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EAGLE60 Gold Wire
Ball Bonder
Process Training Material
Issue Date : 1 Jan 2003
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CHAPTER
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ASM
Introduction To New
Features , New
Heights In UPH and
Fine Pitch
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EAGLE60
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1.0) FINE PAD PITCH CAPABILITIES ( 4 layers Loop )
1.1) 50 µm BPP In-house BGA
! Wire length: 0.6 - 7 mm
! Loop height: 100 – 280 um (4-11 mil)
! Wire diameter: 20 um (0.8 mil)
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1.2) 45 um Ultra Fine Pitch
Wire diameter 20um ( 0.8 mil )
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1.3) 35 um Ultra Fine Pitch
Wire diameter 15um ( 0.6 mil )
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1.4) Au Wire Bonding Process Capability Roadmap Fine
Pitch Capability
Year Platform
1997
1998
AB339
1999
2000
2000
2002
AB339
AB339
EAGLE
EAGLE
EAGLE60
Bond Pad
Pitch
63
55
50
45
40
35
30
µm.
µm.
µm.
µm.
µm.
µm.
µ m.
Bond Pad
Opening
52
48
43
39
35
30
25
µm.
µm.
µm.
µm.
µm.
µm.
µ m.
8
Wire Size Ball Size
25 µm.
25/23 µm.
23/20 µm.
20 µm.
17.5 µm.
15 µm.
13 µ m.
46.5 µm.
42.5 µm.
38 µm.
34 µm.
31 µm.
26.8 µm.
22.0 µ m.
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2.0) SPECIFICATION
Wire
Bonding
Capability
Material
Handling
Capability
Conversion
Time
+ / - 3.0 µ m @ 3 sigma
Placement repeatibility
True bonding area
Wire cycle time : 2mm wire length
Leadframe : length
width
54 mm x 65 mm
65 ms (Q Loop)
Max 280 mm
15 - 75 mm @bonding area in Y is 65 mm
15 - 90 mm @ bonding area in Y is 57 mm
0.075 - 0.8 mm (2.9 - 31.5 mil)
140 - 300 mm
max 100 mm
max 180 mm
< 3 min
< 5 min
thickness
Magazine : length
width
height
Within same leadframe type
Between leadframe types
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3.0) PERFORMANCE IMPROVEMENT
"
"
"
Bonding Speed
! 65 ms/wire (Length 2mm)
Bonding Accuracy
! + 3.0 mm @ 3 sigma
Bondability
! Bond Enhancer Control
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4.0) FEATURES
" Digital
bond head
" High speed linear XY table
" Light weight wire clamp assembly
" High accuracy work holder with linear indexer
" Enhanced BQM ultrasonic energy control
" Enhanced EFO and non-stick detection control
" Ball Formation Monitoring Feature
Continue….
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Continue...
" Simple
and Quick Device Conversion
" Independent programmable temperature control for
pre-heat stage, bond site & post bond stage.
" Lead frame jam protection.
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5.0) TOTAL PROCESS CONTROL
! Ball
formation monitoring process
! Ultrasonic energy laser calibration process
! Multi-mode ultrasonic system with closed-loop control
! Real-time bond monitoring process
! Bond stick detection process
! Advanced loop control
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CHAPTER
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BONDING
SEQUENCE
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STAGE 1 : FIRE LEVEL
WIRE CLAMP
‘CLOSE’
CAPILLARY
2~3x Wire Diameter
FREE AIR
BALL(FAB)
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STAGE 2 : 1ST BOND SEARCH LEVEL
WIRE CLAMP
‘OPEN’
FAB CAPTURE
WITHIN THE
CHAMFER
DIAMETER OF
CAPILLARY
DURING
DECENDING
MOTION, FAB
PULL UPWARDS
BY AIR
TENSIONER
AFTER SEARCH HEIGHT LEVEL:
WIRE CLAMP OPEN, BOND HEAD
SWITCH TO CONSTANT SPEED
AND STANDBY POWER START
1ST BOND SEARCH HEIGHT
DIE
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STAGE 3 : 1ST BOND CONTACT LEVEL (BOND ENHANCER)
WIRE CLAMP
‘OPEN’
Mode
A
B
C
D
E
F
CAPILLARY
DIE
18
Application
45-50um BPP
51-60um BPP
61-70um BPP
71-75um BPP
76-80um BPP
81-90um BPP
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STAGE 4 : 1ST BOND PARAMETER
WIRE CLAMP
‘OPEN’
PARAMETER SEQUENCE :
• Contact Time/Power/Force
• Bond Time/Power/Force
• Release Time/Power/Force
DIE
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1ST BOND TIMING DIAGRAM
Search
Time
Bond
Time
Rel.
Time
Bond
Power
Standby
Power
Rel.
Power
Contact
Power
POWER
FORCE
Contact
Time
Impact
Force
DIE
Contact
Force
Release
Force
Bond
Force
DIE 20
DIE
Main
Intermetallic
Formation
Region
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INTERMETALLIC FORMATION
WIRE CLAMP
‘OPEN’
Intermetallic Growth
Intermetallic
Coverage
DIE
US POWER
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STAGE 5 : LOOPING MOTION
WIRE CLAMP
‘OPEN’
BOND HEAD & XY-TABLE
MOVE ACCORDING TO
SELECTED LOOPING PROFILE
BOND HEAD
MOVE UP
RH
DIE
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STAGE 6 : LOOP TOP POSITION
WIRE CLAMP ‘CLOSE’
ESTIMATED
WIRE
LENGTH
BOND HEAD
MOVE UP
DIE
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STAGE 7 : ARC MOTION
WIRE CLAMP
‘CLOSE’
DEC SAMPLE OFFSET
WIRE CLAMP
‘OPEN’ AT
SEARCH POS.
SD
SYNCHRONOUS
OFFSET
TRAJECTORY
DIE
2nd Sch. Ht.
2nd Sch .Speed
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STAGE 8 : 2ND BOND SEARCH LEVEL
WIRE CLAMP
‘OPEN’
2ND BOND SEARCH HEIGHT
DIE
LEAD
AFTER SEARCH HEIGHT LEVEL:
WIRE CLAMP OPEN, BOND HEAD SWITCH TO CONSTANT
SPEED AND STANDBY POWER START
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STAGE 9 : 2ND BOND CONTACT LEVEL (BOND ENHANCER)
Mode
A
B
C
D
E
F
WIRE CLAMP
‘OPEN’
DIE
LEAD
26
Application
45-50um BPP
51-60um BPP
61-70um BPP
71-75um BPP
76-80um BPP
81-90um BPP
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STAGE 10 : 2ND BOND PARAMETER
WIRE CLAMP
‘OPEN’
PARAMETER SEQUENCE :
• Contact Time/Power/Force
• Bond Time/Power/Force
• Release Time/Power/Force
LEAD
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2ND BOND TIMING DIAGRAM
Search
Time
Contact
Time
Base
Time
Base
Power
Standby
Power
Contact
Power
POWER
Release
Power
Release
Force 2
Contact
Force
FORCE
Release
Time
Impact
Force
Base
Force
Final Wedge
Shape
LEAD
LEAD
28
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STAGE 11 : BH AT ‘TAIL LENGTH LEVEL
WIRE CLAMP
‘CLOSE’
AFTER SEARCH HEIGHT LEVEL:
WIRE CLAMP OPEN, BOND HEAD
SWITCH TO CONSTANT SPEED
AND STANDBY POWER START
Tail length
LEAD
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STAGE 12 : TAIL BREAK
WIRE CLAMP
‘CLOSE’
TAIL AWAY FROM
LEAD UPON WIRE
CLAMP PLATE
TOUCHING GOLD
WIRE
LEAD
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STAGE 14 : FIRE LEVEL
After BH Reach
Fire Level
Position And
After EFO Delay
, A Spark Will
Be Generated To
Form A
Symmetrical
FAB
WIRE CLAMP
‘CLOSE’
FAB
E -Torch
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Sequence
Action
1
Bondhead decent from fire level to 1st search level
2
1st search height.
