DIP IPMs for Small Motor Drive Applications:
Moving Towards
Standard Packages and Features
Eric R. Motto
Powerex Inc., Youngwood, Pennsylvania, USA
1
Presentation Outline
 Applications & Requirements for small
inverters: 0.2kW ~ 16kW (0.25HP ~ 21HP)
 Review DIP-IPM Features & Functions
 Standard Packages
 New Features
 The Complete DIP-IPM Family
 Summary & Conclusions
2
Typical Applications
– White Goods (Appliances)
• Washing Machines, Refrigerators,
Air Conditioners
– Fitness Equipment
• Treadmills, Steppers, Stationary
Bicycle
– HVAC
• Package Air Conditioner
– Pumps
• Water & fuel in residential or
small commercial applications
– Small Industrial Drives
• General purpose & Servo
3
Requirements for Small Inverter
Designs
 Reduced Total Cost
 Short Design Cycle
 Easy Manufacturing
 Small Size
 High Efficiency
 Consistent High Reliability & Dependability
4
The DIP-IPM Concept (Introduced by Mitsubishi in 1998)
Combine the discrete IGBTs, free wheel diodes and HVIC
drivers for a small motor drive into a single component:
Reduced component count – One part replaces more than ten
Improved manufacturabily – No Need to Mount & Isolate multiple devices
Small size – Increased integration yields compact finished equipment
Increased reliability – IGBTs and HVICs designed and tested together
5
DIP-IPM Key Technologies:
 Low cost transfer molded lead frame
Transfer-mold
package
packaging with isolated heatsink mounting
surface – Ideally suited for automated mass
production. (Original Mitsubishi concept introduced 1998)
 Low loss IGBT and soft recovery free wheel
diode chips (Mitsubishi 6th generation technology)
 HVIC (High Voltage Integrated Circuit) for
level-shift and gate drive (Mitsubishi original designs)
Bare
HVIC die
Leadframe
IGBT chip
Ultra fast recovery
diode chip
New HVIC with 1200V level shift
using divided RESURF structure
600V HVIC using conventional
level shifting structure
High Voltage
Floating
Circuits
Al wire
FWDi, IGBT
IC
Au wire
Cu frame
High Voltage
Level
Shifters
Molded resin 6
Insulated resin sheet
Al heat spreader
DIP-IPM Family Features and Benefits:
 Wide Line-Up: 3A-75A 600V, 5A-50A 1200V with
common functionality for easy scaling of designs.
 Highest Reliability: fully tested module with HVIC gate
drivers, six IGBTs and free wheeling diodes delivers
consistent performance and improved reliability.
 Lowest cost: transfer molded package technology
provides the advantages of an isolated module at a cost
comparable to discrete components.
Unsurpassed Efficiency: Low loss 6th generation IGBT
and soft recovery free wheel diode chip technology
provides 30% lower losses than competitive modules.
 Reduced Parts Count: one module replaces fifteen or
more discrete components.
 Smallest size: Use of bare die and simplified lead frame
cuts footprint to less than half of equivalent discrete
components.
 Simplified Assembly: isolated base module eliminates
the need for insulation materials and requires only two
mounting bolts.
7
Miniature 3KW
Three-Phase Inverter
Using 15A Super Mini-DIP
DIP-IPM Typical Application Circuit
(Three Phase Induction/BLDC Motor Control)
 Fault feedback signal
 Simplified Circuit Layout
(Critical circuit parasitics
managed within the module)
 Low external parts count
+
CSF
8
UN
VN
WN
FO
CFO
CIN
VNC
VN1
Level Shift
Gate Drive
UV Prot.
Level Shift
Gate Drive
UV Prot.
U
V
W
Input Signal
Conditioning
Fault
Logic
+VCC
RSF
Gate Drive
UV Prot.
+VCC
+
UV
Prot.
Gate Drive
VP1
WP
P
Motor
Level Shift
+
VWFS
VWFB
+VCC
HVIC
 Under Voltage Lock-Out
for all six devices.
VP1
VP
Controller
 Over Current Protection
(Using external shunt
resistor).
