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REVISIONS
THIRD ANGLE PROJECTION
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DESCRIPTION
DATE
APPROVED
J. Cunningham
C. Danner
A. Spamer
C. Danner
T. Holder
1
Initial Release
12.04.12
2
Updated Appendix B, Section 1.5.2.3
Specification Limits.
04.20.13
3
Updated Document with PCBA Supplier
Feedback
05.10.13
C. Danner
T. Holder
4
Updated Clerical Errors
06.13.13
C. Danner
T. Holder
5
Updated Appendix B, Section 1.5.2.3.
Added WOA for Wave and SMT limits
07.31.13
C. Danner
T. Holder
6
Added requirement for baking Aqueous
Wash PCBAs . Section 5.3
Added C3 Pass/Fail levels 1.5.2.2
Added Definitions of Processed No-clean
and Processed Clean PCBA.
12.11.13
T. Holder
C. Danner
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© COPYRIGHT 2002 GENERAL ELECTRIC COMPANY
PROPRIETARY INFORMATION - THIS DOCUMENT CONTAINS
PROPRIETARY INFORMATION OF GENERAL ELECTRIC
COMPANY AND MAY NOT BE USED OR DISCLOSED TO
OTHERS, EXCEPT WITH THE WRITTEN PERMISSION OF
GENERAL ELECTRIC COMPANY.
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
TOLERANCES ON:
2 PL DECIMALS +
SIGNATURES
DRAWN
Alejandro Spamer, Charles Danner
DATE
10/10/12
GENERAL ELECTRIC COMPANY
g GE Energy Management
Atlanta, GA
CHECKED
3 PL DECIMALS +
ENGRG
ANGLES +
ISSUED
FRACTIONS +
QA
APPLIED PRACTICES
Electronics Supplier Quality Requirements
FIRST MADE FOR:
SIZE
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Contents
1.0 Purpose............................................................................................................................................................................ 5
2.0 Scope ................................................................................................................................................................................ 5
3.0 Definitions and Acronyms .......................................................................................................................................... 6
3.1 Order of precedence ........................................................................................................................................................... 8
4.0 Responsibility .............................................................................................................................................................. 10
5.0 Supplier Approval ....................................................................................................................................................... 11
5.1 Bare Board (PCB) ......................................................................................................................................... 11
5.2 Conformal Coating ..................................................................................................................................... 11
5.3 Washing Circuit Boards ............................................................................................................................. 11
5.4 Material Handling and Electrostatic Discharge (ESD) Protection......................................................... 12
5.5 Business, Technical and SRG Supplier Qualification Surveys ............................................................... 12
6.0 Initial Activities prior to or immediately following Supplier Approval. ........................................................ 13
6.1 Initial Process Technical Review and DFM review .................................................................................. 13
6.2 Design Guidelines/Product Evaluation Test Capabilities/ DFT Review ............................................... 13
6.3 Bill of Material / Approved Vendor List .................................................................................................... 13
6.4 Manufacturer’s Technical Specifications and Material Safety Data Sheet. ........................................ 14
6.5 Process Flow Description........................................................................................................................... 14
6.7 PCB and PCBA Cleanliness Testing Requirements ................................................................................. 15
6.8 In-circuit Test (ICT) and Functional Test (FCT) ......................................................................................... 15
6.9 Lead Trimming ............................................................................................................................................ 16
7.0 Pre-Pilot Approval Requirements ........................................................................................................................... 17
7.1 GE Material Scheduling and Delivery....................................................................................................... 17
7.2 Failure Analysis and Corrective Action System...................................................................................... 17
7.3 Special Process and Testers qualification ............................................................................................................... 18
7.4 First Piece Qualification Report (FPQ) ...................................................................................................... 20
7.5 Process Yield Data/DPMO for Pre-Pilot Run ............................................................................................ 22
7.6 Reliability Qualification Testing ............................................................................................................... 22
7.7 Process Failure Modes and Effects Analysis (PFMEA) ............................................................................ 22
7.8 Quality Control Plan ................................................................................................................................... 25
7.9 Gage R&R and CTQ Capability Studies..................................................................................................... 25
7.10
Supplier Process Quality Data Plan ...................................................................................................... 25
7.11
Ionic Chromatography Testing Board and Process Cleanliness....................................................... 25
7.12
Shipping Package .................................................................................................................................... 26
8.0 Pilot/Production Approval Requirements ............................................................................................................ 28
8.1 Production Readiness Review ................................................................................................................... 28
© COPYRIGHT 2002 GENERAL ELECTRIC COMPANY
PROPRIETARY INFORMATION - THIS DOCUMENT CONTAINS
PROPRIETARY INFORMATION OF GENERAL ELECTRIC
COMPANY AND MAY NOT BE USED OR DISCLOSED TO
OTHERS, EXCEPT WITH THE WRITTEN PERMISSION OF
GENERAL ELECTRIC COMPANY.
GENERAL ELECTRIC COMPANY
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8.2 CTQ data in Supplier Process Quality system. ....................................................................................... 28
8.3 Closure of FPQ Requirements ................................................................................................................... 28
8.4 Closure of PO items .................................................................................................................................... 28
8.5 Pilot samples shipment.............................................................................................................................. 28
8.6 Agency Approvals....................................................................................................................................... 28
9.0 Production - Continuing Requirements ................................................................................................................ 29
9.1 Production Reliability Audits..................................................................................................................... 29
9.2 Environmental Stress Screening (ESS) and Highly Accelerated Stress Screening (HASS) ................. 29
9.3 Supplier Process Quality Data Flow ......................................................................................................... 29
9.4 Quality Control ........................................................................................................................................... 29
9.5 Board and Process Cleanliness Audit....................................................................................................... 31
9.6 Full Traceability .......................................................................................................................................... 32
9.7 Incoming Inspection and Spot Buy Process. ........................................................................................... 33
9.8 Bow & Twist and dimensional inspection (PCBA with BGA only) ........................................................................ 33
9.9 Change control process ............................................................................................................................. 34
9.10
Solder paste printing inspection ........................................................................................................... 34
9.11 BGA Underfill Requirements....................................................................................................................................... 34
9.12
Solder joint and component placement inspection ............................................................................ 35
9.13
Rework Process ....................................................................................................................................... 35
9.14
GE Site Quality Targets (PPMs) .............................................................................................................. 36
9.15
Quality Management system and Internal Audits ............................................................................. 38
9.16
GE Surveillance Audits ........................................................................................................................... 38
9.17
ROHS/REACH Certification process ...................................................................................................... 38
10.0 Agility Specification ................................................................................................................................................... 40
10.1
Supplier Responsiveness to Quality Events......................................................................................... 40
11.0 Electronics Quality Checklist ................................................................................................................................... 41
12.0 Supplier Confirmation ............................................................................................................................................... 42
13.0 Records .......................................................................................................................................................................... 43
14.0 Appendix Section ........................................................................................................................................................ 44
Appendix A RASI Chart ..................................................................................................................................................... 44
Appendix B: PCB/PCBA Cleanliness Specification ......................................................................................................... 45
Appendix C: Production Reliability Audit Testing (PRAT) Specification ................................................................... 51
GENERAL ELECTRIC COMPANY
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Purpose
This document outlines the quality requirements for the different stages of development of an electronics
assembly produced for GE Energy Management applications.
2.0 Scope
The scope of this document is to mandate the minimum requirements for all CM’s manufacturing PCBA’s to
GE Energy Management sites. Additional requirements can be defined by each GE Energy Management
site or business in form of GE Engineering Technical Specifications or as notes on GE drawings.
Product and process quality standards must meet all requirements specified in this document and
documents listed below for product performance per IPC 610 Class 2, unless otherwise specified by site or
drawing. The latest version applies, unless other specified.
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3.0 Definitions and Acronyms
Reference Documents
The most recent revision of the referenced documents applies:
Terms and Definitions
IPC-T-50
Terms and Definitions Interconnecting and Packaging Electronic Circuits
ANSI/EIA-649
National Consensus Standard for Configuration Management
Test Methods
IPC-TM-650
Test Methods Manual
Acceptance
IPC-A-610
Acceptability of Electronic Assemblies
Assembly
J-STD-001
Requirements for Soldered Electrical and Electronic Assemblies
IPC-7912
Calculation of DPMO and Manufacturing Indices for Printed Wiring Assemblies
IPC-9261
In-Process DPMO and Estimated Yield for PWAs
Solderability
J-STD-002
Solderability Testes for Components Leads, Terminations, Lugs, Terminals and Wires
J-STD-003
Solderability Tests for Printed Boards
Assembly Support
J-STD-609
Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb) Pb-Free and Other Attributes and Devices
IPC-7711/7721
Rework, Repair and Modification of Electronic Assemblies
Flux/Solder
J-STD-004
Requirements for Soldering Fluxes
J-STD-005
Requirements for Soldering Pastes
J-STD-006
Requirements for Electronic Grad Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Adhesives
IPC-SM-817
General Requirements for Dielectric Surface Mounting Adhesives
IPC-CA-821
General Requirements for Thermally Conductive Adhesives
Conformal Coating
IPC-CC-830
Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies
Components
J-STD-020
Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices
J-STD-033
Packaging and Handling of Moisture Sensitive Non-hermetic Solid State Surface Mount Devices
Regulatory
IPC-1751
Generic Requirements for Declaration Process Management
IPC-1752
Material Declaration Management
Handling
JS625-A
Requirements for Handling ESDs Devices
ANSI/ESD S20.20
Electrostatic Discharge Control Program Standard
Qualification
EM-SRC-0001
Supplier Quality Requirements
7.4.2-EM-P001
Qualification of Sourced Direct Material
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EAU
EQ
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PCBA
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QCP
QMS
RCA
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- Accelerated Life Test (85/85 Chamber Test)
- Approve Vendor List
- Bill Of Materials
- Contract Manufacturer
- Design for Manufacturing
- Design for Manufacturing and Testability Excellence
- Estimated Annual Usage
- Electronics Quality
- Electrostatic Discharge
- First Piece Qualification
- Non-Conformance Assessment
- Original Equipment Manufacturer
- Printed Circuit Board
- Printed Circuit Board Assembly
- Process Failure Mode Effects Actions
- Quality Control Plan
- Quality Management System
- Root Cause Analysis
- Risk Priority Number
- Supplier Process Quality System
– Supplier Quality Engineer
- Supplier Responsibility Guidelines
- Technical, Regulatory, and Standards
Traceability – The ability to determine the history, location, application, processing conditions and/or
composition of a product by means of documented recorded identification.
Record – Document stating achieved results or providing evidence of performed activities.
Audit – Independent review and examination of records and activities to assess the adequacy of system
controls, to ensure compliance with established policies and operational procedures, and to identify
deficiencies in controls, policies or procedures for corrective and preventive action.
Audit Criteria – Set of policies, procedures, work instruction or requirement used as a reference.
Audit Finding – Result of the evaluation of the collected audit evidence against audit criteria. Audit
findings can indicate either conformance or nonconformance with audit criteria or opportunities for
improvement.
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Containment – Actions taken to minimize the GE Energy Management and customer risk associated with
a nonconformance. Containment actions apply to product, process or material in which the
nonconformance was detected as well as similar products or product families in which the
nonconformance may occur.
Continuous Improvement – Recurring activity to increase the ability to fulfill requirements. The process of
establishing objectives and finding opportunities for improvement is a continuous process.
Correction – Actions to repair, rework or replace the detected nonconformance, defect or other nondesirable situation.
Corrective Action – Action taken to eliminate the cause(s) of an existing nonconformance, defect or other
non-desirable situation to prevent recurrence.
Procedure – Documented statement of QMS process requirements. Unlike a Work Instruction, a
procedure does not state how the process must be performed.
Process – Set of interrelated activities which transform inputs into outputs.
Product – The result of a process. Whenever the term “product” occurs, it can also mean “service”, or any
deliverable associated with fulfillment of a contract.
Quality Management System – Management system to direct and control an organization with regard to
quality.
Requirement – Need or expectation that is stated, generally implied or obligatory.
Root Cause – A cause of an incident, which, if it had not occurred, would have prevented the incident.
Through this document the term Contract Manufacturer (CM) and the term Supplier are used
indistinctively and are considered of equivalent meaning.
3.1 Order of precedence
If this specification conflicts with other documents, the following order of precedence must apply:
1. Purchase order
2. PCBA Assembly drawing package including:
1.0 Diffusion note (list of applicable design documentations) including :