3
Contact Time1, Power1 and Contact Force 1
4
Bond Time 1, Power1 and Base Force 1
Release Time , Release Power , Release Force
5
Reverse Height
6
Reverse Distance
7
Loop Top
8
Search Delay
9
XYZ move from loop position to 2nd search level
10
2nd Search height.
11
Contact Time2, Power2 and Contact Force 2
12
Base Time 2, Power2 and Base Force 2
Release Time ,Release Power ,Release Force
13
Tail Length
14
Bond head rise to reset level
XY move to next wire 1st bond position
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1 2 3
4 a 5 6 7 8 9 10 11 12 b 13
BONDHEAD
XY TABLE
Base
Contact power
power
Contact
power 2
Standby
power
Base
power 2
Standby
power 2
POWER
BOND FORCE
Contact
force
Base
force
Contact
force 2
Base
force 2
Release
force
33
Release
force 2
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CHAPTER
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st
1 &
nd
2
BOND
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1.0) INTRODUCTION
First Bond is the first bonding on a device. Most first bond
bond on the die pad and the intermetallic layer between gold
ball (Au) and Aluminum(Al) pad is formed.
Second bond is the second bonding on a device. This bonding is
normally bond on lead finger (depend on application).
1st
2nd Bond
Bond
Lead 1
Die 1
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2.0) FIRST BOND
2.1) Parameter Affecting 1st Bond
a) Search Speed1, Contact Threshold1 (Bond Enhancer)
b) Standby Power1
c) Contact Time1, Contact Power1 and Contact Force1
d) Bond Time1, Bond Power1 and Bond Force1
e) Release Time1, Release Force1, Release Power1
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1ST BOND TIMING DIAGRAM
Search
Time
Contact
Time
Release
Time
Bond
Time
Release
Power
Bond
Power
Standby
Power
Contact
Power
POWER
Contact
Force
FORCE
Impact
Force
DIE
Release
Force
Bond
Force
DIE 38
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2.1.1) Search Height
! Recommended Setting
! Search height = 8-12 for bond pad pitch < 70 um
! Search height = 5-8 for bond pad pitch > 70 um
2.1.2) Search Speed 1
! This determine the ‘Impact Force’ and ‘Search Time’
! For the 1st bond, user need to consider the Ball Size
<1.8
128
35
1.8-2.3
Ball Size (mil)
2.4-2.7
2.8-3.2
3.3-5.5
256
1st Search Speed
384
512
640
55
Impact Force (gm)
75
100
39
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2.1.3) Standby Power 1
! Bond power applied during search till impact , can help in
some hard to bond application
! Recommended setting = 0 – 30 DAC
2.1.4) Contact Time 1
! After impact and after contact is confirmed , user can set
contact time to apply bond energy and force to improve
ball shear and some other application , example to handle
sensitive device or pad cleaning purposes.
! If Contact time = 0, contact parameter will be ignore.
The machine will apply bond parameter after contact
is confirmed.
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2.1.5) Contact Power 1
!
Ultrasonic energy applied during contact time.
! It can improve ‘Ball Shear’
! It helps in sticking for some application .
! If Contact Power set to = 0, thermo-compression bonding is
applied during this period.
2.1.6) Contact Force 1
! Proper use of this force can help to resolve some process problem ,
example cratering , oxide damage , inconsistent ball formation etc.
2.1.7) Bond Time 1
! Bond time for final ball shape and bond quality.
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2.1.8) Bond Power 1 and Force 1
! Main factors for 1st bond quality.
! Power and Force must be optimized for optimum bond quality.
! These two parameter with sufficient bond time will formed good
intermetallic. (see figure 1)
Intermetallic
Growth
Au2Al
AuAl
Au
Intermetallic
Coverage
Au4Al
Au5Al2
AuAl2
Al
SiO2 or TiW
Si
DIE
Figure 1 : Intermetallic Growth Sequence For Ball Bond
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! Intermetallic Behavior
a) Brittle , conductive , strong
b) Unstable with temperature
c) Exponential phase growth as function of time and temperature
d) Subject to brittle failure
e) Phase growth is key to weld, strong bond but is not subject to
finite life time related time-temp history
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2.1.9) Release Force 1
! ‘Release Force’ applied for special application after Bond Time end
! Default time setting is 2 ms. Recommended Force setting = 0 g
2.1.10) Scrub
! For special application only Recommanded setting - Disable
! This affect the Ball Shear and help Sticking for the
hard/strong device. It used mechanism motion to do the
scrub. (x-y table)
! User can select whether Scrub action is needed along X-axis
direction or Y-axis direction or along the wire direction or
perpendicular to wire direction.
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2.2) First Bond Quality
2.2.1) Ball Size
Max Ball Size = Pad size – 6 um
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! Factors Affecting Ball Size.
# Wire material and Diameter
# FAB Volume and EFO Energy : Current and Time
# Capillary Geometry (Refer to ‘Capillary Selection’
definition)
# Temperature and Bonding Time
# US Power (Ultrasonic Power)
# Impact force and bonding force
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2.2.2) Ball Thickness
Normal setting = 0.5 * wire diameter
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! Factors Affecting Ball Thickness.
# Wire material and Diameter
# FAB Volume and EFO Energy : Current and Time
# Capillary Geometry (Refer to ‘Capillary Selection’
definition)
# Temperature and Bonding Time
# US Power (Ultrasonic Power)
# Impact force and bonding force
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2.2.3) Ball Shear
! Nominal Shear Strength = 6.0 g/mil^2
!Factors Affecting the Ball Shear:#
Die Pad Material & Surface Condition(rough, smooth ,
hard), coating thickness and intermetallic formation.
#
Contamination
#
Damage Metal
#
Transducer Frequency, US Power
#
Bond Time, Bond Temperature
#
Bond Force
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2.2.4) Ball Placement
!
Good placement to ensure no bond short
+ 3.0 Mircon @ 3 Sigma
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3.0) SECOND BOND
3.1) Parameter Affecting 2nd Bond
a) Search Speed2, Contact Threshold2 (Bond Enhancer)
b) Standby Power2
c) Contact Time2, Contact Power2 and Contact Force2
d) Bond Time2, Bond Power2 and Bond Force2
e) Release Time2/Release Power2/Release Force2
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2ND BOND TIMING DIAGRAM
Search
Time
Contact
Time
Bond
Time
Bond
Power
Standby
Power
Contact
Power
POWER
Contact
Force
FORCE
Release
Time
Release
Force 2
Impact
Force
Bond
Force
Final Wedge
Shape
LEAD
LEAD
52
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3.1.1) Search Height
!
This affect the ‘Impact Force’ and ‘Search Time’
!
Recommended setting ,
!
Search Height set 8 - 10
3.1.2) Search Speed 2
! This affect the ‘Impact Force’ and ‘Search Time’
!
For the 2nd bond, user need to consider the Capillary tip
<2.4
Capillary tip(mil)
2.5-3.2
3.3-3.8
128
2nd Search Speed
384
35
256
55
3.9-4.5
4.5-5.5
512
640
Impact Force(gm)
75
100
53
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3.1.3) Standby Power 2
! Bond power applied during search till impact , can help in
some hard to bond application
! Recommended setting = 0 – 30 DAC
3.1.4) Contact Time 2
! See ‘Contact Time 1’ for definition.
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3.1.5) Contact Power 2
! Ultrasonic energy applied during contact time.
! Can improve stitch quality.
! It helps in sticking for some application.
! If contact power = 0, thermo-compression bonding is applied during
this contact time2
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3.1.6) Contact Force 2
! Sufficient Contact Force can improve wire straightness.
! Optimize setting of this force can provide good consistency of
wedge shape.
