,
August 2014
COLAE: Commercialization Clusters of OLAE
White Paper: Standardization in OLAE
- A European Perspective
© COLAE 2012
Project name: Commercialization Clusters of OLAE
Acronym: COLAE
Project type: Coordination and support action
Starting date: 1 September 2011
Duration: 36 months
Call: FP7-ICT-2011-7
Grant agreement number: 288881
Website: www.colae.eu
Compiled by
Ralf Mauer
Ralf.Mauer@innovationlab.de
Executive Summary
COLAE is a pan-European initiative to foster the commercialisation of Organic and Large Area Electronics (OLAE).
It is funded by the European Commission. In order to achieve its goals, the COLAE consortium is actively trying to
support European industry in its efforts to bring OLAE technologies to market. Therefore, this white paper focuses on
specific aspects particularly relevant for Europe without neglecting the international dimension of standardisation.
The aim of this document is to raise the awareness for the ongoing standardization activities in the field of organic
and large area electronics. It contains a short overview on how to benefit from an active engagement in the
standardization process, what the current status of standardization of OLAE technologies is and a simple instruction
on how to engage.
There is a wide variety of reasons why companies should engage in standardization rather than wait for their
competitors to develop standards. Among the most important benefits of technical standards are that they can
increase market volume, facilitate internationalisation strategies and reduce financial risk in product development.
Standardization of OLAE technologies has just recently started, but is rapidly gaining importance with ongoing
activities in a variety of both public and private standards developing organizations (SDOs). This document contains
an introduction of the three most important SDOs dealing with OLAE technologies: IEC (public), IEEE and IPC (both
private). At the moment these activities converge on IEC level. IEC operates 9 technical committees that are of direct
relevance for OLAE technologies, particularly “TC 119 Printed Electronics” which is the only technical committee that
specifically focuses on Organic and Large Area Electronics. TC 119 addresses the standardization of terminology,
materials, equipment, printability, and quality assessment of printed electronics. Currently, the members of TC119
are working on 10 standardization projects. The first standards by this committee are expected to be published by the
end of 2016. TC 119 is strongly dominated by an Asian presence: Approximately two thirds of the technical experts in
TC119 represent Asian countries and 8 of the 10 draft standards in development are convened by Asian experts.
There are no barriers to engage in the standardization process. The contribution to public SDOs is free of charge. In
order to join a national mirror group to a technical committee of IEC it is recommended to contact the appropriate
national SDO. In the case of private SDOs, a paid membership is required for a participation in standardization.
Content
Introduction ............................................................................................................................................................. 4
Benefits and drawbacks of technical standards ........................................................................................................ 5
Benefits of technical standards ............................................................................................................................ 5
Drawbacks of technical standards ........................................................................................................................ 6
Example for printed electronics ............................................................................................................................ 6
Current status of the standardization of OLAE technologies .....................................................................................7
Relevant Standards Developing Organizations .....................................................................................................7
Public SDOs ......................................................................................................................................................7
Private SDOs .................................................................................................................................................... 8
Cooperation between public and private SDOs ................................................................................................ 9
Status of standardization of OLAE technologies .................................................................................................10
IPC ..................................................................................................................................................................10
IEEE ................................................................................................................................................................10
IEC .................................................................................................................................................................. 11
The specific case of IEC TC 119 Printed Electronics .......................................................................................... 11
How to engage in the standardization process ........................................................................................................ 13
Summary ................................................................................................................................................................14
Appendix I: List of CENELEC member countries and national Standards Developing Organizations ....................... 15
Appendix II: Structure of IEC TC 119 Printed Electronics .......................................................................................... 17
Appendix III: Useful Links ........................................................................................................................................18
3
Introduction
This white paper is aimed at raising the awareness for the on-going standardization process for organic and large
area electronics and will discuss the benefits of participating in this process. It will give answers to the following
questions:

Why participate in the standardization process of OLAE technologies?

What is the current status of standardization of OLAE technologies?

