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2N5019 P-Channel JFET
Features
•
•
•
•
•
TO-18 Bottom View
InterFET P0099F Geometry
Typical Noise: 8 nV/√Hz
Fast Switching
RoHS Compliant
SMT, TH, and Bare Die Package options.
Drain
Gate/Case
3
2
Source
1
Applications
• Choppers
• Commutators
• Analog Switches
SOT23 Top View
Source
1
Description
3 Gate
The 30V InterFET 2N5019 JFET is targeted for
choppers and high speed commutator designs.
The on resistance is typically less than 100 Ohms
at room temperatures. The TO-18 package is
hermetically sealed and suitable for military
applications.
Drain
2
TO-92 Bottom View
Drain
3
Gate
2
Source
1
Product Summary
Parameters
BVGSS Gate to Source Breakdown Voltage
IDSS
Drain to Source Saturation Current
VGS(off) Gate to Source Cutoff Voltage
2N5019 Min
30
-5
Unit
V
mA
V
Ordering Information Custom Part and Binning Options Available
Part Number
2N5019
PN5019
SMP5019
SMP5019TR
2N5019COT
2N5019CFT
Description
Through-Hole
Through-Hole
Surface Mount
7“ Tape and Reel: Max 3,000 Pieces
13” Tape and Reel: Max 9,000 Pieces
Chip Orientated Tray
(COT Waffle Pack)
Chip Face-up Tray
(CFT Waffle Pack)
Case
TO-18
TO-92
SOT23
SOT23
Packaging
Bulk
Bulk
Bulk
Minimum 1,000 Pieces
Tape and Reel
COT
400/Waffle Pack
CFT
400/Waffle Pack
Disclaimer: It is the Buyers responsibility for designing, validating and testing the end application under all field use cases and
extreme use conditions. Guaranteeing the application meets required standards, regulatory compliance, and all safety and
security requirements is the responsibility of the Buyer. These resources are subject to change without notice.
IF35085.R00
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Electrical Characteristics
Maximum Ratings (@ TA = 25°C, Unless otherwise specified)
VRGS
IFG
PD
P
TJ
TSTG
Parameters
Reverse Gate Source and Gate Drain Voltage
Continuous Forward Gate Current
Continuous Device Power Dissipation
Power Derating
Operating Junction Temperature
Storage Temperature
Value
30
50
300
3
-55 to 125
-65 to 150
Unit
V
mA
mW
mW/°C
°C
°C
Static Characteristics (@ TA = 25°C, Unless otherwise specified)
2N5019
V(BR)GSS
VGS(OFF)
VDS(ON)
IGSS
IDSS
Parameters
Gate to Source
Breakdown Voltage
Gate to Source
Cutoff Voltage
Drain to Source
ON Voltage
Gate to Source
Reverse Current
Drain to Source
Saturation Current
Conditions
Min
IG = 1μA,VDS = 0V
30
Unit
V
VDS = -15V, ID = -1μA
5
V
VGS = 0V, ID = -3
-0.5
V
VGS = 15V, VDS = 0V
2
nA
VDS = -20V, VGS = 0V
(Pulsed)
ID(OFF) Drain Cutoff Current
VDS = -15V, VGS = 7, TA = 150°C
IDGO
VDS = -15V, IS = 0A, TA = 150°C
Drain Reverse Current
Max
-5
mA
-10
-10
-2
-3
nA
μA
nA
μA
Max
Unit
150
Ω
45
pF
10
pF
V
15
ns
75
ns
100
ns
25
ns
Dynamic Characteristics (@ TA = 25°C, Unless otherwise specified)
2N5019
RDS(ON)
Parameters
Drain to Source
ON Resistance
Ciss
Input Capacitance
Crss
Reverse Transfer
Capacitance
td
Turn-On Delay Time
tr
Rise Time
tf
Fall Time
td(off)
Turn-Off Delay Time
2N5019
Document Number: IF35085.R00
Conditions
VGS = 0V, ID = 0A, f = 1kHz
VDS = -15V, VGS = 0V,
f = 1MHz
VDS = 0V, VGS = 7,
f = 1MHz
VDD = -6V, VGS(ON) = 0V
ID(ON) = -3mA, VGS(OFF) = 7V
VDD = -6V, VGS(ON) = 0V
ID(ON) = -3mA, VGS(OFF) = 7V
VDD = -6V, VGS(ON) = 0V
ID(ON) = -3mA, VGS(OFF) = 7V
VDD = -6V, VGS(ON) = 0V
ID(ON) = -3mA, VGS(OFF) = 7V
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December, 2018
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2N5019
SOT23 (TO-236AB) Mechanical and Layout Data
Package Outline Data
1.
2.
3.
4.
5.
6.
All linear dimensions are in millimeters.
Package weight approximately 0.12 grams
Molded plastic case UL 94V-0 rated
For Tape and Reel specifications refer to
InterFET CTC-021 Tape and Reel Specification,
Document number: IF39002
Bulk product is shipped in standard ESD shipping
material
Refer to JEDEC standards for additional
information.
Suggested Pad Layout
1.
2.
2N5019
Document Number: IF35085.R00
3 of 5
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All linear dimensions are in millimeters.
The suggested land pattern dimensions have been
provided for reference only. A more robust pattern
may be desired for wave soldering.
InterFET Corporation
December, 2018
InterFET
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Technical
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2N5019
TO-18 Mechanical and Layout Data
Package Outline Data
1.
2.
3.
4.
All linear dimensions are in millimeters.
Package weight approximately 0.29 grams
Bulk product is shipped in standard ESD shipping
material
Refer to JEDEC standards for additional
information.
Suggested Through-Hole Layout
1.
2.
2N5019
Document Number: IF35085.R00
4 of 5
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All linear dimensions are in millimeters.
The suggested land pattern dimensions have been
provided as a straight lead reference only. A more
robust pattern may be desired for wave soldering
and/or bent lead configurations.
InterFET Corporation
December, 2018
InterFET
Product
Folder
Technical
Support
Order
Now
2N5019
TO-92 Mechanical and Layout Data
Package Outline Data
1.
2.
3.
4.
5.
All linear dimensions are in millimeters.
Package weight approximately 0.19 grams
Molded plastic case UL 94V-0 rated
Bulk product is shipped in standard ESD shipping
material
Refer to JEDEC standards for additional
information.
Suggested Through-Hole Layout
1.
2.
2N5019
Document Number: IF35085.R00
5 of 5
www.InterFET.com
All linear dimensions are in millimeters.
The suggested land pattern dimensions have been
provided as a straight lead reference only. A more
robust pattern may be desired for wave soldering
and/or bent lead configurations.
InterFET Corporation
December, 2018