SG1846/SG2846/SG3846
Current Mode PWM Controller
Description
Features
The SG1846 family of control ICs provides the required
features to implement Fixed Frequency, Current mode
control schemes while maintaining a minimum external
parts count.
The advanced performance of this
technique can be measured in improved line regulation,
enhanced load response characteristics, and a simpler,
easier-to-design control loop. Topological advantages
include, inherent pulse-by-pulse current limiting
capability, automatic symmetry correction for push-pull
converters, and the ability to parallel “power modules”
while maintaining equal current sharing.
 Automatic Feed-forward Compensation
 Programmable Pulse by Pulse Current Limiting
 Automatic Symmetry Correction in Push-pull
Configuration
 Enhanced Load Response Characteristics
 Parallel Operation Capability for Modular Power
Systems
 Differential Current Sense Amplifier with Wide
Common-mode Range
 Double Pulse Suppression
 200mA Totem-pole Outputs
 ± 1% Bandgap Reference
 Under-voltage Lockout
 Soft-start and Shutdown Capability
 500kHz Operation
Protection circuitry includes built-in under-voltage
lockout and programmable current limit in addition to
soft start capability. A shutdown function is also
available which can initiate either a complete shutdown
with automatic restart, or latch the supply off.
Other features include fully latched operation, doublepulse suppression, dead-time adjust capability, and a
±1% trimmed bandgap reference.
High Reliability Features
Available To MIL-STD-883 – 883, ¶ 1.2.1
Available to DSCC
– Standard Microcircuit Drawing (SMD)
 SGR1846 Rad-Tolerant Version Available


Block Diagram
5.1 V
REFERENCE
REGULATOR
VIN
VREF
SYNC
RT
OSC
CT
U.V.LOCKOUT
VC
Q
A OUT
T
-CURRENT
SENSE
-
+CURRENT
SENSE
+
Q
SG1846
Output Stoge
+
X3
COMP
S R
-
Q
B OUT
S
GND
0.5 V
0.5 mA
N.I.
+
E.A.
INV.
CURRENT LIMITADJUST
SHUTDOWN
+
-
6K
350 mV
-
COMP
Figure 1 · Block Diagram
November 2014 Rev. 1.2
www.microsemi.com
© 2014 Microsemi Corporation- Analog Mixed Signal Group
1
Current Mode PWM Controller
Connection Diagrams and Ordering Information
Ambient
Temperature
-55°C to 125°C
Type
Package
Part Number
SG1846J-883B
J
16-PIN
CERAMIC
DUAL INLINE
PACKAGE
-25°C to 85°C
N
0°C to 70°C
DW
SG2846N
PACKAGE
SG3846N
0°C to 70°C
PLASTIC
SOIC
PACKAGE
C.L./SOFTSTART
VREF
CERDIP
C.L./SOFTSTART
VREF
(-) C.S.
(+) C.S.
SG2846DW
FLAT PACK
PACKAGE
-55°C to 125°C
L
20-PIN
CERAMIC
LLC
3
PACKAGE
SG1846L
CLCC
12
11
10
9
GROUND
OUTPUT A
SYNC
RT
7
8
SHUTDOWN
+VIN
OUTPUT B
VC
16
15
14
13
1
2
3
4
1
2
3
4
5
6
7
8
(-) C.S.
(+) C.S.
(+) ERROR AMP
(-) ERROR AMP
COMPENSATION
CT
SG1846L-DESC
5
6
OUTPUT B
VC
12
GROUND
OUTPUT A
11
SYNC
10
7
RT
8
9
DW Package: RoHS Complaint / Pb-free Transition DC: 0516
DW Package: RoHS / Pb-free 100% Matte Tin Lead Finish
FLATPAK
SG1846L-883B
SHUTDOWN
+VIN
5
6
(+) ERROR AMP
(-) ERROR AMP
C.L./SOFTSTART
VREF
3
16
15
14
13
COMPENSATION
CT
SG3846DW
SG1846F-DESC
1
2
3
4
N Package: RoHS Complaint / Pb-free Transition DC: 0503
N Package: RoHS / Pb-free 100% Matte Tin Lead Finish
PDIP
16-PIN
CERAMIC
F
(-) C.S.
(+) C.S.
(+) ERROR AMP
(-) ERROR AMP
COMPENSATION
CT
SOWB
4
Connection Diagram
SG1846J
16-PIN
PLASTIC DIP
16-PIN
WIDEBODY
-25°C to 85°C
SG1846J-DESC
Packaging
Type
1. N.C.
2. C.L./SOFTSTART
3. V REF
4. (-) C.S.
5. (+) C.S.
6. N.C.
7. (+) ERROR AMP
8. (-) ERROR AMP
9. COMPENSATION
10. C T
3 2
16
15
14
13
SHUTDOWN
+VIN
12
11
10
9
GROUND
OUTPUT A
SYNC
RT
OUTPUT B
VC
1 20 19
4
18
5
17
6
16
7
8
15
14
9 10 11 12 13
Notes:
1.
2.
3.
4.
5.
Contact factory for DESC part availability.
All parts are viewed from the top.
Consult factory for product availability.
The SG2846 & SG3846 is available shipped as tape & reel with the addition of a –TR suffix.
Hermetic Packages J, F, & L use Pb37/Sn63 hot solder lead finish, contact factory for availability of RoHS versions.
Absolute Maximum Ratings
Parameter
Supply Voltage (+VIN)
Collector Supply Voltage(VC)
Analog Inputs (Pins 3, 4, 5, 6, and 16)
Logic Input
Source/Sink Load current (continuous)
Source/Sink Load Current (peak, 200 ns)
Reference Load Current
Soft Start Sink Current
Sync Output Current
Error Amplifier Output Current
Oscillator Charging current (Pin 9)
2
Value
40
40
Units
V
V
-0.3V to +VIN
-0.3V to 5.5V
200
500
30
50
5
5
5
V
V
mA
mA
mA
mA
mA
mA
mA
11. N.C.
12. R T
13. SYNC
14. OUTPUT A
15. GROUND
16. N.C.
17. V C
18. OUTPUT B
19. V IN
20. SHUTDOWN
Thermal Data
Parameter
Operating Junction Temperature Hermetic (J, L, F Packages)
Operating Junction Temperature Plastic (N, DW Package)
Storage Temperature Range
Lead Temperature (Soldering, 10 Seconds)
RoHS Peak Package Solder Reflow Temp. (40 sec. max. exp.)
Values beyond which damage may occur.
1.
Pin numbers refer to ceramic J package.
2.
Value
150
150
-65 to 150
300
260 (+0, -5)
Units
°C
°C
°C
°C
°C
Value
Units
30
80
°C/W
°C/W
40
65
°C/W
°C/W
Thermal Data
Parameter
J Package:
Thermal Resistance-Junction to Case, θJC
Thermal Resistance-Junction to Ambient, θJA
N Package:
Thermal Resistance-Junction to Case, θJC
Thermal Resistance-Junction to Ambient, θJA
DW Package:
°C/W
Thermal Resistance-Junction to Case, θJC
40
°C/W
Thermal Resistance-Junction to Ambient, θJA
95
F Package:
°C/W
Thermal Resistance-Junction to Case, θJC
70
°C/W
Thermal Resistance-Junction to Ambient, θJA
115
L Package:
°C/W
Thermal Resistance-Junction to Case, θJC
35
°C/W
Thermal Resistance-Junction to Ambient, θJA
120
Notes:
Junction Temperature Calculation: TJ = TA + (PD x θJA).
1.
The above numbers for θJC are maximums for the limiting thermal resistance of the package in a standard mounting
2.
configuration. The θJA numbers are meant to be guidelines for the thermal performance of the device/PCBoard system. All of
the above assume no ambient airflow.
Recommended Operating Conditions
Parameter
Supply Voltage Range
Collector Supply Voltage Range
Source/Sink Output Current (continuous)
Source/Sink Output Current (peak 200ns)
Reference Load Current
Oscillator Frequency Range
Oscillator Timing Resistor (RT)
Oscillator Timing Capacitor (CT)
Value
8 to 40
4.5 to 40
100
200
0 to 10
1 to 500
2 to 100
1 to 100
Units
V
V
mA
mA
mA
kHz
kΩ
nF
Operating Ambient Temperature Range
SG1846
SG2846
55 to 125
25 to 85
°C
°C
°C
SG3846
Note: Range over which the device is functional.
0 to 70
3
Current Mode PWM Controller
Electrical Characteristics
Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG1846
with -55°C ≤ TA ≤ 125°C, SG2846 with -25°C ≤ TA ≤ 85°C, SG3846 with 0°C ≤ TA ≤ 70°C, +VIN = 15V. Low
duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the
ambient temperature.
Symbol
Parameter
SG1846
SG2846
Test Condition
Min Typ
SG3846
Units
Max
Min
Typ
Max
5.10
5.15
5.00
5.10
5.20
V
Reference Section
VREF
Output Voltage
TJ = 25°C, IO = 1mA
VREG
Line Regulation
VIN = 8V to 40V
5
20
5
20
mV
IREG
Load Regulation
IL = 1mA to 10mA
3
15
3
15
mV
Temperature Stability
1
Total Output Variation
Output Noise Voltage
Long Term Stability
VREFISC
4
1
1
1
0.4
Line, Load and Temperature
5.00
10Hz ≤ f ≤ 10kHz. TJ = 25°C
TJ = 125°C, 1000Hrs.
Short Circuit Output
Current
Oscillator Section
5.05
mV/°C
0.4
5.20
4.95
5.25
V
100
100
µV
5
5
mV
-10
-45
mA
39
43
47
kHz
1
2
%
VREF = 0V
-10
-45
39
43
47
2
6
OSC
Initial Accuracy
TJ = 25°C
OSCVS
Voltage Stability
VIN = 8V to 40V
1
OSCTS
Temperature Stability
Over Operating Range
1
VOH
Sync Output High Level
VOL
Sync Output Low Level
VIH
Sync Input High Level
Pin 8 = 0V
VIL
Sync Input Low Level
Pin 8 = 0V
IIL
Sync Input Current
Sync Voltage = 5.25V, Pin 8
= 0V
1
3.9
4.35
2.3
3.9
2.5
3.9
1
%
4.35
V
2.3
2.5
3.9
V
2.5
1.2
1.5
V
1.2
2.5
V
1.5
mA
Electrical Characteristics
Symbol
Parameter
SG1846
SG2846
Test Condition
Min
SG3846
Units
Typ Max Min
Typ
Max
Error AMP Section
EAVOS
Input Offset Voltage
0.5
5
0.5
10
mV
EAIIB
Input Bias Current
-0.6
-1
-0.6
-2
µA
EAIOS
Input Offset Current
40
250
40
250
nA
EACM
Common Mode Range
VIN-2V
V
EAAV
Open Loop Voltage Gain VO = 1.2V to 3V, VCM = 2V
1
VIN = 8V to 40V
VIN2V
0
0
80
105
80
105
dB
TJ = 25°C
0.7
1.0
0.7
1.0
MHz
EAUGB
Unity Gain Bandwidth
EACMRR
CMRR
VCM = 0V to 38V, VIN = 40V
75
100
75
100
dB
EAPSRR
PSRR
VIN = 8V to 40V
80
105
80
105
dB
EASNK
Output Sink Current
VID = - 15mV to -5V, VPIN 7 =
1.2V
2
6
2
6
mA
EASRC
Output Source Current
VID = 15mV to 5V, VPIN 7 =
2.5V
-0.4
-0.5
-0.4
-0.5
mA
EAVOH
High Level Output
Voltage
RL = 15kΩ (Pin 7)
4.3
4.6
4.3
4.6
V
EAVOL
Low Level Output Voltage RL = 15kΩ (Pin 7)
0.7
1
2.5
2.75
3.0
1.1
1.2
0.7
1
V
2.5
2.75
3.0
V
1.1
1.2
Current Sense Amplifier Section
CSAV
Amplifier Gain
2 &3
VPIN 3 = 0V, Pin 1 Open
3
Maximum Differential
2
Input Signal (VPIN 4 - VPIN Pin 1 Open RL = 15kΩ (Pin 7)
3)
Input Offset Voltage
2
5
VPIN 1 = 0.5V, Pin 7 Open
25
5
V
25
mV
CSCMRR
CMRR
VCM = 1V to 12V
60
83
60
83
dB
CSPSRR
PSRR
VIN = 8V to 40V
60
84
60
84
dB
CSIIB
Input Bias Current
CSIOC
Input Offset Current
CSCM
Input Common Mode
Range
Delay to Outputs
2
1
2
VPIN 1 = 0.5V, Pin 7 Open
-2.5
-10
-2.5
-10
µA
VPIN 1 = 0.5V, Pin 7 Open
0.08
1
0.08
1
µA
VIN -3
V
VIN 3
0
TJ = 25°C
0
200
500
200
500
ns
0.5
0.55 0.45
0.5
0.55
V
-10
-30
-10
-30
µA
Current Limit Adjust Section
CLIIB
Current Limit Offset
2
Voltage
VPIN 3 = 0, VPIN 4 = 0V, Pin 7
Open
Input Bias Current
VPIN 5 = VREF, VPIN 6 = 0V
0.45
5
Current Mode PWM Controller
Symbol
Parameter
SG1846
SG2846
Test Condition
SG3846
Units
Min
Typ
Max
Min
Typ
Max
250
350
400
250
350
400
mV
VIN
0
VIN
V
Shutdown Terminal Section
SD
Threshold Voltage
Input Voltage Range
SDLC
0
Minimum Latching
4
Current; (IPIN 1 )
3.0
Maximum Non-Latching
5
Current; (IPIN 1 )
SDDELAY
Delay to Outputs
1
TJ = 25°C
1.5
3.0
1.5
mA
1.5
0.8
1.5
0.8
mA
300
600
300
600
ns
Output Section
Collector Emitter
Voltage
40
40
Collector Leakage
Current
VC = 40V
Output Low Level
ISINK = 20mA
0.1
0.4
ISINK = 100mA
0.4
2.1
Output High Level
Rise Time
1
V
200
200
µA
0.1
0.4
V
0.4
2.1
V
ISOURCE = 20mA
13
13.5
13
13.5
V
ISOURCE = 100mA
12
13.5
12
13.5
V
CL = 1nF, TJ = 25°C
50
300
50
300
ns
CL = 1nF, TJ = 25°C
50
300
50
300
ns
Start-Up Threshold
7.7
8.0
7.7
8.0
V
Threshold Hysteresis
0.75
Fall Time
1
Under-Voltage Lockout Section
0.75
V
Total Standby Current
IQ
Supply Current
17
21
17
21
mA
Notes:
These parameters, although guaranteed over the recommended operating conditions, are not tested in the production.
1.
Parameter measured at trip point of latch with V PIN 5 = VREF , VPIN 6 = 0V.
2.
Amplifier gain defined as :
VPIN 4 = 0V to 1.0V
3.
Current into Pin 1 guaranteed to latch circuit in shutdown state.
4.
Current into Pin 1 guaranteed not to latch circuit in shutdown state.
5.
RT = 10kΩ, CT = 4.7nF
6.
6
Characteristic Curves
Characteristic Curves
VREF SHORT CIRCUIT CURRENT - (mA)
REFERENCE VOLTAGE - (V)
5.10
5.05
5.00
4.95
4.90
-55
-25
0
25
50
90
80
70
60
50
40
30
O
TJ = 125 C
O
TJ = 55 C
0.5
10
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
-55
-25
0
50
25
100 125
75
ERROR AMPLIFIER OUTPUT VOLTAGE - (V)
JUNCTION TEMPERATURE - ( C)
O
JUNCTION TEMPERATURE - ( C)
Figure 2 · Reference Voltage Vs.
Temperature
Figure 3 · VREF Short Circuit
Current Vs. Temperature
2.82
2.80
2.78
2.76
2.74
2.72
2.70
1.50
Figure 4 · Current Sense Threshold
Vs. Error Amplifier Output
OSCILLATOR PEAK VOLTAGE - (V)
OSCILLATOR VALLEY VOLTAGE - (V)
2.84
CURRENT SENSE GAIN - (V/V)
1.0
20
O
1.40
1.30
1.20
3.20
3.10
3.00
2.90
1.10
2.68
-55
-25
0
50
25
2.80
100 125
75
-55
JUNCTION TEMPERATURE - (OC)
-25
0
50
25
100 125
75
-55
O
JUNCTION TEMPERATURE - ( C)
Figure 5 · Current Sense Gain Vs.
Temperature
-25
0
50
25
100 125
75
O
JUNCTION TEMPERATURE - ( C)
Figure 6 · Oscillator Valley Voltage
Vs. Temperature
Figure 7 · Oscillator Peak Voltage
Vs. Temperature
220
2.6
190
VIN = 15 V
(10% ABOVE THRESHOLD)
(10% ABOVE THRESHOLD)
2.2
2.0
1.8
1.6
1.4
1.2
200
SHUTDOWN DELAY - (ns)
2.4
CURRENT SENSE DELAY - (ns)
LATCH CURRENT THRESHOLD - (mA)
1.5
0
100 125
75
C.S. VOLTAGE DIFFENTIAL - (V)
100
5.15
180
170
160
180
160
140
150
1.0
120
-55
-25
0
25
50
100 125
75
O
JUNCTION TEMPERATURE - ( C)
Figure 8 · Minimum SCR Latch
Current
-55
-25
0
25
50
75
100
125
O
JUNCTION TEMPERATURE - ( C)
Figure 9 · Current Sense Delay Vs.
Temperature
-55
-25
0
25
50
75
100
125
O
JUNCTION TEMPERATURE - ( C)
Figure 10 · Shutdown Delay To
Output Vs. Temperature
7
Current Mode PWM Controller
1.60
1.50
1.40
1.30
11.0
4.0
SATURATION VOLTAGE - (V)
ERROR AMP SINK CURRENT - (mA)
INPUT OFFSET VOLTAGE - (mV)
5.0
12.0
10.0
9.0
8.0
7.0
6.0
5.0
3.0
C
TJ = -55°
°C
TJ = 25
2.0
TJ = 12
5°C
1.0
4.0
0
-55
-55
-25
0
25
50
75
100
125
-25
0
50
25
0
100 125
75
1900
°C
25
=1
TJ
°C
5
5
=C
TJ
25°
T J=
3.0
2.0
1.0
140
120
=
C T
100
00
0.
1µ
SYNC PULSEWIDTH - (ns)
4.0
F
80
60
40
0
0
100
300
200
1800
1700
1600
=0
CT
1500
µF
. 01
1400
1300
20
500
400
RT = 8 kΩ
RT = 8 kΩ
160
SYNC PULSEWIDTH - (ns)
SATURATION VOLTAGE - (V)
2000
180
5.0
500
400
Figure 13 · Output Transistor
Saturation Voltage Vs. Output
Current (Sink Transistor)
Figure 12 · Error AMP Sink Current
Vs. Temperature
6.0
300
200
OUTPUT CURRENT - (mA)
JUNCTION TEMPERATURE - ( C)
O
JUNCTION TEMPERATURE - ( C)
Figure 11 · Error Amplifier Input
Offset Voltage Vs. Temperature
100
O
1200
OUTPUT CURRENT - (mA)
-55
-25
0
25
50
75
100 125
-55
JUNCTION TEMPERATURE - (O C)
Figure 14 · Output Transistor
Saturation Voltage Vs. Output
Current (Source Transistor)
25
50
75
100 125
Figure 16 · Sync Pulsewidth Vs.
Temperature
RT = 8 kΩ
2.85
26.5
26.0
C = 0.01µF
T
25.5
46
C = 0.001µF RT = 8 kΩ
T
45
DUTY CYCLE - (%)
OSCILLATOR FREQUENCY - (kHz)
OSCILLATOR FREQUENCY - (kHz)
0
JUNCTION TEMPERATURE - ( °C)
Figure 15 · Sync Pulsewidth Vs.
Temperature
RT = 8 kΩ
2.75
C = 0.1µF
T
44
43
42
41
40
39
2.65
25.0
38
-55
-25
0
25
50
75
100
125
O
JUNCTION TEMPERATURE - ( C)
Figure 17 · Oscillator Frequency Vs.
Temperature
8
-25
-55
-25
0
25
50
75
100
125
O
JUNCTION TEMPERATURE - ( C)
-55
-25
0
25
50
75
100
O
JUNCTION TEMPERATURE - ( C)
Figure 18 · Oscillator Frequency
Vs. Temperature
Figure 19 · Duty Cycle Vs.
Temperature
125
Application Information
Application Information
100k
.1
µF
nF
C
T =
C
T =
20
50
nF
nF
C
T =
C
T =
5
10
nF
nF
C
T =
C
T =
C
T =
20k
R (Ω)
T
2
1
nF
50k
10k
5k
2k
1k
100µsec
10µsec
1000µsec
OSCILLATOR PERIOD (µs)
Figure 20 · Oscillator Frequency Curves
5V
3V
1.2 V
IR
IR
3.7 V
SAWTOOTH(Pin 8)
C
T
R
T
OSC(Pin 10)
Id
OUTPUT DEADTIME(T )
D
Oscillator frequency is approximated by the formula: f ~
T
2.2
R C
T T
Figure 21 · Oscillator Circuit
9
Current Mode PWM Controller
VREF
VREF
0.5 mA
5
+
6
Zs
-
7
COMP
Zf
If
< 0.5 mA
Figure 22 · Error Amp Output Configuration (Error amplifier can source up to 0.5 mA)
IS
R
RS
3
+
CURRENT
SENSE
C
4
-
Figure 23 · Current Sense AMP Connections
A small RC filter may be required in some applications to reduce switch transients. Differential input allows
remote noise free switching.
10
Application Information
15
+VIN
SG1846
10
9
8
VC
SYNC
RT
OSC
A OUT
NOR
F/F
13
VIN
11
CT
VOUT
PWM
LATCH
VREF
2
REF
B OUT
NOR
14
0.5 mA
7
-
0.5 V
INV
6
5
+ -
COMP
COMP
+
+ SENSE
+
EA
NI
I/A
- SENSE
SH/DN
I LIMIT
1
FEEDBACK
4
3
16
S/D
SFT/ST
350 mV
GND
12
Figure 24 · Single Ended Boost Configuration
15
+VIN
SG1846
10
9
8
2
VC
SYNC
RT
OSC
A OUT
NOR
F/F
13
VIN
11
CT
VREF
PWM
LATCH
REF
B OUT
NOR
14
0.5 mA
7
6
5
COMP
+ 0.5 V
INV
VOUT
COMP
+
NI
EA
+
I/A
+ SENSE
- SENSE
SH/DN
FEEDBACK
1
I LIMIT
SFT/ST
4
3
16
S/D
GND
12
350 mV
Figure 25 · Buck Converter with Current Sense Winding
11
Current Mode PWM Controller
15
+VIN
SG1846
10
9
8
VC
SYNC
RT
OSC
A OUT
NOR
F/F
13
11
CT
VREF
2
PWM
LATCH
VREF
REF
B OUT
NOR
14
0.5 mA
7
6
5
COMP
+ -
-
0.5 V
INV
COMP
+
+
EA
NI
I/A
+ SENSE
- SENSE
SH/DN
FEEDBACK
1
I LIMIT
S/D
350 mV
GND
12
SFT/ST
Figure 26 · Push/Pull Converter with Slope Compensation
IS
(+) 4
RS
x3
+ -
(-) 3 ISENSE
VREF
0.5 V
0.5 mA
R1
E/A
CURRENT
LIMIT 1
R2
COMP
7
COMP
R2VREF
Peak Current (IS) is determined by the formula: IS =
R1+R2
-0.5
3RS
Figure 27 · Pulse by Pulse Current Limiting
12
4
3
16
Application Information
VREF
ISENSE
R1
+ -
CURRENT
LIMIT 1
R2
+
ʃ
-
S
S
0.5
ISS
E/A
C
VREF
16
SHUT
DOWN
+
- +
-
350 mV
Figure 28 · Soft Start and Shutdown/Restart Functions
~
CURRENT LIMIT
(PIN 1)
~
0.5 V
0
ON
SHUTDOWN
(PIN 16)
~
OFF
~
PWM
VREF
< 0.8 mA
R1
Figure 29 · Shutdown with Auto-Restart
If
< 0.8 mA, the shutdown latch commutates.
when ISS < 0.8 mA, a restart cycle will be initiated.
~
~
~
~
V
REF
> 3 mA (LATCHED OFF)
R1
Figure 30 · Shutdown without Auto-Restart (Latched)
If
> 3 mA, the device will latch off until power is recycled.
13
Current Mode PWM Controller
Package Outline Dimensions
Controlling dimensions are in inches, metric equivalents are shown for general information.
Dim
D
16
9
H
E
8
1
e
L
A2
A
c
INCHES
MIN
MAX
A
2.06
2.65
0.081
0.104
A1
0.10
0.30
0.004
0.012
A2
2.03
2.55
0.080
0.100
B
0.25
0.51
0.010
0.020
c
0.23
0.32
0.009
0.013
D
-
10.67
-
0.420
E
7.40
7.75
0.291
0.305
e
B
MILLIMETERS
MIN
MAX
1.27 BSC
H
10.00
10.65
0.05 BSC
0.394
0.419
L
0.40
1.27
0.016
0.050
θ
0°
8°
*LC
-
0.10
0°
-
8°
0.004
*Lead co planarity
SEATING PLANE
A1
Note:
Dimensions do not include protrusions; these shall
not exceed 0.155mm (.006”) on any side. Lead
dimension shall not include solder coverage.