How to participate in the standardization process?
In the first section, the advantages and disadvantages of technical standards will be discussed in order to highlight
ways for a wide variety of actors to benefit from standardization. An exemplary draft standard from IEC TC 119
Printed Electronics (see below) will be presented.
In the second section, the current status of standardization of OLAE technologies will be described. This includes an
introduction to both public and private standards developing organizations (SDOs) active in the standardization of
OLAE technologies. Most focus will be put on public standardization in the International Electrotechnical
Commission (IEC), specifically on its technical committee for printed electronics (TC 119 Printed Electronics) as this is
the first instance of a technical committee within IEC that exclusively deals with topics specific to an OLAE
technology.
Finally, a simple instruction will be given on how to engage in the standardization process. This instruction will
include both public and private SDOs and aims at reducing barriers to participate in any of these organizations.
4
Benefits and drawbacks of technical standards
The trade-off between advantages and disadvantages of technical standards has been subject to discussion in a
1
wide range of contexts. In this section a brief summary will be presented. Furthermore, participation in
standardization grants access to a wide pool of knowledge. Early access to draft standards can also bring a
competitive advantage towards companies who do not participate in the process and are only informed about new or
revised standards when they are published.
Benefits of technical standards
It is generally agreed that standardization can be particularly beneficial to all parties involved in the process in three
ways:

Encourage innovation and competition:
o
o
o
o
o
o
o

Facilitate interoperability:
o
o

Easier combination or interchangeability of products or services
Reduced risk of choosing a future “loser technology”
Decrease financial risk in product development:
o
o
o
o
o
1
More suppliers with comparable offerings leading to lower prices
Easier evaluation of competitive offerings
Lower switching costs
Certification according to standards increases trust of buyers
Network-effects: greater availability of complementary products or services
Easier communication between actors
Larger number of stakeholders in the market
R&D efforts of multiple parties are combined
Less duplicity of R&D efforts
Easier estimation of market entry barriers (e.g. certifications)
Leverage network-effects: Focus development on complementary products or services
Internationalisation: Product development activities do not have to be repeated for different
regions or nations.
For a detailed discussion see e.g.: http://www.itu.int/en/ITU-T/Documents/Manual_Patents_Final_E.pdf
5
Drawbacks of technical standards
Technical standards can sometimes also have unintended drawbacks that should be considered carefully:

Protecting markets by obstructing access:
o
o

Highly specific certification requirements can hamper market accessibility
Reluctance to adopt new or improved standards can limit market access for improved products or
services
Loss of variety:
o
o

