VDSL
VDSL Over POTS
Solution Products
TBU-PL085-200-WH
Objective
Compliance
VDSL circuits are sometimes combined
with Plain Old Telephone Service (POTS)
circuits. This solution protects those
communication ports against surge and
power contact threats.
GR-1089-CORE
Solution
TBU-CA085-500-WH
1 TBU® High-Speed Protector:
TBU-PL085-200-WH
1 TBU® High-Speed Protector:
TBU-CA085-500-WH
1 GDT: 2020-42T-C4LF
2 Telecom Fuses: B1250T
Alternate Recommendations
Variations of this circuit are available depending
on specific design constraints; contact your
local Bourns technical representative for more
information.
Benefit
This solution provides protection to the voice
and data circuits without impairing the VDSL
30 MHz signal.
B1250T
TBU-CA085-500-WH
VDSL
2020-42T-C4LF
2020-42T-C4LF
B1250T
TBU-PL085-200-WH
B1250T
Filter
Design Kit
SLIC
PN-DESIGNKIT-19
The schematic above illustrates the application protection and does not constitute the complete
circuit design. Customers should verify actual device performance in their specific applications.
Americas: Tel +1-951 781-5500
Fax +1-951 781-5700
Europe: Tel +41-(0)41 768 55 55 Asia-Pacific: Tel +886-2 256 241 17
Fax +41-(0)41 768 55 10 Fax +886-2 256 241 16
COPYRIGHT© 2012 • BOURNS, INC. • 6/12 • e/CPK1136 • “PortNote” is a registered service mark of Bourns, Inc.
“Bourns” and “TBU” are registered trademarks of Bourns, Inc. in the U.S. and other countries.
Bourns® PortNote® solutions provide protection
recommendations for typical port threats.
For more information, go to:
www.bourns.com
or email: protection@bourns.com
PL
IA
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Features
*R
oH
S
CO
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■
■
■
■
■
For use in telecommunication circuit applications requiring low current protection
with high surge tolerance
Overcurrent protection to Telcordia GR-1089-CORE Issue 4 (B1250T only)
& UL 1950/60950
Bourns® TISP® products are recommended for the overvoltage section of the circuit
Agency recognition:
File: E198545
RoHS compliant*
Telefuse™ SMD Power Cross Protection Fuse
Electrical Characteristics
Model
Number
Ampere
Rating
(A)
Voltage
Rating
(VRMS)
B0500T
B1250T
B2000T
0.500
1.25
2.0
600
600
600
Temperature Range ........-55 ºC to +125 ºC
Environmental Characteristics
Thermal Shock ......................MIL-STD-202,
Method 107, Test Condition B
(-65 °C to +125 °C)
Shock ..........MIL-STD-202, Method 213,
Test Condition I
(100 Gs peak for 6 milliseconds)
Vibration ........MIL-STD-202, Method 201
(10-55 Hz, 0.06 inch total excursion)
Salt Spray ....MIL-STD-202, Method 101,
Test Condition B (48 hrs.)
Insulation Resistance ........MIL-STD-202,
Method 302, Test Condition A
(after opening)
10,000 ohms minimum
Solderability ..MIL-STD-202, Method 208
Resistance to Solder Heat
..................MIL-STD-202, Method 210,
Test Condition J (235 °C, 30 sec.)
Physical Characteristics
Body Material
..........Ceramic with tin plated brass caps
Solder ............................................Lead free
Solder Reflow Temperature
..............................240 °C for 30 seconds
260 °C for 3 seconds
Packaging ..............2,000 pcs. per 13 ” reel
Typical
Cold
Resistance
(ohms)
0.350
0.075
0.056
Volt-drop
@ 100 % In
(Volts)
max.
0.23
0.18
0.16
Melting I2T
< 10 msec
(A2 sec.)
Melting I2T
@ 10 In
(A2 sec.)
2
14
33
2.3
17
37
Maximum
Power
Dissipation
(W)
0.20
0.40
0.52
Lightning Surge Withstand Capabilities
Max. Rise/
Min. Decay
(µs)
10/1000
10/360
2/10
10/360
2/10
8/20
Repetitions
Total
50
50
20
10
2
2
Minimum
Peak
Each Polarity Voltage (V)
25
1000
25
1000
10
2500
5
1000
1
5000
1
5000
Minimum Withstand Peak Current (A)
B0500T
25
30
120
30
120
75
B1250T
100
125
500
125
500
300
B2000T
120
150
600
150
600
350
Test Methods per GR-1089/TIA-968-A (FCC Pt. 68)
AC Power Fault Tests
Short
GR-1089
Circuit
1st Level Voltage Current
Test
(VRMS)
(A)
1
2
3
4
6
7
8
9
50
100
200,400,
600
1000
600
440
600
1000
0.33
0.17
Fuse Characteristics
Applications Duration
1
15 min.
1
15 min.
1
60
1 sec.
1
0.5
2.2
3
5
60
1
5
5
5
1 sec.
30 sec.
2 sec.
1.1 sec.
0.4 sec.
B0500T
B1250T
B2000T
Parts pass all 1st Level tests
Will open
Will open
Will open
AC Current Limiting Protector Tests/Fusing Coordination Tests
Maximum Time for Fuse to Open (Seconds)
Asia-Pacific:
TEL +886- (0)2 25624117
FAX +886- (0)2 25624116
Europe:
TEL +41-41 7685555
FAX +41-41 7685510
The Americas:
TEL +1-951 781-5500
FAX +1-951 781-5700
www.bourns.com
Voltage
(Vac)
Current
(A)
600
600
600
600
600
600
600
600
600
600
600
2.2
2.6
3.0
3.75
5
7
10
12.5
20
25
30
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
Duration
B0500T
B1250T
B2000T
Up to 15 Min.
1.0
0.8
0.5
0.3
0.2
0.08
0.04
0.01
0.005
0.004
0.003
900
50
10
5
2
1
0.5
0.2
0.07
0.04
0.02
Will not open
2000
100
10
3
2
0.7
0.3
0.1
0.07
0.05
Telefuse™ SMD Power Cross Protection Fuse
Time/Current Characteristic Curve
Product Dimensions
1000
2.03 ± .102
(.080 ± .004)
Current (Amperes)
100
10
9.65 ± .254
(.38 ± .01)
B2000T
B1250T
1
3.05 ± .127
(.120 ± .005)
B0500T
3.05 ± .127
(.120 ± .005)
0.1
0.01
0.01
0.1
1
10
100
1000
10000
Recommended Pad Layout
Time (Seconds)
3.81
(.15)
4.06
(.16)
5.08
(.20)
DIMENSIONS:
MM
(INCHES)
Solder Profile - 260 °C for 3 Seconds
300
PREHEAT
ZONE 2
ZONE 3
REFLOW
COOL
267
TEMPERATURE (°C)
233
200
167
133
100
67
33
0
0
48
95
143
190
238
286
333
381
429
SECONDS
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Telefuse™ SMD Power Cross Protection Fuse
Packaging Specifications
2.2
(.087)
20
(.787)
13.0
DIA.
(.512)
1.55 ± 0.05
(.061 ± .002)
DIA.
55.0
(2.165)
DIA.
21.0
(.827)
DIA.
0.40 ± 0.05
(.016 ± .002)
4.0 ± 0.1
(.157 ± .004)
2.0 ± 0.1
(.079 ± .004)
1.75 ± 0.1
(.069 ± .004)
1.6 ± 0.05
(.063 ± .002)
DIA.
CL
7.50 ± 0.1
(.295 ± .004)
10.0 ± 0.1
(.394 ± .004)
R
3 ° REF.
3.50 ± 0.1
(.138 ± .004)
0.3
(.012)
TYP.
16.0 ± 0.3
(.630 ± .012)
8.0 ± 0.1
(.315 ± .004)
3.50 ± 0.1
(.138 ± .004)
1.6
(.063)
330
(12.992)
DIA.
DIMENSIONS:
REV. 01/09
“Telefuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MM
(INCHES)
CL
*R
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V SC
AV ER OM
AI SIO PL
LA N IA
BL S NT
E
Features
Applications
■ Fast acting
■ Telecommunications
■ Balanced
■ Industrial electronics
■ Stable breakdown throughout life
■ Avionics
■ Designed to operate with TBU devices
®
■ RoHS compliant* versions available
2020 T-Series - Fast Acting 3-Electrode Miniature GDT
Characteristics
Model No.
Characteristic
Minimum DC Sparkover (100 V/s)
Throughout Service Life
Maximum Impulse Sparkover (5k V 1.2/50 µs)
Throughout Service Life
2020-15T
2020-23T
2020-42T
60 V
180 V
360 V
500 V
650 V
850 V
Impulse Transverse Delay ..................1000 V/µs ............................................................................... < 75 ns
Insulation Resistance (IR) ..................50 V / 100 V............................................................................ > 10 9 Ω
Glow Voltage ......................................10 mA ..................................................................................... ~ 70 V
Arc Voltage .........................................>1 A ........................................................................................ ~ 10 V
Glow-Arc Transition Current ............................................................................................................... < 0.5 A
Capacitance........................................1 MHz ..................................................................................... < 1 pF
DC Holdover Voltage (Network Applied per ITU-T K.12)
2020-15T .......................................52 V ........................................................................................ < 150 ms
2020-23T .......................................80 V ........................................................................................ < 150 ms
2020-42T .......................................135 V ...................................................................................... < 150 ms
Service Life1 .......................................8/20 µs, 10 kA......................................................................... 1 operation
10/1000 µs, 1 kV, 200 A.......................................................... 100 operations2
2/10 µs, 6 kV, 2000 A.............................................................. 10 operations2
10/700 µs, 6 kV, 300 A............................................................ 50 operations2
8/20 µs, 500 A, 1.2/50 µs, 500 V ............................................ 150 operations2
600 V, 10 Arms, 0.2 sec.......................................................... 10 operations
600 Vrms, 0.5 A - 60 A ............................................................ Fail-Short activates3
230 Vrms, 0.5 A-25 A.............................................................. Fail-Short activates3
Operating and Storage Temperature .................................................................................................. -40 to +90 °C
Climatic Category (IEC 60068-1) ....................................................................................................... 40 / 90 / 21
Notes:
1 The rated discharge current is the total current equally divided between each line to ground.
2 Surge polarity should be reversed between consecutive surges (+,-,+,-)
3 Applies only to GDT with optional Fail-Short. GDT operates and will survive with Fail-Short activation.
• At delivery AQL 0.65 Level II, DIN ISO 2859.
Applications
Port Protection
CanBus
RS232
RS422
RS485
RS485
SDI
VDSL
GDT Device P/N
2020-23T
2020-23T
2020-23T
2020-23T
2020-42T
2020-23T
2020-15T
“TBU” is a registered trademark of Bourns, Inc. in the United States and other countries.
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TBU® Device P/N
TBU-CA065-100-WH
TBU-CA065-200-WH
TBU-CA065-200-WH
TBU-CA065-200-WH
TBU-CA085-200-WH
TBU-CA065-100-WH
TBU-CA050-500-WH
2020 T-Series - Fast Acting 3-Electrode Miniature GDT
Product Dimensions (additional lead form configurations available upon request)
2020-xxT-A1
7.9
2020-xxT-C4
FAIL-SHORT
CONFIGURATION
2020-xxT-C2F SHOWN
11.2 REF.
8.1
7.5
9.6
1.0 DIA.
0.7 - 1.0
1.0 DIA.
6.1
6.1
2020-xxT-C2
2020-xxT-C8
DIMENSIONS: MILLIMETERS
13.0
MAX.
UNITS WITH LEADS ARE BASED ON
THE 2020-xxT-A1 BODY.
7.5
15.4
How to Order
1.0 DIA.
4.4
2020 - xxT - x x F LF
1.0 DIA.
4.5
Model Number
Designator
4.4
2020-xxT-C3
Voltage
15 = 60 V
23 = 180 V
42 = 360 V
2020-xxT-C
1.0 mm dia. lead wire
30
LONG
2 PLCS.
7.5
Leads
A = None/Cassette Applications
C = 1 mm Dia. Leads/Through-hole
Lead Shape
(See Product Dimension Drawings)
Fail-Short Option
Blank = Standard Product
F = With Fail-Short Mechanism
1.0 DIA.
4.4
4.75
4.75
1.0 DIA.
7.5
RoHS Compliant Option
Blank = Standard Product
LF = RoHS Compliant Product
Model 2020-xxT ships in standard bulk pack, 100
pcs./tray.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
2020 T-Series - Fast Acting 3-Electrode Miniature GDT
Switch-Grade Fail-Short Device Shorting Curve 2020-xxT-XF
30.0
Current (A) (ELTGS)
20.0
10.0
5.0
1.0
0.5
0.1
1
10
100
1000
Seconds
ELTGS = Each Line to Ground Simultaneously
NOTE: When using a GDT fail-short device, it is imperative that all components associated and
connected to the GDT with failsafe be tested in their respective completely integrated environment
(finished product) to assure desired operation.
REV. D 03/12
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
PL
IA
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CO
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*R
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S
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C955401
Features
Applications
■ Superior circuit protection
■ SLIC protection
■ Overcurrent & overvoltage protection
■ Cable & DSL
■ Blocks surges up to rated limits
■ MDU/MTU modems
■ High-speed performance
■ ONT
■ Small SMT package
■ Voice/DSL line cards
■ RoHS compliant*
■ Agency recognition:
TBU-PL Series - TBU® High-Speed Protectors
General Information
Vdd
The TBU-PL Series of Bourns® TBU® products are low capacitance dual bidirectional high-speed protection
components, constructed using MOSFET semiconductor technology, and designed to protect against faults
caused by short circuits, AC power cross, induction and lightning surges.
In addition to overcurrent protection, an added feature is the voltage monitoring on the two lines. If the voltage
on the line drops below Vss then the voltage will trigger the device to switch to the blocking state.
Line 1 SLIC
Line 1
Line 2 SLIC
Line 2
The TBU® high-speed protector placed in the system circuit will monitor the current with the MOSFET detection circuit triggering to provide an effective barrier behind which sensitive electronics will not be exposed to
large voltages or currents during surge events. The TBU® device is provided in a surface mount DFN package
and meets industry standard requirements such as RoHS and Pb Free solder reflow profiles.
Agency Approval
UL
Description
File Number: E315805
Vss
TBU ® Device
Industry Standards (in Conjunction with OVP Device)
Solutions available for GR-1089-CORE, ITU-T and a combination of both.
Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted)
Symbol
Parameter
Vimp
Peak impulse voltage withstand with duration less than 10 ms
Vrms
Continuous A.C. RMS voltage
Top
Tstg
Tjmax
ESD
Operating temperature range
Storage temperature range
Maximum Junction Temperature
HBM ESD Protection per IEC 61000-4-2 on line pads
Part Number
TBU-PL050-xxx-WH
TBU-PL060-xxx-WH
TBU-PL075-xxx-WH
TBU-PL085-xxx-WH
TBU-PL050-xxx-WH
TBU-PL060-xxx-WH
TBU-PL075-xxx-WH
TBU-PL085-xxx-WH
Value
500
600
750
850
300
350
400
425
-55 to +125
-65 to +150
+125
±2
Unit
V
V
°C
°C
°C
kV
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Symbol
Itrigger
Rdevice
Rmatch
tblock
IQ
Iss
Vreset
Vto
Vss
Rth(j-l)
Rth(j-l)
Rth(j-l)
Rth(j-l)
Parameter
Part Number
Current required for the device to go from
TBU-PLxxx-100-WH
operating state to protected state
TBU-PLxxx-200-WH
Series resistance of the TBU® device
Package resistance matching of the TBU® device #1 - TBU® device #2
Time taken for the device to go into current limiting
Current through the triggered TBU® device with 50 Vdc circuit voltage
Operating current with Vss = -50 V
Forward Mode
TBU-PLxxx-100-WH
®
Reverse Mode
Voltage below which the triggered TBU
device will transition to normal operating state
Forward Mode
TBU-PLxxx-200-WH
Reverse Mode
Voltage threshold offset with 60 Hz applied voltage, with Vss -50 V (Vss - VlineSLIC)
Operating voltage range relative to Vdd
One side junction to package pads - FR4 using minimum recommended pad layout
Both sides junction to package pads - FR4 using minimum recommended pad layout
One side junction to package pads - FR4 using heat sink on board (6 cm2) (0.5 in.2)
Both sides junction to package pads - FR4 using heat sink on board (6 cm2) (0.5 in.2)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Min.
100
200
40
Typ.
150
300
50
±0.5
0.25
0.70
100
15
13
20
17
12
10
15
12
-1.0
-180
110
65
70
40
Max.
200
400
55
±1.0
1
1.50
22
20
25
22
0.2
-20
Unit
mA
Ω
Ω
µs
mA
µA
V
V
V
°C/W
°C/W
°C/W
°C/W
TBU-PL Series - TBU® High-Speed Protectors
Functional Block Diagram
HIGH
VOLTAGE
SWITCH
Line 1 SLIC
Line 1
CURRENT
SENSE
Vdd
+
VOLTAGE
COMPARATOR
Vss
Vdd
Vss
Vdd
VOLTAGE
COMPARATOR
+
Vss
CURRENT
SENSE
HIGH
VOLTAGE
SWITCH
Line 2 SLIC
Reference Application
Line 2
Basic TBU Operation
The TBU-PL Series are high-speed protectors used in voice/
VoIP SLIC applications.The maximum voltage rating of the TBU®
device should never be exceeded. Where necessary, an OVP
device should be employed to limit the maximum voltage. A costeffective protection solution combines Bourns® TBU® protection
devices with a pair of Bourns® MOVs. For bandwidth sensitive
applications, a Bourns® GDT may be substituted for the MOV. If
EN55024 EMC compliance is required, the TBU® device
may require capacitors to be fitted between the Tip and Ring
connections and ground.
The TBU® device, constructed using MOSFET semiconductor
technology, placed in the system circuit will monitor the
current with the MOSFET detection circuit triggering to provide
an effective barrier behind which sensitive electronics are not
exposed to large voltages or currents during surge events. The
TBU® device operates in approximately 1 µs - once line current
exceeds the TBU® device’s trigger current Itrigger. When
operated, the TBU® device restricts line current to less than
1 mA typically. When operated, the TBU® device will block all
voltages including the surge up to rated limits.
GND
When the voltage on the SLIC output is driven below
(Vbat – Vto) the TBU-PL series device switches to the
blocking state, regardless of output current in the device.
2
Vdd
Line 1
SLIC
4
Line 1
1
MOV
C1
MOV
C2
After the surge, the TBU® device resets when the voltage
across the TBU® device falls to the Vreset level. The TBU®
device will automatically reset on lines which have no DC bias
or have DC bias below Vreset (such as unpowered signal lines).
TBU®
Device
Line 2
SLIC
Vss
-VBAT
Line 2
5
8
6
If the line has a normal DC bias above Vreset, the voltage
across the TBU® device may not fall below Vreset after the
surge. In such cases, special care needs to be taken to ensure
that the TBU® device will reset, with software monitoring as one
method used to accomplish this. Bourns application
engineers can provide further assistance.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TBU-PL Series - TBU® High-Speed Protectors
Bourns® TBU® Device Solutions
Industry Standard
Telcordia GR-1089-CORE
Intra-building
Port Type 4
Telcordia GR-1089-CORE
Intra-building
Port Type 4a
Non-GR-1089-CORE Intra-building
Specifications
ITU-T Basic K.20, K.21, K.45
ITU-T Enhanced K.20, K.21, K.45
Surge & AC Withstand
TBU® Device P/N
1500 V, 100 A 2/10 µs
120 Vrms, 25 A, 900 s
TBU-PL050-100-WH
1
MOV-07D201K
2
1000 V, 100 A 10/1000 µs
120 Vrms, 25 A, 900 s
TBU-PL060-100-WH
1
MOV-10D201K
2
TBU-PL085-100-WH
1
MOV-10D361K
2
TBU-PL085-100-WH
1
MOV-10D431K
2
TBU-PL075-100-WH
1
MOV-10D361K
2
TBU-PL060-100-WH
1
TISP4400M3BJ
2
TBU-PL085-100-WH
1
MOV-10D391K
2
TBU-PL060-100-WH
1
TISP4500H3BJ
2
5000 V, 500 A 2/10 µs
230 Vrms, 25 A, 900 s
1500 V, 100 A 2/10 µs
275 Vrms, 25 A, 900 s
4000 V, 40 Ω 10/700 µs
230 Vrms 10 Ω - 1000 Ω, 900 s
600 Vrms 600 Ω, 0.2 s
4000 V, 40 Ω 10/700 µs
230 V rms 10 Ω -1000 Ω, 900 s
600 V rms 600 Ω, 0.1 s
6000 V, 40 Ω 10/700 µs
240 Vrms 10 Ω - 1000 Ω, 900 s
600 Vrms 600 Ω, 0.2 s
600 Vrms 600 Ω, 1 s*
1500 Vrms, 200 Ω, 2 s*
6000 V, 40 Ω 10/700 µs
240 Vrms 10 Ω - 1000 Ω, 900 s
600 Vrms 600 Ω, 1 s
1500 Vrms, 200 Ω, 2 s
Qty.
OVP Device P/N
Qty.
* GDT Special Test Protector with DC breakdown (DCBD) of less than 330 V.
Notes:
1) The Le9500, Le9520 and Le9530 (VE950 series) require a 200 mA Itrigger TBU® device for normal operation. Other SLIC types should use
the 100 mA device.
2) The MOV maximum continuous rms voltage rating should not be exceeded. The exception is where the data sheet highlights withstand
capability such as the 600 Vrms, 1 A for 0.2 s, for example.
3) If EN55024 EMC compliance is required, the TBU® device may require capacitors to be fitted between the Tip and Ring connections and
ground (i.e. in parallel with the MOV device). The capacitance value can be chosen to meet levels as follows:
• 10 nF for EN55024 Level 1
• 20 nF for EN55024 Level 2
• 47 nF for EN55024 Level 3
Selection of capacitor voltage rating depends upon TBU® part number selection. Recommendations include:
• TBU-PL050 & TBU-PL060 Series: 120 VAC, 500 V Peak Surge Rated
• TBU-PL075 & TBU-PL085 Series: 240 VAC, 750 V Peak Surge Rated
Depending upon the SLIC type, it is usually possible to remove any EMI capacitors present between the output of the SLIC and ground
when using capacitors C1 and C2 in parallel with the MOVs.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TBU-PL Series - TBU® High-Speed Protectors
Performance Graphs
Typical Trigger Current vs. Temperature
Typical V-I Characteristics (TBU-PL085-200-WH)
1.8
1.6
ITRIGGER
Normalized Trigger Current
CURRENT
(50 mA/div)
VRESET
VOLTAGE
(5 V/div)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-75 -50 -25
0
25
50
75 100 125
Junction Temperature (°C)
Typical Resistance vs. Temperature
Tracking Voltage Characteristics
2.2
Vbat range of -25 V to -150 V
2.0
100
1.8
Normalized Resistance
Resistance ( )
90
80
70
60
50
40
-4
-3
-2
-1
0
1
2
3
4
Voltage threshold offset (V)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-75 -50 -25
0
25
50
75 100 125
Junction Temperature (°C)
Typical Surge Response
Power Derating Curve
3.0
Total Max. Power (W)
Voltage: 100 V/div
One Side, No PCB Cu
One Side, 0.5 sq. in. PCB Cu
Two Sides, No PCB Cu
Two Sides, 0.5 sq. in. PCB Cu
2.5
2.0
Time: 250 ns/div
1.5
Current: 100 mA/div
1.0
0.5
0.0
20
40
60
80
100
Ambient Temperature (°C)
120
140
(TBU-PL050-100-WH with MOV-07D201K
Using 1800 V 1.2/50 ms Surge Pulse)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TBU-PL Series - TBU® High-Speed Protectors
Product Dimensions
0.70
(.028)
0.725
(.029)
0.825
(.032)
0.40
(.016)
0.825
(.032)
0.85 ± 0.05
(.033 ± .002)
6.50
(.256)
1.335
(.053)
0.30
(.012)
1.15
(.045)
1.275
(.050)
0.30
(.012)
1.35
(.053)
1.20
(.047)
4.00
(.157)
0.85
(.033)
0.85
(.033)
0.73
(.029)
1.35
(.053)
1.275
(.050)
1.20
(.047)
0.85
(.033)
0.85
(.033)
PIN 1 & BACKSIDE CHAMFER
0.90
(.035)
0.85
(.033)
0.85
(.033)
1.335
(.053)
0.80 - 0.95
(.031 - .037)
1.275
(.050)
0.25
C
PIN 1
(.010)
1.25
(.049)
0.75
(.030)
1.30
(.051)
0.70
(.028)
0.00 - 0.05
(.000 - .002)
DIMENSIONS:
0.75
(.030)
0.40
(.016)
MM
(INCHES)
0.75
(.030)
Recommended Pad Layout
TBU® High-Speed Protectors have a 100 % matte-tin termination
finish. For improved thermal dissipation, the recommended layout
uses PCB copper areas which extend beyond the exposed solder
pad. The exposed solder pads should be defined by a solder mask
which matches the pad layout of the TBU® device in size and spacing. It is recommended that they should be the same dimension as
the TBU® pads but if smaller solder pads are used, they should be
centered on the TBU® package terminal pads and not more than
0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length.
Solder pad areas should not be larger than the TBU® pad sizes
to ensure adequate clearance is maintained. The recommended
stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil
opening size 0.025 mm (0.0010 in.) less than the solder pad
size. Extended copper areas beyond the solder pad significantly
improve the junction to ambient thermal resistance, resulting in
operation at lower junction temperatures with a corresponding
benefit of reliability. All pads should soldered to the PCB, including pads marked as NC or NU but no electrical connection should
be made to these pads. For minimum parasitic capacitance, it is
recommended that signal, ground or power signals are not routed
beneath any pad.
Thermal Resistance vs Additional PCB Cu Area
4
3
2
1
5
6
7
8
Dark grey areas show added PCB copper area for better
thermal resistance.
Thermal Resistance (°C/W)
120
Power in One Side of TBU® Device
Total Power in Both Sides of TBU® Device
100
80
60
40
20
0
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Added Cu Area (Sq. In.)
1.6
1.8
2.0
®
3312Series
- 2 mm
SMD
Trimming Potentiometer
TBU-PL
- TBU
High-Speed
Protectors
Reflow Profile
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time (tsmin to tsmax)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5 °C of Actual Peak Temp. (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Pb-Free Assembly
3 °C/sec. max.
150 °C
200 °C
60-180 sec.
217 °C
60-150 sec.
260 °C
20-40 sec.
6 °C/sec. max.
8 min. max.
How to Order
Typical Part Marking
TBU - PL 085 - 100 - WH
MANUFACTURER’S
TRADEMARK
TBU® Product
PRODUCT CODE
- 1ST DIGIT INDICATES PRODUCT FAMILY:
L = TBU-PL SERIES
- 2ND & 3RD DIGITS INDICATE IMPULSE VOLTAGE:
50 = 500 V
60 = 600 V
75 = 750 V
85 = 850 V
Series
PL = Dual Bidirectional Series
- 4TH DIGIT INDICATES TRIGGER CURRENT:
1 = 100 mA 2 = 200 mA
Impulse Voltage Rating
050 = 500 V
060 = 600 V
075 = 750 V
085 = 850 V
PIN 1
MANUFACTURING
DATE CODE
- 1ST DIGIT INDICATES THE YEAR’S 6-MONTH PERIOD.
- 2ND DIGIT INDICATES THE WEEK NUMBER IN THE 6-MONTH PERIOD.
- 3RD & 4TH DIGITS INDICATE SPECIFIC LOT FOR THE WEEK.
Trigger Current
100 = 100 mA
200 = 200 mA
Hold to Trip Ratio Suffix
W = Hold to Trip Ratio
6-MONTH PERIOD CODES:
A = JAN-JUN 2009
C = JAN-JUN 2010
B = JUL-DEC 2009
D = JUL-DEC 2010
Package Suffix
H = DFN Package
E = JAN-JUN 2011
F = JUL-DEC 2011
Device Pin Out
Pad Designation
2
Pin Out
Pad #
1
Line 1
5
Line 2 SLIC
2
6
Vss (SLIC Negative Supply or -Vbat)
3
Vdd (SLIC Ground or 0 V)
Not Used
7
Not Used
4
Line 1 SLIC
8
Line 2
Pad #
4
1
5
8
Pin Out
6
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
3312 - Series
2 mm SMD
Potentiometer
TBU-PL
- TBU®Trimming
High-Speed
Protectors
Packaging Specifications
P0
E
D
t
B
P2
TOP
COVER
TAPE
A
N
F
W
C
D
B0
K0
CENTER
LINES OF
CAVITY
A0
P
D1
EMBOSSMENT
G (MEASURED AT HUB)
USER DIRECTION OF FEED
QUANTITY: 3000 PIECES PER REEL
A
Min.
326
(12.835)
B
Max.
330
(13.002)
Min.
1.5
(.059)
A0
Min.
4.30
(.169)
B0
Max.
4.50
(.177)
Min.
6.70
(.264)
K0
Min.
1.0
(.039)
C
Max.
2.5
(.098)
Min.
7.9
(.311)
D
Max.
13.5
(.531)
D
Max.
6.90
(.272)
Min.
1.5
(.059)
P
Max.
1.2
(.047)
Min.
12.8
(.504)
Min.
1.5
(.059)
Min.
3.9
(.159)
E
Max.
-
Min.
1.65
(.065)
P2
Max.
4.1
(.161)
Min.
1.9
(.075)
G
Ref.
16.5
(.650)
Max.
D1
Max.
1.6
(.063)
P0
Max.
8.1
(.319)
Min.
20.2
(.795)
F
Max.
1.85
(.073)
Min.
7.4
(.291)
Max.
0.35
(.014)
Min.
15.7
(.618)
t
Max.
2.1
(.083)
Min.
0.25
(.010)
N
Ref.
102
(4.016)
max.
7.6
(.299)
W
DIMENSIONS:
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
REV. 01/25/12
“TBU” is a registered trademark of Bourns, Inc. in the United States and other countries.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Max.
16.3
(.642)
MM
(INCHES)
T
PL
IA
N
M
CO
*R
oH
S
A
E075050
5
Features
Applications
■ Superior circuit protection
■ Voice / VDSL cards
■ Overcurrent and overvoltage protection
■ Protection modules and dongles
■ Blocks surges up to rated limits
■ Process control equipment
■ High-speed performance
■ Test and measurement equipment
■ Small SMT package
■ General electronics
■ Agency listing:
TBU-CA Series - TBU® High-Speed Protectors
General Information
Agency Listing
The TBU-CA Series of Bourns® TBU®
Line In/
products are low capacitance single
Line Out
bidirectional high-speed protection
components, constructed using MOSFET
semiconductor technology, and designed
to protect against faults caused by short
circuits, AC power cross, induction and lightning surges.
Line Out/
Line In
Description
File Number: E315805
UL
TBU® Device
The TBU® high-speed protector placed in the system circuit will monitor the current with
the MOSFET detection circuit triggering to provide an effective barrier behind which
sensitive electronics will not be exposed to large voltages or currents during surge
events. The TBU® device is provided in a surface mount DFN package and meets
industry standard requirements such as RoHS and Pb Free solder reflow profiles.
Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted)
Symbol
Parameter
Vimp
Peak impulse voltage withstand with duration less than 10 ms
Vrms
Continuous A.C. RMS voltage
Top
Tstg
Tjmax
ESD
Operating temperature range
Storage temperature range
Maximum Junction Temperature
HBM ESD protection per IEC 61000-4-2
Part Number
TBU-CA025-xxx-WH
TBU-CA040-xxx-WH
TBU-CA050-xxx-WH
TBU-CA065-xxx-WH
TBU-CA085-xxx-WH
TBU-CA025-xxx-WH
TBU-CA040-xxx-WH
TBU-CA050-xxx-WH
TBU-CA065-xxx-WH
TBU-CA085-xxx-WH
Value
250
400
500
650
850
100
200
250
300
425
-55 to +125
-65 to +150
+125
±2
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Unit
V
V
°C
°C
°C
kV
TBU-CA Series - TBU® High-Speed Protectors
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Symbol
Itrigger
Rdevice
tblock
Parameter
Part Number
Min.
Typ.
Max.
Unit
Current required for the device to go from operating state to
protected state
TBU-CAxxx-050-WH
TBU-CAxxx-100-WH
TBU-CAxxx-200-WH
TBU-CAxxx-300-WH
TBU-CAxxx-500-WH
50
100
200
300
500
75
150
300
450
750
100
200
400
600
1000
mA
Series resistance of
the TBU device
Vimp = 250 V
Vimp = 250 V
Vimp = 250 V
Vimp = 250 V
Vimp = 250 V
Itrigger (min.) = 50 mA
Itrigger (min.) = 100 mA
Itrigger (min.) = 200 mA
Itrigger (min.) = 300 mA
Itrigger (min.) = 500 mA
TBU-CA025-050-WH
TBU-CA025-100-WH
TBU-CA025-200-WH
TBU-CA025-300-WH
TBU-CA025-500-WH
13.3
7.1
4.2
3.2
2.6
15.3
8.2
4.8
3.8
3.0
Vimp = 400 V
Vimp = 400 V
Vimp = 400 V
Vimp = 400 V
Vimp = 400 V
Itrigger (min.) = 50 mA
Itrigger (min.) = 100 mA
Itrigger (min.) = 200 mA
Itrigger (min.) = 300 mA
Itrigger (min.) = 500 mA
TBU-CA040-050-WH
TBU-CA040-100-WH
TBU-CA040-200-WH
TBU-CA040-300-WH
TBU-CA040-500-WH
14.3
8.1
5.2
4.3
3.6
16.5
9.4
6.0
5.0
4.2
Vimp = 500 V
Vimp = 500 V
Vimp = 500 V
Vimp = 500 V
Vimp = 500 V
Itrigger (min.) = 50 mA
Itrigger (min.) = 100 mA
Itrigger (min.) = 200 mA
Itrigger (min.) = 300 mA
Itrigger (min.) = 500 mA
TBU-CA050-050-WH
TBU-CA050-100-WH
TBU-CA050-200-WH
TBU-CA050-300-WH
TBU-CA050-500-WH
15.7
9.5
6.6
5.6
5.0
18.0
10.9
7.5
6.5
5.7
Vimp = 650 V
Vimp = 650 V
Vimp = 650 V
Vimp = 650 V
Vimp = 650 V
Itrigger (min.) = 50 mA
Itrigger (min.) = 100 mA
Itrigger (min.) = 200 mA
Itrigger (min.) = 300 mA
Itrigger (min.) = 500 mA
TBU-CA065-050-WH
TBU-CA065-100-WH
TBU-CA065-200-WH
TBU-CA065-300-WH
TBU-CA065-500-WH
17.7
11.5
8.6
7.6
7.0
20.3
13.2
9.8
8.8
8.0
Vimp = 850 V
Vimp = 850 V
Vimp = 850 V
Vimp = 850 V
Vimp = 850 V
Itrigger (min.) = 50 mA
Itrigger (min.) = 100 mA
Itrigger (min.) = 200 mA
Itrigger (min.) = 300 mA
Itrigger (min.) = 500 mA
TBU-CA085-050-WH
TBU-CA085-100-WH
TBU-CA085-200-WH
TBU-CA085-300-WH
TBU-CA085-500-WH
21.4
15.2
12.3
11.3
10.7
24.5
17.4
14.0
13.0
12.2
Time for the device to go from normal operating state to protected state
®
Ω
1
µs
IQ
Current through the triggered TBU device with 50 Vdc circuit voltage
Vreset
Voltage below which the triggered TBU® device will transition to normal operating state
0.25
0.50
1.00
mA
12
16
20
V
Rth(j-l)
Junction to package pads - FR4 using recommended pad layout
98
°C/W
Rth(j-l)
Junction to package pads - FR4 using heat sink on board (6 cm2) (1 in2)
40
°C/W
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TBU-CA Series - TBU® High-Speed Protectors
Reference Application
Basic TBU Operation
®
The TBU devices are general use protectors used in a wide
variety of applications. The maximum voltage rating of the TBU®
device should never be exceeded. Where necessary, an OVP
should be employed to limit the maximum voltage. A costeffective protection solution combines Bourns® TBU® protection
devices with a pair of Bourns® MOVs. For bandwidth sensitive
applications, a Bourns® GDT may be substituted for the MOV.
Line In /
Line Out
Line Out
/ Line In
Equip.
Line
TBU ®
Device
OVP
TBU ®
Device
OVP
Line In /
Line Out
Line Out
/ Line In
Line
The TBU® device, constructed using MOSFET semiconductor
technology, placed in the system circuit will monitor the
current with the MOSFET detection circuit triggering to provide
an effective barrier behind which sensitive electronics are not
exposed to large voltages or currents during surge events. The
TBU® device operates in approximately 1 μs - once line
current exceeds the TBU® device’s trigger current Itrigger.
When operated, the TBU® device restricts line current to less
than 1 mA typically. When operated, the TBU® device will
block all voltages including the surge up to rated limits.
After the surge, the TBU® device resets when the voltage
across the TBU® device falls to the Vreset level. The TBU®
device will automatically reset on lines which have no DC bias
or have DC bias below Vreset (such as unpowered signal lines).
If the line has a normal DC bias above Vreset, the voltage
across the TBU® device may not fall below Vreset after the
surge. In such cases, special care needs to be taken to ensure
that the TBU® device will reset, with software monitoring as one
method used to accomplish this. Bourns application
engineers can provide further assistance.