+
VVFS
VVFB
+VCC
Over Current
Protection
 Direct connection from
controller to all six logic level
gate signals. Compatible
with 3.3V or 5V controller
Input
Condition
VP1
UP
AC Line
Input
Condition
+
Input
Condition
 Single Supply Operation
(Using boot-strap technique)
VUFS
VUFB
HVIC
+15V
HVIC
+3.3 to +5V
LVIC
RSHUNT
N
DIP-IPM
Short-Circuit Protection:
Use external shunt resistor to set trip level
P
DIP-IPM
IC (A)
HVIC
Level Shift
Gate Drive
Under Voltage
3
U
V
W
Protection Level
Filter Set By
RSF x CSF =1.5 -2.0 µs
VCC
Motor
Overcurrent
trip level
LVIC
FO
Gate Drive
Over current
Under Voltage
N
RSHUNT
VSC(ref)
RSHUNT
Typical IC
Waveform
CFO
VNC
CIN
RSF
CSF
0
9
~2 s
t W (s)
DIP-IPM Customer most requested features:
(1) Open low side emitter connections
To allow phase current monitoring for more advanced control techniques
(2) Temperature Sensor
For protection and output power limiting if required to avoid operation of
over temperature protection.
(3) Integrated Boot Strap Supply Diodes
To reduce external component count and relieve high voltage spacing
requirements on the printed circuit board.
(4) Generation to Generation Package Compatibility
To allow easy upgrade to newer more efficient modules and provide longer
term support for existing designs.
10
New DIP-IPM Development Direction:
 Adopt 3 standard packages
(1) Super Mini, (2) Mini DIP, Large DIPIPM
 Include Built-in Bootstrap Diode
Less components to select, test, populate
Will not interfere with other supply schemes
 Provide accurate analog sensor
Linear feedback, not logarithmic
 Make open emitters, standard
Easily connected together externally if not needed
11
Three Standard Packages Defined
Covering : 3A-75A@600V, 5A-50A@1200V
Super Mini DIP
Large DIP
Mini DIP
38mmX24mmX3.5mm
52.5mmX31mmX5.6mm
79mmX31mmX8mm
Transfer-mold
package
Cu Frame
Bare HVIC
die
Al Wire FWDi
IGBT
Au Wire
IC
Leadframe
IGBT chip
Ultra fast recovery diode
chip
12
Mold
resin
Insulated thermal radiating sheet
(Cu foil + insulated resin)
Thin low thermal impedance insulating resin sheet provides significantly
improved thermal performance compared to previous generations
Super Mini DIPIPM Package Cross Section
Cu Frame
Al Wire
Mold
resin
FWDi
IGBT
Au Wire
IC
Insulated thermal radiating sheet
(Cu foil + insulated resin)
3A – 30A, 600V
Optimized of lowest cost and compact size the
Super Mini DIPIPM uses a high thermal
conductivity insulating resin sheet between its
lead frame and copper mounting surface to
provide UL recognized 1500VRMS isolation.
The heat of the transfer moulding process
causes the resin sheet to cure simultaneously
with the epoxy resin. The result is stable high
reliability electrical insulation with low thermal
impedance.
13
Mini DIPIPM Package Cross Section
20A, 30A, 50A 600V
The Mini DIP-IPM has a thicker copper heat
spreader to provide the improved thermal
performance required for demanding
industrial applications. The package also
has a thicker profile with an undercut
backside to provide the clearances needed
for 2500VRMS isolation.
14
Large DIPIPM Package Cross Section
Al wire Molded resin
FWDi, IGBT
IC
Insulated resin sheet
Au wire
Cu frame
Al heat spreader
75A, 600V & 5A-50A 1200V
The large DIPIPM combines TCIL (Thermally
Conductive Insulating Layer) technology with a
heavy aluminum heat spreader to provide low
cost and excellent thermal performance.
Heavier power pins and increased mechanical
strength allows use of this package at ratings of
up to 75A at 600V. The thicker body and
undercut backside provides the spacing and
clearance needed for 1200V devices up to 50A.
15
DIP-IPM Typical Application Circuit – Open Emitter Type
+VCC
Level Shift
Gate Drive
UV Prot.
Level Shift
Gate Drive
UV Prot.
UV
Prot.
U
V
Motor
W
Gate Drive
NW
LVIC
RSHUNT
NV
RSHUNT
NU
DIP-IPM
16
+
RSHUNT
Input Signal
Conditioning
Fault
Logic
P
To Controller
+
UN
VN
WN
FO
CFO
CIN
VNC
VN1
Gate Drive
UV Prot.