3.1.7) Bond Time 2
! Bond time for final stitch shape and quality.
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3.1.8) Bond Power 2 and Force 2
! Main factor for Pull Strength.
! Power and Force must be optimized for optimum stitch quality
! These two parameters and sufficient bond time will provide
optimum adhesion
Wedge Deformation
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3.1.9) Release Force 2
! This ‘Release Force’ applied after Base Time end
! Default time setting is 2 ms. Recommended setting = 0 g
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3.1.10) Scrub
! To improve stitch quality for critical application like QFN. It used
mechanism motion to do the scrub.(x-y table)
! User can select whether Scrub action is needed along X-axis
direction or Y-axis direction or along the wire direction or
perpendicular to wire direction.
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3.2) Second Bond Quality
3.2.1) Wedge Shape
Figure : 2
Figure : 3
! Sufficient Wedge Width & Length
! Secure Tool Impression
! No Fish Tail
! No damage / broken wedge
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! Factors Affecting Wedge Shape
# Lead material, coating thickness and surface
condition(smooth, rough or hard)
# Capillary Face Angle, OR, tip dimension
# Transducer Vibration Amplitude ( US Power )
# Bonding Time and Heat Temperature
# Impact force and bonding force
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3.2.2) Stitch Pull
! Good stitch break mode > 50 % gold remain.
3.2.3) Wedge Placement
! Good placement ensure full wedge on lead finger or desire position.
3.2.4) Tail Bonding
! Good tail bonding will prevent missing tail
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4.0) SETUP CONDITION AFFECTING THE 1ST BOND AND 2ND BOND
4.1) Firm Lead finger clamping. No Floating Paddle.
4.2) Correct Free Air Ball Setting as per Chamfer diameter
Chamfer
Diameter
FAB
4.3) Gold Top plate condition(Not dirty or contaminated
with epoxy, loose die or foreign material )
4.4) Top plate levelness.
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4.5) Temperature Setting
# Normal Lead Frame - 200 –230 degree
# BGA 150 ~ 180 degree
# Copper die pad 120 ~ 140 degree
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5.0) CAPILLARY SELECTION
Hole Diameter(H)
FA
CD
CA
Hole Diameter(H) = wire diameter(D) + 0.2mil (5um) ( for <60um BPP
application
Hole Diameter (H) = wire diameter(D) + 0.3mil (7.6um)
( for 1~1.3mil wire) (25 ~ 33um )
Hole Diameter (H) = wire diameter(D) + 0.5mil (12.7um)
( for 1.5~3mil wire) (38 ~ 76um )
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Chamfer Diameter (CD) = H + 5 um
Tip Diameter, T = Pitch x 1.3
Face Angle (FA) = 8 deg. Wire Diameter (for normal bonding)
= 11deg.Wire Diameter(for fine pitch)
Inside Chamfer (IC) > 0.2 mil, less missing tail
Tip Size ,
OR & FA
affect the
2nd bond
shape
CD and CA
affect the 1st
bond shape
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6.0) MULTI MODE ULTRASONIC SYSTEM
Transducer
Vibration Amplitude (Output)
P,V,I (Input Energy(E))
6.1) Advantages
! Best flexibility for difference application
! Enhances bonding quality by using optimal frequency and control mode.
! Enhances fine pitch bonding capability.
Continue…
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! Provide multiple control modes
- constant voltage/current/power mode
! Programmable ultrasonic power profile
! Selectable for 1st and 2nd bond
! Provide Real Time bond quality monitoring.
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6.2) Bond Quality Monitor(BQM) Board
6.2.1) Constant Current Mode
Constant current during bonding regardless of bond
force variation. Reasons are as follows :
P = I2Z where I = constant
During bonding, impedance Z increase so Output
Power,P increase to maintain the current I.
Recommended BQM mode is Constant Current Mode.
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6.2.2) Constant Voltage,V
Constant voltage during bonding regardless of bond force
variation. Reasons are as followes:
P = IV
and I = V/Z
Therefore,
P = V2/Z where V = constant
During bonding, impedance,Z increase so Output Power,P
increase to maintain the voltage, V.
Result: Z increase and Output Power Decrease
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6.2.3) Rise Time
Rise Time is the time the ultrasonic power reach the maximum power output.
For example:Rise Time = 3 ms
Bond Time = 6 ms
The maximum ‘Bond power’ will be only active for 3 ms. However if Rise
Time set to 8ms and Base time still set to 6 ms, the Bond power will never
reach the maximum value
Power (DAC)
Full power
setting
Rise Time = 3
Rise Time = 8
Time (ms)
3
6
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ADVANCE LOOP
CONTROL
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1.0 LOOP SHAPE
DIE
2nd Kink
1st Kink
1st Kink
DIE
LEAD
Q-LOOP
LEAD
SQUARE LOOP
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1st Kink
DIE
2nd Kink
2nd Kink
3rd Kink
1st Kink
4th Kink
3rd Kink
LEAD
DIE
LEAD
PENTA LOOP
‘M’ LOOP
(3 Kink’s)
(4 Kink’s)
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2.0 ADVANCE Q_AUTO CONTROL
Advance (Q) Auto Loop…
0
1
2
3
4
5
6
7
8
Loop Group Type
Wire Profile
Loop Height
Neck/Reverse Angle
LHT Correction/Scale OS
Trajectory Profile Tune
Pull Ratio
Search Speed 2
Engineering Loop Control
1
STD_Q
200
65
0
Auto
5
640
Q
um
35
0
%
Remark:
‘Scale OS’ is to offset the contact level variation of incoming materials
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2.1 Advance Q_Auto Loop - Control Parameter
Loop Height
+ ve
Loop Height
Correction
Trajectory
- ve
Reverse Angle
Neck Angle
+ ve
77
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2.2 Advance Q_Auto Loop - Wire Profile
TSOP
4~6 mil
2~4 mm
BGA_QA
4~12 mil
(Ball Grip Array
Q-Loop Auto)
1~6 mm
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Continue…..
STD_QA
4~12 mil
(Standard Q-Loop Auto)
1~5 mm
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3.0 ADVANCE SQUARE LOOP CONTROL
Advance Square Loop…
0
1
2
3
4
5
6
7
8
9
A
Loop Group Type
Wire Profile
Loop Height
Neck/Reverse Angle
LHT Correction/Scale OS
Span Length
2nd Kink HT Factor (%)
Trajectory Profile Tune
Pull Ratio
Search Speed 2
Engineering Loop Control
1
STD_SQ
200
60
0
40
50
Auto
5
640
S
um
20
0
%
%
Remark:
Scale OS is to offset the contact level variation incoming materials
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3.1 Advance Square Loop - Control Parameter
Span
100%
Length
50%
Loop Height
0%
+ ve
Loop Height
Correction
Trajectory
- ve
Reverse Angle
Pull Ratio
Neck Angle
+ ve
- ve
2nd Bond Pt
81
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Height Factor
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3.2 Advance Square Loop - Wire Profile
STD_SQ
(Standard Square Loop)
4~12 mil
1~5 mm
Smooth 2nd Kink
BGA_SMT
4~12 mil
(Ball Grip Array Smooth)
1~5 mm
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Continue…..
Sharp 2nd Kink
BGA_SAP
(Ball Grip Array Sharp)
4~12 mil
1~5 mm
SPIDER
4~12 mil
1~6 mm
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Continue…..
CSP_SRT
4~12 mil
(Chip Scale Package
With Short Wire)
0.5~2.0 mm
RSTDSQ
(Reverse Standard
4~12 mil
Square Loop)
1~5 mm
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Continue…..
RBGASAP
(Reverse Ball Grip
4~12 mil
Array Sharp)
1~5 mm
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ADVANCE LOOP
FEATURE
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1.0 DESIGN CONCEPT
! Complicated looping control is interfaced with simple parameters.
