Design and implementation of a
3-phase, 2-Level
Voltage Source Converter
(Using discrete IGBTs)
PEEMD, Research Group, IIT-Delhi
Version V. 1.0 Jun 2017
Edition: V. 1.0, June 2017
PEEMD, Research Group,
IIT-Delhi, India.
Legal Disclaimer
The information given in this report is meant for educational and research purpose only.
However, all the data provided is considered non-binding and shall not create liability for us.
All component data referred in this report is subject to further research and development and
therefore, is to be considered exemplary only.
The publisher reserves the right not to be responsible for the accuracy, completeness or
topicality of any direct or indirect reference to or citation from law, regulations or directives
in this publication.
Edited by:
Martin Cheerangal J,
Sritam Jena,
Dr. Anandarup Das,
Faculty & Students of PEEMD Research Group, IIT-Delhi.
2
ABSTRACT
In this report, step by step design of a 2-level, 3-phase Voltage Source Converter (VSC) is
explained. A 10kVA, 415V 3-phase VSC has been designed, fabricated and tested in the labs
in IIT Delhi. The design of VSC constitutes the gate driver circuit, gate pulse divider circuit,
power circuit, rectifier unit including DC-bus capacitor and the heat sink mounting. Every
chapter is included with the schematic diagrams, PCB layouts (with track widths) and bill of
materials (BOM). Detailed pictures of each circuit design and implementation have been
presented in the report.
The report is mainly intended for students and researchers to develop and fabricate a VSC on
their own in the lab.
3
Contents
1
CHAPTER – 1: VOLTAGE SOURCE CONVERTER .................................... 9
1.1
INTRODUCTION ................................................................................................... 9
1.2
VSC SPECIFICATIONS .......................................................................................... 9
1.3
OVERVIEW OF VSC DESIGN ........................................................................... 10
2
CHAPTER – 2: GATE DRIVERS CIRCUIT ................................................. 11
2.1
INTRODUCTION ................................................................................................. 11
2.2
PROTECTIONS IN GATE DRIVER IC ..................................................................... 11
2.2.1 Active miller clamping protection........................................................ 11
2.2.2 Desaturation protection ........................................................................ 11
2.2.3 /Fault, /Reset & Ready pin functions ................................................... 12
2.3
FEATURES OF GATE DRIVER IC .......................................................................... 13
2.4
GATE DRIVER CIRCUIT DESIGN .......................................................................... 14
2.4.1 Boot-strap capacitor & diode rating ..................................................... 14
2.4.2 DESAT capacitor for blanking time ..................................................... 14
2.5
COMPONENTS & BOM ...................................................................................... 14
2.6
PICTURES SHOWING GATE DRIVER BOARD IN VSC ............................................ 17
2.7
PCB LAYOUT OF GATE DRIVER CIRCUIT ............................................................ 18
3
CHAPTER – 3: GATE PULSE DIVIDER CIRCUIT .................................... 21
3.1
INTRODUCTION ................................................................................................. 21
3.2
FUNCTION OF GATE PULSE DIVIDER CIRCUIT ..................................................... 21
3.3
SIGNALS IN AND OUT OF GATE PULSE DIVIDER CIRCUIT ..................................... 22
3.4
PROTECTION CIRCUIT ....................................................................................... 23
3.4.1 Fault protection .................................................................................... 23
3.4.2 Reset function ....................................................................................... 24
3.5
COMPONENTS & BOM ...................................................................................... 24
3.6
PICTURES SHOWINGOF GATE DIVIDER BOARD IN VSC ...................................... 25
3.7
PCB LAYOUT OF GATE DIVIDER CIRCUIT .......................................................... 27
4
CHAPTER – 4: POWER CIRCUIT ................................................................ 29
4.1
INTRODUCTION ................................................................................................. 29
4.2
SIGNALS IN AND OUT OF POWER CIRCUIT .......................................................... 29
4
4.3
COMPONENTS OF POWER CIRCUIT ..................................................................... 30
4.4
COMPONENTS & BOM ...................................................................................... 30
4.5
PICTURES SHOWINGOF POWER CIRCUIT BOARD IN VSC .................................... 31
4.6
PCB LAYOUT OF POWER CIRCUIT ...................................................................... 32
5
CHAPTER– 5: HEAT SINK DESIGN............................................................. 33
5.1
INTRODUCTION ................................................................................................. 33
5.2
LOSSES IN VSC ................................................................................................. 33
5.2.1 Conduction losses................................................................................. 33
5.2.2 Switching losses ................................................................................... 35
5.3
6
PICTURES OF HEAT SINK .................................................................................... 36
CHAPTER– 6: RECTIFIER UNIT & DC BUS CAPACITOR ..................... 37
6.1
INTRODUCTION ................................................................................................. 37
6.2
RIPPLE CURRENTS IN CAPACITOR ...................................................................... 37
6.3
POWER CAPACITOR & BRIDGE RECTIFIER .......................................................... 38
6.4
COMPONENTS & BOM ...................................................................................... 39
6.5
TOTAL COST OF VSC ......................................................................................... 40
6.6
PICTURE SHOWING CAPACITOR & BRIDGE RECTIFIER ....................................... 40
7
CHAPTER– 7: PICTURES OF COMPLETE VSC SETTINGS .................. 42
7.1
CAPACITOR MOUNTING & DC BUS PLATES ........................................................ 42
7.2