+VCC
Level Shift
VP1
WP
Over Current
Protection
+
VWFS
VWFB
+VCC
HVIC
Controller
VP1
VP
Input
Condition
+
VVFS
VVFB
+VCC
Input
Condition
VP1
UP
AC Line
Input
Condition
+
VUFS
VUFB
HVIC
+15V
HVIC
+3.3 to +5V
Open low side
emitters can easily
be connected
together externally if
not required
Typical DIP-IPM Analog
Temperature Feedback Signal
Typical Output Voltage Characteristic
4.5
4
Output Voltage (V)
The DIP-IIPM temperature
is monitored by a circuit in
the custom LVIC that
provides gate drive for the
IGBTs. Adding the sensor
to the gate drive IC provides
low implementation cost
and high accuracy.
3.5
3
2.5
2
1.5
1
20
40
60
80
100
Temperature (C)
17
120
140
DIP-IPM Linear feedback
versus NTC
Typical Output Voltage Characteristic
4.5
4
Output Voltage (V)
The DIP-IPM linear
temperature feedback
provides superior
resolution in the critical
range. At 80C to 120C
the DIP IPM provides an
output change of 1V
while the NTC provides
a change of only about
0.2V. This makes
implementation of over
temperature protection
more reliable with the
DIP-IPM.
DIP-IPM
3.5
NTC
3
2.5
2
1.5
1
20
40
60
80
100
Temperature (C)
18
120
140
DIPIPM Integration of Bootstrap Circuit
New DIP-IIPMs include integrated Bootstrap circuits. This eliminates the
need for external components a relieves critical spacing on the PCB
PS21963-4
19
PS219B3-AS
Feature Implementation Status
Product Series
Open Emitters
Temperature Sensor
Boot‐Strap Supply Circuit
Super Mini‐DIP
5A, 10A, 15A
20A, 30A, 35A
Available
Available
(20A, 30A)
Under Development
Fall 2013
Mini‐DIP
20A, 30A, 50A
Large DIP
600V
50A, 75A
1200V
5A, 10A, 15A, 25A, 35A, 50A
20
Available
Available
Available
Planning
(2014)
Under Development
Fall 2013
Version 5 Super Mini DIPIPM Features
• 6th Generation, full-gate CSTBT
‒ Low-loss, reduced VCE(sat)
• Built-in bootstrap diode, current limit resistor
• High-accuracy analog temperature output
‒ Linear feedback, not logarithmic
• Pin-compatible with Version 4 Super Mini
• Open emitters, standard
• Available Now!
21
Super Mini-DIP PS219B* (Ver. 5) Application Circuit
Built-In Boot
strap diodes
Analog linear
temperature
feedback
signal
22
Open Low
Side Emitters
NEW: Version 5 Super Mini DIP PS219B* ‐ Line‐up
Voltage
Current
Part Number
Package
Topology
Status
600
5
PS219B2-AS
Super Mini
6-Pac
Available Now
600
10
PS219B3-AS
Super Mini
6-Pac
Available Now
600
15
PS219B4-AS
Super Mini
6-Pac
Available Now
Scope:
1HP to 4HP (0.75kW to 3kW)
Depending on overload requirements
23
The Next Super Mini DIPIPM (Version 6)
• 7th Generation CSTBT (thin wafer)
• Built-in bootstrap diode, current limit resistor
• High-accuracy analog temperature output
‒ Linear feedback, not logarithmic
• Pin-compatible with Version 4,5 Super Mini
• Open emitters, standard
• Planned Availability:
5A,10A, 5A 600V Available Summer 2013
20A,30A,35A 600V Available Fall 2013
24
Version 6 Super Mini
Planned Line-up
25
Voltage
Current
Part Number
Package
Topology
Status
600
5
PSS05S92F6
Super Mini
6-Pac
Summer 2013
600
10
PSS10S92F6
Super Mini
6-Pac
Summer 2013
600
15
PSS15S92F6
Super Mini
6-Pac
Summer 2013
600
20
PSS20S92F6
Super Mini
6-Pac
Fall 2013
600
30
PSS30S92F6
Super Mini
6-Pac
Fall 2013
600
35
PSS35S92F6
Super Mini
6-Pac
Fall 2013
Version 6 Mini DIPIPM Features
• 6.1th Generation CSTBT and low VF FWD
‒ Reduce power loss and improve lock withstand
• Built-in bootstrap diode, current limit resistor
• High-accuracy analog temperature output
‒ Linear feedback, not logarithmic
• Pin-compatible with Version 4 Mini DIPIPM
‒ Temperature output on Pin 20 (previously “VNO”)
• Open emitters, standard
• Available Now!