Fewer products optimized for niche applications
Less diversity between technical approaches, especially in early standardization of emerging
technologies
Dominance of large players active in standardization:
o
There is a tendency towards underrepresentation of small and medium sized enterprises in the
standardization process. Therefore, standards can contain a bias towards large vendors or
purchasers.
Example for printed electronics
In order to demonstrate possible advantages and disadvantages of technical standards, a standard that is currently
under development by IEC TC 119 Printed Electronics will be discussed in this section. As an example the draft
standard IEC 62899-2-1 Ed. 1.0 „Printed electronics - Materials - Part 2-1: Conductive Material Ink” (status: first
committee draft) is chosen.
It is the specific scope of this draft to standardize matters related to conductive material inks. In order to avoid the
risk of limiting the variety of conductive inks in the marketplace, it was decided not to standardize the material itself,
but rather what kind of information should be contained in specification sheets for conductive inks and how to obtain
this information. At the same time this approach leverages many of the benefits offered by standardization. When a
material will be specified according to this standard a buyer ideally will be confident that the material fulfills his
requirements without the need to fully test it himself. It will also facilitate transitions between sellers through an
improved comparability of offerings, which significantly reduces the risk of depending on a single seller. Sellers will
benefit from such a reduction of market entry barriers in that there will be more buyers in the market willing to
purchase materials. Furthermore, R&D efforts for the development of new inks can be channeled more efficiently,
because the requirements of buyers are taken into account in the development of the standard and are thus
articulated very transparently.
6
Current status of the standardization of OLAE technologies
Relevant Standards Developing Organizations
There is a variety of Standards Developing Organizations (SDOs), both public and private, that deal with the
development of standards that are of relevance for the Organic and Large Area Electronics industry. Each of these
SDOs sets its own specific guidelines and procedures for the development of standards, but all share the approach of
voluntary, consensus-based and international standardization. In public SDOs, national committees elect delegations
of industry representatives that participate in international committees and implement national interests. In private
SDOs usually a paid membership of either individuals, e.g. in IEEE, or organizations, e.g. in IPC, is required for a full
participation in the standardization process and participation on international level is purely based on individual
interests and does not require a national consensus as is the case in public SDOs. In the following sections an
overview of the relevant SDOs for the standardization of OLAE is presented.
Public SDOs
Standardization in public SDOs generally happens on three different levels: national, regional (i.e. supranational
level like Europe) and international (i.e. worldwide) level. On international level, the World Standardization
Cooperation was established by the three international SDOs: ISO, IEC and ITU. Of these three the ISO covers
general standardization, IEC is specialized in the preparation of international standards for all electrical, electronic,
and related technologies, whereas the ITU is focused on standardization for telecommunication. These three
international SDOs are mirrored on regional level and national level. In the specific case of regional standardization in
Europe, CEN, CENELEC and ETSI mirror ISO, IEC and ITU respectively (see Figure 1).
Figure 1. Overview of public SDOs on national, regional and international level.
7
For the activities of IEC it was agreed by the member states to elaborate standards on international level first and
to adopt these international standards on national level later in order to avoid fragmentation of standardization
efforts. Consequently, the regional level, i.e. CENELEC in Europe, usually does not play a significant role in the
standardization process. It can however be used to come to a regional consensus that can be pushed forward with
more emphasis on international level than individual nations could do. A list of the member states of CENELEC and
respective national SDOs can be found in the Appendix.
Standardization in IEC is organized in technical committees (TCs) that are formed by delegates of national SDOs.
These delegates are elected in national mirror groups to the corresponding IEC technical committees (see also Figure
2). National SDOs only participate in IEC TCs if there is sufficient interest from technology experts within the
respective country.
One example of such a technical committee with relevance for organic and large area electronics is IEC TC 119
Printed Electronics which was founded in 2012. Currently, 13 national SDOs are sending delegations to working
meetings of this TC twice per year. Each of these SDOs operates a national mirror group (e.g. GUK 682.1 Printed
Electronics at DKE in Germany) that is involved in the elaboration of standards and elects the national delegation
participating in IEC meetings. The latest national SDO to set up such a mirror group was Switzerland with the
support of partners from COLAE. CENELEC has a Reporting Secretariat (SR) that mirrors the activities in IEC: CLC/SR
119 Printed Electronics. However, this SR only serves the purpose to inform the CENELEC Technical Board about IEC
activities that could be of interest for CENELEC. It does not participate in standardization projects and does not hold
any meetings.
Private SDOs
The most notable private standards developing organisation in the field of Organic and Large Area Electronics are
the IPC – Association Connecting Electronics Industries (IPC) and the Institute of Electrical and Electronics Engineers
(IEEE).
IPC – Association Connecting Electronics Industries
IPC is a global industry association dedicated to furthering the competitive excellence and financial success of its
members, who are participants in the electronics industry. In pursuit of these objectives, IPC devotes resources to
management improvement and technology enhancement programs, the creation of relevant standards, protection
2
of the environment, and pertinent government relations. IPC currently has 3528 members, mainly from North
2
Source: http://www.ipc.org
8
America (63 %), Asia (21 %) and Europe (14 %). IPC membership is site specific, meaning that membership is granted
for sites of companies rather than for individuals within companies or entire companies. Within IPC, technical
standards are being developed consensus-based in Standards Committees that are open to all members of IPC. IPC
publishes standards in close collaboration with the Japan Electronics Packaging and Circuits Association JPCA
(www.jpca.jp).
IEEE
IEEE is the world’s largest professional association dedicated to advancing technological innovation and excellence
for the benefit of humanity. IEEE and its members inspire a global community through its highly cited publications,
3
conferences, technology standards, and professional and educational activities. IEEE membership is granted to
individual professionals rather than to organizations.
Within IEEE, technical standards are being developed in Working Groups of the IEEE Standards Association (IEEESA) in a consensus-based process. Participation in these working groups is open to both members and non-members
of IEEE-SA. However, only paying participants are allowed to vote (i.e. members of IEEE or pay-per-vote) on the
adoption of draft standards (for more information on the IEEE-SA standards development process see
http://standards.ieee.org/).
Cooperation between public and private SDOs
IEC and IPC
IEC and IPC are currently evaluating a liaison between IEC TC 119 and IPC D-60 that would allow members of IPC to
participate in IEC TC 119. The aim of such a liaison would be to avoid destructive generation of inadvertent
contradictions between IEC and IPC standards and an additional source of expertise for the work in IEC TC 119.
IEC and IEEE
IEC and IEEE have a so called IEC/IEEE dual logo agreement (see http://standards.ieee.org/develop/intl/iec.html).
This agreement includes processing suitable IEEE standards through the IEC procedure in order to ratify them as
public standards and also a co-development of new and existing standards. IEEE standards that have been adopted
by IEC and jointly developed standards feature the logos of both organisations. The standard IEC 62860/ IEEE Std
1620™ is an example for a dual logo standard that relates to OLAE.
3
Source: http://www.ieee.org
9
Status of standardization of OLAE technologies
Currently, a trend can be observed that leads to a focusing of standardization activities for OLAE on an
international level in the IEC. Standards that have been developed by IEEE in the past have been adopted by IEC and
will be updated there. IPC is currently requesting a liaison to IEC TC 119 Printed Electronics that includes a permission
to contribute directly to IEC standards under development. Therefore, this section will put more emphasis on the
current status of standardization in the IEC and will mention IPC and IEEE only briefly.
IPC
IPC maintains the “IPC Printed Electronics Initiative” that aims at supporting the development of the printed
electronics market by facilitating international, consensus-based industry standards. The corresponding Standards
Committee is D-60 “Printed Electronics” with six subcommittees:
4