Approved Material List/Bill Of Material

Assembly Drawing

Pick Place data or ODB file

Schematics Prints

Mechanical Drawing
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
Visual Control Drawing

Gerber File for PCB manufacturing (Solder masks, Copper layers)

Drilling File for PCB manufacturing

Paste Masks

ITS (Industrial Specification Test)
3. This specification 105X1009
4. Documents referenced in this specification
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4.0 Responsibility
As described in Procedure.
In general, copies of all required documents must be submitted by email to the SQE by the Contract
Manufacturer (CM).
All documents submitted to GE must be in English. Acceptable formats are Adobe PDF, Microsoft Excel or
Microsoft Word.
Certain documents may be submitted by CM by attaching them to the Clear Orbit tool, Quality module
eSDR system maintained by GE. Process information is submitted by the CM by type information into the
Supplier Production Quality (SPQ) system, a web based application maintained by GE.
In section 11 of this document, there is a checklist that can be used to access the status of the required
requirements and activities. Prior to each NPI program, this checklist should be reviewed and a status
assigned to each task.
Review of this checklist needs to be scheduled by the CM at least two weeks prior to each build to support
the build schedules.
Status
• Red (R)
•Yellow (Y)
•Green (G)
Meaning
Task is incomplete and must be completed before proceeding. Build cannot continue until
the task has been satisfactorily completed.
Task is incomplete, but may be completed at a later specified date. Build may continue, but
must be reviewed before proceeding to the next step.
Task is complete.
On the last page of this document, The CM’s Quality Manager and Operations Manager are required to
acknowledge that he/she read and understood the Electronic Quality Requirements listed in this document.
The signed document needs to be sent to the GE Project SQE via email or fax before Prototype parts are
built at the CM.
Appendix A shows a RASI chart that defines responsibilities for each task or requirement from this
document.
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Procedure
5.0 Supplier Approval
5.1 Bare Board (PCB)

Only GE Energy Management approved PCB suppliers may be used for circuit board
assemblies.
 Other PCB suppliers can be proposed at the beginning of the project. To be considered,
alternate PCB suppliers must meet the following conditions:
1. Become an approved and qualified PCB supplier for GE Energy Management.
2. May have a cost advantage to other qualified vendors listed on AVL.
 See PCB Qualification and PCB Cleanliness Requirements on sections 6.6 and 7.11.
5.2 Conformal Coating
When Conformal Coating is required by GE Energy Management:
 When technically feasible, the preferred application method is Spraying by automated
machine, except otherwise stated in GE drawing.
 The preferred coating should be per masking drawing or BOM, if not specified, Dow
Corning 3-1953.
 PCBAs must be clean of any flux residue before Conformal Coating process, a wash step
is recommended.
 Other coatings can be proposed at the beginning of the NPI program. To be considered,
alternate conformal coating materials recommended meet the following conditions:
1. Be composed of 100% solids with low or no VOC content.
2. Be UL approved.
3. May have a cost advantage to preferred coating.
5.3 Washing Circuit Boards

When GE Energy Management does not explicitly specify use of wash process or when
there are no process limitations due to solder paste/flux combination, it is preferred that
PCBA are built using a process that does not require washing the final assembly.
However, if after a review of the process a wash step is required, it must meet the
following requirements:
1. The equipment must be capable of continuously monitoring the wash water as
well as waste water and have the capability to automatically turn off or trip alarm
if cleanliness limits of the wash water or waste water are exceeded.
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2. De-ionized water is mandatory, Tap water is not acceptable. De-ionized water
resistivity level must be greater than ten mega ohms per centimeter (>10
Mohms/cm).
3. If saponifier is needed to meet the cleanliness requirement in Section 7.11, Care
must be taken to specify the correct saponifier by CM. The residues that are to be
removed must be analyzed and understood in order to select the correct
saponifier and the appropriate concentration.
4. The PCBA bill of materials (BOM) must be analyzed to ensure that components will
not be damaged.
5. All PCBAs that have been Aqueous Washed are required to have a minimum
baking time of 1 hour at 65C unless otherwise waived by GE Supplier Quality
organization.
5.4 Material Handling and Electrostatic Discharge (ESD) Protection

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CM must establish an ESD control program in accordance with ANSI/ESD S20.20.
An internal ESD audit schedule must be executed and corrective actions must be planned
and closed in a timely manner in case of any finding.
ESD audits may be performed by certified ANSI/ESD S20.20 external agency, if internal
audits are not performed.
Specific information on how to handle ESD sensitive devices is in JEDEC JESD625-A
ESD protection must be worn by all persons on GE dedicated lines at CM site.
PCBAs must not be subjected to stress or strain beyond the limits specified in IPC-JEDEC9704, Appendix A.
The supplier must protect PCBs from environmental, handling, and storage damage.
5.5 Business, Technical and SRG Supplier Qualification Surveys
In case of a NPI program requiring an approval of a new vendor or on current projects requiring
approval of an alternate CM, the following three surveys must be conducted by GE Sourcing
and/or GE SQE to assess PCBA manufacturer capabilities:
Business Survey, Electronics Technical Audit (also known as Commodity Assessment or
Technical Survey) and depending on manufacturing site location (i.e. Low Cost Country), a SRG
(EHS) survey.
 CM must achieve a score of 90% or greater on the GE Business survey and 80% or
greater on the GE Electronics Technical Audit. In case of a score lower than 80% in any
survey, CM must present an action item list with corrective actions, implementation date
and owner and a second survey must be scheduled by GE SQE in less than 180 days to
validate corrective actions have been implemented and closed and survey score will be
re-assessed.
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
An SRG/EHS audit will be required if CM Manufacturing Location is based in a region
which requires an audit. CM must have no red flags on SRG/EHS audit to be qualified as
GE Supplier.

On NPI programs these surveys should be conducted by GE Energy Management
Sourcing and/or Supplier Quality personnel prior to awarding a contract.

GE Energy SQE will define frequency of future audits and surveys on the Supplier
Surveillance Plan for the specific GE Energy Management manufacturing location or
Commodity.

For use of GE personnel, Survey Checklists can be found in eSMS SQ Library.
6.0 Initial Activities prior to or immediately following Supplier Approval.
6.1 Initial Process Technical Review and DFM review




Includes Review of part technical requirements and CM's proposed production and
quality control process.
Includes FMEA on manufacturing, assembly and testing processes to identify potential
risks.
Includes capacity assessment of proposed processes.
The CM should present a complete Design for Manufacturing (DFM) report at this time for
PCBA and PCB Layout.
6.2 Design Guidelines/Product Evaluation Test Capabilities/ DFT Review



Specific design guidelines required in order for designs to be built in the factory. Specify
any limitations such as PCB trace line width, maximum PCB sizes, component sizes the
equipment can handle. A Design for Testability (DFT) report is required at this time.
DFT report should include Test and evaluation capabilities (i.e. number of test chambers,
capacity, and temperature/humidity capabilities, availability of electrical testers/fixtures
like ICT and/or Flying Probe and/or FCT, etc.).
GE Technology team will decide which CAD format should be used for design related files.
6.3 Bill of Material / Approved Vendor List

GE restricts purchasing of components to only those manufacturer part numbers
specified in the PCBA drawing or the GE approved vendor list.
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
A detailed Bill of Material and Authorized Vendor List must be generated for each project
from CM system. Excel Format is preferred. GE Engineering team must be responsible to
generate BOM or approve BOM in case design is outsourced.
 Should include complete identification of materials including manufacturer or subtier
supplier complete part number (also called order code) and packaging codes (e.g. tape
and reel).
 No single source components are allowed, where technically/logically possible. Having
three alternate vendors per component is recommended. Alternate components on
BOM/AVL must be tested according to GE Energy Management qualification
requirements, 7.4.2-EM-P001 Qualification of Sourced Direct Material and GE Energy
Management Supplier Quality Requirements, EM-SRC-002, component and/or circuit
board assembly.
 CM is responsible to purchase Electronic Components directly from OEM and/or OEM
authorized distributors and must not be purchased from Brokers and/or unauthorized
OEM distributors. In case CM requires the purchase of components from non-authorized
supply channels a SDR request must be submitted via SDR system (ClearOrbit), link to
ClearOrbit system:
https://www1.ge-energy.com/scp/endeavour/disclaimer.do
6.4 Manufacturer’s Technical Specifications and Material Safety Data Sheet.
MSDS are required for all process materials including:
 Solder, flux, adhesives, conformal coating.
 Other chemicals used in the manufacturing process.
 Flame retardants - detailed chemical composition is required for all components using
Flame retardants.
6.5 Process Flow Description.



Include detailed description of equipment including make and model.
Describe equipment layout and factory arrangement.
Include description of manufacturing and inspection steps.
Include high level documentation number for each process step.
CM is required to provide latest IPC forms IPC-1710 and IPC-1720 for submission in the
First Piece Qualification.
6.6 PCB Qualification
The PCB must comply with IPC-A-600 Class 2. The Qualification of PCB must comply with
following requirements:
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
Base Material Certificate

100% inspection report including :
o Boards edges
o Holes and plated through holes
o Printed contacts
o Thickness of metallic coating
o Holes diameters
o Bow & Twist
o Peel Strength

Electrical Test (Continuity, Insulation)

Solder mask characteristics

Process Flow chart

Control Plan

PFMEA if required from the dedicated check-list

Solderability test as per IPC-J-STD-002

Cleanliness test according to Section 7.11
6.7 PCB and PCBA Cleanliness Testing Requirements

PCB/PCBA Cleanliness data on existing production is required. GE Energy Management
prefers data from ionic chromatography testing performed as specified in the IPC-TM650 test methods manual. Refer to section 7.11 of this document for Cleanliness
Specification.
6.8 In-circuit Test (ICT) and Functional Test (FCT)



Where technically feasible, all electronic assemblies must pass an in-circuit test (ICT) and
functional test (FCT). GE must approve in written form any deviation to this requirement
via formal eSDR process using ClearOrbit system or similar formal deviation approval
procedure.
When required by GE, a complete design review of ICT and FCT must be performed.
Refer to section 7.3 Qualification of ICT/FCT testers for requirements to release electrical
testers to production.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
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15
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A
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SH
105X1009
16
REV
6
6.9 Lead Trimming

Component leads must not be cut after soldering processes where possible. Approval from SQE
by 6.2.3A is needed for exceptions based on DFM or DFT.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
16
SIZE
A
DWG NO
SH
105X1009
17
REV
6
7.0 Pre-Pilot Approval Requirements
7.1 GE Material Scheduling and Delivery




