CURRICULUM VITAE
PERSONAL INFORMATION
Name
Address
Telephone
ZAINUDIN KORNAIN, PHD
YANBU INDUSTRY COLLEGE, P.O. BOX 30436
YANBU AL- SINAIYAH, 41912, KSA
+966581286987 (H/P-Saudi Arabia)
Fax
E-mail
Nationality
Date of birth
zkornain@gmail.com / kornainz@rcyci.edu.sa
Malaysian
24th of July 1970, Seremban, Negeri Sembilan, Malaysia
WORK EXPERIENCE
• Dates (from – to)
• Name and address of employer
• Type of business or sector
• Occupation or position held
• Main activities and responsibilities
24th October 2014 – Present
Yanbu Industry College, Yanbu Al-Sinaiyah, Saudi Arabia
Department of Electronics and Instrumentation Engineering Technology
Lecturer.
Teaching Bachelor Degree students in Digital Electronics and its relevant
WORK EXPERIENCE
• Dates (from – to)
• Name and address of employer
• Type of business or sector
• Occupation or position held
• Main activities and responsibilities
1st August 2005 – 22nd October 2014
Universiti Kuala Lumpur British Malaysian Institute, Gombak, Malaysia
Department of Electronics Technology
Senior Lecturer, Dr.
Teaching students in SemiconductorTechnology, Digital Electronics and conducting research
WORK EXPERIENCE
• Dates (from – to)
• Name and address of employer
• Type of business or sector
• Occupation or position held
• Main activities and responsibilities
WORK EXPERIENCE
9th January 2008 – 30th June 2009
Freescale Semiconductor (M) Sdn. Bhd., Petaling Jaya, Malaysia
Department of Total Solution Organization
Researcher
Conducting PhD research in Electronic Packaging Failure Analysis
• Dates (from – to)
• Name and address of employer
• Type of business or sector
• Occupation or position held
Main activities and responsibilities
1st January 2006 – 31st December 2007
Universiti Kuala Lumpur British Malaysian Institute, Gombak, Malaysia
Academic Department
R&D and Post Graduate Coordinator cum Senior Lecturer
Administrator for research and post graduate activity
WORK EXPERIENCE
• Dates (from – to)
• Name and address of employer
• Type of business or sector
• Occupation or position held
• Main activities and responsibilities
1st September 2003 – 31st July 2005
Universiti Kuala Lumpur British Malaysian Institute, Kuala Lumpur, Malaysia
Electronics Section
Lecturer (Transfer from BMI to UniKLBMI)
Teaching degree and diploma
WORK EXPERIENCE
• Dates (from – to)
• Name and address of employer
• Type of business or sector
• Occupation or position held
• Main activities and responsibilities
1st July 2002 – 1st July 2003
British Malaysian Institute, Kuala Lumpur, Malaysia
Academic Department
Industrial Liaison Officer
Establish linkage between institute and industry
WORK EXPERIENCE
• Dates (from – to)
• Name and address of employer
• Type of business or sector
• Occupation or position held
Main activities and responsibilities
20th July 1999 – 31th December 2000
Sarawak Skill Development Centre, Kucing, Malaysia
Academic and Training Department
Coordinator of Pre - Higher National Diploma Programme (Seconded)
Coordinate and supervise the pre-HND programme
WORK EXPERIENCE
• Dates (from – to)
• Name and address of employer
• Type of business or sector
• Occupation or position held
Main activities and responsibilities
5th May 1998 – 26th July 1998
Rolls Royce, Derby, England
Electronics Technology Department
Industry Attachment
Training experience with aircraft engine manufacturer
WORK EXPERIENCE
• Dates (from – to)
• Name and address of employer
• Type of business or sector
• Occupation or position held
Main activities and responsibilities
1st November 1997 – 19th July 1998
British Malaysian Institute, Malaysia
Electrical and Electronics Section
Engineering Instructor ( Transfer from Tuas Polytech to BMI)
Teaching Higher National Diploma (HND) engineering module
WORK EXPERIENCE
• Dates (from – to)
• Name and address of employer
• Type of business or sector
• Occupation or position held
Main activities and responsibilities
4th December 1995 – 31st October 1997
Tuas Polytech, Kuala Lumpur, Malaysia
Electrical and Electronics Section
Engineering Instructor
Teaching Higher National Diploma (HND) engineering module
EDUCATION AND TRAINING
• Dates (from – to)
• Name and address of institution
• Principle subject
• Title of qualification awarded
• Level in national qualification
From 9th Sept 2013 – 25th Feb 2014
Universitat Politecnica de Catalunya, Barcelona, Spain
Implementation of Speech Steganography on FPGA
Areas Erasmus Mundus Post-Doctoral Research
Good
• Dates (from – to)
• Name and address of institution
• Principle subject
• Title of qualification awarded
• Level in national qualification
From Jan 2007 – May 2012
National University of Malaysia
Underfill Material Reliability in Microelectronics Packaging (FC-BGA)
PhD. In Microengineering and Nanoelectronics
Good
• Dates (from – to)
• Name and address of institution
• Principle subject
• Title of qualification awarded
• Level in national qualification
From Jun 2003 – Dec 2004
National University of Malaysia
Microelectronics specialization
MSc.in Microelectronics
Good
• Dates (from – to)
• Name and address of institution
• Principle subject
• Title of qualification awarded
• Level in national qualification
From Oct 1997 – June 1998
The City & Guilds of London Institute
City & Guilds 7304, Further and Adult Education Teaching Skill
National Vocational Qualification Level 4
Good
• Dates (from – to)
• Name and address of institution
• Principle subject
• Title of qualification awarded
• Level in national qualification
From July 1991 – July 1995
National University of Malaysia
Electrical and Electronics Application
Bachelor Engineering (Hons) in Electrical, Electronics and System
Good
PERSONAL SKILLS
AND COMPETENCES
Acquired in the course of life and career
but not necessarily covered by formal
certificates and diplomas.
