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Manpower Methods Machines Materials Measurements Environment
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Operator Reflow Jig Component Mounting Temperature
expertise process
quality program and humidity
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Inadequate Popping Bent Defective Speed too High
training/ components/warped components/ fast/slow temperature/
experience dropping
incompatibility
humidity
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Incorrect Solder Mounter Head nozzle Unsuitable Low
component paste setup/ wear/
component yield
handling/ placement program clogging/ design/ rate
inspection
damage/ quality
misalignment/
contamination
| Potential Causes
| Likelihood | Impact | Suggested Solutions
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|------------------------------|------------|--------|------------------------------------------------------------|
| Operator expertise
| Low
| Low | Provide adequate training and ensure skilled operators. |
| Reflow process
| High
| High | Optimize temperature and timing for specific components. |
| Jig
| Medium | High | Inspect and repair jigs, or replace if necessary.
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| Component quality
| Low
| High | Inspect and sort components, or use higher quality parts. |
| Mounting program
| Medium | High | Optimize mounting program for specific components.
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| Mounter speed
| Medium | High | Adjust speed to match component requirements.
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| Head nozzle wear/damage | Low
| Medium | Regularly inspect and replace nozzles, or repair if damaged.|
| Solder paste placement
| Medium | Medium | Optimize printing process for specific components.
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| Unsuitable component design | Low
| Low | Select components that are suitable for the mounting process.|
| Temperature and humidity | Medium | Medium | Monitor and control the environment to prevent issues. |
EFFECT
Unmount error at the Mounter stage
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Manpower Methods Machines Materials Environment
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Operator Mounter Nozzle Defective Temperature/
error settings issues components humidity
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Incorrect Speed Clogged Missing Unsuitable
component/ adjustment nozzle/ components/ component
nozzle/ mismatch damage incompatible design
feeder/
program
Name
Cause
Analysis Action
Time
Mounter Speed
Speed too fast or
slow
Observe and
measure speed of
the mounter
1 hour
Jig Warping
Jig is bent, warped
Inspect the jig for
30 minutes
warping or damage
Nozzle Suction
Nozzle can't suck
components
Inspect and clean
the nozzle and
feeder
1 hour
Printer Accuracy
Inspect the solder
Position of printing
paste printing
solder paste wrong
process
1 hour
Defective Parts
Mounter process
can drop or pop
parts
Inspect and sort
components for
2 hours
defects and damage
Result
Conclusion
Adjusting speed to
Mounter was
optimal rate can
operating at 20%
improve component
below optimal
placement accuracy
and reduce errors.
Straightening or
replacing the jig can
Jig was found to be
improve component
warped
placement accuracy
and reduce errors.
Regularly cleaning
nozzles and feeders
Nozzle was found to can improve
be clogged
component
placement accuracy
and reduce errors.
Adjusting the
printer can improve
Printer was found to
solder paste
be misaligned
placement accuracy
and reduce errors.
Implementing
quality control
Several defective
checks can prevent
components were
defective
found
components from
being used.
Adjusting the
Name
Cause
Analysis Action Time
Reflow Oven
Process
Process can pop
Inspect the reflow
or drop
2 hours
oven process
components
Jig Warping
Jig is bent,
warped
Solder Paste
Printing
Position of
Inspect the solder
printing solder
paste printing
1 hour
paste not correct process
Inspect the jig for
warping or
30 minutes
damage
Result
Conclusion
Implementing
additional quality
No issues with
control checks
the reflow oven can prevent
process were
components from
found
popping or
dropping during
reflow.
Straightening or
replacing the jig
can improve
Jig was found to
component
be warped
placement
accuracy and
reduce errors.
Adjusting the
printer can
Printer was found improve solder
to be misaligned paste placement
accuracy and
1.Why are there component losses detected after the
Reflow Oven process?
1. Because some components can pop or drop
during the high temperature reflow process.
2.Why do some components pop or drop during the
Reflow Oven process?
1. Because the solder paste may have been
improperly applied, resulting in insufficient or
uneven coverage on the pads.
3.Why was the solder paste applied improperly?