VARIOUS LUGS USED IN VSC ............................................................................ 43
7.3
DC BUS CONNECTION WITH RECTIFIER ............................................................. 44
7.4
COMPLETE VSC ................................................................................................ 45
7.5
EXPERIMENTAL RESULTS OF VSI ....................................................................... 47
7.6
PCB SPECIFICATIONS ........................................................................................ 49
7.6.1 Gate driver circuit................................................................................. 49
7.6.2 Gate pulse divider circuit ..................................................................... 49
7.6.3 Power circuit board .............................................................................. 50
5
LIST OF FIGURES
FIG. 1-1: OVERVIEW OF VOLTAGE SOURCE CONVERTER DESIGN ............................................... 10
FIG. 2-1: ACTIVE MILLER CLAMPING CIRCUIT TO PREVENT TURN ON DURING TURN OFF ............ 12
FIG. 2-2: DESAT & ACTIVE MILLER CLAMPING PROTECTION IN GATE DIVIDER CIRCUIT ........... 12
FIG. 2-3: PROTECTION EMPLOYED IN GATE DRIVER CIRCUIT ...................................................... 13
FIG. 2-4: FIGURE OF THE CORELESS TRANSFORMER EMPLOYED IN GATE DRIVER IC .................. 13
FIG. 2-5: GATE DRIVER CIRCUIT PCB ........................................................................................ 17
FIG. 2-6: FRONT VIEW OF VSC SHOWING THREE GATE DRIVER PCB’S ...................................... 17
FIG. 2-7: FRONT VIEW OF SINGLE GATE DRIVER PCB MOUNTED ON MICA BOARD ..................... 17
FIG. 2-8: TOP VIEW OF GATE DRIVER WITH HEAT SINK SEEN BEHIND ......................................... 18
FIG. 2-9: SIDE VIEW OF THE GATE DRIVER PCB SETUP ON THE HEAT SINK ................................. 18
FIG. 2-10: PCB LAYOUT OF COMPONENTS USED IN GATE DRIVER CIRCUIT ................................. 18
FIG. 2-11: TOP COPPER LAYER ROUTING OF GATE DRIVER PCB ................................................. 19
FIG. 2-12: BOTTOM COPPER LAYER ROUTING OF GATE DRIVER PCB.......................................... 19
FIG. 2-13: TOP COPPER LAYER OF GATE DRIVER PCB (WITH COPPER FILL) ................................ 20
FIG. 2-14: BOTTOM COPPER LAYER OF GATE DRIVER PCB (WITH COPPER FILL) ........................ 20
FIG. 3-1: SCHEMATIC CIRCUIT OF GATE-PULSE DIVIDER CIRCUIT............................................... 21
FIG. 3-2: FRC CONNECTOR (MALE) PIN CONFIGURATION........................................................... 23
FIG. 3-3: FAULT TRIP COMMAND TO ALL DRIVER IC................................................................... 23
FIG. 3-4: RESET CIRCUIT IN GATE PULSE DIVIDER CIRCUIT PCB ................................................ 24
FIG. 3-5: FRONT SIDE OF GATE PULSE DIVIDER CIRCUIT PCB .................................................... 25
FIG. 3-6: BACK SIDE OF GATE PULSE DIVIDER CIRCUIT PCB ..................................................... 26
FIG. 3-7: SIDE VIEW OF GATE DIVIDER PCB SHOWING THE MOUNTING ON ACRYLIC SHEET ........ 26
FIG. 3-8: GATE DIVIDER CIRCUIT PCB AS SEEN IN THE FRONT OF VSC SETUP. .......................... 26
FIG. 3-9: REVERSE SIDE OF THE GATE DIVIDER PCB SHOWING THE ACRYLIC SHEET .................. 26
FIG. 3-10: PCB LAYOUT OF COMPONENTS USED IN GATE PULSE DIVIDER CIRCUIT PCB ............. 27
FIG. 3-11: TOP COPPER AND BOTTOM COPPER LAYER OF GATE DIVIDER PCB ............................ 27
FIG. 3-12: TOP COPPER LAYER OF GATE DIVIDER PCB (WITH COPPER FILL).............................. 28
FIG. 3-13: BOTTOM COPPER LAYER OF GATE DIVIDER PCB (WITH COPPER FILL) ...................... 28
FIG. 4-1: SCHEMATICS OF POWER CIRCUIT ................................................................................ 29
FIG. 4-2: COMPONENTS IN POWER CIRCUIT PCB ....................................................................... 31
FIG. 4-3: BACK SIDE OF POWER CIRCUIT PCB ........................................................................... 31
FIG. 4-4: POWER CIRCUIT PCB MOUNTED ON HEAT SINK ........................................................... 31
6
FIG. 4-5: POWER CIRCUIT PCB SEEN WITH GATE DRIVER BOARD ............................................... 32
FIG. 4-6: TOP COPPER LAYOUT OF POWER CIRCUIT PCB ........................................................... 32
FIG. 4-7: POWER CIRCUIT PCB ROUTING OF BOTTOM COPPER LAYER ........................................ 32
FIG. 5-1: OUTPUT CHARACTERISTICS OF IGBT SWITCH ............................................................ 34
FIG. 5-2: FORWARD CURRENT & VOLTAGE CHARACTERISTICS OF POWER DIODE ........................ 34
FIG. 5-3: FIGURE SHOWING THE SWITCHING ENERGY LOSS IN AN IGBT SWITCH AND DIODE ..... 34
FIG. 5-4: AVERAGE POWER DISSIPATION OF THREE-PHASE DIODE BRIDGE RECTIFIER................. 34
FIG. 5-5: THERMAL RESISTANCE OF SWITCH & DIODE ............................................................... 35
FIG. 5-6: THERMAL RESISTANCE INCLUDING DIODE BRIDGE RECTIFIER ..................................... 35
FIG. 5-7: OVERALL THERMAL RESISTANCE FROM JUNCTION TO AMBIENT .................................. 36
FIG. 5-8: HEAT SINK WITH HOLE DRILLED FOR IGBT SWITCHES ................................................ 36
FIG. 6-1: FIGURE SHOWING VSC, WITH DIFFERENT CURRENTS IN THE CIRCUIT ......................... 37
FIG. 6-2: THE NORMALIZED RMS EQUIVALENT CENTERED DC BUS CURRENT HARMONICS FOR
SPWM, 1ST CENTERED CARRIER FREQUENCY, 2ND, 3RD & 4TH MULTIPLE CARRIER FREQUENCY
.......................................................................................................................................... 38
FIG. 6-3: SEMIKRON’S POWER CAPACITOR & DIODE BRIDGE RECTIFIER ................................. 40
FIG. 6-4: CAPACITOR STAND ...................................................................................................... 40
FIG. 6-5: CAPACITOR STAND FIXED ON THE HEAT SINK .............................................................. 41
FIG. 6-6: DIODE RECTIFIER & IGBT SWITCHES MOUNTED ON HEAT SINK .................................. 41
FIG. 7-1: POWER CAPACITORS ALONG WITH THE POWER CIRCUIT BOARD................................... 42
FIG. 7-2: DC BUS PLATES WITH THE SERIES CONNECTED POWER CAPACITORS ........................... 42
FIG. 7-3: LUGS USED IN VSC’S INTERNAL CONNECTION ........................................................... 43
FIG. 7-4: STEEL STRIP USED AS AN EXTENSION OF –VE DC BUS PLATE ....................................... 44
FIG. 7-5: DC BUS PLATES SEEN WITH BRIDGE RECTIFIER ........................................................... 44