! Intelligent looping control mode is used.
! “One Parameter~One Response” is achieved without interactive effect.
! Powerful auto-tuning technology for looping trajectory profile.
! Operator can achieved looping quality as good as expert.
! 30 + Loop modes for difference application
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2.0 CAPABILITIES
2.1) Loop height
! Loop height is changed according to the programmed
value
12.0 mils
LoopHeight
10.0 mils
LoopHeight
8.0 mils
LoopHeight
89
6.0 mils
LoopHeight
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2.2) Reverse distance
!
Shape of the loop base can be varied by this parameter
Reverse Distance 80 %
Reverse Distance 70 %
Reverse Distance 90 %
Reverse Distance 100 %
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2.3) Flat length
!
Flat length is changed without adjusting other parameters up to 85% with respect
to the wire length
Flat Length 50 %
Flat Length 90 %
Flat Length 30 %
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2.4) Second kink height smoothness
!
Sharpness of second kink
height can be changed easily
using one parameter
2nd Kink Smooth Factor 0 %
2nd Kink Smooth Factor 100 %
2nd Kink Smooth Factor 50
%
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2.5 Penta Loop - 3 Kink’s Loop
"
"
"
Third kink Consistency 6
mm Wire Length
93
Provides a sufficient gap between
wire and adjacent trace, critical in
TBGA applications
Robust wire profile improves wire
sweep, critical in PBGA with 1mil
wire and long loop length
Upper die looping and lower die
looping in stack die package /
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2.6) FBGA
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2.7) Stacked Die Bonding
$
Two approaches to provide maximum gap
between wires
Penta Loop - reverse bonding
Die 2
Die 1
$
Penta loop to have extra third kink
Die 2
Die 1
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2.8) Stacked Die BGA
(Penta M - loop)
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2.9) Stacked Die BGA
Reverse bonding and BSOB
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2.10) Stacked Die BGA
(Reverse bond and BSOB)
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2.11) Multi-tier looping
Upper tier - Square loop
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2.12) Multi-tier Looping
Upper tier - Penta Loop ( 3 Kink’s Loop )
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2.13) Multi-tier Looping
Upper tier - M Loop ( 4 Kink’s Loop )
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2.14) Short Wire Looping
Die edge to
wire gap
36.7 µm
Die edge to
2nd bond pt.
129.5 µm
Die edge to
wire gap
27.38 µm
Die edge to
2nd bond
pt.124.3 µm
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Bond Stick On
Ball(BSOB)/Bond
Ball On
Stitch(BBOS)/
Tail Break
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1.0) BOND STICK ON BALL(BSOB)
1.1) Description
This bonding process is specially developed by
ASM to handle multi-die(MCM) bonding application.
In the conventional approach, if one is trying to connect
the gold wire from one die to the another, a capillary
mark of second bond will be evident on top of the die
which may damage the die. The BSOB process will
solve this problem by bonding a ball onto the die’s
surface first, followed by bonding another wire where
the second bond’s wedge will be landing on top of this
bonded ball(figure 1).
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2nd Bond(wedge)
1st Bond
Bond Ball
Die 1
Die 2
Figure 1 : Bond Stick On Ball(BSOB)
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2.0) BOND BALL ON STITCH(BBOS)/ SECURITY BOND
2.1) Description
This process is also known as security bond. It bonds a ball
on top of the wedge of the normal connection wire.This process is
mainly used to secure the second bond sticking capability.(Figure 2)
Bond Ball
1st Bond
Lead
Die 1
2nd Bond
(wedge)
Figure 2 : Bond Ball On Stitch (BBOS)
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3.0 STANDOFF BALL CONTROL BONDING SEQUENCE
3.1) Free Air Ball (FAB 2)is aligned to the center of the bond pad on device 2.
FAB 2
Device 1
Device 2
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3.2) Capillary descends and bonds ball to bond pad.
Application of 1st bond stand off
ball parameter to form ‘Ball
Thickness’ and ‘Ball Size’
W/clamp ‘open’
Capillary
Device 1
Device 2
During Stand Off Bonding , SOB parameters are applied .
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3.3) Capillary rises to loop base to clear ball.
Capillary rises to set Loop Base
Loop base is the distance between the capillary
tip and contact point.
W/clamp ‘open’
Loop
Base
Contact Pt.
Device 1
Device 2
Recommended setting = 2
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3.4) Capillary move to programme ball offset. Ball offset can be
programmed towards or away from the first bond. + ve towards 2nd bond
- ve away 2nd bond
W/clamp ‘open’
Actual Ball Offset = Setting x 10um
If Ball Offset Setting = 22
Then Actual Loop Base =220um
Device 1
Device 2
Recommended Setting = - ve 35
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3.5) Capillary descends and forms stitch bond on top of the ball.
Capillary descends to set Ball Thickness
(Amt. Z movement above the ball height)
SOB Parameter (Stand Off Ball Parameter)
W/clamp ‘open’
*Ball Thickness
Contact
Pt.
Device 2
Device 1
* Ball Thickness is the distance between the capillary tip and contact point
Recommended setting = 2
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3.6) Capillary moves horizontally for a scrub distance to weaken the
wire at ball neck.
Capillary move to set Scrub Distance
One direction ONLY - Away from the ball
Scrub one direction away from
ball
W/clamp ‘open’
Actual Scrub Distance = Setting x 0.8 um
If Scrub Distance Setting = 10
Then Actual Scrub Distance = 8 um
Device 1
Recommended setting = 8
Device 2
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3.7) Capillary rises to tail height
Capillary moves to set Tail
Length (Amount Z movement
above the bump before the
wire clamp closes)
W/clamp ‘close’
Device 2
Device 1
Recommended setting = 35
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3.8) Capillary rises and tears the wire, as BH ascend to Fire Level.
W/c ‘close’
Device 1
Device 2
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3.9) EFO fires to form free air ball. Cycle repeats until all “Standoff Ball”
are placed.
FAB
Bond Ball
Device 1
Device 2
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3.10) After placing all standoff balls. The machine continue to bond wires.
2nd Bond(wedge)
1st Bond
Bond Ball
Device1
Device1
Device2
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Figure 3 : Standoff Ball Control Parameter Display(page 1)
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4.0) PARAMETER DEFINITION IN STAND OFF BALL CONTROL MENU
4.1) Loop Base
This parameter determines the loop level of the bondhead which
should be sufficient to avoid the ball.
Range: Loop Base
0~5
Setting : 2
4.2) Ball Offset
This setting controls the distance of the table move in order to offset
the capillary from the standoff ball.
Negative value can be moved towards to the first bond.
Positive value can be moved away from the first bond.
Range: Ball Offset
- 40 ~ 20
Setting : - ve 35
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4.3) Ball Thickness
This parameter refer to the ball thickness which controls the level of the
bondhead as it descends to the top of the ball
Range: Ball Thickness
Setting : 2
0~5
4.4) Scrub Distance
This setting controls the capillary moves horizontally with a
Scrub amplitude to weaken the wire at neck. It is always away from the
first bond.
Range: Scrub Dist
4 ~ 12
Setting : 8
4.5) Tail Length
This setting controls the length of the tail where the bondhead
rises to the preset height before the wire clamp is closed.
Range : Tail Length
30 ~ 40
Setting : 35
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4.6) Time Base 1/2
This setting controls the bond time applied to the standoff ball control only.
Time 1 for the 1st bond and Time 2 for the 2nd bond.
4.7) Power Base 1/2
This setting controls the ultrasonic power applied to the standoff ball control
only. Power 1 for the 1st bond and Time 2 for the 2nd bond.
4.8) Force Base 1/2
This setting controls the bonding force applied to the standoff ball control
only. Force 1 for the 1st bond and Force 2 for the 2nd bond.
