16
5.2.2.1
Replace Wire Spool Procedure...................................................................... 5-16
Appendix A:Glossary of Terms and Abbreviations ........................................................... A-1
98890-10EA-001-00
Revision B
Preface
Table of Contents
Operator’s Guide
Page P-4
IConn PLUS ELA High Performance Ball Bonder
Use of This Manual
The purpose of this manual is to give technical data for the Kulicke & Soffa IConn PLUS ELA High
Performance Ball Bonder. Use the Table of Contents to find specific data.
Publication
The IConn PLUS ELA High Performance Ball Bonder publication includes:
•
Operator’s Guide
Operator level data from bonder operation, calibration, and routine maintenance
•
Programmer’s Guide
Step-by-step instruction to teach and edit a process program for automatic bond operation
•
Reference Guide
Menu screen data from options, parameters and the related definitions
•
Maintenance Manual
Maintenance data for all primary modules
•
Material Handling System (MHS) Manual
Setup, operation, and maintenance of the MHS
•
Spare Parts Book
Selective spare parts lists with illustration for parts ordering
•
Installation Guide
Data for site requirement, packing/unpacking, installation, power-up tests and reshipment.
Terms and Conventions Used in Manuals
The format used in this publication is:
•
System modes, Graphical User Interface (GUI) buttons, MMI buttons are capitalized and in bold.
Example: PROGRAM MODE, TEACH NEW REF SYS, ENTER
•
Numeric “Hot Keys” are also in bold, followed by the function name.
Example: 1 AUTO (Mode); 3 DELETE (Menu Option)
•
Monitor messages are in initial caps. Example: Enable Eyepoint Reteach
The terminology below is used in this manual:
Term
Explanation
Chess
To move the XY table/bond head with the use of the mouse or arrow keys.
Select
1.
2.
3.
Drag
To reposition or resize an item on the display with the use of the mouse and the B1
left mouse button in a held state. To stop the drag function, release the B1 left mouse
button.
Index
To move a substrate to the next bonding sequence.
Scroll
To move a text field up or down (left to right) in the toolbar. Arrow keys or sliders are
used to do this function.
Target
Chess the XY Table to put the monitor crosshair or scan box at a specific location in
one of the display windows.
Operator’s Guide
Page P-5
Put pointer on a button or menu item and push the B1 left mouse button.
If item is highlighted (box around item), push ENTER.
Push menu item’s ‘Hot Key’.
Preface
Use of This Manual
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
Record of Changes
Revision
A
Record of Changes
Initial Release
Revision
B
Page
June 2015
Record of Changes
Page
Manual updated to 8-88-4-60 Software Version:
FEA3784
“Executing/Material Error” & “Bonding/Material Error” signal light status added
to the signal light table in section 2.1.5 Light Tower and Audible Alarm.
98890-10EA-001-00
Revision B
Issue Date
Preface
Record of Changes
Issue Date
March 2016
2-4
Operator’s Guide
Page P-6
IConn PLUS ELA High Performance Ball Bonder
Safety Information
The safety topics are as follows:
S.1 General
S.2 Definitions
S.3 Equipment-Specific Warnings
S.4 General Precautions
S.5 Trained Operators and Service Technicians
S.6 Electrical Equipment Servicing
S.7 Safe Use of Heated Material and Equipment
S.8 Potential Ergonomic Hazard – Microscope Use
S.9 Fire Safety
S.10 Emergency Off Switch
S.11 Cover Panels
S.12 Machine Emissions
S.13 Warning and Safety Labels
S.14 Identification Label Descriptions
S.15 Laser Safety
S.16 Declaration of Exemption
S.17 Shutdown and Start-up Procedures
S.1
General
Kulicke & Soffa refer to the latest international health and safety standards, specifications and
procedures during design and assembly of this machine. The machine is safe to operate, but
incorrect maintenance or operation could cause injury to personnel or damage to the equipment.
Keep the machine in the condition specified in this manual. During operation and maintenance,
apply all safety precautions to prevent injury to personnel and damage to the machine. Standard
safety procedure and local safety regulations apply.
The machine is used in the production of semiconductors. Do not use the machine for other
functions. Mechanical or electrical changes made without approval can have an unwanted effect
on the safe and satisfactory operation of the machine.
Kulicke & Soffa accept no responsibility for injury or damage (direct or indirect) caused if one of
these conditions are found:
(1) The machine is used for other tasks
(2) Made changes to the machine that are not approved
(3) Use tools, materials, equipment or procedures that are not approved.
You must read this safety chapter before you operate the bonder.
S.2
Definitions
This manual uses the terms Warning, Caution and Note for important data. Select links below for
more data.
S.2.1 Warning
S.2.2 Caution
S.2.3 Note
Operator’s Guide
Page P-7
Preface
General
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
S.2.1
Warning
WARNING:
The symbol and the term WARNING go before text that is safety related and show a potentially
hazardous situation. If you ignore the warning, it could cause death or serious injury. Warnings
appear before the related task. Read the warnings before you do the task.
All WARNINGs are printed in Bold italic letters.
S.2.2
Caution
CAUTION:
The symbol and the term CAUTION go before text that is safety related and show a potentially
hazardous situation. If you ignore the caution, it could cause minor or moderate injury. It can also
be used to alert against unsafe practices. Cautions appear before the related task. Read the
cautions before you do the task.
All CAUTIONs are printed in Bold italic letters.
S.2.3
Note
Note:
The term Note goes after the text and gives more data that can help you during a task, or gives
you data about the machine. Notes are printed in Bold italic letters.
S.3
Equipment-Specific Warnings
WARNING:
Type 4 Electrical Hazard! The power supply module supplies a hazardous voltage of
420 VDC. This power is used on the X and Y motors and XY amplifier. Before you get access
to the power supply, the XY amplifier, the X and Y motors or their related cables, make sure
that the machine power is off. Disconnect the power supply module from the AC mains. Make
sure that the red safety LED adjacent to the 420 VDC connector on the power supply is off
(approximately after five minutes) before you get access to the power supply module, XY
amplifier, and the X and Y motors.
WARNING:
Type 4 Electrical Hazard! Do not touch the electronic flame-off (EFO) wand or the gold wire
during operation or manual EFO firing. The system makes a spark between the EFO wand
and wire which can cause an electrical shock if you touch it during EFO firing. The potential
shock hazard is not usually life threatening (as given in IEC Publication No. 479). But, K&S
recommends that personnel with unusual heart conditions or artificial heart stimulation
devices (such as pacemakers) must not be permitted to operate or do maintenance on the
equipment.
WARNING:
Type 4 Electrical Hazard! The EFO can transmit a maximum of 5 KV on different internal
parts of the EFO control box and on the high voltage cable. Do not open the EFO box. If it
becomes necessary to hold the high voltage cable or remove the box, disconnect the EFO box
power cable and wait for five minutes. Be careful at all times and apply safety precautions
when you touch or do servicing on the EFO control box and high voltage cable.
98890-10EA-001-00
Revision B
Preface
Warning
Operator’s Guide
Page P-8
IConn PLUS ELA High Performance Ball Bonder
WARNING:
Electro-magnetic Fields! Servo motors that move the bond head and optics have strong
magnetic fields. The artificial heart stimulation devices (such as pacemakers) may operate
incorrectly during bond head movement. Thus, personnel with such devices must not be near
the equipment while it is in operation.
WARNING:
Type 4 Electrical Hazard! Do not touch the clamp assembly when machine power is on. The
clamp is operated by an electrical potential of maximum 500 VDC. When used with heavy wire
or copper kit, the clamp assembly can cause an electrical shock if you touch it. But the
potential shock hazard is not life threatening.
WARNING:
Class 1 Laser Hazard! The bond head Z-axis encoder has a Class 1 laser (and in certain
models, the x-axis and y-axis encoder). While the encoder sensor head is installed on the bond
head (or XY table), the laser is not dangerous to you. Unless specified in the maintenance
procedure, make sure that the machine power is off before you do servicing or remove the
encoder from the bond head (or XY table).
WARNING:
Burn Hazard! Hot surfaces can cause burns. The workholder is hot during and after
operation. Use heat-resistant protective gloves or let surface temperatures decrease to less than
60°c before you touch the workholder.
WARNING:
Hazardous Material! The bond head link is made from a Beryllium alloy that can be a
potential carcinogen. Hazardous dust is made when this material is cut, removed, or ground.
Do not machine or try to rework the bond head. Do not cause scratches on the link with small,
sharp tools when you do work around the bond head area. This may cause particles that can
enter your skin. A material safety data sheet for Beryllium and its safety application is
available from K&S. Refer to your local K&S support for more data.
WARNING:
Injury Hazard! During operation, some modules of the machine move without a warning.
Keep hands, tools, and loose items away from the MHS, XY table, and bond head areas.
S.4
General Precautions
Apply these general safety precautions before you operate, adjust, or do servicing on this
equipment:
•
Components of the workholder are very hot. Do not let your fingers, or materials with a
low melting point to touch the hot areas
•
Obey all WARNINGS and CAUTIONS written in the texts of the machine manuals
•
Always disable all motors before you put your hands near the bond head, XY table, MHS
and other energized systems
•
Keep your hands away from the bond area during machine operation
•
Operate the bonder with covers installed at all times
•
Disconnect the electrical service to the bonder before you remove the rear covers or open
the card rack door (unless machine power is necessary for a specific maintenance task)
•
Standard precautions related to live electrical circuits must be taken at all times
•
Do not put tools or materials on the MHS or bonder when you do maintenance
Operator’s Guide
Page P-9
Preface
General Precautions
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
•
•
S.5
Apply the manufacturer's recommended safety precautions when you use chemical
material
Solvents and aerosols, if used, must be compatible with the bonder serviceable location
and the process
Trained Operators and Service Technicians
For operation and maintenance of the bonder, you must receive training in machine operation
and maintenance given by Kulicke & Soffa. The Performance Based Equipment Training
(P.B.E.T.) given by Kulicke & Soffa makes sure that the personnel can operate and do
maintenance on the machine. There are two levels of training:
•
Level One
Level One training includes basic machine operation and maintenance. Machine Operators
must complete this training before they are permitted to operate the machine.
•
Level Two
Level Two training includes advanced machine operation and maintenance. Service
technicians must complete the two levels of training (Level One and Level Two).
Data on the training and locations can be found on “www.kns.com”.
S.6
Electrical Equipment Servicing
CAUTION:
Before you apply AC power to the machine, read through the safety items below.
S.6.1 Types of Electrical Hazards
S.6.2 Power Supply Servicing
S.6.3 Lockout/Tagout Procedure
S.6.1
Types of Electrical Hazards
At times, it is necessary to get access to some areas of the machine to do setup procedures,
calibrations or regular maintenance procedures. If work in these areas are related to components
near opened energized circuits, the steps to do the work specifies the type of electrical hazard.
The types of electrical hazards are:
•
Type 1: Equipment is fully de-energized (electrically cold)
•
Type 2: Equipment is energized
Live circuits have insulations.
•
Type 3: Equipment is energized
Live circuits are open and accidental contact is possible. Potential exposures are less than
30 VRMS (42.2 volts peak).
•
Type 4: Equipment is energized
Live circuits are open and accidental contact is possible. Potential exposures are more than
30 VRMS (42.2 volts peak) or there are radio frequencies.
•
Type 5: Equipment is energized
Measurements and/or adjustments include entry into the equipment or equipment
configuration does not let you use clamp-on probes.
Note: Electrical hazard of types 3 through 5 are clearly shown in the IConn PLUS ELA
machine manuals.
98890-10EA-001-00
Revision B
Preface
Trained Operators and Service Technicians
Operator’s Guide
Page P-10
IConn PLUS ELA High Performance Ball Bonder
S.6.2
Power Supply Servicing
CAUTION:
You can cause damage to the machine if you apply power that is below the specified voltage
range. Do not connect the machine to source power unless the source power is in the range of
200 VAC to 240 VAC. If the source power is below this range, a step-up transformer is
necessary (see NOTE below).
Note: If the source input voltage is in the range of 100 VAC to 120VAC, a step-up transformer
is necessary. This is to increase the input voltage to the required 200 to 240 VAC range.
The step-up transformer is installed between the IConn PLUS ELA power supply and
the source input voltage. Speak your local Kulicke & Soffa support for more data about
this feature.
The DC power to all components on the IConn PLUS ELA are supplied by the power supply
through the Power Distribution Unit (PDU). But the +420VDC supply to the XY amplifier
comes directly from the power supply through an approved cable.
CAUTION:
There is a red safety LED adjacent to the 420 VDC connector on the power supply, which,
when come on shows that there is voltage of more than 60 VDC. Make sure that this safety
LED is off before you disconnect the power supply, XY amplifier, or X and Y motors. See
figure above for location.
A
A
Safety LED Location
Figure P-1: Safety LED on the Power Supply
Configuration setup is not necessary for the power supply. Make sure that the source AC line
voltage is in the range of 200 to 240 VAC. Also, frequency differences in the source input
voltage are applied automatically.
S.6.3
Lockout/Tagout Procedure
Kulicke & Soffa recommends that you apply these lockout/tagout procedures:
Operator’s Guide
Page P-11
Preface
Power Supply Servicing
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(1)
Use a power connector locking device. When you remove power from the machine, put
the lockout device (user supplied) such as the power lockbox (shown below) on the power
cable. This is to prevent accidental power connection to the bonder during maintenance.
Figure P-2: Power Cord Lockbox and Tagout Tag
A
(2)
Attach the tagout tag on the lockout device. This gives a clear warning to all personnel that
the machine cannot be operated until the tagout tag and the lockout device are removed.
Refer to OSHA Standard (29 CFR 1910.147) for data on the control of hazardous energy
with lockout/tagout procedures.
(3)
Remove the cable connector of the backup battery (A) from the J1 connector of the power
supply unit (B) and put the cable connector fully in a bubble wrap (C) during the
maintenance of the bonder. If a secondary backup battery is available on J2, do the steps
again.
Backup Battery
B
Power Supply Unit
C
Bubble Wrap
Figure P-3: Backup Battery Cable Wrap
98890-10EA-001-00
Revision B
Preface
Lockout/Tagout Procedure
Operator’s Guide
Page P-12
IConn PLUS ELA High Performance Ball Bonder
(4)
Use a pressurized air valve locking device. When you remove pressurized air from the
machine, put the valve lockout device (user supplied, example shown below). This is to
prevent accidental pressurized air connection to the bonder during maintenance.
Figure P-4: Example of Valve Lockout Device
S.7
Safe Use of Heated Material and Equipment
The workholder heaters are hot and it will burn your skin immediately if you touch the heaters or
components near the heaters without protection. Apply safety precautions when you load or
remove the hot materials or do servicing in the area around the workholder to prevent injury.
S.7.1
User's Responsibilities for Personal Safety
It is your responsibility to operate and do servicing on the machine safely. You must know all the
hazards and their related safety precautions. Examine all of the safety data given with the
equipment. Read the WARNINGs in the machine manuals, and know the areas of the machine
with hazardous labels.
S.8
Potential Ergonomic Hazard – Microscope Use
There is a potential ergonomic hazard when you use the microscope installed on the machine.
The eyepieces of the microscope are 1380 mm (54.3 inches) above the ground. For some
machine users, this eyepiece height is too low to use. For others, the eyepiece height is too high
to look through the microscope. The height of the microscope is not adjustable. To prevent
potential injury, apply these precautions when you use the microscope:
WARNING:
Do not stay on tiptoe when you look through the microscope. This is not a stable position and
this may cause you to fall down.
(1)
If the eyepieces are too high, put your feet on a step while you look through the
microscope. This lets you to look through the eyepieces easily, but the maximum step
height must not be more than 100 mm (4 inches).
(2)
If the eyepieces are too low, make sure that the time to look through the microscope (in a
bent position) is no more than 20 seconds at a time. During intervals, make sure that you
stay up straight for approximately 10 seconds after each view (of 20 seconds). To prevent
potential injury, the maximum number of views at the microscope in a bent position is two
for each day (with rest after each 20 seconds view).
Operator’s Guide
Page P-13
Preface
Safe Use of Heated Material and Equipment
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
S.8.1
Heated Equipment Servicing
Set the heaters to off and give sufficient time for the workholder heaters to cool fully before you
start the maintenance procedure.
To make sure that the workholder heaters are cool:
S.9
(1)
In the Temperature Configuration dialog, set 1 TURN ALL ZONES to OFF.
(2)
Monitor the heat zone temperatures shown on the monitor screen.
(3)
When the shown temperatures equal the ambient temperature (approximately 25 °C), start
the maintenance procedure.
Fire Safety
This section shows the fire suppression equipment necessary for the machine and the storage of
flammable supplies.
Select links below for more data:
S.9.1 Fire Suppression
S.9.2 Flammable Maintenance Supplies
S.9.1
Fire Suppression
The machine is operated in a clean room that has fire detection and fire suppression equipment.
The only requirement is to make sure that the fire extinguishing agent is applicable for the
removal of electrical and electronic fires. The machine contains no flammable liquids or gases
and does not use flammable liquids or gases during operation. If there is no area specified to put
the fire suppression equipment where the machine operates, the fire suppression equipment must
be available near the machine. Only personnel approved to extinguish fires can use the fire
suppression equipment. If there is a fire, fumes from the machine are the same as those found
from the combustion of electrical or electronic equipment. Apply standard discharge and
cleaning procedures at all times.
S.9.2
Flammable Maintenance Supplies
Some preventive maintenance procedures use isopropyl alcohol, grain alcohol and acetone for
cleaning and grease removal which are flammable liquids. Large quantities of alcohol (more than
1 liter) must be put in storage with reference to local regulations. At a minimum, the alcohol
must be kept in approved containers with clear labels. You must keep the containers out of the
production area in fireproof lockers. When the use of alcohol is necessary for machine
maintenance, use only in small quantities in tightly closed container with label. Keep the alcohol
away from open flames or other sources of ignition at all times. Refer to manufacturer’s Materia
Safety Data Sheet (MSDS) for all hazardous items for the correct handling, storage and usage.
Note: You must discard used wipes soaked in isopropyl alcohol, grain alcohol and acetone
according to your local laws.
S.10
Emergency Off Switch
The IConn PLUS ELA emergency off switch is on the front right side of the upper console. It is
a latching switch with a large red knob surrounded by a yellow label. The switch is large and
clear to see, and conveniently in position. This is to make sure that you can easily find and use it,
if an emergency power down of the system is necessary.
98890-10EA-001-00
Revision B
Preface
Heated Equipment Servicing
Operator’s Guide
Page P-14
IConn PLUS ELA High Performance Ball Bonder
Push the switch knob in to start an emergency power down process. This causes the power
supply contactor to open and to remove all AC power from the equipment. To start up the bonder
after an emergency power down, release the emergency off switch. Then push the machine off
switch once, and push the machine on switch to start up the machine.
CAUTION:
When you push the emergency off switch during bonding, operation may result in the loss of
the process program and possibly cause damage to the material. Make sure that you clear all
leadframes from the workholder before you restart the bonder after an emergency off
condition.
Select links below for more data:
S.10.1 Emergency Off Switch Specifications
S.10.2 Test Emergency Off Switch Operation
S.10.1
Emergency Off Switch Specifications
•
•
•
S.10.2
Switch Location: Front, right side corner of the upper console.
Switch Description: Latching switch with large red knob and a yellow label imprinted with
the term “EMERGENCY OFF”. When activated, the switch latches in the on position.
The switch knob must be turn clockwise to release and unlock the switch.
Functions:
Emergency Off- Push the emergency off switch:
•
When you push in the switch, it cuts off all AC power to the system by the release of
the power supply contactor.
•
When the emergency off switch is pushed:
The emergency off switch stays in the latched position to prevent unauthorized use
of the machine. If the “ON” switch button is pushed with the emergency off switch
latched down, the machine power continues to stay off. Go to the next step to restart
from emergency off.
•
Restart from emergency off:
Turn the switch knob clockwise to release the switch and reset the emergency off
switch. This will release the switch to reset to the “out” position. Push the machine
OFF switch and then push the machine ON switch button to start up the machine.
Note: The equipment will not restart unless the emergency off switch is reset to the
“out” position.
Test Emergency Off Switch Operation
A test of Emergency Off Switch operation must be done regularly as part of the scheduled
machine preventive maintenance. The test must also be done immediately after the machine is
installed at your site, during initial start up.
In this test, you must operate the switch to make sure that power is immediately removed from
the machine. The main power switch will not return power to the machine when the emergency
off switch is activated (latched down).
S.11
Cover Panels
The machine covers include the workholder cover, input and output magazine handler covers,
upper console cover panel and lower console cover panel. They give protection to the trained
personnel from hazards related to the movement of the mechanical parts, heating elements and
electrical subsystems of the equipment. The covers must be in place and attached during all
normal operations. They must be opened or removed by trained service personnel only.
Operator’s Guide
Page P-15
Preface
Emergency Off Switch Specifications
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
S.12
Machine Emissions
This section gives the various types of machine emissions for IConn PLUS ELA High
Performance Ball Bonder. Select links below for more data:
S.12.1 Ionizing and Non-Ionizing Radiation
S.12.2 Vibration
S.12.3 Noise
S.12.4 Gases, Vapor, Dust
S.12.1
Ionizing and Non-Ionizing Radiation
•
•
S.12.2
Ionizing Radiation:
There are no sources of ionizing radiation in the machine.
Non-ionizing Radiation:
The machine has been tested to show compliance with EN 61000-6-4, “Generic Emissions
for Industrial Environments.”
Vibration
If the machine is installed as specified in the Installation Guide, the machine will not let out any
appreciable vibration when in operation. Make sure that the machine on its leveling feet and with
no contact between the machines and site walls or other equipment. Elastomer vibration isolators
are used on the leveling feet to support the machine and prevent vibrations from the machine to
transmit it to the floor.
S.12.3
Noise
Continuous acoustical noise emitted by the machine will not be more than 85 dB(A). This is
measured from the user position as prescribed in ANSI S1.13 “Methods for the Measurement of
Sound Pressure Levels.”
S.12.4
Gases, Vapor, Dust
The machine produces no gases, vapors, or dust as a result of its operations.
98890-10EA-001-00
Revision B
Preface
Machine Emissions
Operator’s Guide
Page P-16
IConn PLUS ELA High Performance Ball Bonder
S.13
Warning and Safety Labels
This section gives the safety and identification labels on the IConn PLUS ELA High
Performance Ball Bonder. The safety labels inform trained users and trained service personnel
that a hazardous condition may exist in the general area of each of those labels. This requires
caution if actions must be done in those areas. The identification labels are informative and
intended to help trained users and trained service personnel to do their duties safely.
F
A
B
C
D
B
B
E
A
S.13.2 Burn Hazard Warning
D
S.13.5 General Hazard Warning
B
S.13.3 Pinch Point Hazard Warning
E
S.13.8 Operator ESD Connection Point Label
C
S.13.4 Electrical Hazard Warning
F
S.13.1 Emergency Off
Figure P-5: Machine Front and MHS Safety Label Tags
Operator’s Guide
Page P-17
Preface
Warning and Safety Labels
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
A
D
C
A
B
A
S.13.4 Electrical Hazard Warning
C
S.13.5 General Hazard Warning
B
S.13.7 Equipment Grounding IEC
D
S.14.2 Equipment Configuration Tag
Figure P-6: Machine Safety Label Tags (rear view)
98890-10EA-001-00
Revision B
Preface
Warning and Safety Labels
Operator’s Guide
Page P-18
IConn PLUS ELA High Performance Ball Bonder
D
C
B
A
A
S.13.4 Electrical Hazard Warning
C
S.14.3 Equipment Identification/Manufacturer’s Identification Label
B
S.13.6 Disconnect Power Label
D
S.14.4 FDA Explanatory/Certification Label
Figure P-7: Lower Console Front Safety Label Tags
A
B
A
S.13.4 Electrical Hazard Warning
B
Clamp Driver Board
Figure P-8: Card Cage Safety Label Tags
Operator’s Guide
Page P-19
Preface
Warning and Safety Labels
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
A
B
C
A
S.14.1 EFO Box Ordering Notice Label
B
S.13.4 Electrical Hazard Warning
C
S.13.3 Pinch Point Hazard Warning
Figure P-9: EFO and MHS Safety Labels
A
A
S.13.9 Beryllium Product Warning
Figure P-10: Bond Head Safety Label
98890-10EA-001-00
Revision B
Preface
Warning and Safety Labels
Operator’s Guide
Page P-20
IConn PLUS ELA High Performance Ball Bonder
S.13.1
Emergency Off
Figure P-11: Emergency Off Label
•
•
•
S.13.2
Label: Emergency Off Label
Description:
This label identifies and increases the visibility of the emergency off switch. This label
makes sure that all users are fully aware of its location and function.
Color: Black on yellow background
Burn Hazard Warning
Figure P-12: Burn Hazard Warning Label
WARNING:
Hot temperatures can go as high as 200°C.
•
•
•
S.13.3
Label: Burn Hazard Warning
Description:
Trained users and service personnel are warned of hot surfaces in the workholder area and
on the bond head and optics assembly.
Color: Black on yellow background
Pinch Point Hazard Warning
Figure P-13: Pinch Point Warning Label
•
•
•
Operator’s Guide
Page P-21
Label: Pinch Point Hazard Label
Description:
Trained users and Service Personnel are warned to keep hands and fingers clear of the
area.This applies to the front and rear areas of the input and output magazine handlers and
on the front of the workholder area.
Color: Black on yellow background
Preface
Emergency Off
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
S.13.4
Electrical Hazard Warning
Figure P-14: Electrical Hazard Warning Label
•
•
•
S.13.5
Label: Electrical Hazard Warning Label
Description:
This label alerts trained service personnel to the presence of high voltage in the area.
Color: Black on yellow background
General Hazard Warning
Figure P-15: General Hazard Warning Label
•
•
•
S.13.6
Label: Warning, General Hazard Label
Description:
This label alerts trained service personnel (TSP) to the presence of danger at the
workholder area, upper and lower console areas when covers are taken out. The TSP must
to look for the related labels (next to the General Hazard Label) and read the safety
information before you try to service the equipment.
Color: Black on yellow background
Disconnect Power Label
Figure P-16: Disconnect Power Before Servicing Label
•
•
•
98890-10EA-001-00
Revision B
Label: Disconnect Power Before Servicing Label
Description:
The label tells trained service personnel to disconnect the input power cord of the power
supply before they service the equipment in the lower console.
Color: White on blue background
Preface
Electrical Hazard Warning
Operator’s Guide
Page P-22
IConn PLUS ELA High Performance Ball Bonder
S.13.7
Equipment Grounding IEC
Figure P-17: Equipment Grounding IEC Label
•
•
•
S.13.8
Label: Equipment Grounding IEC Label
Description:
Label identifies the connection point for input power ground.
Color: Black on white background
Operator ESD Connection Point Label
Figure P-18: Operator ESD Connection Point Label
•
•
•
S.13.9
Label: Operator ESD Connection Point Label
Description:
Label identifies the connection point to attach the ESD wrist strap. This is to prevent
equipment damage from electrostatic discharge.
Color: Black on white background
Beryllium Product Warning
Figure P-19: Beryllium Product Warning Label
•
•
•
Operator’s Guide
Page P-23
Label: Beryllium Product Warning Label. “BERYLLIUM PRODUCT. HAZARDOUS
DUST PRODUCED WHEN MACHINED, FILED, OR GROUND.”
Description:
Trained service personnel are directed to manual for safety information with parts made
from Beryllium alloy, which can represent a health hazard under certain conditions.
During normal machine operations and maintenance actions, the Beryllium alloy does not
represent a hazard to machine users or service technicians. Refer to IConn PLUS ELA
High Performance Ball Bonder Maintenance Manual, chapter 5: bond head, for more data.
Color: Black on yellow background
Preface
Equipment Grounding IEC
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
S.13.10 Hard Stop Caution
A
A
Hard Stop Limit Line
Figure P-20: Hard Stop Caution Label
•
•
•
Label: Hard Stop Caution Label. “HARD STOP CAUTION. Do not force beyond the hard
stop.”
Description:
Trained operators and service personnel are not to turn the work light beyond the hard
stop. This is because rotation beyond the hard stop will cause damage to the joint on the
goose neck. The hard stop location is denoted on the caution label.
Color: Black and white text on yellow, red, and gray background
S.13.11 Excessive Load Warning Against Scope Mount
Figure P-21: Excessive Load Warning Label (Against Scope Mount)
•
•
•
98890-10EA-001-00
Revision B
Label: Excessive Load Warning Label (Against Scope Mount). “DO NOT LEAN OR
APPLY EXCESSIVE LOAD AGAINST SCOPE MOUNT ASSEMBLY.”
Description:
Trained operators and service personnel are not to lean or apply excessive force on the
scope mount assembly because this can cause damage to the locking screw and cause a
blockage to the linkage system. Do not use the scope mount assembly to push the bonder
during transport.
Color: Black text on yellow background
Preface
Hard Stop Caution
Operator’s Guide
Page P-24
IConn PLUS ELA High Performance Ball Bonder
S.14
Identification Label Descriptions
The sections below give descriptions of each identification label that includes label location,
color(s) and purpose, meaning, additional instructions, etc.
Select links below for more data:
S.14.1 EFO Box Ordering Notice Label
S.14.2 Equipment Configuration Tag
S.14.3 Equipment Identification/Manufacturer’s Identification Label
S.14.4 FDA Explanatory/Certification Label
S.14.1
EFO Box Ordering Notice Label
Figure P-22: EFO Box Ordering Notice Label
•
•
•
S.14.2
Label: EFO Box Ordering Notice Label
Description:
This label tells the trained service personnel to take note of the full part number that
includes the last two digits when ordering a new or replacement EFO Box. It also instructs
them to consult the customer service representative if necessary.
Color: Black on beige card stock
Equipment Configuration Tag
Figure P-23: Equipment Configuration Tag
•
•
•
Operator’s Guide
Page P-25
Label: Equipment Configuration Tag
Description: This tag gives Trained Service Personnel with the AC power configuration of
the equipment, as shipped. It also instructs them to refer to the Maintenance Manual if the
line voltage and frequency is out the specification.
Color: Red on White Card
Preface
Identification Label Descriptions
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
S.14.3
Equipment Identification/Manufacturer’s Identification Label
Figure P-24: Equipment Identification Label
•
•
•
S.14.4
Label: Equipment Identification/Manufacturer's Identification Label
Description:
The label specifies the equipment and manufacturer's identification numbers (model
number, serial number, series and date manufactured), identifies the country of origin, and
indicates CE compliance. It shows data on the AC power configuration and tells trained
maintenance personnel of the expected maximum power consumption at listed nominal
voltages. It also directs trained maintenance personnel to consult the Machine Manuals
before you try to reconfigure the system.
Color: Black on gray
FDA Explanatory/Certification Label
Figure P-25: FDA Explanatory/Certification Label
•
•
•
98890-10EA-001-00
Revision B
Label: FDA Explanatory/Certification Label
Description:
This label specifies that, with the use of Class 1 lasers in, the equipment is considered a
Class 1 Laser Product as specified per international standard EN/IEC 60825-1:2007. It
also specifies that the equipment complies with the US Food and Drug Administration/
Center for Devices and Radiological Health (FDA/CDRH) performance standards for
laser products except for deviations as documented in FDA/CDRH Laser Notice Number
50 published on June 24, 2007.
This label, in conjunction with the Equipment Identification Label (FDA/CDRH
Manufacturer's Identification Label), comprise the necessary US FDA/CDRH label
requirement for Class 1 Laser Products.
Color: Black on white
Preface
Equipment Identification/Manufacturer’s Identification Label
Operator’s Guide
Page P-26
IConn PLUS ELA High Performance Ball Bonder
S.15
Laser Safety
Note: The data below applies to K&S machines with serial numbers “@@E@-@@XXXXX”
where “@” is alpha configuration data and X is numeric.
LASER SAFETY INFORMATION: Mercury & Chip Encoder
These encoders contain an infrared laser diode or diodes. Emitted invisible laser radiation levels
have been measured to be in the CDRH Class 1 range, which is not considered hazardous.
However, to decrease exposure to the diverging beam, install the encoder sensor in its
operational configuration near the encoder scale before you apply power.
Figure P-26: Class 1 Laser Product Label
•
•
•
•
Invisible laser radiation
•
Wavelength: 850 nm
All maintenance procedures such as cleaning must be performed with the MicroE encoder
turned off.
Do not insert any reflective surface into the beam path when encoder is powered.
Do not attempt to service the encoder.
MicroE Systems
125 Middlesex Turnpike, Bedford, MA 01730
Serial # XXXXX
Model # Mercury II 1900XY/ZCRS
Manufactured Date: October 2011
Figure P-27: MicroE Systems Label
CAUTION:
The use of controls or adjustments or performance of procedures other than those specified
herein may result in hazardous radiation exposure.
(1)
This laser product is designated as Class 1 during all procedures of operation.
•
(2)
Operator’s Guide
Page P-27
Non-accessible Laser Parameter
•
Wavelength: 850 nm
The bond head Z-axis encoder and the XY table X and Y encoders contain a Class 1 laser.
While the encoders are mounted in the bonder, the laser poses no danger to the user or
maintenance technician. However, it is recommended that, unless specifically required for
the maintenance activity, you always turn off the machine power before you service the
equipment. Turn off the machine power before you remove the encoder from the bond
head or X and Y table.
Preface
Laser Safety
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(3)
Under normal usage, there is no user maintenance required or any scheduled maintenance
necessary to the laser encoders. The laser encoders should not be opened and no repair,
service or modification shall be done by customer. Only trained K&S service personnel or
K&S trained customer service engineers are able to service the encoders.
(4)
If the X or Y encoder becomes faulty, send the complete X/Y table to the factory for repair
and/or replacement. This is due to the complexity and special tools required for the repair,
setup and recalibration. In some instances, and subject to the fault finding results, a trained
K&S service engineer may make the repairs on-site. You can service the Z-axis encoder at
a customer site but only by a trained K&S service engineer or K&S trained customer
service engineer.
(5)
A bonder with a faulty laser encoder should be taken out of service for repair by a
qualified service engineer as mentioned above.
(6)
For customer performed service functions, only K&S trained customer service engineers,
with K&S calibration tools and maintenance procedures in the equipment's Maintenance
Manual, are permitted.
Note: The data below applies to K&S machines with serial numbers “@@H@-@@XXXXX”
where “@” is alpha configuration data and X is numeric.
Figure P-28: Class 1 Laser Product Label
CAUTION:
The use of controls or adjustments or performance of procedures other than those specified
herein may result in hazardous radiation exposure.
(7)
This laser product is designated as Class 1 during all procedures of operation.
•
Non-accessible Laser Parameter
•
Wavelength: 850 nm
(8)
The bond head Z-axis encoder contains a class 1 laser. While the encoder is mounted in the
bonder, the laser poses no danger to the user or maintenance technician. However, it is
recommended that, unless specifically required for the maintenance activity, you always
turn off the machine power before you service the equipment. Turn off the machine power
before you remove the encoder from the bond head or X and Y table.
(9)
Under normal usage, there is no user maintenance required or any scheduled maintenance
necessary to the laser encoders. The laser encoders should not be opened and no repair,
service or modification shall be performed by customer. Only trained K&S service
personnel or K&S trained customer service engineers are allowed to service the encoders.
(10) You can repair and replace the Z-axis encoder at a customer site but only by a trained K&S
service engineer or customer service engineer.
(11) A bonder with a faulty laser encoder should be taken out of service for repair by a
qualified service engineer as mentioned above.
98890-10EA-001-00
Revision B
Preface
Laser Safety
Operator’s Guide
Page P-28
IConn PLUS ELA High Performance Ball Bonder
(12) For customer performed service functions, only K&S trained customer service engineers,
with K&S calibration tools and maintenance procedures in the equipment's Maintenance
Manual, are permitted.
S.16
Declaration of Exemption
Kulicke & Soffa Pte Ltd declares that our products, i.e. ball bonders, wedge bonders, die bonders
and similar industrial equipment are exempt from the European RoHS (Restriction of Use of
Certain Hazardous Substances) and WEEE (Waste of Electrical and Electronics Equipment)
directives refered to the equipment under the not applicable category of “Large-scale, stationary
industrial tools” as referenced in EU Directive 2011/65/EU (RoHS) Article 2§4(d) and
Article 3§(3).
Examples of this type of equipment have previously been reviewed by third party evaluators (see
Note 1) who determined that the equipment reviewed meet the above criteria (see Note 2) and, as
such, are deemed to be outside the scope of both European Union (EU) RoHS and WEEE.
Note: 1) TUV Rheinland of North America, RoHS & WEEE – Official letter of exemption,
Kulicke & Soffa; September 26, 2005
Note: 2) TUV Rheinland of North America, WEEE and RoHS Directive Applicability to
Industrial Machinery; September 27, 2005
S.17
Shutdown and Start-up Procedures
In the event of a plant shutdown, bonders must be shut down. The machine shutdown and startup procedures are given below. Select links below for more data:
S.17.1 Machine Shutdown Procedure
S.17.2 Machine Start-up Procedure
S.17.1
Machine Shutdown Procedure
(1)
Turn “OFF” all heaters (pre-heat, bond site and post heat) from the GUI.
(2)
Remove all materials, units, magazines, wires, P-parts, etc from the bonder.
(3)
Re-initialize the workholder.
(4)
Save Bond Process Programs (if needed).
(5)
Save MDP to C:\ drive.
(6)
Push the machine off button to shut down the machine.
(7)
Disconnect clean dry air (CDA) supply line and AC power cord from the AC mains.
(8)
Wait for machine to cool down to room temperature. Place desiccants on the X/Y motors,
lower console (inside and outside) and heat block. Move the bond head above the heat
block.
(9)
Put a plastic sheet over the machine to prevent dust accumulation.
(10) At this juncture, inform the personnel in-charge of the site to shut down the HVAC
(heating, ventilating and air conditioning) system.
Operator’s Guide
Page P-29
Preface
Declaration of Exemption
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IConn PLUS ELA High Performance Ball Bonder
S.17.2
Machine Start-up Procedure
Note: Coordination with facilities is extremely important to make sure that there is smooth
transition of the bonders into production.
(1)
Wait for the production environment to stabilize to the these conditions:
•
•
•
Temperature ~77°F (25°C) or below
Relative humidity of 40-60%
Barometric pressure of 540 to 810 mm Hg (21.2 to 31.9” Hg)
(2)
Remove all desiccants from the bonder.
(3)
Purge the CDA supply (incoming facilities) before you connect the CDA supply line to the
bonder.
(4)
Check the supply (incoming) voltage with a multimeter. This is dependent on the AC
voltage requirement on the machine.
(5)
Connect the AC power cord to the AC mains.
(6)
Push the machine on button to power up the machine.
(7)
Load Bond Process Program.
(8)
Install the heat block & clamp insert.
(9)
Do the bonder dry cycle mode with pre-heat, bond site and post heat temperature setpoints turned “OFF”.
(10) Turn “ON”pre-heat, bond site and post heat heaters after successful completion of dry
cycle.
(11) Do the machine setup for production refered to customer’s standard procedure.
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Preface
Machine Start-up Procedure
Operator’s Guide
Page P-30
IConn PLUS ELA High Performance Ball Bonder
Chapter 1: Introduction
1.1 Overview
1.2 Equipment Description
Operator’s Guide
Page 1-1
Introduction
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IConn PLUS ELA High Performance Ball Bonder
1.1
Overview
This manual gives the basic instructions to operate the IConn PLUS ELA High Performance Ball
Bonder. It also includes the calibration and maintenance data.
The Operator’s Guide is divided into five chapters:
Chapter 1: Introduction
Chapter 2: Interface
Chapter 3: Operation
Chapter 4: Calibration
Chapter 5: Preventive Maintenance and Replacements
A glossary appendix is at the end of this manual:
Appendix A: Glossary of Terms and Abbreviations
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Introduction
Overview
Operator’s Guide
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IConn PLUS ELA High Performance Ball Bonder
1.1.1
Operation Related Manuals
To operate the IConn PLUS ELA machine, refer to these manuals:
•
Operator’s Guide
•
Programmer’s Guide
•
Reference Guide
1.1.2
Software Release Notes
Refer to the topics in the Power Series software release notes for data on the past and current software
releases:
•
New features: Description and operation data of the new features in this software release
•
Resolved issues: Software fixes for each software release
•
Known issues: Possible issues related to the software release
•
Installation: Data related to installation of the software
Operator’s Guide
Page 1-3
Introduction
Operation Related Manuals
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IConn PLUS ELA High Performance Ball Bonder
1.2
Equipment Description
The K&S IConn PLUS ELA High Performance Ball Bonder makes wire interconnections on
semiconductor integrated circuit (IC) devices. The machine attaches a wire bond connection through a
thermosonic ball bonding process. This process uses heat, force, and ultrasonic energy to attach each
end of the wire to the device. The term ‘ball bonding’ refers to the process where the tail of each wire
(i.e., the first bond) is melted to a shape of a ball before bonding.
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Introduction
Equipment Description
Operator’s Guide
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IConn PLUS ELA High Performance Ball Bonder
The machine hardware includes:
A
B
C
Upper Console
Wire Feed
Man Machine Interface
D
E
F
Lower Console
Material Handling System
Vision & Optics
G
H
XY Table
Bond Head
Figure 1-1: IConn PLUS ELA High Performance Ball Bonder
The primary features of the IConn PLUS ELA High Performance Ball Bonder are as follows:
•
Process Robustness
•
Production Portability
•
Ease of Use
•
Robust Hardware Performance
•
Upgrade-ability
•
Extra large 56 mm x 90 mm bond area
•
Better serviceability
•
Extended holdup power supply with automatic recovery
1.2.1
XY Table
The XY table includes two sliders and drive systems attached to the table assembly. Each linear servo
motor operates to apply ‘X’ (left to right) and ‘Y’ (front to back) movements. During an operation, the
two servo motors move the sliders in X and Y directions to identify the reference and bond locations.
During an automatic operation, the software sends the signals to the servo motors. In teach and manual
operations, you use the Man Machine Interface (MMI) to move and set the position. The bond head and
optics are attached to the front Y slide of the XY table.