FIG. 7-6: DC BUS PLATE SEEN IN TOP VIEW ................................................................................ 44
FIG. 7-7: FRONT VIEW OF VSC .................................................................................................. 45
FIG. 7-8: SIDE VIEW OF VSC ..................................................................................................... 45
FIG. 7-9: TOP VIEW OF VSC ...................................................................................................... 46
FIG. 7-10: ACRYLIC SHEET TO COVER VSC ............................................................................... 46
FIG. 7-11: COMPLETE 2-LEVEL VSC WORKING SETUP .............................................................. 46
FIG. 7-12: EXPERIMENTAL SETUP OF VSI FED INDUCTION MOTOR DRIVE .................................. 47
FIG. 7-13: EXPERIMENTAL RESULTS OF VSI DRIVING AN INDUCTION MOTOR ........................... 47
FIG. 7-14: RESULTS OBTAINED FOR AN INPUT DC VOLTAGE OF 586V ........................................ 48
FIG. 7-15: RESULTS OBTAINED FOR A MAXIMUM LINE CURRENT OF IM ..................................... 48
7
List of tables
TAB. 1-1: VOLTAGE SOURCE CONVERTER SPECIFICATIONS ......................................................... 9
TAB. 2-1: BOM & LIST SHOWING THE COMPONENTS USED IN GATE DRIVER CIRCUIT ............... 16
TAB. 3-1: SIGNALS FROM GATE PULSE DIVIDER CIRCUIT ........................................................... 22
TAB. 3-2: BOM & LIST SHOWING THE COMPONENTS USED IN GATE DRIVER CIRCUIT ................ 25
TAB. 4-1: SIGNALS FROM POWER CIRCUIT PCB ........................................................................ 29
TAB. 4-2: BOM & LIST SHOWING THE COMPONENTS USED IN POWER CIRCUIT ......................... 30
TAB. 6-1: BOM & LIST OF COMPONENTS USED IN RECTIFIER UNIT & OTHER PARTS OF VSC..... 39
TAB. 6-2: TOTAL COST OF VOLTAGE SOURCE CONVERTER SETUP ............................................. 40
TAB. 7-1: LUGS CONNECTING VARIOUS TERMINALS .................................................................. 43
8
1 Chapter – 1: VOLTAGE SOURCE CONVERTER
1.1 INTRODUCTION
Voltage Source Converter (VSC) is an indispensable part of a variety of power
electronic systems. It finds application in motor drives, power factor correcting equipment, grid
integration of renewable energy sources etc. Among other types of inverters, Voltage Source
Inverter (VSI) is more efficient, more robust and gives faster dynamic response. Due to these
reasons, VSC finds a suitable place in most industrial applications.
Two-level VSC’s are mostly used in low voltage, low power applications and in some
medium voltage applications. In order to obtain a better understanding of VSC, a two-level
VSC has been designed and implemented in the following report. The main idea behind
building the inverter is to get a hands-on experience in designing a gate-driver circuit, power
circuit, DC-link bus capacitor, and heat sink which forms the main constituents of a VSC.
1.2 VSC SPECIFICATIONS
S No
Ratings
Values
1
Inverter kVA
10kVA
2
DC bus voltage
600V
3
Output line voltage
415V rms
4
Output Current
15A rms
5
Switching Frequency
20KHz (max)
6
𝑉𝐶𝐸𝑆 (IGBT rating)
1200V
7
𝐼𝐶 (IGBT rating)
25A @ 100°C
Tab. 1-1: Voltage Source Converter specifications
9
1.3 OVERVIEW OF VSC DESIGN
Fig. 1-1: Overview of Voltage Source Converter design
10
2 Chapter – 2: GATE DRIVERS CIRCUIT
2.1 INTRODUCTION
Gate driver circuit contains a gate driver IC 2ED020I12-F2 (Infineon), with a bootstrap technique to drive a half bridge of the power circuit. It is an interface circuit between gate
pulse divider circuit and power circuit. This Infineon make IC is chosen as it provides
protection features like IGBT desaturation protection and active miller clamping protection.
On the left side of the driver IC, the signals are exchanged between the gate divider
circuits. This includes the input gate signal to the non-inverting terminal of driver IC, inverting
shutdown logic signal input, ready, /fault,/reset pins corresponding to the high side and low
side of the driver IC. On right is the bootstrap capacitor, diode, protections and exchange of
signals between the IGBT power circuit and driver IC.
2.2 PROTECTIONS IN GATE DRIVER IC
2.2.1 Active miller clamping protection
Active miller clamping protection circuit as shown Fig. 2-1 is employed in gate driver
circuit to prevent parasitic turn-on of IGBT switch during turn off process. During turn off, due
to the sudden rise in VCE , gate voltage rises due to the miller capacitance. When voltage reaches
the IGBT threshold, a dynamic turn on of the power switch occurs. To avoid this, the clamp
pin monitors gate voltage during turn off state. It activates additional discharge path as the gate
voltage sinks 2V below 𝑉𝐸𝐸2𝑋𝑋 .
2.2.2 Desaturation protection
Desaturation protection is employed by the DESAT pin. This pin monitors the VCE
voltage to detect desaturation caused by short circuits. If the monitored voltage is above 9V,
and a certain blanking time has expired, the desaturation protection is activated by sending an
active low signal in the /FAULT pin (refer gate pulse divider circuit for further explanation)
and the IGBT is switched off. Blanking time is adjustable by external capacitor. Desaturation
and active miller clamping protections used in the gate driver circuit is shown in Fig. 2-2.
11
Fig. 2-1: Active miller clamping circuit to prevent turn on during turn off
Fig. 2-2: DESAT & Active miller clamping protection in gate divider circuit
2.2.3 /Fault, /Reset & Ready pin functions
Active low /FAULT signal triggers the inverting shutdown input logic, which switches
off the power IGBT switch. For /RESET function, refer gate divider circuit. READY pin gives
a high and low signal depending on the DESAT pin. A high signal is given for normal working
operation (Green LED is connected) and it gives a low signal during fault condition (Red LED
is connected). Fig. 2-3 shows the functionality of above pin functions in the gate driver circuit.
All the explanation is applicable to both high side and low side circuit.
12
Fig. 2-3: Protection employed in gate driver circuit
2.3 FEATURES OF GATE DRIVER IC
The gate drive IC 2ED020I12-F2 has an added feature compared to the existing optocoupler and level shifter circuit required for isolation. It is the presence of coreless transformer
isolation provided between the input and output side of the driver IC as shown in Fig. 2-4.
The galvanic isolation is employed in both high side and low side of the driver IC. This
increases the reliability of driver IC compared to the aging of opto-coupler isolation method
and the requirement of level shifter for isolation in output side.