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4.9) Standby Power 1/2
This setting controls the power activated when the bonding head
reach the search level, to the moment the bond head contacts the
bond surface. With the vibration, before contact take place. Bond
head will clean up the pad surface and remove water vapor on the
pad. This parameter used for the standoff ball control only.
4.10) Contact Time 1/2
Refer to the ‘Contact time 1/2’ definition in ‘Bond Parameter’
menu. But this parameter will be affected on the Standoff ball
control only.
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4.11) Contact Power 1/2
Refer to the ‘Contact Power 1/2’ definition in ‘Bond Parameter’
menu. But this parameter will be affected on the Standoff ball
control only.
4.12) Contact Force 1/2
Refer to the ‘Contact Force 1/2’ definition in ‘Bond Parameter’
menu. But this parameter will be affected on the Standoff ball
control only.
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5.0 BSOB WIRE PARAMETERS
Figure 4 : Standoff Ball Control Parameter Display(page 2)
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5.1) Wire Offset In ----------------Menu
This is the offset parameter that is required to ensure maximum contact
area between the stitch bond and ball. It is always away from the first
bond.
Range:
Wire Offset
10 ~ 30
Recommended setting = 25
2nd Bond
Wedge
Capillary position
during stitch bond
Stand Off Ball
5.2) Second Bond Search Speed
This Parameter controls the impact for stitch on ball.
Range:
Search Speed 2
32 ~ 256
Recommended setting = 32
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5.3) Time Base 1/2
This setting controls the bond time applied to the device. Time 1 for the 1st
bond and Time 2 for the 2nd bond.
5.4) Power Base 1/2
This setting controls the ultrasonic power applied to the device. Power 1 for
the 1st bond and Time 2 for the 2nd bond.
5.5) Force Base 1/2
This setting controls the bonding force applied to the device. Force 1 for the
1st bond and Force 2 for the 2nd bond.
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5.6) Tail Break Time
This parameter is used to resolve or minimize snake wire problem when
user enable BBOS or BSOB. This paramater controls the speed of bond
head after tail level moving towards fire level.
Range :
Tail Break Time 0 – 100
Recommended setting = 50
Range : Tail Break Distance 10 - 50
Recommended setting = 25
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Ball Formation
Monitor & Bond
Stick Detection
Process
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1.0) BALL FORMATION MONITOR (BFM)
1.1) Introduction
The ball formation monitor(BFM) is one of latest
features which has been introduced and the
purpose of this feature is to eliminate capillary
mark on die. This feature uses the voltage from
the e-torch spark while forming the free air ball
generated from EFO box to predict the tail
condition ( see figure 1)
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Gold Wire
Intelligent system designed to monitor the
millisecond free-air ball formation process
Capillary
E-torch
Outward
bent tail
Inward
Bent tail
Contaminated
wire
Contaminated
E-torch
Very short tail
Figure 1 : Accurate Missing Ball Detection
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1.2) Advantages
"
"
"
"
Improve bonding yield by detecting all
defective free-air balls
Improve reliability of the package by detecting
balls with contamination
Eliminate capillary mark on die by accurate no
ball detection
Can detect improper setup in tail length,
clamping and sparking system
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109087 BALL FORMATION MONITOR
0 Sampling Bonds(Redo)
50
1 Abnormal Sampling Limit
2 Contamination Factor
10%
35 0.1X
3 Abnormal Tail Factor
4 Sampling Exception Rate
25 0.1%
35%
(Use default value for 1,2,3 & 4 for sampling)
Figure 2 : BFM Display
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2.3) How does the sampling works..
When a machine changes from 1 device to another ,the machine
usually experiences many false alarms. Why is this so ? This is
because the limits used from the previous device are different from
the current device used. In order to avoid these false alarms caused
by the variance of the limits , one may increase the value of the
contamination factor ,abnormal tail factor and sampling rate. Do
not start the sample bonding when the new device is not yet
properly set up.
During sample bonding ( i.e. 50 samples for example ), each
sample will be compared with the contamination factor
( Contamination Threshold Imt - 50 ), which has been set in the
software . If any sample exceeds the limit, the machine will report
‘wire or e-torch contamination’. The sample value reflected on the
machine will not be taken and it will continue bonding until it has
completed the number of samples set by the user ( e.g. 50 samples )
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CT Imt
-
Contaminated Threshold Limit
CS Imt
-
Contaminated Sensitivity Limit
AT Imt
-
Abnormal Tail Threshold Limit
AS Imt
-
Abnormal Sensitivity Limit
Note : Abnormal Threshold & Sensitivity are limits used to detect abnormal
tail & other related rejects.
Contaminated Threshold & Sensitivity are limits used to detect the wire or
e-torch contamination
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1.4) BFM Process Flow
FAB Detection
Error
Non Error
Continue
Bonding
Contamination Tail
Actual CT > CT Limit
and
Actual CS > CS Limit
EFO Gap Wide
Breakdown voltage exceed
Missing Ball
Actual CT = 0 or 255
Abnormal Tail
Actual AT > AT Limitb
or
Actual AS > AS Limit
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Grade Legend
Contamination Grade
Threshold Value
Sensitivity Value
A
70
75
B
70
60
C
90
50
D
90
30
E
90
10
Abnormal Tail Grade
Threshold Value
Sensitivity Value
A
6
60
B
8
55
C
10
50
D
12
45
E
14
40
* Cont…
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* Initially select Grade B for both (recommended ).
User can enable the Auto correction if they want the
machine to automatically adjust the grade / setting to
prevent false alarm otherwise user can manually adjust
the grade level to prevent false alarm.
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2.0) BOND STICK DETECTION
2.1) Introduction
!
AC method allows to cover more critical chips and
assembly.
!
Programmable signal amplitude extends the range of
detectable device to opto-electronic components
without manual intervention.
!
Programmable threshold adapts better to great variety
of chip designs.
!
Auto detection of threshold possible through
software.
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BSD Procedure Flow Chart
From functiuon 15, Enable Sampling
Select # of samples and set applied voltage to 30 DAC
Disable 1st wire if necessary
Start Auto Bond
Is Sampling
successful ?
No
Switch setting at EFO box. Refer to
table 1 (Start with 1 towards 4)
Yes
Continue Autobond
Encounter 1st
bond False alarm
Manually
increase stick
adjust value
by 5
?
Yes
Yes
Increase threshold
voltage by 1
No
Encounter 2nd
bond false alarm
?
No
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Cont’…
If encounter consistent false alarm, check the following :
1) Wire end grounding
2) Wire clamp capacitance measured from ground to wire clamp should not exceed 0.5uf
Switch Setting At EFO Box.
Set
Switch 1
Switch 2
R (MΩ)
Current (uA)
Reference
Possible
Max Ioutput (uA)
1
OFF
OFF
1.14
1.5
4.38
2
ON
OFF
0.90
2.0
5.50
3
OFF
ON
0.46
5.0
10.80
4
ON
ON
0.22
10.0
22.70
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Sampling Theory ( FOR BSD )
Sampling usually detects how many bonds were experiencing non-sticking on
bonds. When setting up for a new device, the user should always take new
samples of the said device. This is because each die has different impedances
on them. During sampling the EFO box will increase the applied voltage until
it reads the difference between open and close voltages , larger than the
tolerance factor. To be able to satisfy the condition of the tolerance factor , the
difference of the open and close voltages should be greater than 5. As soon as
the tolerance factor is satisfied ,the EFO box will stop increasing the applied
voltage. However , if the applied voltage is set to 30 DAC , it is already
sufficient to satisfy the condition of the tolerance factor , giving ample time to
read the open and close voltages and eventually set a threshold voltage between
the open and close voltages. After first bond sampling is completed , the bond
stick detection will automatically start the sampling on the second bond.
The sampling will perform stick check depending on the number of samples set
by the user. The threshold for the second bond will be set as a result of the
addition of the maximum stick check reading and the ‘stick adjust
correction factor’ the user has set in the machine.