D-61 “Printed Electronics Design”,

D-62 “Printed Electronics Base Materials/Substrates”,

D-63 “Printed Electronics Functional Materials”,

D-64 “Printed Electronics Final Assembly”,

D-65 “Printed Electronics Test Methods” (currently in formation) and

D-66 “Printed Electronics Processes”.
Up to date, the IPC committee for Printed Electronics has released the following international standards:

IPC/JPCA-2291 “Design Guideline for Printed Electronics”,

IPC/JPCA-4921 “Requirements for Printed Electronics Base Materials” (Substrates), and

IPC/JPCA-4591 “Requirements for Printed Electronics Functional Materials”.

IPC/JPCA-6901 “Performance Requirements for Printed Electronics Assemblies” (Initial Draft Status)
IEEE
5
IEEE operates the “Printed and Organic Electronics Working Group” that has published a widely recognized
standard on organic transistor and materials characterization: IEEE Std P1620™. Based on this document a second
standard has been published: IEEE Std 1620.1™ ”Test Methods for the Characterization of Organic Transistor Based
Ring Oscillators “. In 2013 both of these have been adopted by the IEC as international standards IEC 62860 and IEC
62860-1, respectively.
4
5
Source: http://www.ipc.org/ContentPage.aspx?pageid=Printed-Electronics-Initiative
http://grouper.ieee.org/groups/printedelectronics/
10
IEC
The IEC currently operates 97 technical committees. 9 of those are of direct relevance for the standardization of
OLAE technologies:









TC 21 Secondary cells and batteries (for rechargeable printed batteries)
TC35: Primary cells and batteries (for single use printed batteries)
TC34 Lamps and related equipment (for OLED lighting)
TC47 Semiconductor devices
TC82 Solar photovoltaic energy systems (for OPV)
TC91 Electronics assembly technology
TC110 Electronic display devices (for OLED display)
TC113 Nanotechnology
TC 119 Printed Electronics
The specific case of IEC TC 119 Printed Electronics
IEC TC 119 was the first IEC technical committee that was founded specifically by the OLAE community. All other
standardization efforts for OLAE technologies have thus far been integrated into the activities of existing TCs.
Therefore the activities within TC 119 are of special interest for this report, even though they only cover the
“printable part” of OLAE technologies. Detailed information about TC 119 can be retrieved from the IEC website
(www.iec.ch) or Appendix II. Due to the interdisciplinary nature of printed electronics, TC 119 maintains close liaisons
to the TCs mentioned above and also to technical committees outside of IEC, e.g. ISO TC 130 “Graphic Technology”.
Members of TC 119. Currently the membership of TC 119 consists of 13 participating countries and 8 observer
countries. Europe is represented in TC 119 by 8 participating countries and 4 observing countries. A list of European
countries involved in TC 119 can be found in Appendix 1 “List of CENELEC member countries and national Standards
Developing Organizations”.
Working Groups. At the time of writing TC 119 consists of five working groups and one advisory group. As listed
below, Europe is represented by one third of the members (i.e. technical experts) of the working groups. Additionally,
TC 119 has two Ad hoc Groups AhG 7 “Printed Products” and AhG 8 “Roadmapping” that will get the status of
Working Groups once they have started the work on a first standardisation project.
#
Name
Convenor
Members
European Members
WG 1
Terminology
GB
18
6
WG 2
Materials
JP
34
11
WG 3
Equipment
KR
24
5
WG 4
Printability
KR
23
5
WG 5
Quality assessment
DE
10
3
AG 1
Advisory Group
GB
16
6
11
TC 119 Work programme. At the moment 10 standardization projects are ongoing within TC 119. Two of those are
st
in the status of “1 committee draft”, seven are “Approved New Work” and one is “Proposed New Work”. The earliest
estimated publication date for a standard resulting from these projects is December 2016. This reflects the young age
of the committee:
Project Reference
Title
Stage
Document
Reference
Working
Group
Project
Leader
Forecast
Publication
Date
IEC 62899-1 Ed. 1.0
Printed electronics - Materials Part 1 : Substrates
Printed electronics - Materials Part 2-1: Conductive Material
Ink
Measurement of pattern width
in printed electronics
Equipment - General - Contact
printing - Rigid master - Part 1 Measurement method of plate
master external dimension
Equipment - General - Contact
printing - Rigid master - Part 2 Measurement method of plate
master pattern dimension
Equipment-Inkjet-Head
performance - A measurement
method of jetting speed
Printed Electronics Vocabulary
Quality assessment in printed
electronics - Part x: Flexible
and/or bendable primary or
secondary cells: Failure modes
and mechanical testing
1CD
119/48/CD
02
JP
2016-12
1CD
119/49A/CD
02
JP
2016-12
ANW
119/20/NP
04
KR
2016-11
ANW
119/21/NP
03
KR
2016-11
ANW
119/22/NP
03
KR
2016-11
ANW
119/23/NP
03
KR
2016-11
ANW
119/25/NP
01
DE
2017-05
ANW
119/39/NP
05
DE
2017-11
Printed electronics - Quality
assessment - Part x:
Mechanical stress on printed
OLED lighting devices formed
on flexible substrates
Printed electronics - Materials Part 10-100: Silver wire ink (film
resistance)Printed electronics Materials - Part 10-100: Silver
wire ink (film resistance)
ANW
119/40/NP
05
JP
2017-11
PNW
119/46/NP
02
KR
IEC 62899-2-1 Ed. 1.0
IEC 62902 Ed. 1.0
IEC 62903-1 Ed. 1.0
IEC 62903-2 Ed. 1.0
IEC 62904 Ed. 1.0
IEC 62905 Ed. 1.0
IEC 62946-1 Ed. 1.0
IEC 62946-2 Ed. 1.0
PNW 119-46 Ed. 1.0
12
How to engage in the standardization process
Stakeholders who wish to join the standardization process have to identify a suitable SDO and technical committee
within the respective SDO. Figure 2 depicts a simplified decision tree demonstrating the choices and actions that
lead towards a participation in a desired committee. As the first step, a decision has to be found, whether
participation in a public or private SDO is more desirable.
Private SDOs. If engagement in a private SDO is more desirable, the preferred type of engagement, i.e. either
personal (IEEE) or organizational (IPC) engagement, can be used as a basis for the decision making process. In the
case of engagement in IEEE there is a chance that standards developed in working groups are adopted by IEC under
the dual logo agreement. In the case of IPC, it is possible for members of standards committees (SCs) to join IEC
technical committees that have an official partnership agreement with IPC (e.g. for IEC TC 119). Information on
how to join a private SDO can be found on the respective websites www.ieee.org or www.ipc.org.
Public SDOs. In public SDOs a membership in a national mirror group is required for an engagement in the