Fig. 2-4: Figure of the coreless transformer employed in gate driver IC
13
2.4 GATE DRIVER CIRCUIT DESIGN
2.4.1 Boot-strap capacitor & diode rating
𝑪𝑩𝑺 =
𝐼𝑄2𝑀𝐴𝑋 ∗ 𝑡𝑃 + 𝑄𝐺_𝑀𝐴𝑋 6 𝑚𝐴 ∗ 1.5𝑚𝑠 + 155 𝑛𝐶
=
≅ 𝟏𝟎 𝝁𝑭 𝒂𝒕 𝟐𝟓 𝑽
∆𝑉𝐵𝑆
1𝑉
𝑰𝑸𝟐_𝑴𝑨𝑿 = 𝑄𝑢𝑖𝑒𝑠𝑐𝑒𝑛𝑡 𝐶𝑢𝑟𝑟𝑒𝑛𝑡 𝑂𝑢𝑡𝑝𝑢𝑡 𝐶ℎ𝑖𝑝 𝑖𝑛 𝑔𝑎𝑡𝑒 𝑑𝑟𝑖𝑣𝑒𝑟 𝑑𝑎𝑡𝑎𝑠ℎ𝑒𝑒𝑡
𝒕𝑷 = 𝑀𝑎𝑥𝑖𝑚𝑢𝑚 𝑆𝑤𝑖𝑡𝑐ℎ𝑖𝑛𝑔 𝑝𝑒𝑟𝑖𝑜𝑑
𝑸𝑮_𝑴𝑨𝑿 = 𝑀𝑎𝑥𝑖𝑚𝑢𝑚 𝑡𝑜𝑡𝑎𝑙 𝑔𝑎𝑡𝑒 𝑐ℎ𝑎𝑟𝑔𝑒 𝑣𝑎𝑙𝑢𝑒 𝑜𝑓 𝐼𝐺𝐵𝑇 𝑠𝑤𝑖𝑡𝑐ℎ
∆𝑽𝑩𝑺 = 𝑉𝑜𝑙𝑡𝑎𝑔𝑒 𝑑𝑟𝑜𝑝 𝑎𝑐𝑟𝑜𝑠𝑠 𝑏𝑜𝑜𝑡𝑠𝑡𝑟𝑎𝑝 𝑐𝑎𝑝𝑎𝑐𝑖𝑡𝑜𝑟
Boot-strap diode rating: Fast recovery diode, 1200V and 1A.
2.4.2 DESAT capacitor for blanking time
𝑪𝑫𝑬𝑺𝑨𝑻 =
𝐼𝐷𝐸𝑆𝐴𝑇 ∗ 𝑇𝐷𝐸𝑆𝐴𝑇𝐵𝐿𝐴𝑁𝐾 550𝜇𝐴 ∗ 3𝜇𝑠
=
≅ 220pF
𝑉𝑅𝐸𝐹_𝐷𝐸𝑆𝐴𝑇
9
𝑻𝑫𝑬𝑺𝑨𝑻𝑩𝑳𝑨𝑵𝑲 = 𝑅𝑒𝑞𝑢𝑖𝑟𝑒𝑑 𝑏𝑙𝑎𝑛𝑘𝑖𝑛𝑔 𝑡𝑖𝑚𝑒
𝑰𝑫𝑬𝑺𝑨𝑻 = 𝐼𝑛𝑡𝑒𝑟𝑛𝑎𝑙 𝑐𝑢𝑟𝑟𝑒𝑛𝑡, 𝑡𝑎𝑘𝑒𝑛 500𝑢𝐴
𝑽𝑹𝑬𝑭_𝑫𝑬𝑺𝑨𝑻 = 𝐷𝐸𝑆𝐴𝑇 𝑟𝑒𝑓𝑒𝑟𝑒𝑛𝑐𝑒 𝑣𝑎𝑙𝑢𝑒, 𝑠𝑒𝑡 𝑖𝑛𝑡𝑒𝑟𝑛𝑎𝑙 𝑎𝑠 9𝑉
2.5 COMPONENTS & BOM
S
NO
1
s
COMPONENT
THICK FILM
1
RESISTOR,
SMD
VALUE
0Ω,
1/4W, 5%
PACK
AGE
MOUSER
PART NO.
QT
Y
UNIT
PRICE
ORDER
PRICE
SMD1206
603AC1206JR070RL
4
2.52
10.08
14
2
THICK
FILM 10Ω,
RESISTOR,
1/4W, 5%
SMD
SMD1206
603RC1206JR0710RL
1
1.26
1.26
3
THICK
FILM 50Ω,
RESISTOR,
1/4W, 1%
SMD
SMD1206
603RC1206FR0749R9L
2
1.68
3.36
4
THICK
FILM
100Ω,
RESISTOR,
1/4W, 1%
SMD
SMD1206
603RC1206FR07100RL
2
1.68
3.36
5
THICK
FILM
270Ω,
RESISTOR,
1/4W, 5%
SMD
SMD1206
603RC1206JR07270RL
5
1.26
6.30
6
THICK
FILM
820Ω,
RESISTOR,
1/4W, 1%
SMD
SMD1206
603RC1206FR07820RL
1
1.68
1.68
7
THICK
FILM
1KΩ,
RESISTOR,
1/4W, 1%
SMD
SMD1206
603RC1206FR071KL
2
1.68
3.36
8
THICK
FILM
10KΩ,
RESISTOR,
1/4W, 5%
SMD
SMD1206
603RC1206FR071KL
9
1.26
11.34
9
MULTILAYER
CERAMIC
CAPACITOR,
SMD
220pF,
50V, 10%
SMD1206
77VJ1206Y221K
XACBC
2
2.17
4.34
10
MULTILAYER
CERAMIC
CAPACITOR,
SMD
100nF,
10V, 10%
SMD1206
77VJ1206Y104K
XQCBC
8
2.31
18.48
11
MULTILAYER
CERAMIC
CAPACITOR,
SMD
1uF,
SMD1206
77VJ1206Y105K
XQTBC
3
4.62
13.86
12
MULTILAYER
CERAMIC
CAPACITOR,
SMD
SMD1206
58112063C106KA
T2A
4
15.40
61.6
13
MULTILAYER
CERAMIC
SMD1206
811
GRM31CR71E
15.89
15.89
10V, 10%
10uF,
25V, 10%
4.7uF, 10%
15
CAPACITOR,
SMD
475KA88
14
ALUMINIUM
ELECTROLYTI 100uF,
C CAPACITOR, 16V, 20%
SMD
6.3X6.