CM must know and understand GE scheduling and logistics procedures. This information
is contained in Purchase Order documentation that CM should receive from GE Sourcing.
CM must become familiar with their GE Site material scheduler(s), customs agent, and
warehouse contacts.
Contact GE Sourcing for detailed logistics requirements that begin with Pilot part
deliveries.
In some occasions, Customer Service parts are ordered by separate purchase order and
include different logistics. CM must know their Customer Service parts buyer and
logistics required.
7.2 Failure Analysis and Corrective Action System




The CM is required to have a well implemented Return Material Authorization (RMA)
system in order to approve and track rejected material returns from GE Energy
Management. CM is responsible for shipping and analysis (laboratory) expenses for all
rejects being returned for failure analysis on confirmed rejects. The CM must provide the
return procedure for GE to follow to ensure tracking of all failures. It is important that
this procedure works quickly and smoothly.
The CM is required to have a defined and working failure analysis and corrective action
system. Failures identified at GE manufacturing facilities will be returned to the CM for
analysis and corrective action. Each failure returned to CM or agreed to have repaired
must be tracked, analyzed, and have a corrective action implemented before closing the
report.
Failure analysis laboratory must have adequate equipment to perform:
o Autopsy Analysis Level 1: To confirm that the suspect PCBA is defective.
o Autopsy Analysis Level 2: To confirm which component or process is causing the
assembly to be defective.
In case of subtier supplier quality issue, CM must send defective components to subtier
supplier or 3rd party external laboratory if failure rate is above one percent (1%) of total
failure returned in RMA shipment for:
o Autopsy Analysis Level 3: To confirm root cause of component malfunction.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
17
SIZE
A
DWG NO
SH
105X1009
18
REV
6
7.3 Special Process and Testers qualification
Each new Supplier production line and/or revised combination of solder and cleaning process must
be qualified.
Any change in type or modification of soldering or cleaning equipment (reflow oven, wave solder,
wash, hand solder, rework, etc.) or change in materials used in these processes must require requalification. Because the thermal profile, amount of flux, and wash efficiency, (if washed) vary,
material manufacturer’s test data is not acceptable.

Profiles should be established for each GE PCBA to insure the flux is properly activated,
components are not thermally stressed, and proper solder joint formation is achieved. The
appropriate number of thermocouples or temperature labels must be applied to the top and
bottom of the PCBA to insure these requirements are met. Infrared sensors could also be
used.

Where multiple reflow ovens or wave solder machines are used in a work cell, an individual
profile must be qualified on each machine.

Changes to the PCBA design, the reflow oven, wave solder machine or processes, must
require the Supplier to review the profile to insure the requirements as stated are met.

Profiles must be archived for at a minimum of three (3) years and available for GE review
upon request. The data record must define all applicable machine parameters and serial
numbers, thermocouple locations, PCBA part number and revision, date, and the person
performing the profile.

All soldering materials (solder paste, wire, bars, and fluxes) must be compatible with other
materials used.
The minimum data required are:
Solder wave:

Configuration of the measurement process
o Pallet configuration
o Location of temperature sensor
o Certificate of calibration of temperature sensor used for Profile board
o Acquisition data system

Temperature Profile of following Key Characteristic’s :
o Preheat ramp rate top & bottom PCB & comp (°C/sec)
o Preheat temperature top & bottom – PCB (°C)
o Solder contact dwell time (sec)
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
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A
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o Bottom side component temperature delta (preheat to solder immersion) (C°)

Velocity of Carrier

Solder bar configuration (composition)

Wave configuration (lambda/chip)

Identification of the profile board

Storage conditions of the profile board

X ray inspection (if applicable)

Solder Wave Machine Reference Number

Maintenance plan

Solder Bath Analysis Reporting (minimum of monthly per machine)
Reflow oven:

Configuration of the measurement process
o Frame configuration
o Location of temperature sensor
o Certificate of calibration of temperature sensor
o Acquisition data system

Temperature Profile of following Key Characteristic’s :
o Maximum Temperature (°C)
o TAL (sec)
o Temperature Ramp rates (°C/sec)
o Liquidous temperature (°C)

Velocity of Carrier

Solder paste configuration (composition, thickness)

Identification of the profile board

Storage conditions of the profile board

X ray inspection (if applicable)

Oven Reference Machine Number

Maintenance plan
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
19
SIZE
A
DWG NO
SH
105X1009
20
REV
6
Hand solder:
The solder must be minimum qualified according to supplier training plan based on IPC-A-610
standard.
Solders dedicated to rework operations must be qualified according to IPC-7711/21.
Pick & Place

Standard PCBA as tool description

Standard Program

Pick & Place Reference Machine Number

Maintenance plan
Coating

Environment conditions (housing, temperature, humidity, compressed air)

ESD compliance

Cleaning Procedure and Material

Curing Process

Masking procedure

Varnish preparation (composition of components)

Varnish application with records of Key Characteristics

Adherence test (per manufacturing requirement)

Thickness measurement
ICT and FVT Qualification
 Testers must be qualified per the SI500116.
 Source files for the test program, test library elements, and test fixture design documents
must be provided to GE on request.
7.4 First Piece Qualification Report (FPQ)
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
20
SIZE
A
DWG NO
SH
105X1009
21
REV
6
Prior to Purchase Order for First Piece Samples, GE SQE or GE Buyer will inform CM of First Piece
Qualification Requirements, sample quantity and due dates. Prior to shipping Pre-Pilot parts, a
First Piece Qualification Report must be electronically submitted via email to GE SQE for analysis
and consideration of approval. At minimum, FPQ Reports require 5 samples and the following
requirements to be completed:








Measurement of all dimensions specified on the GE released drawings (i.e. Gerber files,
bare PCB drawing, Assembly drawing, etc.).
Verification that all components match the vendor and part number listed on the GE
master or approved Bill Of Material /Approved Vendor List (BOM/AVL).
Verification that all drawing notes are in compliance
Verification of the correct software revision with checksum if applicable.
When requested by GE SQE, a Capability study with Gage Repeatability Reproducibility
(GRR) study on Critical To Quality (CTQ) parameters as specified on the drawings.
Process yield at all major manufacturing steps with Pareto of defects.
Complete and up to date control plan and process Failure Mode Effects Analysis (PFMEA)
Any changes affecting the form, fit, function, or manufacturing process and procedures
must require new first piece reports and samples to be submitted.
Refer to GE Energy Management Supplier Quality Requirements EM-SRC-002 for additional
Qualification requirements available at the following link:
http://site.ge-energy.com/about/suppliers/en/document.htm
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
21
SIZE
A
DWG NO
SH
105X1009
22
REV
6
7.5 Process Yield Data/DPMO for Pre-Pilot Run


Inspection procedures must be in accordance with IPC-A-610, Class 2 or as specified by
GE site.
Process first pass yield and DPMO for reflow, wave solder, ICT, FCT and final inspection
must be monitored and recorded for the Pre-Pilot run of parts. Data must be included as
an attachment to the First Piece Report since many times the first piece parts are
produced at the same time as the Pre-Pilot run. At a minimum the report must include
the number of boards produced vs. number failed at each station (PPM) and a summary
of the total quantity of defects (DPMO). The top 5 defects need to be summarized in
pareto charts along with any applicable corrective actions.
7.6 Reliability Qualification Testing

Reliability testing will be managed and performed by the CM as defined in the PCBA
drawing and/or specification.
7.7 Process Failure Modes and Effects Analysis (PFMEA)

CM must conduct and present a process FMEA. All high-risk FMEA items must be
addressed in the Quality Control Plan.


There must exist, an internal best practice document and communication process that is
utilized in the PFMEA development. The process must include documentation and data
which explains how the PFMEA numbers/rankings were developed. In case CM needs
some guidance on how to develop PFMEA rankings, please contact GE SQE or use as
reference the following Table of PFMEA Rankings for Electronics (PCBA) manufacturing.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
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SHEET
22
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A
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RATING DEGREE OF SEVERITY
LIKELIHOOD OF OCCURRENCE
1
Customer will not notice
Likelihood of occurrence is 1 PPM
the adverse effect or it is remote
insignificant.
(No Impact on Form, Fit, or
Function)
3
5
7
10
Customer will experience
annoyance due to the
slight degradation of
performance.
(Customer will need to
conduct Rework or
Sorting.)
Low failure rate without
100 PPM
supporting documentation
Customer is made
uncomfortable or their
productivity is reduced by
the continued degradation
of the effect.
(Customer will need to
scrap parts or be subject
to warranty costs)
High degree of customer
dissatisfaction due to
component failure without
complete loss of function.
Productivity impacted by
high scrap or rework
levels.
Customer endangered due
to the adverse effect on
safe system performance
without warning before
failure or violation of
governmental regulations
Relatively moderate failure 200 PPM
rate with supporting
documentation
Relatively high failure rate 500 PPM
with supporting
documentation
Assured of failure based
on warranty data or
significant DV testing
1,000 PPM
ABILITY TO DETECT
Sure that the potential failure will
be found or prevented before
reaching the next customer.
(Defect is Obvious and can be
kept from affecting the
customer.)
Low likelihood that the potential
failure will reach the next
customer undetected.
(Automated inspection built into
process, such as a machinebased vision system. Or,
process control monitoring is
established. )
Moderate likelihood that the
potential failure will reach the
next customer.
(Manual inspection built into
process. This includes humanbased visual inspections.)
Poor likelihood that the potential
failure will be detected or
prevented before reaching the
next customer.
(Audit and/or Sampling Plan
established.)
Absolute certainty that the
current controls will not detect
the potential failure.
(Not Detectable)
100%
95%
85%
70%
< 50 %
Table of Suggested PFMEA Rankings for Electronics (PCBA) manufacturing





This process must be reviewed periodically for effectiveness and must include continuous
improvement and lessons learned.
All PFMEA concerns must have descriptions of current controls and recommended
actions.
Mistake proofing potential failure modes and controls must be identified in the PFMEA.
The PFMEA is a living document and must be traceable to process changes. These
documents must contain the special Product/Process characteristics agreed to and
identified by the Qualification Team.
The Process FMEA (PFMEA) must reflect the entire manufacturing process from receiving
through shipping.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
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SHEET
23
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A
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105X1009


24
REV
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The CM must ensure all failure modes observed during pre-production runs are captured
on the PFMEA.
The CM must ensure failure occurrence and the detection ability of these failures,
observed during pre-production runs correlate with the occurrence and detection
numbers documented on the FMEA.
PFMEA Criteria:
 For all Process Failure Mode and Effects Analysis (PFMEA) documentation, the following
criteria recommended to be used to identify the need to take corrective action:
Rolling Top 20 Rule: Using the RPN score, pareto the failure mechanisms and address the
top 20% RPN value that are in Zone I and II. (i.e. 80/20 rule).
Referring to Chart 1 PFMEA Risk Zones, special attention must be given to:
Zone I. RPN’s that have a Severity ≥ 9 regardless of RPN value, Occurrence level, or
Detection level.
Zone II. RPN's that have a Severity ≥ 5 and an Occurrence ≥ 2, regardless of
Detection level and RPN value.
Zone III. Detection = 10. (The potential defect is allowed to leave the plant and
reach the field).
Chart 1 - PFMEA Risk Zones
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
24
SIZE
A
DWG NO
SH
105X1009
25
REV
6
7.8 Quality Control Plan