MOTHER TONGUE
MALAY
OTHER LANGUAGES
• Reading skills
• Writing skills
• Verbal skills
ENGLISH
Very good
Good
Good
SOCIAL SKILLS
AND COMPETENCES
Communication and feedback, teamwork competences acquired during the activity within the
Academic Department for 18 years
Living and working with other people, in
multicultural environments, in positions
where communication is important and
situations where teamwork is essential
(for example culture and sports), etc.
ORGANISATIONAL SKILLS
AND COMPETENCES
Coordination and administration of
people, projects and budgets; at work, in
voluntary work (for example culture and
sports) and at home, etc.
TECHNICAL SKILLS
AND COMPETENCES
With computers, specific kinds of
equipment, machinery, etc.
OTHER SKILLS
AND COMPETENCES
Capacity to organize the education and scientific activity of the department, the meetings of the
department. Capacity to organize the national and international scientific conferences.
Capacity to work in the team and to coordinate the drawing up the curricula for Microelectronics
Technology for degree and master level, self-evaluation reports for the same specialization
Experience in Mentor Graphics and Microwind for IC Design Tool, Verilog/VHDL Code
Language, FPGA Application, Multisim, Labview, Microcontroller, Intel’s and Zilog’s Assembly
Language operating systems.
Experience in delivery motivational talk to local teenagers and youth. Also can guide students to
have good time management and study skills
Competences not mentioned above.
DRIVING LICENCE(S)
ADDITIONAL INFORMATION
ANNEXES
B2 and D (Motorbike and Car). Malaysian Driving License since 1995
INCLUDE IN ATTACHMENT
SEE ATTACHMENT
ATTACHMENT
RESEARCH INTERESTS
Microelectronics, Digital IC Design and Semiconductor Technology (Process and Packaging), Advanced Materials for
Microelectronics Technology
PUBLICATIONS
Book and Magazine
1.
Zainudin Kornain & Azman Jalar, “ Solution of Underfill Failure for FC-BGA Package” Publisher: Penerbit UKM 2012 – In
process of publication
International and Local Peer-Reviewed Journal
1. A. Jalar, F.A.M. Nasir, M.A.A. Hamid & Z. Kornain, “Stereometry of Voids in Solder Interconnect of Electronics Packaging”,
Journal of Engineering Technology, Vol.2 (1), pp.28-35, 2012
2. I. Ahmad, A. Jalar, Z. Kornain & U. Hashim, “Effect Of Reflow Profile (RSP Vs RTP) on Sn/3.8Ag/0.7Cu Solder Joint Strength
in Electronic Packaging”, Journal of Engineering Technology, Vol.2 (1), pp. , 2012
3.
A.M.M. Azhari, W.S. Wan Zaki, N. Zinal, B. Ishak, Z. Kornain & M. M. Abdul Jamil,”The Developement of Air Quality Monitoring
System”, Journal of Engineering Technology, Vol.1, pp. 69-73, 2011.
4.
Zainudin Kornain, Azman Jalar, Rozaidi Rasid, Shahrum Abdullah, “The Study of Underfill Epoxy Hardness in Reducing
Curing Process Time for Flip Chip Packaging” Key Engineering Material, Vol. 462-463, pp. 1194-1199, 2011 (Science Citation
Index Expanded: 2005-2006/ ISI Thomson IF : 0.224)
5.
Z.Kornain, A.Jalar, R.Rashid, C.S.Foong and T.L.Wong “Estimation of Curing Profile's Parameters for Flip Chip Packaging
using DSC and TGA” Key Engineering Materials, Vol. 467-469, pp. 950-955, 2011. (Science Citation Index Expanded: 20052006/ ISI Thomson IF : 0.224)
6.
