SMD  Low Power LED
67-21/LK2C-S40406CADB2/2T
Features
‧PLCC-2 package
‧Top view white LED
˙High luminous intensity output
˙Wide viewing angle
˙Pb-free
˙RoHS compliant
Description
The Everlight 67-21 package has high efficacy, high CRI, low power consumption, wide viewing angle and a compact
form factor. These features make this package an ideal LED for all lighting applications.
Applications
‧ General lighting
‧ Decorative and Entertainment Lighting
‧ Indicators
‧ Illumination
‧ Switch lights
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DATASHEET
SMD  Low Power LED
67-21/LK2C-S40406CADB2/2T
Device Selection Guide
Chip
Emitted Color
Materials
InGaN
Resin Color
Neutral White
Water Clear
Absolute Maximum Ratings (TSoldering=25℃)
Parameter
Symbol
Rating
Unit
Forward Current
IF
30
mA
Peak Forward Current (Duty 1/10 @10ms)
IFP
100
mA
Power Dissipation
Pd
110
mW
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Rth J-S
65
℃/W
Junction Temperature
Tj
125
℃
Soldering Temperature
Tsol
Thermal Resistance (Junction / Soldering point)
Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
Note:
The products are sensitive to static electricity and must be carefully taken when handling products
Electro-Optical Characteristics (TSoldering=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Luminous intensity
Iv
2400
-----
3000
mcd
IF=20mA
Forward Voltage
VF
2.9
-----
3.6
V
IF=20mA
2θ1/2
-----
120
-----
deg
IF=20mA
Color Rendering Index
Ra
70
-----
-----
Reverse Current
IR
-----
-----
50
Viewing Angle
Condition
IF=20mA
μA
VR =5V
Notes:
1. Tolerance of Luminous flux: ±11%.
2. Tolerance of Forward Voltage : ±0.1V.
3. Tolerance of Color Rendering Index: ±2
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DATASHEET
SMD  Low Power LED
67-21/LK2C-S40406CADB2/2T
Bin Range of Luminous intensity
Bin Code
Min.
Max.
Unit
Condition
6C
8C
AD
2400
2600
2800
2600
2800
3000
mcd
IF=20mA
Note:
Tolerance of Luminous Intensity: ±11%
Bin Range of Forward Voltage
Group
Bin Code
Min.
Max.
Unit
Condition
B2
36
37
38
39
40
41
42
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.0
3.1
3.2
3.3
3.4
3.5
3.6
V
IF=20mA
Note:
Tolerance of Forward Voltage: ±0.1V.
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DATASHEET
SMD  Low Power LED
67-21/LK2C-S40406CADB2/2T
Bin Range of Chromaticity Coordinates
CCT
Bin Code
40K-1
4000K
40K-2
CIE_x
CIE_y
0.4006
0.4044
0.3871
0.3959
0.3828
0.3803
0.3952
Bin Code
CIE_x
CIE_y
0.3828
0.3803
0.3703
0.3726
0.3670
0.3578
0.3880
0.3784
0.3647
0.3871
0.3959
0.3952
0.3880
0.3736
0.3874
0.3828
0.3803
0.3703
0.3726
0.3784
0.3647
0.3828
0.3803
0.3898
0.3716
40K-3
40K-4
Note:
1. The value is based on driving current by 20mA.
2. Tolerance of Chromaticity Coordinates: ±0.01
The C.I.E. 1931 Chromaticity Diagram
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DATASHEET
SMD  Low Power LED
67-21/LK2C-S40406CADB2/2T
Spectrum Distribution
Typical Electro-Optical Characteristics Curves
Fig.1 - Forward Voltage Shift vs.
Junction Temperature
Fig.2 - Relative Luminous Intensity
vs. Forward Current
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
-50 -25 0
25 50 75 100
Tj - Junction Temperature (°C)
Ts=25°C
1.6
Relateive Luminous Intensity
(Normalized at 20 mA )
Forward Voltage Shift -V
0.20
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
5
10
15
20
25
30
IF - Forward Current (mA)
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DATASHEET
SMD  Low Power LED
67-21/LK2C-S40406CADB2/2T
Typical Electro-Optical Characteristics Curves
I F- Forward Current (mA)
Relative luminous intensity
y
t
i
e
s
r
nu
et
t
a
n
r
I
e
sp
um
oe
nT
i
mn
uo
Lt
i
c
en
vu
i
t
J
a
l
.
e
s
Rv
3
.
g
i
F
1.4
Fig.4 - Forward Current vs. Forward
Voltage
1.2
1.0
0.8
0.6
0.4
0.2
-50 -25
0
25
Ts=25°C
200
100
10
1
2.0
50
75 100
Tj - Junction Temperature (°C)
3.5
4.0
VF - Forward Voltage (V)
m
a
r
g
a
i
D
n
o
i
t
a
i
d
a
R
6
.