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2.2) Advantages
!
For difference device wire bonder can automatically
adjust Vap(Voltage apply) to a suitable voltage level,
base on device impedance.
!
AC signal used can reduce the probability of high
voltage shock to devices, compared with DC signal.
!
Machine can automatically search for suitable startup sampling time for accurate 2nd bond non stick
signal detection.
!
Less parameters need adjustments and there are
helpful messages for warning.
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2.3) Flow-chart Of Non Stick Detection.
1st Bond Non Stick Detection
Applied Voltage A = 30 DAC
Tolerance Factor = 5, Stick Adjust S = 35 sample
False Alarm
Bonding
Increase T and/or A
1st Bond Non Stick not reporting
Decrease T and/or A
Passed 1st Bond Non Stick Detection
2nd Bond Non Stick Detection
False Alarm
Bonding
Increase S
2nd Bond Non Stick not
reporting
Decrease S
Completed setting for both 1st and 2nd Bond
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Stick Adjust using Auto Bond Menu ( For 2nd bond Non stick detection )
Stick adjust setting may be adjusted on the Auto bond menu. Pressing
Function will display a special menu where the stick adjust can be found.
( 7 stickadj )
The theory is based also on the open and close circuit. After the tail length (
2nd Bond ), the wire clamp will close. The bond head will start moving
upward ( the bond stick detect will start the sampling time ). Within the
value set by the user for the sampling (e.g. set to 35 samples ), the wire is
expected to be opened . If the wire is not open , then it will be detected as
2nd bond nonstick.
Recommended setting for this is 20.
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Tail Stick Function in Auto bond menu ( For 2nd bond nonstick detection )
The tail stick function is an independent function that works when that tail
break function is on and is located on the special menu on the Auto bond ( 9
tail stick ). The tail break function can be enabled on the wire parameter menu
( tail break map ). A recommended value for the tail stick function is 55.
Note : This function is only applied when Tail Break ‘Ena’.
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st
1
nd
2
&
BOND
FAILURE
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1.0) FIRST BOND FAILURE
1.1) Silicon Oxide Crack
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1.1.1) Cause
Material :
•Wrong capillary is used.
• Wrong etching process.
• Gold wire used is too sensitive to silicon crack.
• Glass under bonding pad is too thin.
Bonder :
•Parameters setting is not optimized yet.
•Unstable impact force or too large impact force.
•Ultrasonic is too large.
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1.1.2) Solution
1.
2.
1st contact time
Select high frequency transducer .
Optimize the bonding parameter :
:
Increase contact time so as to ensure the bond head
is settled before ultrasonic.
1st contact power : Set to zero .But sometimes, if the ball shear result
is bad , contact power can be increased. However, it
cannot exceed the base power.
1st contact force : Increase contact force so as to ensure the gold ball
is deformed before ultrasonic .
1st bond time
: Reduce bonding time in order to minimize vibration
due to ultrasonic.
1st bond power
: Reduce power, hence ,amplitude is also reduced.
1st bond force : Increase suitable bond force so that the gold ball is
stable in ultrasonic.
Search speed : Reduce search speed to ensure less bond head impact.
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1.2) Cratering
"
"
"
The result of brittle fracture:initiated by some imperfection,flaw,crack,etc.
which caused the stress at the imperfection to exceed the critical stress for
failure in the material
Bonding may initiate the critical stress rise but the material’s composite
structural properties create the setting of failure
Any defect on a glass coating surface in intimate contact with Si will result in
potential crack propagation through the glass if critical stress is exceeded(and
possibly into the Si)
Continue……
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"
"
Removal of stress concentrations and film tensile stress result in
low or no “chip-out” failure
In Summary:
---excessive ultrasonic energy: primary cause
---bond force/impact force/Si particle size/low
modulus P.O(polymer or overcoat)/package
stress/die size: secondary cause
---brittle fracture failure mechanism
---Si precipitation and particles in Al/volumetric
change in Au-Al
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1.3) Missing Ball/Inconsistent Balls
" 2nd power, 2nd force, 2nd search speed too high
" wire clamp (open / close) force
" Leads clamping (check for floating)
" Dirty/contaminated bond lead or wire
" Torch tip dirty
" Tail Length too short
" EFO spark at Window Clamp - Window clamp set-up too high
" Fire level too low or high
1.4) Lift Metal
" Too much 1st power
" Base force not enough
" Wire too high
" Al pad not fully cured or contamination between Al and
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1.5) Non Stick On Bond Pad
"
"
"
"
"
"
"
"
"
"
Die Pad Floating
Substrate too soft
Insufficient 1st Bond Parameter
Insufficient heat
Over-used Capillary
BQM out of calibration (Normal BQM)
Material contaminated
Not perform contact search
Epoxy too soft-not properly cured
Epoxy contaminated the Die pad during cure
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1.6) Lifting Ball
"
"
Base power not enough
Increase standby power, contact power and base power
1.7) Small Ball
"Contaminated
"Tail
"Tip
"Tail
wire and device or E-torch
too short
of tail length swing away from E-torch
length setting to short
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1.8) Off Center Ball/Golf Ball
"
"
"
"
Tail length too long
Wire or wire path contamination
Air tensioner flow rate too low
EFO box or cable connection problem
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1.9) Smash Ball
"
"
"
"
"
"
"
"
"
"
Floating Die/Over Clamp force
Reduce search speed
Reduce the Bond Force
EFO Torch tip setting no good
Contact Search not performed
BQM board not calibrated.
Dirty Torch Tip
Inconsistent Die Thickness / Die Height
EFO Box Problem
Air diffuser too large
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1.10) Misplaced Ball
"
"
"
Poor PR Set-up, Poor Lighting setup
Poor clamping on unit, Unit moving during clamping.
Air diffuser insufficient
1.11) Neck Crack
"
"
"
"
"
"
"
"
Excessive Reverse Distance
Reverse High too low
Wrong Capillary type used.
Over used capillary
Contact sensor dirty
Material problem -wire
Wire clamp opening too small
EFO current too large
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2.0) SECOND BOND FAILURE
2.1) Lift Stitch
"
"
"
"
"
"
Lead floating or contamination
2nd time,power and force need increasing
Increace release fire
Apply 2nd bond scrub
Increase 2nd contact power
Capillary lifetime
2.2) Stitch Cut
"
"
"
Reduce 2nd power / force
Optimise lead clamping
New capillary
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2.3) Inconsistent 2nd Bond Deformation
" Tilted Leads
" Poor Window Clamp setup
" Insufficient Bonding Temperature
" Dirty top plate
" Wrong top plate used
" Over used capillary
" Contaminated Material
" Optimise 2nd power and force factor
2.4) 2nd Bond Tailing
" Gold wire is too old
" Capillary Chamfer Angle too shallow
" Capillary Chamfer Diameter too large
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CHAPTER
9
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LOOP
CONTROL
(FAILURE)
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1.0) EXCESSIVE LOOP CORRECT SETTING
Action
Reduce the Loop Correct
Setting
DIE
LEAD
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2.0) FIRST KINK STRAIGHTEN
Possible Causes
1) Abnormal
trajectory profile
2) Loop correction is
too small / wire too
tight
DIE
LEAD
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3.0) SAGGING WIRE
Possible Cause
Ideal
Negative Synchronous
Offset too much
DIE
Actual Sagging
LEAD
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4.0) TRIANGULAR LOOP SHAPE
Triangular
Loop Shape
DIE
1. Appearance
Action 1
•Reduce Reverse Distance
•Increase Reverse Distance Angle
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5.0) LOOP BASE INCONSISTENCY
Possible Cause
•Search Delay incompatible
with Reverse Distance or
Reverse Distance 2
DIE
LEAD
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6.0) INCONSISTENT LOOPING
Possible Causes
1. Floating leads
Inconsistent
Capillary
DIE
LEAD
Sometimes
Bounce
Upwards
2. Friction along wire path
3. Trajectory selection is not
good
Sometimes
4. Wire on capillary is not good
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7.0) HIGHEST POINT INCONSISTENT
Possible Causes
Highest Point Inconsistent
•Capillary Geometry
•Search Delay setting not optimized
•Base strength too weak, causing
second bond to squeeze back. Need
to increase Reverse Distance and
search delay to damper the squeeze
back force (need to take care on
neck crack).