1.2.2
Bond Head
WARNING:
Hazardous Material! The bond head link is made from a Beryllium alloy that can be a potential
carcinogen. Hazardous dust is made when this material is cut, removed, or ground. Do not machine
or try to rework the bond head. Do not cause scratches on the bond head link with small, sharp tools
Operator’s Guide
Page 1-5
Introduction
XY Table
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IConn PLUS ELA High Performance Ball Bonder
when you do work around the bond head area. This may cause particles that can enter your skin. A
material safety data sheet for Beryllium and its safety application is available from K&S. Refer to
your local K&S support for more data.
The bond head, installed as a part of the front Y slide of the XY table, includes:
•
Transducer with capillary (transducer made of titanium)
•
Flat coil Z motor with motor housing
•
Beryllium Aluminum link (see Warning above)
•
High resolution Z encoder
•
Bond head temperature stabilization through Z motor heat elements and constant
•
Parallel wire clamps
•
Flexure bearing assembly
•
Electronic Flame-Off (EFO) assembly (attached to the Y slide)
•
Contact force sensor (piezo sensor)
The Z motor moves the bond head along the vertical axis. This motor applies all of the force necessary
to make the bond. The bond head moves in three dimensional space to make a loop before it moves to
make the second bond.
A
F
E
B
D
C
A
B
Z Encoder Glass Scale
Wire Clamp
C
D
Transducer
Piezo Sensor
E
F
Flexure Assembly
Z Motor Assembly
Figure 1-2: Bond Head Components
1.2.3
Material Handling System
This Material Handling System (MHS) moves the substrates and their magazines automatically into
their working position during the wire bonding process. The Material Handling System (MHS) loads,
moves and removes leadframes during the bonding process. It also moves magazines from supply to
storage for the load and removal operations of the bonder. The MHS pulls in a lead frame, moves it to
and from the bond site and then removes the lead frame after bonding. Data about the Material
Handling System setup and operation can be found in the Material Handling System Manual of the
IConn PLUS ELA High Performance Ball Bonder manual set.
1.2.4
Lower Console
The lower console includes the card rack, the power supply, supply systems, the new programmable
pneumatic control unit, and cool down system. It also contains printed circuit boards for the bonder,
computer, and vision. See Chapter 2: Lower Console for more data.
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Material Handling System
Operator’s Guide
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IConn PLUS ELA High Performance Ball Bonder
1.2.5
Upper Console
The upper console includes the video monitor, signal light tower, wire feed equipment, a wire feed/
BITS, PCB, pneumatic equipment, EFO electronics, and a zoom microscope. See Chapter 3: Upper
Console for more data.
1.2.5.1
Wire Feed System (part of Upper Console)
The bonder uses a 2” diameter wire spool which is installed on a panel above the bond head. A motor
turns the spool to feed wire as necessary. Wire feed is monitored by an optical sensor, which signals the
wire feed motor. This keeps a constant length of wire between the spool and the capillary. The wire
spool holder is conductive and electrically connects the wire on the wire spool to the Bond Integrity
Test System (BITS). This gives one more path for the BITS return signal, which makes detection of
BITS NSOP and short tail (SHTL) errors more accurate.
A wire tensioner gives tension to the wire. The air guide lets off pressurized air to lift the wire and make
a loop. The controls on the MMI keypad is used to feed the wire manually. See Chapter 3: Upper
Console for more data.
1.2.6
Optics & Vision System
The electronic optical system used on the IConn PLUS ELA High Performance Ball Bonder includes a
dual magnification optics assembly, two video camera heads, bond site illuminators and a vision system
unit. All are installed on the front Y slide above the bond head. The electronic crosshair in the video
window of the GUI display shows the position of the capillary above the device during bonding
operations. Some optical parameters (lighting, etc.) are adjustable.
The machine includes a Pattern Recognition System (PRS) and Video Lead Locator (VLL) system for
image processing before bonding. Lead frames and their magazine operations are done by the automatic
Material Handling System (MHS) included into the bonder.
C
E
H
G
Q
L
J
A
D
R
I
F
K
M
B
N
O
P
A
B
C
D
E
F
G
H
I
To Vision System
To Vision System
Camera A
Camera B
High Magnification Relay Lens (Adjustable)
Low Magnification Relay Lens (Adjustable)
Fixed Relay Lens
Mirror
High/Low Beam Splitter
J
K
L
M
N
O
P
Q
R
Wide Angle Vertical LED (Blue)
Aperture
Wide Angle Vertical LED (Red)
Beam Splitter
Objective Lens
Oblique LEDs (Red/Blue)
Device
Neutral Density Filter
Diffuser
Figure 1-3: Dual Magnification Optics Assembly - Optical Path
See Chapter 4: Vision System and Optics for more data.
Operator’s Guide
Page 1-7
Introduction
Upper Console
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1.2.7
User Interface
User interface components installed on the lower console include the Man Machine Interface (MMI)
assembly. The MMI assembly includes a keypad, a three–button mouse and a tool drawer.
The machine software tells the user through a Graphical User Interface (GUI) shown on the LCD
monitor. You can select the options on the GUI to do machine functions and get access to program,
operation, and configuration menus. The two windows in the GUI show live bond site video and a
graphical view of the current process program. Other data (heater temperatures, X, Y, and Z axis
positions, battery status, etc.) are constantly shown on the screen.
1.2.8
Software
The software is divided by “modes”, with related menus put together in each mode.
Messages and prompts shows the machine status and ask for entry of necessary data. The keyboard and
three–button mouse are used to input when applicable. The monitor shows the error messages if there is
a system error.
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Introduction
User Interface
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IConn PLUS ELA High Performance Ball Bonder
Chapter 2: Interface
2.1 User Interfaces
2.2 Software and Graphic User Interface (GUI)
2.3 Software Navigation
2.4 Illumination Control and Configuration
2.5 Abbreviations used in the Software
Operator’s Guide
Page 2-1
Interface
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IConn PLUS ELA High Performance Ball Bonder
2.1
User Interfaces
This section gives data on the user interfaces for the IConn PLUS ELA High Performance Ball Bonder.
E
A
F
B
G
C
D
A
B
C
D
Light Tower
Microscope
Man Machine Interface (MMI)
Tool Storage Drawer
E Video Monitor
F Emergency Stop Button
G Work Light
Figure 2-1: User Interfaces
Select the user interface below:
2.1.1 Man Machine Interface
2.1.2 Emergency Off Button
2.1.3 Microscope
2.1.4 Work Light
2.1.5 Light Tower and Audible Alarm
2.1.6 Video Monitor
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Interface
User Interfaces
Operator’s Guide
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IConn PLUS ELA High Performance Ball Bonder
2.1.1
Man Machine Interface
The Man Machine Interface (MMI) is the primary user interface to teach and operate the machine. The
mouse, mouse buttons, function buttons, control buttons and the alpha and numeric keypads have more
than one function in the machine mode, procedure and status. The MMI control, motor stop, run/stop
and auto index buttons light up when they are set to ON. For more data on the MMI operation, refer to
Section 2.2.3 Man Machine Interface (MMI).
2.1.2
Emergency Off Button
The Emergency Off (EMO) button is the red button on the front of the bonder. You push it to remove
the electrical power to the machine. This button is electrically connected in series with the power button
on the front of the upper console.
To restart the bonder, turn the EMO button clockwise to disengage and set the button to the "out"
(released) position. Push the (red) power OFF button, then push the (green) power ON button to start
the bonder. If the EMO button is not in the "out" position, the bonder will not start.
2.1.3
Microscope
The zoom microscope is given for general inspection of the bond material. To use it, adjust and move
the microscope arm and move it to a position with the best field of view (FOV). You can move the
microscope out or fully remove this tool when it is not used.
2.1.4
Work Light
The work light is a high intensity lamp installed on a flexible extension. It can be used when more light
is necessary to see the work area. The work light is controlled by the software and is automatically off
during eyepoint teach and find sequence to prevent interference with PRS and VLL operations. The F9
(Work Light) button on the function bar sets the light status on or off but it does not operate during
eyepoint teach and find sequence.
Operator’s Guide
Page 2-3
Interface
Man Machine Interface
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IConn PLUS ELA High Performance Ball Bonder
2.1.5
Light Tower and Audible Alarm
Note: You can edit the signal lights and alarm. This includes: On, Off and Flash (for signal lights
only) for different error groups and conditions. Refer to chapter 5: Configure in Reference
Guide for more data.
The light tower has three signal light units to show different conditions. The alarm operates as set by
the user. The alarm stops when the condition is cleared. You can turn the ring at the bottom of the light
tower to adjust the alarm volume. The tables below show the default setup of the signal lights and
alarm:
Status/Signal
Status/Signal
Status/Signal
Status/Signal
“Normal Operation”
System Error
Warnings
Host Interface Error
Material Error
Vision Error
“Executing State”
Other Errors
Bonding Error
MHS Error
“Idle/Motor Stop State”
Pause/Stop State”
Executing/Material Error
Bonding/Material Errors
Definition:
Symbol
Meaning
R
Red
Y
Yellow
G
Green
☼
Flashing
♫
Alarm On
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Interface
Light Tower and Audible Alarm
Operator’s Guide
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IConn PLUS ELA High Performance Ball Bonder
2.1.6
Video Monitor
The color video monitor (at the top of the bonder) shows menus, dialogs, prompts, messages, toolbar
and function bar buttons, image windows and crosshair. These components are used to set up, calibrate,
program, and operate the bonder. All of the components shown on the monitor screen make up the
Graphical User Interface (GUI).
Figure 2-2: Video Monitor Screen
The monitor display is the primary source of machine and program data. The display items change
applies to the selected mode, current operation, and machine status. The primary display components
are: the mode bar, function bars, graphic and video displays with crosshair, menus, dialogs, information
boxes, temperature status and axis position indicators. For more data on these GUI items, refer to
section 2.2 Software and Graphic User Interface (GUI).
Push the button on the front of the monitor to set it ON or OFF. You can adjust the display properties
such as contrast and brightness with the display control menu. Push one of the control buttons on the
front of the monitor to open this menu. Refer to the IConn PLUS ELA Maintenance Manual for more
data on display control operations.
Operator’s Guide
Page 2-5
Interface
Video Monitor
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IConn PLUS ELA High Performance Ball Bonder
2.2
Software and Graphic User Interface (GUI)
This section contains basic data about the software which controls the operation of the IConn PLUS
ELA Ball Bonding Platform. You can find descriptions of the Graphic User Interface, displays and
other features that help you during bonder operations.
The software divides the bonder operations into modes. Each mode menu contains procedures related to
the mode. When you select the mode options, menus and dialogs appear with options.
Data prompts appear to tell you the machine status or to ask you to put in necessary data. The Man
Machine Interface (MMI) is made of an alphanumeric and a mouse to get user responses, if necessary.
The monitor also shows errors or warnings when there is a system problem or maintenance
requirement.
The interface gives cursor control on the monitor screen and MMI keypad control to move around the
GUI.
Here are the topics in this chapter:
2.2.1 Software Version Data
2.2.2 Monitor Screen and Elements of Screen
2.2.3 Man Machine Interface (MMI)
2.2.1
Software Version Data
Data on the software version installed on the bonder can be found in the SYSTEM ADMINISTRATION (SYS
ADMIN) mode. To see this data, select 8 SYS ADMIN → 3 SOFTWARE OPTIONS → 1 DISPLAY VERSIONS.
This causes a dialog to appear with the version and release dates of the primary software components.
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Software and Graphic User Interface (GUI)
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2.2.2
Monitor Screen and Elements of Screen
The monitor screen (on the top of the bonder) shows menus, dialogs, prompts, messages, windows,
help data, and function buttons. They are used to set up, calibrate, program, and operate the bonder and
MHS.
#2
#1
#3
#4
#6
#7
#5
#8
#10
#9
#11
#13
#12
#14
#15
#16
#17
#19
#26 #24
#30
#27 #25
#29 #28
#23
#18
#22
#21
#20
Figure 2-3: Video Monitor Screen Elements
Primary Screen Element
Definition
Mode Bar
(#1)
The ON mode is highlighted on the mode bar at the top of the screen. Modes
are AUTO, MANUAL, PROGRAM, CONFIGURE, CALIBRATION, UTILITIES,
DIAGNOSTICS, and SYS ADMIN (System Administration). To select a mode,
push the number (Hot Key) showed in the mode button or put the cursor on
the mode button and push B1 (left mouse button).
Data Box
(#2 and #3)
The data box on top (#3) shows the name of the current loaded process
program and the current time. The data box below (#2) shows you
instructions.
Axis Position Indicators
(#4)
At the top right of the screen are the X, Y, and Z position indicators. The
indicators show the positions of the crosshair (X, Y) and bond head (Z)
relative to the preset ‘zero’ points.
Mouse Button
Assignments
(#5)
Wire Count
(#6)
Operator’s Guide
Page 2-7
This display area shows you the function of each mouse button (B1, B2 and
B3) in the current operation. B2 relates to chessing for most operations. B1
and B3 assignments change according to the operation.
The wire count indicator is found at the top right of the screen, just below the
X, Y, and Z position indicators. The wire count indicator displays the number of
taught wires in the currently loaded process program.
Interface
Monitor Screen and Elements of Screen
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Primary Screen Element
Definition
GUI/ Windows Switch
(#7)
After you select the gray box, the display interface will switch to the Windows
based operating system. Equipment Manuals can be viewed on this desktop.
Do not do any other activity on this interface. Select the black box to switch
the display interface to the Bonder GUI.
Snapshot Tool
(#8)
The screen capture feature lets the user collect the screen image from the
bonder monitor directly. The image saved includes the user interface
elements, the graphic overlays (if any) and the live video image. The image
file can be stored to an external USB storage device (connected through the
bonder USB port) or to the Matrox hard drive.
Menu
(#9 and #10)
The menus show available items related to the selected mode or the previous
menu level. To exit a menu, push ESC or place the pointer on the title bar (the
white field at the top of a sub-menu) and push B1. To select a menu item,
push the number (Hot Key (#9)) of the item or position the pointer on the item
and push B1.
Dialog
(#10)
The dialogs usually appear when a menu item has been selected. The dialog
is a communication interface between you and the selected operation. Dialogs
can contain instructions on how to do a task, or data entry fields for you to put
in necessary data for the operation. Elements in the dialog for control include:
operation modes, slide bars, radio buttons, spin buttons, control buttons, and
data entry fields. Refer to Introduction section for more data on dialogs.
Display Windows
(#11 and #12)
The two display windows (large (#11) and small (#12)) on the GUI. One shows
live video and the other shows a graphic representation of important
components that specify the bond sites. To swap between these two displays,
select the SWAP F1 function button.
Crosshair
(#13)
The crosshair is a graphic image on a display window. The crosshair has two
purposes:
1. To select reference points
2. To select bond locations. In the second function, the crosshair shows the
position of the capillary over the device. When the pointer (arrow head) is
placed in the video or graphics windows, it takes the shape of a small
crosshair. Its purpose is to select a location to which the main large
crosshair is to be positioned. To position the crosshair to the pointer, push
the middle mouse button B2.
"Dummy State" Button
(#14)
This button on the right side of the GUI shows the "dummy state" color and
condition when you make a selection or change the global validation switch
setting. When you select this button, the "dummy state" dialog appears.
Button
Condition
and Color
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Global
Validation
Switch
“Dummy
State”
Material ID
Validation
Options
Command
ON
Normal
Per configuration
of each validation
Available
OFF
Dummy
Disabled
Available
OFF
Local
Disabled
Available
Interface
Monitor Screen and Elements of Screen
Operator’s Guide
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IConn PLUS ELA High Performance Ball Bonder
Primary Screen Element
FAB and Bond Buttons
(#15)
Definition
The FAB or Bond buttons are on the right side of the GUI read and show the
flow rate.
•
Green: Within flow rate limits
•
Red (with value): Out of flow rate limits
•
Red (with "X.XX"): Pressure is out of limits (too high or too low)
•
Blue: Gas supply OFF
Light Tower Override Icon The Light Tower Override (LTO) feature lets the user to override the normal
(#16)
light tower states for all modes of the bonder. The ‘override state’ function can
help to identify equipment conditions to the user. To access the ‘Light Tower
Override’ function, click on the desktop shortcut icon labelled ‘LTO’ adjacent to
the bottom right corner of the GUI display.
Illumination Preset Icon
(#17)
This is a shortcut icon, when selected shows the LOAD FROM PRESET menu
taken from the F10/Optical dialog. This lets the user to select different
illumination values from a list of available presets. The list of available presets
is dynamic and determined by the state of the machine.
Privilege Level Icon
(#18)
This is a quick connect button to the Select Privilege Level menu. Four access
levels can be selected from here: Anyone, Operator, Supervisor, and
Administrator. A password is required to effect the change.
Temperature Status/
Buttons
(#19)
The temperature status/buttons are found at the bottom of the display screen,
just above the function bars. These buttons report the temperature of the preheat (Pre), bond (Bond), and post-heat (Post) sites. The data updates every
five seconds. Select any one of the Status buttons causes the Temperature
Configuration dialog to appear. Refer to Configuring the Machine section in
the Reference Guide for data related to temperature configuration.
Host Interface (GEM)
(#20, #21 and #22)
The three GEM buttons are the GEM Terminal Message (#20), GEM Control
State (#21) and GEM communication state (#22). These three GEM (SEMI
E30 Generic Model For Communications and Control of Semi Equipment)
buttons control the exchange of data between an external (host) computer
and the bonder.Refer to Utilities Chapter in the Reference Guide for more
data.
Operator’s Guide
Page 2-9
Factory Automation
(#23)
Lets you send data (messages) to the host. Refer to Utilities Chapter in the
Reference Guide for more data.
Battery Status
(#24)
Make sure that the battery status B on GUI is highlighted in green, which
represents normal function. If battery status is highlighted in red, battery box
needs to be replaced.
Air Status
(#25)
This display-only indicator shows that the status of the bonder input air
pressure. The background of the indicator is white when input air pressure is
52 psi or higher. The background of the indicator turns red when input air
pressure falls below 52 psi. Set the input air pressure regulator at 55 psi for
normal operation.
Interface
Monitor Screen and Elements of Screen
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IConn PLUS ELA High Performance Ball Bonder
Primary Screen Element
Definition
Magnification Control
(#26)
Dual magnification optics is standard on the IConn PLUS ELA bonder. The
standard optics configuration gives a different magnification of the bond site:
low magnification (2X Standard), and high magnification (6X Standard).
A High/Low magnification control button is found at the bottom of the GUI
screen just above the upper function buttons. This control button lets you
change between low and high magnification.
The button shows the current magnification setting (i.e., H = High
Magnification, L = Low Magnification). When the button’s background is gray,
magnification control is locked and you cannot change the magnification.
When the button’s background is white, you can change the magnification
with the use of the button. The magnification setting can also be changed by
toggling the setting of MAGNIFICATION in the Adjust Lighting dialog.The
Adjust Lighting dialog appears when the F10 function button is selected from
the monitor screen or when the F10 function key is pushed on the MMI.
When the magnification setting is switched, the XY Table moves to center the
active optics over the location previously center with the former optics. This
motion is dependent upon accurate crosshair offset values for both
magnification settings.
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Monitor Screen and Elements of Screen
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Primary Screen Element
Definition
The summary below gives the instances when you can and cannot change
the magnification setting.
•
When the bonder is idle (i.e., not bonding or editing), the context of the
Adjust Lighting dialog is INSPECTION. Magnification change is enabled
•
When working in MANUAL mode, there are no restrictions
•
During AUTO mode operations, magnification remains as it was taught.
Magnification change is enabled during Sequence Stop
•
During PROGRAM mode, the restrictions below apply:
• MHS TEACH: magnification forced to Low; change is disabled
• Teach REFERENCE SYSTEM: refer to the row below
• WIRES/PARAMETERS: magnification forced to Low; change is
enabled
• Edit DEVICES: no restrictions
• ALIGN REF: magnification remains set as it was taught
•
Magnification change is disabled when working in the modes below:
• CONFIGURE
• CALIBRATION (except PRS and CROSSHAIR OFFSET)
• UTILITIES (except EDIT TEACH DEFAULTS)
• DIAGNOSTIC
• SYSTEM ADMINISTRATION
Magnification within
Reference Systems
The guidelines below are for magnification within reference systems:
•
Each feature type can have only one magnification (i.e., all eye points in a
set must have the same magnification; all operator points must have the
same magnification; all sites must have the same magnification)
•
Magnification changes are locked out when one element of a feature type
is taught. Magnification changes are locked until all the elements of this
feature type are retaught or new feature type is taught.
ZTC Status
(#27)
This GUI button shows the status of the Z axis Temperature Controller (ZTC).
The ZTC electronics keeps a set temperature for the Z axis motor
environment in the bond head. If the monitored temperature goes above the
set tolerance, the “Z” button on the GUI turns red and auto bonding stops.
Likewise, if the temperature goes below the set tolerance, the “Z” button on
the GUI turns blue and auto bonding stops. The “Z” button is used to access
the set point and tolerance configuration of the ZTC. ZTC configuration is
done by an approved personnel. You need a password for this.
Function Buttons
(#28 and #29)
The 20 function buttons on the upper (#29) and lower (#28) function bars on
the bottom of the monitor display give quick access to some common mode
functions. To set a lower function button to the ON/OFF state, push its related
function key on the MMI. To set the upper functions ON/OFF state, push
SHIFT THEn F# key on the MMI. To select the upper and lower function
buttons, put the cursor on the button and push mouse button B1.
Machine Status
(#30)
These three indicators show the current status of the bonder. For example, if
the bonder is in the “Stop” mode and AUTO INDEX is latched, their related
indicators are highlighted in the machine status. Likewise, if MOTOR STOP
has been latched, the “Motor Stop” and “Stop” indicators are highlighted in the
machine status.
Procedural Messages
Warning Messages
Operator’s Guide
Page 2-11
Various procedures, such as Crosshair Offset, have on-screen messages in
dialogs to guide you through the procedures.
Warning messages are displayed to tell the user that:
•
An action about to be done can require additional operations;
•
The operation goes near a pre-set limit. For example, Video Lead Locator
will have to be taught again.
Interface
Monitor Screen and Elements of Screen
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Primary Screen Element
Error Messages
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Definition
Error detection generates an applicable message on the monitor. It often
gives corrective instructions. Error messages can describe a MHS
malfunction or a defect in the program or device. For examples PRS/VLL
teach or find failure, unsatisfactory data entry, missing wire, missing ball or
machine failure.
Interface
Monitor Screen and Elements of Screen
Operator’s Guide
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IConn PLUS ELA High Performance Ball Bonder
2.2.3
Man Machine Interface (MMI)
The MMI is the primary user interface with controls to teach and edit process programs, and operate the
machine. The mouse, mouse buttons, numeric keypad, function keys and alpha keypad have multiple
assigned functions in different operational mode, procedure and machine status. The named control
buttons (MOTOR STOP, RUN/STOP and INDEX, etc.) have the same function in all operational modes and
procedures and button LED illuminates when they are set ON.
A
B
C
D
E
F
Function Keys
Motor Stop
Run/Stop
Index
Auto Index
Alpha Keypad
G Numeric Keypad
H Tensioner Control/Indicator
I
Mouse
J Tab Keys
K Wire Feed Control/Indicator
L Air Guide Control/Indicator
Figure 2-4: Man Machine Interface (MMI)
Key
Definition
FUNCTION KEYS
The ten (10) function keys on the MMI relate to the upper and lower function
bars shown at the bottom of the monitor screen. Assigned functions change
with machine status. Push the function key to select the related function from
the bottom function bar. Hold SHIFT selects the top row functions. For example:
to save a process program, press SHIFT + F1.
TAB
Moves the cursor from data entry field to data entry field. If the dialog contains
multiple pages, the up/down Tab keys may be used to navigate up and down
through the pages.
CONTROLS AND
INDICATORS
Electrical and pneumatic controls/indicators for the wire feed are found on the
front face of the upper console. The electrical controls and indicators are:
WIRE FEED Key: Wire spool rotates to feed wire when button is pushed
•
TENSIONER Key: Push to set the vacuum ON and OFF. Applies air
•
pressure to give wire tension
TENSIONER Indicator: LED illuminates when vacuum to wire tensioner is
•
ON
AIR GUIDE Key: Push to set the air pressure ON and OFF. Gives an air jet
•
to direct and support the fed wire
AIR GUIDE Indicator: LED illuminates when air pressure to air guide is ON
•
ESC (ESCAPE)
Menu: Exits the current menu
Dialogs: Activates callback attached to the CANCEL button
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Page 2-13
Interface
Man Machine Interface (MMI)
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Key
Definition
ARROW KEYS
Arrow keys have different functions in different modes or menus of machine
operation. Some functions of the arrow keys are:
•
When XY chessing is selected from the upper function bar, push the left
and right arrow keys to move the bond head in the X-axis. Push the up and
down arrow keys to move the bond head in the Y-axis.
•
When Z chessing is selected from the upper function bar, push the up or
down arrow key to move the bond head up or down in the Z-axis
•
All four arrows are used to move text cursor to edit a process program
name, or to select the name of a prerecorded program
•
The up and down arrow keys can be used to add or decrease the value
contained in a data entry field of a dialog
NUMERIC KEYS
Used as a ‘Hot Key’ to make selections from the mode bar or to activate a mode
of operation in a dialog. The numeric keys are also used to enter values into
data entry fields.Alpha characters are entered by way of the alpha keypad. The
zero key may be used in place of and as the DONE or NEXT buttons in dialogs.
SHIFT
•
•
•
ENTER
To register data into bonder memory, push ENTER after data input. If a menu
item is highlighted with a box, push ENTER to select the item.
MOTOR STOP
Select to disable all servo motors. This function does not remove power from
the circuit boards or power supply. Bonder and MHS operation stop. The
bonder enters standby mode, and shows the standby mode dialog. Both key
switches must be pushed at the same time to activate MOTOR STOP.
RUN/STOP
Enables or disables machine operation. The key light is ON while the machine
is in the auto mode. Push the key while in auto mode to enable sequence stop
mode. The key operates in auto and stop only.
INDEX
Commands the MHS to do one index cycle. The function is applicable under
conditions given by the bonder status.
AUTO INDEX
Commands the MHS to index after every device. Applicable in auto mode only.
ALPHA KEYPAD
The alpha keypad lets you input alpha characters.
MOUSE/MOUSE
BUTTONS
The basic function of the mouse is to move the pointer and cursor on the
screen. It also controls table movement (chess) in the X and Y axes. When
enabled and the middle mouse button B2 is pushed, the three mouse buttons,
left B1, middle B2, and right B3, have functions which are specified by the
software mode and the operation. During operations, the current use for each
mouse button is shown with indicators in a message box on the monitor screen.
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SHIFT+ESC: All menu trees are exited, all the way to the mode bar
SHIFT+MINUS/DECIMAL POINT: To produce a minus (-) character
SHIFT+ F#: Selects the related upper function button
Interface
Man Machine Interface (MMI)
Operator’s Guide
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IConn PLUS ELA High Performance Ball Bonder
2.3
Software Navigation
The mode bar at the top of the screen gives access to the primary sections of the software. When the
software is first initialized, the numbers 1 through 8 appear in front of the mode names. To select a
mode, put in the number (hot key) or put the cursor (pointer) on the applicable button and push B1. The
numbers go out of view when the mode menu appears. These numbers appear again when you push ESC
and exit the menu.
See the figure for the first-level menu for each mode.
Figure 2-5: Level 1 Menu Tree
A brief description of each mode is shown:
Mode
Description
AUTO
The primary purpose of AUTO mode is to do wire bonding without user aid. This is
done with a basic process cycle specified by the process program in memory. The
basic process cycle is made up of three primary components: align material, bond
material and index material. At Sequence Stop, an option of AUTO mode, changes
can be made to program parameters, bond positions and related settings while in
AUTO mode. After corrections are made, process can be restarted on the same or
next device.
MANUAL
In MANUAL mode, no process program is necessary, but you can bond a wire and
make parameter changes. MANUAL mode lets you find the best wire parameters
before you teach the process program. MANUAL mode also lets you operate related
tasks during the servicing.
PROGRAM
In PROGRAM mode, you can teach or edit a reference system or process program.
You can also load a reference system or process program into memory, save it to
hard disk, memory device, or clear it from memory.
CONFIGURE
CALIBRATION
CONFIGURE mode lets you configure the bonder for production requirements.
CALIBRATION mode lets you teach and calibrate the machine such as the X and Y
servo, bond head, PRS, workholder and magazine handler.
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Interface
Software Navigation
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Mode
UTILITIES
DIAGNOSTIC
SYS ADMIN
Description
The UTILITIES mode lets access to process program file operations, edit MDP
(machine dependent parameter), host interface connections, wire measurements,
and monitor statistical summary.
The DIAGNOSTIC mode gives access to do tests for the temperature controllers and
several of the primary MHS components. The current condition of the bonder’s
sensors can also be shown.
The SYSTEM ADMINISTRATION mode gives access to tools for password control
and privileged operations. This mode also lets you examine the bonder software
version. The system date and time can also be changed.
Select the links below for the software navigation options:
2.3.1 Introduction to the Menu Tree
2.3.2 Example of Navigation between Menus and Dialogs
2.3.3 Dialogs
2.3.4 Function Bar (Upper)
2.3.5 Function Bar (Lower)
2.3.6 Display Windows
2.3.7 Chessing
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Interface
Software Navigation
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IConn PLUS ELA High Performance Ball Bonder
2.3.1
Introduction to the Menu Tree
The software is put as a menu tree with the eight modes (AUTO, MANUAL, etc.) as the primary sections of
the bonder software. When a mode is selected, the secondary modes appear as menus or dialogs. Each
item selected from a menu causes the next menu or dialog to appear. Some mode bar, menu or dialog
items can be grayed out (OFF). This shows that the function cannot be selected at the current time. OFF
modes or menu items occur when:
•
Operations are not possible because of the condition of the bonder operation
•
The item is an option and has not been installed in the software
•
The item is software controlled and cannot be changed
Note: To select an item by number:
1) Enter the number to the left of the mode or menu item hot key.
2) Use the mouse to put the cursor on the item and push the left mouse button B1.
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Interface
Introduction to the Menu Tree
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2.3.2
Example of Navigation between Menus and Dialogs
Modes, menus, and dialogs operate as shown below. See Section 2.3.3 Dialogs for instruction on
dialogs. The example shows a change of the MHS Index Utilities as a Manual operation.
Select the MANUAL mode and the background turns white. The first-level menu appears at the far left.
Then, select the MHS UTILITIES from the menu and a second-level menu appears in position of the menu
before.
MODE
LEVEL 1 MENU List of Submodes (can include dialogs)
The Title of the Mode. The Mode background is white.
TITLE Submode selected from Level 1 Menu. Background is white.
LEVEL 2 MENU List of Submodes (can include dialogs)
PBN Pushbutton that goes back to Level 2 Menu. Background is gray.
TITLE Submode selected from Level 2 Menu. Background is white.
LEVEL 3 MENU List of Submodes (can include dialogs)
Go to a Menu or Mode:
1.
2.
Key in the “Hot Key” number next to the mode or function listing.
Put the pointer on the mode or function and push B1 or highlight the mode or function and
push ENTER.
Go to a Menu before or Mode before:
1.
2.
3.
4.
Push the ESC button on the keyboard to get access to a level before.
Click on another Mode if the current menu is at level 1.
Click on the Mode or the menu title if the current menu is at level 2.
Click on the DONE or CANCEL button if the current menu is at level 3.
Figure 2-6: Navigation from Menu to Menu
INDEX UTILITIES is then selected from the MHS Utilities menu and the Index Utilities dialog appears in
its position. This dialog lets you examine, change or apply the changes. To change INDEX TIMES, enter a
value into the text box, move the slide bar, or click on the D button (default value). To disable or enable
correction, verification and strip feed, or to make the changes made to the necessary index mode, select
the applicable radio button.
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Example of Navigation between Menus and Dialogs
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IConn PLUS ELA High Performance Ball Bonder
The menus and some dialogs contain numbers to the left of the options. These numbers are “Hot Keys”
to get access to the next level menu or function dialog. Push 2 to go to the MANUAL mode when there are
numbers adjacent to the modes. Push 3 to go to the MHS Utilities menu with the Manual menu opened.
Then push 1 to go to the INDEX UTILITIES with the MHS Utilities menu opened. You can select on the
menu title or push ESC to go back to the menu before.
A
B
D
F
E
C
A
B
C
First-level Menu
Second-level Menu
Third Level Menu
D
E
F
Accept the setting, but stay in the dialog
Accept the settings and go back to menu.
Reject the settings and go back to menu
Figure 2-7: Menu/Dialog Navigation Example
Move the cursor to the selection with the use of the mouse and push B1. The user can also use the “tab
keys” on the MMI to highlight the selection and push ENTER.
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Interface
Example of Navigation between Menus and Dialogs
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2.3.3
Dialogs
When you select a menu item, a dialog appears. The dialog tells you about the selected function.
Dialogs can contain instructions on how to do a specified task or prompt the user to enter data. Dialogs
give access to most functions during process program teach/edit or bonder operation. To start the
function, select a function in the dialog or push the hot key.
Push the control button APPLY to start the specified operation or change the parameter in the dialog for
it to stay open. Usually, the selection of the control buttons NEXT or DONE, or push on the 0 button on
the keypad to close the dialog.
The sections below contain the elements that make up a dialog.
Dialog
Default Button
Text Box
Definition
A square button with a “D” label. To set the text box to a specified value.
A text box is used to change the value of a parameter or setting. In the text box
example, the LINE TOLERANCE is set to 0.500 mils. This setting can be
changed by with the use of one of the procedures below:
•
Push the hot key (5 in the example). Then, enter the new value and push
ENTER
•
Use the up/down tab keys on the MMI to move to the highlight box on the
item, then push ENTER. Enter in the new value and push ENTER
•
Put the mouse cursor on the item and push the left mouse button B1. Then,
enter in the new value and push ENTER
The software uses some dialogs that lets you adjust a slide bar or push the
default button D to change the contents of the text box. This type of a dialog will
also let you enter the data directly into the text box.
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Slide Bar
Use the slide bar to change the value of a setting along its full range. The slide
bar is a horizontal or vertical bar with a center button used to make the
adjustments. To change the value of the text box, put the cursor on the button,
push and hold mouse button B1. Use the mouse to move the button to the
specified position of the value shown.
Spin Button
Select the button to add (up arrow) or decrease (down arrow) the value in the
related text box.
Interface
Dialogs
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IConn PLUS ELA High Performance Ball Bonder
Dialog
Definition
Menu
Some dialogs contain options that are shown in a selection sequence known as
a menu. The menu item can be an “on/off” panel. Push the panel again and
again causes its indicator to the right to show AUTO RUN or DRY CYCLE. When
selected, other items in a menu can show a different dialog. For example, when
Auto Run is selected, the Auto Configuration dialog is shown. A menu item can
also be selected with the item hot key on the MMI.
The option 8 in the example causes the “Miscellaneous” dialog to appear.
When a menu first appears, a blue box highlights the default menu item. You
can put the blue box on an item when you push the up or down on the Tab key.
Then, you can select the item when you push ENTER.
Menu items can also show a ‘mode of operation’. When a mode is selected,
instructions appear in the status bar that shows how to do the operation. Mode
menu items are found in the dialogs related directly to the teaching and editing
of process programs.
You can use one of these procedures to select a menu item:
•
Push the hot key of a mode
•
Use the tab keys to go to the highlighted box, then push ENTER
•
Use the mouse, put the cursor on the item, then push B1
Scroll Bar
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Page 2-21
A horizontal or vertical bar with a center button used to show more text or
options. In the example shown below, the bar is used to show more file names.
To show more text or options, put the cursor on the button, push and hold B1
and drag it. For small movements, put the cursor on an end arrow and push B1.
For large movements, put the cursor in an open area in the scroll bar and push
B1.
Interface
Dialogs
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Dialog
Definition
Radio Button
Only one radio button for each group of radio buttons can be active at a time. To
select a radio button, move the mouse to put the cursor on the button, then
push B1.
Control Buttons
Each dialog contains a minimum of one control button. All control buttons have
labels to show the possible steps. When the button is selected, the operation
starts. If you select a control button, a new dialog can appear (see NEXT below)
or complete an operation (see OK below). Other control buttons are: DONE,
APPLY, LOAD, CANCEL, and SAVE.
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Interface
Dialogs
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2.3.4
Function Bar (Upper)
The upper function bar gives easy access to the 10 most used functions. When selected, these buttons
change in color and can show a dialog. The mode bar is disabled while the dialog is shown.
Figure 2-8: Function Bar (Upper)
The “SHIFT + function” buttons select the operation on the upper function bar. For example, push the
“SHIFT+F10” buttons to park the indexer. You can also select a function when you move the mouse, put
the cursor on the function button and push B1.
Function Button
“Save Prog”
(SHIFT + F1)
Saves the current process program to the default drive.
“OPE State”
(SHIFT + F2)
The OPE (Overall Production Effectiveness) button shows the current machine
condition (Productive) with background color (green) specified in SEMI E10
Standard. To monitor production data, refer to the Auto, Manual and Program
mode sections in the Reference Guide.
Configure Graphics
Display
(SHIFT + F3)
Shows a dialog which lets you show or hide bond site labels, wire labels, and
the graphics overlay.
W/H Oper
(SHIFT + F4)
Workholder Operations. Shows the Workholder Utilities menu (refer to Section
Workholder Function Bar Utilities in the Reference Guide).
“Mag Oper”
(SHIFT + F5)
Magazine Handler Operations. Shows the Mag Handler Utilities menu (refer to
Section MHS Manual Mode Utilities in the Reference Guide).
EFO
(SHIFT + F6)
Do an electronic flame-off of the wire.
“Bnd Ht Relrn”
(SHIFT + F7)
Operator’s Guide
Page 2-23
Definition
Bond Height Relearn. Forces the bond head Z axis to teach itself the point at
which the capillary touches the work.
XY Chessing
(SHIFT + F8)
Push the button to enable or disable X-axis and Y-axis chessing. Z chessing is
disabled when this feature is enabled. This feature enables small chessing with
the use of the MMI arrow keys to control X and Y axes movement (see Utilities
of the Reference Guide).
Z Chess
(SHIFT + F9)
Turns Z chessing on or off. XY chessing is disabled when Z chessing is
enabled. This feature lets the use of the UP and DOWN arrow keys to control Zaxis movement (see Utilities Chapter of the Reference Guide).
Park Indexer
(SHIFT + F10)
Forces the indexer on the workholder to park away from the center of the
workholder.
Interface
Function Bar (Upper)
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2.3.5
Function Bar (Lower)
The lower function bar contains 10 function buttons. The function associated with a button can change
with the mode or the step selected.
Figure 2-9: Function Bar (Lower)
Standard Function Options
F1
F2
F3
F4
F5
F6
F7
F8
F9
F10
Swap
Z Video
Zoom In
Zoom Out
Center
Park
B/H
USG On
Clamp
Open
Work
Light
Optical
USG Off
Clamp Shut
Function Button
Definition
Interchanges the video and graphical windows.
F1 SWAP
F2 Z VIDEO
Digitally zoom in on the video image. The three video zoom levels are normal
(100%), 200% and 400% magnification. Push the F2 button again and again to
see through the three levels.
F3 ZOOM IN
Zoom in on the graphical image. Magnification adds by one level each time the
button is pushed. 19 levels are available.
Zoom out of the graphical image. Magnification decreases by one level each
time the button is pushed. 19 levels are available.
F4 ZOOM OUT
Put the XY Table in the center of its travel limits.
F5 CENTER
Put the bond head to the right rear corner of its travel limits.
F6 PARK B/H
Sets the Ultrasonics to ON or OFF. The button shows the selected condition.
F7 USG ON/OFF
F8 CLAMP OPEN/SHUT
Opens or closes the wire clamps. The button shows the selected condition.
F9 WORK LIGHT
Sets the auxiliary work light ON or OFF as necessary. The software turns the
work light off during bonding independently.
F10 OPTICAL
The Adjust Lighting dialog appears. You can adjust the vertical and oblique
illumination to give a satisfactory view of the work surface in the video display.
Teach Lead Function Options
F1
F2
F3
F4
F5
F6
Swap
Z Video
Zoom
In
Zoom Out
Center
Park
B/H
Function Button
F8 FLIP LEAD
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F7
F8
F9
F10
Flip Lead
Work
Light
Optical
Definition
Rotates the graphic lead representation 180° from its current orientation. The
closed end of the graphic lead is the tip of that lead.
Interface
Function Bar (Lower)
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IConn PLUS ELA High Performance Ball Bonder
Teach Pad Function Options
F1
F2
F3
F4
F5
F6
Swap
Z Video
Zoom
In
Zoom Out
Center
Park
B/H
Function Button
F8 “ROTATE PAD”
F7
F8
F9
F10
Rotate
Pad
Work
Light
Optical
Definition
“Rotate Die Pad” lets you turn the die pad teach box between 0 and 360 in 45
intervals each time the button is selected. This lets you set a rectangular teach
box at the correct angle when you teach the die pads.
Teach Wire Function Assignments
F1
F2
F3
F4
F5
F6
F7
F8
F9
F10
Swap
Z Video
Zoom
In
Zoom Out
Center
Park
B/H
Repeat
Delta
Repeat
Wire
Work
Light
Optical
Function Button
2.3.6
Definition
“F7 REPEAT DELTA”
This function automatically teaches the current wire with the use of the same
related change in position of the two wires before. The delta is the pattern of die
pads and leads which are skipped.
“F8 REPEAT WIRE”
This function automatically teaches the current wire with the use of parameters
identical to those used by the wire immediately taught.
Display Windows
•
•
Operator’s Guide
Page 2-25
Video Display
The video image seen by the camera is shown on the screen in one of the two display windows.
Initially, this image is shown in the larger window. The SWAP F1 function button changes the
video image and graphical image between the two display windows.
Graphical Display
This is an electronic image of reference points (eye points and operator points on the leadframe
and die), leads and die pads made in the process program. Initially, the image is shown in the
smaller window found at the lower left of the screen. The SWAP F1 function button changes the
graphical image and video image between the two display windows.
Interface
Display Windows
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2.3.7
Chessing
The term 'Chess' applies to the manual movement of the bond head in the different axes of the Bonder.