Must be submitted during First Piece Qualification and include a detailed list of all process
steps to include all inspections, tests and audit plans ensuring production conformance to
specifications; all internal and external CTQ checks must be identified. Reaction plan
showing actions the operator has to take when non-conforming product is found must be
included. For NPI programs, a Safe Launch Quality Control Plan may be required by GE
SQE.
The following processes must be controlled using Statistical Process Control :
o Solder Paste Height and Volume (Continuous variable)
o Deionized Water Washing (Continuous variable)
o PCBA Process Cleanliness (Discrete variable)
7.9 Gage R&R and CTQ Capability Studies




7.10
When requested by GE, a Gage R&R study using ANOVA method is required for critical
operations (i.e. visual inspection, test, dimensional checks, etc.).
When requested by GE, Capability studies are required to be performed for each CTQ.
Critical Internal process parameters can also be considered as CTQ on SPC system when
requested by GE SQE.
The minimum sample size for computing the capability (Cpk) must consist of 30 parts
made up of 6 logical subgroups of 5 consecutively made parts each. Subgroups are
selected in a way as to maximize the exposure to varying conditions.
Supplier Process Quality Data Plan
CM must provide a plan which ensures regular data collection, analysis and reporting into the
GE SPQ system for all CTQs and noted dimensions with sample size, frequency, and a person
responsible for SPC data submissions that must be agreed to and entered in the control plan.
Frequency of data reporting is dependent upon CM's production plan to meet GE's production
requirements and will be approved by GE Supplier Quality team.
7.11
Ionic Chromatography Testing Board and Process Cleanliness

Incoming PCB and processed board cleanliness levels must be proven to meet the
specifications of Ionic Chromatography test procedure as defined per IPC-TM-650 2.3.28.
prior to receiving approval to ship pre-pilot parts.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
25
SIZE
A
DWG NO
SH
105X1009




26
REV
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Ionic Chromatography and WOA limitation level must not be greater than GE
Specification Table 1 in Section 14 Appendix B or as specified by GE Engineering per part
drawing or per GE specific site board cleanliness specification.
PCBA Cleanliness testing specification is outlined in Section 14 Appendix B.
Ionic Chromatography test must be performed at a GE approved laboratory site.
Approved Laboratories for Ionic Chromatography testing are listed below or as specified
by GE SQE:
FORESITE, INC.
1982 S. Elizabeth Street
Kokomo, Indiana USA 46902
765-457-9033
www.residues.com
7.12
Shipping Package


A package sample must be delivered to the receiving site for approval prior to Pre-Pilot
build.
Packaging must adequately protect parts and satisfactorily meet Ship Test requirements
per Fed Ex test as defined in Cycle II, Schedule C (FedEx).
Fedex Ship Test.pdf







Packages should have dividers inside to separate individual PCBAs
Individual PCBAs must be stored in an ESD-safe package. ESD-safe packages (i.e.
Dissipative Metallized Shielding Bags/Conductive Cardboard) must have a surface
resistivity value of less than 1x10^11 ohms @100 volts or per GE Engineering Site
Specification. When qualifying Anti-static Shielding bags type III, these must be tested
according to MIL-B-81705C standard.
When Pallets (set of boxes) are requested, palletizer plastic must cover 100% of the area
of the pallet to avoid water damage to packages and PCBAs.
Individual package weight maximum is 35 pounds.
Packages are to be palletized (GE preferred method) and shipped on pallets made from
materials approved by the materials manager of the receiving site.
Refer to EM-SRC-0005 – Marking Packaging Preservation and Shipping Requirements
latest revision or specific GE site specific Packaging Requirements.
Each package must at a minimum be labeled with the following information:

The GE Part number with revision number

The GE Supplier code
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
26
SIZE
A
DWG NO
SH
105X1009
27
REV
6

Box Quantity

Box Number

Manufacturing Date (Box Pack Date)

PO Number
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
27
SIZE
A
DWG NO
SH
105X1009
28
REV
6
8.0 Pilot/Production Approval Requirements
8.1 Production Readiness Review
To be conducted to ensure:
 All qualification steps are completed and all action items are closed.
 Ramp-up and inventory build plans are in place.
 All issues with respect to access of GE scheduling, payment, and quality computer
systems have been resolved.
 Shipping, CM Distribution Center, and customs issues resolved.
8.2 CTQ data in Supplier Process Quality system.
Initial data on all CTQs from either the capability study or pilot run at CM must be entered into
SPQ - a web based application for monitoring CTQs, prior to GE's "BR3" review (per GEEQMS
7.0.2).
8.3 Closure of FPQ Requirements
Close all Open First Piece Qualification requirements; all requirements that received a conditional
approval in the initial FPQ submittal must be closed. GE SQE may require CM to re-submit the
First Piece Qualification Report and samples if any FPQ requirement is not met at this stage.
8.4 Closure of PO items
Close all Remaining Open issues related to GE Production purchase orders received.
8.5 Pilot samples shipment
Ship Pilot controls using the defined logistics procedures per GE purchase orders. Only the GE
buyer can authorize shipment of pilot or production parts by another method.
8.6 Agency Approvals

CM is responsible to provide access and to support Agency Approvals (UL, CE, etc.)
certifications at a certified agency lab in case they are required by GE Energy drawing.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
28
SIZE
A
DWG NO
SH
105X1009
29
REV
6
9.0 Production - Continuing Requirements
9.1 Production Reliability Audits


Production Reliability Audits (PRAT) Testing Specification requirements must be followed
in cases where GE Energy Management requests per the drawing. Test methods and
detailed specifications of PRAT testing will be provided by GE Engineering team in charge
of the project.
PRAT testing specification is outlined in Section 14 Appendix C.
9.2 Environmental Stress Screening (ESS) and Highly Accelerated Stress Screening (HASS)

ESS and HASS must be followed in case GE requests them per the drawing based on
criticality of PCBA, quality, cost and volume. ESS and HASS test specifications will be
provided by GE Engineering team in charge of the NPI project.
9.3 Supplier Process Quality Data Flow


For those CTQs identified on the drawings, data must be entered into SPQ system in
accordance with the sampling plan setup defined by GE SQE in the SPQ system. Link to
SupplierNet SPQ System is here:
https://suppliernet.geappliances.com/SPQ/Dispatcher?REQUEST=SIGNONNEWLOOKANDF
EEL.
Internal Process CTQs (i.e. solder paste volume) at CM production line must be monitored
with control charts and those can be audited and requested by GE at any given time for
Engineering or Quality reviews. Control Charts must be reviewed by Process or Quality
Engineer every shift and corrective actions should be taken and documented in case any
SPQ rule is violated.
9.4 Quality Control
9.4.1 Statistical Process Control (SPC)
The following processes shall be controlled at a minimum using SPC:
 Solder Paste Thickness or Volume
 Washing / Cleanliness
9.4.2 Defect Records
Confirmed defects shall be recorded for each unit of PCBA. Each Defect Record shall include the
following information, and shall be kept for at least 5 years:
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
29
SIZE
A
DWG NO
SH
105X1009










30
REV
6
Manufacturing location
Manufacturing line
GE product identifier
GE product revision code
Unit serial number
Defect category according to IPC-9261
Defect description
Component reference designator (CRD) for component, placement, and termination defects
GE component part number for component, placement, and termination defects
Defect quantity for termination defects
9.4.3 Product Defect Reports
A Product Defect Report shall be provided on a periodical basis, including:



DPU run chart, with a plot point for each build-lot since the first
Defect pareto chart, by component reference designator
Defect Record
DPU is defined as:
DPU = D/U
D = Number of confirmed component, placement, termination, and assembly defects for the
build lot
U = Number of PCBs started for a PCBA build lot
9.4.4 Process DPMO Reports
Process DPMO shall be reported quarterly. A DPMO shall be reported for each combination of
Assembly Line, Assembly Type (IPC-2222), and Process used to manufacture GE products.
Process DPMO shall be calculated according to IPC-9261 for the following processes:
0 = No Problem Found
1 = Component
2CT = Placement, Chip, Top Side
Use this to classify product defects caused by a high-speed chip placement machine.
2CB = Placement, Chip, Bottom Side
2GT = Placement, General, Top Side
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
30
SIZE
A
DWG NO
SH
105X1009
31
REV
6
Use this to classify defects caused by a general-purpose placement machine.
2GB = Placement, General, Bottom Side
2M = Placement, Manual
Use this to classify defects caused by manual placement.
3RT = Termination, Reflow Soldering, Top Side
3RB = Termination, Reflow Soldering, Bottom Side
3W = Termination, Wave Soldering
3S = Termination, Selective Soldering
Use this to classify defects caused by selective soldering using either wave pallet or nozzle.
3M = Termination, Manual Soldering
4 = Assembly
5 = In-Circuit Test Problem
6 = Functional Test Problem

First Product Defect Report must be presented for Pilot Run results. At a minimum the
Product Defect Report must include a weekly summary of defects categorized by Failure
mode, the number of boards produced vs. number failed at each station (PPM) and a
summary of total quantity of defects (DPMO). Include the top 5 defects summarized in
pareto charts along with any applicable corrective actions.
9.5 Board and Process Cleanliness Audit


Daily cleanliness audit testing are required using Ionic Chromatography, Static ROSE (i.e.:
Omegameter or Ionograph), C3 Testing or Coupon Sampling, at minimum every four
hours or once per production build if less than four hours. This must be documented in
the Quality Control Plan for the production of PCBA family and approved by GE Energy
Management SQE. After one year, CM may request in form of RFI in the Clearorbit
system to reduce testing frequency to once per day or once per production build.
Weekly cleanliness audit reports of the results are required to be submitted to GE Energy
Management SQE for each GE Energy Management Site.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
31
SIZE
A
DWG NO
SH
105X1009
32
REV
6

Bare PCB Ionic Chromatography or C3 Test cleanliness report required on each PCB
shipment lot to CM and results archived by CM for three years.
 Processed PCBA samples must be post all soldering processes and pre coating process.
 Bare PCB and Processed PCBA Cleanliness report to be submitted periodically as required
by section 7.11 of this document.
 Ionic Chromatography test procedure is defined per IPC-TM-650 2.3.28.
 The static ROSE method is fully described in IPC-TM-650 2.3.25 and 2.3.25.1.
 Ionic and WOA limitation level must not be greater than GE Specification referred in
section 7.11 of this document.
9.6 Full Traceability
CM must have systems supporting full traceability which includes SMT component lot
traceability, as well as electrical testing, rework and packaging processes traceability. Each
PCBA must be serialized at the start of the assembly process with a unique number label (i.e.
labeled, inkjet marked or laser etched) to help trace the assembly through the entire
manufacturing process. Specific requirements on identification of serial numbers must be
provided by each GE Energy Management business or site At minimal each serial number
must include a code indicating the manufacturer name and location and a date code
indicating the serialization date.
Each serial number must have the following information associated with it:
 Date and time of serialization
 Manufacturer part number and date code of each component, including PCB, on the
PCBA
 Each MAC address allocated to the unit (when applicable)
 Date and time of each successful product quality conformance test
Records of each serial number and the associated information must be kept for at least three
years.
In case a top level assembly (parent) is directly sold to GE and is conformed of two or more
sub-assemblies (children), information must be available to allow traceability to the subassemblies serial numbers.