DIE
LEAD
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8.0) WIRE SWAY
Wire Sway
Slightly
Longer
Case 1
Wire Sway but Loop Base consistent
•Capillary Geometry
•Air Tensional problems
•Wire Path related
•Wire Spool
•Second Bond Parameters related
Capillary
Pull
Case 2
Wire Sway with inconsistent Loop Base
•Air Blow at marginally profile or too
strong
•Wire Pull
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9.0) SECOND BOND LANDING ANGLE
Angle Too Small
DIE
Result
Reason
LEAD
Recommendations
•Adjust Dec Sample and Synchronous
Offset
•Use Vertical Pull or Horizontal Pull
Suggest
Vertical Pull Height 50
Vertical Pull Time 50
Horizontal Pull
15% or 3mil
Weight
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10) LOOP BASE BENDED
Case 1
Possible Causes
•Capillary
Geometry
•Tail length
•Air tensional
•Wire clamp gap
too big
Preferred
Bended
Already
Case 2
Wire not fully into
the capillary due to
weak air tension
1 to 2 mil
174
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11) INCONSISTENT SQUARE LOOP SHAPE
Recommendations
•Increase Dec Sample to shift out profile
•Adjust Synchronous Offset
•Use fixed span length
Kink
Kink
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12) INCONSISTENT SECOND KINK
Inconsistent
Recommendation
•Decrease Second Bond Base Power
•Increase Reverse Distance 2
•Use fixed span length
•use rump motion (new feature)
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EFO
SETTING
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Wire clamp closed
3 Mil
Tail Length
Fire Level Factor
Current
Capillary
Level
Machine at Reset Position
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Wire clamp
closed
Approx. 2~3 x
Wire Diameter
Free Air
Ball(FAB)
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EFO Parameter A
Wire Size
Ball Thick
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Capillary Data B
For Double Chamfer,
Need to key in Chamfer
Angle 2
Hole
Diameter
Face
Angle
C’Diameter
Chamfer Angle
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Parameters Affecting
Free Air Ball (FAB)
Downward
Free Air Ball =
EFO Parameter A + Capillary Data B
Note : Above parameters only affect the
melted gold volume.
FAB
Free Air Ball
Pad Surface
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Capillary
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Chamfer diameter
Tip Diameter
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Capillary Condition
Good Capillary
Capillary after 1000K
Capillary after 800K
Bond points
Bond points
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FTN 15
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1.0) EFO CONTROL
1.1) EFO Delay
User can set time delay before EFO start sparking.
1.2) EFO Setting
Under this menu are all the critical parameters that affect the
Free Air Ball (FAB) formation.
1.2.1)EFO Box Type
STD / HEAVY
Select the EFO Box type that is used on the existing machine.
STD
For 0.6 mil to 2.0 mil wire size application.
HEAVY
For 1.5 mil to 3.0 mil wire size application.
Continue….
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1.2.2) EFO Current
This parameter determines the amount of constant current flow to
melt the gold wire.
1.2.3) Auto EFO Time
No / Yes
Select yes, the EFO box will automatically adjust the EFO
Current and EFO Time based on the information in EFO
Parameter in the Base Parameter.
1.2.4) EFO Time
This parameter setting determine the ball size of the
Free Air Ball(FAB) i.e. longer EFO Time setting will give
bigger FAB
Continue…..
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1.2.5) EFO Gap Volt
This is the EFO breakdown voltage checking the threshold
voltage. If the Breakdown voltage is greater than the EFO Gap
Voltage the machine will give ‘ the EFO Gap Wide’ warning
for shortail.
1.2.6) EFO Control Mode
Capil/FAB/FAB2
Capil : Machine will be automatically calculate the FAB
depending on the capillary geometry. In this case
user need to load/key in the capillary data.
FAB : User need to key the value of the FAB manually.
FAB2 : Free Air Ball(FAB2) used for the standoff ball
control.
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1.2.7) Ball Formation Monitoring (BFM)
Ball formation monitoring feature is to eliminate the capillary mark on
Die.
During bonding,, the machine will compare each sampling with the
‘ Contaminated Limit ’ and ‘ Abnormality Limit’.
If any of the sample exceeds the limit ,it will report ‘ Wire Abnormal
tail’ or ‘ E-torch contamination’. ( For more detail ,refer to chapter 8 )
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2.0 SKIP DIE
2.1) Ink Size (Radius)
For skip by Ink Mark user need to teach the Ink Size (radius)
2.2) Skip Missing Die
Machine will search for PR, if PR failure then found missing die
machine will skip that unit.
!
VLL Before Check Ink
YES/NO
User can Enable/Disable the VLL before check ink mark
!
Skip Missing Die
To enable/disable the Skip Missing Die
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2.3) Skip Ink/Bad Unit
After indexing, the Pattern Recognition System will search for PR
alignment points. Any damage/dirty die found on the die surface leads to
PR failure. PR Table Retry will be activated for second attempt and if
fail, then it will skip that unit. To activate the skip ink/bad unit, user
must enable the PR Table Retry.
!
Skip Ink Unit
YES/NO
If Pattern Recognition on Die failed, it will go to ink spot to
verify. The machine will skip unit when ink spot is located (If
machine can’t spot ink mark it will inform operator to assist).
!
Check Special Pat.(Pattern)
YES/NO
To enable/disable the Skip Ink Unit by Special Pattern checking.
!
Teach Special Pat….
After enabling the ‘ check by special pattern ’ ,the user needs
to teach the machine a particular special die pattern on that unit.
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2.4) Skip By Mark Checking
YES/NO
To enable/disable the skip by mark checking
!
Ink Size(radius)
Skip mark checking by referring to the ink size, so user need
to teach the Ink Size(radius)
!
Check Rej_Indicator Only
YES/NO
To enable/disable the skip unit by Reject Indicator checking.
!
Teach Reject Indicator….
After enabling the function ‘ check by reject indicator ‘ , the
user needs to teach the particular reject indicator pattern on
that unit.
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3.0 SCRUB CONTROL
This affects the Ball Shear, Pull Strength and Sticking for the special
application ( some BGA or QFN or Special Die Pad ) device. It uses a
mechanism motion to do the scrub i.e XY table. With this item it could be
specified whether scrub action is needed along X-axis, Y-axis, a long wire
direction or perpendicular to wire direction. Under this function user need
to key in:
!
Period of a scrub cycle
!
No. of scrub cycle
!
Scrub amplitude
!
Scrub direction
!
Scrub Force
!
Scrub Power
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4.0 BOND PROCESS CONTROL
4.1) 1st Wire Power Offset
When the first unit indexed into the bond site, the Free Air Ball tends to cool
down for the first wire. Additional power is needed in
order to achieve desired bonding result.
4.2) 1st Wire Time Offset
(ms)
This parameter determine the time taken to apply the 1st Wire Power Offset.
4.3) 1st/2nd Release Force
4.3.1. After Base Force ,apply Release Force before the Bond Head life up to
achieve some difference in the bonding quality between 1st and 2nd bond.
4.3.2. For small ball application, these parameters are used to
achieved consistent ball size.
4.3.3. For some application , it can improve the 2nd stitch shape
and cap mark.
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4.4) Power Compensation Method
User can select the power compensation method for second bond
ultrasonic Power and Force compensation factor. This factor is
used to eliminate traditional existing second bond shape and to
improve the second bond sticking along the X – bonding axis.