XY chessing and Z chessing are not enabled at the same time. To do an X-axis chess is to move the
bond head left and right while a Y-axis chess is to move it front and back. To chess with the mouse and
mouse button B2, put the cursor in the video or graphic window.
XY chessing limits are shown as the center black area (bondable area) in the Graphics window. The red
area shows the area which is out of the limits. If the user tries to chess in one of the windows and
reaches the limit, an error dialog appears and you cannot chess further in the same direction. To
continue, the user must select OK in the error dialog. To chess in the Z-axis is to move the bond head up
and down. Chessing properties for the bonder are given in the sections below.
SWAP
Video Display
Graphic Display
Figure 2-10: Video and Graphic Displays
Coarse XY chessing can be done with the use of one of two methods. The first method is to put the
mouse cursor over the target within the graphics or video window and push the mouse button B2. The
bond head then moves and put the crosshair over the target.
The second method is to select the XY chessing button on the upper function bar (see Section
2.3.4 Function Bar (Upper)). The cursor changes to a double-ended arrow whenever the cursor is
placed on the vertical or horizontal line of the crosshair. As long as the double-ended arrow is visible,
movement will only happen in the X or Y axis whenever B2 is pressed.
Note: When XY axis chessing is enabled on the function bar, the user can still use the first method
of coarse chessing.
Fine XY chessing can be done with the use of one of two methods. The first method is to push and hold
mouse button B2. This action causes the fine movement of the crosshair over the target area. Once B2 is
released, the crosshair stops. The second method is to select the XY chessing button on the upper
function bar (see Section 2.3.4 Function Bar (Upper)). Push the up or down arrow key causes fine Y
axis movement of the bond head. Push the left or right arrow key causes fine X axis movement of the
bond head).
To do a Z chess, push the Z CHESS button on the upper function bar. It lets the user chess the Z axis of
the bond head. With the button selected, Z axis chessing is done either with the up or down arrow key
on the MMI numeric keypad.
The chessing restrictions below apply for the Bonder:
•
XY chessing and Z chessing are never enabled at the same time
•
The bond head cannot be chessed during an index cycle
•
Chessing is limited to within the bondable area. An error dialog will appear if the user attempts to
chess outside of the bondable area. Any further chessing (in the limit direction) is prevented
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Chessing
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IConn PLUS ELA High Performance Ball Bonder
2.4
Illumination Control and Configuration
Select the OPTICAL F10 button on the lower function bar or push the F10 button on the MMI to get access
to the Adjust Lighting dialog.
Figure 2-11: Adjust Lighting Dialog
Good illumination at the bond site is necessary when you teach a process program. When you adjust the
illumination values, these conditions apply:
•
The illumination levels are set by the illumination calibration
•
Make sure that the illumination is bright and clear with a good contrast. Keep the intensity away
from saturation. If you enter a value that is more than 255 for the Illumination values on a
calibrated machine, a warning appears
Figure 2-12: Warning
Select CANCEL to set the values to 255. The Adjust Lighting dialog will show up again. If the
user selects OK, the setting before stays.
•
Use only vertical illumination when you teach the die pads and reference points on the die
•
When you teach a lead, use the vertical illumination first, then with oblique illumination, if
necessary
•
The vertical and oblique illumination (standard configuration) can be adjusted for best contrast
and a clear field of view (FOV)
•
Red light is used for High Mag while blue light is used for Low Mag
Refer to the ‘illumination and magnification’ section in the Programmer’s Guide for more data for
illumination and magnification settings during process program teach.
Operator’s Guide
Page 2-27
Interface
Illumination Control and Configuration
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2.5
Abbreviations used in the Software
The abbreviations shown below are most used in menus, dialogs and help or data messages.
Abbreviation
Definition
Admin
Administration
Alt
Alternative
Calc
Calculation
Cal or Calib
Calibration
Cap
Capillary
Chg
Change
Config
Configuration
Dep, Depd
Depend, Dependency
Dim
Dimension
Dist
Distance
EFO
Electronic Flame-Off
Grip
Gripper
ID
Identifier
I/O
Input and Output
MHS
Material Handling System
MMM
Material Movement Manager
Opr
Operator
Param(s)
Parameter(s)
Proc
Process
Prox
Near
PRS
Pattern Recognition System
Pnt(s)
Point(s)
Ref
Reference
Sys
System
USG
Ultrasonic Generator
Val
Value
VLL
Video Lead Locator
w/
with
W/H
Workholder
Xhair
Crosshair
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Interface
Abbreviations used in the Software
Operator’s Guide
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IConn PLUS ELA High Performance Ball Bonder
Chapter 3: Operation
3.1 Machine Start Up Introduction
3.2 Power Up Sequence
3.3 Load/Save/Clear Menu
3.4 Operating Procedures
3.5 Product Conversion
3.6 Recovery Operations
3.7 Power Failure Recovery (PFR)
Operator’s Guide
Page 3-1
Operation
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IConn PLUS ELA High Performance Ball Bonder
3.1
Machine Start Up Introduction
This section gives a description of the bonder start up sequence and related setup procedures. Make
sure that you correctly install the bonder and capillary, connect the air and power and use the correct
magazines, leadframes and components.
Select the topics below for the basic operations of the IConn PLUS ELA High Performance Ball
Bonder.
3.2 Power Up Sequence
3.3 Load/Save/Clear Menu
3.4 Operating Procedures
3.5 Product Conversion
3.6 Recovery Operations
3.7 Power Failure Recovery (PFR)
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Machine Start Up Introduction
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IConn PLUS ELA High Performance Ball Bonder
3.2
Power Up Sequence
For more data on the power up sequence of the bonder, refer to the figure and the topics that follow. It
takes approximately five minutes for the MOTOR STOP mode to appear after the power switch is set to
ON. During this procedure, the bonder loads the operation software onto the bonder memory from the
hard disk, do different checks and subsystem initializations.
Power Switch ON
(See Caution Below)
Software Loads, Selftest & Initialization
Bonder in Motor Stop
Mode
XYZ Limit Seeking
MHS Positioning
MHS/ Bonder
Configuration and
Calibration (If
Required)
Rail Height Verification
Bonder Ready
Teach Heat Block
Figure 3-1: Power Up Sequence
Some of the tests, such as the light tower and worklight test can be seen. Other tests that are done at the
board level and cannot be seen. Errors that occur during power up sequence appear on the GUI after the
bonder loads the software. When the bonder exits MOTOR-STOP mode, the power up sequence continues
the GUI instruction dialogs. Follow the instructions and do the sequence.
CAUTION:
To prevent damage to machine electronics, follow these rules to power up the machine:
1.> Clear any jams.
2.> Deactivate (pull out) the Emergency Off switch.
3.> Press STOP on the Start/Stop switch.
4.> Press START on the Start/stop switch. Do not press START and STOP switch continuously. Allow at least 15
seconds between power up and power down cycles.
Note: The ‘Fault’ LEDs on the stepper boards stays ON until the software load is completed and the
stepper motors are initialized. After the motors start and no error occurs, the ‘Fault’ LEDs set
to OFF.
3.2.1
Software Load and Automatic Test
(1)
The bonder downloads the EFO firmware:
The EFO firmware automatically downloads the latest firmware version when it is available.
•
When the bonder starts up and a new firmware version is detected, an EFO firmware
update is done automatically
•
When the firmware is downloaded, it applies immediately after the bonder restarts
Bonder starts to download the firmware and get one of these results:
•
Downloads the firmware correctly and restarts
•
Downloads the firmware, but fails. Speak to your nearest K&S customer support
personnel
•
Bonder does not download firmware. The bonder initializes
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Operation
Power Up Sequence
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(2)
Machine Configuration Data Check:
The bonder does this check at the start. This is to make sure that the machine configuration data
is correct for bonder operations. If the machine configuration data is incorrect, error 1008
“Machine Configuration Data Failed” appears (see figure).
Figure 3-2: Error 1008
When you select 5 MORE, a dialog with more data on the error appears.
Figure 3-3: Error 1008 - More
Note: A PFK is necessary for correct machine data configuration. Speak to your nearest K&S
customer support personnel.
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Operation
Software Load and Automatic Test
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IConn PLUS ELA High Performance Ball Bonder
3.2.2
Motor Stop Mode
After the bonder initializes, completes the automatic tests and power is applied, it enters Motor Stop or
Standby mode (the motors and solenoids are not energized). The Motor Stop mode dialog appears.
Select OK to exit this dialog.
Figure 3-4: Motor Stop Mode Dialog
The bonder enters the Motor Stop mode for these conditions:
•
The power is ON and the bonder initializes. After the initialization is completed, the machine
enters STANDBY mode
•
Push the MMI MOTOR STOP when the bonder energizes
If the bonder exits bonding and enters the Motor Stop mode, the software:
•
Disables the amplifiers
•
Stops the servo relay
•
Sends a command to servo CPU (CPU2) to stop the motor
•
Cancels commands that are not done
In the Motor Stop mode, the bonder enables the steppers and solenoids. When the bonder exits the
Motor Stop mode, the steppers and solenoids disable. The software commands the PRS system to stop
bonder and MHS operations. If the machine is connected to a Factory Automation Server/System
(FAS) host (a PC that monitors the wire bonder through a communications link with the SEMI SECS
protocol), the machine tells the host about the mode change.
The software records the time and date when the bonder enters the Motor Stop mode. When the bonder
exits the Motor Stop mode (follow the initialization instructions), the software sets the servo power,
steppers and solenoids to ON. The bonder starts automatic X, Y and Z limits and MHS home position
find. Motor Stop mode recovery is manual only.
(1)
X, Y and Z Limit Seeking:
The X, Y and Z Limit Seeking function finds the range limits of the X, Y, and Z positions of the
bond head. Select OK to start the procedure. Read the instruction dialog that appears during the
procedure and do the correct step.
Figure 3-5: X, Y and Z Limit Seeking
Operator’s Guide
Page 3-5
Operation
Motor Stop Mode
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(2)
MHS Home Position:
The MHS Home Position dialog starts the software, which finds the home positions of the MHS
motors on the magazine handler and the workholder. Home position is the zero point from which
all distances are calculated for each axis. For example, the motor home position is the front rail
position that is nearest to the user. The home position of the rear rail motor is the rear rail position
that is farthest from the user.
Figure 3-6: MHS Home Position Dialog
Select OK to start the procedure. Magazines can stay in the Magazine Handler grippers (usually
magazines will have been unloaded during usual shut down of the bonder). During MHS home
position, remove leadframes from the workholder if necessary. This prepares the workholder,
thus the rails can close.
Note: Read the instruction dialog that appears when the procedure is ON and do the correct
step.
(3)
Rail Height Measurement:
The initialization continues with the measurement and verification of the workholder rail height.
Refer to the message prompt and do this.
Figure 3-7: Rail Height Measurement indication
Select OK and the bond head (capillary) moves down to touch the workholder rear rail. This is
done to calculate the height of the rails to make sure that they are at the correct height.
WARNING:
Do not touch the bond head.
CAUTION:
You can cause damage to the capillary when the capillary with ball moves down to touch the rear
rail.
When the calculation is done, one of three results is shown. These results are:
•
When (A) appears, the rail height is correct. This is the recommended result
•
When (B) appears, the rail height is satisfactory. This can mean throughput decreases
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Motor Stop Mode
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•
When (C) appears, the rail height is incorrect. This disables indexing
Prompt (A):
Prompt (B):
Prompt (C):
Figure 3-8: Rail Height Calculation Results
If the rail height is correct, select OK and bonder initialization continues. If the rail height is
satisfactory and you select OK, indexing is enabled, but the throughput can decrease. Set to the
best rail height to increase the throughput. If the rail height is not correct, indexing is disabled.
Change the workholder rails to the correct height before you index a device. The rail height
adjustment is shown in Chapter 4, Calibration.
(4)
Teach Heat Block Position
When Rail Height Measurement is completed, the H/B Position dialog appears. This
measurement tool lets you teach a specified location on the heat block. These location help MHS
teach of the heat block center and dimensions. The GUI instruction tells you to teach the
reference position of the heat block. Usually, reference point 1 is taught at the top left corner of
the die space (see figure). Some applications can have a different reference point. Make sure that
this reference point is easily identified and stays at the usual position because all X and Y
positions refer to this location.
Figure 3-9: Heat Block Reference Point 1 Dialog
Specify the PP to use and teach the reference point locations. This location is the same for
reference points 1 and 2. To do this, teach reference point 2 on point 1. Point 2 sets the rear and
leftmost limits of travel along the X and Y axes during bonding.
Figure 3-10: Heat Block Reference Point 2 Example
Operator’s Guide
Page 3-7
Operation
Motor Stop Mode
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The software gives instructions to the user to teach Point 3. This is the lower right corner of the
die space and along the X and Y axes of the bonding scope.
Figure 3-11: Heat Block Reference Point 3 Example
Some applications can use a heat block insert which does not have a die space. In such
conditions, specify a location with the same travel limits. Make sure that it is easy to identify and
find this location. This makes sure that the machine initialization and Teach H/B Position
operations can be done easily. When all heat block reference points are taught, select DONE from
the H/B Position dialog. This causes the next prompt to appear.
(5)
Calibrate or Restore
If a bonder software update is done, but it gives a corrupted MDP data, the MDP data of the
operating software is restored. For these two conditions, the Calibrate or Restore dialog appears
for you to select bonder calibration or restore MDP data from the memory device.
To start the calibration procedure, push 1 on the MMI or put the cursor (pointer) on OK then push
B1. When the calibration procedure has completed, the software starts the next calibration
automatically. Push 2 on the MMI or select CANCEL to bypass the calibration and restore the last
known good MDP data from a copy.
Figure 3-12: Calibrate or Restore
(6)
Restore MDP Files
Select CANCEL in the Calibrate or Restore Choice dialog will cause the Restore MDP Files dialog
to appear. This part of the power up sequence lets you restore the MDP data. Usually, the restored
MDP data agree with the operation. Select FROM DRIVE again and again to set the memory device
as USB (U) or HDD (C).
Note: It is recommended to save the MDP data to a USB. If the HDD (C) drive fails, MDP
component files can be restored from the USB (U) drive. Some calibration data is not
saved. These data must be calibrated again.
Figure 3-13: Restore MDP Files Dialog
Select START RESTORE to restore the MDP component files from the selected drive to the bonder
software. When the restore operation is completed, select DONE.
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Motor Stop Mode
Operator’s Guide
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IConn PLUS ELA High Performance Ball Bonder
3.3
Load/Save/Clear Menu
The Load/Save/Clear menu appears when you select LOAD/SAVE/CLEAR from the PROGRAM menu. You
can use this menu for options to operate on the bonder component files.
Figure 3-14: Load/Save/Clear Menu
Click DRIVE to select one of the two available memory devices: HDD (C) and USB (U). Select the memory
type before you load or save the Process Program (PP).
The Load/Save/Clear menu gives the functions below:
3.3.1 Load Process Program
3.3.2 Save Process Program
3.3.3 Clear Process Program
3.3.4 Load Reference (Ref) System
3.3.5 Save Reference (Ref) System
3.3.6 Load Process Program without MHS
3.3.7 Set Up OLP (Off Line Programming)
3.3.8 Load PP Without Heat Block Reteach
Note: Select Process Program Manager in the UTILITIES mode to get more component file utilities
(list, copy, delete functions). Refer to the Reference Guide, chapter 7: Utilities for more data.
Operator’s Guide
Page 3-9
Operation
Load/Save/Clear Menu
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3.3.1
Load Process Program
To load a PP from the HDD (C) or USB (U) hard drives to the bonder memory, select LOAD PROCESS
PROGRAM from the Load/Save/Clear menu
File Name Format
Long Name Format
Figure 3-15: Load Process Program Dialog
The Load Process Program dialog appears in the long or file name format. The format that appears is
selected in the PRIVILEGED OPERATIONS (password-protected) menu, SYS ADMIN mode. You can select
to load a PP from a memory type through the DRIVE option. Push ESC to exit the operation and dialog.
To load a PP for the bond operation:
(1)
Select DRIVE again and again in the Load/Save/Clear menu to select HDD (C) or USB (U).
(2)
Select LOAD PROCESS PROGRAM. The Load Process Program dialog appears.
(3)
Enter the PP name into the text box. A highlight appears on the name related to the entry in the
list. The alternative is to use the scroll bar, look for the program in the list, then select to highlight
it.
Note: The text box used in the long name format accepts general text to a maximum of 80 characters
in length.
When the PP is found and highlighted, select the LOAD button to load the program. When loaded, the PP
name appears in the information box found on the monitor screen.
Figure 3-16: Process Program Long Name Button
If the long name format is used, part of the name shows in a button found in the information box. When
this button is selected ON, a dialog appears with the full PP name. To continue, select the OK button in
the dialog.
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Operation
Load Process Program
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When the program is loaded, you can select ALIGN REF from the PROGRAM menu. This causes the
bonder to do an automatic eyepoint alignment on the PP reference systems that are not aligned. Select
other PROGRAM menu options such as WIRES/PARAMETERS or EDIT REF SYS to do the same automatic
eyepoint alignment. Refer to the Programmer’s Guide for more data.
Note: The wire type data is included when the PP loads. This feature starts a wire type data check if
the copper kit is installed on the machine. If the wire type data is not shown, the user can
select the copper wire type.
3.3.2
Save Process Program
To save a PP, select the SAVE PROG button on the upper function bar or SAVE PROCESS PROGRAM on
the Load/Save/Clear menu. Select DRIVE again and again to set the memory device as HDD (C) or USB
(U). Then, select SAVE PROCESS PROGRAM to save the PP.
Figure 3-17: Process Program Save/Save As Dialog Flow
The items in the Save Operations dialog are given below:
Parameter
NAME
Definition
Shows the default PP Name. This name is made up of 4 parts. See
this figure for the general PP name format.
Example:
Month:
JA=January
FB=February
MR=March
AP=April
MY May
JN=June
JL=July
AG=August
SP=Spetember
OC=October
NV=November
DC=December
MR 26 12 02
Da
Last two
digits of the
Program
number for
the date:
00=First
01=Second
02=Third
03=Fourth
etc.
SAVE
Saves the PP changes to the selected DRIVE and uses the default
name of the component files and all taught reference systems used.
SAVE AS
Saves the PP changes to the selected DRIVE and opens the Save As
dialog. This dialog lets you change the component file names and
adds a short note and/or instruction that are related to the PP. For
more data, see the Save As dialog items below.
DONE
Cancel and exit the save operations.
Note: Save program SHIFT + F1 function button operates the same as the Save Process Program
function described above.
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Operation
Save Process Program
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The items in the Save As dialog are given below:
Parameter
Definition
LONG NAME
If the PP is saved with the long name format, the text box accepts
general text to a maximum of 80 characters in length. Part of the
name appears on a button found in the information box. When this
button is clicked on, a dialog with the full PP name appears.
FILE NAME
The component file name that is saved and identified on the selected
DRIVE. The default file name is shown at first. This name can be
different from the name shown in the Save Operations dialog. This
text box is limited to eight characters and must have the “.BND”
extension.
COMMENT
An “alphanumeric” text box that lets you put a note in the file.
MORE COMMENT
An “alphanumeric” text box that lets you put a note in the file.
PARAMETER FILES
Select to open a dialog that lets you change the name of one or more
parameter groups.
Select to open a text box and enter the new group name. Make sure
that you keep the extension ".PRM" when you rename the group.
MHS FILES
Opens a dialog that lets you change the names of one or more
material handling system files which are necessary for the PP (see
section 3.3.2.1 Rename MHS Files).
DEVICES, WIRES AND REF SYS
NAMES
Opens a dialog that lets you change the names of those files which
are necessary for the PP (see section 3.3.2.2 Rename Device/Wires/
Ref Sys).
DRIVE
This option lets you select the memory type that the PP is saved to.
USB (U): Save PP to the USB drive
•
HDD (C): Save PP to Hard drive (C). This selection is not
•
applicable for this feature
SAVE TO MEDIA AS
This option lets you select the format to save the PP. When the
selected DRIVE is HDD (C), this is a disabled option.
BND: Save as *.BND format
•
•
TAR: Save as *.TAR format
Note: The alternative to set the 8 DRIVE option is through the usual PROGRAM → 1 LOAD/SAVE/CLEAR
→ 2 DRIVE. These two DRIVE settings are synchronized.
Note: When you select PROGRAM → 1 LOAD/SAVE/CLEAR → 2 DRIVE and set DRIVE to HDD (C), the SAVE
TO MEDIA AS SETTING grays out. You can only change the SAVE TO MEDIA AS option for memory
device (HDD or USB).
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Save Process Program
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3.3.2.1
Rename MHS Files
Select MHS FILES from the Save As dialog to open the Rename MHS Files dialog. Five sets of MHS
parameter files are available to be renamed as part of the SAVE AS option. Select each group to open its
text box. You can change MHS file names in this dialog.
Figure 3-18: Rename MHS Files Dialog
Note: Each of the parameter groups end with an extension which identifies its type (e.g., ‘.MAG’).
Make sure that you keep this extension when you rename the group.
Parameter
Definition
LF PARAMETERS
Contains the leadframe dimensions and programming data of the PP.
MH PARAMETERS
Contains the magazine handler dimensions and programming data of
the PP.
MH PHYSICAL DATA
Contains the specifications of the magazines and the Magazine
Handlers operation settings used with the PP.
WHL PHYSICAL DATA
Contains the specifications and indexing settings of the workholder.
HB POSITION DATA
Contains the taught heat block position in the PP.
When all selections are completed, select SAVE to start the save operation. The PP is saved or replaced
with the selected format (‘.BND’ or ‘.TAR’) into the selected drive, HDD (C) OR USB (U).
Note: If SYS ADMIN → PRIVILEGED OPERATIONS → PROGRAM MODE OPERATIONS SAVE PP TO C option
is set to NO. The PP save operation to HDD(C) cannot continue.
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Operation
Save Process Program
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3.3.2.2
Rename Device/Wires/Ref Sys
Select DEVICES, WIRES AND REF SYS NAMES from the Save As dialog to open the Rename Device/
Wires/Ref Sys dialog. The Rename Device/Wires/Ref Sys dialog contains program names for the
device, die, lead and down reference systems. The program file names for these reference systems are
also included.
Figure 3-19: Rename Device/Wires/Ref Sys Dialog
Note: Each data file ends with an extension which identifies its type. Keep this extension when you
rename the group.
When operations in the Rename Device/Wires/Ref Sys dialog are complete, select DONE or push 0
(zero) to show the Save As dialog. Items in the dialog are specified as follows.
Parameter
Definition
NEXT DEVICE
Sets the next device in a matrix or packages with more that one
device in the PP. Shows the related files for that device at the bottom
of the dialog. When the dialog first appears, the first device is
selected. If you select the NEXT DEVICE, the next device is selected.
If the next device is one device (a matrix or packages with more that
one device), NEXT DEVICE is grayed out (OFF).
DEVICE
Shows the program name given to the currently selected device
(sys_die). The text box lets you rename the device. If the entered
name is used, a message prompt appears.
WIRES FILE
The name of the file that specifies wire position compared to the
reference systems used to make the PP.
DIE REF SYS
The short name of the Die Reference System used to make the PP
(U1).
REF SYS FILE
The file name of the Die Reference System used to make the PP.
LEAD REF SYS
The short name of the Lead Reference System used to make the PP
(S1).
REF SYS FILE
The file name of the Lead Reference System used to make the PP.
There can be more than one file name that is not shown in the Rename Device/Wires/Ref Sys dialog.
For example, more file names can appear for die, lead and down bond reference systems.
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Save Process Program
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IConn PLUS ELA High Performance Ball Bonder
3.3.3
Clear Process Program
To clear the PP from bonder memory, select CLEAR PROCESS PROGRAM from page 1 of the Load/Save/
Clear menu. If there is a PP in memory, a prompt appears.
Figure 3-20: Clear Process Program Dialog
Select OK to clear the PP. Select CANCEL to go back to the Load/Save/Clear menu.
3.3.4
Load Reference (Ref) System
To load a reference system, select LOAD REF SYSTEM from the Load/Save/Clear menu. The Load A
Reference System dialog appears.
Figure 3-21: Load Reference System Dialog
This dialog lets you get a stored reference system. New PPs can be made with saved lead and die
reference systems, thus the necessary teach time is decreased. Select DRIVE to set the drive as HDD (C)
or USB (U). Make sure that you have selected the drive type before you load or save the reference
system.
(1)
Set the number of the devices into the DEVICE text box. This is the number of the devices to put in
the reference system.
(2)
Select the reference system in the dialog. This highlights the selected reference system.
(3)
Select the LOAD button to load the reference system. When the reference system is loaded, the
name of the loaded reference system appears in the information box below the mode bar. If the
loaded reference system is incorrect, select DELETE LAST LOADED to delete the reference system.
(4)
Once a reference system is loaded, the software puts the reference system at the crosshair in the
display window.
The reference system is connected to other reference systems in the device with the steps below:
(1)
Use the mouse and B2, then chess the crosshair position over a point in the reference system.
(2)
Push B1 to select the point. If necessary, push B3 to deselect the point.
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Clear Process Program
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(3)
Chess the crosshair to the location to put the reference system.
(4)
Push B1 to set the reference system.
Note: This can only be done while in Load Reference System dialog.
(5)
If necessary, do the load procedure to load more reference systems again. When all the necessary
reference systems have been loaded and correctly positioned, select the DONE in the Load A
Reference System dialog.
After the reference system is loaded and positioned, it must be aligned before you do the teach
operations. Do this when you select ALIGN REF from the Program menu. This selection causes the Align
Reference System dialog to appear. Refer to the Reference System Alignment section in the
Programmer’s Guide for more data and instructions to align the reference system.
3.3.5
Save Reference (Ref) System
To save a reference system, select SAVE REF SYSTEM from the Load/Save/Clear menu. The Select a
Reference System dialog appears.
Figure 3-22: Select a Reference System Dialog
(1)
Select DRIVE to set the drive as HDD (C) or USB (U). Make sure that you have selected the drive
type before you load or save the reference system.
(2)
Select and highlight the reference system in the dialog.
(3)
Select the APPLY button to save the reference system.
The SAVE AS text box lets you save more copies of the reference system with the use of a different
name. Select the SAVE AS text box, then push ENTER. Enter the new name of the reference system and
select the APPLY button. When all reference systems have been saved, select the DONE button to exit the
dialog.
Note: After each reference system is taught, it can be saved as many times as necessary. Change the
reference system name with each save to make future identification easy. A reference system
can then be loaded independently to make a new PP, thus it is not necessary to make a PP. All
the reference systems are connected together when the PP is saved.
98890-10EA-001-00
Revision B
Operation
Save Reference (Ref) System
Operator’s Guide
Page 3-16
IConn PLUS ELA High Performance Ball Bonder
3.3.6
Load Process Program without MHS
This feature lets you load a program with no effect on the related MHS files. No changes will be made
to the MHS files in bonder memory taught in MHS setup or previous loaded standard Load Process
Program menu item. This feature lets you load a new different PP without changes to the related MHS
files. This feature aids the AutoOLP (Auto Offline Programming) since most of the OLP program is
prepared off line, then transmitted to the bonder for completion. This prevents changes to the MHS
setup that had been done before.
To load a PP without MHS files is a password-protected PRIVILEGED OPERATIONS feature in the
PROGRAM mode. PRIVILEGED OPERATIONS is in the SYS ADMIN mode. If this feature is disabled in
PRIVILEGED OPERATIONS, the LOAD PP W/O MHS item on page 1 of the Load/Save/Clear menu is
disabled. If this feature is enabled, select LOAD PP W/O MHS from the Load/Save/Clear menu to show the
Load Process Program w/o MHS dialog.
File Name Format
Long Name Format
Figure 3-23: Load Process Program without MHS Dialog
The load PP w/o MHS dialog appears in one of two formats. One format uses the PP’s ‘Long Name’
while the other uses the PP’s ‘File Name’. The format that appears is related to the selection that was
made in the password-protected Privileged Operations feature for PROGRAM mode. PRIVILEGED
OPERATIONS is in the SYS ADMIN mode. If the user selects not to load a PP, the ESC button can be
pressed to exit the Load Process Program w/o MHS dialog.
To load a PP, select DRIVE from the Load/Save/Clear menu to set the memory device, then select LOAD
PROCESS PROGRAM W/O MHS. The Load Process Program w/o MHS dialog appears in the 'file name' or
'long name' format. When you enter a program name into the text box, a highlight appears on the name
related to the entry in the list. The user can also look through the list with the scroll bar to select the
program. When the PP is highlighted, select the DONE button to load the program. The text box used in
the ‘Long Name’ format accepts general text to a maximum of 80 characters in length.
Operator’s Guide
Page 3-17
Operation
Load Process Program without MHS
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
Once loaded, the PP name appears in the information box found on the monitor screen. If the ‘Long
Name’ format is used, part of the name appears on a button found in the information box. When this
button is clicked on, a dialog appears to show the full name of the PP appears. To continue, select the
OK button in the dialog.
Figure 3-24: Process program ‘Long Name’ Button
3.3.7
Set Up OLP (Off Line Programming)
The Set Up OLP feature adapts the coordinates removed from the CAD (computer aided design) to the
machine. This feature increase the edit function for the imported PPs taught with AutoOLP. This makes
the PRS teach process faster and removes the risk of an error. Select SET UP OLP from page 2 of the
LOAD/SAVE/CLEAR menu. A sequence of dialogs appears will teach you the steps that are necessary to
adapt the PP. Refer to the AutoOLP user guide and Reference manual Program menu for more data.
3.3.8
Load PP Without Heat Block Reteach
The LOAD PP W/O H/B RETEACH setting gives you the option to disable the Heat Block Position dialog
during the loading of the PP.
Note: After this setting is changed, it is saved to the PP. If no PP is loaded, this option is disabled.
98890-10EA-001-00
Revision B
Operation
Set Up OLP (Off Line Programming)
Operator’s Guide
Page 3-18
IConn PLUS ELA High Performance Ball Bonder
3.4
Operating Procedures
These are the procedures that are usually done during bonding:
3.4.1 Initial Start Up
3.4.2 Load/Unload Magazines During Bonding
3.4.3 Stop Auto Bonding
3.4.4 Clear Leadframes from Indexer
3.4.5 Remove Magazines From Magazine Handlers
3.4.6 Bonder/Workholder System Shut Down
Operator’s Guide
Page 3-19
Operation
Operating Procedures
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
3.4.1
Initial Start Up
Note: Make sure that the correct P-parts (heat block insert and clamp insert) and parts necessary for
the specified carrier (singulated or non-singulated flat boat, etc.) procedures are installed.
Follow the instructions in section 3.5.3 Enter/Edit Material Dimensions & MHS Configure
Parameters to install the heat block and clamp insert. Refer to the applicable kit installation
instruction to install the equipment for the specified carrier type.
CAUTION:
Remove all P-parts when told to prevent damage to the rails.
(1)
Do the bonder power up sequence.
(2)
Make sure that all system pneumatic gauges show sufficient pressure. Refer to the IConn PLUS
ELA Maintenance Manual for the pneumatic settings.
(3)
Make sure that you set the wire feed system correctly.
(4)
Load the PP. The input magazine handler, workholder, and output magazine handler are
automatically changed to correct positions for selected carrier, device, and magazine.
Temperature controller states (ON or OFF) and set points are loaded as part of the program. Wait
a minimum of 30 minutes for the workholder heaters to become stable at the set temperatures.
(5)
Enter “H.B. (heat block) Operator Point”. Do the instructions shown.
(6)
Select AUTO at top of graphics display.
(7)
Put the magazines that contain carriers with new devices onto the load tray of the input magazine
handler.
(8)
Put the empty magazines onto the load tray of the output magazine handler.
(9)
Make sure that the magazines are in position to feed and receive carriers from the workholder
and are flushed with the magazine handler side plate.
(10) Make sure that the correct PP name is shown.
98890-10EA-001-00
Revision B
Operation
Initial Start Up
Operator’s Guide
Page 3-20
IConn PLUS ELA High Performance Ball Bonder
(11) Make sure that the primary bond parameters are correct.
Note:
When the magazine is put on motorized tray, make sure that the magazine is parallel to
the front edge of motorized tray and flushed with the input side plate
D
A
E
F
G
B
C
A
B
C
D
Z-tower Assembly
Magazine Guide
Motorized Tray
Input Tray
E Not Motorized Tray
F Input Magazines Wall
G Magazines (X2)
Figure 3-25: Load Magazines on Magazine Handler (Input Magazine Handler Shown)
Note: Set the magazine guide approximately 1.5 mm from end of the magazine.
Note: It is necessary to teach the bond position before the machine can do an index. Refer to MHS
Teach in MHS Manual for more data.
(12) Push INDEX to start carrier indexing. The input magazine handler picks a magazine from the load
tray and puts the first magazine slot level with the workholder. Carrier indexing occurs until the
clamp is applied to the first device at the bond site.
(13) Push RUN/STOP button on control panel to start automatic bonding. Push AUTO INDEX for
automatic indexing (if desired).
Operator’s Guide
Page 3-21
Operation
Initial Start Up
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
3.4.2
Load/Unload Magazines During Bonding
Note: If safety covers are installed on the magazine handlers, the magazine handler access doors
must be disengaged and opened to load/unload magazines. The door latches are controlled
through options on the Mag Handler Operations menu that can be called up by a toolbar
button.
3.4.3
(1)
Load more magazines of carriers onto the load tray of the input magazine handler, as empty
magazines are put on the unload tray.
(2)
Load the empty magazines onto the load tray of the output magazine handler, as completed
magazines are put on the unload tray.
(3)
Do not let the magazine handler load trays to become empty or operation is stopped.
(4)
Remove magazines from the unload trays. Do not let the unload trays stay full. If not, the bonder
operation stops.
Stop Auto Bonding
Note: This procedure is to stop the auto bonding operation before all carriers in the input magazines
are bonded.
3.4.4
(1)
Select W/H OPER from the toolbar.
(2)
Set 5 STRIP INJECT. The Strip Inject dialog appears.
(3)
Select 1 STRIP INJECT OFF. Select DONE to exit the Strip Inject dialog. Select DONE to exit the
Workholder Utilities menu.
(4)
Bonding will continue until all remaining carriers in the workholder are bonded and ejected into
an output magazine. No new carrier is pulled into the workholder from the input magazine.
Clear Leadframes from Indexer
Note: Do the instructions below if bonding is stopped with carriers in the workholder.
3.4.5
(1)
Select W/H OPER from the toolbar.
(2)
Select 3 EJECT LEADFRAME from the Workholder Utilities menu. Carriers in workholder are
moved into the output magazine.
(3)
Select DONE to exit the Workholder Utilities menu.
Remove Magazines From Magazine Handlers
Note: If bonding stops and there are magazines in the magazine handler grippers, do the steps
below.
(1)
Select MAG OPER button on the toolbar.
(2)
Select 3 EJECT INPUT MAG and 7 EJECT OUTPUT MAG from the Mag Handler Utilities dialog.
Note: If Safety Covers are installed on the magazine handlers, the magazine handler access doors
must be disengaged and opened to load/unload magazines. The door latches are controlled
through options on the Mag Handler Operations menu that can be called up by a toolbar
button.
(3)
Remove magazines from the load tray and unload tray of the input magazine handler.
(4)
Remove magazines from the load tray and unload tray of the output magazine handler.
(5)
Select DONE to exit the Mag Handler Utilities dialog.
98890-10EA-001-00
Revision B
Operation
Load/Unload Magazines During Bonding
Operator’s Guide
Page 3-22
IConn PLUS ELA High Performance Ball Bonder
3.4.6
Bonder/Workholder System Shut Down
Note: This procedure shuts down the bonder/workholder at the end of a shift/day.
(1)
On the wire feed system, push the AIR GUIDE and TENSIONER buttons on the MMI to set the
pneumatic to OFF (AIR GUIDE and TENSIONER LED indicators OFF).
(2)
Make sure that the carriers are removed from workholder.
(3)
Make sure that the magazines are removed from magazine handlers.
Note: The MOTOR STOP button has two actuators, and is made up of two buttons. These two
actuators must be pressed at the same time to activate the Motor Stop function. This prevents
MOTOR STOP from accidental operation.
(4)
Operator’s Guide
Page 3-23
Push MOTOR STOP (button lamp ON). The bonder enters standby mode.
Operation
Bonder/Workholder System Shut Down
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
3.5
Product Conversion
Start
Enter carrier/magazine
dimension & MHS
configuration parameters
See C below
No
Do you have
the process
program?
Have you taught
the carrier limits
Load process program
from bonder hard disk or
USB memory device
See B below
Save process program to
the bonder
See C below
Install new clamp & heat
block inserts
See A below
Teach bond position
Yes
Yes
Create process program
See Programmer’s Guide
No
Is the jam detect
threshold set?
No
Teach jam detect threshold
Yes
No
Do you have the
clamp & heat block
inserts for this
device/carrier?
Is the video
image in focus?
No
Adjust focus at optics
See E below
No
Install correct leadframe
stopper
See F below
Yes
Yes
Adjust workholder rail
height
See E below
No
Is the workholder rail
height acceptable?
Are the correct
leadframe stoppers
installed?
Yes
Start MHS teach
procedure
See D below
Relearn/move operator
point/positions
No
Check indexing &
magazine handling
Have you set the
heat block operator
point and positions?
Is the MHS
operation OK?
Check/edit parameters &
dimensions. Change bond
position. Save progress
Yes
Yes
Done
Figure 3-26: Product Conversion Sequence
A
B
C
3.5.1 Replace Clamp Insert and Heat Block Insert
3.5.2 Load Process Program
3.5.3 Enter/Edit Material Dimensions & MHS Configure Parameters
98890-10EA-001-00
Revision B
D
E
F
Operation
Product Conversion
3.5.4 Teach Bond Position
3.5.6 Optics Focus
3.5.7 Select the Leadframe Stopper Position
Operator’s Guide
Page 3-24
IConn PLUS ELA High Performance Ball Bonder
3.5.1
Replace Clamp Insert and Heat Block Insert
WARNING:
Do not touch clamp insert, heat block, or other parts in the indexer rails. If the temperature
controllers are on, these items are very hot and will immediately burn bare skin.
Note: Make sure that the temperature controllers are on and the workholder heat areas are at
operating temperatures for the procedure below.
(1)
Select W/H OPER from the toolbar.
(2)
Select CLEAR WORKHOLDER from the Workholder Utilities menu.
(3)
A message prompt to remove material, clamp and heat block inserts from the workholder (if
necessary) appears.
(4)
Select DONE to close the message prompt.
(5)
Remove clamp insert.
(a)
Install an M4 x 37 mm screw into each of the two tapped holes in the clamp insert. Do not
tighten the screws.
(b)
Make sure that the height of the bottom surface of clamp insert is higher than the top
surface of the front rail.
(c)
Push down the left clamp arm and hold on to that position.
(d)
Hold the left screw on the clamp insert with pliers or other tool.
(e)
Pull the left side of the clamp insert away from the left clamp arm.
(f)
Do steps (5)(c) to (5)(e) to remove the right side of the clamp insert.
CAUTION:
Be careful when releasing the clamp insert to prevent damage to the bottom of the clamp window.
(6)
Operator’s Guide
Page 3-25
(g)
Put the clamp insert on a flat, heat-resistant surface.
(h)
Select OK to close the message prompt.
Remove heat block insert.
(a)
Install an M4 x 37 mm screw into the tapped hole at the right side of the heat block insert.
Do not tighten the screw.
(b)
Put in 3 mm Allen® key into the opening slot in the heat block lever.
(c)
Push the Allen® key to the left with the use of 3.5 lbf to 4 lbf (pound force) to push the
heat block lever against the spring.
(d)
Hold the screw with pliers or other tool.
(e)
Push the heat block insert to the left against the heat block lever, then pull the right side of
the heat block insert up.
(f)
Lift the heat block insert away from its mount.
Operation
Replace Clamp Insert and Heat Block Insert
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(g)
Carefully put the heat block insert on a flat, heat-resistant surface.
A
B
Remove and Install Clamp Insert
C
D
E
A
I
F
Install
H
G
1. Push down the Allen® key to push the heat block lever against
spring (View A)
2. Push the insert against heat block lever (View A)
3. Lower the insert onto heat block and release (View B)
4. Release Allen® key (View B)
Remove
1. Push down the Allen® key to push the heat block lever against
the spring. (View A)
2. Push the insert against heat block lever. (View B)
3. Lift the right side of insert and pull away from heat block. (View
A)
4. Release the Allen® key. (View B)
J
B
Remove and Install Heat Block Insert (Front View)
A
B
C
D
E
Clamp Insert
M4 x 37 Screws
3mm Allen® Key
M4 x 37 Screws
Heat Block Insert
F
G
H
I
J
Heat Block Lever
Spring
Heat Block Mount
3mm Allen® Key
M4 x 37 Screws
Figure 3-27: Clamp Insert and Heat Block Insert Removal/Installation
Note: Remove the Allen® key and M4 x 37 Screws when done.
98890-10EA-001-00
Revision B
Operation
Replace Clamp Insert and Heat Block Insert
Operator’s Guide
Page 3-26
IConn PLUS ELA High Performance Ball Bonder
(7)
A
B
Make sure that you have the right heat block type setup before you attach your heat block insert.
Do step (a) for IConn heat block insert or step (b) for Ultra heat block insert.
Ultra Heat Block Insert
Ultra Adaptor Bar
C
D
Universal Heat Block
M4 x6 mm Extra Low Head Cap Screw (x2)
E
IConn Heat Block Insert
Figure 3-28: Ultra Against IConn Heat Block
(a)
To change from Ultra heat block to IConn heat block:
1.
Remove the two low head M4 screws from the Ultra adaptor bar.
2.
Remove the Ultra adaptor bar from the standard heat block.
3.
Keep the Ultra adaptor bar and two M4 screws for future installation.
4.
Go to CONFIGURE menu → WORKHOLDER → DEVICE CONFIGURATION.
Figure 3-29: Device Configuration - Heat Block Type (Ultra And IConn)
A
B
5.
Set the heat block type from ULTRA to ICONN.
6.
Enter your applicable heat block insert thickness (IConn default: 394 mils).