3X7.7
mm
647UUA1C101M
CL1GS
1
20.65
20.65
15
SCHOTTKY
DIODE-BAT
165
SOD323-2
726BAT165E6327
HTSA1
8
20.44
163.52
16
STTH112U
FAST
RECOVERY
DIODE
SMB
511STTH112U
3
30.10
90.30
17
GREEN
SMD
SMD1206
604APTR3216SG
C
4
6.65
26.60
18
RED LED-SMD
75mW,
20mA
SMD1206
604APT3216EC
2
7.21
14.42
19
TERMINAL
BLOCK
2P,5mm
DIL
651-1888687
4
70.5
282.00
20
FRC
CONNECTORMALE
26 Pin
DSC
653-XG2A2601
205.1
1
205.1
750mA,
40V
–
1A,
1200V
LED- 62.5mW,
20mA
TOTAL
For 3 Gate
Drivers IC’s
1
₹
957.50
3
₹
2872.50
Tab. 2-1: BOM & List showing the components used in Gate driver circuit
16
2.6 PICTURES SHOWING GATE DRIVER BOARD IN VSC
Fig. 2-5: Gate driver circuit PCB
Fig. 2-6: Front View of VSC showing three
Fig. 2-7: Front View of single gate driver
gate driver PCB’s
PCB mounted on mica board


Three FRC connector cable to power
divider circuit can be seen in Fig. 2-6
Two Screws are used to place the
mica board on heat sink and it can be
seen in Fig. 2-7
17
Fig. 2-8: Top View of gate driver with heat
Fig. 2-9: Side View of the gate driver PCB
sink seen behind
setup on the heat sink
Length of mica board on which 3 gate driver PCB’s are mounted: 24cmX10cm
2.7 PCB LAYOUT OF GATE DRIVER CIRCUIT
Fig. 2-10: PCB layout of components used in gate driver circuit
18
Fig. 2-11: Top copper layer routing of gate driver PCB
Fig. 2-12: Bottom copper layer routing of gate driver PCB
19
Fig. 2-13: Top copper layer of gate driver PCB (with Copper fill)
Fig. 2-14: Bottom copper layer of gate driver PCB (with Copper fill)
20
3 Chapter – 3: GATE PULSE DIVIDER CIRCUIT
3.1 INTRODUCTION
Gate pulse divider circuit is the interface between dead band circuit and the half bridge
gate driver circuit. This divider circuit segregates the gating pulse required for three gate driver
circuits along with the short circuit fault protection.
Fig. 3-1: Schematic circuit of Gate-pulse divider circuit
3.2 FUNCTION OF GATE PULSE DIVIDER CIRCUIT
This circuit receives gating signals from dead band circuit and fault signal input (if any)
from the gate driver circuit. The six gating signals are sent to three individual gate driver circuit
through FRC cable and three sets of regulated +5V DC and +15V DC as well. There is a reset
button to reset IGBT switches after fault. The circuit schematics is shown in Fig. 3-1.
3.3 SIGNALS IN AND OUT OF GATE PULSE DIVIDER CIRCUIT
This circuit gets input from the DSP for gating signals, +5V, +15V DC from regulated
power supply and fault signal input (if any) from the gate driver PCB. The output from this
circuit are individual FRC connector for each driver PCB, three sets of regulated +5V DC and
+15V DC to each gate driver PCB and a reset command to the gate driver IC to reset all the
switches. Following tables explains the signals in and out of the gate-pulse divider PCB.
In & Out signals of Gate pulse divider Circuit PCB
From DSP through dead band – 6 gating signals
(A,/A, B,/B, C,/C)
In
Regulated +5V and +15V DC Power supply
Fault signal input (active low) from the gate driver IC
( During short circuit – low signal is sent from driver IC )
26 pin FRC (male) connector to each driver PCB
Out
+5V and +15V DC supply to each gate driver PCB
Reset command signal to driver IC to switch off all switches
(Included in the individual FRC pin port)
Tab. 3-1: Signals from Gate pulse divider circuit
In Fig. 3-2, the FRC connector on left side is the six gating pulse required to drive the
switches and on right are the three FRC connectors to three individual gate driver circuits. The
pin description of FRC is shown in Fig. 3-2.On left - A, /A, B, /B, C, /C are the six gating pulse
and on right is the signal given to individual gate driver IC with fault protection and reset
option. INT+X (T-Top switch input, B-Bottom switch input in a leg) is the non-inverting input
of the driver IC and INT-X is the inverting input. Here, gating signals are given to the noninverting inputs.
22
Fig. 3-2: FRC connector (male) pin configuration
3.4 PROTECTION CIRCUIT
3.4.1 Fault protection
Active low fault pin (/FLT) in FRC connector to each driver IC is activated whenever
there is a huge current flow due to short circuit problem. Short circuit in the load or arm rises
the collector emitter voltage of the IGBT switches. DESAT pin of the driver IC senses this
voltage and triggers an active low signal (/FLT) if the voltage goes beyond 9V. As shown in
Fig. 3-3, all the three /FLT pin from three driver IC is given to the input of NAND gate and the
output is given to the inverting input of all three driver IC. This compliments the gating logic
of switches and turns off the IGBT.
Fig. 3-3: Fault trip command to all driver IC
23
3.4.2 Reset function
Active low reset button (/RST) in the gate divider circuit resets the driver IC, when it
has previously received a fault input. During normal working it gets ‘+5V’ from the following
reset circuit shown in Fig. 3-4.
Fig. 3-4: Reset circuit in Gate pulse divider circuit PCB
3.5 COMPONENTS & BOM
The components used and BOM used in the Gate pulse divider circuit PCB are shown
in the following table.