Aendraa Azhar Abdul Aziz, Muhammad Faizol Ahmad Ibrahim1, Azman Jalar, Syarif Junaidi, Shahrum Abdullah, Mohd Nasrizal
Rashdi and Zainudin Kornain “Effects of different fillers on microstructure and tensile properties of welded AA6061-T6” Key
Engineering Material, Vol. 462 – 463 , pp. 1189-1193, 2011. (Science Citation Index Expanded: 2005-2006/ ISI Thomson IF :
0.224)
7. A. Jalar, Z.Kornain ,R. Rasid, S. Abdullah and N.K. Othman ,"The Effect of Underfill Fillet Geometry to Die Edge Stress for Flip
Chip Packaging", Advanced Material Research, Vol. 148-149, pp. 1108-1111, 2011 (SCOPUS and EI Compendex)
8. A.M.M. Azhari, W.S. Wan Zaki, N. Zinal, B. Ishak, Z. Kornain & M.M. Abdul Jamil, “The Development of Air Quality Monitoring
System”, UniKL BMI Journal of Engineering Technology, Vol. 1, pp. 69-73, 2011.
9.
Z. Kornain, A. Jalar, R. Rashid , S. Abdullah, B. Lee, ” Comparative Study of Phenolic-based and Amine-based Underfill
Material in Flip Chip Plastic Ball Grid Array Package (FC-PBGA) “ ASME Journal of Electronics Packaging, Vol. 132 (4), pp.
1012-1017, 2010 (Science Citation Index Expanded / ISI Thomson IF2009: 0.781)
10. M. F. Rosle, S. Abdullah, M. A. A. Hamid, A. R. Daud, A. Jalar, Z. Kornain “Surface Topographical of Gold Aluminide
Compound for Thermosonic Ball Bonding”, ASME Journal of Electronics Packaging, Vol. 132 (4), 2010 (Science Citation
Index/ISI Thomson, IF 2009 : 0.781)
11. Zainudin Kornain, Azman Jalar, Rozaidi Rasid, “The investigation of die back edge cracking in flip chip ceramic ball grid array
package” UTHM Journal Science and Technology, Vol. 2, pp. 135-147, 2010
12. Zainudin Kornain, Azman Jalar, Rozaidi Rasid, Shahrum Abdullah, “An Optimization of Two-Steps Curing Profile to Eliminate
Voids Formation in Underfill of HiCTE Flip Chip Packaging “ International Journal of Advanced Material Research, Vol. 97-101,
pp. 23-27, 2010 (SCOPUS and EI Compendex)
13. Z. Kornain, A. Jalar, N. Amin, R. Rasid and C.S. Foong, “Comparative Study of Different Underfill Material on Flip Chip
Ceramic Ball Grid Array Based on Accelerated Thermal Cycling “, American Journal of Applied Science and Engineering”, Vol.
3, pp. 83-89, 2010 (DOAJ)
14. Zainudin Kornain, Azman Jalar, Rozaidi Razid, Ang Ye Cheah, Muhammad Faizol Ahmad Ibrahim, Aendraa Azhar Abdul Aziz
” Characterization of Clean Flux for Die Attachment in Flip Chip Packaging” FEIIC International Journal of Engineering and
Technology, 2010,
15. Muhammad Faizol Ahmad Ibrahim, Aendraa Azhar Abdul Aziz, Azman Jalar, Syarif Junaidi, Zainudin Kornain, “The effect of
filler Al-5%Si and Al-5%Mg on Porosity Distribution of AA6061 Alumunium Alloy Joints”, FEIIC International Journal of
Engineering and Technology, 2010.
16. Aendraa Azhar Abdul Aziz, Azman Jalar, Junaidi Syarif, Zainudin Kornain, Muhammad Faizol Ahmad Ibrahim, and Mohd
Nasrizal Rashdi, “Precipitate Evolution Following Gas Metal Arc Welding of 5083H321/H116 Aluminium Alloy”, Metallurgical and
Materials Transaction B, 2010, under review (Science Citation Index/ISI Thomson, IF 2009 : 0.781)
17. Zainudin Kornain, Azman Jalar, Rozaidi Rasid, Fong Chee Seng, “Effect of Curing Profile to Eliminate the voids / black dots
formation in underfill epoxy for Hi-CTE Flip Chip Packaging” Journal of Science, Engineering and Technology, Vol. 59, pp. 374379, 2009. (SCOPUS)
Conference and Proceeding
1. Mohd Firdaus Roslan, Zainudin Kornain & Shah Rizailli Mukhtar,” Laser Doppler Technique To Detect And Analyze
Microcirculatory Blood Flow On Normal Human Skin Tissue” Poster Presentation, Asia Pacific Conference on Engineering and
Techopreneurship, Kuala Lumpur, 23-24 October 2012
2. Ameerul Syafiq Amir Fauzi, Zainudin Kornain & Shah Rizailli Mukhtar,” Detection And Analysis of Microcirculatory Blood Flow
On Atopic Eczema Of Human Skin Tissue Using Laser Doppler Technique” Poster Presentation, Asia Pacific Conference on
Engineering and Techopreneurship, Kuala Lumpur, 23-24 October 2012
3. Ashraff Kaharudin, Nurul Arif Mohamad, Muhammad Yusuff Ridzuan, Zainudin Kornain & Muhammad Rosli Abdullah,
“Development And Innovation of Fire Fighting Robot Using Intelligent Multiple Sensor” Poster Presentation, Asia Pacific
Conference on Engineering and Techopreneurship, Kuala Lumpur, 23-24 October 2012
4. Mohd Najmuddin Mohd Nasir, Zainudin Kornain & Mohd Azlan Abu,”Programable Control For Home Safety via GSM
Remote”, Poster Presentation, Asia Pacific Conference on Engineering and Techopreneurship, Kuala Lumpur, 23-24 October
2012
5. Mohd Azlan Abu, Zainudin Kornain & Muhammad Rosli Abdullah, “Design and simulation of Fuzzy Control Hydroponics
Lighting System”, Proceeding of Asia Pacific Conference on Engineering and Techopreneurship, Kuala Lumpur, 23-24 October
2012
6. Rahmat Mohd Kassim, Zainudin Kornain & Mohd Azlan Abu,” Development and Optimization of Solar Power Angular And
Direction Position For Solar Tracking System”, Proceeding of Asia Pacific Conference on Engineering and Techopreneurship,
Kuala Lumpur, 23-24 October 2012.