Bond Plane
Ultra Heat Block Insert
C
D
IConn Heat Block Insert
Universal Heat Block
E
Adaptor
Figure 3-30: Heat Block Insert Thickness Side View (Ultra Against IConn)
7.
Operator’s Guide
Page 3-27
Select DONE.
Operation
Replace Clamp Insert and Heat Block Insert
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
8.
(b)
(8)
Do the clamp calibration.
From IConn heat block to Ultra heat block:
1.
Attach the Ultra adaptor bar to the standard heat block with the two low head M4
screws.
2.
Go to CONFIGURE menu → WORKHOLDER → DEVICE CONFIGURATION.
3.
Set the heat block type from ICONN to ULTRA.
4.
Enter your applicable heat block insert thickness (Ultra default: 250 mils).
5.
Select done.
6.
Do the clamp calibration.
Make sure that you have the correct clamp arm type (130 mm or 110 mm) setup for your clamp
insert. Do step (a) for 130 mm clamp insert or do step (b) for 110 mm clamp insert.
(a)
To change from 110 mm clamp insert to 130 mm clamp insert:
1.
Go to CONFIGURE menu → WORKHOLDER → DEVICE CONFIGURATION.
Figure 3-31: Device Configuration - CL Type (110 mm and 130 mm)
(b)
2.
Set the clamp insert type from 110 MM to ULTRA - 130 MM.
3.
Enter the CI SHOULDER DEPTH (130 mm default: 201 mils).
4.
Select DONE.
5.
Do the clamp calibration.
To change from 130 mm clamp insert to 110 mm clamp insert:
Note: It is necessary to install the 110 mm clamp arm kit before you continue.
(9)
1.
Go to CONFIGURE menu → WORKHOLDER → DEVICE CONFIGURATION.
2.
Set the clamp insert type from ULTRA - 130 MM to 110 MM.
3.
Enter your CI SHOULDER DEPTH (110 mm default: 151 mils).
4.
Select done.
5.
Do the clamp calibration.
Install the new heat block insert.
(a)
Remove the screw from the old heat block insert and install it into the tapped hole at the
right side of the new heat block insert. Do not tighten the screw.
CAUTION:
Do not try to install a cold heat block insert onto a heat block mount that is at operating temperature.
It is not easy to remove the heat block if it catches on the mount.
98890-10EA-001-00
Revision B
Operation
Replace Clamp Insert and Heat Block Insert
Operator’s Guide
Page 3-28
IConn PLUS ELA High Performance Ball Bonder
(b)
Put the heat block insert onto the heat block mount and wait for a small temperature
increase.
(c)
Put in a 3 mm Allen® key into the opening slot in the heat block lever.
(d)
Push down the Allen® key to the left with 3.5 lbf to 4 lbf (pound force) to push the heat
block lever against the spring.
(e)
Use pliers to hold the screw in heat block insert and put the insert on the heat block mount.
(f)
Make sure that the channel along the bottom of the insert is aligned with and fits onto the
heat block mount.
(g)
Hold the screw in the insert with pliers and push the insert to the left against the heat block
lever.
(h)
Push the heat block insert down onto the mount, then release the screw.
CAUTION:
Be careful when the heat block insert (or heat block insert - P-part) is installed to prevent damage to
the rear rail center guide with screws.
(i)
Remove the screw from the heat block insert.
(j)
Remove the Allen® key from the heat block lever.
(10) Install new clamp insert.
(a)
Remove the screws from the old clamp insert and install them into the tapped holes in the
new clamp insert. Do not tighten the screws.
(b)
Hold the screws in the clamp insert.
(c)
Put in the ends of clamp insert into the slots on the left and right clamps arms.
(d)
Push the clamp insert to the rear of the machine until these two sides lock in the clamp
arms.
(e)
Remove the screws from the clamp insert.
(11) Select OK in Standby Mode dialog to start the machine initialization.
3.5.2
Load Process Program
(1)
Select PROGRAM from the mode bar.
(2)
Select 1 LOAD/SAVE/CLEAR from the Program menu to clear the current PP.
(3)
Select 3 LOAD PROCESS PROGRAM. A dialog appears with a list of available PPs.
(4)
Scroll through the list on the display to find the PP file for the device that is processed.
(5)
Select the PP file name.
(6)
Select LOAD to load the program. A message appears to tell you that the setup procedure must be
done.
(7)
Select OK, then do the setup. Refer to section 3.5.4 Teach Bond Position of this manual for teach
bond position procedure.
(8)
If necessary, push ESC to close the Program menu.
Operator’s Guide
Page 3-29
Operation
Load Process Program
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
3.5.3
Enter/Edit Material Dimensions & MHS Configure Parameters
(1)
Select CONFIGURE from the mode bar.
(2)
Configure workholder parameters:
(a)
Select 6 WORKHOLDER from the Configure menu.
Note: In the MHS Configuration dialog, select CANCEL to exit the dialog with no changes
saved.
(b)
Select 1 DEVICE CONFIGURATION.
(c)
Set DEVICE to the correct device type.
(d)
Select DONE after all changes have been made.
(e)
Select 2 DEVICE PARAMETERS.
(f)
Enter values for the leadframe or flatboat dimensions in the menu list.
(g)
Select DONE after all changes have been made to the dialog.
(h)
Select 3 INDEXING PARAMETERS.
(i)
Enter values for indexing parameter.
(j)
Select DONE after all changes have been made to the dialog.
(k)
Select 4 INJECT PARAMETERS.
(l)
Enter gripper puller parameter values.
(m)
Select DONE after all changes have been made to the dialog.
(n)
Select 5 CLAMP PARAMETERS.
(o)
Enter clamp parameter values.
(p)
Select DONE after all changes have been made to the dialog.
(q)
Select 6 EJECT PARAMETERS.
(r)
Enter eject parameter values.
(s)
Select DONE after all changes have been made to the dialog.
(t)
Select 7 WORKHOLDER CONFIGURATION.
(u)
Set the workholder configuration settings.
(v)
Select DONE after all changes have been made to the dialog.
Note: All parameters that you get access through the Workholder menu selection 8 RESERVED
PARAMETERS cannot be changed.
(w)
(3)
98890-10EA-001-00
Revision B
Push ESC to close the Workholder Configuration menu.
Configure MAGAZINE HANDLER parameters:
(a)
Select 7 MAG HANDLER from the menu.
(b)
Select 1 MAGAZINE PARAMETERS from the Mag Handler Configuration menu.
(c)
In the dialog, select INPUT to enter dimensions for the input magazines only, OUTPUT for
output magazines only, or BOTH for these two magazines. Enter values for the magazine
dimensions.
(d)
Select DONE after all changes have been made to the dialog.
(e)
If INPUT or OUTPUT was selected in step (c), open the Magazine Dimensions dialog again
and select the rest of the magazine type (Input or Output). Enter dimensions for that
magazine, then select DONE.
(f)
Select 2 MAGAZINE SLOT ORDER. Select and specify the slot sequence for the input and/or
output magazines.
Operation
Enter/Edit Material Dimensions & MHS Configure Parameters
Operator’s Guide
Page 3-30
IConn PLUS ELA High Performance Ball Bonder
(4)
Operator’s Guide
Page 3-31
(g)
Select 3 MAGAZINE ALIGNMENT. Enter magazine alignment parameter values. Select DONE
after all changes have been made to the dialog.
(h)
Select 4 MAG INDEX PARAMETERS. Enter magazine index parameter values. Select DONE
after all changes have been made to the dialog.
(i)
Select 5 MAG CONFIGURATION. Enter magazine index parameter values. Select DONE after
all changes have been made to the dialog.
(j)
Select 6 MAGAZINE EJECT OPTIONS. Enter magazine index parameter values. Select DONE
after all changes have been made to the dialog.
(k)
Select 7 TEACH INPUT MAG SLOT. Enter magazine index parameter values. Select DONE
after all changes have been made to the dialog.
(l)
Select 8 TEACH OUTPUT MAG SLOT. Enter magazine index parameter values. Select DONE
after all changes have been made to the dialog.
(m)
If necessary, push ESC to close all menus.
Select SAVE BND button from the toolbar to save the MHS data as part of the current PP.
Operation
Enter/Edit Material Dimensions & MHS Configure Parameters
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
3.5.4
Teach Bond Position
Teach leadframe bond position, eyepoint and operator point with the options on the MHS Teach menu
in Program mode. Select PROGRAM → 2 MHS TEACH to open the menu.
Do the teach procedure until the device theta position is correct. Make sure that the sides of the die
paddle at the bond site are parallel to the edges of the heat block cavity. If not, adjust the theta position
of the heat block:
(1)
Set the workholder heaters to OFF (if it is ON). Let the heaters cool down before you continue.
(2)
Remove the heat block insert, if necessary.
(3)
Install the heat block gauge.
(4)
Loosen (just by 1/4 turn) each of the four M3 screws from the heat block assembly to the top of
slider base.
(5)
Turn the heat block assembly and put the horizontal line of the crosshair on the front edge of the
heat block gauge.
(6)
Chess the crosshair from the left to right until the front edge is along the horizontal line of
crosshair.
(7)
Tighten (just by 1/4 turn) each of the four M3 screws a little.
(8)
Make sure that the heat block assembly does not move when the screws are tightened.
(9)
Tighten each of the four M3 screws to a torque of 13 lb-in.
(10) Make sure that the heat block assembly does not move when the screws are tightened.
(11) Chess the horizontal line of the crosshair from left to right on the front edge of the heat block
gauge. Make sure that the theta position of heat block assembly is correct.
(12) Remove the heat block gauge.
(13) Install the heat block insert to the heat block.
(14) Make sure that the heat block cavity edges are parallel to the edges of the die paddles.
(15) Make sure that the edges of the tie bars are parallel to the sides of the tie bar grooves.
(16) Push mouse button B1 to do checks for alignment at all four corners of the die paddle.
98890-10EA-001-00
Revision B
Operation
Teach Bond Position
Operator’s Guide
Page 3-32
IConn PLUS ELA High Performance Ball Bonder
(17) Continue with the bond position teach procedure.
1. Die space turned in relation to the device
(edges of the die paddle not parallel to edges of
die space).
2. This position shows the die paddle parallel to edges of
die space after theta position is adjusted.
A
C
D
B
A
B
M3 Screw (x4)
Front Edge of Heat Block Gauge
C
D
Heat Block
Heat Block Gauge
Figure 3-32: Align Heat Block with Die Paddle (Theta Position Alignment)
Note: Horizontal line of crosshair to align with the front edge of the heat block gauge.
3.5.5
Set Workholder Rail Height
Refer to Set the Rail Height section.
3.5.6
Optics Focus
It is necessary to do the optics focus adjustment to adapt the new product. The function of this
adjustment is to get a sharp, clear video image of the device for point and image recognition.
See chapter 4 of the Maintenance Manual for optics focus adjustment.
Operator’s Guide
Page 3-33
Operation
Set Workholder Rail Height
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
3.5.7
Select the Leadframe Stopper Position
Leadframe stoppers are installed at the input and output ends of the rear rail assembly. At the input end,
the stopper helps the leadframe align at the rail level. This lets the leadframe enter into the opening in
the input magazine wall. At the output end, the stopper helps to eject the leadframes through the output
magazine wall opening into the magazine. And it also prevents other leadframes in the magazine from
moving into the opening in the side wall.
There are four stopper positions to set for each of the angular cut (chamfer) or cutout width. The
settings are related to the dimensions of the cutouts and/or angular cuts in the leadframe head and tail
edges. The procedure is given in the table below. The table shows the setting of the leadframe stopper
position, which is necessary to install when you change the workholder to bond a new leadframe type.
Leadframe Cutout
and Angular Cut
Stopper Position
2 mm
C=0
4 mm
6 mm
8 mm
X
C= 2 mm
X
C= 4 mm
X
C = 6 mm
X
Leadframe with Angular Cut/Cutout (Top View)
E
E
Package Index Direction
Input Stopper Positions
A
C
D
B
2 mm
4 mm
A
B
C
Adjustable Input Stopper
M2 Flat Screws (x2)
Rear Rail
6 mm
D
E
8 mm
Rear Rail Input Stopper Base
Angular Cut or Cutout Width
Figure 3-33: Leadframe with Angular Cut/Cutout (Top View) and Input Stopper Positions
98890-10EA-001-00
Revision B
Operation
Select the Leadframe Stopper Position
Operator’s Guide
Page 3-34
IConn PLUS ELA High Performance Ball Bonder
3.5.8
Do MHS Operation Check
(1)
Put a magazine filled with sample carriers (the same type that is used in production) on the input
magazine handler load tray.
(2)
Put an empty magazine on the output magazine handler load tray.
(3)
Make sure that there is no material in the workholder. If there is, select W/H OPER from the
toolbar.
(4)
Select 3 EJECT LEADFRAME. The carrier is ejected from the workholder output.
(5)
Select DONE to remove the dialog from display.
(6)
Select MANUAL from the mode bar.
(7)
Select 3 MHS UTILITIES → 1 INDEX UTILITIES.
(8)
Select NORMAL INDEX CONTINUOUSLY and select APPLY. The MHS operations start:
(9)
(a)
The input magazine handler moves the magazine from the load tray and align the first slot
of the magazine to the workholder input slot. The output magazine handler moves the
empty magazine from the load tray and align its first slot to receive a carrier from
the workholder.
(b)
The puller pulls the leadframe in the first slot of the magazine into the workholder. The
leadframe is pulled to a position where it can be picked by the index gripper.
(c)
The index gripper moves until the first device on the carrier is aligned at the bond site and
the clamp is applied. The clamp is disabled on this device, the next device is moved to the
bond site and the clamp is applied. This continues until the clamp has been applied to all
the devices in the carrier.
(d)
After the clamp is disabled on the last device, the index gripper tucker pushes the carrier
into an output magazine slot.
(e)
The indexing cycle continues until it is stopped by you or until the input magazine does
not have carriers.
Monitor the magazine handlers and workholder as they operate.
(10) If an error is shown, note the data given in the error dialog on screen, then select CONTINUE.
(11) If the MHS does not operate and the error dialog is shown again, select ABORT. Refer to the
troubleshooting data in section 5 of this manual.
(12) When the MHS operates correctly or when all operational problems have been identified, select
the WH OPER on the toolbar.
(13) Select 1 STOP INDEXING from the Workholder Utilities menu.
(14) Select DONE to exit the menu.
(15) Select MAG OPER from the toolbar.
(16) Select 3 EJECT INPUT MAG and 7 EJECT OUTPUT MAG to eject the input and output magazines.
(17) Select DONE to exit the Mag Handler Utilities menu.
(18) Select 4 CLEAR WORKHOLDER.
(19) Use tweezers to remove leadframes from the workholder.
(20) Select DONE to exit the Workholder Utilities menu.
(21) Adjust magazine dimensions, leadframe dimensions, and MHS parameters that are necessary to
correct problems. Save MHS configuration when done.
Operator’s Guide
Page 3-35
Operation
Do MHS Operation Check
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
3.6
Recovery Operations
This section contains the recovery procedures to restore the bond operation to standard operation.
Select the topics below for the recovery operations procedures:
3.6.1 Correct a Bond Location in Auto Mode
3.6.2 Change Bond/ Wire Parameters
3.6.3 Reteach Bond Height
3.6.4 Remove Leadframe(s) from Indexer
3.6.5 Remove Magazines from Magazine Handler
98890-10EA-001-00
Revision B
Operation
Recovery Operations
Operator’s Guide
Page 3-36
IConn PLUS ELA High Performance Ball Bonder
3.6.1
Correct a Bond Location in Auto Mode
To make sure that the wires are accurately bonded to the correct locations.
(1)
Push RUN/ STOP on the MMI keypad or select 1 AUTO from the mode bar and then push 9 on the
keypad. Auto bonding operation stops and the Sequence Stop menu appears.
(2)
Select 1 BOND LOCATOR from the Sequence Stop menu. The Bond Location dialog appears. Use
the steps below to find the bond position, where correction is necessary:
WARNING:
Keep hands clear of the bond head. If a change is made in the bond location dialog, the bond head
moves immediately to that location.
(3)
(a)
Key in the device number into the 1 DEVICE NUMBER text box. If a matrix or some device
packages do not exist, this selection is OFF and set the default value of ‘1’.
(b)
Enter the value into the 2 WIRE NUMBER text box to set the necessary wire number.
(c)
Enter the value into the 3 BOND NUMBER text box to set the necessary bond number.
(d)
Select DONE to exit the dialog. Page 1 of the Sequence Stop menu appears.
Select 5 CORRECT BOND LOCATIONS from the Sequence Stop menu. The Correct Bond Locations
dialog appears.
Figure 3-34: Correct Bond Locations Dialog
(4)
(5)
Push 1 to correct single bonds.
(a)
Use the mouse and B2 mouse button to chess the crosshair to the correct bond location for
the current site (the crosshair and current bond locations).
(b)
Push B3 to teach the corrected bond location. To select a different site, chess the crosshair
to the site and push B3.
Push 2 to correct a sequence of bond sites.
(a)
Use the mouse and B2 to chess the crosshair to the first bond location in the sequence, then
push B1 to select the site. If necessary, push B3 to deselect the site. Chess to and select the
last site in the sequence in the same procedure.
(b)
Chess the crosshair to the corrected locations for the sequence of bonds and push B1 to
teach their new location.
(6)
Click on DONE when all correct bond location operations are complete. The Sequence Stop
dialog appears.
(7)
Push RUN/ STOP on the MMI keypad. Automatic bonding starts again.
Operator’s Guide
Page 3-37
Operation
Correct a Bond Location in Auto Mode
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
3.6.2
Change Bond/ Wire Parameters
To change the bond and wire parameters in the specified wire or wire group.
(1)
Push RUN/ STOP on the MMI keypad. Auto bonding operation stops and the Sequence Stop menu
appears.
(2)
Click on 3 EDIT BOND PARAMETERS. The Set Bond Parameters dialog appears.
(3)
With the use of the mouse and B1, click on 1 EDIT again and again until the necessary edit
function WIRE/ GROUP/ ALL is shown.
(4)
Push and drag with B2 to chess the video display crosshair over the necessary wire or wire in a
group. Push B1 to register wire or group selection.
(5)
To select the parameter, select the applicable parameter group item in the Set Bond Parameters
menu.
Note: Some dialogs contain more than one page. To move between pages, click on the text box
of the page number. Key in the necessary page number, then push ENTER.
(6)
Push B1 to select the parameter setting, where change is necessary. This highlights the selection
for setting change.
(7)
Key in the necessary value or select again and again to the necessary setting. Push ENTER to
register the change.
(8)
Do steps (6) and (7) again if necessary until all changes are made in the parameter set.
(9)
Click on DONE PARAMETER SET. The Set Bond Parameters dialog appears.
(10) Do steps (3) through (9) if necessary until all changes are made to each parameter set.
(11) Click on Done Group in the Set Bond Parameters dialog.
(12) Push RUN/ STOP on the MMI keypad. Automatic bonding starts again.
3.6.3
Reteach Bond Height
To teach the reference system bond height to the bonder.
Note: Bond Height is automatically taught on the first run of a loaded PP. This procedure can be
started as necessary.
(1)
Select BND HT RELEARN from the Upper Function bar.
Figure 3-35: Select ‘BND HT RELRN’ from Upper Function Bar
3.6.4
(2)
PRS search is done on the next device.
(3)
The first bond on first wire is made at slow speed. During this movement, the bonder calculates
and saves the bond height in memory.
(4)
The standard bonding operation starts again.
Remove Leadframe(s) from Indexer
Use the procedure that follows to safely remove leadframes from the workholder if bonding is stopped
with carriers in the workholder, and bonding will not continue.
WARNING:
Do not touch the heat blocks or inserts if heat elements are on. These components are hot and will
burn bare skin.
Tools, Materials, and Equipment
Part Number
Supplier
None
Local Purchase
Tweezers
(1)
98890-10EA-001-00
Revision B
Select W/H OPER from the upper function buttons. The Workholder Utilities dialog appears.
Operation
Change Bond/ Wire Parameters
Operator’s Guide
Page 3-38
IConn PLUS ELA High Performance Ball Bonder
3.6.5
(2)
Select 3 EJECT LEADFRAME from the menu. Leadframe(s) are ejected from the Indexer into the
output magazine.
(3)
Select DONE from the Workholder Utilities dialog.
Remove Magazines from Magazine Handler
If bonding is stopped and there are magazines in the Magazine Handler grippers, use this procedure to
safely remove magazines from the Magazine Handler.
Note: Clear leadframes from the indexer, then remove magazines from the Magazine Handlers.
Refer to Section 3.6.4 Remove Leadframe(s) from Indexer for more data.
(1)
Select the MAG OPER button on the toolbar.
Figure 3-36: Mag Handler Utilities Menu
Note: If Safety Covers are installed on the Magazine Handlers, the Magazine Handler access
doors must be disengaged and opened to load/unload magazines. The door latches are
controlled through options on the Mag Handler Operations menu that can be called up
by a toolbar button.
(2)
Remove the magazines from the load tray and unload tray of the input magazine handler.
(3)
Remove the magazines from the load tray and unload tray of the output magazine handler.
(4)
Select DONE to exit the Mag Handler Utilities menu.
Operator’s Guide
Page 3-39
Operation
Remove Magazines from Magazine Handler
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
3.7
Power Failure Recovery (PFR)
When the power fails during bonder operation, the system makes the best of a maximum of two
minutes of remaining battery power. The bonder tries to complete the last operation (finish wire/ finish
device/ finish index) without user aid before it starts the power down sequence. When the battery is
low, the bonder bonds the last wire, ejects the remaining leadframes from the workholder and power
down the machine.
Select the topics below for the extended power supply operation:
3.7.1 Configure Extended Power Supply
3.7.2 Extended Power Down Sequence
3.7.3 Configure the Quick/Standard Power Failure Recovery (PFR)
3.7.4 Battery Monitor
98890-10EA-001-00
Revision B
Operation
Power Failure Recovery (PFR)
Operator’s Guide
Page 3-40
IConn PLUS ELA High Performance Ball Bonder
3.7.1
Configure Extended Power Supply
Figure 3-37: Configure Extended Power Supply Dialog
(1)
Select SYS ADMIN → 2 PRIVILEGED OPERATIONS → 9 MORE (2) → CONFIGURE EXTD POWER
SUPPLY.
Note: The default configuration is set as follows:
1.
Clear Workholder: Yes.
2.
Package Completion: Finish Index.
3.
Standby Wait Timer: 10 seconds.
(2)
Select again and again 1 CLEAR WORKHOLDER to set YES or NO options. Refer to the table below
for the available options.
(3)
Select again and again 2 PACKAGE COMPLETION to set the FINISH WIRE/ FINISH DEVICE/ FINISH
INDEX option. Refer to the table below for the available options.
Parameter
CLEAR WORKHOLDER
Definition
•
•
PACKAGE COMPLETION
YES: If the battery capacity permits, the bonder does the
sequence step, a Clear Workholder operation and then shut down
fully
NO: If the battery capacity permits, the bonder does the sequence
step and then shut down fully
•
FINISH WIRE: If the battery capacity permits, the bonder will bond
•
FINISH DEVICE: If the battery capacity permits, the bonder will
•
FINISH INDEX: If the battery capacity permits, the bonder will
one wire and then shut down
bond one device and then shut down
bond all of the devices in the current index and then shut down
(4)
Operator’s Guide
Page 3-41
Key in the STANDBY WAIT TIME (one to ten seconds). If the machine power fails in idle mode,
STANDBY WAIT TIME shows the time that the machine will wait before it shut down.
Operation
Configure Extended Power Supply
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
3.7.2
Extended Power Down Sequence
The extended power down procedure lets the automatic operation continue for the last specified step to
the end and shut down automatically after a power loss. There are three possible recovery sequences
that can occur when the main power is down:
3.7.2.1 Power Down During Auto Mode
3.7.2.2 Power Down During Program Mode
3.7.2.3 Resumption of AC Power During Power Down Sequence
3.7.2.1
Power Down During Auto Mode
When AC Power Fail occurs during auto run, error 711 prompt appears. This error is a warning to the
user that the AC power is OFF and power is supplied by the UPS to the machine.
Figure 3-38: AC Power Down, UPS Dialog
When the UPS is operated, the power down sequence starts. The power down sequence is related to the
set configuration (see Section 3.7.1 Configure Extended Power Supply) and the available UPS
capacity. The system tries to complete the set package completion (finish wire, or finish device, or
finish index) and clear the workholder (if set to yes), then the bonder will shut down.
If the available capacity of the UPS is not sufficient to complete the set package, the system will follow
the sequence below before shut down:
•
Finish Wire
•
Clear Workholder (leadframes eject into the Output Magazine)
•
Finish Device
•
Finish Index
If the machine stops when an error occurs before the step is completed, the machine will not start auto
run again. During this period, the Count Down dialog is shown. After the STANDBY WAIT TIMER has
expired, the machine will shut down.
3.7.2.2
Power Down During Program Mode
If AC power fails, enters Sequence Stop mode or an error occurs during program mode, the system
saves the PP and the STANDBY WAIT TIMER (decreases) GUI appears. After the STANDBY WAIT TIMER has
expired, the machine will shut down.
Figure 3-39: Standby Wait Timer (Decreases) GUI
If no PP is loaded in memory, the machine will shut down immediately.
98890-10EA-001-00
Revision B
Operation
Extended Power Down Sequence
Operator’s Guide
Page 3-42
IConn PLUS ELA High Performance Ball Bonder
3.7.2.3
Resumption of AC Power During Power Down Sequence
If AC Power is restored while a device is bonded in UPS mode, there is no effect on the bonder, which
continues to bond automatically. If AC Power is restored while the materials are removed from the
workholder in UPS mode (the leadframes that all not fully bonded are in the output magazine) a dialog
is shown. Remove the leadframes that all not fully bonded from the output magazine to the input
magazine.
Note: The empty leadframe must be put in first into the next empty slot, above the new leadframe
slot of the Input Magazine. After that, put in the partially bonded leadframe into the slot
above the empty leadframe slot.
When you select OK, the input magazine handler does indexing rearward for two slot positions. You can
manually restart bonding.
Figure 3-40: Partially Bonded and Empty Leadframes Dialog
If output magazine holds an empty leadframe, a dialog is shown. Remove the empty leadframe in the
output magazine and insert it into an empty slot above an empty leadframe in the input magazine. When
you select OK, the input magazine handler does indexing rearward for two slot positions. You can
manually restart bonding.
Figure 3-41: Partially Bonded Leadframes Dialog
If the output magazine holds leadframes that all not fully bonded and the input magazine or output
magazine is ejected. Reverse jog is not permitted.
Figure 3-42: Reverse Jog Prohibited
Operator’s Guide
Page 3-43
Operation
Extended Power Down Sequence
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
3.7.3
Configure the Quick/Standard Power Failure Recovery (PFR)
Go to CONFIGURE mode, select 1 AUTO → 8 MISCELLANEOUS → 1 CONFIGURE POWER FAILURE
→ 1 POWER FAILURE RECOVERY.
RECOVERY
Figure 3-43: PFR Configuration
Select one of the power recovery modes: QUICK, STANDARD, or OFF.
Display
Definition
QUICK
Quick Power Failure Recovery (PFR) (see Section 3.7.3.1 Quick
Power Failure Recovery Sequence)
STANDARD
Standard PFR (see Section 3.7.3.2 Standard Power Failure Recovery
(PFR) Sequence)
OFF
Default setting. No PFR.
If QUICK is selected, the CLEAR WORKHOLDER option is set to ENABLE in the Extended Power Supply
Configuration menu and a prompt appears. Select OK to exit.
98890-10EA-001-00
Revision B
Operation
Configure the Quick/Standard Power Failure Recovery (PFR)
Operator’s Guide
Page 3-44
IConn PLUS ELA High Performance Ball Bonder
3.7.3.1
Quick Power Failure Recovery Sequence
In the Quick Power Failure Recovery (PFR) Sequence, you can accept the GUI selection to do the
motor initializations. After the initialization, a GUI appears to tell the user to manually put the
leadframe(s) that is not completed into the input magazine. Then the user can start an automatic
indexing and alignment. The machine automatically does the indexing of the leadframe until the last
device that is not complete without the clamp applied on the completed devices. The machine also
aligns the device, points at the next new wire while it enters the Sequence Stop mode. Then user can
restart auto bonding with the RUN button. During a quick recovery step, the user has an option to abort
the quick recovery sequence and exit to standard PFR sequence.
POWER UP SEQUENCE
Power up Temperature
-Bonder uses last set of
operating temperature
Quick PFR Dialog
Quick Motor Initialization
Manual Replacement of leadframes
Automatic Index and
Alignment
Continue Auto Run
- GUI Message to continue
Figure 3-44: Quick PFR Sequence
Operator’s Guide
Page 3-45
Operation
Configure the Quick/Standard Power Failure Recovery (PFR)
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
3.7.3.2
Standard Power Failure Recovery (PFR) Sequence
In the Standard Power Failure Recovery (PFR) Sequence, the usual machine initialization starts again.
For power failure recovery during initialization, it is necessary to cause an interference to make the
machine start auto run again.
Figure 3-45: Standard Power Failure Recovery
98890-10EA-001-00
Revision B
Operation
Configure the Quick/Standard Power Failure Recovery (PFR)
Operator’s Guide
Page 3-46
IConn PLUS ELA High Performance Ball Bonder
3.7.4
Battery Monitor
The software monitors the battery signal and shows the status in the icon [B] on the right of the Air
Supply icon [A]. A green setting [B] on the icon shows the battery is ON. A red setting [B] on the icon
shows the battery is OFF. If battery is OFF, refer to the Maintenance Manual, section 2: Lower Console
for more data and instructions.
If the battery capacity is low, the error dialog (#2234) appears. The Battery icon becomes red, but the
machine continues to bond. Select the MORE or DONE to exit the dialog.
Error Dialog 2234
Battery (B) Icon
Figure 3-46: Low Battery Condition Error (#2234)
Note: The light tower and alarm gives a Warning group signal. The emergency clamp open (ECO) is
not enabled.
The error dialog (#2234) only appears ONCE for each time the battery capacity becomes low. The next
error dialog 2234 will appear in these conditions:
•
The machine is fully charged. Then, the battery capacity becomes low again
•
After 30 hours, a Bad Battery error (#715) occurs. After battery recovery, the battery capacity
becomes low again
•
The machine restarts. Then, the machine battery capacity becomes low again
If the bonder detects the bad battery condition at power up or stays in the Low Battery condition for
more than 30 hours, the Bad Battery error (#715) appears. Bonder operation stops.
Figure 3-47: Bad Battery Condition Error
The USB connection between the Matrox and power supply can cause the loss of battery data on the
machine. Upon machine initialisation, a status message is shown upon correct connection between the
Matrox and the power supply. The status message appears when the power supply operates on the
battery for three second periods or when there is a change in connection status. If the connection is
broken, the [B] indicator starts to flash with the status setting color. An error message is shown. The
options below are available:
Operator’s Guide
Page 3-47
Operation
Battery Monitor
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
Note: No effect on machine operation.
Figure 3-48: Power Supply To Matrox Connection Error
•
•
•
98890-10EA-001-00
Revision B
Continue - Error message is closed. If you do not try to restore the connection between the power
supply and Matrox, the [B] indicator will continue to flash and show the battery status
More - More data on the error is shown
Connection is restored - The [B] indicator is shown with the status setting color as before
Operation
Battery Monitor
Operator’s Guide
Page 3-48
IConn PLUS ELA High Performance Ball Bonder
Chapter 4: Calibration
4.1 Calibration Introduction
4.2 Servo Calibration
4.3 Vision System Calibration
4.4 Bond Head Calibrations
4.5 Workholder Calibration
4.6 Magazine (Mag) Handler Calibration
4.7 Incomplete Calibrations
4.8 XY Table Characterization
4.9 On Bonder Personality Factor (OBPF)
4.10 Eyepoint Thermal Drift Calibration
4.11 Crosshair Offset Characterization
4.12 Process Program Portability Factors
Operator’s Guide
Page 4-1
Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
4.1
Calibration Introduction
Calibration makes sure that machine indexing, bonding and the different component functions occur
correctly. Use the calibration results as special MDP (machine dependent parameters), that cannot be
used on a different bonder.
A correctly installed capillary is necessary for many calibration procedures. The topics below give a
short introduction of each Calibration mode item.
Figure 4-1: Calibration Menu
4.2 Servo Calibration: To calibrate the X-axis and Y-axis of the XY table and Z-axis of the bond head
motor. It also calibrates the X-axis and Y-axis of the table to correct the heat related enlargement.
4.3 Vision System Calibration: To calibrate the pattern recognition system (PRS), optics position for
Lookahead feature, and Crosshair Offset.
4.4 Bond Head Calibrations: To calibrate the bond head elements and incorporate a step by step
procedure that will teach you the full capillary change and related procedures.
4.5 Workholder Calibration:To calibrate all functions of the workholder. Included are clamp positions,
rail positions and sensors, indexer positions and sensors, leadframe X position sensor, leadframe jam
detect software, and tucker eject software sensor.
4.6 Magazine (Mag) Handler Calibration: To calibrate the trays and slots of the input and output
magazine handlers. The calibrations set the position limits of the magazine handlers related to the
workholder. Also set are the locations of each set of trays used in load and unload magazines.
4.7 Incomplete Calibrations: To give a list of all of the calibrations that have not been completed or not
done at all.
4.8 XY Table Characterization: To calibrate the X and Y offsets as a function of table position and
calculate the exact coordinate data to the nearest encoder value. This feature refers to the right angle X
and Y plane to calculate alignment and bond locations.
4.9 On Bonder Personality Factor (OBPF): To calibrate the USG system on different bonders to give
the same capillary vibration.
4.10 Eyepoint Thermal Drift Calibration: To calibrate the drift caused by heat enlargement of the
device to be bonded to increase precision.
4.11 Crosshair Offset Characterization: To adjust and correct the offset difference caused by the full
bond head movement on the XY table. This gives better control to the bond head movement and
prevent bonding errors caused by offset errors.
4.12 Process Program Portability Factors: To calibrate for 100% PP portability from bonder to bonder.
98890-10EA-001-00
Revision B
Calibration
Calibration Introduction
Operator’s Guide
Page 4-2
IConn PLUS ELA High Performance Ball Bonder
4.1.1
Calibration Sequence
This shows a typical calibration sequence. All calibration procedures can be done independently
without the full sequence. Do a full calibration at the start during machine set up.
START
Temperature Configuration
Temperature Settings are done
in CONFIGURE Mode.
Servo Tune
PRS
Workholder Calibration
Crosshair Offset
- Rails
- Clamp
- Indexer
- X Sensor
- Tucker Eject
- Grippers
- Jam Detect
Bond Force
USG
EFO Height
Magazine Handler
Calibration
XY Table Characterization
- Input Trays
- Output Trays
- Input Slot
- Output Slot
DONE
Figure 4-2: Calibration Sequence
Operator’s Guide
Page 4-3
Calibration
Calibration Sequence
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
4.2
Servo Calibration
WARNING:
Electromagnetic Fields! Servo motors are used to position the bond head and optics give strong
magnetic fields. Bond head movement can have bad effect on medical aid devices (e.g. pacemakers).
If you use such devices, do not go near the equipment when it is in operation.
Servo calibration lets you adjust the servo values of the X, Y and Z axes, which are necessary in other
calibrations that have bond head movement. Thus, Servo calibration must be done before these
calibrations.
Select SERVO from the CALIBRATION menu to open the SERVO CALIBRATION menu. When this is done,
the calibration procedure can be selected. The figure below shows the items in the SERVO CALIBRATION
menu.
#1
#6
#7
Figure 4-3: Servo Calibration Menu and its Dialog
See related topics below:
4.2.1 Tune X-axis, Y-axis, and Z-axis
4.2.2 Map Z Encoder
4.2.3 Tuned Servo Parameters
4.2.4 Fine Phasing
4.2.1
Tune X-axis, Y-axis, and Z-axis
The three calibration procedures above automatically adjust the servo values of the X, Y and Z axes in
sequence. When you start the calibration procedure, the bonder completes all the necessary steps
automatically.
98890-10EA-001-00
Revision B
Calibration
Servo Calibration
Operator’s Guide
Page 4-4
IConn PLUS ELA High Performance Ball Bonder
4.2.2
Map Z Encoder
The Map Z encoder calibration makes sure that the Z encoder counts are aligned with the setup of the
machine. These are the steps to do the calibration:
(1)
Go to CALIBRATION → SERVO menu and select MAP Z ENCODER to start the Z encoder calibration
procedures.
Figure 4-4: Servo Menu
(2)
Select LEARN MAP USING STEP GAUGE.
(a)
LEARN MAP USING STEP GAUGE:
(b)
SET MAP MANUALLY WITH OPTIONAL DATA:
This starts the map gauge calibration
For more data on Set Map Manually with
Optional Data, go to Step (11)
Figure 4-5: Z Axis Encoder Map Calibration Dialog
(3)
Set all workholder heaters to off and let the temperature of the heaters decrease to less than 32°C.
(a)
CONTINUE:
(b)
CANCEL:
Opens the workholder rails
Goes back to the first menu
Figure 4-6: Z Axis Encoder Map Calibration Dialog
Operator’s Guide
Page 4-5
Calibration
Map Z Encoder
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Revision B
IConn PLUS ELA High Performance Ball Bonder
(4)
Select CONTINUE. The warning appears to clear the workholder. Select OK and rails will move.
Note: If the software detects the workholder temperature is at 32 degree or higher, the
warning appears:
Figure 4-7: Workholder Temperature Warning Dialog
Figure 4-8: Z Axis Encoder Map Calibration Dialog and Warning
(5)
Install the Z Encoder Map gauge (08890-0901-001-xx) on the heat block in the orientation
shown below. Select CONTINUE. The table will move to the near location of the upper left corner
of the left pad on the gauge.
Figure 4-9: Z Axis Encoder Image
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Calibration
Map Z Encoder
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IConn PLUS ELA High Performance Ball Bonder
(6)
Align the corner. An image of an aligned corner appears:
Figure 4-10: Align Z Axis Encoder Image
(7)
The table will move to the near location of the front right pad bottom right corner. An image of
an aligned corner is shown below:
Note: If necessary, you can select back and align the top left corner of the gauge again.
Figure 4-11: Z Axis Encoder Map Calibration Image
Operator’s Guide
Page 4-7
Calibration
Map Z Encoder
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IConn PLUS ELA High Performance Ball Bonder
(8)
Select CONTINUE. The learn sequence starts. The bond head will move to each of the three pads
on the gauge and learn the height. And it will move to the steps gauge in the center and learn the
heights. On completion with a learned Map, the pop-up appears:
Figure 4-12: Z Encoder Map Warning Dialog
(9)
The bond head will move to the rear right end of the travel. The Z motor will disable
momentarily when the new Z Encoder scalar is sent to the servo. The Z motor will energize and
go up to set the Z top limit. It will then go down to set the Z index mark. The process ends when
Z motor moves to the safe position near the top limit. On completion, the pop-up appears.
Note: Make sure all calibrations are done.
Figure 4-13: Z Axis Encoder Map Calibration
(10) Select CONTINUE.
(11) Go to CALIBRATION → SERVO → MAP Z ENCODER and select SET MAP MANUALLY WITH OPTIONAL
DATA. The Z Axis Encoder Map Calibration dialog opens. Select a value in the CLICK FOR
OPTIONAL VALUES. This menu lets you continue with the same Z initialization sequence from
step (3) to (9). This option is used to fine tune the calibration for specified application.
Figure 4-14: Z Axis Encoder Map Calibration
Parameter
4.2.3
Definition
CURRENT MAP ADJUST
It is the value given by the Optional Value. Default: 0.00
CLICK FOR OPTIONAL VALUES
There are three values to select: 0.00, 0.26 and 0.55.
ACCEPT
It takes the Optional Value as the CURRENT MAP ADJUST value and
the calibration will be done based on this value.
CANCEL
Cancel and no user calibration value is accepted.
Tuned Servo Parameters
Select TUNED SERVO PARAMETERS from the SERVO menu to open the TUNED SERVO PARAMETERS
dialog. Select SERVO AXIS in the TUNED SERVO PARAMETERS dialog to see the X, Y or Z servo
parameters. You can see but cannot change these parameter settings.
98890-10EA-001-00
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Calibration
Tuned Servo Parameters
Operator’s Guide
Page 4-8
IConn PLUS ELA High Performance Ball Bonder
4.2.4
Fine Phasing
The XY amplifier finds the point in a phase to make sure that the entry point is in "commutation" table.
Accurate phase values can give better performance of the XY table. When you select the 6 FINE
PHASING and OK, the XY table moves to its limits to get the phase values of the point. When the
calibration is completed, a dialog appears to show the results. Select OK to save the values.
Figure 4-15: X And Y Fine Phasing Results
Operator’s Guide
Page 4-9
Calibration
Fine Phasing
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IConn PLUS ELA High Performance Ball Bonder
4.3
Vision System Calibration
The VISION SYSTEM menu contains the calibration procedures related to the vision system.
Figure 4-16: Vision System Dialog
Select the topics below for these calibration procedures:
4.3.1 Pattern Recognition System (PRS)
4.3.2 Optics Position
4.3.3 Crosshair Offset
4.3.1
Pattern Recognition System (PRS)
PRS calibration makes sure that the video image pixels shown give the correct distance. To do the PRS
calibration, select PRS from the Calibration menu to open the Calibrate Eyepoint Values dialog.
Figure 4-17: Calibrate Eyepoint Values Dialog
The PRS calibration data is used in PRS/VLL calculation. If PRS calibration fails, the eyepoints cannot
be taught on the bonder. Unsatisfactory calibration result can give bad bond positions. Bond position
can change randomly from device to device. Bond positions change as a group on a device and have
more effect on the bonds near the problem eyepoint. See related topics below:
4.3.1.1 PRS Calibration Setup
4.3.1.2 Do the PRS Calibration
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Vision System Calibration
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4.3.1.1
PRS Calibration Setup
Note: To do PRS calibration, a clear and constant point of reference (die or lead eyepoint) is
necessary. Make sure that you have a device at the bond site.
(1)
Select the eyepoint:
(a)
Make sure that the clamp and vacuum are applied to the production device at the bond site.