standardization process. The membership in a national mirror group includes the possibility to become an elected
delegate representing national interests on IEC level (elections are on a personal basis, not organizational). In case
that such a mirror group does not exist in the country of origin, it can be founded by contacting the responsible
national SDO and gathering a sufficient number of experts (typically at least five) who are willing to participate in
such a mirror group. The COLAE consortium can give support in setting up national mirror groups. In cases where it
is not possible to join or found a national mirror group, interested stakeholders have to revert to joining a private
SDO.
Figure 2. Process flow for engaging in the standardization process.
13
Summary
The aim of this document is to raise the awareness for the ongoing standardization activities in the field of organic
and large area electronics. It contains an overview on how to benefit from an active engagement in the
standardization process, what the current status of standardization of OLAE technologies is and a simple instruction
on how to engage.
There is a wide variety of reasons why companies should engage in standardization rather than wait for their
competitors to develop standards. Among the most important benefits of technical standards are that they can
increase market volume, facilitate internationalisation strategies and reduce financial risk in product development.
Standardization of OLAE technologies has just recently started, but is rapidly gaining importance with ongoing
activities in a variety of both public and private standards developing organizations (SDOs). This document contains
an introduction of the three most important SDOs dealing with OLAE technologies: IEC (public), IEEE and IPC (both
private). At the moment these activities converge on IEC level. IEC operates 9 technical committees that are of direct
relevance for OLAE technologies, particularly “TC 119 Printed Electronics” which is the only technical committee that
specifically focuses on Organic and Large Area Electronics. TC 119 addresses the standardization of terminology,
materials, equipment, printability, and quality assessment of printed electronics. Currently, the members of TC119
are working on 10 standardization projects. The first standards by this committee are expected to be published by
the end of 2016. TC 119 is strongly dominated by an Asian presence: Approximately two thirds of the technical
experts in TC119 represent Asian countries and 8 of the 10 draft standards in development are convened by Asian
experts.
There are no barriers to engage in the standardization process. The contribution to public SDOs like the IEC is free
of charge. In order to contribute to an IEC technical committee one has to join or initiate the respective technical
mirror group on national level and become an elected representative of that nation on IEC level. In the case of private
SDOs, a paid membership is required for a participation in standardization
14
Appendix I: List of CENELEC member countries and national Standards
Developing Organizations
Member of
IEC TC119*
Country
Name of the Standards Developing Organization (SDO)
Short
Austria
Österreichischer Verband für Elektrotechnik
OVE
Belgium
Comité Electrotechnique Belge/Belgisch Elektrotechnisch
Comité
Bulgaria
Bulgarian Institut for Standardization
BDS
Croatia
Croatian Standards Institute
HZN
Cyprus
Cyprus Organisation for Standardization
CYS
P
Czech Republic
Czech Office for Standards, Metrology and Testing
UNMZ
O
Denmark
Danish Standards Foundation
DS
Estonia
Estonian Centre for Standardization
EVS
Finland
Standardization in Finland
SESKO
Former Yugoslav
Republic of Macedonia
Standardization of the Republic Macedonia
ISRM
France
Union Technique de l'Electricité
UTE
O
Germany
Deutsche Kommission Elektrotechnik Elektronik
Informationstechnik im DIN und VDE
DKE
P
Greece
Hellenic Organisation for Standardization
ELOT
Hungary
Hungarian Standards Institution
MSZT
Iceland
Icelandic Standards
Ireland
National Standards Authority of Ireland
Italy
Comitato Electrotecnico Italiano
CEI
Latvia
Latvian Standard
LVS
Lithuania
Lithuanian Standards Board
LST
Luxembourg
Institut Luxemburgeois de la Normalisation, de l'Accréditation,
de la Sécurié et qualité des produits er services
Malta
The Malta Competition and Consumer Affairs Authority
Netherlands
Netherlands Elektrotechnisch Comité
NEC
Norway
Norsk Elektroteknisk Komitee
NEK
Poland
Polish Committee for Standardization
PKN
CEB/BEC
P
IST
NSAI
P
ILNAS
MCCAA
O
O
15
Portugal
Instituto Português da Qualidade
IPQ
Romania
Romanian Standards Association
ASRO
Slovakia
Slovak Electrotechnical Committee
Slovakia
Slovak Standards Institution
SUTN
Slovenia
Slovenian Institute for Standardization
SIST
Spain
Associación Espanola de Normalización y Certificación
Sweden
Svensk Elstandard
Switzerland
Electrosuisse
Turkey
Turkish Standards Institution
TSE
United Kingdom
British Standards Institution
BSI
SEV
AENOR
P
SEK
P
P
P
*P = Participating Member, O = Observing Member; Status as of April 2014
16
Appendix II: Structure of IEC TC 119 Printed Electronics
Secretariat: Republic of Korea
Secretary: Mr. Kyung-Tae Kang (KR)
Chairman: Mr. Alan Hodgson (UK)
Members: 13 Participating, 8 Observing
Liaisons:





TC 47 Semiconductor Devices,
SC47F MEMS,
TC110 Electronic display devices,
TC113 Nanotechnology,
IPC
Working Groups:






WG 1 Terminology:
o The specification provides a terminology for printed electronic products and systems. It gives
preferred, harmonized terms, their definitions and symbols for printed electronics materials,
manufacture, assessment, components and devices. Specific terms will be defined by the
corresponding WG, the final definition shall be confirmed by WG1.
WG2 Materials:
o To develop measuring methods and evaluation methods for materials such as substrates, inks and
related materials for printed electronics. To analyze the effectiveness of the existing methods
specific to the materials of printed electronics. To define specific terms and to determine
assessments, requirements, and specifications for materials of printed electronics.
WG3 Equipment:
o Standardization for printing, coating, other related equipment and tools, sub-units and parts for
manufacturing printed electronics.
WG4 Printability:
o The measurements or requirements of both the qualities of printed patterns and the
reproducibility of printing designs as the result of interaction of printing media, inks and
substrates.
WG5 Quality assessment:
o To generate test methods and procedures for the measurement of specified product parameters,
for lifetime assessment and for reliability testing and stressing of printed and/or flexible
electronics components and products.
Advisory Group:
o Task: Produce recommendations / guidelines for the full TC 119 and work on issues for TC 119.
o Primary objectives: Liaison strategy and conflict management. Maintenance of the Strategic
Business Plan.
o Secondary objectives: Agenda construction. Recommend minimum content for New Work Items.
17
Appendix III: Useful Links
COLAE on the web: http://www.colae.eu
Standards developing organisations:

IEC: http://www.iec.ch

IEEE: http://www.ieee.org

IPC: http://www.iec.org

CENELEC: http://www.cenelec.eu
Printed Electronics standardisation committees:

IEC TC 119: http://www.iec.ch/tc119

CENELEC SR 119: http://www.cenelec.eu/dyn/www/f?p=104:7:719055136580301::::FSP_ORG_ID:1258739

IEEE: http://grouper.ieee.org/groups/1620/

IPC: http://www.ipc.org/ContentPage.aspx?pageid=Printed-Electronics-Initiative
Information about standardisation for researchers and scientists:

CENELEC Research Helpdesk: http://www.cencenelec.eu/research/ResearchHelpdesk/Pages/default.aspx

Study on the contribution of standardization to innovation in European-funded research projects:
http://www.cencenelec.eu/standards/Education/JointWorkingGroup/Documents/Study_Contribution_Sta
ndardization_Innovation_Final2013.pdf

Project BRIDGIT – Bridging the gap between Research and Standardization:
http://www.cencenelec.eu/research/BRIDGIT/Pages/default.aspx
18
Grant agreement No. 288881
FP7-ICT-2011-7
info@colae.eu
www.colae.eu