NANYA ROAD,MUGANG ZHAOQING
CITY GUANGDONG CHINA.
LEDTECH ELECTRONICS CORP.
TEL:86-758-2875541,2870651,2877464,2876185,2877017
FAX:86-758-2878014
Http://www.ledtech.com.tw
SPECIFICATION
PART NO. : LT5K13-AA-UJF7-SA8
3.2 x 2.8mm SMD TYPE
Approved by
Checked by
Prepared by
Tung
Lian
Yu Fang
LT5K13-AA-UJF7-SA8
3.2 x 2.8mm SMD TYPE
Package Dimensions
1.9
2.8
0.8
3.6
K
2.2
3.2
2.4
0.9
0.14
A
0.6
0.8
Notes:
1. All dimensions are in mm.
2. Tolerance is ±0.25mm unless otherwise noted.
Description
LED Chip
Part No.
LT5K13-AA-UJF7-SA8
Material
Emitting Color
AlGaInP/Si
Hyper Red
Lens Color
Water Clear
VER.: 01 Date: 2006/12/30
Page: 1/7
LT5K13-AA-UJF7-SA8
3.2 x 2.8mm SMD TYPE
Absolute Maximum Ratings at Ta=25 ℃
Parameter
Symbol
Rating
Unit
Power Dissipation
PD
78
mW
Reverse Voltage
VR
5
V
D.C. Forward Current
If
30
mA
If(Peak)
100
mA
Operating Temperature Range
Topr.
-25 to +85
℃
Storage Temperature Range
Tstg.
-40 to +100
℃
Soldering Temperature
Tsld.
Peak Current(1/10Duty Cycle,0.1ms Pulse Width.)
Reflow Soldering: 260℃ for 10 sec.
Hand Soldering: 350℃ for 3 sec.
Electrical and Optical Characteristics:
Parameter
Symbol
Condition
Min.
Typ.
Luminous Intensity
IV
If=20mA
200
400
Forward Voltage
Vf
If=20mA
2.1
Peak Wavelength
λP
If=20mA
632
nm
Dominant Wavelength
λD
If=20mA
625
nm
Reverse Current
Ir
Vr=5V
Viewing Angle
2θ1/2
If=20mA
120
deg
∆λ
If=20mA
20
nm
Spectrum Line Halfwidth
Max.
Unit
mcd
2.6
100
V
µA
Notes: 1.The datas tested by IS tester.
2. Customer’s special requirements are also welcome
VER.: 01 Date: 2006/12/30
Page: 2/7
LT5K13-AA-UJF7-SA8
3.2 x 2.8mm SMD TYPE
Typical Electrical/Optical Characteristic Curves
50
500
40
400
Relative Luminous Intensity
Forward Current IF(mA)
(25℃ Ambient Temperature Unless Otherwise Noted)
30
20
10
1.4
1.6
1.8
2.0
2.2
300
200
100
0
2.4
10.0
0.0
30.0
Forward Current (mA)
Applied Voltage (V)
Forward Current VS. Applied Voltage
Forward Current VS. Luminous Intensity
50
Forward Current IF(mA)
20.0
0°
20°
10°
30°
40
30
40°
1.0
20
50°
0.9
0
60°
0.8
10
20
40
60
80
100
Ambient Temperature Ta (。C)
Ambient Temperature VS. Forward Current
70°
80°
90°
0.7
0.5
0.3
0.1
0.2
0.4
0.6
Radiation Diagram
VER.: 01 Date: 2006/12/30
Page: 3/7
LT5K13-AA-UJF7-SA8
3.2 x 2.8mm SMD TYPE
PRECAUTION IN USE
Storage
Recommended storage environment
Temperature:
5oC ~ 30oC (41oF ~ 86oF)
Humidity:
60% RH Max.
Use within 7 days after opening of sealed vapor/ESD barrier bags.
If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
Fold the opened bag firmly and keep in dry environment.
Soldering
Reflow Soldering
Lead Solder
Lead – free Solder
120~150℃
180~200℃
Pre-heat
Pre-heat time
120sec. Max.
120sec. Max.
240℃ Max.
260℃ Max.
Peak temperature
Soldering time
10sec. Max.
10sec. Max.
Condition
refer to
refer to
TemperatureTemperatureprofile 1
profile 2
*After reflow soldering rapid cooling should be avoided.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
＜1 : Lead Solder＞
240°C Max.
10sec. Max.
2.5~5°C/sec.
Pre-heating
120~150°C
120sec. Max.
60sec. Max.
Hand
Soldering
Temperature
Soldering time
350℃ Max.
3sec. Max.
(one time only)
＜2 : Lead-free Solder＞
260°C Max.
10sec. Max.
1~5°C/sec.
Pre-heating
180~200°C
120sec. Max.
60sec. Max.
1~5°C/sec.
2.5~5°C/sec.
[ Recommended soldering pad design ]
Use the following conditions shown in the figure.
1.4
1.8
1.4
2.2
(UNIT:mm)
VER.: 01 Date: 2006/12/30
Page: 4/7
LT5K13-AA-UJF7-SA8
3.2 x 2.8mm SMD TYPE
Handling of Silicone Resin LEDs
Handling Indications
During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound
Figure 1
In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
Figure 2
When populating boards in SMT production, there are basically no restrictions regarding the form
of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be
prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area.
VER.: 01 Date: 2006/12/30
Page: 5/7
LT5K13-AA-UJF7-SA8
3.2 x 2.8mm SMD TYPE
Dimensions for Tape
4.0
2.0
2.24
1.5
1.75
5.5
4.0
12.0
0.25±0.05
4.0
60.0±0.5
57
178.0± 1
Dimensions for Reel
13.2±0.5
16.2±0.5
Notes:
1.All dimensions are in mm, tolerance is±2.0mm unless otherwise noted.
2.Specifications are subject to change without notice.
VER.: 01 Date: 2006/12/30
Page: 6/7
LT5K13-AA-UJF7-SA8
3.2 x 2.8mm SMD TYPE
Packing
REEL
QUANTITY: 2,000 PCS
: LTXXXX-XX-XXX
: 3,000PCS
: B3(X:0.298±0.01;Y:0.296±0.01)
: 3.3-3.4V
: T1(700-800mcd)
: Year / Month / Day
178±1
Product NO.
QUANTITY
W/D(nm)
VF
IV(mcd)
LOT NO.
LEDTECH ELECTRONICS CORP.
PART NO :LTXXXX-XX
Q'TY
: PCS
LOT NO :XXXXXXXXX
DATE
:
BIN CODE:
溼氣敏感材料
MOISTURE SENSITIVE DEVICES
1. 在5°C~30°C密封貯藏，1年有效。
Shelf life in sealed bag : 12 months
at 5° C~30°C .
2. 開封後需在168小時內使用。
LEDTEC
H ELE
PART
NO. ：LTCTRONI
QTY
8AB3-51CS COR
LOT
P.
：40 00
PCS -UAF1
DAT NO. ： XXX
E
BIN COD ：20 XXXXXX
X
E ： X 03.06.04
moun
this bag ted withi
n
is open
ed .
INSIDE BOX
QUANTITY: 4 BAGS
TOTAL: 8,000 PCS
s after
Q'TY
: PCS
LOT NO :XXXXXXXXX
DATE
:
BIN CODE:
MOISTU 溼氣敏感
LEDTECH ELECTRONICS CORP.
PART NO :LTXXXX-XX
RE SEN 材料
1. 在5°
C~30
SITI
Shel f °C密封貯藏 VE DEV
life in
at 5°
seale d ，2年有效 ICES
bag :
。
2. 開封 C~30° C
24 mont
.
後需
在72小
hs
Devi
時內
ces
使用
72 hour have to
。
be
BAG
QUANTITY: 2,000 PCS
230±
1.0
Devices have to be mounted within
168 hours after this bag is opened .
270±1.0
2
5±
27
23
5±
2
LEDTECH ELECTRONICS CORP.
PART NO :LTXXXX-XX
75±2
Q'TY
: PCS
LOT NO :XXXXXXXXX
DATE
:
BIN CODE:
Notes:
1.All dimensions are in mm, tolerance is±2.0mm unless otherwise noted.
2.Specifications are subject to change without notice.
VER.: 01 Date: 2006/12/30
Page: 7/7