Make sure that the GUI video display is shown and that the diffuser is set to 10 psi (0.70
kg/cm²).
(b)
Select on CALIBRATION, then select PRS from the CALIBRATION mode menu.
(c)
Move the PRS teach window to a good eyepoint location with the use of the mouse button
B2.
(2)
Set the PRS calibration parameters:
Parameter
Definition
WINDOW SIZE
The Calibrate Eyepoint Values dialog lets you adjust the dimensions of
the PRS Teach window. The teach window is a green box aligned to
the crosshair center. The window sets the search limits with reference
to the eyepoint pattern. Select VERTICAL or HORIZONTAL in the
Calibrate Eyepoint Values dialog to set the window dimensions. Put
the dimension values into the text box, then select ENTER.
ALGORITHM
Set ALGORITHM to DIE or LEAD. Usually, PRS calibration is done on
a die image with clear and accurate edges. But some devices can
contain features that are less clear and accurate, for example lead
eyepoints (an image that contains discrete components such as
capacitors or diodes). In this condition, if the only alternative is to do
the PRS calibration, the LEAD algorithm must be used. The algorithm
selection has no effect on subsequent calibration results.
MAGNIFICATION
Set MAGNIFICATION to High (6x) or Low (2x) magnification. Do the
PRS calibration for high and low magnifications. During PRS
calibration, the High or Low magnification button on the monitor
screen is disabled in sequence.
ILLUMINATION
Select F10 to open the Lighting dialog appears and adjust the
illumination for clear image edges. Clear edges are necessary to
teach eyepoints. A high vertical illumination level is recommended
when you teach the eyepoints on the die. A high oblique illumination
level is recommended when you teach the eyepoints on the leads.
(3)
Set the related operations:
Parameter
Definition
CROSSHAIR OFFSET
Shows the dialog used to correct crosshair offset. See more data in
section 4.3.3 Crosshair Offset that follows.
EDIT L/F PARAMETERS
Shows the L/F Parameters dialog, which lets you to adjust a
leadframe parameter. Refer to Reference Guide for more data on
parameters in the L/F Parameters dialog.
CLAMP UTILITIES
Shows the dialog to set clamp operations. These can be necessary
during the PRS calibration procedure to change the position of the
view of the device.
Operator’s Guide
Page 4-11
Calibration
Pattern Recognition System (PRS)
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4.3.1.2
Do the PRS Calibration
(1)
Adjust the eyepoint parameters for the best illumination, view and magnification.
(2)
Push B1 to start the calibration. If the PRS calibration result is correct, the bonder saves the result
automatically and does a PRS data update in the Calibrate Eyepoint Values dialog.
Note: When the calibration completes correctly for one magnification adjustment, do the PRS
calibration for the other magnification adjustment (High or Low).
If the calibration does not complete correctly, a message prompt with “unsuccessful calibration”
appears. These messages are as follows:
•
“Eyepoint Teach Process Was Unsuccessful”
•
“Not Enough Edges”
•
“Pattern Not Unique”
For these conditions, you can correct the cause of the failure by:
•
The adjustment of the teach window position over the eyepoint location
•
The window dimensions and/or the lighting settings
The PRS calibration can fail if the optics hardware is set out of the limits. For this condition, a ‘PRS
Calibration Failed’ prompt appears is the same as the one shown in the figure below. The prompt shows
pixels to axis pulse ratios.
Figure 4-18: Calibration Results Message
If a pixel to axis pulse ratio value is out of range, it is necessary to do optics focus adjustment and
camera rotation. It can be necessary to do a camera rotation adjustment for “X per Y” and “Y per X”
values that do not fall in range. It can be necessary to do a focus adjustment for “X per X” and “Y per
Y” values that do not fall in range. Refer to Maintenance Manual, optics section for more data on these
adjustments.
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Calibration
Pattern Recognition System (PRS)
Operator’s Guide
Page 4-12
IConn PLUS ELA High Performance Ball Bonder
4.3.2
Optics Position
The optics position adjustment includes three options: LOOKAHEAD OFFSET, NOMINAL OFFSET and USER
The goal of the Lookahead Offset feature is to increase the UPH of your application. The
Lookahead alignment bonds a device at the capillary side and aligns the next device at the camera side.
Thus, it is not necessary for camera offset movement in device system during the bonding phase.
OFFSET.
Figure 4-19: Optics Position Dialog
Select the topics below for the optics position setup:
4.3.2.1 Lookahead Offset Calibration Procedure
4.3.2.2 Nominal Offset Calibration Procedure
4.3.2.1
Lookahead Offset Calibration Procedure
The purpose of the Lookahead optics setup is to show you the procedures to set up the lookahead
feature on the application. Lookahead can be set up with or without a PP.
Note: The crosshair offset value in the X-axis must be more than 400 mils. An adjustment less than
400 mils can cause a possible collision between the optics assembly and the glass tube in the
wire clamp area. The system gives a warning and recommends you to repeat the calibration.
Tools, Materials, and Equipment
Hex Wrench Set
Optical Alignment Wedge Tool
Part Number
Supplier
None
Local Purchase
08089-0901-025-XX
Kulicke & Soffa
-
-
Production Package with Matrix Devices
(1)
Configure the MHS device parameters, load the matrix device onto the workholder rails, and
clamp the device.
(2)
Select 3 CROSSHAIR OFFSET from the VISION SYSTEM menu and do the crosshair offset
calibration.
(3)
Select 2 OPTICS POSITION from the VISION SYSTEM menu.
(4)
Set 1 SELECT OFFSET to LOOKAHEAD OFFSET.
(5)
Select 2 START OPTICS ADJUSTMENT to start the adjustment.
Operator’s Guide
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Calibration
Optics Position
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IConn PLUS ELA High Performance Ball Bonder
Note: If the crosshair offset is not done, this dialog appears to tell you to do the crosshair
offset calibration before you continue.
Figure 4-20: Crosshair Offset Message Dialog
Figure 4-21: Lookahead Adjustment Dialog 1
(6)
Select 1 START CROSSHAIR ADJUSTMENT.
(7)
The dialog below prompts you to select a feature on the device that you can easily identify again
and put the crosshair on it.
Figure 4-22: Lookahead Adjustment Dialog 2
(8)
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Select CONTINUE.
Calibration
Optics Position
Operator’s Guide
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IConn PLUS ELA High Performance Ball Bonder
(9)
Put in the optical alignment wedge tool (08089-0901-025-XX) between the optics housing and
the dowel pins on the front Y-slide. The narrow end must be to the left. Loosen the four bolts on
the optics housing but not fully.
Figure 4-23: Lookahead Adjustment Dialog 3
A
D
B
C
E
A
B
C
Optics Housing Pins (x2)
Flush Optics Housing to the rear
Optics Alignment Wedge Tool (narrow end side)
D
E
Optics Housing Screws (x4)
Front Y Slide Pin (x2)
Figure 4-24: Optical Alignment Wedge Tool
(10) Select CONTINUE.
(11) Manually move the optics housing rearward to the previously targeted device done step 7. Put the
crosshair at the center of the feature previously targeted on that device.
Figure 4-25: Lookahead Adjustment Dialog 4
Note: An adjustment less than 400 mils can cause a possible collision between the optics
assembly and the glass tube in the wire clamp area.
(12) Select OK.
Operator’s Guide
Page 4-15
Calibration
Optics Position
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IConn PLUS ELA High Performance Ball Bonder
(13) Tighten the bolts on the optics housing. Make sure that the optics housing touches the wedge tool
while you tighten. Remove the wedge tool when done. Because of optics movement, it is
necessary to adjust the wire tensioner tube assembly to correct the wire path.
Figure 4-26: Lookahead Adjustment Dialog 5
(14) Select CONTINUE.
(15) The machine prompts for a PRS calibration. Do the PRS calibration.
(16) The machine shows the result dialog from the lookahead setup as shown in the figure below.
Make sure that the Crosshair offset value is between 400 and 800 mils.
Figure 4-27: Lookahead Crosshair Offset Values Dialog
(17) Select OK. The machine calculates the crosshair offset differences and transmits the results to the
system.
4.3.2.2
Nominal Offset Calibration Procedure
The purpose of the nominal optics setup is to reset the optics offset position to the default Crosshair set
up of 400 mils.
Note: The crosshair offset value in the X-axis must be more than 400 mils. An adjustment less than
400 mils can cause a possible collision between the optics assembly and the glass tube in the
wire clamp area. The system gives a warning. Do the calibration again.
Tools, Materials, and Equipment
Hex Wrench Set
Optical Alignment Wedge Tool
Part Number
Supplier
None
Local Purchase
08089-0901-025-XX
Kulicke & Soffa
-
-
Production Package with Matrix Devices
(1)
Configure the MHS device parameters, load the matrix device onto the workholder rails, and
clamp the device.
(2)
Select 3 CROSSHAIR OFFSET from the vision system menu and do the crosshair offset calibration.
(3)
Select 2 OPTICS POSITION from the vision system menu.
(4)
Set 1 SELECT OFFSET to NOMINAL OFFSET.
(5)
Select 2 START OPTICS ADJUSTMENT to start the adjustment.
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Optics Position
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IConn PLUS ELA High Performance Ball Bonder
Note: If Crosshair Offset is not done, this dialog appears to prompt you to do the Crosshair Offset
before you continues.
Figure 4-28: Crosshair Offset Message Dialog
Figure 4-29: Crosshair Adjustment Dialog 1
(6)
Select 1 START CROSSHAIR ADJUSTMENT.
(7)
The dialog below prompts you to select a feature on the device that you can easily identify again
and put the crosshair on it.
Figure 4-30: Crosshair Adjustment Dialog 2
(8)
Operator’s Guide
Page 4-17
Select CONTINUE.
Calibration
Optics Position
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IConn PLUS ELA High Performance Ball Bonder
(9)
Put in the optical alignment wedge tool (08089-0901-025-XX) between the optics housing and
the dowel pins on the front Y-slide. The narrow end must be to the left. Then loosen the four bolts
on the optics housing but not fully.
Figure 4-31: Crosshair Adjustment Dialog 3
A
D
B
C
E
A
B
C
Optics Housing Pins (x2)
Flush Optics Housing towards the rear
Optics Alignment Wedge Tool (narrow end side)
D
E
Optics Housing Screws (x4)
Front Y Slide Pin (x2)
Figure 4-32: Optical Alignment Wedge Tool
(10) Select CONTINUE.
(11) Manually move the optics housing rearward to the previously targeted device done step 7. Align
the crosshair center with the feature previously targeted on that device.
Figure 4-33: Crosshair Adjustment Dialog 4
Note: An adjustment less than 400 mils can cause a possible collision between the optics assembly
and the glass tube in the wire clamp area.
(12) Select OK.
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Optics Position
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(13) Tighten the bolts on the optics housing. Make sure that the optics housing touches the wedge tool
while you tighten. Remove the wedge tool when done. Because of optics movement, align the
wire tensioner tube assembly along the capillary.
Figure 4-34: Crosshair Adjustment Dialog 5
(14) Select CONTINUE.
(15) The machine prompts for a PRS calibration. Do the PRS calibration.
(16) The machine shows the result dialog from the crosshair offset setup. as shown in the figure
below. Make sure that the Crosshair offset value is between 400 and 800 mils.
Figure 4-35: Nominal Crosshair Offset Values Dialog
(17) Select OK to start the machine calculation for the crosshair offset differences and send the results
to the system.
Operator’s Guide
Page 4-19
Calibration
Optics Position
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IConn PLUS ELA High Performance Ball Bonder
4.3.3
Crosshair Offset
The manual CROSSHAIR OFFSET calibration corrects the X-axis and Y-axis distance from the location
seen through the optics and the position (where the bond tool tip touches the work). This offset can
occur as a result of one or more of the below:
•
Capillary replacement
•
Optics adjustment
•
Device thickness change
•
Bond head adjustment
Once this offset is measured and corrected, the capillary touches the exact point targeted by the
electronic crosshair.
Select the topics below for Crosshair Offset options:
4.3.3.1 Set the Crosshair Offset Calibration Conditions
4.3.3.2 Crosshair Offset Calibration
4.3.3.1
Set the Crosshair Offset Calibration Conditions
Select the 3 CROSSHAIR OFFSET from the VISION SYSTEM menu to open the CROSSHAIR OFFSET
calibration dialog. The CROSSHAIR OFFSET calibration dialog contains a high/low magnification
selection and shows the two sets of crosshair offset values. The offset difference between the low and
high magnifications is also shown.
Figure 4-36: Crosshair Offset Calibration Dialog
Note: If the crosshair offset calibration data were found, a dialog appears for you to select to
calibrate High magnification only or High and Low magnifications. The high magnification
only selection uses previously calibrated offset values between the 2 cameras, thus it is not
necessary to teach the low magnification offset again. This option is only applicable for
capillary and package changes.
The primary calibration dialog lets a full range of options to be selected and set. The items below
specify each option.
Parameter
Definition
CURRENT CROSSHAIR OFFSET
Shows the crosshair offset values for the X-axis and Y-axis for high
and low magnification optics (high (6x) & low (2x)). The delta between
the low magnification offset and the high magnification offset is also
shown.
MODE
When you set this to LIVE CYCLE, the bonder does the bond cycle
and make a ball. In DRY CYCLE mode, the bonder does the bond
cycle, do not make a ball but makes a tool mark on the work surface.
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Calibration
Crosshair Offset
Operator’s Guide
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IConn PLUS ELA High Performance Ball Bonder
Parameter
ALIGNMENT BOX SIZE
Definition
When Mode is set to DRY CYCLE and PRS ASSISTANCE is set to ON,
ball diameter dimensions is shown. If PRS ASSISTANCE is set to OFF,
alignment box dimensions is shown. When Mode is set to LIVE
CYCLE and PRS ASSISTANCE is disabled, and the alignment box
dimensions is shown.
•
•
6 PRS ASSISTANCE: If it is ON, it is not necessary to put the
crosshair accurately at the center of the tool mark. Put the
crosshair near the tool mark and push B3, then the bonder
automatically refers to the tool mark location and calibrates the
crosshair offset. If the tool mark is not found, it prompts a failure
to find tool mark message and set PRS ASSISTANCE to OFF.
If set to OFF, it is necessary to put the crosshair accurately at the
tool mark center to teach the tool mark position manually
7 PRS FIND COUNT: 10-30: This sets the number of times the tool
mark is found with PRS ASSISTANCE is set to ON. The default
setting is 15 counts
MAGNIFICATION
Set MAGNIFICATION to HIGH or LOW magnification if it is set and
necessary. Do the crosshair offset calibration for high and low
magnifications. During the calibration, the High/Low magnification
button on the monitor screen is disabled.
APPLY CHANGE TO
Sets the scope of calibration to which the changes are applicable to
CURRENT MAG or BOTH MAGS. This changes only the offsets for the
selected magnification and is usually used to adjust the offset values.
PRS SETTINGS
When selected, the PRS ASSISTANCE settings menu appears.
CLAMP UTILITIES
Opens a dialog that lets you do clamp operations. These can be
necessary during the PRS calibration procedure to change the
position of the shown device.
See section 4.3.3.2 Crosshair Offset Calibration.
4.3.3.2
Crosshair Offset Calibration
Tools, Materials, and Equipment
Production Device
Part Number
Supplier
None
None
Note: Since the dimensions of crosshair offset is not known, the location targeted by the crosshair
will not be where the tip touches the die. Activate Z Chess on the upper function buttons and
lower the capillary to touch the work surface. Identify this location with the use of the
microscope. This procedure makes the search for the tool mark easy because its general
location is identified.
(1)
Make sure that the clamp and vacuum is applied to the device at the bond site and the live video
is set to the large display window.
(2)
If necessary, select F10 and adjust the illumination on the device. Select DONE when completed.
(3)
Select CALIBRATION at the mode bar. Select 3 BONDHEAD → 1 CROSSHAIR OFFSET. The Crosshair
Offset Calibration dialog appears. Open this menu through 2 VISION SYSTEM → 3 CROSSHAIR
OFFSET.
(4)
Set MODE to DRY CYCLE.
(5)
Set MAGNIFICATION to HIGH.
Operator’s Guide
Page 4-21
Calibration
Crosshair Offset
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IConn PLUS ELA High Performance Ball Bonder
(6)
If you use the automatic find feature, set PRS ASSISTANCE of PRS ASSISTANCE SETTINGS to ON.
The blue crosshair overlay changes to a green circular overlay with a circular diameter equal to
the inner dimensions of the tool mark. If you use the manual tool mark find, set PRS ASSISTANCE
of PRS ASSISTANCE SETTINGS to OFF.
(7)
Change the PRS FIND COUNT if the default value of 15 is not sufficient.
(8)
In the ALIGNMENT BOX SIZE, set the value equal to the nominal dimensions of the tool mark, thus
the PRS system finds the tool mark correctly. The nominal tool mark dimensions is the wire
diameter dimensions.
(9)
Use the mouse and button B2 to position the crosshair over a clear area on the die.
Put capillary above die
Select B1 to make a tool mark
Put crosshair near the tool mark and
select B3 - Calibration
B
A
A
Green Circular Overlay
B
Tool Mark
Figure 4-37: Manual Crosshair Offset Calibration Sequence
(10) Push button B1 to make a tool mark on the die.
(11) Position crosshair near the tool mark and push button B3 to do the calibration. The system
automatically finds the tool mark, calibrate the crosshair offset and apply the values to the
system. If tool mark cannot be found, go to step (13).
(12) Set MAGNIFICATION to LOW, then do steps (9) through (11) again.
(13) If tool mark cannot be found, use the mouse and button B2 to position the crosshair, thus it is at
the center of the tool mark. Push F2 button (Z Video) to expand the video image. Make sure that
the crosshair is at the center position of the tool mark.
(14) Select B3 to do the calibration. The system calibrates the crosshair offset and apply the values to
the system.
(15) When offset calibration is completed, the decision box shown in the figure below appears on the
monitor. It shows:
•
•
•
The X and Y offset values
The X and Y placements of the tool mark
The X and Y positions of crosshair during calibration
(16) Select OK to save the calibration or CANCEL to discard it and repeat the procedure.
Figure 4-38: Crosshair Offset Calibration Decision Box
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Calibration
Crosshair Offset
Operator’s Guide
Page 4-22
IConn PLUS ELA High Performance Ball Bonder
4.4
Bond Head Calibrations
WARNING:
Electro-magnetic Fields! Servo motors that move the bond head and optics have strong magnetic
fields. The artificial heart stimulation devices (such as pacemakers) may operate incorrectly during
bond head movement. Thus, personnel with such devices must not be near the equipment while it is
in operation.
The bond head calibration lets you set all aspects of bond head operation but not those related to X and
Y movements.
Figure 4-39: Bond Head Calibration Menu
See related topics below:
4.4.1 Crosshair Offset
4.4.2 EFO (Electronic Flame Off) Height Procedure
4.4.3 Z-axis Adjustments
4.4.4 Bond Force Calibration
4.4.5 USG (Ultrasonic Generator) Calibration
4.4.6 Capillary (Cap) Change
4.4.1
Crosshair Offset
Refer to section 4.3.3.2 Crosshair Offset Calibration.
Operator’s Guide
Page 4-23
Calibration
Bond Head Calibrations
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IConn PLUS ELA High Performance Ball Bonder
4.4.2
EFO (Electronic Flame Off) Height Procedure
EFO Height calibration finds the correct distance between the capillary tip and the EFO wand to get
correct ball formation. The height of the EFO wand is found in distance (mils or mm) of the bond head
Z-axis travel. Calibration is necessary after a flowhead setup or EFO wand replacement. This is not
necessary after a capillary change. Select 2 EFO from the bond head menu to show the EFO Height
dialog.
See section 4.4.2.1 Execute Calibration
Sequence for Redo Calibration procedures.
Figure 4-40: EFO Height Dialog
is a password-protected feature that lets you add a
compensation value (portability factor) for the EFO Current Offset. For more data on this
feature, refer to section 4.12 Process Program Portability Factors.
Note:
3 CHANGE EFO CURRENT OFFSET
(1)
Click on CALIBRATION at the mode bar. The Calibration menu appears.
(2)
Select 3 BOND HEAD. The bond head menu appears.
(3)
Select 2 EFO from the bond head menu. The EFO dialog appears.
(4)
Select the Z CHESS button from the toolbar. This lets you use the Up/Down arrow keys on the
MMI to pulse the Z-axis motor up and down. Instruction prompts appear in the data box on the
monitor screen.
Enable Z
Chess
Figure 4-41: Z Chess Instructions
(5)
Use the Up/Down arrow keys, chess the Z-axis to move the EFO wand height to between 260
mils and 280 mils. While you chess the Z-axis, monitor the Z-axis position indicator until the
software gets the application value. The Z-axis position indicator is found in the upper right
corner of the monitor screen. If the Z-axis position is not in the correct range during the height
adjustment, the instructions appear in the data box as the figure below.
Out of range
Figure 4-42: EFO Wand Height Instructions
Note: The acceptable range for the EFO wand height is 260 to 280 mils. The beat value is 270 mils.
A prompt appears in the data box to tell you that the range is more than the permitted range in
the positive or negative direction. If the software cannot get this range, cancel the calibration
and adjust the EFO wand position, then do the calibration again.
98890-10EA-001-00
Revision B
Calibration
EFO (Electronic Flame Off) Height Procedure
Operator’s Guide
Page 4-24
IConn PLUS ELA High Performance Ball Bonder
(6)
When the Z-axis position indicator shows the applicable value, click on 1 ACCEPT to keep the
data or 2 CANCEL to cancel the calibration.
Figure 4-43: EFO Calibration
4.4.2.1
Execute Calibration Sequence
In the current EFO height calibration process, it is necessary to redo the calibration sequence from the
start. This feature adds the Redo Calibration option that comes with less calibration steps and enables
the user to accept the calibration result if it is satisfactory.
To use this feature, do as follows:
(1)
Teach or load a process program and enable the Copper kit.
(2)
Go to the CALIBRATION → BOND HEAD → EFO → CALIBRATION SETTINGS menu and set
CALIBRATION WITH GAUGE to YES.
Figure 4-44: EFO Height Dialog
(3)
Select EXECUTE CALIBRATION SEQUENCE to start EFO Auto Calibration. If the calibration value
is out of the limit, a warning appears in the Calibration Results Dialog as shown below:
Figure 4-45: Calibration Results Dialog
Operator’s Guide
Page 4-25
Calibration
EFO (Electronic Flame Off) Height Procedure
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
See the table below for the parameters and the related definition.
Parameter
Definition
VERIFY NEW EFO HEIGHT
The capillary tip moves down to the measured EFO height position.
The user can do a check on the EFO wand and capillary tip position
with microscope. When the EFO height value is out of the limit of the
EFO position (with the minimum and maximum settings), the
verification is not permitted. A message dialog appears:
REDO CALIBRATION
The Bond Head moves down and measures the EFO height again.
Select Calibration Settings or Execute Calibration Sequence in the
dialog shown below:
The user can edit the EFO Height Offset and EFO Height Range
values in the dialog shown below:
ABORT
98890-10EA-001-00
Revision B
The EFO Height Calibration fails and this option ends the calibration.
Calibration
EFO (Electronic Flame Off) Height Procedure
Operator’s Guide
Page 4-26
IConn PLUS ELA High Performance Ball Bonder
(4)
If the calibration value is within the limit, the new EFO height is shown in the Calibration
Results Dialog and the calibration result is saved. This ends the calibration sequence.
Figure 4-46: Calibration Results Dialog (Result Accepted)
See the table below for the parameters and the related definition.
Parameter
Definition
ACCEPT
The EFO Height Calibration result is saved and this ends the
calibration sequence. The “Accept” option is only available for the
successful calibration. After “Accept”, the message dialog appears:
ABORT
When the EFO Height Calibration is successful, this option ends the
calibration sequence.
1. After “Abort”, a dialog appears:
2.
4.4.3
Select OK, a dialog appears:
Z-axis Adjustments
Z-axis adjustments lets you operate the Z-axis function of the bond head correctly. Select 3 Z-AXIS
ADJUSTMENTS from the bond head menu to show the Z-axis Adjustments menu.
Figure 4-47: Z-axis Adjustments Menu
Operator’s Guide
Page 4-27
Calibration
Z-axis Adjustments
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
Note: Select 3 LOOP HEIGHT FACTOR/OFFSET to open a password-protected feature. This lets you
program a compensation value (portability factor) for the Loop Height Scale Factor and Loop
Height Offset. Portability factors are part of the machine dependent parameters (MDPs). It is
your responsibility to manually calibrate the portability factors. This makes sure that the same
process program can be used for different machines to get the same process performance. For
more data on this feature, refer to section Process Program Portability Factors.
See related topics below:
4.4.3.1 Align Transducer
4.4.3.2 Set Z Reset
4.4.3.3 Loop Height Factor/Offset
4.4.3.1
Align Transducer
Note: Transducer alignment is a technical procedure and must be done when necessary by trained
personnel only.
This mechanical calibration makes sure that the capillary is perpendicular to the work surface during
bonding.
The bond plane for the IConn PLUS ELA is set. The workholder rails must be lifted or lowered to align
the bond plane that includes the thickness of the device.
The transducer alignment calibration takes you through a sequence of dialogs with instructions to
explain the data in the MHS software. The sequence continues until completed or aborted. If an error
occurs during the sequence, it will abort and an error message appears to tell you the reason the
sequence is aborted.
Tools, Materials, and Equipment
Part Number
Supplier
Hex Wrench Set
None
Local Purchase
Hand Tools
None
Local Purchase
Torque Driver, 35 oz-in (0.25 Nm)
08828-0901-002-xx
Kulicke & Soffa
Perpendicularity Setup Gauge
08888-0901-014-xx
Kulicke & Soffa
Bond Force Calibration Weight Assembly
08888-0901-020-xx
Kulicke & Soffa
None
Local Purchase
Shim, 2–mil (0.05 mm), metal
(1)
Click on CALIBRATION at the mode bar. The Calibration menu appears.
(2)
Press 3. The BOND HEAD menu appears.
(3)
Press 3. The Z-AXIS ADJUSTMENTS menu appears.
(4)
Select 1 TRANSDUCER ALIGNMENT from the menu. The instruction dialog for Step 1 appears.
Figure 4-48: Transducer Alignment: Step 1 Instructions
(5)
98890-10EA-001-00
Revision B
Select 1 START from the Step 1 dialog. This causes all material to be ejected from the workholder.
The puller and indexer move to their parked position. Wait until all movements have stopped
before you continue.
Calibration
Z-axis Adjustments
Operator’s Guide
Page 4-28
IConn PLUS ELA High Performance Ball Bonder
WARNING:
Injury Hazard. Hot surfaces can cause burns. Do not touch the clamp insert with no hand
protection. When you remove or attach the clamp insert, install two screws in the clamp insert and
hold the screws with pliers. There are two M4 tapped hole in the clamp insert for this purpose.
(6)
Remove the clamp insert.
(7)
Install the heat block. Make sure that the perpendicularity gauge can extend above the heat block
cavity.
(8)
Select 2 CONTINUE from the Step 1 dialog. The bond head moves to the center of the heat block.
Then, the heat block is moved to its last calibrated bond plane position. The Step 2 dialog
appears.
Figure 4-49: Transducer Alignment: Step 2 Instructions
(9)
Loosen the Z-axis lock screw to release the EFO wand.
(10) Remove the EFO wand.
(11) Carefully chess the bond head to move the transducer above the center of the heat block.
(12) Select 1 CONTINUE from the Step 2 dialog. This disables the Z-axis servo motor and enables the
heat block motor. The Step 3 dialog appears.
Figure 4-50: Transducer Alignment: Step 3 Instructions
(13) Remove the capillary from the transducer.
(14) Adjust side-to-side perpendicularity:
(a)
Operator’s Guide
Page 4-29
Install the perpendicularity gauge on the heat block. Orientate the gauge positions of the
two touch pads (1 and 2) to the positions as shown in the figure below.
Calibration
Z-axis Adjustments
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
Note: Make sure that the gauge is at the center of the heat block cavity. The feet of the gauge
must not fall into the heat block cavity and must be seated on the heat block surface. Use
the Up/Down arrow keys on the MMI to lift or lower the heat block.
A
B
Perpendicularity Gauge
Transducer
C
Heat Block
Figure 4-51: Gauge Position (Top View)
CAUTION:
Do not let the transducer parts fall into the workholder during the next step. Put a cloth above the
workholder to catch the parts if they do drop.
(b)
Remove the screw and washer from the left side of the transducer. Install the shoulder
screw (supplied with gauge) and tighten 1 to 2 turns.
Note: If the transducer tabs touch the screws at the end of alignment, there could be a
negative effect on the performance of the ultrasonics. The shoulder screw keeps
the left mount tab of the transducer to the center. This prevents the transducer to
touch the screws when the alignment is complete.
(c)
Loosen the right transducer screw 1/4 turn to make sure that the transducer is free to move.
Tighten the shoulder screw until it seats, then back it off 1/4 turn. Make sure that the
transducer is free to turn around the shoulder screw.
(d)
Carefully chess the bond head to the center position of the heat block. Align the bottom
surface of the transducer tabs above the perpendicularity gauge on the heat block (see
figure below). Adjust the position and make sure that when the transducer is pressed
down, the transducer tabs rest on the two touch pads of the perpendicularity gauge.
A
B
Perpendicularity Gauge
Transducer
C
Heat Block
Figure 4-52: Gauge Position, Side-to-Side Perpendicularity (Top View)
Note: At this point, make sure that the bond head link is not set on the perpendicularity
gauge. Put the gauge in the center to make sure that all of its feet are on the heat
block surface. Make sure that the transducer tabs are in the center and caught on
the two touch pads of the gauge.
(e)
98890-10EA-001-00
Revision B
Hold the transducer flat on the gauge. Use a metric ball driver or the tip of a screwdriver to
apply light pressure to the top side of the transducer tabs. Tighten the transducer screws
lightly (alternately) and make sure that the transducer tabs stay flat on the gauge.
Calibration
Z-axis Adjustments
Operator’s Guide
Page 4-30
IConn PLUS ELA High Performance Ball Bonder
(f)
Latch the reference weight (08888-0901-020-XX) to the wire clamp fixed bracket as
shown in the figure below.
Figure 4-53: Reference Weight
Note: During this calibration, the Z-axis position display, found at the top right corner of the
monitor screen, will not show engineering units. The display will show Z-axis encoder
pulses. This display must be referred to when the user is instructed to record the Zcount.
(g)
Carefully lift the bond head and put a flat, 2 mil (.05 mm) shim between the left transducer
tab and the touch pad of the perpendicularity gauge. Be careful not to put the shim beyond
the tab and below the bond head link. This can bias and affect the value. Let the weight of
the bond head rest on the shim. Do not press down on the gauge.
(h)
Record the Z-count for the left side.
(i)
Carefully lift the bond head and put a flat, 2 mil (.05 mm) shim between the right
transducer tab and the touch pad of the perpendicularity gauge. Be careful not to put the
shim beyond the tab and below the bond head link. This can bias and affect the value. Let
the weight of the bond head to stay on the shim. Do not press down on the gauge.
(j)
Record the Z-count for the right side.
(k)
Calculate the difference between the two sides. The difference must be 0 (zero) ± 30 Zcounts. If the difference is larger than ± 30, do one of these:
•
•
(l)
Operator’s Guide
Page 4-31
If the higher count is on the right side, turn the transducer clockwise, redo the step
above and record the new Z-count values
If the higher count is on the left side, turn the transducer counterclockwise, redo the
step above and record the new Z-count values
When the difference is less than 0 ± 30, remove the shoulder screw from the transducer
mount and replace it with the initial screw and washer. Torque each screw in sequence and
in steps of 10 oz-in, to a torque value of 35 oz-in (0.25 Nm). Remove the bond force
calibration weight and the perpendicularity gauge. Remove all shims from the bond head
area.
Calibration
Z-axis Adjustments
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(m)
Select 1 CONTINUE from the Step 3 dialog. The Step 4 dialog appears.
Figure 4-54: Transducer Alignment: Step 4 Instructions
(15) Adjust front-to-rear perpendicularity:
(a)
Install the perpendicularity gauge on the heat block to make sure that touch pads ‘1’ and
‘2’ are perpendicular to the rails.
A
B
Transducer
Perpendicularity Gauge
C
D
Heat Block
Transducer Crystal Stack
Figure 4-55: Gauge Position, Front-to-Rear Perpendicularity (Top View)
98890-10EA-001-00
Revision B
(b)
Put the bond head and make sure that the transducer crystal stack is between pad 1 and pad
2 of the perpendicularity gauge. Make sure that the feet on the gauge do not fall into the
heat block insert cavity but are all seated on the heat block insert surface. Make sure that
the touch pads of the gauge do not touch the transducer crystal stack.
(c)
Latch the reference weight (08888-0901-020-xx) onto the wire clamp fixed bracket.
(d)
Carefully lift the bond head and put a 2 mils (.05 mm) shim between the transducer and the
rear touch pad of the perpendicularity gauge. Make sure that all the four feet of the gauge
touch the heat block surface. Let the weight of the bond head set on the shim. Do not push
the gauge down.
(e)
Chess the heat block up or down until the shim cannot move with a small friction against
its movement. When the heat block is at the correct height, put the shim again and record
the rear Z-count.
(f)
Carefully lift the bond head and put a 2 mil (.05 mm) shim between the transducer and the
front touch pad of the perpendicularity gauge. Make sure that all four feet of the gauge
touch the heat block surface. Let the weight of the bond head set on the shim. Do not push
the gauge down.
Calibration
Z-axis Adjustments
Operator’s Guide
Page 4-32
IConn PLUS ELA High Performance Ball Bonder
(g)
Chess the heat block up or down until the shim cannot move with a small friction against
its movement. When the heat block is at the correct height, put the shim again and record
the front Z-count. Remove the shim.
Note: As the last test, do the procedure for the front and rear again. Make sure that
there is a small friction when you remove the shim from between the front and
rear pads on the gauge and the transducer. Record the Z-count values each time.
(h)
Calculate the difference of the Z-count between the front and rear The difference must be 0
(zero) ± 10 Z-counts). If the difference is larger than ± 10 Z-counts, do steps (f) through
(h) again.
(i)
When the heat block is less than specification and the transducer is in position against the
gauge by the calibration weight. Select 1 CONTINUE in step 4 dialog. This causes the
software to disable heat block chessing and sets the bond plane Z servo reference to the
current Z encoder position. The software saves this value for future reference. The Step 5
dialog appears.
Figure 4-56: Transducer Alignment: Step 5 Instructions
(16) Remove the perpendicularity gauge and calibration weight.
(17) Install the capillary, EFO wand and clamp insert, then select 1 CONTINUE. The Z servo is enabled
and the bond head is lifted to the safety position. This completes the calibration sequence.
(18) Do these adjustments/calibrations:
•
•
•
•
•
•
•
•
•
4.4.3.2
Servo Tune Z-axis
MHS Clamp
Bond Force
EFO
USG
Crosshair Offset
Rail Height Z
Input Slot
Output Slot
Set Z Reset
Select 2 SET Z RESET from the Z-axis Adjustments menu to automatically measure and calculate the Z
reset position relative to the home and bond plane positions. This calculation is done during usual
machine power up. It is possible that the data can become missing or damaged during operation. This
automatic calibration lets you start a correction.
Operator’s Guide
Page 4-33
Calibration
Z-axis Adjustments
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
4.4.3.3
Loop Height Factor/Offset
is a password-protected feature. This feature lets you program a
compensation value (portability factor) for the LOOP HEIGHT SCALE FACTOR and LOOP HEIGHT OFFSET.
Portability factors are part of the machine dependent parameters (MDPs). It is the responsibility of the
customer to manually calibrate the portability factors. This is necessary for the same process program
to be used for different machines to get the same process performance. For more data on this feature,
refer to section Process Program Portability Factors.
3 LOOP HEIGHT FACTOR/OFFSET
98890-10EA-001-00
Revision B
Calibration
Z-axis Adjustments
Operator’s Guide
Page 4-34
IConn PLUS ELA High Performance Ball Bonder
4.4.4
Bond Force Calibration
Bond Force Calibration measures the necessary electrical current to move the bond head in the air and
to apply 50 g of force. This standardizes the bond force. Screen data shows the current necessary for 0 g
(movement in air), the current necessary for 50 g of bond force, and the scale factor. The bond force
calibration weight assembly (08888-0901-020-xx) is necessary for this calibration.
The Bond Force Calibration dialog appears when 4 BOND FORCE is selected from the Bond Head menu.
The results of the last calibration are shown along with the selections of: 1 CALIBRATE, 2 VERIFY and 3
CHANGE BOND FORCE OFFSET. To do calibration, select 1 CALIBRATE and do the on screen instructions.
Note: See 4.4.3.3 Loop Height Factor/Offset for description of 3 CHANGE BOND FORCE OFFSET.
Note: The dialogs below are examples. Values shown in the dialog will not be the accurate
calibration results.
Figure 4-57: Bond Force Calibration and Results Dialog
WARNING:
Hot surfaces! Do not touch the heat block insert, clamp plate, or other workholder parts with no
protection on hands.
See related topics below:
4.4.4.1 Bond Force Calibration Procedure
4.4.4.2 Bond Force Verification Procedure
4.4.4.1
Bond Force Calibration Procedure
Specification
•
B/F Scale Factor: 6.4-7.1 Counts/g
•
Force Sensor Scale Factor: 11-24 Counts/g
Tools, Materials, and Equipment
Part Number
Supplier
None
Local Purchase
Torque Wrench 25 oz-in (0.18 Nm)
Tweezers
None
Local Purchase
Calibration Reference Weight
08888-0901-020-xx
Kulicke & Soffa
Force Sensor Calibration Tool
08858-0901-001-xx
Kulicke & Soffa
Operator’s Guide
Page 4-35
Calibration
Bond Force Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(1)
Select 1 CALIBRATE. The dialog for ‘Step 1’ appears.
Figure 4-58: Bond Force Calibration Step 1 Dialog
Note: It is recommended to install the capillary before you continue to the Zero Gram
Calibration. This setup is related to conditions and thus does a more accurate Zero
Gram calibration than without the capillary.
(2)
Do the instructions in the Step 1 dialog:
(a)
Make sure that the clamp insert is removed.
(b)
Secure wire as the wire clamp opens.
(c)
Chess the bond head to the left of the heat block cavity.
WARNING:
The bond head makes a series of fast up and down movements before the measurement of the zero
gram offset.
(d)
Select 1 PERFORM ZERO GRAM CALIBRATION. The heat block is lowered. Then the bond
head moves down in the Z-axis. This lets the software calculate the force necessary to
move the bond head without opposition. When the calculation completes, the heat block is
lift and the dialog for ‘Step 2’ appears.
Figure 4-59: Bond Force Calibration Step 2 Dialog
(3)
Do the steps in the Step 2 dialog:
(a)
Remove the capillary (if capillary is present).
(b)
Install the reference weight (08888-0901-020-xx). Latch it onto the wire clamp bracket as
shown in the figure below.
Figure 4-60: Reference Weight
98890-10EA-001-00
Revision B
Calibration
Bond Force Calibration
Operator’s Guide
Page 4-36
IConn PLUS ELA High Performance Ball Bonder
(c)
Select 1 PERFORM WEIGHTED CALIBRATION. The bonder lowers the heat block, then bond
head along the Z-axis for the software calculation of the force necessary to move the bond
head with attached weight. When the calculation completes, the dialog for ‘Step 3’
appears.
Figure 4-61: Bond Force Calibration Step 3 Dialog
(d)
(4)
Remove the reference weight as shown. Select 1 ACCEPT to accept the results or 2 DISCARD
to discard.
Follow the instructions in the force sensor calibration procedures:
(a)
Use a tweezer to install the force sensor calibration tool (08858-0901-001-xx) into the
capillary clamp in the transducer. Tighten the clamp screw to a torque of 25 oz-in (0.18
Nm).
Figure 4-62: Force Sensor Calibration Tool
(b)
Chess the bond head above to the heat block mesa or flat surface.
(c)
Select 1 START CALIBRATION to start the force sensor calibration. The bond head makes a
series of fast movements to calibrate the force sensor for contact detection and force
feedback.
Figure 4-63: Force Sensor Calibration Dialog
Operator’s Guide
Page 4-37
Calibration
Bond Force Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(d)
After the calibration, the Bond Force Calibration dialog shown in the figure below
appears. Select DONE to complete bond force calibration.
Figure 4-64: Bond Force Calibration Dialog
4.4.4.2
Bond Force Verification Procedure
This verification procedure examines the bond force against a calibrated gram force gauge. This is done
by the software to give a specified force to the bond head Z motor. That force is then examined with the
gram force gauge to counter the force. When the software releases the Z motor energy because of the
opposition. The gram force gauge is the force applied. This test can be done when necessary, but must
be done after a Bond Force calibration to make sure the bonding precision.
Tools, Materials, and Equipment
Part Number
Supplier
None
Local Purchase
Gram Force Gauge
(1)
Select 2 VERIFY from the Bond Force Calibration dialog. The Bond Force Verification Step 1
dialog appears.
Figure 4-65: Bond Force Verification Step 1 Dialog
(2)
Do the steps below in the Bond Force Verification Step 1 dialog:
(a)
Select 1 TESTING FORCE.
(b)
Enter the applicable force. Select ENTER.
Note: Make sure that the testing force is not higher than the specifications of the bonder.
(c)
Select NEXT to continue. The Bond Force Verification Step 2 dialog appears.
Figure 4-66: Bond Force Verification Step 2 Dialog
98890-10EA-001-00
Revision B
Calibration
Bond Force Calibration
Operator’s Guide
Page 4-38
IConn PLUS ELA High Performance Ball Bonder
(3)
Do the steps below in the Bond Force Verification Step 2 dialog:
(a)
Make sure that the clamp is closed.
(b)
Remove the EFO wand (if not already removed from calibration procedure).
(c)
Use the mouse button B2, put the bond head above the die of a production device. When
the capillary descends, it touches the die.
(d)
Select 1 PERFORM VERIFY CALIBRATION. The BOND FORCE VERIFICATION STEP 3 dialog
appears.
