AP P L I CAT I O N G R O UP ( A P G )
AUT O M O T I V E
PROGRESS
REPORT
Organisation Cart of the Application Group (ApG) Automotive
IM PR INT
P RO GR E S S R E PO RT OF T H E A PP L I CAT IO N GR OU P
AUT OM OTI V E 201 1/2 012
Published by:
ZVEI - Zentralverband Elektrotechnik und Elektronikindustrie e.V.
(ZVEI - German Electrical and Electronic Manufacturers´ Association)
Electronic Components and Systems Division
PCB and Electronic Systems
Lyoner Straße 9
60528 Frankfurt am Main
Germany
Fon:
Fax:
Mail:
Internet:
+49 69 6302-276
+49 69 6302-407
zvei-be@zvei.org
www.zvei.org
Division: Electronic Components and Systems
PCB and Electronic Systems
Editors: Dr. Stefan Gutschling, Dr. Rolf Winter
Photographs Cover: IAA 2011, ZVEI
While the greatest care has been taken in compiling this document, no
responsibility is accepted for its contents.
All rights reserved, in particular rights regarding reproduction,
distribution and translation. No part of this document may be
reproduced in any form (printing, photocopying, microfilm or any other
process) nor stored, processed, reproduced or distributed using
electronic systems, without written permission from the ZVEI.
Issued: Mai 2012
Organisation Chart of the Application Group (APG) Automotive
Application Group (APG) Automotive
Steering Committee APG
J. Weyer, Freescale Semiconductors
P. Gresch, Brose
SUPPLY CHAIN
TECHNOLOGY
Working Group
Working Group
Ad-hoc Group
Electro-Mechanical Interfaces
Component Cleanliness
Part Change Notification Method
S. Hauptenbuchner, Kostal
Dr. M. Nikolussi, Robert BOSCH
Dr. O. Autzen, Robert BOSCH
Task Force
4)
1)
Working Group
1)
Working Group
End of Life Vehicles
Customer Specific Requirements
Supply Chain Reliability
B. Eilken, Infineon Technologies
B. Buchwald, Infineon Technologies
M. Ludwig, Robert BOSCH
Working Group
Working Group
High Temperature &
Power Electronics
Ad-hoc Group
First-Mate-Last-Break
Ch. Thienel, Robert Bosch
1)
Failure Parts Analysis
H. Anders, STMicroelectronics Application
Dr. M. Rittner, Robert BOSCH
2)
1,2)
Working Group
Team
Working Group
Functional Safety
High Temperature Electronics
Robustness Validation Forum
B. Arends, Marquardt
Dr. M. Rittner, Robert BOSCH
H. Keller, Keller Consulting
Ad-hoc Group
3)
High Voltage Cables and
Interconnection Technology
Dr. H. Kalb, LEONI Kabel
Working Group
Team
6)
Working Group
Power Electronics
Zero Defect Strategy
M. Münzer, Infineon Technologies
H. Mahler, Infineon Technologies
Team
5)
Process Reliability
Standardisation
Prof. H.-J. