NANYA ROAD,MUGANG ZHAOQING
CITY GUANGDONG CHINA.
LEDTECH ELECTRONICS CORP.
TEL:86-758-2875541,2870651,2877464,2876185,2877017
FAX:86-758-2878014
Http://www.ledtech.com.tw
SPECIFICATION
PART NO. : LT8AB3-43-UGE3-TD-Z
0805 SMD CHIP LED
ATTENTION
OBSERVE PRECAUTION
FOR HANDLING
ELECTRO STATIC
SENSITIVE
DEVICES
Approved by
Checked by
Prepared by
Tung
Andy
Karen
LT8AB3-43-UGE3-TD-Z
0805 SMD CHIP LED
Package Dimensions
CATHODE
MARK
0.8
0.4
0.4
1.4
2.0
RESIN
TOP VIEW
0.28±0.05
BOTTOM VIEW
Notes:
1. All dimensions are in mm.
2. Tolerance is ±0.1mm unless otherwise noted.
Description
LED Chip
Part
No.
LT8AB3-43-UGE3-TD-Z
Material
Emitting Color
InGaN/Sapphire
Blue
Lens Color
Water Clear
VER.: 01 Date: 2007/01/16 Page: 1/6
0805 SMD CHIP LED
LT8AB3-43-UGE3-TD-Z
Absolute Maximum Ratings at Ta=25 ℃
Parameter
Symbol
Rating
Unit
Power Dissipation
PD
120
mW
Reverse Voltage
VR
5
V
D.C. Forward Current
If
30
mA
If(Peak)
80
mA
Operating Temperature Range
Topr.
-30 to +80
℃
Storage Temperature Range
Tstg.
-40 to +85
℃
Soldering Temperature.
Tsol.
Electric Static Discharge
ESD
Peak Current(1/10Duty Cycle,0.1ms Pulse Width.)
Reflow Soldering:260℃ for 10 sec.
6000
V
Electrical and Optical Characteristics:
Parameter
Symbol
Condition
Min.
Typ.
Luminous Intensity
IV
If=20mA
51.6
100
Forward Voltage
Vf
If=20mA
3.2
Peak Wavelength
λp
If=20mA
----
nm
Dominant Wavelength
λd
If=20mA
465
nm
Reverse Current
Ir
Vr=5V
Viewing Angle
2θ1/2
If=20mA
130
deg
∆λ
If=20mA
26
nm
Spectrum Line Halfwidth
Max.
Unit
mcd
4.0
50
V
µA
Notes:1.The datas tested by IS tester.
2. Customer’s special requirements are also welcome.
VER.: 01 Date: 2007/01/16 Page: 2/6
0805 SMD CHIP LED
LT8AB3-43-UGE3-TD-Z
Typical Electrical/Optical Characteristic Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
240
Relative Luminous Intensity
Forward Current IF(mA)
50
40
30
20
10
2.8
3.0
3.2
3.4
3.6
Forward Voltage (V)
200
160
120
80
40
3.8
0
15
20
25
30
35
40
Forward Current (mA)
FORWARD CURRENT VS.APPLIED VOLTAGE
RELATIVE INTENSITY VS. FORWARD CURRENT
10
50
40
30
Relative Intensity
Forward Current IF(mA)
10
5
20
10
0
20
40
60
Temperature(℃)
80
1.0
0.5
0.2
0.1
-20
100
0
20
40
60
80 100
Temperature(℃)
RELATIVE INTENSITY VS. AMBIENT TEMPERATURE
FORWARD CURRENT VS. AMBIENT TEMPERATURE
0°
10°
20°
30°
40°
1.0
0.9
50°
0.8
60°
70°
80°
90°
0.7
0.5
0.3
0.1
0.2
0.4
0.6
Radiation Diagram
VER.: 01 Date: 2007/01/16 Page: 3/6
LT8AB3-43-UGE3-TD-Z
0805 SMD CHIP LED
Precautions in Use:
Storage
Recommend storage environment
Temperature： 5℃∼30℃ (41°F∼86°F)
Humidity：
60% RH Max.
Use within 7 days after opening of sealed vapor/ESD barrier bags.