Figure 4-67: Bond Force Verification Step 3 Dialog
(4)
Do the steps below in the BOND FORCE VERIFICATION STEP 3 dialog:
(a)
Lift the front of the transducer with a gram force gauge until the green video disappears.
Note: The gauge must be held level and perpendicular to the transducer for accurate results.
(b)
(5)
When the green video disappears, compare the force applied to lift the transducer with the
force applied (the Testing Force).
Do the steps below in the BOND FORCE VERIFICATION STEP 4 dialog. Select 1 RETRY to do
verification again. Select 2 DONE when verification is complete.
Figure 4-68: Bond Force Verification Step 4 Dialog
(6)
Operator’s Guide
Page 4-39
Install the EFO wand.
Calibration
Bond Force Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
4.4.5
USG (Ultrasonic Generator) Calibration
The transducer is used to give energy to make bonds on the work surface. The transducer also gives a
‘bleed voltage’ used during looping which helps pay out the wire through the capillary. The USG
calibration matches the output of the USG electronics to the impedance load of the transducer. The
USG energy applied to the transducer will be known during production. Do the USG calibration after
one of the below:
•
Capillary or transducer replacement.
•
Transducer alignment
•
USG electronics or cable replacement.
Select 5 USG from the bond head menu to access the USG Calibration dialog. The TUNED FREQUENCY
item shows the frequency at which maximum power is applied to the transducer. The IMPEDANCE
selection shows the measured opposition, in ohms (ω), to USG power application found during
calibration.
Figure 4-69: USG Calibration Dialog Flow
Select 8 USG PERSONALITY VALUES to access the password-protected feature that lets you program a
compensation value (portability factor) for the USG parameters. Portability factors are part of the
machine dependent parameters (MDPs). It is the responsibility of the customer to manually calibrate
the portability factors. This will let the same process program to be used for different machines to get
the same process performance. For more data on this feature, refer to Process Program Portability
Factors section.
CAUTION:
The K&S Micro-Swiss Sigma capillary gives a more sensitive bonding process that makes it
applicable for fine pitch applications and sensitive die packages. Do these instructions to get the best
performance with Sigma capillaries.
(1)
Use K&S standard USG calibration.
(2)
Do not remove or touch the capillary with tweezers during the USG calibration or when the USG
function bar selection (Function F7) is ON.
(3)
When you clean the Sigma capillary, enable the USG (Function F7). The USG CLEAN VOLTS
parameter must not be more than 2000 mV (see Reference Guide).
(4)
Use recommended bond parameters (see Reference Guide).
98890-10EA-001-00
Revision B
Calibration
USG (Ultrasonic Generator) Calibration
Operator’s Guide
Page 4-40
IConn PLUS ELA High Performance Ball Bonder
4.4.5.1
USG Calibration Procedure
•
USG Specification
•
USG Tuned Frequency: 51 ± 3 KHz (LF) and 122 ± 5 KHz (HF)
•
USG System Impedance: 80-320 ω (LF) and 15-75 ω (HF)
Note: A USG calibration can fail caused by one of the below:
- Incorrect transducer or capillary installation
- Loose or bad transducer cable
(1)
Do the steps below. The items in the USG Calibration dialog are below:
Parameter
Definition
TUNING SITE
This item defaults to free air and it cannot be changed by you
TUNED FREQUENCY
Shows current frequency values
IMPEDANCE
Shows current impedance values
START FREQUENCY
Shows the frequency at which the calibration scan operation is to
start. You can set a applicable minimum start frequency rather than
the software default
FREQUENCY STEP
This parameter specifies the frequency of the measurements and
calculations are made to find out if a resonant frequency has been
found. For example, a step value of 40 Hz starts resonant frequency
calculations at 40 HZ interval during the frequency scan
END FREQUENCY
The frequency at which the calibration scan operation is to complete.
This parameter cannot be set by you. Its value is automatically
calculated by the software when a change is made to the Start
Frequency or Frequency Step parameters
USG HARDWARE CALIBRATION
Select this option to access the new USG hardware calibration dialog
shown in the figure above.
Note: This USG hardware calibration must be done first before you select 7 CALIBRATE in the USG
dialog.
Parameter
Definition
CALIBRATION SETTINGS
Lets you to put in values that overrides the default setting values
START CALIBRATION
Select this option to calibrate the system hardware related to USG
OSC/AMP RESULTS
Shows the last hardware calibration results
(2)
When all parameters are set correctly, calibrate the USG. Do the steps below:
Figure 4-70: USG Tune Results Dialog
(a)
Operator’s Guide
Page 4-41
Select 7 CALIBRATE. This refers to the conditions set up in the USG Calibration dialog to
start the calibration cycle.
Calibration
USG (Ultrasonic Generator) Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(b)
4.4.6
The USG Tune Results dialog appears after the calibration cycle. Select 3 ACCEPT to save
the results to memory. Select 4 CANCEL to cancel the USG calibration. The results are not
saved.
Capillary (Cap) Change
The Capillary Change sequence gives step by step procedures to help in the replacement of the capillary
in the transducer. Although it is not a calibration, it is related to the calibrations necessary after a
capillary change on the machine. To start. select 6 CAPILLARY CHANGE from the Bond Head menu. This
causes the first dialog to appear. The step by step description is shown below for each operation in the
sequence. Refer to the table below which gives descriptions of all the dialogs that appear in the dialog
sequence that follows.
Dialog
Description
Remove and Insert Capillary
These dialogs gives you the steps necessary to remove and install a
capillary. These directions are used as a reminder only. You must
know the capillary replacement procedure before you continue. Refer
to Replacement Procedures section for instructions on how to do this
procedure. After the capillary has been replaced, select OK to show
the next dialog.
USG Calibration
The USG Calibration dialog appears. Set the parameters and do the
calibration. See section 4.4.5.1 USG Calibration Procedure for more
data. When the USG Calibration has been done, click on the DONE.
This shows the next dialog.
Crosshair Offset Calibration
The Crosshair Offset Calibration dialog appears. Set the parameters
and do the calibration. See section 4.3.3 Crosshair Offset for more
data. When the Crosshair Offset Calibration has been done, select
DONE. This shows the next dialog.
EFO Height
The EFO Height Calibration dialog appears. Do the calibration. When
the EFO Height Calibration has been done, select 1 ACCEPT. This
causes the next dialog to appear.
Relearn Bond Height
The Relearn Bond Height dialog appears. Select BND HT RELRN
button from the upper function bar. The bond head moves down in the
Z-axis to let the software learn the point at which the capillary touches
the work surface. When the bond height has learned, the next dialog
appears.
Thread Wire
The Thread Wire dialogs appear with the steps necessary to do this
task. Do wire threading as told and then do a ‘Bond Off’ to make a ball
at the capillary tip. The USG must not be enabled until the wire is
correctly threaded in the capillary.Upon completion, click on DONE.
The capillary has been changed and all necessary calibrations and
adjustments have been done to make sure that the product quality is
at the resumption of automatic wire bonding.
98890-10EA-001-00
Revision B
Calibration
Capillary (Cap) Change
Operator’s Guide
Page 4-42
IConn PLUS ELA High Performance Ball Bonder
Note: To feed the wire correctly, your own skill is necessary.
Thread Wire Procedures
(Next Page)
Figure 4-71: Capillary Change Dialog Flow (1 of 2)
Operator’s Guide
Page 4-43
Calibration
Capillary (Cap) Change
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
Relearn Bond Height
(Previous Page)
Figure 4-72: Capillary Change Dialog Flow (2 of 2)
98890-10EA-001-00
Revision B
Calibration
Capillary (Cap) Change
Operator’s Guide
Page 4-44
IConn PLUS ELA High Performance Ball Bonder
4.5
Workholder Calibration
Workholder calibration puts all the six parts of the workholder into correct alignment with each other.
This makes sure that the leadframes are loaded, indexed, and ejected correctly.
Figure 4-73: Workholder Calibration Menu
This calibration makes sure that the heat block cavity automatically put the bond head at the position
taught before. These are done during heat block operator point teach, Indexer Calibration, X Sensor
Calibration and Rail Calibration. The bond head does not do automatic position adjustment if the heat
block data is not valid or if the limits search was not done.
WARNING:
Workholder Calibrations must be done with workholder heaters at serviceable temperature for most
accurate results. If the workholder is hot, do not touch the hot parts when you remove parts or
material (leadframes, heat block insert, clamp insert) or when you do other operations.
Note: Calibrations must be done with no material in the workholder or magazine handlers.
Note: Make sure that the die paddle of the heat block targeted during workholder calibrations is on
the workholder X and Y center lines.
Note: MHS calibration cannot be done unless the X, Y, and Z servo movement have been tuned and
crosshair offset has been calibrated.
Select the links below for the workholder calibration procedures:
4.5.1 Rail Calibration
4.5.2 Clamp Calibration
4.5.3 Indexer Calibration
4.5.4 X Registration Sensor Calibration
4.5.5 Force Jam Detect Calibration
4.5.6 Wall Calibration
4.5.7 Rail Height Adjustment
4.5.8 Puller/Gripper Calibration
4.5.9 Gripper Calibration Result
4.5.10 Workholder Calibrations
Operator’s Guide
Page 4-45
Calibration
Workholder Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
4.5.1
Rail Calibration
In the Rail Calibration, the front and rear rail home positions are taught with reference to the center of
bond in the Y-axis. Rail Calibration must be done after an important adjustment to the workholder
which can affect the Y center line of index. The procedure uses the heat block die paddle front and rear
edges (to be found with the horizontal crosshair) to find the center of bond in the Y-axis. Then the rails
move nearer to the heat block. The bonder prompts for the horizontal crosshair to be put at the edge of
the vertical leadframe to stop at the surface of each rail. This completes the calibration.The die paddle
of the heat block insert attached to the heat block must be at center with respect to workholder Y-axis
center line. If the insert attached to the heat block does not meet this requirement, it must be replaced
with one that does before the Rail Calibration.
WARNING:
Do not touch the clamp insert or heat block without hand protections if the workholder heaters are at
serviceable temperature. When you remove or install the clamp insert, install two screws in the insert
and hold the screws with pliers. When you remove the heat block, install a screw at the right side of
the heat block and hold the screw with pliers. There are two M4 tapped holes in the clamp insert and
one M4 tapped hole in the heat block for this purpose.
A
B
C
D
E
F
G
A
B
C
D
Crosshair Position (Rear)
Rear Rail
Rear Edge
Heat Block Insert
E Front Edge
F Front Rail
G Crosshair Position (Front)
Figure 4-74: Rail Calibration Crosshair Positions
(1)
Select CALIBRATION → WORKHOLDER → RAILS.
Figure 4-75: Rail Calibration Selection
98890-10EA-001-00
Revision B
Calibration
Rail Calibration
Operator’s Guide
Page 4-46
IConn PLUS ELA High Performance Ball Bonder
(2)
The rails open and a prompt appears to remove the leadframe and clamp insert. After the items
are removed, select OK.
Figure 4-76: Rail Calibration - Remove Material
(3)
When prompted, align the horizontal line of the front edge of the heat block insert die paddle.
Select OK.
Figure 4-77: Rail Calibration - Align Horizontal Line with Front Edge
(4)
When prompted, align the horizontal line of the crosshair with the rear edge of the die paddle,
then select OK. The machine calculates the center of the die paddle in the Y-axis and uses this
value as the front–rear center of the workholder.
Figure 4-78: Align Horizontal Line with Rear Edge
(5)
If a contamination removal system (CRS) is installed on the machine, move the head of the CRS
to a safe position. Make sure that it does not catch the removal of the heat block insert before you
continue. Remove the heat block insert when prompted. Select OK. The rails close in to each
other.
(6)
Find the cutout part of the rear rail. Put the horizontal line of crosshair on the rear edge of the
cutout. Select OK. Use a small tool (tweezers, etc.) to detect the rear edge of the rear rail.
Figure 4-79: Rail Calibration - Align Horizontal Line on the Rear Rail
(7)
Align the horizontal crosshair with the calibration feature on the front rail. Select OK.
Figure 4-80: Rail Calibration - Align Horizontal Line with Stop Edge on Front Rail
CAUTION:
Do not try to attach a cold heat block insert onto a heat block mount that is at serviceable
temperature. The jam on the heat block mount that caused by heat makes it not easily to be removed.
Operator’s Guide
Page 4-47
Calibration
Rail Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(8)
Install the heat block insert and clamp insert. Move the CRS head rear to its serviceable position
(if present). Select OK.
Figure 4-81: Rail Calibration - Install Heat Block Insert
(9)
4.5.2
Push the ESC key when necessary to go out of the Calibration menu.
Clamp Calibration
The purpose of Clamp Calibration is to teach clamp insert height in relation to bond plane height. Do
this calibration after an adjustment to the clamp or heat block mechanism. In this procedure, a prompt
appears to tell you to remove the clamp insert and put the capillary above a machined surface on the
heat block. After the capillary moves down to touch the heat block, a prompt appears. Install clamp
insert and put the capillary above a machined surface on the clamp insert. The heat block and clamp
inserts then move up together until they touch the capillary.
WARNING:
If the workholder heaters are at serviceable temperature:
1. Do not touch the clamp insert without hand protections. When you remove or install the clamp
insert, install two screws in the insert and hold the screws with pliers. There are two M4 tapped holes
in the clamp insert for this purpose.
2. Do not touch the heat block insert without hand protections. When you remove or install the heat
block insert, install a screw in the right end of the insert and hold the screw with pliers. There is an
M4 tapped hole in the heat block insert for this purpose.
(1)
Select CALIBRATION → WORKHOLDER → CLAMP to open the rails. A dialog appears to prompt for
the verification of the P-part dimensions and bond head Z adjustment match with the P-parts and
bond head setup.
Figure 4-82: Clamp Configuration and Calibration
(2)
Select OK to continue.
(3)
Install the heat block insert on the heat block. Select OK to continue. The heat block comes up
between the rails until it is at the nominal bond plane height.
98890-10EA-001-00
Revision B
Calibration
Clamp Calibration
Operator’s Guide
Page 4-48
IConn PLUS ELA High Performance Ball Bonder
(4)
Put the crosshair above the top surface of the heat block. Do not put it above the die paddle.
Move the crosshair to the right of X center. After this is done, select OK to continue.
Figure 4-83: Clamp Calibration - Install Heat Block Insert and Change Crosshair Position
A
D
B
E
F
C
A
B
C
Die Paddle
Crosshair
Heat Block Insert
D
E
F
Clamp Insert Window
Crosshair
Clamp Insert
Figure 4-84: Clamp Calibration - Install clamp Insert and Change Crosshair Position
(5)
The bond head moves down until it touches the heat block, then moves up.
Note: Before you do the next step, the option to do the clamp home position (maximum clamp
opening) check is given. For step by step instructions, see section on “Clamp Home Position
Adjustment”. When satisfied with the clamp home position, continue with the procedures
below.
(6)
Insert Clamp Insert. Select OK.
(7)
Put the crosshair above the top surface of the clamp insert (highest machined surface). Do not put
it above the clamp insert window. Move the crosshair to the right of X center to prevent the EFO
wand touches the clamp arm during table movement. When this is done, select OK to continue.
Figure 4-85: Clamp Calibration - Put Crosshair above Clamp Insert
(8)
The clamp closes. The capillary comes down, touches the clamp insert, and then moves up. The
heat block moves up to nominal position. The capillary moves down to touch the clamp surface,
then moves up. The heat block position is adjusted to lift the clamp, after which the capillary
again moves down to touch the clamp. This is done again and again until the clamp is lifted eight
(8) mils. This step make sure that the clamp is at the correct height when the heat block is at the
clamped position.
(9)
Select OK in response to “Calibration was Successful” dialog.
(10) Push the ESC key two times to exit the Calibration menus.
Operator’s Guide
Page 4-49
Calibration
Clamp Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
4.5.3
Indexer Calibration
You teach the home positions of the left and right gripper assemblies with the Indexer Calibration. The
home positions are related to the center of bond position in the X direction. Do this calibration if there
is important adjustment to the index or eject grippers. This can change the X center line of index, or the
X origin.
In this procedure, you use the vertical crosshair to find the left and right edges of the heat block die
paddle. From these locations the machine finds the center of bond in the X-axis. The index gripper is
moves near to the bond site. A prompt appears for you to install the calibration wafer, and put it against
the right edge of the left gripper jaw. Then align the vertical crosshair with the right edge of the wafer.
When the location of this point is set, the bonder starts the Right Gripper Calibration. A prompt appears
for you to install the calibration wafer and put it against the left edge of the right gripper jaw. Then
align the vertical crosshair with the right edge of the wafer. When the location of this point is set, the
calibration is complete.
(1)
Select CALIBRATION → WORKHOLDER → INDEXER.
WARNING:
Clamp and heat block inserts can be hot. When you remove or install the inserts, install screw(s) in
the insert and hold the screw(s) with pliers. There are M4 tapped holes in the clamp and heat block
inserts for this purpose.
(2)
Remove carrier (if present) and the clamp insert. Select OK when done.
Note: Do steps (3) and (4) with a BGA heat block or other heat block that does not contain a down
set. Align the vertical crosshair with the outer edge of the left side hole (step (3)). Then align it
to the outer edge of the right side hole (step (4)) in the heat block insert. The holes were
machined into the heat block insert for this purpose.
(3)
Align the vertical line of the crosshair with the left edge of the heat block insert die paddle. Select
OK when done.
Figure 4-86: Indexer Calibration - Align Vertical Line to Left Edge of Heat Block Cavity
(4)
Align the vertical line of the crosshair with the right edge of the heat block die paddle and select
OK. The machine calculates the center of the die paddle and uses this value as the left–right
center of the workholder.
Figure 4-87: Indexer Calibration - Align Vertical Line to Right Edge of Heat Block cavity
(5)
If a contamination removal system (CRS) is installed on the machine, move the head of the CRS
to a safe position. Make sure that it does not interfere with the removal of the heat block insert
before you continue.
(6)
Remove the heat block insert. Select OK when done.
98890-10EA-001-00
Revision B
Calibration
Indexer Calibration
Operator’s Guide
Page 4-50
IConn PLUS ELA High Performance Ball Bonder
(7)
Put the calibration wafer (08021-0901-011-xx) on the rails and let it touch the rear rail and the
right edge of the closed indexer gripper jaws. Select OK when done.
Figure 4-88: Indexer Calibration - Put the Metal Wafer 1
(8)
Align the vertical line of the crosshair with the right edge of the wafer. Select OK when done.
This starts the Right Gripper Calibration.
A
B
G
F
H
C
E
D
I
Right Gripper
Left Gripper
A
B
C
D
E
Align the wafer to the front rail
Right edge of wafer
Calibration Wafer
Left Gripper
Right Edge of Left Gripper Jaws
J
F Left edge of wafer
G Align the wafer to the front rail
H Calibration Wafer
I Left Edge of Right Gripper Jaws
J Right Gripper
Figure 4-89: Indexer Calibration - Put the Metal Wafer 2
(9)
Put the calibration wafer (08021-0901-011-xx) on the rails and align it against the rear rail and
the left edge of the closed right gripper jaws. Select OK when done.
Figure 4-90: Indexer Calibration - Put the Metal Wafer 3
(10) Align the vertical line of the crosshair with the left edge of the wafer. Select OK when done.
(11) Remove the calibration wafer. Select OK when done.
(12) Install the heat block insert and clamp insert. Move the CRS head to its serviceable position (if
present). Select OK when done.
(13) A completion message appears when the calibration is completed. Select OK as necessary to
close Calibration menu. Continue to do the Wall Calibration if necessary.
Figure 4-91: Indexer Calibration Completed Dialog
Operator’s Guide
Page 4-51
Calibration
Indexer Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
4.5.4
X Registration Sensor Calibration
X Registration Sensor Calibration finds the distance from the detection point of the X registration
sensor to the bond site in the X-axis. Do this calibration after an adjustment to the workholder, or when
the X registration sensor is adjusted or replaced.
Note: Do the Rail Calibration before you do this calibration.
WARNING:
Do not touch the clamp or heat block inserts if the workholder heaters are on. When you remove or
install the clamp insert, install two screws in the insert and hold the screws with pliers. There are two
M4 tapped holes in the clamp insert for this purpose. When you remove or install the heat block
insert, install a screw in right end of the insert and hold the screw with pliers. There is an M4 tapped
hole in the heat block insert for this purpose.
(1)
Select CALIBRATION → WORKHOLDER → X SENSOR.
(2)
Remove the material (if present) from the workholder and remove the clamp insert. Make sure
that the heat block insert is installed. Select OK when done.
Note: Use a BGA heat block or other heat block that does not contain a down set to do steps (3) and
(4). Align the vertical crosshair with the outer edge of the left–side hole (step (3)). Then align
the outer edge of the right–side hole (step (4)) in the heat block insert. The holes were
machined into the heat block insert for this purpose.
E
C
A
D
F
B
G
A
B
C
D
Left Clamp Arm
X Sensor
Left Vertical Edge
Right Vertical Edge
E Rear Rail
F Heat Block Insert
G Front Rail
Figure 4-92: X Sensor Calibration
(3)
Align the vertical line of the crosshair with the left edge of the heat block insert die paddle. Select
OK when done.
Figure 4-93: X Sensor Calibration - Align Vertical Line to Left Edge of Heat Block Cavity
(4)
Align the vertical line of the crosshair with the right edge of the heat block die paddle and select
OK. The machine calculates the center of the die paddle and uses this value as the left–right
center of the workholder.
Figure 4-94: X Sensor Calibration - Align Vertical Line to Right Edge of Heat Block Cavity
(5)
98890-10EA-001-00
Revision B
If a contamination removal system (CRS) is installed on the machine, move the head of the CRS
to a safe position. Make sure that it does not interfere with the removal of the heat block insert
before you continue.
Calibration
X Registration Sensor Calibration
Operator’s Guide
Page 4-52
IConn PLUS ELA High Performance Ball Bonder
(6)
Remove the heat block insert and select OK. The front rail moves the X sensor below the left–side
clamp arm.
(7)
Find the X sensor amplifier installed on the front of the front wall plate. The Y sensor amplifier is
installed below the frame of the indexer wall bracket.
D
C
F
E
I
G
H
A
B
A
B
C
D
E
X Registration Sensor Amp
Y Registration Sensor Amp
Teach Button
Status LEDs (Yellow)
Switching Threshold
F
G
H
I
Green Power ON LED
Yellow Output LED
Bar Graph Display (Red)
Manual Adjustment Buttons
Figure 4-95: X Sensor Amplifier Functions and Location
(8)
Do one of the X-sensor amplifier teach procedures as follows:
(a)
Operator’s Guide
Page 4-53
Use the metal calibration wafer to do the X-sensor amplifier teach procedure:
1.
Put the metal calibration wafer (08021-0901-011-xx) onto the workholder rails from
external.
2.
Push and hold the TEACH (or ‘--’) button on the X registration sensor amplifier for
two to three seconds until the status LEDs (“LO” and “DO”) flash one by one.
3.
Move the metal calibration wafer to the left side to enable the X sensor.
4.
Push the TEACH (or ‘–’) button one time when the metal calibration is above the X
sensor.
5.
Move the metal calibration wafer to the right side to disable the X sensor.
6.
Push and TEACH (or ‘–’) button one time when the metal calibration wafer is not
there or unblocked.
Calibration
X Registration Sensor Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
7.
Move the metal calibration wafer to the left side and align the left side wafer to the
right edge of the gripper. Select OK.
A
D
B
C
A
B
C
Align the wafer to front rail
Wafer
Index Gripper
E
D
E
Right Edge of Wafer
Right Edge of index gripper jaws
Figure 4-96: X Sensor Calibration - Insert Wafer
(b)
98890-10EA-001-00
Revision B
8.
The index gripper moves and holds the calibration wafer. The gripper quickly pulls
the wafer to the left and to the right until the sensor sees the right edge of the wafer.
It then pulls the wafer to the bond site.
9.
Align the vertical line of the crosshair in the GUI video window to the right edge of
the wafer. Select OK.
10.
Remove the calibration wafer from the workholder. Select OK. Install the heat block
insert and clamp insert. Move the CRS head to its serviceable position (if present).
Select OK.
11.
Push ESC two times to exit Calibration mode.
Do the X-sensor amplifier teach procedure without the metal calibration wafer:
1.
Make sure that the X-sensor emitter and receiver fiber optic cables are correctly
connected to the X-sensor amplifier.
2.
Make sure that the distance between the preheat plate and the bottom of the rear rail
is less than 0.25 mm. See Adjust Preheat/Post Heat Insert Height section in the
MHS manual.
3.
Push and hold the TEACH (--) button on the amplifier for two to three seconds until
the red light goes off and the status LED (yellow) flashes.
4.
Push the TEACH (--) button on the amplifier for five times until the light of the
number 4 bar graph show (red) flashes and stops.
5.
Do the teach bond position. See Teach Bond Position section in the MHS manual.
Calibration
X Registration Sensor Calibration
Operator’s Guide
Page 4-54
IConn PLUS ELA High Performance Ball Bonder
4.5.5
Force Jam Detect Calibration
The Force Jam Detect (FJD) Calibration lets you enter an identification (ID) number for the force jam
detect transducer and values for two MHS machine dependent parameters (MDPs) used by the FJD
subsystem. Values for the MDPs are identified (and a transducer ID number is given) at the factory and
printed on the jam detect sensor label.
You can then adjust the preload that the tucker arm applies on the jam detect sensor. The Calibration
dialog shows the preload adjustment range and current preload setting. If necessary, turn the preload
adjustment screw on the tucker arm so that the preload value is in the center of the adjustment range.
The jam detect sensor ID number and MDPs must be changed only if the jam detect sensor is replaced,
and only to the values printed on the sensor label. Adjust the preload if you: replace the jam detect
sensor, replace or adjust the tucker blade, or see a jam detect preload drift error.
(1)
Select CALIBRATION → WORKHOLDER → JAM DETECT.
(2)
The JDC Calibration dialog appears.
A
A
Label (with data of Transducer ID, Zero Offset, Scale Factor)
Figure 4-97: JDC Calibration Dialog 1
(3)
(4)
Operator’s Guide
Page 4-55
The dialog shows the jam detect transducer ID number, Zero Offset value, and Scale Factor
value. If these values must be updated:
(a)
Find the label on the side of the force jam detect sensor assembly. Note the transducer ID
number and the values for the Zero Offset and Scale Factor parameters.
(b)
Select the TRANSDUCER ID option from the menu. Use the numeric keypad to enter the ID
number from the label. Select ENTER.
(c)
Select the ZERO OFFSET option. Enter the Zero Offset value from the label. Select ENTER.
(d)
Select the SCALE FACTOR option. Enter the Scale Factor value from the label. Select
ENTER.
Note the preload range and current preload values shown in the dialog. Preload value is at the
center of the preload range. For example, if the range given is from 9 to 15 units, then the preload
value is 12. If preload value is at the center of the range, it is not necessary to adjust preload.
Calibration
Force Jam Detect Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(5)
If it is necessary to calibrate the jam detect preload, select NEXT to show the second calibration
dialog. Do the procedure in step (6) to adjust the preload. Select DONE to exit calibration if
preload is OK
A
A
Preload Adjustment Screw
Figure 4-98: JDC Calibration Dialog 2
(6)
98890-10EA-001-00
Revision B
Adjust jam detect sensor preload, if necessary:
(a)
Find the preload adjustment screw on the tucker arm.
(b)
Turn the screw to increase or decrease the preload that the tucker arm applies on the jam
detect sensor transducer. Stop when the shown preload value is at the center of the range.
(c)
Select DONE to exit the Jam Detect Calibration and save the changes that were made.
Calibration
Force Jam Detect Calibration
Operator’s Guide
Page 4-56
IConn PLUS ELA High Performance Ball Bonder
4.5.6
Wall Calibration
Wall Calibration measures the positions of the input and output walls from the bond center. These
values are used to set the left and right software limits of the indexer axis. Do this calibration after an
adjustment to the input or output walls, index gripper, puller gripper, and eject tucker.
Figure 4-99: Wall Calibration Dialog
4.5.6.1
Input Wall Calibration
(1)
Select CALIBRATION → WORKHOLDER → WALL → INPUT WALL.
(2)
Use the left and right arrow keys on the MMI to align the puller gripper jaw tip to the outer
surface (magazine side) of the input wall.
A
B
Front View
A
Puller Gripper Jaw Tip
B
Input Wall Outer surface
Figure 4-100: Input Wall Calibration
(3)
4.5.6.2
Push OK to complete the calibration.
Output Wall Calibration
(1)
Select CALIBRATION → WORKHOLDER → WALL → OUTPUT WALL.
(2)
Use the left and right arrow keys on the MMI to align the eject tucker tip to the outer surface
(magazine side) of the output wall.
A
B
Front View
A
Eject Tucker Tip
B
Output Wall Outer Surface
Figure 4-101: Output Wall Calibration
(3)
Operator’s Guide
Page 4-57
Push OK to complete the calibration.
Calibration
Wall Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
4.5.7
Rail Height Adjustment
This procedure sets the workholder rails to the optimal height relative to the heat block height for the
carrier (lead frame, flat boat, etc). When a change is made to DEVICE THICKNESS or a process program is
loaded (for a new device type). The software will tell you to adjust the height of the workholder rails.
Select 7 RAIL ADJUSTMENTS from the WORKHOLDER calibration menu (see figure below) or select 8 RAIL
ADJUSTMENTS from the W/H OPER on the toolbar. The Rail Height Measurement dialog appears and
shows:
•
The last measured rail height and the optimal rail height referred to carrier thickness
•
The direction (clockwise/counterclockwise) that you must turn the rail height adjustment screw
to remove the difference between the measured rail height and optimal rail height
•
The last measured rail height is considered optimal, acceptable, or unacceptable
Figure 4-102: Rail Height Measurement Dialog
You can do a check on the device configuration and device parameters, and measure the current rail
height. If this selection is selected, the machine sets rail height. The measured rail height, direction to
turn the rail height adjustment screw, and a new position then appear in the dialog. Once the rails have
been adjusted to an optimal or acceptable height, the user can accept the current rail position and stop
the procedure.
The optimal rail height is 5.0 mils below the height of the heat block. The height of the heat block is
equal to the bond plane height (zero) minus the thickness of the material. For example, if a leadframe is
8 mils thick, the height of the heat block is -8 mils relative to the bond plane at zero. The optimal rail
height is at -13.0 mils (5.0 mils below the height of the heat block). The equation for optimal height is
“optimal height = bond plane height - (carrier thickness + 5.0 mils”. This example is illustrated below.
A
B
C
Leadframe
Heat Block Insert
Rail
D
E
F
Bond Plane
Heat Block Height
Rail Height
Figure 4-103: Rail Height/Heat Block Height Example
98890-10EA-001-00
Revision B
Calibration
Rail Height Adjustment
Operator’s Guide
Page 4-58
IConn PLUS ELA High Performance Ball Bonder
4.5.7.1
Rail Height Measurement and Adjustment
(1)
Select 1 DEVICE CONFIGURATION from the dialog. This lets you make sure that and/or edit the
device configuration with the DEVICE CONFIGURATION dialog. The device may be set to be of the
LEADFRAME, FLATBOAT SINGULATED or FLATBOAT NON-SINGULATED type. This is the same
dialog which is shown from the Configuration menu in CONFIGURE mode.
(2)
Select 2 DEVICE PARAMETERS from the dialog. This lets you set the parameters for a STANDARD
LEADFRAME, FLATBOAT NON-SINGULATED or FLATBOAT SINGULATED devices. Which dialog is
shown is dependent upon the ‘Device’ setting in the Device Configuration dialog.
Note: Go to Step (3) only when all device configuration parameters are set correctly.
(3)
Select 3 MEASURE CURRENT POSITION from the dialog. This causes the bond head to go to the rear
rail and the capillary makes contact with a notched-out area on the rear rail. In turn, this causes
the calculated rail height to appear in the RAIL HEIGHT indicator of the dialog. The POSITION
indicator will reflect OPTIMAL, ACCEPTABLE or UNACCEPTABLE.
Note: The workholder will index if the position is OPTIMAL or ACCEPTABLE. But, to accept an
ACCEPTABLE result may decrease the throughput. The workholder will not index if an
UNACCEPTABLE result is accepted. Because of the possible throughput decrease, always try to
adjust the rail height to an OPTIMAL position.
(4)
If the POSITION is OPTIMAL or ACCEPTABLE, select the DONE button to accept the current rail
height and go to step (6). If POSITION is UNACCEPTABLE, go to step (5).
(5)
If the POSITION is UNACCEPTABLE, do the steps below:
(a)
Calculate the difference between the rail height and optimal rail height shown in the
dialog. This is the necessary amount of adjustment (in mils) to set the rails to optimal
height.
(b)
Loosen the two M6 x 25 mm screws. Turn the rail height adjustment handle (see figure
below) in the direction (CW or CCW) shown in the dialog. The number of mils necessary
to move the rails to optimal height is also shown.
A
M6 x 25 mm SHCS
B
Adjustment Handle
Figure 4-104: Rail Height Adjustment Mechanism
(c)
(6)
Operator’s Guide
Page 4-59
Select 3 MEASURE CURRENT POSITION. Go to step (4).
Push ESC two times to dismiss all menus.
Calibration
Rail Height Adjustment
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
4.5.8
Puller/Gripper Calibration
The PULLER/GRIPPER calibration sets the current range and grip force necessary to grip the lead frame.
See related topics below:
4.5.8.1 Puller Sensor Calibration
4.5.8.2 Index Gripper Sensor
4.5.8.3 Eject Gripper Sensor
4.5.8.4 Index Gripper Force
4.5.8.5 Eject Grip Force Calibration
4.5.8.1
Puller Sensor Calibration
This calibration measures the minimum current necessary to close the puller jaw.
(1)
Select CALIBRATION → WORKHOLDER → PULLER/ GRIPPER → PULLER SENSOR.
Figure 4-105: Gripper Calibration Menu
(2)
Remove all materials on the workholder. These include the heat block insert and clamp insert. If
a contamination removal system (CRS) is installed on the machine, move the head of the CRS to
a safe position. Select OK.
(3)
The puller gripper does a series of jaw movements to get the current.
(4)
When completed, a prompt with the calibration outcome is shown.
Figure 4-106: Puller Sensor Calibration
(5)
4.5.8.2
Select OK to save the data.
Index Gripper Sensor
This calibration measures the current necessary to supply a right grip force for different lead frame
thicknesses.
(1)
Select CALIBRATION → WORKHOLDER → PULLER/ GRIPPER → INDEX GRIPPER SENSOR.
(2)
Remove all materials on the workholder. This includes the heat block insert and clamp insert. If a
contamination removal system (CRS) is installed on the machine, move the head of the CRS to a
safe position. Select OK.
98890-10EA-001-00
Revision B
Calibration
Puller/Gripper Calibration
Operator’s Guide
Page 4-60
IConn PLUS ELA High Performance Ball Bonder
(3)
Put the calibration gauge (03118-0901-005-xx) through the output side as told in the dialog.
Make sure the cut out slots point to the front rail. Align the left edge of gauge against the right
edge of the gripper jaw. Select OK.
A
B
A
Calibration Gauge
B
Right Edge of Index Gripper Jaw
Figure 4-107: Index Sensor Calibration
(4)
The Index Sensor Calibration starts. Make sure that the first calibration process starts at the far
left slot of the gauge. Wait for the calibration to complete.
(5)
After the calibration, an instruction prompt to remove the calibration gauge is shown. Select OK
after you remove the gauge.
Figure 4-108: Calibration Gauge for Index Sensor Calibration
(6)
When completed, a prompt with the calibration outcome is shown. Select OK to save the data.
Figure 4-109: Index Sensor Calibration Result
4.5.8.3
Eject Gripper Sensor
This calibration measures the current necessary to supply a right grip force for different leadframe
thicknesses.
(1)
Select CALIBRATION → WORKHOLDER → PULLER/ GRIPPER →EJECT GRIPPER SENSOR.
(2)
Remove all materials on the workholder. This includes the heat block insert and clamp insert. If a
contamination removal system (CRS) is installed on the machine, move the head of the CRS to a
safe position. Select OK.
Operator’s Guide
Page 4-61
Calibration
Puller/Gripper Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(3)
Put the calibration gauge (03118-0901-005-xx) through the input side as told in the dialog. Make
sure the cut out slots point to the front rail. Align the right edge of gauge against the left edge of
the gripper jaw. Select OK.
A
B
A
Calibration Gauge
B
Left Edge of Eject Gripper Jaw
Figure 4-110: Eject Sensor Calibration
(4)
The eject sensor calibration starts. Make sure that the first calibration process starts at the far
right slot of the gauge. Wait for the calibration to complete.
(5)
After the calibration, an instruction prompt to remove the calibration gauge is shown. Select OK
after you remove the gauge.
(6)
When completed, a data prompt with the calibration outcome is shown. Select OK to save the
data.
Figure 4-111: Index Sensor Calibration Result
4.5.8.4
Index Gripper Force
This calibration measures the current necessary to supply a right grip force for different leadframe
thicknesses.
(1)
Select CALIBRATION → WORKHOLDER → PULLER/ GRIPPER → INDEX GRIPPER FORCE.
(2)
Remove all materials on the workholder. This includes the heat block insert and clamp insert. If a
contamination removal system (CRS) is installed on the machine, move the head of the CRS to a
safe position. Select OK.
(3)
Install the low force calibration weight gauge (03129-0901-002-xx) on the rear of left gripper
upper jaw.
Figure 4-112: Low Force Calibration Weight Gauge
98890-10EA-001-00
Revision B
Calibration
Puller/Gripper Calibration
Operator’s Guide
Page 4-62
IConn PLUS ELA High Performance Ball Bonder
(4)
Put the calibration gauge (03118-0901-005-xx) through the output side as told in the dialog.
Make sure the cut out slots points to the front rail. Align the left edge of gauge to the right edge
of the gripper jaw. Select OK.
Figure 4-113: Calibration Gauge
B
C
A
A
B
Low Force Calibration Weight Gauge
Calibration Gauge
C
Right Edge of the Gripper Jaw
Figure 4-114: Index Gripper Force Calibration Setup
(5)
The index gripper force calibration starts. Make sure that the first calibration process starts at the
far left slot of the gauge. Wait for the calibration to complete.
(6)
After the calibration, an instruction prompt to remove the calibration gauge and the weight gauge
is shown. Select OK after you remove the gauges.
(7)
When completed, a data prompt with the calibration outcome is shown. Select OK to save the
data.
Figure 4-115: Index Sensor Calibration Result
4.5.8.5
Eject Grip Force Calibration
This calibration measures the current necessary to supply a correct grip force for different leadframe
thicknesses.
(1)
Select CALIBRATION → WORKHOLDER → PULLER/ GRIPPER → EJECT GRIPPER FORCE.
(2)
Remove all materials on the workholder. This includes the heat block insert and clamp insert. If a
contamination removal system (CRS) is installed on the machine, move the head of the CRS to a
safe position. Select OK.
Operator’s Guide
Page 4-63
Calibration
Puller/Gripper Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(3)
Install the low force calibration weight gauge (03129-0901-002-xx) on the rear of right gripper
upper jaw.
Figure 4-116: Low Force Calibration Weight Gauge
(4)
Put the calibration gauge (03118-0901-005-xx) through the input side as told in the dialog. Make
sure the cut out slots points to the front rail. Align the right edge of gauge with the left edge of the
gripper jaw. Select OK.
Figure 4-117: Calibration Gauge
A
B
C
A
B
Calibration Gauge
Left Edge of the Gripper Jaw
C
Low Force Calibration Weight Gauge
Figure 4-118: Eject Gripper Force Calibration Setup
(5)
The index gripper force calibration starts. Make sure that the first calibration process starts at the
far right slot of the gauge. Wait for the calibration to complete.
(6)
After the calibration, an instruction prompt to remove the calibration gauge and the weight gauge
is shown. Select OK after you remove the gauges.
(7)
When completed, a data prompt with the calibration outcome is shown. Select OK to save the
data.
Figure 4-119: Index Sensor Calibration Result
98890-10EA-001-00
Revision B
Calibration
Puller/Gripper Calibration
Operator’s Guide
Page 4-64
IConn PLUS ELA High Performance Ball Bonder
4.5.9
Gripper Calibration Result
Select GRIPPER CALIBRATION RESULTS from the Puller/ Gripper menu to show a dialog that contains the
results of all the gripper calibrations. All the items in this dialog are for view purpose only, they cannot
be changed.
Figure 4-120: Gripper Calibration Results
4.5.10
Workholder Calibrations
Select WORKHOLDER CALIBRATIONS from the WORKHOLDER menu to show a dialog that contains the
results for all the workholder calibrations. For results related to the two point calibration data, make
sure that the Two Point Rail Cal option is enabled in the Rails Configuration menu. All the items in this
dialog are for view purpose only, they cannot be changed.
Figure 4-121: Workholder Calibrations
Operator’s Guide
Page 4-65
Calibration
Gripper Calibration Result
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
4.6
Magazine (Mag) Handler Calibration
The Magazine Handler Calibrations have software routines that are used to calibrate the input trays,
output trays, input slot and output slot. A series of software dialogs step you through each calibration
process.
Figure 4-122: Magazine Handler Calibration Menu
Note: Each Magazine Handler Calibration must be fully completed. A restart of the calibration
procedure is necessary when you click on the CANCEL button before the calibration.
Select the topics below for the procedures of Magazine Handler Calibration:
4.6.1 Input/Output Trays Calibration
4.6.2 Input/Output Slot Calibration
4.6.3 Y Sensor Offset
4.6.4 Calibration Results
98890-10EA-001-00
Revision B
Calibration
Magazine (Mag) Handler Calibration
Operator’s Guide
Page 4-66
IConn PLUS ELA High Performance Ball Bonder
4.6.1
Input/Output Trays Calibration
This calibration tells you to move the magazine handler gripper to the applicable positions and to teach
the correct positions to pick up and eject magazines.
WARNING:
During the calibration procedures, magazine handler components move. Before the execution of
each step, remove hands from the magazine handler area.
WARNING:
Hot surfaces on heat blocks and heat block inserts. Make sure that you exercise extreme caution
when you work in these areas.
Note: The steps for the Input Trays Calibration and Output Trays Calibration are the same. Thus,
this section only shows the calibration operation for input trays.