S
NO
COMPONENT
VALUE
PACK
AGE
MOUSER
PART NO
QT
Y
UNIT
Price
Order
Price
1
Diode-1N4001
50V,1A
DO-41
821-1N4001
1
₹ 10.43
10.43
2
CARBON FILM
RESISTOR
10KΩ,
0.25W, 5%
DO-41
603-CFR25JR-5210K
3
₹ 2.52
7.56
3
CAPACITOR CERAMIC
100nF, 10V
DIL
140-50V5104Z-RC
1
₹ 19.6
19.6
4
CAPACITOR ELECTROLYTIC
1uF, 50V
DIL
105CKE100M
1
₹ 7.10
7.1
5
CAPACITOR ELECTROLYTIC
4.7uF,25V
DIL
ECA1HM47RI
1
₹ 11.2
11.2
CAPACITOR –
100uF,
1
₹ 17.5
17.5
6
DIL
24
ECE-
ELECTROLYTIC
16V
A1CKA101
7
RESET SWITCH
SPST
(LEADS)
DIL
8
TERMINAL
BLOCK
2P,5mm
DIL
9
FRC
CONNECTORMALE
26 Pin
10
NOT GATE
11
3 I/P NAND
GATE
1
₹ 27.5
27.5
651-1888687
9
₹ 70.5
634.5
DSC
653-XG2A2601
4
₹ 205.1
820.4
14 Pin
DIL
595SN74HC14N
1
₹ 37.8
37.8
14 Pin
DIL
595SN74LS10N
1
₹ 53.2
53.2
₹
1646.7
TOTAL
Tab. 3-2: BOM & List showing the components used in gate driver circuit
3.6 PICTURES SHOWINGOF GATE DIVIDER BOARD IN VSC
Fig. 3-5: Front side of Gate pulse divider circuit PCB
25
Fig. 3-6: Back side of Gate pulse divider
Fig. 3-7: Side view of gate divider PCB
circuit PCB
showing the mounting on acrylic sheet
circuit inside
Fig. 3-8: Gate divider circuit PCB as seen in
the front of VSC setup.

Fig. 3-9: Reverse side of the gate divider
PCB showing the acrylic sheet
FRC connector cable is seen coming
out of the gate divider circuit, Also

Gate divider circuit is mounted on the
three individual FRC cables can be
front part of the acrylic sheet that covers
seen connected to three gate driver
the whole VSC
3.7 PCB LAYOUT OF GATE DIVIDER CIRCUIT
Fig. 3-10: PCB layout of components used in gate pulse divider circuit PCB
Fig. 3-11: Top copper and bottom copper layer of gate divider PCB
Fig. 3-12: Top copper layer of gate divider PCB (With Copper fill)
Fig. 3-13: Bottom copper layer of gate divider PCB (With Copper fill)
28
4 Chapter – 4: POWER CIRCUIT
4.1 INTRODUCTION
Power circuit includes the three leg of the conventional two level voltage Source
Converter. It contains 6 discrete IGBT’s and the output AC three phase power leads(R, Y, B)
as shown in the schematics Fig. 4-1.
Fig. 4-1: Schematics of Power circuit
4.2 SIGNALS IN AND OUT OF POWER CIRCUIT
In & Out signals of Power Circuit PCB
From Gate driver PCB – 6 sets of gate signal wires for
In
each IGBT (blue, yellow pair of wires)
From DC-link Capacitor – 4 connectors for +Vdc (red)
& 1 connector for –Vdc (black)
3-phase output power lead (R, Y, B) taken from the
Out
mid-point of 3 legs (Red, Yellow, Blue connector)
Tab. 4-1: Signals from power circuit PCB
29
4.3 COMPONENTS OF POWER CIRCUIT

IGBT switches are placed at the back side of the PCB shown in Fig. 4-3. In Fig. 4-2,
the AC output leads are the corresponding R, Y, B colored banana connectors.

The lower set of banana connectors are for the DC-link capacitor voltage terminals,
+Vdc and –Vdc connection (4 connectors for +Vdc and 1 connector for -Vdc).

Back to back zener diode is placed to avoid the gate emitter voltage of IGBT’s to go
beyond certain value during short circuit conditions. Here, 20V zener diode is selected.
(For more information, please refer Application note AN4507 in the appendix)
4.4 COMPONENTS & BOM
The components used and BOM used in the power circuit PCB are shown in the
following table.
S
COMPONENTS
NO
VALUE
PACK
AGE
PART NO.
QT
Y
UNIT
Price
Order
Price
1
ZENER DIODE,
ZD1-12
20V,10mA
DO-41
512BZX85C20
12
₹ 10.50
126
2
IGBT’s
1200V, 25A
TO247
726IKW25T120
6
₹ 429.10
2574.6
3
CARBON FILM
RESISTOR
1KΩ, 0.25W,
5% MCF
DO-41
603-CFR25JR-521K
6
₹ 2.52
15.12
4
POWER
CONNECTOR
BANANA
CONNECTOR
DIL
548-31602-0
8
₹ 161.00
1288
₹
4003.72
TOTAL
Tab. 4-2: BOM & List showing the components used in power circuit
30
4.5 PICTURES SHOWINGOF POWER CIRCUIT BOARD IN VSC
Fig. 4-2: Components in Power circuit PCB
Fig. 4-3: Back side of Power circuit PCB
Fig. 4-4: Power circuit PCB mounted on heat sink
31
Fig. 4-5: Power circuit PCB seen with gate driver board
4.6 PCB LAYOUT OF POWER CIRCUIT
Fig. 4-6: Top copper layout of Power circuit PCB
Fig. 4-7: Power circuit PCB routing of bottom copper layer
32
5 Chapter– 5: HEAT SINK DESIGN
5.1 INTRODUCTION
In the operation of power semiconductor switches, part of the electric energy is being
transformed into heat energy. In order for any devices to operate within desired temperature
limits, power dissipation performance must be well understood. Power dissipation or losses in
any power semiconductor switches can be classified as conduction loss and switching loss.
5.2 LOSSES IN VSC
5.2.1 Conduction losses
Conduction power loss occurs when the switch is in on position. Eq-4.1&4.2 gives the
conduction loss in an IGBT switch [Refer: AN of IGBT power loss calculation].
PCT  uCEO  ICavg  rC  ICrms 2
 1
PCT  uCEO  IO 
 2

ma  cos 1 
 1 m  cos 1 
 rC  IO 2   a


8
3

8

(4.1)
(4.2)
Conduction loss in power diode is given in the equation Eq-3&4.
PCD  uDO  I Davg  rD  I Drms 2
 1
PCD  uDO  IO 
 2

ma  cos 1 
 1 m  cos 1 
 rD  I O 2   a


8
3

8

Where,
𝒖𝑪𝑬𝑶 = IGBT on-state zero-current CE voltage (0.75 V)
𝒖𝑫𝑶 = on-state zero-current voltage drop across diode (1.25 V)
𝒓𝒄 = CE on state resistance =
𝛥𝑢𝑐𝑒
⁄𝛥𝐼 (0.045 Ω)
𝑐
𝒓𝑫 = Diode on state resistance =
𝛥𝑢𝐷
⁄𝛥𝐼 (0.025 Ω)
𝐷
𝑰𝒐 = √2 . 𝐼𝑜𝑟𝑚𝑠 (rms value of output current) (10 A)
𝑴𝒂 = Amplitude modulation index (0.98)
33
(4.3)
(4.4)
𝐜𝐨𝐬 𝜱𝟏 = Motor displacement factor (1)
In order to find the uCEO & rC , the output characteristics of IGBT is to be studied. Fig. 5-1
shows the output characteristics of Infineon IKW25T120 IGBT switch
Fig. 5-1: Output characteristics of IGBT
Fig. 5-2: Forward current & voltage
switch
characteristics of power diode
Similarly, uDO & rD , can be obtained from the forward current and forward voltage
characteristics of power diode as shown in Fig. 5-2.