7. Zainudin Kornain & Mohd. Najmuddin Mohd. Nasir,” Programmable Control Home Safety via GSM Remote”, Proceeding Asia
Pacific Conference on Engineering and Techopreneurship, Kuala Lumpur, 23-24 October 2012.
8.
Z .Kornain, M.R. Abdullah & M.A. Abu, “Telemedicine System: Development of Wireless Healthcare Units with GSM and
Bluetooth Link”, Proceeding of IEEE Symposium in Industry Electronics and Application, Bandung Indonesia, 23-26 September
2012. pp. 72-77. (Scopus Index).
9. Mohd Azlan Abu, Zainudin Kornain, Muhammad Hariz Rosli & Izzudin Muhammad Iqbal,” Automated Car Braking System
using Labview”, Proceeding of IEEE Symposium in Industry Electronics and Application, Bandung Indonesia, 23-26 September
2012. pp.250 – 254. (Scopus Index).
10. Mohd Azlan Abu, Zainudin Kornain, Muhammad Hariz Rosli & Izzudin Muhammad Iqbal, “Automated Car Braking System
Using Neural Network System via Labview environment”, Proceeding of IEEE Conference on Open System, Kuala Lumpur
Malaysia 25-28 September 2012. Accepted (Scopus index)
11. Z. Kornain，A. Jalar，R. Rasid，C.S. Foong，T. L. Wong, “ Estimation of Curing Profile's Parameters for Flip Chip
Packaging using DSC and TGA “, International Conference on Material, Mechatronics and Automation, Melbourne, Australia,
15-16 January 2011. Accepted published in Journal of Key Engineering Materials.
12. Azman Jalar, Zainudin Kornain and Rozaidi Rasid," The Effect of Underfill Fillet Geometry to Die Edge Stress for Flip Chip
Packaging", 2010 International Conference in Advanced Materials and Manufacturing Process, Shenzen, China, 6-8 November
2010. Accepted published in Journal of Advanced Material Research.
13. Zainudin Kornain, Azman Jalar, Rozaidi Rasid, Shahrum Abdullah, “The Study of Underfill Epoxy Hardness in Reducing
Curing Process Time for Flip Chip Packaging “, Proceeding of International Conference on Fracture and Strength of Solid,
Kuala Lumpur, Malaysia, 7-8 June 2010, ISBN 978-983-44698-3-2. Accepted published in journal of Key Engineering Materials.
14. Zainudin Kornain, Azman Jalar, Rozaidi Razid, Ang Ye Cheah, Muhammad Faizol Ahmad Ibrahim, Aendraa Azhar Abdul Aziz
” Clean flux Selection For Die Attach Process and Its Compatibility With Underfil Epoxy for Flip Chip Packaging” Proceeding of
FEIIC Conference on Advanced Material and Processes, pp. 159-163, Kuching, Malaysia, 2-5 August 2010.
15. Muhammad Faizol Ahmad Ibrahim1, Aendraa Azhar Abdul Aziz, Azman Jalar, Syarif Junaidi, Mohd Nasrizal Rashdi, Zainudin
Kornain and Muhamad Nubli Zulkifli, “The effect of filler Al-5%Si and Al-5%Mg on Porosity Distribution of AA6061 Alumunium
Alloy Joints” Proceeding of FEIIC Conference on Advanced Material and Processes, pp. 143-147, Kuching, Malaysia, 2-5
August 2010.
16. Aendraa Azhar Abdul Aziz1 , Muhammad Faizol Ahmad Ibrahim1,
Azman Jalar1 , Syarif Junaidi2 , Nasrizal Rashdi3 and
Zainudin Kornain, “Microstructure and tensile properties of the joint gas metal arc welding the joint gas metal arc welding
AA6061-T6 “ International Conference on Fracture and Strength of Solid, Kuala Lumpur, Malaysia, 7-8 June 2010, ISBN 978983-44698-3-2 Accepted published in journal of Key Engineering Materials.
17. Zainudin Kornain, Azman Jalar, Rozaidi Rasid, Shahrum Abdullah, “An Optimization of Two-Steps Curing Profile to Eliminate
Voids Formation in Underfill of HiCTE Flip Chip Packaging”, International Conference on Manufacturing, Science and
Engineering, Zhuhai, China, 26-28 Disember 2009. Accepted published in journal of Advanced Material Research.
