676 – FBGA (27 x 27 x 1.6 mm)
Non Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
BB
2,062.9293 mg
Body Size (mil/mm)
Package Weight – Site 2
27 x 27 x 1.6 mm
N/A
SUMMARY
The 676-FBGA is a Non Pb-Free package. Standard components (Non Pb-Free) currently in production are
RoHS 5 compliant. Standard components may contain Pb, but do not contain the other 5 substances (above
allowable levels).
ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 011707 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS
are listed in section 1A. Materials from this list may be contained or intentionally added to this product, as it is
not considered Pb-Free or RoHS compliant.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
Analysis
Report
(Note 2)
0
0
100.4883
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
48,711
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05551 Rev.*D
Page 1 of 4
676 – FBGA (27 x 27 x 1.6 mm)
Non Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of
Use
Substance
Composition
SiO2
60676-86-0
Acrylic
Proprietary,
29690-82-2
68541-56-0,
25068-38-6
13676-54-5
25722-66-1
7440-50-8
7440-02-0
7440-57-5
7726-95-6
7440-31-5
7439-92-1
7440-22-4
Proprietary
Proprietary
Proprietary
7440-21-3
7440-57-5
60676-86-0
Proprietary
Proprietary
Proprietary
1314-60-9
Proprietary
Epoxy
Substrate
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
CAS Number
Bisphenol
Triazol
Cu
Ni
Au
Br
Sn
Pb
Silver
Epoxy Resin
Functionalized Ester
Diester
Si
Au
Silica (fused)
Epoxy resin
Phenolic resin
Mixed Siloxanes
Antimony Pentoxide
Brominated epoxy
resin
Silica (quartz)
Carbon black pigment
Silica (Cristobalite)
Antimony Trioxide
Weight by
mg
66.8888
% weight of
substance per
Homogenous
material
11.0000%
32,424
% weight of
substance
per
package
3.2424
10.0000%
29,477
2.9477
8.0000%
23,581
2.3581
15.0000%
17.5000%
36.3900%
1.5000%
0.5500%
0.0500%
63.0000%
37.0000%
76.5000%
5.5000%
5.5000%
12.5000%
100.0000%
100.0000%
74.1000%
10.0000%
5.0000%
5.0000%
0.8000%
2.0000%
44,215
51,584
107,265
4,421
1,621
147
82,941
48,711
39,371
2,831
2,831
6,433
46,400
10,679
344,615
46,507
23,253
23,253
3,721
9,301
4.4215
5.1584
10.7265
0.4421
0.1621
0.0147
8.2941
4.8711
3.9371
0.2831
0.2831
0.6433
4.6400
1.0679
34.4615
4.6507
2.3253
2.3253
0.3721
0.9301
1.0000%
0.5500%
1.0000%
0.5500%
4,651
2,558
4,651
2,558
0.4651
0.2558
0.4651
0.2558
PPM
60.8080
48.6464
91.2120
106.4140
221.2803
9.1212
3.3444
0.3040
171.1017
100.4883
81.2201
5.8394
5.8394
13.2713
95.7200
22.0300
710.9154
95.9400
47.9700
47.9700
7.6752
14808-60-7
1333-86-4
14464-46-1
1309-64-4
19.1880
9.5940
5.2767
9.5940
5.2767
Package Weight (mg):
2,062.9293
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05551 Rev.*D
Page 2 of 4
676 – FBGA (27 x 27 x 1.6 mm)
Non Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
Cover tape
< 5.0
< 5.0
< 5.0
Carrier tape
Plastic Reel
Tray
Moisture Barrier bag
Shielding bag
Protective Band
Shipping and inner/
pizza box
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Material
PBB
PPM
PBDE
PPM
< 5.0
< 5.0
< 5.0
Analysis
Report
(Note2)
CoA-COVT-R
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG-R
CoA-SBAG-R
CoA-PROB-R
CoA-ABOX-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05551 Rev.*D
Page 3 of 4
676 – FBGA (27 x 27 x 1.6 mm)
Non Pb-Free Package
Document History Page
Document Title: 676 - FBGA 27X27X1.6MM NON PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
Document Number:
001-05551
Rev. ECN No. Orig. of
Change
**
405290
YXP
*A
2584298 HLR
*B
3447033 HLR
*C
*D
4031247 YUM
4210985 HLR
Description of Change
New specification
Added the CAS number for Br.
Changed CAS number of Au.
Deleted the Ion Impurities on Goldwire material.
Added the %weight of homogenous on material composition
table.
Completed the RoHS substance on Indirect Material table.
Updated the material composition table to reflect 4 decimal
places on values.
Removed tube material on declaration of packaging table.
Added assembly site name in the Assembly heading.
Added the weight for Lead (Pb) on Section 1 for Banned
Susbtances.
Distribution: WEB
Posting:
None
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05551 Rev.*D
Page 4 of 4