Aluminum Cover
Board Level Shield
Reduces the weight of a board level shield (BLS) significantly and
transfers heat faster while maintaining excellent shielding
effectiveness performance.
The Aluminum BLS cover is geared towards applications where weight management is
critical. Compared to other metal substrates, it can offer up to a ~ 70% reduction in weight
(Table 1). The frame can be made out of Nickel Silver or Tin plated cold rolled steel. In
addition, Aluminum is higher in thermal conductivity (Table 1) which allows the transfer of
heat more quickly versus alternative typical metal substrates used for a BLS cover.
FEATURES
BENEFITS
Lightweight
60 dB @ 1 GHz shielding effectiveness
Thermal conductivity of 138 W/m-K
Thin gauge precision stamping
Different plating options such
as Nickel and Tin
• Locking features built into the cover
• Reduces the weight of a device.
• Provides EMI shielding over a wide
frequency range.
• Transfers heat more quickly due to its
high thermal conductivity.
• Ability to hold tight tolerances on thin
gauge, complex stamped covers.
• The cover stays securely attached
to the frame.
•
•
•
•
•
VALUE
• Enables a lighter device
• Ease of assembly
• Packaged in a way to utilize automation
during assembly to maximize throughput
Metal Substrate
Aluminum
Cold Rolled Steel
Stainless Steel
Nickel Silver
Density (g/cc)
2.7
7.9
8.0
8.7
SAMPLES
• Aluminum cover samples are available in
each region: Europe – Liberec, NAM –
Schaumburg, and APAC – Shenzhen
• Al cover sample P/N: BMI-S-230-C-AL
• Standard frame P/N: BMI-S-230-F-R
Thermal Conductivity (W/m-K)
138
65
16
29
Table 1: Comparison of Metal Substrates
USA: +1.866.928.8181
MET-DS-Aluminum Cover BLS_121115
Europe: +49.8031.24600
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shall not be liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in
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