If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃
for 24 hours.
Fold the opened bag firmly and keep in dry environment.
Soldering
Reflow Soldering
Recommend use of upper and lower heater type reflow furnace.
260℃ Max for up to 10 seconds, one time only.
Pre-heat is 150℃ Max for up to 2 minutes Max.
In case of screen-printing, keep metal mask thickness between 0.2mm and 0.3mm.
Cleaning
Surface condition of this device may change when organic solvents such as
trichloroethylene or acetone were applied.
Avoid using organic solvent.
Recommend ultrasonic method 300W Max.
Packaging
EIA-481A standard package.
In 8mm tape on 4000 pcs diameter reels sealed in vapor/ESD barrier bags.
Reflow Temp/Time:
10 SEC.
Temperature
260°CMAX.
140～160
4°C/SEC.
4°C/SEC.
2 minutes Max.
Time
VER.: 01 Date: 2007/01/16 Page: 4/6
0805 SMD CHIP LED
LT8AB3-43-UGE3-TD-Z
1.2
Reflow Soldering Pad Dimensions
0.9
3.3
1.2
2.26±0.10
CATHODE
0.90±0.1
+0.30
8.0-0.10
3.5±0.05
4.0±0.1
+0.1
-0
2.0±0.05
1.75±0.1
Dimensions for Tape
4.0±0.1
1.40±0.1
Dimensions for Reel
12±0.5
TAPE
START
9±0.5
180±1
180±1
60±0.5
END
NO
COMPOMENTS
400mm MIN.
TRAILER
NO
COMPOMENTS COMPOMENTS
80mm MIN.
LEADER
Notes:
1.All dimensions are in mm, tolerance is±2.0mm unless otherwise noted.
2.Specifications are subject to change without notice.
VER.: 01 Date: 2007/01/16 Page: 5/6
LT8AB3-43-UGE3-TD-Z
0805 SMD CHIP LED
Dimensions for Tape
PART NO
LOT NO
QUANTITY
DATE
PART NO
LOT NO
QUANTITY
DATE
BIN CODE
XXXXX
XXXXX
XXXXX
XXXXX
180±1
Reel : 4,000PCS
XXXXX
XXXXX
XXXXX
XXXXX
XXXXX
溼氣敏感材料
MOISTURE SENSITIVE DEVICES
1. 在5°C~30°C密封貯藏，2年有效。
Shelf life in sealed bag : 24 months
at 5°C~30°C .
2. 開封後需在168小時內使用。
220±
LEDTEC
PAR T H ELE
NO. ：LTCTR ONI
QTY
8AB 3-51CS CORP.
LOT
：4000
-UAF1
DATE NO.： XXX PCS
XXX
BIN
XXXX
CODE ：2003.0
6.04
：X
MOISTU 溼氣敏感
RE SEN 材料
C~30°
SIT
1. 在5°
IVE DEV
C 密封
Shelf
貯藏
life
at 5°C~ in sealed ，2年有效 ICES
。
bag :
30°C
24 mon
.
後需
ths
Devices 在72小時
72 hour have to be內使用。
mou
s after
this bag nted with
in
is open
ed .
2. 開封
Bag : 4,000PCS
1.0
Devices have to be mounted within
168 hours after this bag is opened .
250±1.0
27
23
5±
2
5±
2
75±2
5 Bags : 20,000PCS
PART NO
LOT NO
QUANTITY
DATE
BIN CODE
XXXXX
XXXXX
XXXXX
XXXXX
XXXXX
PART NO
LOT NO
BIN CODE
QUANTITY
DATE
XXXXX
XXXXX
XXXXX
XXXXX
XXXXX
C/T NO
PART NO
QUANTITY
N.
W.
G.
W.
REMARK
XXXXX
XXXXX
XXXXX
XXXXX
XXXXX
XXXXX
415
285
5 Boxes :100,000PCS
24
5
Notes:
1.7 inch reel-4000 pieces per reel.
2.Minimum packing quantity is 500 pieces for remainders.
3.The maximum number of consecutive missing lamps is two.
VER.: 01 Date: 2007/01/16 Page: 6/6