1. Because the printer head or stencil may not have
been properly calibrated or aligned during the
solder paste printing process.
4.Why were the printer head or stencil not properly
calibrated or aligned?
1. Because the printing equipment was not properly
maintained, calibrated, or checked for accuracy.
5.Why was the printing equipment not properly
maintained, calibrated, or checked for accuracy?
1. Because the maintenance or calibration schedule
was not followed, or the equipment was not
properly monitored for issues and maintained as
needed.
These are just some possible "Why" questions and
answers for the Reflow Oven process, and the actual root
1. Because the solder paste may have dried up or
become contaminated, leading to a blockage in the
nozzle.
2.Why did the solder paste dry up or become
contaminated?
1. Because the solder paste was not stored or
handled properly, such as being exposed to air for
too long or not being covered securely.
3.Why was the solder paste not stored or handled
properly?
1. Because there was a lack of training or standard
operating procedures for handling solder paste, or
because employees did not follow the procedures
that were in place.
4.Why was there a lack of training or standard operating
procedures?
1. Because the company may not have prioritized
training and documentation for this process, or
because there was a lack of awareness of the
importance of proper handling of solder paste.
5.Why was there a lack of awareness of the importance of
proper handling of solder paste?
1. Because the company may not have a culture of
continuous improvement, or because there may
not have been effective communication about the
programmed correctly.
2.Why was the coordinate program not set up or
programmed correctly?
1. Because there may be a lack of training or
understanding of how to set up the program
correctly, or there may be a lack of communication
between the production line workers and the
engineering team responsible for programming the
machine.
3.Why did the components need to be unmounted and
then reflowed to turn them on?
1. Because the incorrect mounting position may have
caused the components to not be properly
connected or soldered, resulting in a failed
electrical connection that required reflowing to fix.
4.Why did the incorrect mounting position result in failed
electrical connections?
1. Because the components may not have been in
the correct position or orientation to make proper
electrical contact with the board, or the solder
paste may not have been applied correctly.
5.Why were the components not in the correct position or
orientation, or why was the solder paste applied
incorrectly?
1. There may be various reasons, such as a lack of
Sure, here is an expanded Define step that includes both sets of information:
1.What is the problem?
•The problem is that chips are being lost after the Mount and Reflow Oven stages of the production line. The types of chips being lost are not specified, but it is causing delays and potentially increasing cos
2.Where and when does the problem occur?
•The problem occurs at the Mount and Reflow Oven stages of the production line. It is unclear how frequently the problem occurs or whether it is specific to certain products or orders.
3.How severe is the problem and what is the impact?
•The problem can have a significant impact on the production line's efficiency and cost, as it requires extra time and resources to replace the lost chips and fix any resulting defects. Additionally, if the proble
4.Who is affected by the problem?
•The problem affects the entire production line, including operators, engineers, and quality control personnel, as well as potentially customers who receive products with missing or defective chips.
5.What is the goal of solving the problem?
•The goal of solving the problem is to reduce the occurrence of chip loss after the Mount and Reflow Oven stages, improve the efficiency and quality of the production line, and ultimately improve customer
keep going buddy
6.What are the potential causes of the problem?
•There are several potential causes of chip loss after the Mount and Reflow Oven stages, including a bent or warped jig, reflow process issues (such as components popping or dropping), incorrect solder p
7.What data is needed to better understand the problem?
•To better understand the problem, it will be important to gather data on the frequency and location of chip loss, the types of chips that are being lost, and the impact on production, cost, and quality. Additio
8.What is the scope of the problem?
•The scope of the problem is currently unclear, as it is not known how frequently the problem is occurring, whether it is specific to certain products or orders, or whether it is limited to a specific part of the pr
9.What is the deadline for solving the problem?
•The deadline for solving the problem is currently unclear. It will be important to assess the impact of the problem on production, cost, and quality to determine whether there is an urgent need for resolution
10.Who will be responsible for solving the problem?
•The responsibility for solving the problem will likely fall on a cross-functional team that includes operators, engineers, quality control personnel, and potentially external experts or consultants. It will be important to