In case of a CM or sub-tier supplier quality issue, CM must be able to provide the
following information in less than 24 hours:
o Shipments and Invoices # affected (shipping tracking numbers).
o Specific Pallets affected within affected shipments. (if applicable)
o Specific Boxes where suspect material was shipped.
o Specific Range of Serial Numbers of PCBAs affected based on specific date codes
or lot numbers of suspect components.
o Test historical data (at minimum ICT and FCT) of Serial Numbers affected.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
32
SIZE
A
DWG NO
SH
105X1009
33
REV
6
9.7 Incoming Inspection and Spot Buy Process.

All components must be sourced directly from OEM or OEM Authorized Distributors.
Buying from individual brokers (Spot Buy) is not allowed and a SDR request must be
submitted to GE for approval in case components are urgently needed and there is no
other feasible option to obtain parts from authorized channels.
 Material shelf life must follow component shelf life Specification (when specifically
defined by GE Engineering or defined in GE drawing) or component datasheet, whichever
is less.
 Material over two (2) years old and less than five (5) years old must be tested for
solderability per IPC/EIA/JEDEC J-STD-002 prior to use. Any use of parts older than 5
years requires the written approval of GE.
 Material storage conditions (recommended: Ambient temperature of 23 C +/-5C at 35% +
15%/- 35% relative humidity) must be properly controlled; incoming material must be
stored/sealed in the manufacturer original package; resealed reels and open package
material must follow the material floor life and moisture sensitivity level guidelines
defined by J-STD-033.
 For Last-Time-Buy (LTB) material requiring long term storage, the LTB material must be
stored in proper condition (i.e. vacuum sealed moisture barrier bag) to limit the impact of
material reliability and solderability.
 In case shelf life of material has been exceeded or improper storage conditions, material
must be tested for solderability according to Wetting Balance or Reflow simulation JSTD-002 test procedures and components with MSL >2 must be handled according to JSTD-033. In addition, Reliability tests (i.e. Temperature cycling, Autoclave, etc.) might be
required depending on the application and GE specific requirements for the project in
question.
 A written and approved deviation from GE via eSDR (Supplier Deviation Request) in
ClearOrbit system should be obtained in order to process:
o LTB material exceeding its shelf life.
o Sub-tier supplier ECN/EOL notifications
o Spot Buys
o Use of components or bare PCBs exceeding material shelf life.
Refer to section 6.3 of this document to obtain the link to ClearOrbit system
to request an eSDR.
9.8 Bow & Twist and dimensional inspection (PCBA with BGA only)

Through-hole PCBA: Warp and twist must not exceed 1.5% (0.015 inch per inch) as
measured on the diagonal. Measured per IPC-TM-650, Method 2.4.22.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
33
SIZE
A
DWG NO
SH
105X1009

34
REV
6
SMT or Mixed Technology PCBA: Bow and Twist must not exceed 0.75% (0.0075 inch per
inch) as measured on the diagonal. Measured per IPC-TM-650, Method 2.4.22.
Dimensional inspection according to mechanical drawing is required.
9.9 Change control process
9.10

CM must notify GE Energy Management by Request for Information (RFI) in ClearOrbit of
any proposal to change sub-tier supplier, manufacturing location, equipment, material,
process or design which may affect form, fit, function, reliability, serviceability,
performance, functional interchangeability, regulatory compliance, safety, options or
spare parts interchangeability at least 6 months before implementing the change in
order to have enough time to complete full GE Electronics Qualification process. If RFI is
approved by GE Energy SQE, GE Sourcing and SQE will initiate an Engineering Change
Request to begin GE Electronic Qualification Process.

Minimum safety stock levels must be approved by GE for manufactured or purchased
(sub-tier components) parts in case of an Engineering Change, End Of Life (EOL), Product
Change Notifications (PCN) or Product Termination Notifications (PTN) situations.
Solder paste printing inspection

9.11
CM must have process controls to measure solder paste area and volume applied on PCB
solder pads. Techniques available, but not limited to, are:
o Automatic 2D or 3D inspection on solder printing machine.
o Off-line solder paste height measurement with specialized equipment.
o In-line Automatic Optical Inspection for solder paste printing (recommended for
fine pitch components, QFN and BGAs pads).
BGA Underfill Requirements
When required by GE drawing, BGA Underfill material selection must be identified on an
assembly Bill of Materials.
The following requirements must be met:

Water washed boards are recommended to be dried before underfill

Fillet height must be a minimum of 50% of the BGA Component Height

Voids are NOT permitted adjacent to solder balls
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
34
SIZE
A
DWG NO
SH
105X1009
9.12
REV
6

Voids must be less than 10% of covered surface area

Temperature and cure must follow recommendations of the material manufacturer

Underfill should not be allowed to flow in un-tented vias in adjacent areas
Solder joint and component placement inspection
•
•
9.13
35
GE Energy Management recommends use of Automatic Optical Inspection (AOI)
equipment after reflow to inspect quality of solder joints, component polarity and
placement.
In case of BGAs, QFN or other package type where solder joint is hidden below
component body, X-ray inspection is required. Automatic X-ray Inspection is
recommended for high volume projects or very critical parts where QFNs or BGAs are
present.
Rework Process
•
•
•
•
•
•
•
•
Rework process must be fully compatible to guidelines on IPC 7711/7721 Rework, Repair
and Modification of Electronic Assemblies.
Rework area must have clearly marked areas for storing any WIP which is classified as
non-conforming material. Material flow must be controlled to prevent any mixing of good
and suspected/rejected parts.
Full traceability is mandatory in rework area. CM must be able to trace any serial number
that has been reworked, identify failure mode and have rework action stored in database
as well as time and date when board was released from rework area.
Rework equipment must follow calibration schedule.
Operators in rework / touch-up areas must have specialized training on IPC 7711/7721 or
compatible standard and must be evaluated before working in mass production. Annual
internal recertification program must be conducted.
Except for BGA, QFN and hidden solder joints, every reworked solder joint or touch-up
operation must be inspected using magnification aid (i.e. Microscope) according to J-STD001. Rework of BGA or QFN and similar packages with hidden solder joints must be
inspected with X-ray equipment and Electrical test (i.e.: ICT or FCT) prior to release to next
manufacturing step.
A supervisor or second operator must re-inspect every reworked PCBA.
PFMEA must include all rework and touch-ups operations in the product assembly line.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
35
SIZE
A
DWG NO
SH
105X1009
9.14
36
REV
6
GE Site Quality Targets (PPMs)
•
•
CM is required to maintain a rolling three month quality level of less than 1000 defective
parts per million (PPM) at each GE Energy Management production site.
PPM is defined as CM responsible PCBA rejected from GE Energy Management
production lines divided by PCBA used on GE Energy Management production line used
in same time period multiplied by one million.
o
PPM

# of CM responsibl
# of PCBA
•
•
•
•
•
•
e Re jected
PCBA
used on GE Pr oduction
x 1 , 000 , 000
Line
GE SQE to provide CM their PPM level periodically with a maximum timeframe of
quarterly per year.
CM has the first six months of a new PCBA production intent volume to established PPM
baseline and plan of actions to reduce rolling three month PPM to 1000 PPM within the
first year of production intent volume.
CM is responsible for additional screens on internal production line to reduce identify
defects caused by CM at GE production line until corrective actions are implemented.
For defects that CM suspects to be related to GE Energy Management production
processes or designs, CM must submit RFI in ClearOrbit system with detail of defect and
impact on PPM in total and percentage defect per month for GE SQE to review. If
approved by GE SQE, the GE SQE will initiate an audit finding into Gensuite or GE site
approved audit tracker for Root Cause and Corrective Action tracking. GE SQE is
responsible for updating CM’s PPM data to reflect defects that are only attributable to
CM.
If CM does not show plan of actions, effective implementation of actions on CM
production line and at a minimum 20% improvement year over year on PPM value, GE
Energy Management can take effective actions against CM as stated in the GE Supplier
Agreement with CM.
CM internal quality targets at critical process steps listed below must support the 100
PPM GE Energy Management target. Internal quality targets must be reviewed at a
maximum every 3 months to demonstrate continuous improvement.
1. Paste Printing
2. Placement
3. Reflow
4. AOI (if applicable).
5. X-ray (if applicable)
6. Manual Insertion
7. Wave solder
8. Selective soldering
9. In-circuit Test
10. Functional Test
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
36
SIZE
A
DWG NO
SH
105X1009
•
•
37
REV
6
CM has the first six months of a new PCBA production intent volume to established First
Pass Yield baseline of 95% for each critical process step and plan of actions to improve
First Pass Yield within the first year of production intent volume to 97%.
Each year, the CM and GE Energy SQE will review first pass yield data and established
first pass yield goal for each process for each of the GE Energy Management Production
site.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
37
SIZE
A
DWG NO
SH
105X1009
9.15
•
•
6
CM must be ISO 9001:2008 certified or similar (TS16949, AS9000, etc.) or demonstrate to
GE that CM has implemented a compatible QMS system to ISO 9001:2008.
CM must have an internal audit program and the resulting reports, including corrective
actions list from internal audits, must be accessible to GE Energy SQE.
GE Energy recommends suppliers to maintain an Environmental Program compatible to
ISO 14001 or similar standard and conduct periodic EHS/SRG audits to subtier suppliers.
GE Surveillance Audits
•
•
•
9.17
REV
Quality Management system and Internal Audits
•
9.16
38
GE Energy Management personnel must be allowed to enter CM manufacturing
location(s) in order to perform QMS, Regulatory, SRG/EHS and/or Surveillance Process
audits.
When CM is defined as Key Supplier and/or when requested by GE SQE, Surveillance
Audits will be performed at CM manufacturing location(s). These types of audits can be
focused on quality controls for internal processes of electronics manufacturing, TRS, RCA
and/or NDE.
If required by GE Supplier Quality and Regulatory teams, a Regulatory and /or SRG audit
will be performed annually at CM manufacturing location(s).
ROHS/REACH Certification process
•
•
•
When requested by GE Energy Management or specified in drawing, CM must present
convincing evidence (MSDS, Chemical Composition Tables or equivalent) that the CM’s
Process non-AVL and MRO Materials is complying with EU ROHS and REACH regulations.
In case the project requires having ROHS and REACH certification, a written approval in
eSMS Qualification form 6.2.3A from GE Energy Management must be granted to the CM
before starting any kind of production of sellable parts.
The CM must complete and submit IPC Form IPC 1752-2, Class 1 or 5 and Reach Supplier
Declaration Letter on their company letter head for all non-AVL and MRO Material that
include but not limited to:
o Solder Paste
o Solder Bar
o Solder Wire
o Flux
o Adhesive/Tape
o Conformal Coating
o CM selected PCB Supplier
The IPC forms are available for free download at http://www.ipc.org/175x . The supplier
declaration letter is available in Appendix B of this work instruction. It must be digitally
signed.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
38
SIZE
A
DWG NO
SH
105X1009
•
39
REV
6
Blank Template for Creating Declaration on Company Letterhead
Date:
Supplier Name:
Supplier Address:
Attention: GE Energy Management
Request for Information pursuant to Regulation (EC) No 1907/2006 OF THE EUROPEAN
PARLIAMENT AND OF THE COUNCIL of 18 December 2006 “REACH Regulation”
Dear To Whom it may concern :
(Supplier Name) has reviewed GE’s request for information and our contractual obligations
regarding REACH Regulation [Regulation (EC) No 1907/2006 OF THE EUROPEAN PARLIAMENT
AND OF THE COUNCIL of 18 December 2006] and the use of Substances of Very High Concern
(SVHC’s).
I hereby affirm, as a duly authorized representative of the Company, that all parts, materials, or
sourced finished goods supplied to GE do not contain any of the SVHC’s as per the European
Chemicals Agency’s “Candidate List of Substances of Very High Concern for Authorization”
(updated 06/2012) at levels above 0.1% weight by weight (w/w).
The statements made in this certification on this date are true, accurate, and provide complete
disclosure of any and all SVHC’s contained in parts or products sold to GE. I, on behalf of
_____________, confirm _________ will not make any changes to the parts, material, or
products without following the GE Change Process.
Sincerely yours,
Name
Title
Phone Number
Email address

Supplier must identify and control all RoHS versus non-RoHS components.