Figure 31 · DW 16-Pin SOWB Package Dimensions
Dim
D
1
b1
E
A
-
5.33
-
0.210
0.38
-
0.015
-
A
c
A1
L
e
SEATING PLANE
b
θ
3.30 Typ.
0.130 Typ.
b
0.36
0.56
0.014
0.022
b1
1.14
1.78
0.045
0.070
c
0.20
0.36
0.008
0.014
D
18.67
19.69
0.735
0.775
e
A2
INCHES
MIN
MAX
A1
A2
E1
MILLIMETERS
MIN
MAX
2.54 BSC
E
7.62
E1
L
θ
0.100 BSC
8.26
0.300
0.325
6.10
7.11
0.240
0.280
2.92
0.381
0.115
0.150
-
15°
-
15°
Note:
Dimensions do not include protrusions; these shall
not exceed 0.155mm (.006”) on any side. Lead
dimension shall not include solder coverage.
Figure 32 · N 16-Pin Plastic Dual Inline Package Dimensions
14
PACKAGE OUTLINE DIMENSIONS
PACKAGE OUTLINE DIMENSIONS
Dim
D
16
9
1
8
E
eA
b2
Seating Plane
L c
H
θ
b
e
INCHES
MIN
MAX
0.015
0.045
0.200
0.020
0.065
0.008
0.760
0.220
0.015
0.785
0.280
A
b
b2
0.38
1.04
5.08
0.51
1.65
c
D
E
0.20
19.30
5.59
0.38
19.94
7.11
e
Q A
MILLIMETERS
MIN
MAX
2.54 BSC
0.100 BSC
eA
H
7.37
0.63
7.87
1.78
0.290
0.025
0.310
0.070
L
α
Q
3.18
0.51
5.08
15°
1.02
0.125
0.020
0.200
15°
0.040
Note:
Dimensions do not include protrusions; these shall not
exceed 0.155mm (.006”) on any side. Lead dimension
shall not include solder coverage.
Figure 33 · J 16-Pin Ceramic Dual Inline Package Dimensions
E3
D
E
A
A1
L2
L
8
3
1
Dim
MILLIMETERS
MIN
MAX
INCHES
MIN
MAX
D/E
E3
e
8.64
9.14
8.128
1.270 BSC
0.340
0.360
0.320
0.050 BSC
B1
L
A
0.635 TYP
1.02
1.52
1.626
2.286
0.025 TYP
0.040
0.060
0.064
0.090
h
A1
A2
1.016 TYP
1.372
1.68
1.168
0.040 TYP
0.054
0.066
0.046
L2
B3
1.91
2.41
0.203R
0.075
0.95
0.008R
Note:
13
All exposed metalized area shall be gold plated 60
micro-inch minimum thickness over nickel plated
unless otherwise specified in purchase order.
h
A2
18
B1
e
B3
Figure 34 · L 20-Pin Ceramic Leadless Chip Carrier (LCC) Package Outline Dimensions
15
Current Mode PWM Controller
PACKAGE OUTLINE DIMENSIONS
Controlling dimensions are in inches, metric equivalents are shown for general information.
Dim
L
B
69
85
7
4
8
3
9
2
10
1
D
e
16
1
E
S1
S1
E1
L
L
A
Q
A
b
c
D
E
E1
e
L
Q
C
MILLIMETERS
MIN
MAX
INCHES
MIN
MAX
1.65
1.91
0.38
0.48
0.102
0.152
11.18
6.22
6.74
7.62
1.27 BSC
6.35
9.40
0.51
1.02
0.20
0.057
0.067
0.010
0.019
0.004
0.006
0.290
0.238
0.252
0.272
0.050 BSC
0.250
0.370
0.020
0.040
0.008
Note:
1. Lead No. 1 is identified by tab on lead or dot on cover.
2. Leads are within 0.13mm (.0005”) radius of the true
position (TP) at maximum material condition.
3. Dimension “e” determines a zone within which all body
and lead irregularities lie.
Figure 35 · F 16-Pin Ceramic Flatpack Package Dimensions
16
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor
and system solutions for communications, defense & security, aerospace and industrial
markets. Products include high-performance and radiation-hardened analog mixed-signal
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Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or
the suitability of its products and services for any particular purpose, nor does Microsemi assume any
liability whatsoever arising out of the application or use of any product or circuit. The products sold
hereunder and any other products sold by Microsemi have been subject to limited testing and should not
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believed to be reliable but are not verified, and Buyer must conduct and complete all performance and
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SG1846.1.2/11.14