Performance Graphs
Typical V-I Characteristics (TBU-CA050-300-WH)
Typical Trigger Current vs. Temperature
1.8
Normalized Trip Current (A)
ITRIP
CURRENT
(100 mA/div)
VRESET
VOLTAGE
(5 V/div)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-75 -50 -25
0
25
50
75 100 125 150
Junction Temperature (°C)
Power Derating Curve
Typical Resistance vs. Temperature
2.2
3.0
Normalized Resistance (Ω)
No Additional PCB Cu
0.5 sq. in. Additional PCB Cu
Total Max. Power (W)
2.5
2.0
1.5
1.0
0.5
0.0
20
40
60
80
100
120
140
Junction Temperature (°C)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-75 -50 -25
0
25
50
75 100 125 150
Junction Temperature (°C)
TBU-CA Series - TBU® High-Speed Protectors
Product Dimensions
0.70
(.028)
0.80
(.031)
0.70
(.028)
1.85
(.073)
6.50 ± 0.10
(.256 ± .004)
0.85 ± 0.05
(.033 ± .002)
0.30
(.012)
4.00 ± 0.10
(.157 ± .004)
1.85
(.073)
3.40
(.134)
0.30
(.012)
PIN 1 & BACKSIDE CHAMFER
0.00 - 0.05
(.000 - .002)
DIMENSIONS:
MM
(INCHES)
C
0.25
PIN 1
(.010)
Pad Designation
Pad #
Pin Out
1
Line In/Out
2
NU
3
Line Out/In
Recommended Pad Layout
TBU® High-Speed Protectors have a 100 % matte-tin termination
finish. For improved thermal dissipation, the recommended layout
uses PCB copper areas which extend beyond the exposed solder
pad. The exposed solder pads should be defined by a solder mask
which matches the pad layout of the TBU® device in size and spacing. It is recommended that they should be the same dimension as
the TBU® pads but if smaller solder pads are used, they should be
centered on the TBU® package terminal pads and not more than
0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length.
Solder pad areas should not be larger than the TBU® pad sizes
to ensure adequate clearance is maintained. The recommended
stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil
opening size 0.025 mm (0.0010 in.) less than the solder pad size.
Extended copper areas beyond the solder pad significantly improve
the junction to ambient thermal resistance, resulting in operation
at lower junction temperatures with a corresponding benefit of reliability. All pads should soldered to the PCB, including pads marked
as NC or NU but no electrical connection should be made to these
pads. For minimum parasitic capacitance, it is recommended that
signal, ground or power signals are not routed beneath any pad.
3
2
1
Dark grey areas show added PCB copper area for better
thermal resistance.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TBU-CA Series - TBU® High-Speed Protectors
Reflow Profile
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time (tsmin to tsmax)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5 °C of Actual Peak Temp. (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Pb-Free Assembly
3 °C/sec. max.
150 °C
200 °C
60-180 sec.
217 °C
60-150 sec.
260 °C
20-40 sec.
6 °C/sec. max.
8 min. max.
How to Order
Typical Part Marking
TBU - CA 085 - 500 - WH
MANUFACTURER’S
TRADEMARK
TBU® Product
PRODUCT CODE
- 1ST DIGIT INDICATES PRODUCT FAMILY:
A = TBU-CA SERIES
Series
CA = Bi-Series
- 2ND & 3RD DIGITS INDICATE IMPULSE VOLTAGE:
25 = 250 V
40 = 400 V
50 = 500 V
65 = 650 V
85 = 850 V
Impulse Voltage Rating
025 = 250 V
040 = 400 V
050 = 500 V
065 = 650 V
085 = 850 V
- 4TH & 5TH DIGITS INDICATE TRIGGER CURRENT:
05 = 50 mA
10 = 100 mA 20 = 200 mA
30 = 300 mA
50 = 500 mA
Trigger Current
050 = 50 mA
100 = 100 mA
200 = 200 mA
300 = 300 mA
500 = 500 mA
PIN 1
MANUFACTURING
DATE CODE
- 1ST DIGIT INDICATES THE YEAR’S 6-MONTH PERIOD.
- 2ND DIGIT INDICATES THE WEEK NUMBER IN THE 6-MONTH PERIOD.
- 3RD & 4TH DIGITS INDICATE SPECIFIC LOT FOR THE WEEK.
6-MONTH PERIOD CODES:
A = JAN-JUN 2009
C = JAN-JUN 2010
B = JUL-DEC 2009
D = JUL-DEC 2010
E = JAN-JUN 2011
F = JUL-DEC 2011
Hold to Trip Ratio Suffix
W = Hold to Trip Ratio
Package Suffix
H = DFN Package
Thermal Resistance vs Additional PCB Cu Area
Thermal Resistance (°C/W)
120
100
80
60
40
20
0
0
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Added Cu Area (Sq. In.)
1.6
1.8
2.0
TBU-CA Series - TBU® High-Speed Protectors
Packaging Specifications
P0
E
D
t
B
P2
TOP
COVER
TAPE
A
N
F
W
C
D
B0
K0
CENTER
LINES OF
CAVITY
A0
P
D1
EMBOSSMENT
G (MEASURED AT HUB)
USER DIRECTION OF FEED
QUANTITY: 3000 PIECES PER REEL
A
Min.
326
(12.835)
B
Max.
330
(13.002)
Min.
1.5
(.059)
A0
Min.
4.3
(.169)
B0
Max.
4.5
(.177)
Min.
6.7
(.264)
K0
Min.
1.0
(.039)
C
Max.
2.5
(.098)
Min.
7.9
(.311)
D
Max.
13.5
(.531)
D
Max.
6.9
(.272)
Min.
1.5
(.059)
P
Max.
1.2
(.047)
Min.
12.8
(.504)
Min.
1.5
(.059)
Min.
3.9
(.159)
E
Max.
-
Min.
1.65
(.065)
P2
Max.
4.1
(.161)
Min.
1.9
(.075)
G
Ref.
16.5
(.650)
Max.
D1
Max.
1.6
(.063)
P0
Max.
8.1
(.319)
Min.
20.2
(.795)
F
Max.
1.85
(.073)
Min.
7.4
(.291)
Max.
0.35
(.014)
Min.
15.7
(.618)
t
Max.
2.1
(.083)
Min.
0.25
(.010)
N
Ref.
102
(4.016)
max.
7.6
(.299)
W
DIMENSIONS:
Max.
16.3
(.642)
MM
(INCHES)
REV. 10/12
“TBU” is a registered trademark of Bourns, Inc. in the United States and other countries.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.