Three types of the compensation method are :
I) Bond Center
ii) Wire Direction
iii) Lead Direction
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5.0 SAFETY CONTROL
5.1) Edit Bond Pt. Tol.(um)
Under program verification mode, user can set the tolerance of the
bond point for the first and second bond, so during the ‘edit bond
point’ and ‘VLL’ reload or search, operator only can edit the bond
point position between the setting tolerance. This parameter can be
disable by setting the value to 0.
5.2) Upper Search Tol. 1/2
User can set the maximum upper contact height tolerance base on the
Die and Lead surface. If it exceeds the limit, during contact search ,
machine will stop bonding and give warning message.
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5.3) Lower Search Tol 1/2
User can set the minimum lower contact height tolerance based
on the Die and Lead surface.
5.4) Wire End Detection
If bonding of wire is finished machine will activate ‘ wire end
sensor ‘ and the machine will automatically stop bonding.
5.5) Device Oxidize Limit Time
sec
If the machine is idle, a counter will start counting. If the counter
exceeds Device Oxidize Limit Time, window clamp and top plate
will open to avoid over curing of substrate.
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6.0 SPEED CONTROL
6.1) Speed Percentage
This parameter control the overall machine operating speed. Kindly
consult ATS process before speed reduction.
6.2) Search Speed 1/2
Before the capillary touch the die or lead surface, the capillary travel
with selected speed within a designated traveling height. This speed
used to control the impact force.
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7.0 PR CONTROL
7.1) Fast PR
YES/ NO
No=> PC will process and display every operating image, therefore
slower in PR Speed.
Yes=> PC will process and display only the last detected area on the
the screen.
7.2) PR Tolerance Retry
If PR alignment fail, machine will check if the PR Tolerance Retry is
ativated. If yes, it will try again.
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7.4) Digital Zoom on Die
NO/ YES
To improve the accuracy of the Die manual alignment, the Digital Zoom can
be configured to automatically activate during teach, edit or correct. This has
the effect of making the image magnified by 2 and allows the user to clearly
make out the edges of patterns on the die.
NB : It only affects the Die manual alignment, leads are not affected.
7.5) PR Auto Threshold
DISABLE/ ENABLE
Enable this function, PC will auto calculate the optimum PR threshold value.
7.6) PR Reload control
DISABLE/ ENABLE
Customer can prevent their operator from reloading Pattern
Recognition. ( if PR quality fails )
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7.7) Substrate PR Compensate
ENABLE/DISABLE
Enable
After doing PR Alignment on leads and the machine find out that the lead
alignments are shifted, it will auto offset to find the die alignments.
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8.0 LOOPING CONTROL
8.1) Horizontal Length Factor
This is a Flat Length slope for short and long wire.
8.2) Reverse Dist 2 Factor
This is a Reverse Dist 2. Slope for short and long wire.
8.3) Auto Select Loop Type
ENABLE/DISABLE
Select enable, when auto tuning the machine will auto select the loop mode
for particular wire based on wire length.
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9.0 HEATER CONTROL
9.1) Heater Control
This is for the Software controlled Heater Controller.
9.2) Heater Setting
User need to enter the heater configurations and setting so that software can
react accordingly.
"
Select Heater/ PreHeat/ PostBnd/ Fork Ht/ OvrHang/ Heater2
Select the respective heater to input setting required.
Continue…..
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"
"
"
"
"
"
Heater
=> At Bond site
Pre-heat
=> Before Bond site to raise the substrate temperature
before actual bonding site.
Post Bond => After Bond site to maintain the temperature for
inspection.
Fork Heater => This is for Power Device application (Example TO220)
OverHang => This situated on top of the pre-heater to conserve the
heat on the die surface.
Heater2
=> This is reserved for future application.
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9.3) Temperature Type
C Deg/ F Deg
User can select the desired measurement unit for temperature control.
9.4) Set Temperature
This is for the user to set the operating temperature.
Deg
9.5) Heater Alarm
Deg
User can set the upper and lower temperature control limits.
9.6) Set Temp. Offset (*0.1)
Deg
This is to compensate the temperature difference between the
actual top plate surface temperature and Set Temperature.
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9.7) Heater Auto Tune
Used for Heater Controller calibration for designated heater setting.
Thus after entering the configuration and setting for selected heater,
user must use this parameter to auto tune.
9.8) Temperature Show
User can monitor the real time temperature. User can also press Shift +
FTN7 to see the above display.
9.9) ON/OFF Motec
Used to ON/OFF the heater elements.
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10.0 PARAMETER
10.1) Set Parameter Range
Process Engineer can access this menu to set the upper and lower parameter
range.
# Set Bond Parameter Range
# Set Base Parameter Range
# Set EFO Setting Range
# Set Standoff ball Range
# Set Standoff Ball Wire Range
10.2) Lock Parameters
User can lock the parameters access.
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10.3) Loop Mode Type
Enable/ Disable
Select the desire bonding Loop Mode from below:
# TSOP Loop/ Auto Loop/ Normal Loop
#
(Q)Auto Loop
[Group 1(Q)/2(q)/3(K)/4(k)]
#
Square Loop
[(L)ong Square(Norm)/(l)ong_Square(Low)/ (S)hortSquare(Norm)/
(s)hort Square(Low)/ (I)Gnd Square(Norm)/ (i)Gnd Square(Low)]
#
Uni Slope Square Loop
[(U)Long Uni Slope(Norm) / (u)Long Uni Slope(Low)
/ (V)Short / Uni Slope(Norm) / (v)Short Uni Slope(Low)]
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11.0 PARAMETER
11.1) Index Accuracy Statistic
This is for ASM Production application.
11.2) Reset Statistics
User can reset the statistics menu.
11.3) Reset Error Log
In order to reset the MTBA/MTBF errors logging, user can trigger using
this menu.
11.4) Errors Causing Interrupt
User can define the errors that caused MTBA/MTBF.
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11.5) Stats Operation Mode
Prodn/Engnrng/SchDwn/UschDwn/ NSchDwn
Kindly refer to AB339 User manual.
11.6) Stats Display Interval
Never/1sec/2sec/5sec/10sec/30sec/1min/Unit
This is to trigger the Statistic display within designated time
interval.
11.7) Enable BQM SPC
YES/ NO
In auto bond menu., Enable BQM SPC means enable SPC
function.
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11.8) Report BQM SPC Error
YES/ NO
Report BQM SPC set to Yes
If an SPC error occurs, machine will stop and display :“Statistic Process
error” and then ask user whether to do calibration or not, then switch to
auto bonding.
11.9) Report BQM SPC
No
When SPC error occurs, machine will automatically tune BQM board
instead of stopping.
Yes
When SPC error occurs, machine will stop and await the user to
tune the BQM board.
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11.10) SPC error may due to
Control value exceeding control range
Control value exceeding bias rule
Control value exceeding trend rule
11.11) Hours Check SPC
DSP BQM will perform interval SPC checking based on the time interval
setting in this parameter.
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12.0 MISC CONTROL
12.1) Skip Bonding Last Col.
YES/NO
For some matrix application, customer can choose to skip the last
column during bonding.
12.2) Control Air Diffuser
YES/NO
The air diffuser will automatically cut-off during bonding if this
feature is used (YES).
12.3) Capillary Control Power
This feature is to offset the Ultrasonic Power (1st and 2nd
Bond Base Power) during bonding especially when changing
new capillary with no TBR.( Tail Break Reinforcer )
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12.4) Power Offset Bond Count
* 100
It means, the Number of wires needed to offset the power. One value
is equivalent to 100 wires. So, after completion of 100 wires, machine
will automatically shift to normal power setting.
12.5) Index Test Position
YES/NO
This is strictly for in-housing testing
12.6) Num Unit Off Panel Light
This feature is to turn Off the panel light by referring to
the number of unit bonded.
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