Supplier must segregate or control all RoHS versus non-RoHS material including
process materials and tools.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
39
SIZE
A
DWG NO
SH
105X1009
40
REV
6
10.0 Agility Specification
10.1
Supplier Responsiveness to Quality Events
•
•
•
In case of any quality event requiring NCA or RCA or having medium and/or high risk
non-conformances based on GE Energy Management site specific Non-conformance
Screening Matrix , CM must be able to provide a full containment plan and traceability
data within 24 hours after being informed by GE Energy Management. CM is responsible
for related expenses per GE Supplier Agreement.
Root cause analysis report and corrective actions must be implemented in
manufacturing, documented and communicated (as CAR or 8d) to GE Energy
Management within 30 working days after CM being notified of the quality issue by GE
Energy Management. CM are responsible for related expenses per GE Supplier
Agreement for supporting production in parallel to these activities:
o Correction and Containment Plan is needed less than 24 hours after being
informed by GE Energy Management, for approval by GE SQE.
o Root Cause is needed within 5 working days after being informed by GE Energy
Management, for approval by GE SQE.
o Corrective Action and Preventive Action Plan is needed within 10 working days
after being informed by GE Energy Management, for approval by GE SQE.
o Corrective Action Plan implementation is needed within 30 calendar days after
being informed by GE Energy Management, for approval by GE SQE.
o Preventive Action Plan implementation will be qualified and audited during
Supplier Surveillance.
If CM does not respond in a timely manner according to this section, GE Energy
Management can take effective actions against CM as stated in the GE Supplier
Agreement with CM.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
40
SIZE
DWG NO
A
SH
105X1009
41
REV
6
11.0 Electronics Quality Checklist
Program Title:
Project Leader:
Checklist Items
R/Y/G
Date:
Comments
Prior to Business Award:
 GE Business Survey. Minimum score required:
90%.
 Conduct GE Technology Survey. Information
only
Complete for Prototype build approval:
 Initial Process Review
 Design Guidance/DFM and DFT Data
 Preliminary Bill of Material
 Process Material Specifications and MSDS
 Process Flow Description
 PCB Qualification
 Preliminary Board and Process Cleanliness
 ICT and FCT Preliminary Description
Complete for Pre Pilot build approval:
 SSO Access
 GE Material Scheduling and delivery
 Failure Analysis and Corrective Action System
 Special Process and Testers Qualification
 First Piece Reports
 Autopsy Scorecard and Process Yield
Data/DPMO
 Reliability Qualification Testing
 Reliability Production Audit
 Process FMEA
 Quality Control Plan
 Gage R&R and Capability Studies
 Supplier Process Quality (SPQ) Data Plan
 Ionic Chromatography Testing
 Shipping Package Design
 Production Readiness Review
Complete for Pilot/Production Build
Approval
 GE Production material POs received
 Supplier Process Control (SPC) Data Flow
 Close all open FPR items / Samples shipment
 Agency Approvals
 Close all remaining items.
Production - Activities that continue.
 Production Reliability Audit (if applicable)
 ESS and HASS (if applicable)
 Supplier Process Quality Data Flow (SPQ)
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
41
SIZE
DWG NO
A
SH
105X1009
42
REV
6












Quality Control
Process Cleanliness Audit
Full Traceability
Incoming Inspection and Spot Buy Process
Bow and Twist Dimensional Inspection
Change control Process
Solder Paste Printing Inspection
BGA underfill Requirements
Solder joint Inspection
Rework process
Quality Targets (PPMs)
Quality Management System and Internal
Audits
 GE Annual Quality Audits
 ROHS/REACH certification – Process Non
AVL material.
Agility Specification
Supplier Responsiveness to Quality events
12.0 Supplier Confirmation
Hereby, I QUALITY MANAGER (CM) confirm that I have read and UNDERSTAND GE Electronic Quality
Requirements listed above.
Date
Supplier Quality Manager / Company / Phone Number / Email
______________________________
Signature
Hereby, I OPERATIONS MANAGER (CM) confirm that I have read and UNDERSTAND GE Electronic
Quality Requirements listed above.
Date
Site Operations Manager / Company / Phone Number / Email
______________________________
Signature
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
42
SIZE
A
DWG NO
SH
105X1009
43
REV
6
13.0 Records
All requested and reviewed documents need to be filed and stored as quality records by GE Energy SQE using
eSMS system under the Qualification record per the PCBA part number.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
43
SIZE
A
14.0
DWG NO
SH
105X1009
REV
44
6
Responsibility
Legend
Appendix Section
GE
SUPPLIER Supplier
Quality
Requirement
Prior to Business Award:
· GE Business Survey. Minimum score
required: 90%.
·
Conduct GE Process Survey. Min Score
required 80%.
Appendix A RASI Chart
GE Sourcing/
Procurement
S,I
R,A
S
S,I
R,A
S
R,I
R,I
S,I
R,I
R,I
R,I
R,I
R,I
A
S
GE
Engineering
2. Complete for Prototype build approval:
· Initial Process Review
· Design Guidance/DFM and DFT Data
· Preliminary Bill of Material
· Process Material Specifications and MSDS
· Process Flow Description
· Bare PCB Qualification
· Preliminary Board and Process Cleanliness
· ICT and FCT Preliminary Description
Complete for Pre Pilot build approval:
A
A
A
A
A
A
· GE Material Scheduling and delivery
· Failure Analysis and Corrective Action
System
R,I
R
A
· Special Process and Testers Qualifications
R
R,I
A
A
R,I
R
R
R,I
R,I
R,I
R,I
R,I
R,I
S,I
S,A
A
A
A
A
A
A
A
A
R
· SPQ - CTQS Definition
I
R,I
S
A
· Close all open FPR items / Pilot run
Samples shipment
R,I
A
S
R,I
R,I
A
A
S
S
R
R
R
R
R
R
A
A
A
A
A
A
S,I
S,I
R
R
R
R
R
R
R
R,I
A
A
S
A
A
A
A
A
R,I
R,I
R,I
A
A
A
S
R,I
A
S
· First Piece Reports
· Autopsy Scorecard and Process Yield
Data/DPMO
· Reliability Qualification Testing
· Reliability Production Audit
· Process FMEA
· Quality Control Plan
· Gage R&R and Capability Studies
· Supplier Process Quality (SPQ) Data Plan
· Ionic Chromatography Testing
R= Responsible
A= Approver
S= Support
I= Information
S
A
R
S
S
S
S
S
· Shipping Package Design
· Production Readiness Review
S,A
S,I
S,A
S,I
S,I
S
S
S
I
Complete for Pilot/Production Build Approval
· GE Production material POs received
· Agency Approvals (i.e. UL, etc)
· Close all remaining items.
R,A
S
Post-Production Activities
·
·
Production Reliability Audit
ESS and HASS
·
Supplier Process Data Flow (SPC)
·
Process Yield Data/DPMO
·
Process Cleanliness Audit
·
Full Traceability
·
Incoming Inspection and Spot Buy
Process
·
Bow and Twist Inspection
·
Change control Process
·
Solder Paste Printing Inspection
·
BGA Underfill
·
Solder joint Inspection
·
Rework process
·
Quality Targets (PPMs)
·
Quality Management System and
Internal Audits
·
GE Annual Quality Audits
·
ROHS/REACH certification
Agility Specification
Supplier Responsiveness to Quality Events
GENERAL ELECTRIC COMPANY
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GE Energy Management
Atlanta, GA
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Appendix B: PCB/PCBA Cleanliness Specification
1.1. Purpose
This section outlines GE Digital Meters Printed Circuit Board Assembly (PCBA) Cleanliness testing
requirements, PCB/PCBA sample testing to be conducted, the data collection procedure, the method of
analysis, definition of specification limits of each ion of concern and direction on action to take when
levels are exceeded. In the event of conflict between the requirements of this document and the
referenced applicable documents listed below, this document governs and takes precedence.
1.2. Scope
This section covers the following:
 Starting a new assembly line
 Qualifying or switching to a new Printed Circuit Board (PCB) supplier
 Changing a PCB Supplier process or materials
 Qualifying a new Contract Manufacturer (CM) / Commodity (FPQ) (Pilot Run)
 Qualifying a new PCB and/or PCBA Design
 Verifying the quality of manufactured PCBAs to ensure the CM has maintained the quality of
work
1.3. Definition & Acronyms
 CM – Contract Manufacturer
 Ion Chromatograph - Measures the amount of ionic contamination that is present on the
surface of the PCB. Ionic contamination is a concern due to the relationship between high
contamination levels and failure of the PCB due to electro migration.
 PCB – Printed Circuit Board
 PCBA – Printed Circuit Board Assembly
 SMT – Surface Mount Technology
 SQE – Supplier Quality Engineer
 Via – conductor which electronically connects one or more layers of a PCB or PCBA
 WOA – Weak Organic Acid
1.4. Responsibility
 Contract Manufacturer ensures this specification is followed
 Supplier Quality – Ensures CM compliance with this specification; receives and store cleanliness
reports from third-party testing laboratory.
 Third-Party Testing Laboratory performs cleanliness per IPC-TM-650 2.3.28A on samples
submitted by CM.
 Engineering analyzes data from the Third-Party Testing Lab. and takes action when results
indicate a failure
 Sourcing distributes this specification to Contract Manufactures
 Quality reviews and approves action taken as a result of test failures.
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GE Energy Management
Atlanta, GA
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1.5. Procedure
1.5.1. Samples & Data collection: Depending on the origin of the requirement, CM must collect and
submit the following quantity of samples:
1.5.1.1 On Going production - Quarterly audits:
The PCBA Contract Manufacturer’s location site submits to the GE designated Testing Lab or use
certified C3 Tester, the following sample for cleanliness testing on a quarterly basis:



1 Raw PCB panel directly from PCB supplier.
1 Processed PCB per part family from incoming inspection at CM , run through Reflow and Wave
soldering processes and after wash process if applicable without conformal coating and
components.
In cases where there are multiple part families, alternate samples from varying part families
each quarter, so that all part families are tested at a minimum annually. Part Families must be
defined by GE PCB part number or PCB vendor, pcb finish, and PCB material.
1.5.1.2 PCB Engineering Changes
The PCBA Contract Manufacturer’s location site submits to the GE designated Testing Lab or use
certified C3 Tester, the following sample for cleanliness testing for qualified CMs supplying PCBAs to
GE, for qualification of a modification to the PCB and/or PCBAs processes affecting form, fit or
function:
 1 Raw PCB directly from PCB Supplier, if qualification is due to PCB change.
 1 Processed PCB per part family from PCBA CM, run through Reflow and Wave soldering
processes and after wash process if applicable without conformal coating and components.
1.5.1.3 New PCB Supplier or new PCB Manufacturing location or NPI Qualification:
The PCBA Contract Manufacturer’s location site submits to the GE designated Testing Lab the
following sample for cleanliness testing for new CM qualification or qualification of new PCB
suppliers or PCB / PCBA design the sample size is:
 5 unprocessed PCB ( Raw PCBs ) directly from PCB supplier.
 5 Processed PCB from PCBA CM, run through Reflow and Wave soldering processes and after
wash process if applicable without conformal coating and components.
1.5.1.4 Sample handling
Once removed from the CM normal manufacturing process, the samples must be handled with clean
cotton gloves or clean-room vinyl gloves in order to keep contaminants (hands, oils, salts, etc.) from
being transferred to the PCB and PCBA samples.
Place sample PCBs/PCBAs either in a KAPAX bag or wrap in new aluminum foil prior to placing in a
sealed bag and packaging for shipment to the Testing Lab. Send packaged samples to the following
test lab.
Foresite
1982 S. Elizabeth St.
GENERAL ELECTRIC COMPANY
g
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GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
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Kokomo IN 46902
(765) 457-8095
FAX (765) 457-9033
www.Residues.com
1.5.2. Cleanliness Testing
The testing lab assesses the PCB/PCBA samples provided by GE contract manufacturers as follows:
1.5.2.1. Areas of Investigation
Bare PCB: sample three areas plus the whole board
1. Board surface
Processed PCBAs: sample six areas plus the whole board
1. Board Surface
2. During Failures Analysis investigation, C3 extraction under components and between
layers.
1.5.2.2. Test Procedure
Ionic Chromatography test procedure as defined per IPC-TM-650 2.3.28A. Static Rose
(Omegameter) test procedure as defined per IPC-TM-650 2.3.25.1. Localize extraction will be
performed using the C3 tester equipment.
C3 audit testing can be performed at 2 different levels; normal standard reliability (60 seconds
at 500 uA of leakage current ) or High Reliability (120 seconds at 250uA of leakage current ) .
Levels for passing audit testing will be determined initially by GE and control documentation
will reflect this Pass/Fail criteria.
1.5.2.3
Definitions
1.
Bare Board : Is designated as a PCB ( Printed Circuit Board ) that has been
fabricated only . Fabrication is etching, drilling, plating, soldermask and adding a
surface finish protectant.
2. Processed – No Clean Board : Is a PCB that doesn’t use an aqueous wash process
for removing flux residues at the PCBA manufacturer.

For C3 testing – PCB shall have reflow/wave processes (flux and soldering) if
these are the normal process for that PCB. Components should be added
unless otherwise specified by GE.

For IPC –TM-650 2.3.28 – PCB bag method. PCB shall have reflow/wave
processes (flux and soldering) if these are the normal process for that PCB.
Components should not be added.
GENERAL ELECTRIC COMPANY
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DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
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Processed – Clean Board : Is a PCB that uses an aqueous process to remove flux
residues at the PCBA manufacturing.

For C3 testing – PCB shall have reflow/wave processes (flux and soldering) if
these are the normal process for that PCB. Components should be added
unless otherwise specified by GE.

For IPC –TM-650 2.3.28 – PCB bag method. PCB shall have reflow/wave
processes (flux and soldering) if these are the normal process for that PCB.
Components should not be added.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
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6
1.5.2.4 Specification Limits Ionic Chromatography levels must not exceed the following levels:
Contaminants
Sodium
Potassium
Calcium
Magnesium
Ammonium
Na+
K+
Ca+2
Mg+2
NH4+
CH3CO
OHCOOBrClFNO3NO2Li
SO4-2
Acetate
Formate
Bromide
Chloride
Fluoride
Nitrate
Nitrite
Lithium
Sulfates
Citrate
Phosphate
<3
<3
<1
<0.5
<2
Processe
d No
Clean
Board
(μg/in2)
<3
<3
<1
<1
<2.5
<2.5
<3
<3
<2.5
<3
<2.5
<0.5
<2
<2
<0.5
<3
<0.5
<2
<3
<6
<3.5
<1
<3
<3
<1
<3
<2
<3
<3
<6
<3.5
<1
<3
<3
<1
<3
<2
<3
Bare
Board
(μg/in2)
Processed
Clean
Board
(μg/in2)
<3
<3
<1
<1
<2.5
PO4-3
WOA N/A
25
SMT
WOA
WOAN/A
150
WAVE
Static Rose (Omegameter) levels must not exceed the following levels:
Contaminants
Sodium Chloride
NaCl
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
Bare
Board
(μg/in2)
<5
CAGE CODE
25
25
Processed
Board
(μg/in2)
<10
DWG NO
105X1009
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1.6. Outputs
1.6.1. Test Report
GE designated Testing Lab documents the test results and sends a report to the CM which initiated
the testing or C3 Test Results the CM submits the test report to the GE SQE.
1.6.2. Test Results Analysis:
Analysis of the report is conducted by the SQE. In case the maximum values listed in the above
table are exceeded:

If qualifying a new PCB Manufacturer or a new PCBA Contact Manufacturer or a
process/material change at current CM, then the qualification is rejected until corrective
action is implemented and proven effective through subsequent testing.

If during audit testing of current product, then the lots of printed circuit boards associated
with the failed board must be placed into non-conforming material. Supplier Quality
Engineer will follow GEE-501 Supplier Deviation and Request for Information Process.