26
Version 6 Mini DIPIPM
27
Voltage
Current
Part Number
Package
Topology
Status
600
20
PSS20S71F6
Mini
6-Pac
ES = NOW
600
30
PSS30S71F6
Mini
6-Pac
ES = NOW
600
50
PSS50S71F6
Mini
6-Pac
ES = NOW
Generation 4 Large DIP-IPM Line-Up
Typical Applications:
HVAC, Industrial Drive, Pump.
Features:
• Protection: Short Circuit (using
on-chip current mirror), UV
Lockout
• Analog Temperature Feedback
• 2500VRMS Isolation
• N-Side Emitter Open
• UL Recognized
• RoHS Compliant
79mmX31mmX8mm
28
Nominal /
Peak Current
IGBT blocking
Rating
voltage rating
IGBT and Free
Diode
Part Number
VCES
IC/ICP
600V
50A / 100A
PS21A79
600V
75A / 150A
PS21A7A
1200V
5A / 16A
PS22A72
1200V
10A / 20A
PS22A73
1200V
15A / 30A
PS22A74
1200V
25A / 50A
PS22A76
1200V
35A / 70A
PS22A78E
1200V
50A/100A
PS22A79
Large DIP-IPM Application Circuit
VUFS
Three Phase
Induction/BLDC Motor
Control
P
VUFB
+
Level Shift
Gate Drive U
Level Shift Gate Drive VVFS
+VCC
HVIC UP
Input
Condition
VP1
Input
Condition
+
V
VCC
VVFB
UN
CIN
VNC
Fault
Logic
UV
Prot.
VN1
+
VN
Gate Drive +VCC
15V
CSF
29
WN
Gate Drive WN
FO
W
Input Signal
Conditioning
VN
CFO
Level Shift +VCC
Motor
Input
Condition
VP1
WP
VPC
HVIC VWFS
VWFB
+VCC
Overcurrent
Protection
 Separate low side
emitters for phase current
monitoring if required.
Typic
HVIC  Analog feedback signal
(VT) proportional to device
temperature
VP1
3.3V ‐ 5V Logic Interface to MCU  Current Mirror output
allows use of low power
shunt resistor
VT
RSF
Temp Sense
LVIC
UN
RSHUNT
UNDER DEVELOPMENT
The Next “Large” 1200V DIPIPM
• 7th Generation CSTBT and FWD (thin wafer)
• Built-in bootstrap diode
‒ Less components to select, test, populate
• High-accuracy analog temperature output
‒ Linear feedback, not logarithmic
• Pin-compatible with Version 4 “Large” DIPIPM
• Open emitters, standard
 Target Availability Fall 2013
30
UNDER DEVELOPMENT
The Next “Large” 1200V DIPIPM
Planned Line-Up
31
Voltage
Current
Part Number
1200
5
PSS05SA2FC
1200
10
PSS10SA2FC
1200
15
PSS15SA2FC
1200
25
PSS25SA2FC
1200
35
PSS35SA2FC
1200
50
PSS50SA2FC
Sinusoidal Inverter Loss Simulation
(Available from Powerex website: www.pwrx.com)
(1)
Select
Device
(2)
Enter
application
operating
conditions
32
(3)
Run Loss
Simulation
(4)
Read losses
temperature
rise and
junction
temperature
DIP-IPM Family Summary
 Wide Line-Up: 3A-75A 600V, 5A-50A 1200V with common functionality for easy scaling of
designs from 300W to 15KW.
 High Reliability: fully tested module with HVIC gate drivers, six IGBTs and free wheeling
diodes delivers consistent performance, improved reliability and increased manufacturing
yields.
 Low cost: transfer molded package technology provides the advantages of an isolated
module at a cost comparable to discrete components.
 High Efficiency: Low loss 5th generation IGBT
and soft recovery free wheel diode chip
technology.
 Reduced Parts Count: one module replaces
fifteen or more discrete components.
 Smallest size: Use of bare die and simplified
lead frame cuts footprint to less than half of
equivalent discrete components.
 Simplified Assembly: isolated base module
eliminates the need for insulation materials and
requires only two mounting bolts.
33
1/14/2013
Miniature 3KW
Three-Phase Inverter
Using 15A Super Mini-DIP
Questions?
34