Note: You can use an empty magazine or a straightedge in this calibration. In the steps below, show
how to use an empty magazine for calibration.
Tools, Materials, and Equipment
Part Number
Supplier
None
Local Purchase
Empty magazine
(1)
Select CALIBRATION from the mode bar, then select MAG HANDLER from the Calibration menu.
This causes the Mag Handler menu to appear.
(2)
From the Mag Handler menu, select INPUT TRAYS. This causes the first in a series of instructional
dialogs to appear.
(3)
Remove magazines or other material from the top and bottom trays of the input magazine
handler. Select OK when done.
(4)
Align the top tray of the input magazine handler. Follow the instructions in the dialog and the
steps below.
(a)
Put an empty magazine on the top tray of the input magazine handler. Put it against the
rear right corner of the tray.
(b)
Use the left/right arrow keys on the MMI to chess the gripper (fork) of the input magazine
handler. Make sure that the alignment buttons on the bottom gripper pad touch the
magazine wall.
A
C
B
D
A
B
Alignment Button
Bottom Gripper Jaw
C
D
Magazine
Tray
Figure 4-123: Alignment Buttons (Side View)
(c)
(5)
Make sure that the Top Tray Calibration. Follow the instructions in the dialog and the steps
below.
(a)
Operator’s Guide
Page 4-67
Select OK in the dialog when the gripper is at the correct position.
Remove the magazine from the top tray.
Calibration
Input/Output Trays Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(b)
(6)
(7)
Select OK in the dialog. The tray sensor at the front of the gripper finds the sensor flag at
the top tray. When done, the gripper moves near the bottom tray and stops. The next dialog
appears on the display.
Align the input magazine handler’s bottom tray. Follow the instructions in the dialog and the
steps below.
(a)
Put an empty magazine on the bottom tray of the input magazine handler, align it to the
rear right corner of the tray.
(b)
Use the left/right arrow keys to chess the gripper (fork) of the input magazine handler to
where the alignment buttons above the bottom gripper pad touches the magazine wall.
This is the same procedure that was done for the top tray.
(c)
Select OK in the dialog when the gripper is at the correct position.
Make sure that the Bottom Tray Calibration. Follow the instructions in the dialog and the steps
below.
(a)
Remove the magazine from the bottom tray.
(b)
Select OK in the dialog. The tray sensor at the front of the gripper finds the sensor flag at
the bottom tray.
Note: This completes the procedures of Input Trays Calibration. If necessary, do the
procedures of Output Tray Calibration.
98890-10EA-001-00
Revision B
Calibration
Input/Output Trays Calibration
Operator’s Guide
Page 4-68
IConn PLUS ELA High Performance Ball Bonder
4.6.2
Input/Output Slot Calibration
This calibration tells you to move the magazine handler gripper to the applicable positions and to teach
the correct slot positions for the magazine handler to inject and eject leadframe.
The figure below shows the gauges used in the Input/Output Slot Calibrations. The figure shows each
gauge with relation to how it is used when you do the Input and Output Slot Calibrations. Refer to the
figure when you do the calibrations.
A
B
C
D
F
G
H
E
A
B
C
D
E
I
Input Upper Y-axis Hole
Input Lower Y-axis Hole
Input Z-axis Hole
Output Slot Calibration Side
Magazine-Sized Gauge
F
G
H
I
Input Slot Calibration Side
Input Calibration Pin
Y-Z Gauge Insert
Output Calibration Pin
Figure 4-124: Magazine-Sized Gauge and Y-Z Gauge
Note: Put magazine-sized gauge as shown.
Align the magazine-sized gauge left or right against mag handler wall.
Align the Y-Z gauge insert against rear rail.
WARNING:
During the calibration procedures, MHS components move. Before the execution of each step,
remove hands from the mag handler and workholder areas.
WARNING:
Hot surfaces on heat blocks and heat block inserts. Make sure that you exercise extreme caution
when you work in these areas.
Note: The steps for the calibration of the input slot and output slot are the same. Thus, only the
operations necessary to do the Input Slot Calibrations are given in the steps below.
Tools, Materials, and Equipment
Part Number
Supplier
Magazine-Sized Gauge
03412-0999-007-xx
Kulicke & Soffa
Y-Z Gauge
03128-0901-006-xx
Kulicke & Soffa
(1)
Operator’s Guide
Page 4-69
Select CALIBRATION, from the mode bar, then select MAG HANDLER from the Calibration mode
menu.
Calibration
Input/Output Slot Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(2)
From the Mag Handler menu, select INPUT SLOT. This causes the first in a series of instructional
prompts to appear.
(3)
Remove all lead frames from the workholder. Select OK.
(4)
Remove hands from the workholder area, then select OK in the ‘Warning’ prompt.
WARNING:
During the next step the rail height is measured by the bond head goes down and touches the rear
rail. Make sure there is no ball in the capillary before you do this step.
(5)
Read the warning in the dialog and select OK to continue with the rail height measurement.
Note: If rail height is not correct, do the rail height adjustment before you do this calibration. Refer
to the section of the rail height adjustment.
(6)
Remove all material from the workholder. Remove the clamp and heat block inserts. Move out
the cleaning head of the contamination removal system (CRS) if it is available. Select OK when
done.
(7)
Put the magazine and Y-Z gauges. Do the steps below:
(a)
Put the magazine-sized gauge on the load tray of the input mag handler. Put the gauge for
pickup. Push it against the input mag handler wall. Make sure that the label FRONT points
to the front of the machine.
(b)
Put the Y-Z gauge in the workholder. Put the pins along the rear rail. Carefully push the YZ gauge (use very little pressure) against the front rail.
B
A
A
Magazine Gauge Slot
B
Y-Z Gauge
Figure 4-125: Y-Z Gauge
(c)
(8)
Select OK in the dialog. This causes the input magazine handler to pick up the magazinesized gauge.
Put the magazine-sized gauge at the correct Z-axis location. Do the steps below.
CAUTION:
Remove the Y-Z gauge from the magazine gauge before you chess the gripper.
(9)
(a)
Use the Up and Down arrow keys on the MMI to chess the gripper (fork). Make sure that
the Y-Z gauge input pin can go into the Z-axis hole freely on the magazine-sized gauge.
(b)
When alignment is correct, move the Y-Z gauge into the workholder. Make sure that the
pin is free of the magazine gauge. When the Y-Z gauge is put correctly, select OK in the
dialog.
Put the magazine-sized gauge at the correct lower Y-axis location. Do the steps below.
(a)
98890-10EA-001-00
Revision B
Use the LEFT and RIGHT Arrow keys on the MMI to chess the gripper (fork). Make sure
that the Y-Z gauge input pin can go into the lower Y-axis hole freely on the magazine
gauge.
Calibration
Input/Output Slot Calibration
Operator’s Guide
Page 4-70
IConn PLUS ELA High Performance Ball Bonder
(b)
When alignment is correct, move the Y-Z gauge into the workholder again. Make sure that
the pin is free of the magazine gauge. When the Y-Z gauge is in the correct position, select
OK in the dialog.
(10) Put the magazine-sized gauge at the correct upper Y-axis location. Do the steps below.
(a)
Use the LEFT and RIGHT Arrow keys on the MMI to chess the gripper (fork). Make sure
that the Y-Z gauge input pin can go into the upper Y-axis hole freely on the magazine
gauge.
(b)
When alignment is correct, move the Y-Z gauge into the workholder again. Make sure that
the pin is free of the magazine gauge. When the Y-Z gauge is in the correct position, select
OK in the dialog.
(11) Adjust the width of the unload tray magazine guide to clear the magazine gauge when the gauge
is ejected. Select OK in the dialog to eject the magazine gauge.
(12) Remove the Y-Z gauge from the workholder rails. Select OK when done.
(13) Install heat block and clamp inserts. Select OK when done.
Note: This completes the procedures for Input Slot Calibration. If necessary, do the procedures for
Output Slot Calibration.
Operator’s Guide
Page 4-71
Calibration
Input/Output Slot Calibration
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
4.6.3
Y Sensor Offset
The MOTION AFTER Y SENSOR parameter is the Y-axis distance the input magazine handler travels when
the leadframe is made aligned with the workholder. This distance has a default value of 10 mils and is
fine-tuned manually. A accurate distance is necessary to make sure that the leadframe can index
smoothly into the workholder. The purpose of this Y SENSOR OFFSET calibration is to add the precision
of this parameter.
Tools, Materials, and Equipment
Part Number
Supplier
Magazine-Sized Gauge
03412-0999-007-xx
Kulicke & Soffa
Y Sensor Calibration Gauge
08888-0901-030-xx
Kulicke & Soffa
Note: To activate the calibrated option of Y Sensor Offset, go to CONFIGURE → MAG HANDLER → MAG
CONFIGURATION. Set MOTION AFTER Y SENSOR to CALIBRATED.
(1)
Select CALIBRATION → MAG HANDLER → Y SENSOR OFFSET. You are told to follow a series of
instructions shown on the GUI.
(2)
Keep hands away from the workholder area, then select OK in the “Warning” prompt as shown in
the figure below.
Figure 4-126: Warning: Keep Hands Away
(3)
Remove all materials, clamp, and heat block inserts from the workholder. Move out the cleaning
head of Contamination Removal System (CRS) if it is available. Select OK when done.
Figure 4-127: Removal of All Materials
(4)
Put magazine-sized gauge (03412-0999-007-xx) at the drop-off end of the input load tray and do
the instructions given in the figure below. Select OK when done.
Figure 4-128: Magazine-sized Gauge
98890-10EA-001-00
Revision B
Calibration
Y Sensor Offset
Operator’s Guide
Page 4-72
IConn PLUS ELA High Performance Ball Bonder
(5)
The gripper of the input magazine handler picks up the magazine-sized gauge and moves to the
calibration position. Do the instructions in the dialog as shown in the figure below.
Figure 4-129: Y Registration Sensor Gauge
(a)
Put the Y sensor calibration gauge (08888-0901-030-xx) into the indexer rails.
(b)
Push the Y sensor calibration gauge against the rear rail.
A
C
D
B
A
B
Screw
Magazine-sized Gauge
C
D
Y Sensor Calibration Gauge
Rear Rail
Figure 4-130: Y Sensor Calibration Gauge
(6)
(c)
Chess the magazine-sized gauge until the top of the gauge is aligned with the rails. Use UP
or DOWN arrow keys to chess.
(d)
Align the Y sensor calibration gauge against the rear rail and align its slots along the holes
on the top right surface of magazine gauge.
(e)
Select OK to continue.
Tighten the Y sensor calibration gauge to magazine-sized gauge. Select OK to continue.
Figure 4-131: Y Sensor Calibration Gauge to Magazine-sized Gauge
(7)
The Y registration sensor detects the Y sensor calibration gauge. Keep hands away from the
MHS as the magazine handler is about to move. Select OK in the “Warning’ prompt as shown in
the figure below.
Figure 4-132: Warning: Mechanism Ready to Move
Operator’s Guide
Page 4-73
Calibration
Y Sensor Offset
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
Note: If the Y registration sensor does not detect the Y sensor calibration gauge, a prompt
appears to tell you to abort the calibration. Select OK and do a check on the installation
of Y sensor calibration gauge.
(8)
When the Y registration sensor is detected, the input magazine handler will move away by 100
mils to unblock the sensor. Then it moves rearward until it blocks the Y sensor again. It will stop
and the Y-axis value (calibrated value) is recorded. The Y sensor offset value is saved in the
system.
Note: The distance for Y sensor offset is between 2-50 mils. If the recorded Y sensor offset
value is out of this range, a prompt appears to tell you to adjust the Y registration sensor
position again. Select OK in the dialog shown to adjust the Y registration sensor again.
(9)
Remove the Y sensor calibration gauge as shown in the prompt. Select OK to Continue.
Figure 4-133: Y Registration Sensor Gauge Dialog
(10) Adjust the width of the unload tray magazine guide to give clearance for the gauge to park. Select
OK to eject the magazine gauge to the unload input tray.
Figure 4-134: Eject Magazine Guide
(11) To activate the calibrated option of Y SENSOR OFFSET, go to CONFIGURE → MAG HANDLER →
MAG CONFIGURATION. Set MOTION AFTER Y SENSOR to CALIBRATED.
4.6.4
Calibration Results
Select 9 CALIBRATION RESULTS from the MAG HANDLER menu to show a dialog that contains the results
of all the magazine handler calibrations. All of the items in the dialog are for view purposes only and
cannot be changed.
98890-10EA-001-00
Revision B
Calibration
Calibration Results
Operator’s Guide
Page 4-74
IConn PLUS ELA High Performance Ball Bonder
4.7
Incomplete Calibrations
Select 6 INCOMPLETE CALIBRATIONS from the Calibration menu to show the Incomplete Calibrations
dialog. This dialog contains a list of calibrations that are failed or not done on the bonder. If all
necessary calibrations are completed with acceptable results, the dialog is empty. Click on the DONE
button to close the dialog. The Incomplete Calibration dialog shows a list of calibrations that you must
complete before you can start bonding.
Figure 4-135: Incomplete Calibrations
Operator’s Guide
Page 4-75
Calibration
Incomplete Calibrations
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
4.8
XY Table Characterization
Table mapping uses the table position to calibrate the X and Y offsets and uses the data to calculate best
coordinates to the nearest encoder count. This feature refers to the XY plane to calculate the alignment
and bond locations.
Note: Refer to the Table Mapping Tool Kit (08888-0905-001-xx) for more data on XY table mapping
procedure.
Select 7 XY TABLE CHARACTERIZATION from the Calibration mode menu to open the XY TABLE
CHARACTERIZATION dialog.
Figure 4-136: XY Table Characterization
98890-10EA-001-00
Revision B
Calibration
XY Table Characterization
Operator’s Guide
Page 4-76
IConn PLUS ELA High Performance Ball Bonder
4.9
On Bonder Personality Factor (OBPF)
The On Bonder Personality Factor (OBPF) calibration prepares the ultrasonics generator (USG) system
on different bonders to give the same capillary vibration. This is to make sure that the same power
settings give equivalent bonding response in a group of bonders.
To calibrate the USG system, you must know the system power input to make the vibration at the
capillary tip. The USG system is calibrated to set the high frequency current factor (HFCF) and low
frequency current factor (LFCF) of the bonder. A range of current factor values are used to adjust the
USG system output with a range of power inputs. The HFCF and LFCF are set to adjust the USG power
input to the bonder. This is done to make sure that the bonding output is equivalent for a group of
bonders.
The calibration setup includes consumable and non-consumable parts.
•
Consumable parts (08888-0832-000-XX):
Tools, Materials, and Equipment
Part Number
Qty
Supplier
C8-82-2479-P37-KSS
15
Kulicke & Soffa
Leadframes with 208LD devices
19088-0208-000
15
Kulicke & Soffa
0.8 mil, PD Coated CU Wire
84400-5000-000
1
Kulicke & Soffa
Part Number
Qty
Supplier
41520-1920-810
2
Kulicke & Soffa
C8-82-2479-P37 Capillary
•
Non-consumable parts (08888-0833-000-XX):
Tools, Materials, and Equipment
Magazine, Leadframe,1.920x8.100
Clamp Insert 208LD
08888-0833-010-XX
1
Kulicke & Soffa
Heat Block 208LD
08888-0833-020-XX
1
Kulicke & Soffa
You must do the OBPF calibration after these procedures:
•
Transducer adjustment or replacement
•
Piezo Sensor replacement
•
USG board replacement
Operator’s Guide
Page 4-77
Calibration
On Bonder Personality Factor (OBPF)
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
4.9.1
Calibration Procedure
(1)
Select CALIBRATION, then ON BONDER PERSONALITY FACTOR.
Figure 4-137: Personality Factor Calibration Set Up Dialog
The items in the Personality Factor Calibration Set Up dialog are as follows:
Parameter
Definition
PERSONALITY FACTOR
Sets the frequency type for calibration.
HFCF: Calibrates the high frequency current factor
•
•
LFCF: Calibrates the low frequency current factor
USG “XXX”
This setting shows the current factor (personality factor) value of low
frequency (LFCF) or high frequency (HFCF).
•
When PERSONALITY FACTOR is LFCF, this setting is USG LFCF
•
When PERSONALITY FACTOR is HFCF, this setting is USG HFCF
PROCESS
•
ADJUSTMENT: Calibration mode to adjust the force slope settings to
•
MEASURE SLOPE: Calibration mode that refers to the current HFCF or
make sure that the USG response slope aligns tightly to the target slope
LFCF to measure the force and USG response slop
TARGET SLOPE
This sets the target slope for the calibration of the current factor (personality
factor) for HFCF or LFCF. At the factory, the bonder is calibrated at 0.210 for
high frequency and 0.198 for low frequency.
SHOW LAST GRAPH
Shows the USG response data that is collected from the last calibration.
SETUP INFORMATION
Shows the materials that are necessary for the calibration. Added "New
Capillary Screw" as a recommended setup material.
PERFORM
Starts the calibration.
(2)
Install the wire spool (84400-5000-000).
(3)
Put one magazine with the 208LD devices onto the input magazine handler. Put the other
magazine onto the output magazine handler.
(4)
Set PERSONALITY FACTOR to LFCF or HFCF.
(5)
Set PROCESS to ADJUSTMENT.
98890-10EA-001-00
Revision B
Calibration
Calibration Procedure
Operator’s Guide
Page 4-78
IConn PLUS ELA High Performance Ball Bonder
(6)
Select PERFORM to start the calibration. The Load Program dialog appears.
Figure 4-138: Load Calibration Program
(7)
Select LOAD PROCESS PROGRAM. The bonder loads the special calibration PP.
•
•
If PERSONALITY FACTOR is LFCF, the bonder loads “OBLFCF.TAR”
If PERSONALITY FACTOR is HFCF, the bonder loads “OBHFCF.TAR”
Figure 4-139: Dialog Prompt
(8)
A dialog appears. If necessary, remove the clamp insert and the heat block. Install the clamp
insert (08888-0833-010-XX) and the heat block (08888-0833-020-XX), then select OK.
(9)
Select OK. The Bonding Set Up dialog appears with the automatic setting change.
Figure 4-140: Bonding Set Up Dialog
•
•
Operator’s Guide
Page 4-79
If the C8-82-2479-P37 capillary is not installed:
1.
Remove the capillary, if necessary.
2.
Select DONE.
3.
Install the C8-82-2479-P37 capillary.
4.
Do the routing of the bonding wire, then do a bond off.
5.
Select AUTO from the mode bar, then push RUN.
If the C8-82-2479-P37 capillary is installed:
1.
Do the routing of the bonding wire, then do a bond off.
2.
Select START BONDING. The bonder will try to do a usual PRS alignment. If the
bonder cannot find the eyepoints and a PRS error occurs, do a usual eyepoint teach.
Calibration
Calibration Procedure
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
Note: If the indexing of an empty device onto the bond site occurs, teach the heat block
operator points, index position and do the MHS teach process, before bond off.
Note: If there is no material on the bond site, the bonder pulls in a new leadframe and starts
bonding. At the first index, teach the index position again.
Figure 4-141: Auto Bonding in Calibration Mode
(10) Auto bonding starts and the bonder calibrates for the current factor (personality factor). The
calibration is done on a maximum of six groups of 800 wires. Refer to this table.
Conditions (Error Message in
Result Dialog)
Recommended Step
“Slope of the data abnormally
low.”
Make sure that the free-air-balls (FAB) are bonded to surface and that
the die paddle is correctly attached to the heat block. Do the check on
the transducer connections.
“The fit of the data was poor.”
Clean the devices, new capillary, new cap screw and new wire with
plasma. Do the check for FAB formation problems on the bonded ball.
Make sure that the cover gas and flow head operate correctly.
“Y-intercept is outside the normal
range.”
Tune the Z servo, do the force calibration and do a check on the bond
head cables.
“Convergence tolerance hasn’t
been met.”
Select REDO to do the calibration program cycles again.
“The collected data was invalid.”
Enter this console command, then do the calibration again:
"nfsMount("xserver", "LOG_STORAGE", "/sd0/LOG_STORAGE") "
If the console is not available, restart the bonder.
98890-10EA-001-00
Revision B
Calibration
Calibration Procedure
Operator’s Guide
Page 4-80
IConn PLUS ELA High Performance Ball Bonder
•
If none of these conditions occur after bonding a group of 800 wires, bonding stops. The
Result dialog appears. Select ACCEPT to accept the current factor (personality factor) value
and exit the calibration.
Figure 4-142: Result Dialog - Calibration Pass
•
•
If a condition occur after bonding a group of 800 wires, bonding continues on the next
group of wires
If a condition occur after bonding the sixth group of 800 wires, bonding stops. The Result
dialog appears with an error condition for the sixth group of 800 wires
Figure 4-143: Result Dialog - Calibration Error
(11) Select REDO to continue or CANCEL to exit the calibration. Refer to the table for the
recommended steps for the condition.
(12) The calibration is completed. A dialog appears. Select OK.
Figure 4-144: Calibration Complete
Operator’s Guide
Page 4-81
Calibration
Calibration Procedure
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
4.10
Eyepoint Thermal Drift Calibration
This calibration adjusts the drift against time caused by heat expansion of the device to be bonded to
increase precision.
After Calibration
Before Calibration
Figure 4-145: Eyepoint Thermal Drift Calibration Dialog
The CURRENT CALIBRATION SETTINGS section shows the current settings of eyepoint thermal drift.
From the settings, you can easily tell that if a calibration is necessary.
The selections in the Eye Point Thermal Drift Calibration are as follows:
Parameter
Definition
ALIGN SCHEME
This selection shows the current alignment scheme (see Reference
Guide for procedures).
L/F 1ST INDEX DELAY
The interval of the first index when a package is indexed to the bond
area before you start the alignment.
L/F 2ND+ INDEX DELAY
The interval of the second and subsequent indexes when a package is
indexed to the bond area before you start the alignment.
MAX EXPANSION TIME
This parameter applies only when ALIGNMENT SCHEME is set to
INTRA-DEVICE. It shows the “maximum expansion time” permitted
after each index for the completion of intra-device alignment.
INTRA-DEVICE FINDS
This parameter applies only when ALIGNMENT SCHEME is set to
INTRA-DEVICE. It shows the number of times the device is aligned
during the Max Expansion Time.
98890-10EA-001-00
Revision B
Calibration
Eyepoint Thermal Drift Calibration
Operator’s Guide
Page 4-82
IConn PLUS ELA High Performance Ball Bonder
The selections in the Calibration Setup menu are as follows:
Parameter
4.10.1
Definition
EYEPOINT FIND MODE
This sets the eyepoint for calibration. You can set to use only the first
or second eyepoints, or two eyepoints together. The you set to use the
two eyepoints together, the machine refers to the eyepoint with more
thermal drift to give the results.
SHIFT TOLERANCE
The highest thermal drift that is permitted between alignment and
bonding. If the value for this parameter is lower, the index delay is
longer and the number of intra-device alignment is larger.
NUMBER OF STRIPS
Number of strips to be used in the calibration. The results are referred
to the device that has the most thermal drift in the strips processed.
The first strip is not used for the calculation of “L/F 1st Index Delay”.
For this, the first device of the next strip must be used. For the other
parameters, the device that had the most thermal drift in all the strips
processed is used (the first device of each strip is not included).
PERFORM CALIBRATION
When you select this, the leadframe in the workholder (if any) will first
be ejected. A new leadframe is indexed in and the calibration
sequence is done with the use of all the packages in the number of
strips selected.
GRAPH RESULTS
See section 4.10.1 Graph Results.
Graph Results
The graphs show the collected data and the calculated parameters. Each graph shows the strip and
device number. The recorded data for the two eyepoints are shown (distance moved vs. time) when two
eyepoints are used, and the calculated intra-device alignment times. The index delay with and without
intra-device alignment are shown. You can select one of the strip to examine the graph.
Figure 4-146: Graph Result of Eyepoint Thermal Drift Calibration
Parameter
Definition
SAVE TO FLOPPY
Saves the graph and data on to a floppy disk.
SAVE TO USB
Saves the graph and data on to an external USB device.
NEXT DEVICE
Lets you see the graph for the next device.
PREVIOUS DEVICE
Lets you see the graph of the previous device.
Operator’s Guide
Page 4-83
Calibration
Graph Results
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
4.11
Crosshair Offset Characterization
Crosshair Offset Characterization gives better control to the bond head movement and prevents
bonding errors related to the offset. This is a standard calibration procedure that corrects the offset
difference caused by the full bond head movement on the XY table.
Tools, Materials, and Equipment
Crosshair Offset Mapping Jig
Part Number
Supplier
08888-0734-000-XX
Kulicke & Soffa
Note: This calibration is not shown and can only be activated by Kulicke & Soffa approved
personnel. For more data, refer to your nearest K&S customer support.
4.11.1 Automatic Low Magnification Calibration
4.11.2 Calibration Procedure
4.11.1
Automatic Low Magnification Calibration
The automatic calibration of the low magnification is related to the bonder magnification system:
•
If the machine has a dual magnification, the machine uses the default high magnification and you
cannot change this
•
If not, the machine calibrates and uses the low magnification
98890-10EA-001-00
Revision B
Calibration
Crosshair Offset Characterization
Operator’s Guide
Page 4-84
IConn PLUS ELA High Performance Ball Bonder
4.11.2
Calibration Procedure
(1)
Select CALIBRATION → MORE. The Advanced Calibration menu appears. Select CROSSHAIR
OFFSET CHARACTERIZATION.
Figure 4-147: Advanced Calibration Menu
(2)
A dialog appears to tell you of the MHS movement. Select OK.
(3)
A dialog appears to tell you to clear the workholder. If necessary, remove the material, clamp
insert, heat block and EFO wand and move the CRS clean head out.
•
•
(4)
Select OK to continue. Install the tool, then select OK to continue. Select CANCEL to cancel
Select CANCEL, then OK to go out of the calibration sequence
Install the Crosshair Offset Characterization tool to the bond head with the device below the
camera. Select OK.
Figure 4-148: Installation of Crosshair Offset Characterization Tool
(5)
A dialog appears to tell you to adjust the illumination correctly. Select OK.
(6)
Select F10 OPTICAL button on the function bar. The Adjust Lighting dialog appears.
(7)
Adjust the optical lighting, then select SAVE AS PRESET. The Lighting Presets (Save As) dialog
appears.
(8)
Select XHAIRMAP CALIBRATION. This saves the optical light settings to be used in the next
crosshair calibration.
(9)
In the Crosshair Offset Characterization dialog, set the calibration eyepoint dimensions, accept
level and the X/Y step dimensions.
(10) Select START CHARACTERIZATION. This deletes the expired calibration results and starts the
calibration.
Operator’s Guide
Page 4-85
(a)
The bond head moves and records the locations in the safe area on the bond plane.
(b)
The bonder saves each location and crosshair offset to the parameter.
(c)
The bond head moves to make sure that the calibration tool is stable.
Calibration
Calibration Procedure
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(d)
A Calibration status dialog appears to show the number of the saved locations. You can
also exit the calibration in the next dialog that shows “Crosshair offset characterization in
progress”.
(11) The calibration is completed:
(a)
If an eyepoint error occurs during the calibration, a error dialog appears. Select DONE to do
the Crosshair Offset Characterization again or complete the calibration.
(b)
If the calibration is correct, the Crosshair Offset Characterization Result dialog appears
with the calibration data. Select ACCEPT to save the calibration results and error values to
the bonder parameters.
(c)
If the calibration error occurs, a calibration error dialog appears. Select ACCEPT to use
these values for error offset correction. Select CLEAR MAP to delete the results. The values
in the brackets “<>” is the failed value.
(12) The Crosshair Offset Characterization dialog appears again. Select DONE and prompt appears.
(13) Remove the Crosshair Offset Calibration tool. Select OK.
(14) A prompt appears and the bonder restores the MHS.
(15) A prompt appears. Install the heat block, then select OK. The calibration is completed.
98890-10EA-001-00
Revision B
Calibration
Calibration Procedure
Operator’s Guide
Page 4-86
IConn PLUS ELA High Performance Ball Bonder
4.12
Process Program Portability Factors
Process Program Portability is a feature that enables for 100% process program portability from bonder
to bonder. This feature lets you apply compensation values (portability factors) for bond parameters
(EFO current offset, loop height scale factor, loop height offset, bond force offset, USG current offset,
USG power offset and USG voltage offset). These portability factors are included in the machine
dependent parameters (MDPs).
Different dialog shows only its related portability factors. Each portability factor is password-protected
(if a password is set). The data dialog shows directly if there is no password set. To continue, select OK
in the dialog.
You must manually calibrate the portability factors to make sure that the same process program can be
used for different machines to get the same process performance. The calibration done on the bonder
does not change the current portability factors. But, offset values must be adjusted if there are changes
to the USG components and/or the bond head. If the machine default portability factor is modified, a
warning appears to tell you that the portability factor is changed. You must adjust the portability factor
after the calibration is completed. The portability factors are applicable to the related process
parameters used in manual/auto bonding, bond off and crosshair calibration functions.
Select the topics that follows for more data on each portability factor:
4.12.1 EFO Current Offset
4.12.2 Loop Height Factor/Offset
4.12.3 Bond Force Offset
4.12.4 USG Personality Values
4.12.1
EFO Current Offset
The EFO CURRENT OFFSET parameter offsets the EFO current. It is the compensation for the differences
in the EFO system that is related to the output current and the dimension of the Free-Air-Ball (FAB).
The software adds the value of this parameter to the value of the EFO CURRENT parameter which is
found in the Edit Ball Parameters dialog (see the Edit Bond Parameters section in Reference Guide).
The software is then send the result of the calculation to the EFO box. The unit of this parameter is mA.
The value range is ± 5 mA with the default value set to 0 (zero).
Select CALIBRATION → BOND HEAD → EFO → CHANGE EFO CURRENT OFFSET to show the Change EFO
Current Offset dialog.
Figure 4-149: Portability Factor - EFO Current Offset
Change the value of EFO CURRENT OFFSET from the CHANGE EFO CURRENT OFFSET dialog. Select DONE
when you complete the change(s).
4.12.2
Loop Height Factor/Offset
The LOOP HEIGHT SCALE FACTOR parameter is used to set the scale factor of loop height. This adjusts
for differences in the Z movements that is related to the loop height consistency. The range is between
0.95 to 1.05. The default scale factor is 1.0 (1.0 = 100%). The resolution of the scale factor is 0.0001.
Operator’s Guide
Page 4-87
Calibration
Process Program Portability Factors
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
The LOOP HEIGHT OFFSET parameter is used to offset the loop height. This adjusts for differences in the
Z movements that is related to the loop height consistency. The resolution of the offset value is 0.01
mils. The range is ± 2 mils with the offset default value of 0 (zero).
Select CALIBRATION → BOND HEAD → Z-AXIS ADJUSTMENTS → LOOP HEIGHT FACTOR/OFFSET →
CHANGE LOOP HEIGHT SCALE/OFFSET to show the Change Loop Height Scale/Offset dialog.
Figure 4-150: Portability Factors - Loop Height Factor/Offset
Change the value of LOOP HEIGHT SCALE FACTOR and LOOP HEIGHT OFFSET from the CHANGE LOOP
HEIGHT SCALE/OFFSET dialog. Select DONE when you complete the change(s).
4.12.3
Bond Force Offset
It is used to offset the bond force applied. This is to adjust for differences in the bond head system that
is related to the bond force, and ball size and shear. The resolution of the value is 1 g and the range is ±
5 g with the default value of 0 (zero).
Select CALIBRATION → BOND HEAD → BOND FORCE → CHANGE BOND FORCE OFFSET to show the
Change Bond Force Offset dialog.
Figure 4-151: Portability Factor - Bond Force Offset
Change the value of BOND FORCE OFFSET from the CHANGE BOND FORCE OFFSET dialog. Select DONE
when you complete the change(s).
98890-10EA-001-00
Revision B
Calibration
Bond Force Offset
Operator’s Guide
Page 4-88
IConn PLUS ELA High Performance Ball Bonder
4.12.4
USG Personality Values
Select CALIBRATION → BOND HEAD → USG → USG PERSONALITY VALUES to show the USG Personality
Values dialog.
Figure 4-152: Portability Factors - USG Personality Values
Change the value of selections 1 to 6 from the USG PERSONALITY VALUES dialog. Select DONE when you
complete the change(s). You can select UNITS to change the values to different units. The available
selections are MACHINE and ENGR (engineering).
USG Personality Values (Parameter Definitions):
Parameter
Definition
VOLTAGE
FACTOR
VOLTAGE FACTOR is used to normalize the USG behavior of the bonder. The software
multiplies the value of this parameter by the value of the USG VOLTS parameter which is
found in the Edit Bond Parameters dialog. The software is then send the result of the
calculation to the USG board.
VOLTAGE
OFFSET
VOLTAGE OFFSET is used to offset the USG voltage applied. This corrects the differences
in the bond head and transducer system which is related to the amplitude of the ultrasonic
scrub, and the ball size and shear. The value of this parameter is added to the value of the
USG VOLTS parameter which is found in the Edit Bond Parameters dialog. The software is
then send the result of the calculation to the USG board. The unit of this parameter is mV
(millivolts). The value range is ± 2000 mV with the default value set to 0 (zero).
CURRENT
FACTOR
CURRENT FACTOR is used to normalize the USG behavior of the bonder. The software
multiplies the value of this parameter by the value of the USG CURRENT parameter which
is found in the Edit Bond Parameters dialog. The software is then send the result of the
calculation to the USG board.
CURRENT
OFFSET
CURRENT OFFSET is used to offset the USG current applied. This corrects the differences
in the bond head and transducer system that is related to the amplitude of the ultrasonic
scrub, and the ball size and shear. The value of this parameter is added to the value of the
USG CURRENT parameter is in the Edit Bond Parameters dialog. The software is then
send the result of the calculation to the USG board. The unit of this parameter is mA
(milliamperes). The value range of this parameter is ± 25 mA with the default value set to 0
(zero).
POWER
FACTOR
POWER FACTOR is used to normalize the USG behavior of the bonder. The software
multiplies the value of this parameter by the value of the USG POWER parameter which is
found in the Edit Bond Parameters dialog. The software is then send the result of the
calculation to the USG board.
POWER
OFFSET
POWER OFFSET is used to offset the USG power applied. This corrects the differences in
the bond head and transducer system that is related to the amplitude of the ultrasonic
scrub, and the ball size and shear. The value of this parameter is added to the value of the
USG POWER parameter which is found in the Edit Bond Parameters dialog. The software
is then send the result of the calculation to the USG board. The unit of this parameter is
mW (milliwatts). The value range is ± 50 mW with the default value set to 0 (zero).
Operator’s Guide
Page 4-89
Calibration
USG Personality Values
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
Chapter 5: Preventive Maintenance and Replacements
5.1 40-hour Preventive Maintenance
5.2 Replacement Procedures
98890-10EA-001-00
Revision B
Preventive Maintenance and Replacements
Operator’s Guide
Page 5-1
IConn PLUS ELA High Performance Ball Bonder
5.1
40-hour Preventive Maintenance
The 40-hour preventive maintenance includes maintenance procedures for 40 hours. For full
maintenance schedule and routine, refer to the Maintenance Manual.
Obey the warnings below when preventive maintenance (PM) procedures in the area of preheat and
bond site heat blocks are done.
WARNING:
Do not touch the heat blocks or inserts if heating elements are on. These components are hot and will
burn skin without protection.
Service
Inspect/Clean Bonder and MHS
8 hours
Inspect Capillary
8 hours
Clean Air Guide
8 hours
Clean Wire Clamp Jewels
40 hours
Check Wire Clamp Gap
40 hours
Clean Microscope Lens
40 hours
Clean Wire Feed Tensioner
Operator’s Guide
Page 5-2
Frequency
•
•
•
After each wire spool replacement
After 1000 feet (300 meters) of wire usage
If wire feed problems are caused by dirt collected in the
tensioner tubes
Preventive Maintenance and Replacements
40-hour Preventive Maintenance
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
5.1.1
Inspect/Clean Bonder and MHS
Remove dust, dirt, or foreign materials.
Tools, Materials, and Equipment
5.1.2
Part Number
Supplier
5 - 10% solution of Isotropy Alcohol in deionized
water
None
Local Purchase
Lint-free Cloth
None
Local Purchase
Vacuum Cleaner
None
Local Purchase
(1)
Push the MOTOR STOP key (key indicator turns ON). Off workholder heaters. Give several
minutes for heat blocks to cool.
(2)
Examine bonder and MHS to see if they are clean.
(3)
Use cloth or vacuum cleaner to remove dust, dirt, or foreign materials. Make sure bond site area.
Use alcohol/water solution to clean dirty surfaces of machine.
Inspect Capillary
Examine capillary for wear or gold collected.
WARNING:
The bond site area is hot. Do not touch the heated surfaces.
5.1.3
(1)
Push the MOTOR STOP key (key indicator turns ON).
(2)
Use the microscope to visually examine first and second bonds for crispness. Poor bonds can
show worn or damaged capillary.
(3)
If bond tool replacement is necessary, refer to Section 5.2.1 Replace Capillary.
Clean Air Guide
Remove collected dust from the wire feed air guide.
•
Frequency
•
For each 200 hours of operation in clean room environment
•
For each 8 hours of operation in non-clean room environment. Usually if contamination in
the air guide assembly causes wire feed problems
Tools, Materials, and Equipment
Clean room gloves
(1)
Part Number
Supplier
None
Local Purchase
Hex Wrench Set
None
Local Purchase
Lint-free cloth
None
Local Purchase
Microdenier Wiper (Berkshire MicroPolx 2000 or
equivalent)
None
Local Purchase
Isopropyl alcohol
None
Local Purchase
Push the AIR GUIDE and TENSIONER KEY on the MMI keypad to stop the AIR GUIDE and
TENSIONER. Make sure that the LED indicators are off (dark).
CAUTION:
Operation Hazard. Do not touch the air guide surfaces with bare hands or with tools.
(2)
98890-10EA-001-00
Revision B
Wear clean room gloves.
Preventive Maintenance and Replacements
Inspect/Clean Bonder and MHS
Operator’s Guide
Page 5-3
IConn PLUS ELA High Performance Ball Bonder
(3)
Loosen the two captive screws at the front plate and remove the front plate.
A
B
C
D
E
F
Back Plate
Sensor Opening
Air Guide Manifold
Sensor Capstan
Sensor Opening
Front Plate
G
H
I
J
K
Captive Screw
M2 x 12 mm Screw
M1.6 x 8 mm Screw
M4 x 12 mm FLHCS
Lower Capstan
Figure 5-1: Air Guide
(4)
Loosen the M4 x 12 mm FLHCS and remove the back plate from the upper console. Make sure
that you do not pull the sensor cable behind the back plate.
(5)
Loosen each M1.6 x 8 mm screws and remove the sensor capstan and low capstan.
(6)
Remove the two M2 x 12 mm screws found at the rear face of the back plate. Take out the air
guide manifold. Note the ground cable attached behind.
(7)
Make the lint-free cloth moist lightly with the isopropyl alcohol. Carefully clean the surfaces of
the front and back plates, manifold inner surfaces, and capstan surfaces.
(8)
Let the surfaces dry.
(9)
Use a new dry lint-free cloth and clean the surfaces in one direction to remove all the
contamination.
(10) Make the microdenier wiper moist lightly with the isopropyl alcohol. Carefully clean the
surfaces of the front and back plates, manifold inner surfaces, and capstans surfaces.
(11) Let the surfaces dry.
(12) Use a new dry microdenier wiper, and clean the surfaces in one direction to remove all the
contamination.
(13) Put the sensor capstan's sensor opening on the back plate's sensor opening. Turn to align the
openings. Make sure that the chamfered face of the capstan’s sensor is rested the back plate.
(14) Tighten the sensor capstan to the back plate.
(15) Install the low capstan and tighten the screw. Make sure that the chamfered face of the capstan’s
sensor is rested the back plate.
Operator’s Guide
Page 5-4
Preventive Maintenance and Replacements
Clean Air Guide
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(16) Install the air guide manifold to the back plate. Make sure that you align the air guide manifold’s
edge to the back plate’s edge (see figure below).
A
B
Air Guide Manifold
Back Plate
C
Edge to Edge Alignment
Figure 5-2: Air Guide Manifold
(17) Tighten the two M2 x 12 mm screws together with the ground cable.
(18) Install the back plate to the upper console and tighten the M4 x 12 mm FLHCS.
(19) Install the front plate with the two captive screws.
(20) Push the AIR GUIDE and TENSIONER KEY on the MMI keypad. Make sure that the LED indicators
are on, on the keypad.
98890-10EA-001-00
Revision B
Preventive Maintenance and Replacements
Clean Air Guide
Operator’s Guide
Page 5-5
IConn PLUS ELA High Performance Ball Bonder
5.1.4
Clean Wire Clamp Jewels
To prevent sticking of wire clamp.
•
Frequency: 40 hours, or sooner when:
•
Wire clamp operates erratically, or
•
False BITS non-stick on pad (NSOP) indications (Intermittent)
Tools, Materials, and Equipment
Part Number
Supplier
Clean, white, lint–free paper
None
Local Purchase
Ethanol (grain alcohol), 98% purity or better
None
Local Purchase
CAUTION:
Only ethanol (grain alcohol) should be used to clean the clamp jewels. Do not use other solvents
(potassium iodide, Lime–Away, etc.), as they will chemically react with and damage the conductive
clamp jewel material.
WARNING:
Ethanol (grain alcohol) is a volatile flammable liquid. Exercise care when using it.
Note: You can do wire clamp cleaning with bonder under power.
(1)
Push the F8 key on the MMI (clamp opens). If there are wires between clamp jewels, remove
them.
(2)
Apply a few drops of alcohol to moist a piece of lint–free paper. Put the moist paper between the
clamp jewels.
(3)
Push the F8 key (clamp closes). Carefully move the paper back-and-forth in between clamp
jewels.
(4)
Push the F8 key (clamp opens). Discard the moist paper.
(5)
Put a dry piece of lint–free paper between the clamp jewels and push the F8 key (clamp closes).
(6)
Remove the paper between the closed clamp jewels in one smooth movement. Discard the paper.
(7)
Push the F8 key (Clamp opens). Blow canned air over the clamp jewel.