Fig. 5-3: Figure showing the switching
Fig. 5-4: Average power dissipation of
energy loss in an IGBT switch and diode
three-phase diode bridge rectifier
34
5.2.2 Switching losses
Switching loss in both IGBT switch and anti-parallel power diode can be found using the
energy loss graph as shown in Fig. 5-3 . Average power dissipation in the diode bridge rectifier
can be found from the datasheet as shown in Fig. 5-4.
Total power loss, PT = PCT + PCD + Prectifier
PT  130W
Thermal dissipation from junction to ambient is given by the Eq-4.5
 JA 
RJA 
TJ  TA
PT
(4.5)
110O  30O
 0.615O C / W
130W
(4.6)
Now the thermal resistance of IGBT & diode between junction and case as given in
datasheet would be parallel connected and the effective thermal resistance is 0.3939O C / W
as shown in Fig. 5-5.
Now, the thermal resistance of paste (1.5°C/W) used in the sink is added to get
1.8939°C/W (1.5 + 0.3939). Six such parallel IGBT’s are pasted onto the sink and thus the
overall thermal resistance is considered to be in parallel and it is 1.8939 / 6  0.31565O C / W .
Thermal resistance of the three-phase diode bridge included with the above resistance is
0.288°C/W as shown in Fig. 5-6.
Fig. 5-5: Thermal resistance of switch &
Fig. 5-6: Thermal resistance including
diode
diode bridge rectifier
Overall junction to ambient thermal resistance is shown in Fig. 5-7 and the sink to ambient
thermal resistance is taken for 10A current case.
The volume of the heat sink is found from the following equation,
Volume =
𝑉𝑜𝑙𝑢𝑚𝑒 𝑅𝑒𝑠𝑖𝑠𝑡𝑎𝑛𝑐𝑒 (𝐶𝑚2 °𝐶/𝑊)
𝑇ℎ𝑒𝑟𝑚𝑎𝑙 𝑟𝑒𝑠𝑖𝑠𝑡𝑎𝑛𝑐𝑒 (°𝐶/𝑊)
=
800
0.4043
= 1980 𝐶𝑚3 , @ 0.4043 °𝐶/𝑊
Two heat sinks of volume 15X13X7.5cms are mounted on 32X30X2.5cms iron base plate.
Fig. 5-7: Overall thermal resistance from junction to ambient
5.3 PICTURES OF HEAT SINK
Fig. 5-8: Heat sink with hole drilled for IGBT switches
36
6 Chapter– 6: RECTIFIER UNIT & DC BUS CAPACITOR
6.1 INTRODUCTION
Selection of DC-link capacitor is an important part of designing the Voltage Source
Converter (VSC) circuit. In this section, a description of DC-link capacitor design and diode
bridge rectifier have been explained. In order to select a DC-link capacitor, the knowledge of
ripple currents flowing through the capacitor is necessary.
6.2 RIPPLE CURRENTS IN CAPACITOR
In the VSC circuit shown in Fig. 6-1, the ripple currents flowing in the DC-bus capacitor
can be divided into two categories. They are low frequency ripple of 300Hz ( I rh ) and high
frequency ripple of multiple carrier frequencies ( I ih ). These ripple currents in DC-bus depends
on modulation index, load power factor, PWM strategy employed, PWM-VSC carrier
frequency and grid frequency [1]. Low frequency ripple ( I rh ) is found to be 5A from Eq-1.
I rh  Pload /10 Vphrms
I rh 
12 103
10  415
(1)
= 5A
3
Where, Pload is rated load power (12KW) & V phrms is the per phase grid voltage rms value.
Fig. 6-1: Figure showing VSC, with different currents in the circuit
37
To calculate high frequency ripple current, double FFT 3-D graphics used in [2] is used
for the various operating points (shown in Fig. 6-2). For the selected operating point of
modulation index mi =0.78 and pf =0.86 and assuming motor load current of 25A (peak), the
high frequency ripple current I ih obtained is 8.075A. The total ripple current rating of DC-bus
capacitor is found to be 9.5A using the Eq-2.
IC  I rh2  Iih2
(2)
IC  52  8.0752 =9.5A
The DC-bus capacitance value is 1390µF using the Eq-3.
CDC  Pload / (240 Vripple Vphrms  f re )
CDC 
(3)
12 103
= 1390uF
0.5
415
240 
 600 
 50
100
3
Where, Vripple is 0.5% of VDC (600V) and f re is grid frequency
6.3 POWER CAPACITOR & BRIDGE RECTIFIER
The capacitor used is SEMIKRON’s SKC 3M3-40A-1, 10.1A, which is a 3300µF,
400V, 10.1A ripple current inverter grade capacitor. Two such capacitors are connected in series
to form the required capacitance. Three-phase diode bridge rectifier used is VS-36MT120 rated
for 1200V and 35A.
Fig. 6-2: The normalized rms equivalent centered DC bus current harmonics for SPWM, 1st
centered carrier frequency, 2nd, 3rd & 4th multiple carrier frequency
38
6.4 COMPONENTS & BOM
The component used and BOM of power circuit PCB is shown in the following table.