18. Zainudin Kornain, Azman Jalar, Rozaidi Rasid, Fong Chee Seng, “Effect of Curing Profile to Eliminate the voids / black dots
formation in underfill epoxy for Hi-CTE Flip Chip Packaging”, WCSET International Conference on Manufacturing and Industrial
Engineering, Bali, Indonesia, 25-27 November 2009. Accepted published in Journal of Science, Engineering and Technology.
(SCOPUS Index)
19. Zainudin Kornain, Azman Jalar, Shahrum Abdullah, Nowshad Amin, “Prediction of Encapsulant Performance Toward Fatigue
Properties of FC-BGA using Accelerated thermal Cycling (ATC)”, 4th WSEAS International Conference on Applied and
Theoritical Mechanics, Cairo, Egypt , 29-31 December 2008, pp 123-127, ISBN : 978-960-474-046-8. (SCOPUS Index)
20. Zainudin Kornain, Nowshad Amin, Azman Jalar, Ang Ye Cheah, “Effect of Underfill Properties to Solder Bump Reliability
Under Accelerated Temperature Cycling in HiCTE Ceramic Flip Chip Ball Grid Array”, 6 th IEEE Regional Student Conference on
Research and Development, Johor Bahru, 26-27 November, 2008.ISBN - 978-1-4244-2869-4 (SCOPUS Index).
21. Zainudin Kornain, Nowshad Amin, Azman Jalar, Ang Ye Cheah, “Effect of Silica Filler in Reducing Mold Void in PBGA (Plastic
Ball Grid Array) Packages”, 6th Regional IEEE Student Conference on Research and Development, Johor Bahru, 26-27
November, 2008. ISBN - 978-1-4244-2869-4 (SCOPUS Index).
22. Mohd Firdaus Karman, Hisham Mat Hussin, Zainudin Kornain, “The Development of Watermelon Ripeness Tester Using
Infrared (IR) System ”, 6th Regional IEEE Student Conference on Research and Development, Johor Bahru, 26-27 November,
2008. ISBN - 978-1-4244-2869-4 (SCOPUS Index)
23. Zainudin Kornain, Nowshad Amin, Azman Jalar, Ibrahim Ahmad, Ang Ye Cheah, “Effect of silver nanoparticles filler to
electrical properties in electrically conductive adhesive (ECA)”, Proceeding of 15 th Regional Symposium on Chemical
Engineering , Kuala Lumpur, 2-3 December, 2008. Vol.2, pp. 981-986. ISBN 978-983-2982-23-4
24. Zainudin Kornain, Nowshad Amin, Azman Jalar, Ang Ye Cheah and Ibrahim Ahmad, “Effect of Treated Silver Nanoparticles to
Electrical Conductivity Improvement of Electrically Conductive Adhesive (ECA)”, Proceeding of IEEE International Conference
on Semiconductor Electronics (ICSE), 25-27 November, 2008, pp. 388-393, ISBN: 978-1-4244-2561-7. (SCOPUS Index)
25. Nowshad Amin, Ang Ye Cheah, Zainudin Kornain, and Ibrahim Ahmad,” The Effect of Clean and No-clean Flux in Enhancing
the Wettability of Eutectic Solder Bump Flip Chip PBGA”, IEEE International Conference on Semiconductor Electronics (ICSE),
Johor Baharu, Malaysia, 25-27 November, 2008. pp. 549-554, ISBN: 978-1-4244-2561-7. (SCOPUS Index)
26. Zainudin Kornain, Ang Ye Cheah, Nowshad Amin and Azman Jalar, “An Approach on Underfill Material Selection for the low-k
Flip Chip Plastic Ball Grid Array (FCPBGA)”, 33rd IEEE International Electronics Manufacturing Conference (IEMT), Penang,
Malaysia, 4-6 November, 2008. (SCOPUS Index)
27. Nowshad Amin, Ang Ye Cheah and Zainudin Kornain, “Implementation Of Novel Reflow Profile Of Various Clean And No
Clean Fluxes To Enhance Flux Stability And Oxide Layer Removal Of The High Lead Solder Bump”, 33 rd IEEE International
Electronics Manufacturing Conference, Penang, Malaysia (IEMT), 4-6 November, 2008. (SCOPUS Index)
28. Z.Kornain, Y.C.Ang, Z.Y.Lam, N.Amin and A.Jalar,” An Investigation of Die Back Edge Cracking in Flip Chip Ceramic Ball Grid
Array Package (FC-CBGA)”, Engineering Postgraduate Conference, Kajang, Selangor, Malaysia, 21-22 October 2008.
29. Z.Y.Lam, Z.Kornain, Y.C.Ang and N.Amin ,” Practical Analysis on Pogo Pin Test Fixture Induced Mechanical Damages and Its
Root Causes”, Engineering Postgraduate Conference, Kajang, Selangor, Malaysia, 21-22 October 2008.
