Bridging the Gap Between Power
PCBs and Bus Bars for Power
Electronics Applications
By
Albert J Mastrangelo, Rogers Corporation, USA and
Koen Hollevoet, Rogers BVBA, Belgium
Motor, Drive & Automation Systems
Conference, Orlando FL USA
March 13, 2012.
Outline
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Power Distribution – PCBs and Busbars.
Current Technologies – Limitations.
Advanced Applications – Unmet Needs.
Defining Advantages.
Current Applications.
Future Work.
Conclusions.
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Current Solutions - Copper Thickness
Copper
Thickness (mm)
Conventional
Busbars
0.800
0.400
Power PCB’s
0.035
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Power PCB Basics: Add More Copper
Filled
milled
gap
Signal
path
“Iceberg Technology” – patented by KSG Leterplatten GmbH
Wirelaid™ Technology – patented/trademarked by Jumatech
Copper inlays – patented by Korsten & Goosens GmbH
Combi Board – Schweizer Electronics GmbH
There are several creative PCB technologies to increase
copper thickness
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Power PCB Issues in Power Electronics
• Supply issues
– Not all PCB suppliers can handle thick copper.
Cu
FR4
• Reliability
– Thermal stress leads to delamination, cracking, measeling.
• In application- due to high current density
• In manufacturing- due to drilling thick copper
– Thick copper affects process window
• PCB fabrication (soldermask application, HAL)
• PCB assembly: e.g. soldering processes
– Compromised integrity mounting screwed components.
• Cost
– PCB cost increases due to adding thicker copper.
– Longer process time (e.g. etching), Higher material cost and waste
(copper), More tooling / more manual operations.
– Impact on yield.
• Creative constraints
– 2-D limits designs and reduces ability to optimize form factor.
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Summary - Limitations of Power PCB
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Supply limitations - outside of standard processes.
Higher costs associated with selectively adding copper.
Potential for delamination, cracking, and measeling.
Insulation gaps - solder mask may not bridge steep
edges.
• Mechanical integrity may be compromised upon
assembly.
• Creative Constraints --- 2-D.
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Power Distribution – PCBs and Bus Bars
• New Applications Require Intermediate
Solutions.
– Solar Inverters.
– Low Voltage Drives.
– EV and (H)EV Power Trains.
• Convergence - Common Requirements.
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Thinner Conductors – Copper or Aluminum.
Form Factor Constraints – Size and Weight.
Increasing Complexity.
Higher Volumes.
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Quantities Of Bus Bars By Application
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A New Circuit Technology - PowerCircuit™
Rail
?
LV drives
Power PCB
0
10
Renewable
HVDC
Laminated
Bus Bar
EV
100
1.000
10.000
Typical Current (Amperes)
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Circuit Technologies - Type
Current
HIGH
Laminated Busbars
Thicker
copper
Stacked Busbars
PCB
 2D
 Low inductance
 Partial Discharge controlled
 3D
RO-LINX®
PowerCircuit™
Technology
Thicker
insulation
Cables
LOW
LOW
HIGH
Voltage
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Defining Unmet Needs
• Provide added functionality - Current Carrying Capacity
PLUS:
– Active and Passive Components
– Electronic Control Circuitry.
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3-D Capability To Meet Form Factor Requirements
Active or Passive Thermal Management Opportunities.
Compatibility with Interconnection Processes
Compatibility with Component Mounting Processes.
Complexity Reduction
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Circuit Technologies - Conductor Thickness
Conductor
Thickness (mm)
Conventional
Busbars
1.000
RO-LINX® PowerCircuit™ Technology
0.500
Power PCB’s
0.035
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Advantages
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Meets Application Demand Without High Cost Additive Copper
Process.
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Thin copper solution – 0.5 mm to 1.0 mm and carries 100-500 A.
Enables Added Functionality.
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Active or Passive Components – capacitors, etc.
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Reduces Thermal Stress and Improves Thermal Performance.
properties vs. PCBs.
• Enables 3-D Design.
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Reduces Complexity.