The test report and all reviewed outcomes are filed and stored as quality records by Supplier
Quality using the naming convention: (P/N)_(PCBA CM)_(PCB CM)_IC Report
Number_mmddyyyy. Records are stored in folder
http://libraries.ge.com/foldersIndex.do?entity_id=7053282101&sid=101#21973385101
Records are maintained for a minimum of three years after the year of creation (records
created in 2012 may not be deleted until January 1, 2016).
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
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Appendix C: Production Reliability Audit Testing (PRAT) Specification
1.0 Purpose
Establishes procedures to ensure consistent, ongoing reliability of printed circuit board assemblies after
initial qualification, and prevent significant failure rates due to insufficient product reliability. A “significant”
failure rate is any greater than 10% in 10 years of life. It outlines the minimum requirements for ongoing
product reliability audit testing of printed circuit board assemblies produced for GE Energy Management
applications; how audit test specifications and failure criteria are defined; and how appropriate reporting
and alarming will be conducted in response to such failures.
2.0 Scope
The procedures are developed to target three types of excursions, and to detect them within 2 to 3 months
of printed circuit board production:
• Catastrophic failures due to inferior components (such as unauthorized sub-tier supplier changes)
• Wide excursions in some previously controllable variable (process drift at the CM)
• Shift in the overall quality (systemic drift at the CM or sub tier supplier)
3.0 Definitions and Acronyms
3.1 Acronyms
 ALT - Accelerated Life Test (85/85 Chamber Test)
 BOM - Bill of Materials
 CM - Contract Manufacturer
 EAU - Estimated Annual Usage
 PCBA - Printed Circuit Board Assembly
 PRAT - Product Reliability Audit Testing
 QCP - Quality Control Plan
 SPQ - Supplier Production Quality system
 SQE - Supplier Quality Engineer
1.2 Definitions
 Audit Period - Timeframe over which the representative sample lot is collected and during which the
audit population is produced. There should be no discontinuity of audit periods; the start date of one
audit period should immediately follow the end date of the prior audit period.
 Audit Population - Product represented by a particular set of test results from a particular sample lot
on a particular ALT cycle.
 Failure Review Team - SQE, SQE Team Leader, Design Engineer, Office of the Chief Engineer,
Reliability Engineer
 Sample Lot - A rationally sub-grouped collection of samples in accordance with Section 6.5.3 of one
part number, representing one audit population, which will be tested together in one ALT cycle,
representing one audit period.
GENERAL ELECTRIC COMPANY
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GE Energy Management
Atlanta, GA
SIZE
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CAGE CODE
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Suspension Check - The required, weekly suspension of each PRAT chamber test to check 100% of
the sample lot on test for failures, as stipulated by the ALT specification for that board.
4.0 Responsibility
• Supplier Quality is the primary contact who determines when a part is required to have PRAT.
• Engineering is the primary contact for development of ALT specification Documentation.
• Contract Manufacturer is the primary contact for developing GE approved access to environmental
test capability to meet specification.
5.0 Inputs
• ALT Specification Document
• Environmental Test Chamber Capability.
• Production parts.
6.0 Procedure
6.1 Quality Requirements for PRAT Specification – The SQE ensures an effective PRAT Specification is
provided to the CM’s, which enables them to effectively implement, and exercise PRAT. The key
deliverables are selection of PCBAs for PRAT, PRAT test outline, and collection of technical
information.
6.1.1 Selection of PCBAs for The PRAT Program – The SQE selects part numbers for the PRAT
Program. It is not practical to require testing for each and every PCBA part number. The
ideal selection of part numbers utilizes a minimum number of part numbers on test while
covering a maximum number of high-EAU part families, CM’s, components, and sub-tier
suppliers (in that order of priority).
6.1.1.1 The SQE should first select any PCBA family with EAU greater than 100K.
Second, each CM producing this family should be represented - select each
CM’s most populated version within that family. This provides a wide and
efficient coverage of each family, for each CM and their respective supply
chains.
6.1.1.2 There are other circumstances the SQE should take into consideration beyond,
EAU, CM coverage, when choosing part numbers for the PRAT Program:
• Part numbers at risk of becoming problematic (new technology, new
design, etc.)
• High historical failures
• Designs of higher complexity
• First time CM’s or Sub-tier suppliers
• New components
6.1.1.3 Special Circumstances in PCBA Selection - There are special circumstances,
which may prevent the straightforward selection procedure outlined above, or
present opportunities for more efficient part number selection, Some examples
are listed below:
GENERAL ELECTRIC COMPANY
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DRAWN
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GE Energy Management
Atlanta, GA
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CAGE CODE
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•
Masked IC – this prevents ALT software from being programmed, and can
make PRAT impossible for such part numbers. Ideally, another means of
PRAT could be identified for that part’s components and sub-tiers at all
CM’s.
• Insufficient acceleration factor - some failure modes are impossible to
accelerate in ALT, inherent to the design and application. It is important
that this is made clear by the Design Engineer – See Section 6.2. Ideally,
another means of PRAT could be identified for any such failure mode
determined to be of significant concern, at all CM’s.
• Production mix – in some instances, a CM may have a discontinuous
production schedule with infrequent, large runs of the only part number
with a Flash IC (a service board). This can make sub-grouping across one
part number and/or one period difficult. In this case, revisit alternative
production schedules and customize rational sub-grouping procedures. It
may sometimes be prudent to identify different part numbers within a
PCBA family when part number EAUs are small.
• Common-BOM/Design optimization – If two board families are being
considered for PRAT, and it can be shown that the BOMs and/or designs for
these parts are sufficiently similar, then one part may be shown to be
representative for both, eliminating the need to PRAT the other. It should be
kept in mind that such optimization may be possible at one CM but not
another, for a particular part number, due to the product mix for each CM.
6.1.2 PRAT Test Outline - The SQE stipulates the number of boards, and test duration required to
demonstrate 90% Reliability, 90% Confidence, for 10 Years of Life. This 90% confidence of
90% reliability should be accomplished by requiring a 10-year test (based on application and
platform-specific acceleration factors) with one of the following criteria sets:
• Test 22 or more samples with 0 failures,
6.1.3 Collection and Review of Technical Information - The SQE facilitates discussion with the
Design Engineer, who will provide the technical details outlined in Section 6.2, in an ALT
specification specific to each part number. The SQE reviews and approves the ALT
specification at the Spec Peer Review, paying particular attention to:
• Failure modes not accelerated
• Any suggestions made by the Design Engineer for BOM/Design Optimization
• Clarity, and thoroughness for use by the CM
• Understanding any unique failure modes (and root cause procedures) inherent to a
particular part number design
Once the SQE has the completed document, the SQE will ensure that the CM meets all
specifications.
6.2 Technical Requirements for PRAT Specification
6.2.1 The Design Engineer supports the SQE by generating the ALT specification, which should
provide all technical information, necessary for PRAT. Each ALT specification must pass ALT
Spec Peer-Review. At a minimum, the ALT specification must include the following:
GENERAL ELECTRIC COMPANY
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GE Energy Management
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
Identify any differences in load condition between the PRAT ALT and the expected worst
case application
 List of any suggestions for other possible part numbers which may be represented by this
part number (BOM/Design Optimizations)
 Provide definitions, and all documents necessary to design and construct all required load
systems, and fixtures
 Provide software and all necessary instructions on preparation of PCBA samples
 Detailed special-case root cause procedures that should be initiated in the event of a
failure
6.3 PRAT Procedures at The Contract Manufacturer
6.3.1 The CM to ensure all aspects of this document, and ALT specification are strictly followed, and
that the intent of the PRAT Program is satisfied to the best of the CM’s ability. The intent is
that the CM ensure every reasonable effort is made to maintain continuous, uninterrupted
testing and sample collection, so that for every part number identified for PRAT, all production
periods are represented by a specific sample lot. Other than suspension checks and
reasonable times replacing one sample lot with another, there should be no interruption in
testing for any part number requiring PRAT. Other than unavoidable circumstances, samples
should be rationally sub-grouped in accordance with Section 6.3.2. If there are extenuating
circumstances, making this impractical, written approval from the SQE is required. In all PRAT
matters, the SQE is the primary point of contact for the CM.
6.3.2 Rational Sub-Grouping of Samples - The practice of rational sub-grouping by the CM is
absolutely essential in selecting a cross-section of samples, which uniformly represents the
entire audit period under test. Failure to exercise rational sub-grouping by the CM drastically
decreases the reliability, and value of the test data, and could ultimately undermine the
intent of the PRAT Program entirely. Sample collection for each and every sample lot should
be uniform, continuous, and ongoing. Guidelines for sample collection are as follows:
a. Determine the dates of audit period for which a sample lot must be collected.
b. Determine scheduled production for the part number being sampled over that audit
period
c. Determine the number of days, shifts, lines within that production schedule
d. Determine the size of the sample lot stipulated by the SQE, which should include 4 golden
samples in accordance with Section 6.3.4.
e. Ensure samples are collected (mid-shift) uniformly across all dates, shifts, and lines.
Example 1 –
1. Audit Period is January 1 to February 1
2. Production schedule is 3 shifts on January 8, 3 shifts on January 15 and 2 shifts on
January 26. All are run on 2 lines.
3. 32 Samples are required (28 for test and 4 for golden samples)
4. This Sample Lot would be best sub-grouped by taking 2 per line, per shift, per day, for
a total of 32 samples.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
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January 8
January 15
January 26
TOTAL
6
32
Shift 1
Line 1
2
2
2
6
Line 2
2
2
2
6
Shift 2
Line 1
2
2
Line 2
2
2
4
4
Shift 3
Line 1
2
2
2
6
Line 2
2
2
2
6
Example 2 –
1.
2.
3.
4.
Audit Period is January 1 to February 1
Production schedule is 3 shifts, 7 days per week, all of January. All are run on 2 lines.
32 Samples are required (28 for test and 4 for golden samples)
This Sample Lot would be best sub-grouped by taking 1 sample per day, but
alternating through the shifts and lines.
January 1
January 2
January 3
January 4
January 5
January 6
Repeat…
6.3.3
6.3.4
Shift 1
Line 1
1
Line 2
ISSUED
Line 2
Shift 3
Line 1
Line 2
1
1
1
1
1
Test Procedures - The CM must understand and strictly follow the corresponding ALT
specification in the testing of each part number identified to be on PRAT. Each part number
will have its own, part-specific ALT specification. These specifications are NOT
interchangeable.
Sample Lot Retention by The CM - The CM must label and retain all sample lots (including 4
golden samples) for a minimum of 6 months after suspension off PRAT. These 4 golden
samples must be rationally sub-grouped across the sample lot before the ALT cycle is
started, and put aside, untested (for possible, future use in root cause analysis). The labeling
of all these samples must include, at a minimum:
• Audit Period
• Begin and End date of ALT
• Sample Number (within Sample Lot)
• Date failure was discovered
• “Tested” or “Golden”
• “Failed” or “Un-Failed”
• For “Failed”, a brief description of the failure mode
GENERAL ELECTRIC COMPANY
g
DRAWN
Shift 2
Line 1
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
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105X1009
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6.3.6
6.3.7
6.3.8
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Response to Failures by Contract Manufacturer - The CM will continue testing, indefinitely,
any time there has been a failure in an ALT cycle, even if the failure is discovered on the last
suspension check, and the sample lot was planned to be taken off test. Once a sample lot
experiences one failure, written approval by the SQE is required before the CM may end the
ALT cycle. Until this written approval is granted, weekly suspension shacks will continue
indefinitely, superseding the test period stipulated. This practice is necessary to prevent loss
of valuable information that future failures in that sample lot may provide. However, this
does not allow the next scheduled ALT cycle to be delayed.
IN THE EVENT OF AN ALT FAILURE, THE NEXT ALT CYCLE MUST CONTINUE TO BE PUT ON
TEST AS SCHUDULED – WHILE EXTENDING THE ALT WHICH EXPERINCED THE FAILURE!
All failed samples should be handled with great care and preserved for root cause analysis in
accordance with Section 6.3.7.
Failure Reporting by Contract Manufacturer - The CM enters all PRAT results into SPQ every
week immediately upon completion of the weekly ALT suspension check. The CM will also
make every reasonable effort to root cause all failures as soon as possible, in accordance
with Section 6.3.7, and report those findings to the SQE by e-mail ASAP.
Root Cause Analysis by Contract Manufacturer - The CM handles all failed samples with great
care and preserves the maximum amount of analysis value the failed sample may provide,
once returned to the SQE. All failed samples will eventually be returned to the SQE. The CM
makes every reasonable effort to determine root cause on all PRAT failures, immediately
upon their discovery. This should be accomplished through the CM’s established root cause
process, with the following stipulations:
• No destructive analysis or disassembly must be conducted by the CM without written
approval by the SQE
• Detailed records will be maintained by the CM including, at a minimum, label information
in Section 6.3.4, and pertinent technical/functional information that could assist in higher
level root cause for each failure
The SQE will direct subsequent actions on a case-by-case basis. This may include sending
components or PCBAs back to sub-tier suppliers, sending PCBA back to SQE immediately, or
holding PCBA in current condition while waiting for more data.
Responsibilities for PRAT Failures – Supplier Quality - In response to a PRAT failure, the SQE:
• Orchestrates the immediate investigation and analysis
• Enters any and all failures immediately upon alarm into Gensuite
• Oversees CM’s fulfillment of all data collection and reporting responsibilities outlined.
• Conducts second-pass root cause analysis on any failures CM fails to diagnose
• Calls together the Failure Review Team and presents all failures
• Determines exposure, forecasts failure rates, and estimates cost to the business as
needed
• Orchestrates the activities of CM, Quality, Engineering, and Sourcing to resolve all
Gensuite items, as determined appropriate by the Failure Review Team
• For Red Conditions (see Section 7.3), orchestrates the cross-functional team presentation
to supply chain management and risk council
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
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DWG NO
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REV
6
•
Manages corrective actions for process or part root causes, and qualify design
improvements as needed.
6.3.9 Responsibilities for PRAT Failures – Engineering - In response to a PRAT failure, the Design
Engineer:
• Provides third-pass root cause analysis on any failures CM and SQE fail to diagnose.
• Orchestrates all change request and design activities, and interpret data as needed.
• Orchestrates all outside lab activities conducted for the purposes of root cause analysis
as needed.
• Defines and orchestrates all subsequent ALT testing conducted for the purposes root
cause analysis as needed.
• Defines suitable design changes and supports qualifications as needed.
• Maintains availability to SQE (conference calls, updates) as needed.
6.3.10 Documentation at the Contract Manufacturer - The CM references this document, the ALT
specification and a test equipment preventative maintenance program/schedule (outlined in
Section 6.3.11) in the QCP for each part number identified to be on PRAT to ensure strict
adherence. Records of all preventative maintenance performed will be maintained and must
be made available to GE for review upon request.
6.3.11 Fixtures and Test Box Maintenance - The CM generates and implements a preventative
maintenance program/schedule for all PRAT test equipment. The CM must provide the SQE
with documentation of this program/schedule and reference the document in the CM’s QCP.
7.0 Outputs
The SQE to tracks, reports, and orchestrates appropriate responses to negative PRAT results, fully supported
by the Design Engineer.
7.1 Tracking - The SQE builds into SPQ Reliability and tracks each part identified for PRAT for ongoing
tracking of all PRAT results. Alarms should trigger on any failure, as well as for “no data”.
7.2 Reporting - The SQE investigates all PRAT failures, enters them into Gensuite, and presents PRAT
results at quality reviews. The SQE presents management with appropriate updates on any and all
alarms defined in Section 7.3.
7.3 Prescribed Responses to PRAT Failures - As different types of failures, at different points in ALT life,
are cause for different levels of concern, it is impractical to define specific responses for 1, 2, 3…
failures. Therefore, for any and all failures, a case-by-case review by the Failure Review Team is
required to gain consensus on what actions are appropriate to resolve a given failure scenario. For
a given part number under PRAT, there are three conditions with three general responses:
• GREEN - no failures over 6 months (update monthly)
• YELLOW - 1 or 2 failures over 6 months (resolve and update monthly)
• RED - 3 or more failures over 6 months, or significant root cause findings (elevate, resolve, update
as needed) FAILURE OF 3 OR MORE SAMPLES OF A SPECIFIC PART NUMBER, WITHIN A SIX
MONTH PERIOD, OR SIGNIFICANT ROOT CAUSE FINDINGS ARE CONSIDERED CONDITIONS OF
INCREASED RISK (RED), AND REQUIRE IMMEDIATE ELEVATION TO SUPPLY CHAIN
MANAGEMENT AND RISK COUNCIL!
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
57
SIZE
A
DWG NO
SH
105X1009
58
REV
6
8.0 Records
 ALT specification is maintained in the Supplier Quality Library by Supplier Quality for a minimum of
three years after the year created.
 Records of all PRAT testing are maintained by the CM for a minimum of three years after the year
created.
 Records of failures including root cause analysis and any actions taken are maintained in the
Supplier Quality Library by Supplier Quality for a minimum of three years after the year created.
GENERAL ELECTRIC COMPANY
g
DRAWN
ISSUED
GE Energy Management
Atlanta, GA
SIZE
A
CAGE CODE
DWG NO
105X1009
Alejandro Spamer/Charles Danner 10/10/2012
Name and date
SCALE
SHEET
58