2SD2216G - Panasonic Semiconductor

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This product complies with the RoHS Directive (EU 2002/95/EC).
Transistors
2SD2216G
Silicon NPN epitaxial planar type
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For general amplification
Complementary to 2SB1462G
■ Package
■ Features
• Code
SSMini3-F3
• Marking Symbol: Y
• Pin Name
1: Base
2: Emitter
3: Collector
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• High forward current transfer ratio hFE
• Low collector-emitter saturation voltage VCE(sat)
• SS-Mini type package, allowing downsizing of the equipment and
automatic insertion through the tape packing.
■ Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
60
V
Collector-emitter voltage (Base open)
VCEO
50
V
Emitter-base voltage (Collector open)
VEBO
7
V
100
mA
200
mA
125
mW
125
°C
−55 to +125
°C
Collector current
IC
Peak collector current
ICP
Collector power dissipation
PC
Junction temperature
Tj
Storage temperature
Tstg
Symbol
Collector-base voltage (Emitter open)
VCBO
IC = 10 µA, IE = 0
60
V
Collector-emitter voltage (Base open)
VCEO
IC = 2 mA, IB = 0
50
V
Emitter-base voltage (Collector open)
VEBO
IE = 10 µA, IC = 0
7
Collector-base cutoff current (Emitter open)
ICBO
VCB = 20 V, IE = 0
ICEO
VCE = 10 V, IB = 0
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Parameter
ue
■ Electrical Characteristics Ta = 25°C ± 3°C
an
Collector-emitter cutoff current (Base open)
hFE1 *2
en
Forward current transfer ratio
Ma
int
hFE2
Collector-emitter saturation voltage
Transition frequency
*1
VCE(sat)
fT
Collector output capacitance
(Common base, input open circuited)
Cob
Conditions
Min
VCE = 10 V, IC = 2 mA
160
VCE = 2 V, IC = 100 mA
90
Typ
Max
Unit
V
0.1
µA
100
µA
460

0.3
V
IC = 100 mA, IB = 10 mA
0.1
VCB = 10 V, IE = −2 mA, f = 200 MHz
150
MHz
VCB = 10 V, IE = 0, f = 1 MHz
3.5
pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *1: Pulse measurement
*2: Rank classification
Rank
Q
R
S
No rank
hFE1
160 to 260
210 to 340
290 to 460
180 to 390
Product of no-rank is not classified and have no marking symbol for rank.
Publication date: November 2008
SJC00406BED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
2SD2216G
PC  Ta
IC  VCE
IB  VBE
60
1 200
Ta = 25°C
VCE = 10 V
Ta = 25°C
IB = 160 µA
1 000
Collector current IC (mA)
50
100
75
140 µA
120 µA
40
100 µA
30
80 µA
Base current IB (µA)
125
800
600
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Collector power dissipation PC (mW)
150
50
25
40
60
80 100 120 140 160
2
4
6
8
10
VCE = 10 V
240
VCE = 10 V
Ta = 25°C
200
Collector current IC (mA)
Collector current IC (mA)
0
0
160
25°C
120
Ta = 75°C
−25°C
80
160
120
80
40
40
0.4
0.8
1.2
1.6
2.0
hFE  IC
600
an
VCE = 10 V
int
Ma
Ta = 75°C
25°C
300
−25°C
200
100
1
10
Collector current IC (mA)
100
200
400
600
800
1 000
fT  I E
VCB = 10 V
Ta = 25°C
240
180
120
60
0
− 0.1
−1
−10
Emitter current IE (mA)
SJC00406BED
0.2
0.4
0.6
0.8
−100
1.0
Base-emitter voltage VBE (V)
VCE(sat)  IC
100
IC / IB = 10
10
1
25°C
0.1
0.01
0.1
Ta = 75°C
−25°C
1
10
Collector current IC (mA)
Base current IB (µA)
300
Transition frequency fT (MHz)
en
500
0
0.1
0
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Base-emitter voltage VBE (V)
400
0
ue
0
0
IC  I B
200
Forward current transfer ratio hFE
0
Collector-emitter voltage VCE (V)
IC  VBE
240
2
200
20 µA
Collector-emitter saturation voltage VCE(sat) (V)
20
Ambient temperature Ta (°C)
0
40 µA
10
0
400
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0
60 µA
20
100
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
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(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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20080805
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