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Permitting creative solutions to meet form factor requirements and space/weight
limitations. – THINK OUT OF THE PLANE!
Eliminates cabling, wiring, etc.
Reduces Assembly Steps, Error Probability, and Costs.
Enables High Throughput Soldering and Component Assembly.
.
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Interconnection Capabilities
Compatibility with various interconnection and component
mounting technologies is critical for volume production.
Mechanical
Fastened
Riveted
Soldered
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Soldering Process Details
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Equipment :
Flux :
Solder Alloy :
Pre-heating :
Insulation :
Solderpath :
ERSA EWS 330
Interflux IF2005 C
SnCu (Interflux®) at 269 C
topside before wave.
Polyimide
Patented design
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Performance Characteristics
• Fabrication Technology
Open mould
Closed mould
– Proprietary Insulation Materials
– High Performance Adhesives
– Proven Assembly Technology
• >20 yrs lifetime in rail, off-road vehicle, and other demanding
applications.
• Temperature
– -40°C to +105°C continuous operating temperature.
• Reliability
– Operational Life: >15 years.
– Temperature Cycling: 1000 cycles (-40°C to +125°C).
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Power Electronics Applications
(Hybrid) Electrical Vehicles
Fast Battery
Charger: Typical
DC/DC Converter:
Products
RO-LINX®
PlanarPower™
Typical Products
RO-LINX®
PlanarPower™
RO-LINX®
PowerCircuit™
Energy Storage /
Battery Packs:
Motor Drive /
Power Electronics:
Typical Products
RO-LINX®
Hybrid™
Typical Products
RO-LINX®
PowerCircuit™
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Power Electronics Applications
Commercial Inverters
• Wind Energy Inverters
• Solar Inverters
• 100-500 A Typical
Power (kW) versus Current (A)
Grid Voltage
5 kW
10 kW
25 kW
35 kW
100 kW
250 kW
500 kW
1.000 kW
110 V
1-phase
45 A
91 A
227 A
318 A
909 A
2.273 A
4.545 A
9.091 A
220 V
1-phase
23 A
45 A
114 A
159 A
455 A
1.136 A
2.273 A
4.545 A
110 V
3-phase
76 A
106 A
303 A
758 A
1.515 A
3.030 A
220 V
3-phase
38 A
53 A
152 A
379 A
758 A
1.515 A
LV Variable Frequency Drives
• Voltage Inverter
• Frequency Inverter
• UPS
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Future Work
RO-LINX® PowerCircuit™ Applciations
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Explore Adjacent Technologies
Support Higher Service Temperatures to 125 C.
Battery Pack Applications - RO-LINX®Hybrid™
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Integrates Power Connection With Signal Lines:
– Flex circuit (replacing wires)
– Various plating options (oxidation)
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Advantages:
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Assembly time reduction
Error free connection
Smaller form factor
Ease of maintenance
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Future Work
Integrated Planar Transformers RO-LINX®PowerPlanar™
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Lower Losses
– Eliminate some of the connection losses (hot spots)
– Reduces the leakage and stray inductance between the terminations
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Improved Thermal Management
– Reduced losses
– Improved thermal transfer through busbar
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Reduced Stack Height
– >10% height reduction
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Improved Mechanical Tolerances
– Easier mounting
(Patent
RO-LINX® PlanarPower ™ contains
a
Pending)
10 kW planar transformer in a E64
core
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Conclusions - PowerCircuit™ Technology
• New Multilayer Circuit System for Power
Electronics.
• Add Funtionality – Power and Passives.
• Compatible with High Volume Manufacturing
and Assembly Technologies.
• 3D Capability  Enables Compact Designs.
• Thermal Management Opportunities.
• Proven High Performance and Reliable
Technology.
• Future Developments for Adjacent
Applications.
Bridging the Gap Between Electronics and Power Electronics
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Thank You
Al Mastrangelo
al.mastrangelo@rogerscorp.com
+1 919 342 5687
Questions?
Technology leaders in materials and components for breakthrough
performance, efficiency, and reliability.
Let us help you build a better world.
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