(8)
Push the F8 key several times to open and close the clamp. Make sure that the clamp jewels do
not stick.
(9)
Do a visual check between the clamp jewels for residue or paper fibers and remove them as
needed.
(10) Do the procedure, if necessary.
(11) Fill in the machine wire clamp cleaning log.
Operator’s Guide
Page 5-6
Preventive Maintenance and Replacements
Clean Wire Clamp Jewels
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
5.1.5
Check Wire Clamp Gap
Note: The wire clamp lateral position and clamp gap adjustments interact with each other. After you
adjusted the wire clamp gap, do a check on the clamp lateral position.
Make sure the gap between wire clamp jewels is correct to prevent higher impact force on the wire and
to prevent wire path drag.
•
Frequency: Check clamp gap for each 40 hours of operation or if the wire clamp operates
erratically.
Tools, Materials, and Equipment
Part Number
Supplier
None
Local Purchase
Insulated Hex wrench, 0.9 mm
(1)
On the work light (press F9) to illuminate the wire clamp jewels. Set the bond head and
microscope until the bottom of the clamp jewels can be seen.
(2)
Increase the microscope magnification to 4X and adjust the focus as necessary. Turn the
microscope eyepiece so the reticle is horizontal in the field of view.
(3)
Press F8 to open the wire clamp. Align a major reticle division with the edge of the conductive
clamp jewel. The easiest procedure to set the clamp jewels is to put the cursor in the live video
window with high magnification. Select button B2 to move the mouse.
WARNING:
Electrical Shock Hazard! Do not touch the wire clamp with hands or uninsulated tools when
machine power is on.
A
B
C
Clamp Adjustment Screw
Put the insulated 0.9 mm Hex Wrench
Movable Arm
D
E
Wire Clamp Gap
Fixed Arm
Figure 5-3: Wire Clamp Gap
(4)
Put the insulated hex wrench into the wrench guide to find the clamp adjustment screw.
(5)
Adjust the clamp adjustment screw to get the correct gap value. The table below shows the
correlation between major reticle divisions and gap in mils. The gaps measured in the table are
gaps at the wire position.
Divisions
Gap (mils)
(6)
98890-10EA-001-00
Revision B
2.0
2.5
3.0
3.5
4.0
2.5
3.1
3.7
4.3
4.9
Do steps (3) to (4) again until you get the necessary gap. Check wire clamp lateral position.
Preventive Maintenance and Replacements
Check Wire Clamp Gap
Operator’s Guide
Page 5-7
IConn PLUS ELA High Performance Ball Bonder
5.1.6
Clean Wire Feed Tensioner
Clean tensioner tubes to remove dirt and wire lubricants that may block wire path or damage wire.
•
Frequency: Clean for each wire spool change or after 1000 feet (300 meters) of wire usage
Tools, Materials, and Equipment
Part Number
Supplier
Hex wrench set
None
Local Purchase
Ultrasonic cleaner
None
Local Purchase
Tweezers
None
Local Purchase
Grain alcohol
None
Local Purchase
A
B
C
D
E
F
Benching Surface
M2 Screw
X Preset Adjustment Screw
Y Preset Adjustment Screw
Funnel
Funnel Pre-load
G
H
I
J
K
L
Tensioner Body
Quick Disconnect
Tensioner Support
Single-scribed Line
Middle Tube
Double-scribed Line
Figure 5-4: Wire Tensioner
(1)
Push the AIR GUIDE and TENSIONER KEY on the MMI keypad. Make sure that the LED indicators
are off (dark).
(2)
Remove the wire:
(a)
Operator’s Guide
Page 5-8
Enter Manual mode.
Preventive Maintenance and Replacements
Clean Wire Feed Tensioner
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(3)
(4)
(5)
(6)
(7)
98890-10EA-001-00
Revision B
(b)
Press F8 or select F8 on display to open wire clamp (F8 on display reads “Close”).
(c)
Remove wire from the tensioner.
(d)
Press MOTOR STOP to put the machine in Standby mode.
Remove the tubes from the tensioner.
(a)
Release the quick disconnect fitting from the optics.
(b)
Found on the front of the tensioner body. Loosen and remove the two M2 x 10 mm screws
and washers from the tensioner assembly to the optics. Remove the tensioner assembly.
Do not remove the X and Y preset adjustment screws.
(c)
Release the preload screw and remove the funnel at the top of the tensioner.
(d)
Remove the four tubes from the tensioner.
Clean the wire tensioner tubes.
(a)
Fill an ultrasonic cleaner tank with grain alcohol.
(b)
Put the four tubes and the funnel in the ultrasonic cleaner tank. Clean the parts
ultrasonically until dirt and contamination are removed.
(c)
Remove the tubes from the ultrasonic cleaner tank. Use clean, low pressure air to dry
tubes.
Use a pair of tweezers and put the tubes into the tensioner bore shown in Detail A.
(a)
Find and align the double-scribed line tubes and insert them into the tensioner bore. Make
sure the lower tube seats in the collar at the bottom of the tensioner bore.
(b)
Put the middle tube into the tensioner bore.
(c)
Put the single-scribed line tube into the tensioner bore.
(d)
Install the funnel onto the external thread at the top of the tensioner. Make sure that the
hole in the funnel fits onto the smaller diameter end of the upper tube.
(e)
Tighten the funnel preload screw.
Install the tensioner into the optics.
(a)
Align and touch the tensioner body to the X and Y preset blocks on the optics. Make sure
that the two benching surfaces are engaged to the X and Y preset blocks.
(b)
Tighten with the two screws and washers. It is not necessary to align the tensioner to the
setting from before.
(c)
Connect the tensioner air pressure tube to the quick disconnect fitting removed before.
Select OK in the Standby mode dialog box to start machine initialization. When completed, install
bonding wire.
Preventive Maintenance and Replacements
Clean Wire Feed Tensioner
Operator’s Guide
Page 5-9
IConn PLUS ELA High Performance Ball Bonder
5.1.7
Clean Microscope Lens
To prevent dirt collect on microscope eyepiece lenses.
•
Frequency: As necessary
Tools, Materials, and Equipment
Part Number
Soft Lens Tissue
None
Local Purchase
Clean cotton swab
None
Local Purchase
Mild detergent
None
Local Purchase
(1)
Clean dust from eyepiece lenses with the soft lens tissue.
(2)
If dust on lenses is gritty or greasy:
Operator’s Guide
Page 5-10
Supplier
(a)
Clean each lens with mild detergent and warm water.
(b)
Dry each lens with a cotton swab.
Preventive Maintenance and Replacements
Clean Microscope Lens
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
5.2
Replacement Procedures
WARNING:
Injury Hazard. Incorrect maintenance could cause injury. Do not do maintenance unless you have
completed the approved maintenance training course. Read the data in this chapter.
This section includes the replacement procedures when you do the maintenance on the machine. The
function of this section is to give the user the instructions necessary to replace the components safely.
Select below for the maintenance replacement procedures:
Procedures
98890-10EA-001-00
Revision B
Frequency
References
Replace Capillary
When necessary
5.2.1 Replace Capillary
Replace Wire Spool
When necessary
5.2.2 Replace Wire Spool
Preventive Maintenance and Replacements
Replacement Procedures
Operator’s Guide
Page 5-11
IConn PLUS ELA High Performance Ball Bonder
5.2.1
Replace Capillary
The bond tool (capillary) must be replaced at scheduled intervals to make sure that the bonds are of
quality. The causes that make the capillary to wear and/or become damaged are as below:
•
The number of bonds done
•
Bond force
•
The quantity of ultrasonic power used
•
The bonding surface
•
Wire make up
•
Capillary incorrectly operated
CAUTION:
The K&S Micro-Swiss Sigma capillary gives a more sensitive bonding process. It is good for fine
pitch applications and sensitive die packages. Obey the guidelines below to get the best performance
with the Micro-Swiss Sigma capillaries.
CAUTION:
Do not touch the capillary with tweezers or try to remove it from the transducer while the USG is ON.
(Function F7)
CAUTION:
When you clean the Micro-Swiss Sigma capillary, on the USG. (Function F7) Make sure that the
‘USG Clean Volts’ parameter is not more than 2000 mVolts (refer to “Tool Usage Configuration”
section of the Reference Guide)
CAUTION:
Use K&S standard USG calibration.
Select below for the capillary replacement operation:
5.2.1.1 Bond Tool (Capillary) Usage
5.2.1.2 Capillary Replacement Procedure
5.2.1.1
Bond Tool (Capillary) Usage
The IConn PLUS ELA High Performance Ball Bonder have software that is used to monitor the use of
the bond tool. During Auto bonding, the software monitors threshold limits set up in TOOL USAGE
configuration. If one of the threshold limits is reached, a warning appears to tell the user. It is necessary
for the user to replace the bond tool and update the TOOL USAGE software with the steps below:
Operator’s Guide
Page 5-12
Preventive Maintenance and Replacements
Replace Capillary
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(1)
Select CONFIGURE at the mode bar, then select 3 TOOL USAGE. The Tool Usage dialog appears.
Figure 5-5: Tool Usage Dialog
(2)
Make sure that the tool usage limit values for 1 BOND LIMIT and 2 HOUR LIMIT are set to correct
values. If necessary, enter the new data directly into the data text boxes to update.
(3)
Select 3 CHANGE TOOL. This resets the Usage Statistics fields in the dialog.
Note: If 1 Bond Limit, 2 Hour Limit and 3 Changed Tool are OFF (grayed), reset ‘Usage Statistics’
fields. Select 6 Tool Usage Privileged Functions. This feature is password-protected. You can
find more instructions in “Tool Usage Configuration” section of the Reference Guide.
5.2.1.2
(4)
Set 4 STOP AT EVERY DEVICE to show ON or OFF. When set to ON and the TOOL USAGE threshold is
reached, bonding stops after each device is bonded.
(5)
If necessary, set 5 USG CLEAN VOLTS to the correct mvolts value (see Caution above).
(6)
Select the DONE button. The Configure menu appears. Select ESC to close the menu.
Capillary Replacement Procedure
Note: A capillary change software tool is available through two of the GUI menus (Manual menu
and bond head Calibration menu). Select the tool to start the software function that shows the
operator through the capillary change procedure. To change a capillary without the software
tool, do the procedures below.
Tools, Materials, and Equipment
Torque Wrench, 25 oz-in (0.18 Nm)
.050” Hex Driver Bit
Part Number
Supplier
None
Local Purchase
27790-4020-104
Kulicke & Soffa
Tweezers
None
Local Purchase
Capillary
-
-
CAUTION:
If a Micro-Swiss Sigma capillary is used, do not touch the capillary with tweezers. Do not remove the
capillary from the transducer while the USG (FUNCTION [F7]) is active.
98890-10EA-001-00
Revision B
Preventive Maintenance and Replacements
Replace Capillary
Operator’s Guide
Page 5-13
IConn PLUS ELA High Performance Ball Bonder
(1)
Select the PARK INDEXER GUI button to park the MHS workholder components. Use the mouse
to move the bond head to a location where the capillary can be easily removed.
(2)
Examine the AIR GUIDE and TENSIONER indicators on the MMI keypad. If one of the indicator is
on, push the button switch to stop the application.
(3)
Remove wire from the capillary.
CAUTION:
Do not touch the EFO wand assembly when you attach or remove the capillary.
CAUTION:
Make sure that the capillary is straight when you loosen or tighten the capillary screw hex head with
the torque bit. This is to prevent wear around the hex head.
(4)
Loosen the capillary clamp screw to release the capillary (see figure below). Use tweezers to
remove the capillary from the transducer.
A
B
Alignment Surface
Capillary
C
D
Clamp Screw (08890-0085-003-XX)
K&S Driver Bit (22790-4020-104)
Figure 5-6: Capillary
Note: Examine clamp screw for each 10th capillary change; Replace clamp screw for each 50th
capillary change.
(5)
Use tweezers to remove the new capillary from its storage vial. Put the capillary into the capillary
clamp in the transducer. Move the capillary up until it aligns with the top of the capillary clamp.
CAUTION:
Make sure that the capillary is straight when you loosen or tighten the capillary screw hex head with
the torque bit. This is to prevent wear around the hex head.
(6)
Use the torque wrench with .050” hex driver bit (P/n: 27790-4020-104) to tighten the capillary
clamp screw to 25 oz-in (0.18 Nm).
(7)
Do the Ultrasonic Generator (USG) calibration. Refer to Calibration chapter.
(8)
Teach the crosshair offset. Refer to the Calibration chapter.
(9)
Do the EFO Wand Height calibration. Refer to the Calibration chapter.
(10) Select the BND HT RELRN (bond height relearn) on the GUI toolbar button. The bonder will lower
the capillary to find contact height with the die at the bond site.
(11) Thread bonding wire through the capillary bore. Use the F8 button to open the wire clamps. If
necessary, select the USG button (or push its related function key) to on the USG. This will help
the wire to enter the capillary bore.
Operator’s Guide
Page 5-14
Preventive Maintenance and Replacements
Replace Capillary
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(12) Use the mouse to select a device lead and press B1 (mouse button 1) to bond off the unwanted
wire. On the tensioner after this is done.
(13) Make sure that there is a ball on the bonding wire below the capillary. If not, use the EFO button
on the GUI toolbar to fire the EFO. This will make a ball on the wire.
(14) If the tool usage limit function is used, reset the tool usage counter.
98890-10EA-001-00
Revision B
Preventive Maintenance and Replacements
Replace Capillary
Operator’s Guide
Page 5-15
IConn PLUS ELA High Performance Ball Bonder
5.2.2
Replace Wire Spool
This section contains steps to make sure that the wire spool is correctly installed on a conductive wire
spool mount. The steps also make sure the bonding wire is threaded correctly and wire feed devices are
in correct work condition. The primary benefit of the conductive wire spool mount is that it gives EFO
free-air-ball (FAB) consistency.
The conductive wire spool mount has gives a different circuit wire path for the Bond Integrity Test
System (BITS) signal to go back to. The other wire paths for the signal are through the wire clamps and
the wire feed diverter. This improvement was made to make BITS detection of non-stick bonds and
short tails (NSOP and SHTL errors) more accurate.
The Conductive Spool Mount Assembly has two features that give a wire path for the BITS return
signal. The spool clips and a spring-loaded electrical contact. The three (3) spool clips touch the inner
diameter of the spool at different points on standard dimension spools.
The bonding wire is also connected to the BITS circuit by a electrical connection to the wire on the
spool. The trailing end of the bonding wire is not connected to the spool flange. It is attached below a
spring plunger electrical contact installed behind the spool. This contact is connected to the BITS return
signal circuit.
Once the wire is loaded through the bond tool, the user can do a bond off to make a gold ball. This
feature is used when the wire is loaded or threaded. The user manually selects a bond off position. The
bonder will do a second bond at that location with the use of the MANUAL mode Bond 2 parameters (no
program loaded). If a process program is loaded, it uses the Bond 2 parameters saved with that
program.
The F8 function button is set to manually open and close the wire clamp. The instructions on the button
shows the step to do and not the status of the clamp. When the wire clamp is shut the button reads
‘Clamp Open’. When the wire clamp is open, the button reads ‘Clamp Shut’ and turns red. During this
period of time, a Bond Off can be done.
Note: K&S recommends users to install the wire spool with wire pay-out in the clockwise direction.
This is to decrease the risk of accidental de-spooling and tangling of wires.
Note: Adjust the wire feed optical sensor if wire with a different diameter is used. Refer to the
Maintenance Manual for procedure.
Note: Do not touch the wire with your fingers; always use tweezers. Make sure that the diverter and
internal surfaces of the air guide are free of contamination before continue. Refer to the wire
system cleaning procedures in the Maintenance Manual.
5.2.2.1
Replace Wire Spool Procedure
Replace empty bonding wire spool on wire feed assembly with a full spool of wire.
Tools, Materials, and Equipment
Part Number
Supplier
Tweezers
None
Local Purchase
Bonding Wire Spool
None
Local Purchase
Note: The wire spool turns in the clockwise direction. Connect tail end of the spool to the spring
plunger at the back or the front tail post in the front. (See figure below)
(1)
Push the AIR GUIDE and TENSIONER KEYS on the MMI. Make sure that the LED indicators are off.
(2)
Remove the bonding wire from the capillary and tensioner.
(3)
Do a check on the tail end of the wire on the spool. If it is connected, push the spring plunger on
the tail end of the wire and remove the wire.
(4)
Remove the spool from the spool holder.
Operator’s Guide
Page 5-16
Preventive Maintenance and Replacements
Replace Wire Spool
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
(5)
Attach a new spool on the spool holder. Make sure that:
(a)
The spool unwind in the clockwise direction.
Note: Make sure that the wire tail (spring plunger contact or front tail post) do not touch the cover
of upper console, motor screws, and conductive surface of spool cover. This will cause
interference with the Bond Integrity Test System (BITS) signal. Keep a minimum tail beyond
the spring plunger contact or front tail post shown in the figure below.
A
B
C
D
E
Wire Spool Mount
Front Tail Post
Push Spring Plunger Contact
Spool Tail End around Shaft
Wire Spool
F
G
H
I
J
Front Tail Post (Spring Loaded)
Wire Spool Mount
Spring Plunger Contact
Minimum Wire Length End
Push Spring Loaded flange
Figure 5-7: Spring Plunger Contact and Front Tail Post
(6)
With the spool unwinds in clockwise direction, remove the end of wire taped to the rear flange of
the spool. Push in the spring load plunger front tail post of the contact and put the wire end below
the contact point. Release the spring plunger or front tail post. Make sure the wire end points to
the spool and does not touch any exposed metal surfaces on the machine during spool rotation
(see previous figure and previous note).
Note: If non-conductive wire is used, the wire end MUST be terminated to the ground post.
WARNING:
Caution! Electrical shock hazard! Do not touch the wire clamp with hands or uninsulated tools.
(7)
98890-10EA-001-00
Revision B
Examine the glass feed tube attached on the wire clamps. Clean it if necessary.
Preventive Maintenance and Replacements
Replace Wire Spool
Operator’s Guide
Page 5-17
IConn PLUS ELA High Performance Ball Bonder
(8)
Thread wire through the wire feed as shown in the figure below. Press the FEED push button on
the upper console to pay-out wire from the spool. Press [F8] on the control panel to open or close
the clamps when necessary.
A
B
C
D
E
F
Spool Holder
Air Guide Amplifier
Diverter
Air Guide
Wire Detector Sensor
Wire Tensioner
G
H
I
J
K
L
Power Switch
Emergency Off Switch
Tensioner Regulator
Air Guide Regulator
Diffuser Regulator
Thread Assist Button
Figure 5-8: Wire Spool Replacement
(9)
Push the TENSIONER KEY on the MMI. Make sure that the LED indicators are on. Make sure that
the AIR GUIDE is off.
(10) Use the mouse to select a device outer lead. Press B1 (mouse button 1) to do a bond off.
(11) Make sure that there is a ball on the bonding wire below the capillary. If not, use the EFO button
on GUI toolbar to fire the EFO and make a ball on the wire.
(12) Examine for wire vibration between air guide and tensioner. If there is vibration, adjust air guide
pressure to remove vibration.
(13) If the “Wire Usage” software is used, select 4 CHANGE WIRE SPOOL command to reset the wire
usage statistics. The WIRE REMAINING item in the dialog box will be updated with the value
previously entered for the WIRE SPOOL LENGTH.
Operator’s Guide
Page 5-18
Preventive Maintenance and Replacements
Replace Wire Spool
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
Appendix A: Glossary of Terms and Abbreviations
98890-10EA-001-00
Revision B
Glossary of Terms & Abbreviations
Operator’s Guide
Page A-1
IConn PLUS ELA High Performance Ball Bonder
-ADefinition
Description
ALIAS
The Area or feature on a die or leadframe which the PRS incorrectly identified for a correct
eyepoint.
ALIGNMENT
Material alignment is the movement to put the material at the bond site. Operate the Pattern
Recognition System or manually do the alignment. This is related to the parameters and settings
in the process program.
ALIGNMENT TOLERANCE
Maximum permitted difference from the set distance between the two operator points of a
reference system. Applicable only for 2-point reference systems. Recommended tolerance must
be 10% of the smallest bond pad dimension. For outer leads, it must be related to the lead with
tolerance and give a larger tolerance for larger increase in the lead dimension.
ALTERNATE EYEPOINT
An eyepoint for each second reference. For example: if there are two manufacturers of a die
where the two die are not the same, the program will look for an alternate eyepoint. See also
“Backup Eyepoint”.
AXIS POSITION
INDICATORS
X, Y and Z values at the top right corner of the monitor screen. X and Y values of the crosshair
are related to the X-Y zero from before. Z refers to the bond head height, again with reference to
the zero location from before.
-BDefinition
Description
BACKUP EYEPOINT
A different eyepoint on the same die in a different location. The vision system have a second try
to find an eyepoint for alignment purposes.
BITS
Bond Integrity Test System. Used to detect the non-stick bonds at the die (NSOP), non-stick
bonds at the leadframe, or short tails (SHTL) during auto bonding.
BIMODAL
There are only two primary light intensity levels.
BOND FORCE
The force applied to get a good bond (to apply an electrical connection). It is the touch force, in g,
applied on the wire when the wire bond.
BOND HEIGHT
The height at which the bond tool touches the work surface.
BOND OFF
A process to make a gold ball, once the wire is loaded through the capillary (with a fraction of an
inch extended beyond the capillary). Used to repair a broken wire or replace a wire spool.
BOND POWER
The ultrasonic energy give out by the USG during bond time.
BOND PROGRAM
See Process Program.
BOND TIME
The length of time that the USG is on for each bond is related to the intensity of the bond. If the
bond time is too low or too high, the bonds will be weak. Examine the operation of shear tests
show the best setting.
BONDING
A process of a wire ball attach to semiconductors device with heat, pressure, and ultrasonic
energy. It connects the wire ball to a die pad. Alignment data and the control of all the
subsystems are use for calculation of correct bond locations.
BOOT/BOOTING
The initial step of the machine after reset or power up. To load the software of the machine and
prepare it for operation again.
BUTTON
A button can be square, rectangular, or triangular in shape. When selected, it starts a process,
activates a dialog, steps through a list of selections, adds/decreases a value, or opens an edit
area.
-CDefinition
Description
C/V
see Constant Velocity Value.
CALIBRATION MODE
A mode of the machine that lets the user calibrate parameters of the machine to make sure that
the measurements are valid. For example: to set the distance between the tool and the optics
(crosshair offset), find limits, set the pixels to pulse ratio in the PRS.
CAMERA IMAGE
The window that shows the image from the camera on the screen of the machine.
CAMERA LINEARITY
The camera turn to align the video camera CCD image element with the axis movement.
Operator’s Guide
Page A-2
Glossary of Terms & Abbreviations
98890-10EA-001-00
Revision B
IConn PLUS ELA High Performance Ball Bonder
Definition
Description
CHESS
To move the bond head work table (in the X and Y directions) with manual control of the mouse
and mouse button B2. When you hold the arrow button down, it moves the bond head work table
continuously and the image moves at a continuous rate. Chess only applies to the graphics and
video image window.
When you hold the arrow button down, it moves the bond head work table continuously and the
image moves at a continuous rate.There are three chess selections available to the user:
Jumping - Set the cursor at the selected location and push button B2.
Dragging - Push and hold mouse button B2 then drag the image.
Inching - Use the cursor controls on the keyboard to move one pixel at a time (related to the
zoom factor).
COMPONENT FILES
The other files used with the Process Program File to make a process program. The process
program file has the .BND extension and can have a file name of maximum 80 characters. A
component file has a .REF, .PRM, OPR, .CHG, .WIR, .PDL, or .EYE extension and can have a
file name of maximum 40 characters.
CONFIGURE MODE
A mode of the machine that lets the user configure the machine to the requirements of the
factory.
CONSTANT VELOCITY
VALUE (C/V)
The speed of the capillary from after TIP to the work surface and, thus, the constant velocity of
the capillary against the work. If it is set too high, machine will make flat bonds. If it is set too low,
the bond time can be high and unacceptable. Units are in ms or mmps.
CROSSHAIR
Horizontal and vertical cross image on the screen which are used with the X, Y, and Z directional
buttons to find eyepoints, user points for the process program. The large yellow crosshair
appears initially in the center of the graphics and the video image windows. The two windows
and their crosshair are different.
The crosshair on the video image window is always in the center. When the user selects a new
position, the video image moves to the new position and the crosshair is automatically put in the
center. Thus it is possible to move across the bond site. The graphics image crosshair can move
in the graphics window and the zoom factor have an effect on it. The graphics window can
include the full work area or only a small area. Change in one window will cause an applicable
change in the other window.
CROSSHAIR OFFSET
A taught distance which adjusts for the fact that the objective lens and the capillary are not in line
above a device. This adjustment is necessary when the crosshair is used to show the location of
the bond tool above the device.
CURSOR
The "+" on the screen used to point to and click on menus, menu items, and buttons and to hold
and adjust the slide bars.
-DDefinition
Description
DE-SELECT
To close (turn off) a menu, menu item, function, or condition with the cursor position at the
selected item and to push the B1 (left) mouse button. If a condition is de-selected, the highlight is
off to show that the condition is no more ON.
DEFAULT BUTTON
A square button with a “D” in the center of it. Select this button sets a parameter value to its set
default value.
DIALOG
A window that appears temporarily to ask for data or to let the user adjust or select the settings/
parameters.
DOUBLE-SELECT
To quickly push and release the mouse button B1 two times without movement of the cursor.
DRAG
To move an item on the screen. Put the cursor above the item and then push and hold the mouse
button B1 and move the mouse to move the cursor.
DRY CYCLE
Operate the MHS workholder with or without material in the workholder, without bond wire.
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-EDefinition
Description
EFO
see Electronic Flame-Off.
EFO GAP
The vertical distance between the EFO electrode and the tip of the wire on the capillary when the
bond head is at its reset position.
EFO OPEN
Refers to an error when the wire tail is too short or no wire is at the tip or the EFO gap is too wide.
EFO TIME
The time that the EFO is set to on.
EJECT
This refers to the step of material movement from one mechanical subsystem to a different one.
For example: eject a leadframe refers to the leadframe movement from the output side of the
workholder to the output magazine in the output elevator. To eject a magazine means to move it
from the elevator to the output platform.
Eject Position
See Unload Position
ELECTRONIC FLAME-OFF
The hardware that makes electric spark to melt the wire tip to a shape of a ball below the
capillary.
ENTER
Use the MMI keypad or the keyboard to enter and edit data.
EYEPOINT
A feature of the material that the machine and we can identify. The number of eyepoints and their
location can be specified in process program. The PRS identified this reference point during the
teach sequence. For each reference system, the number of eyepoints must equal the number of
operator points. Die eyepoints make use of the small feature usually found on die reference
systems. Lead eyepoint looks for long straight edges such as those usually found in an outer
lead reference system.
EXCEPTION
Error or unusual condition occurs
-FDefinition
Description
FACTORY AUTOMATION
SERVER/SYSTEM
A computer which can monitor the ball bonder with the SEMI SECS procedure.
FAS
Factory Automation Server/System.
FORCE
see Bond Force.
FUNCTION BUTTONS
Two rows each with 10 buttons at the bottom of the screen. Use these buttons to start or stop a
procedure. The function related with a button can change for different operations.
FUNCTION KEYS
The row of 10 buttons at the top of the keypad found on the MMI. These buttons do the same
functions as the bottom row of Function buttons. The function related with a button can change
for different operations.
-GDefinition
Description
An abbreviation for the term Graphical User Interface.
GUI
-HDefinition
Description
HOST
A far computer that can collect or input process data from/to the machine, select process
programs for the equipment, and control the machine.
HOST INTERFACE
A procedure to interchange data between a host computer and the machine. The host computer
can also control the machine with this interface.
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Definition
HOT KEY
Description
The numeric character related with an item in a menu or dialog. When you see menus or dialogs,
push the hot key of the item to select the item. When you select the item, a text box can open, an
operation can start or a different menu or dialog can appear.
-IDefinition
Description
IC
A device with two reference systems: the outer leads or substrate and the die.
ICON
A symbol that show a window or step/s.
INDEX
Index moves new material into bond position. Index can occur after a part of a unit or a full unit is
completed. The index can put a fully new unit to the bond location or a new part of the same unit.
INJECT
This term usually means to move a leadframe from the input magazine into the workholder.
-JDefinition
Description
J WIRE
A Kulicke & Soffa procedure to put bent wires. This procedure puts a J-shape into the bond wire
with the use of the lateral movement parameter.
JOG
A term to show the vertical index of the gripper assembly of the Mag Handler.
-KDefinition
Description
KEYBOARD
A QWERTY keyboard (keypad) found on the MMI (see MMI).
KINK HEIGHT
The vertical distance between the first bond and the position above the first bond where the XY
table starts the Reverse Motion.
-LDefinition
Description
L/F
Leadframe
LEADFRAME
The Carrier for IC devices with metal leads to which the wires from IC bond pads are attached
LIGHT TOWER
A signal post to show the condition of the machine (Motors stopped, in automatic operation,
error, etc.).
LINEARITY
Camera turn. See Camera Linearity.
LOT
A group of materials with data to monitor production.
LOT ID
A name or number related with a lot for identification purposes.
LOT TRACKING
A procedure to monitor the process and collect data for future reference.
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Definition
Description
LOW LOOPING
A Kulicke & Soffa process to make very low wire loops.
LOWER CONSOLE
The primary card rack of the machine, electronics (cards), power supplies, amps for the servos
and steppers, the memory devices, the chassis, and the cooling fans.
LTOL
An abbreviation for the term “line tolerance”. Line tolerance make sure that the position of
operator points and eyepoints are valid.
-MDefinition
Description
M/C
Machine.
MACHINE DEPENDENT
PARAMETER
A bonder or machine specified parameter.
MAN MACHINE INTERFACE
(MMI)
The tools through which the machine user operates the control system. User controls through the
mouse, buttons, function keys, and keypad on the lower console.
MANUAL
It can refer to the Manual Mode of the operation or that user operation is necessary to complete
a process.
MANUAL MODE
A machine mode that lets the user bond wires manually. That is, set the location of bond sites
and put one wire.
MATERIAL HANDLING
SYSTEM
The Material Handling System includes the electronics, mechanical system, and control software
that are used to move material through the machine. The Material Handling System contains the
input magazine handler, workholder, output magazine handler and the related electronics.
MATRIX
An area of wafer, devices or device groups that are put in columns and rows.
MBD
Missing Ball Detector.
MDP
see Machine Dependent Parameter
MENU
A list of available commands in a window. Menu titles can appear at the top bar of the window.
The illustration shows the Manual menu.
MHS
see Material Handling System.
MMI
see Man Machine Interface.
MODE
A group of related tasks or functions usually selected when you select the “mode” of operation in
a dialog or menu (e.g., “Add” mode when you teach the user points). This term could also refer to
an operation condition of the machine such as Auto Mode, Manual Mode, Program Mode and
more.
MODE BAR
The horizontal bar that contains the names of the primary sections or modes of the program. The
mode bar is at the top of the display screen. The illustration above shows the left modes in the
mode bar. Manual Mode is the ON mode
MOTORIZED WIRE SPOOL
When a sensor activates, the spool turns to feed out the wire. If the sensor is off, the spool stops
because the wire is loose.
MOUSE
Input device with three buttons and a ball used to set a screen cursor and make selections or
adjustments (see illustration).
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Definition
MOUSE BUTTONS
Description
The three mouse buttons are found on the mouse and are referred to as B1, B2, and B3 on the
screen. The function of each button changes and this is related to the operations done on the
screen. Refer to the screen for the current button functions. Some of the possible functions for
the three buttons are shown below.
B1 = Left Button: Select, Add/Learn, Cancel Select, Next, Step
B2 = Center Button: Chess
B3 = Right Button: Delete, Cancel Select, Auto Learn, Relearn, Gives a Function, Remove
Relation, Opposite Function
MTBA
Mean Time Between Assists. Average length of time between errors that the bonder detect.
MTBF
Mean Time Between Failures. Average length of time between errors where manual repair by a
user is necessary.
MTTA
Mean Time To Assist. Average quantity of time to correct a bonder program.
MTTR
Mean Time To Repair. Average quantity of time for a user to complete the repair.
MWS
see Motorized Wire Spool
MULTI-CHIP
A device with more than 2 reference systems: one for outer leads or substrate and one for each
die on the device.
-NDefinition
Description
NSOL
Non Stick on Lead. BITS error to tell you the wedge is lifted from the second bond.
NSOP
Non Stick on Pad. BITS error to tell you the ball is lifted from the first bond.
-ODefinition
Description
ON-LINE HELP
A window with text to give information about a selected object for the machine user. Note: once
On-line Help is started other topics are available for inspection.
ON-LINE PROCEDURE
A window with data for the machine user that gives step by step instructions for some procedure
to be done on the machine. For example: To put through the wire.
OPEN
To show the contents of a file in a window or to expand an icon to a window.
OPERATOR POINT
A location on the die or outer lead that a machine user can identify to make sure that the device
is aligned correctly. The user must teach the reference point before wire bonding. Used if the
PRS fails. A good location is on the bond pad.
OPTICS OFFSET
The distance between the center of the optics and the bond tool.
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-PDefinition
Description
PAD FIND
This function uses the PRS to automatically adjust the first bond to the center on bond pads.
PATTERN RECOGNITION
SYSTEM (PRS)
A part of the vision system. This term usually refers to the electronics and software that monitor
graphics at the work site for alignment purposes. The PRS lets the bonder operate automatically
to find the eyepoints before each device is bonded. Correct the differences in die location from
package to package.
PERFORMANCE LOG
The data that the machine can collect automatically and includes such data as MTBA, MTTA,
MTBF, MTTR, and Utilization time.
PFR
see Power Failure Recovery.
PIXEL
The smallest graphical unit that can show up on the screen, usually one point.
Planarity
The parallel relation between a flat surface and a reference plane.
POINT
To move the cursor to a specified area on the screen.
POWER FAILURE
RECOVERY
This feature continue automatic operation after power failure.
PREHEAT
To increase the temperature of the device before it reaches the bond position.
PROCESS PROGRAM (PP)
Made up of modules of ASCII text that can be read, modified, saved, and restored. These
modules contain the instructions and parameters for the machine to bond materials.
PROCESS PROGRAM FILE
Primary file of a process program. Component Files are the other files used with this file to make
a process program. The process program file has the .BND extension and may have a file name
of maximum 80 characters.
PROCESS STATISTICS
Refers to data automatically collected while the machine bonds. Included in this set of statistics
are: the number of devices bonded and the number of bonds since capillary was replaced.
PROGRAM MODE
A mode that lets the user load, edit or teach a process program.
PROMPT
A dialog by the machine. Steps by the user is necessary to continue. Prompts are usually found
in dialogs or in the status bar of the monitor, below the Mode bar.
PRS
see Pattern Recognition System.
PRS CALIBRATION
A procedure to make sure the vision systems pixels and the machines movement pulses are at
right angles.
-Q-RDefinition
Description
RADIO BUTTON
A diamond shape button. Radio buttons are in sets of two or more. Only one radio button for
each set can be ON at a time. As shown in the example, “Normal Index” is selected.
REFERENCE SYSTEMS
A reference system is a group of bond sites, usually all the bond sites of an object in the work
area, always of the same height. Examples of reference systems are:
•
all the bond sites on a die
•
all the bond sites on the outer lead (lead shelf)
The goal of the reference system is to mix and align the die and outer lead without reteach. A
complete process program includes the definition of all of the reference systems (in the work
area) and data related to the wiring of the device.
REFERENCE SYSTEM
ORIGIN
The origin (0,0) of an instance of a reference system.
REVERSE BONDING
Refers to the opposite sequence of bonding. During ball bonding, the first (ball) bond is on the
die and the second (wedge) bond is on the lead. In reverse bonding the first bond is on the lead
and the second bond is on the die pad.
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Definition
REVERSE MOTION
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Description
Refers to the XY table movement in the opposite direction (away from the second bond). This is
after the bond head has reach a set height (kink height) while above the first bond to get a unique
wire shape.
Glossary of Terms & Abbreviations
Operator’s Guide
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IConn PLUS ELA High Performance Ball Bonder
-SDefinition
Description
S ING
This term refers to bent wires. When you see from the top, these wires have a “S” shape.
SCAN CORRIDOR
The area and direction that the VLL examine for the metal leads.
SCREEN
The show area of the monitor.
SCROLL BAR
A horizontal or vertical bar in a dialog. A center button which can be moved to show more text or
selections.
SEQUENCE STOP MODE
To select or on a menu, menu item, function, with the cursor on the top of the item and push of
mouse button B1. If a condition is selected, the selection is highlighted to show that it is ON.
Items in dialogs and menus may also be selected. You can select the “Hot Key” of a item if a
number is to the left of the item.
SELECT
A mode the machine enters when the user presses the sequence Stop Button while the machine
is in automatic mode. Its function is to stop the procedure at the subsequent safe condition in the
process temporary. For example: at the end of a wire or at the end of an index. While in
Sequence Stop mode, the user may operate the machine as if it were in Manual Mode. It is
possible to exit automatic operation fully from this mode of the machine
SHTL
Short Tail. BITS error tells you that the wire tail is too short after the second bond.
SITE
It can be a bonding site (a die pad or lead bonding site), a die, a die and outer lead, device group,
or all the areas (within the bond head travel).
SKIP
An index that moves the materials which have not been work on away from the work site.
SLIDE BAR
A horizontal or vertical bar with a center button used to make adjustments to a setting such as
illumination or focus.
SOIC
Small Outline IC.
SPC
see Statistical Process Control.
STANDBY MODE
This mode is entered with a push of the Motor Stop control button on the MMI. In standby mode,
electrical power to the electrical motors and solenoids is off.
STATISTICAL PROCESS
CONTROL
A feature that collects and examine data to increase production yield. Then, tune the process to
increase or keep the production quality.
STEP AND REPEAT
A machine feature that work on a number of the same devices (device groups) without an index.
For example, there are same dies in the same work site. You can teach the process once and
then teach the locations of other dies.
Substrate
A type of reference system that contains other reference systems. The alignment of these
reference system is related to the alignment of the substrate reference system. For example,
when you teach a wafer process program, substrate reference systems are taught that each
contain many die reference systems. The machine align a substrate reference system during
wafer bonding. It use the reference system to bond all the die in the substrate. This saves the
time to align each of the many die reference systems.<P> Substrates do not contain bond related
items: bond pads, bond locations and more.
SWAP
To move the images in the windows of the screen. The images interchange positions (swap). The
image in the large window moves to the small window and the image in the small window moves
to the large window. Press the F1 function key to swap.
-TDefinition
Description
TAB
A button used to move from one edit area or selection to the next.
TABLE MAPPING
A procedure to correct precision errors in the XY table movement position.
TABLE ORIGIN
The (0,0) of the table. Reference System Origins are found in (mapped on top of) this reference
system.
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IConn PLUS ELA High Performance Ball Bonder
Definition
Description
TAIL LENGTH
Tail length is the length of the wire “tail” left below the capillary after the second bond is made.
This parameter changes the dimension of the ball that the EFO can make.
TIP
see Tool Inflection Point.
TIP HEIGHT
The height above the work surface to start examine or constant velocity.
TOL CORRECTION
Top of Loop correction monitors wire release and adjust wire path during part of the cycle. This
helps to control the loop height in some application
TOOL INFLECTION POINT
The distance above the bond surface at which the speed of the capillary changes from
controlled decrease to constant velocity. TIPs are learned for all wires. Remove the set TIP offset
value from the learned bonding height gives the TIP offset.
TRANSDUCER
A device that changes electrical into vibration power to bond the wire.
-UDefinition
Description
ULTRASONICS
GENERATOR
The mechanical processes and electronics that cause vibration in the transducer as part of the
bonding process.
Unload Position
The location of the wafer chuck assembly where the user (or an automated wafer handler) can
remove a bonded wafer from the wafer chuck. Can also refer this as Eject Position. The user can
teach this position in Calibration mode.
UPPER CONSOLE
Bonder subassemblies: monitor, man machine interface, keyboard, light tower, audio alarm, wire
feed, pneumatic controls and cable.
UPH: UNITS PER HOUR
The number of units bonded in a hour.
UPS
Uninterruptible Power Supply.
USG
see Ultrasonics Generator.
UTILITIES MODE
A mode of the machine that lets user make adjustments that are usually not related to the
process. For example: copy files, delete files and more.
-VDefinition
Description
VIDEO LEAD LOCATOR
Finds accurate taught location of bond positions on the outer leads to each device to make sure
that the position is accurate. Keeps data about position, angle, width, and illumination levels.
Tells bonder of lead distance to make sure that bond placement is correct. Get video image
directly from the monitor.
VISION SYSTEM
There are two parts to the vision system: the optics and the electronics. The vision system gives
data for the correct alignment of die bond sites and metal leads in the work site
VLL
see Video Lead Locator.
VLL ASSOCIATION
An adjacent group of metal leads that the vision system see from one position of the table.
-WDefinition
Description
W/C
Wire clamp.
W/H, WH, WHL
Workholder.
WIRE FEED
A system to feed out the wire from a wire spool and supply it to the bonding tool. A wire feed
mechanism includes mechanical process, electronics, sensors, and software.
WIRE GROUP
A group of wires in the same reference system that have the same bond parameters applied to
them.
WIRE PATH
The mechanical process include: possible pressurized air, supports and more. The bonding wire
line from the spool to the capillary.
WIRE SAG
Wire loop that faces down.
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-XDefinition
Description
X-AXIS
The side to side movement of the bond head (see XY table).
X-Y ZERO
Primary alignment point for a package. Used as point from which all other X and Y coordinates
are calculated. Recommended location is at bottom left corner of package on a lead.
XY TABLE
A positioning system to move a load (a bond head in the case of ball bonders) in XY (horizontal)
space.
-YDefinition
Description
Y-AXIS
The front to rear movement of the bond head (see XY table).
YIELD
The percentage of good bonded devices the machine processes against. the number of not
bonded devices that enter the machine.
-ZDefinition
Description
Z APEX
The wire highest point along the Z-axis between bonds of a wire.
Z-AXIS
The up and down movement of the bond head.
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Glossary of Terms & Abbreviations
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