S
NO
COMPONENT
VALUE
PACK
AGE
MOUSER
PART NO
QT
Y
UNIT
Price
Order
Price
1
ALUMINIUM
ELECTROLYTIC
CAPACITOR –
SCREW
TERMINAL
3300uF,
400V,
11A
EPCOS
/TDK
871B43456A9
338M
2
5168.8
10337.6
2
BRIDGE
RECTIFIER –
3PHASE
35A,
1200V
D-63
84436MT120
1
872.9
872.9
3
BLEEDER
RESISTOR- WIRE
WOUND
25KΩ,
13W
Chassis
mount
588GW13J25
K0E
2
374.5
749
4
SNUBBER FILM
CAPACITOR - PP
Lug
type
871B32656S72
24K564
2
648.9
1297.8
5
POWER
CONNECTORS
DIL
548-316020
11
161
1771
8
LUG
571324955
30
15.47
464.1
7
9
10
0.22uF,
1250V
DC
BANAN
A
CONNE
CTOR
RING
TYPE
ACRYLIC BOX &
INSULATION
SHEET
THERMAL
SHEET
1500
500
METAL BASE &
FOR CAPACITOR
1000
TOTAL
₹
19,492.40
Tab. 6-1: BOM & List of components used in rectifier unit & other parts of VSC
39
6.5 TOTAL COST OF VSC
S No
Circuit
Cost
1
Gate driver
2,872.50
2
Gate pulse divider
1,646.79
3
Power Circuit
4,003.73
4
Rectifier, Capacitor Units & others
19,492.40
Total
₹ 28,015.41
Tab. 6-2: Total cost of Voltage Source Converter Setup
6.6 PICTURE SHOWING CAPACITOR & BRIDGE RECTIFIER
Fig. 6-3: SEMIKRON’s power capacitor & diode bridge rectifier
Fig. 6-4: Capacitor stand
40
Fig. 6-5: Capacitor stand fixed on the heat sink
Fig. 6-6: Diode rectifier & IGBT switches mounted on heat sink
41
7 Chapter– 7: PICTURES OF COMPLETE VSC SETTINGS
7.1 CAPACITOR MOUNTING & DC BUS PLATES
Fig. 7-1: Power capacitors along with the power circuit board
Fig. 7-2: DC bus plates with the series connected power capacitors
42
7.2 VARIOUS LUGS USED IN VSC
Fig. 7-3: Lugs used in VSC’s internal connection
Lug
Purpose – Connecting terminals
a
Connecting banana connectors in power circuit & DC bus plates
b
Bridge rectifier to DC bus plates & banana connectors
c
Capacitor voltages (+ve, mid-point and -ve )
Tab. 7-1: Lugs connecting various terminals
43
7.3 DC BUS CONNECTION WITH RECTIFIER
Fig. 7-4: Steel strip used as an extension of –ve DC bus plate
Fig. 7-5: DC bus plates seen with bridge rectifier
Fig. 7-6: DC bus plate seen in top view
44
7.4 COMPLETE VSC
Fig. 7-7: Front view of VSC
Fig. 7-8: Side view of VSC
45
Fig. 7-9: Top view of VSC
Fig. 7-10: Acrylic sheet to cover VSC
Fig. 7-11: Complete 2-Level VSC working setup
46
7.5 EXPERIMENTAL RESULTS OF VSI
Fig. 7-12: Experimental setup of VSI fed Induction motor drive
Fig. 7-13: Experimental results of VSI driving an Induction Motor
47
Fig. 7-14: Results obtained for an input DC voltage of 586V
Fig. 7-15: Results obtained for a maximum line current of IM
48
7.6 PCB SPECIFICATIONS
7.6.1 Gate driver circuit
Board Title:
HALF BRIDGE GATE DRIVER BOARD
Size (length x width):
99.9mm X 77.69mm/ As per Gerber file
Shape:
Rectangular
Number of Layers:
2
Component Type:
As per Gerber file
Hole diameter:
Finished hole size
Minimum Trace Width/Gap:
As per Gerber file
As per Gerber file
Minimum Hole Size:
Board Surface Finish
ENIG Immersion Gold RoHS
Solder mask:
SMOBC. Green on both sides
Electrical Test:
Required
Special Info/Instructions:
1. PCB Manufacturing process must be lead-free and
RoHS compliant.
2. PCB Manufacturing must be compliant with IPC-A6012 Class 2
Quantity:
3
7.6.2 Gate pulse divider circuit
Board Title:
GATE PULSE DIVIDER CIRCUIT BOARD
Size (length x width):
152.4mm X 88.9mm/ As per Gerber file
Shape:
Rectangular
Material:
0.063" +/- [10%] high Tg FR4
Number of Layers:
2
Component Type:
As per Gerber file
Hole diameter:
Finished hole size
Minimum Trace Width/Gap:
As per Gerber file
Minimum Hole Size:
As per Gerber file
Solder mask:
SMOBC. Green on both sides
Electrical Test:
Required
49
Special Info/Instructions:
1. PCB Manufacturing process must be lead-free and
RoHS compliant.
2. PCB Manufacturing must be compliant with IPC-A6012 Class 2
Quantity:
1
7.6.3 Power circuit board
Board Title:
INVERTER POWER CIRCUIT BOARD
Size (length x width):
255mm X 75.8mm/ As per Gerber file
Shape:
Rectangular
Material:
0.063" +/- [10%] high Tg FR4
Number of Layers:
2
Component Type:
As per Gerber file
Hole diameter:
Finished hole size
Minimum Trace Width/Gap:
As per Gerber file
Minimum Hole Size:
As per Gerber file
Copper Thickness
2oz. Cu all layers
Solder mask:
SMOBC. Green on both sides
Electrical Test:
Required
Special Info/Instructions:
1. PCB Manufacturing process must be lead-free and
RoHS compliant.
2. PCB Manufacturing must be compliant with IPC-A6012 Class 2
Quantity:
1
50
Reference
[1] A.M. Hava, U. Ayhan, V.V Aban, “A DC bus capacitor design method for various inverter
applications,” IEEE Energy Conversion Congress and Exposition (ECCE), Sep 2012.
[2] U. Ayhan, A.M. Hava, “Analysis and characterization of DC bus ripple current of two-level
inverter using the equivalent centered harmonic appraoch,” IEEE Energy Conversion Congress
and Exposition (ECCE), Sep 2011
[3] Final datasheet of Infineon’s EiceDRIVER 2ED020I12-F2, Dual IGBT Driver IC
[4] Datasheet of Infineon’s discreet IGBT IKW25T120 series
[5] Infineon AN-2006-01: Application Note for driving IGBT’s with unipolar gate voltage
[6] Infineon AN-2014-06 1EDI Compact family: Application Note for Gate driver IC.
[7] Infineon Application Note on “Explanation of discrete IGBTs’ datasheet.
[8] Infineon AN-2013-12: Application Note on “Recommendation for screw tightening torque
for IGBT discrete devices”.
[9] Infineon AN, V1.1, Jan 2009, “IGBT Power losses calculation using the datasheet
parameters” – Refer three phase AC motor drive.
[10] “How to select heat sink” by Seri Lee.
[11] Texas Instruments’ App Report SLVA462-May 2011, “Understanding thermal dissipation
& design of a heat sink”.
[12] Datasheets of all the discrete components used in VSC circuit.
51