30. Ang Ye Cheah, Nowshad Amin, Zainudin Kornain and Lam Zi Yi ,” Study on Various Types of Clean and No-Clean Flux on the
Flux Stability by Using Thermal Gravimetric Analyzer (TGA)”, Engineering Postgraduate Conference, Kajang, Selangor,
Malaysia, 21-22 October 2008
31. Gary D Steffen, Iskandar Hack, Zainudin Kornain, Abdul Halim Ali, “Providing International Experience through Studying
Abroad for Engineering Technology Student “,
2007
American Society of American Engineering Educator's Conference, Hawaii,
32. Zainudin Kornain , Ibrahim Ahmad, Mohd Faizul Idros, “ Study of Lifetime Prediction of NMOS Transistor Due to Hot Carrier
Effect”, IEEE Conference on Optoelectronic and Microelectronics Material and Device (COMMAD), 6-8 Dec , Perth, Australia,
2006, pp. 298-301, ISBN 1-4244-0578-5. (SCOPUS Index)
33. Hisham Mat Hussin , Zainudin Kornain , “Accessing the Intel’s 8051-based device controller via internet application : Termite
Detector “, STRG 06038, 2006/2007.
34. Zainudin Kornain, “Komitmen Industri Dalam Membantu Penyusunan Program Pembangunan Kemahiran dan Kompetensi
bagi Memenuhi Tuntutan Negara”, National Student Development Conference, Kuala Lumpur, Malaysia , 8-9 August 2006
35. S.H. Abdullah, I. Ahmad, Z. Kornain , “Solder Joint Reliability and Crack Growth Characteristics of WSP Using Double and
Tripple Zincation ”, IEEE National Symposium on Microelectronics, Kuching, Malaysia, 21 – 24 December 2005. (SCOPUS
Index)
36. Faizul Akmar Tajul Arif, Zainudin Kornain, “Intercom System and Monitoring Using Lab View” 1st Annual UniKL-BMI Internal
Seminar, (IS2005), Malaysia, 17 November 2005
37. Irwan Ibrahim, Zainudin Kornain, “Wireless Car Park Monitoring System,” 1st Annual UniKL-BMI Internal Seminar, (IS2005),
Malaysia, 17 November 2005
38. Zainudin Kornain and Ibrahim Ahmad, “Temperature and Zincation Process Effect on Electrical Resistivity of Al Bond Pad for
UBM”, IEEE International Conference on Semiconductor Electronics, Kuala Lumpur, Malaysia, 7 – 9 December 2004.
(SCOPUS Index)
AWARDS, GRANTS AND CONSULTANCY
1.
2.
Best Student of Kolej Jati, Institut Teknologi MARA (1990)
Short Term Grant Award,UniKLBMI, Accesing the Intels’s 8051-Based Device Controller Via Internet Application: Termite
Detector (2005 & 2006)
3. Author for Microlectronics Technology program for “Working paper of UniKL as Technologist Consultant for Kolej
Kemahiran Tinggi MARA, Beranang, Malaysia, 2006.
4. Skim Zamalah Pasca Siswazah –UKM-OUP-TK-16-63, 2008
5. Short Term Grant Award, UniKLBMI, Downlink Radio Access Point for ROFS for LTE Application (2011 & 2012)
6. 15 Years Excellence Service in UniKL Award -17 December 2011
7. Project entitled “Programmable Control for Home Safety via GSM Remote” – Top 20 for UniKL BMI Engineer Day (2012)
8. Project entitled “Optimization of Solar Power Angular and Direction Position for Solar Tracking System” – Gold Medal in the
Novel Research and Innovation Competition (NRIC 2012) USM, Penang. Best award of Innovation Challenge, UniKLBMI
Engineers Day 2012. Top 10 for FYP (2nd Made in UniKL) competition 2012.
9. Member of Consultancy Group for failure analysis in BTU (Base Terminal Unit) and CPE (Customer Premises Equipment)
for Telekom Malaysia, 2012
10. External Examiner for Master Theses, “Failure Analysis Using A Combination of IDDQ Scan Test and Photo Emission
Microscopy Technique For Gate Oxide Defect on CMOS VLSI Technology”, Universiti Tun Hussin Onn Malaysia, Nov 2012
11. Internal Examiner for Master Theses “ Improved Performance for Track and Hold Device for Low Power Amplifier “, UniKL
BMI, Nov. 2012
12. AREA1105023, Erasmus Mundus Scholarship for Post-Doc at Universitat Politècnica de Catalunya, Barcelona, Spain 2013
PROFESSIONAL MEMBERSHIP

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2006 – Member of Electronic Device Chapter IEEE Incorporate New York, USA
2006 – Volunteer for IEEE Teacher in Service Program (TISP)
2007- present Member of Component, Packaging and Manufacturing Technology Society Chapter, IEEE
2012 – Associate Research Fellow, Microelectronic Packaging Research Group (MIPAC), IMEN, UKM
2013 – Member of International Association of Engineer (IAEng): No. 127071
2013 – Life Member of Electronics Packaging Research Society: No. 0022
2013 - Editorial Board Member International Academy for Science & Technology Education and Research
PROFESSIONAL ACTIVITIES
1.