g
i
F
t
n
e
r
e
r
r
u
u
t
Ca
r
de
r
a
p
wm
re
o
FT
g
gn
nr
i
i
v
e
i
r
d
l
Do
.S
x
.
as
Mv
5
.
g
i
F
0° 10° 20°
Rth j-s=65 C/W
50
Forward Current IF (mA)
3.0
2.5
30°
40
40°
30
1.0
0.9
0.8
50°
20
0.7
70°
80°
90°
10
0
20
0
40
60
80
100
60°
0.5 0.3
0.1
0.2 0.4 0.6
Soldering Temperature TS (°C )
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DATASHEET
SMD  Low Power LED
67-21/LK2C-S40406CADB2/2T
Package Dimension
Polarity
Cathode Mark
Recommended Solder Pad
Note:
Tolerance unless mentioned is ±0.2mm; Unit = mm
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DATASHEET
SMD  Low Power LED
67-21/LK2C-S40406CADB2/2T
Moisture Resistant Packing Materials
Label Explanation
‧CPN: Customer’s Product Number
‧P/N: Product Number
‧QTY: Packing Quantity
‧CAT: Luminous Intensity Rank
‧HUE: Dom. Wavelength Rank
‧REF: Forward Voltage Rank
‧LOT No: Lot Number
Reel Dimensions
Note:
Tolerances unless mentioned ±0.1mm. Unit = mm
© 2010, Everlight All Rights Reserved. Release Date : 27.Oct.2011. Issue No: V1
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DATASHEET
SMD  Low Power LED
67-21/LK2C-S40406CADB2/2T
Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel
Note:
Tolerances unless mentioned ±0.1mm. Unit = mm
Moisture Resistant Packing Process
Label
Aluminum moisture-proof bag
Desiccant
Label
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DATASHEET
SMD  Low Power LED
67-21/LK2C-S40406CADB2/2T
Reliability Test Items and Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level：90%
LTPD：10%
No.
1
2
Items
Reflow Soldering
Test Condition
Temp. : 260℃/10sec.
Thermal Shock
H : +100℃ 5min
∫ 10 sec
Test Hours/Cycles
6 Min.
Sample Size
22 PCS.
Ac/Re
0/1
22 PCS.
0/1
200 Cycles
22 PCS.
0/1
200 Cycles
L : -10℃ 5min
3
Temperature Cycle
H : +100℃ 15min
∫ 5 min
L : -40℃ 15min
High Temperature/Humidity
Reverse Bias
High Temperature/Humidity
Operation
Ta=85℃,85%RH
1000 Hrs.
22 PCS.
0/1
Ta=85℃,85%RH,
IF = 20 mA
1000 Hrs.
22 PCS.
0/1
6
Low Temperature Storage
Ta=-40℃
1000 Hrs.
22 PCS.
0/1
7
High Temperature Storage
Ta=85℃
1000 Hrs.
22 PCS.
0/1
8
Low Temperature
Operation Life
Ta=-40℃,
IF = 30 mA
1000 Hrs.
22 PCS.
0/1
9
High Temperature
Operation/ Life#1
Ta=25℃,
IF = 30 mA
1000 Hrs.
22 PCS.
0/1
10
High Temperature
Operation/ Life#2
Ta=55℃,
IF =30 mA
1000 Hrs.
22 PCS.
0/1
11
High Temperature
Operation/ Life#3
Ta=85℃,
IF = 20 mA
1000 Hrs.
22 PCS.
0/1
4
5
© 2010, Everlight All Rights Reserved. Release Date : 27.Oct.2011. Issue No: V1
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DATASHEET
SMD  Low Power LED
67-21/LK2C-S40406CADB2/2T
Precautions for Use
1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out
will happen).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 168 Hrs under 30℃ or less and 60% RH or less. If unused
LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time,
baking treatment should be performed using the following conditions.
Baking treatment: 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
.
.x
x
a
aM
M.
c
Ce
0s
60
21
C.
x
5a
5M
2.
ec
ve
os
b0
A3
.
x
a
M
.
c
e
s
/
C
3
.
x
a
M
.
c
e
s
/
C
6
.
c
7e
1s
20
e5
v1
o~
b0
A6
g
n
i
t
a
e
h
e
r
P
.
c
Ce
0s
00
22
~1
0~
50
16
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
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DATASHEET
SMD  Low Power LED
67-21/LK2C-S40406CADB2/2T
4. Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less
than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be
careful because the damage of the product is often started at the time of the hand solder.
5. Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head
soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of
the LEDs will or will not be damaged by repairing.
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