Technical Program Committee cum Technical Paper Reviewer, IEEE International Conference on Electronic Design
(ICED2014), Penang, 19-21 August 2014.
2. Technical Program Committee cum Technical Paper Reviewer, IEEE International Conference on Engineering Technology and
Technopreneurship (ICE2T 2014), Kuala Lumpur , 27-29 August 2014
3. Co-Inventor and Exhibitor, 25th International Invention, Innovation & Technology Exhibition (ITEX 2014), Kuala Lumpur 8-10
May 2014, Malaysia
4. Co-Inventor and Exhibitor, Invention, Innovation & Design Exposition, IIDEX 2014, Shah Alam 27 – 30 April , Malaysia
5. Technical Committee 2014 The 4th International Conference on Advanced Materials Research (ICAMR 2014), January 22-23,
2014, Riyahd, Saudi Arabia.
6. Expert Panel, Research Coordination Workshop Solder and Soldering for Electronics Packaging, 22 July 2013, Faculty of
Science and Technology, Universiti Kebangsaan Malaysia, Bangi, Malaysia
7. Technical Program Committee as Technical Paper Reviewer, IEEE Symposium in Industry Electronics and Application, Kucing
Malaysia, 22-25 September 2013
8. Inventor and Exhibitor, 24th International Invention, Innovation & Technology Exhibition (ITEX 2013), Kuala Lumpur 9-11 May
2013
9. Technical Chair cum Technical Paper Reviewer, International Conference of Advanced Material Research, Dubai 19-20
January 2013
10. Team Leader, Freescale Cup (Smart Racing Car), Universiti Teknologi MARA, Shah Alam, Malaysia,1-2 December 2012
11. Team Leader, Poster Presentation, Asia Pacific Conference on Engineering and Techopreneurship, Kuala Lumpur, 23-24
October 2012
12. Chairman, Technical Advisory Committee, Asia Pasific Conference on Engineering and Techopreneurship, Kuala Lumpur, 2324 October 2012.
13. Organizer, Academic student and staff visit to Institute of Microengeering and Nanoelectronics (IMEN), UKM, Bangi, Malaysia
4 October 2012
14. Organizer, IEEE Technical Talk on “Preview on Digital Design Technology”, UniKL BMI. 30 August 2012
15. Liaison Officer cum Team Leader, Novel Research and Innovation Competition (NRIC 2012) USM, Penang 17-19 July 2012
16. Technical Program Committee as Technical Paper Reviewer, IEEE Symposium in Industry Electronics and Application,
Bandung Indonesia, 23-26 September 2012.
17. Technical Program Committee as Technical Paper Reviewer, IEEE International Conference on Electronics Design, Systems
and Applications Kuala Lumpur, 5-6 Nov 2012(ICEDSA 2012)
18. Member of Editorial Review Board, UniKL BMI Journal of Engineering Technology, 2011-2013
19. Chairman of Technical Committee, UniKL BMI Journal of Engineering Technology, 2011-2013
20. 2006 – Chairman for Student Exchange Program between UniKL BMI and Purdue University, USA
21. 2006 – Chairman for 2nd Annual UniKL-BMI Internal Seminar 2006 (IS2006), May 2006, Malaysia
22. 2006 – Program Manager for LabView Short Course for Staff and Students , UniKL-BMI
23. 2004-2006 – Speaker/Motivator for Study Skill and Stress Management for Students, UniKL-BMI
24. 2006 – Program Manager for short course of IC Digital and Custom Designed using Menthor Graphic for Staff, UniKL-BMI
25. 2006 – Program Manager for Seminar of Writing Journal and Proceeding, UniKL-BMI
26. Technical Member, UniKL 1st Conference 2007
27. Organizer IEEE Technical Talk “Exploring The Embedded System & IC Design Technology” by Prof. Iskandar Hack (Purdue
University,USA), 1st August 2006.
28. 2005 – Committee Member for 1st Annual UniKL-BMI Internal Seminar 2005 (IS2005), November 2005, Malaysia
SEMINAR, CONFERENCE AND WORKSHOP ATTENDED
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LabView Ver. 2012 Hands On Workshop, National Instrument Academy, Kuala Lumpur Malaysia 5 July 2013
Matlab and Simulink Day 2013, Hilton Kuala Lumpur, Malaysia 28 March 2013
Technical Workshop, IEEE Symposium in Industry Electronics and Application, Bandung Indonesia, 23-26 September 2012.
FYP Workshop 2012, 21st-22nd June 2012, Ampang, Kuala Lumpur.
IEEE Technical Talk on Digital Lifestyle and Digital Home, 19 April 2012, NMES Lab, 1st Floor, Block B, Faculty of Engineering,
Multimedia University, Cyberjaya.
Workshop on Complete Guide to Matlab, 10-12 April 2012, Wisma R&D, Universiti Malaya, Kuala Lumpur, Malaysia
Workshop on Semiconductor Fabrication Technology, 7-8 March 2012, Kompleks Eureka, USM, Penang, Malaysia.
Seminar Penyelidikan (Geran-geran Penyelidikan Kementerian Pengajian Tinggi, 28 April 2011, UniKL, Jalan Sultan Ismail.
Mimos Wafer Fab Failure Analysis Free Seminar, 30 March 2011, Mimos Berhad.
International Conference on Material, Mechatronics and Automation, Melbourne, Australia, 15-16 January 2011.
The 4th Korea-Malaysia Joint Workshop on Nanotechnology, Putrajaya, 13 December 2010.
International Conference in Advanced Materials and Manufacturing Process, Shenzen, China, 6-8 November 2010.
Workshop On Scientific Paper Writing And Ethics By IMEN, 27-28 September 2010, PPS, UKM.
Workshop on X-Ray Imaging System Workshop, 24-25 June 2009, MIPAC, UKM.
International Conference on Manufacturing, Science and Engineering, Zhuhai, China, 26-28 December 2009.
WASET International Conference on Manufacturing and Industrial Engineering, Bali, Indonesia, 25-27 November 2009.
Course on DOE/Taguchi Method for Process and Optimization in Microelectronics and Packaging, 16-18 November 2009,
UKM, Bangi.
Operation and Application Training for Nanoindentor, ASPAC, UKM, 19-20 Oct 2009
Bengkel Penulisan ASPAC, 29-31 Mei 2009, Port Dickson, Malaysia
Seminar on Successful Research and Technical Writing, Faculty Engineering, 4 May 2009
Malaysian Metallurgical Conference 2008, Bangi, 3-4 December, 2008.
Workshop in IEEE 10th Electronic Technology Packaging Conference, Singapore, 9 December, 2008.
6th IEEE Student Conference on Research and Development, Johor Baharu, 26-27 November 2008.
IEEE International Conference on Semiconductor Electronics , Johor Baharu, , 25-27 November, 2008.
A Workshop on How to Write a Technical Paper, Faculty of Engineering, UKM, 27 March 2008.
Regional Symposium on Chemical Engineering, Kuala Lumpur, 2-3 December 2008
33th IEEE International Electronic Manufacturing Technology Conference, Penang, 4-6 November, 2008.
Engineering Post Graduate Conference, Kajang, Selangor, 21-22 October 2008.
Workshop on Introduction to Abaqus V6.7 for Electronic Packaging, 13-17 August 2007, UKM.
Seminar on Emerging Trend in IC and System Packaging Technology, 7 August 2007, Subang Jaya, Malaysia
Workshop on Thermal Analysis, Faculty Science Technology, UKM, 24-25 April 2007.
IEEE Conference on Optoelectronic and Microelectronics Material and Device, Perth Australia, 6-8 December, 2006.
IEMT Short Course Industry Electronic and Manufacturing Technology, KL, 2006.
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NASDEC National Student Development Conference, KL, 2006.
National Instrument Conference, KL, 2006.
Workshop in Digital IC Design Tool-FPGA Advantage, BMI, KL 2006.
Workshop in IC Design – Verilog Code, PSDC, Penang, 2005.
Workshop in Custom IC Design , BMI, KL, 2006.
Module Development for course of Semiconductor Technology for diploma and degree, Port Dickson, 2005/2006.
Seminar in writing Journal and Proceeding, BMI, 2006.
Workshop in IC Design – Verilog Code, PSDC, Penang, 2005.
IEEE National Symposium on Microelectronics, Kuching, Malaysia, 21 – 24 December 2005
IEEE International Conference on Semiconductor Electronics, Kuala Lumpur, Malaysia, 7 – 9 December 2004
SUBJECT THOUGHT
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Semiconductor Technology I -Degree
Semiconductor Technology II –Degree
Digital IC Design - Degree
Microelectronics (Process and Packaging) – HND and Diploma
Microprocessor Based System – HND and Diploma
Introduction Custom Digital IC Design - Diploma
Degree Final Project –Degree
Digital and Analogue Electronics – HND, Diploma and Degree
Engineering Mathematic – Diploma
Introduction to Digital Electronics – Degree
Digital Electronics - Degree
References
Name
Telephone No.
Email
Position
Company
:
:
:
:
:
Dr. Zulkhairi Mohd Yusof
03- 61841000
zulkhairi@bmi.unikl.edu.my
Deputy Dean (Student Affairs & Technopreneur)
Universiti Kuala Lumpur British Malaysian Institute (UniKL BMI)
Name
Telephone No.
Email
Position
Company
:
:
:
:
:
Dr. Muhammad Mahadi Abdul Jamil
016-7179179
mahadi79@gmail.com
Associate Professor
Universiti Tun Hussein Onn Malaysia (UTHM)
Name
Telephone No.
Email
Position
Company
:
:
:
:
:
Assoc. Prof. Dr. Azman Jalar
019-2539948
azmn@ukm.my
Deputy Director of Institute of Microengineering and Nanoelectronics (IMEN)
Universiti Kebangsan Malaysia (UKM)
Name
Telephone No.
Email
Position
Company
:
:
:
:
:
Ahmad Basri Zainal
019-5713159
abasri@bmi.unikl.edu.my
Deputy Director of Institute of Microengineering and Nanoelectronics (IMEN)
Universiti Kebangsan Malaysia (UKM)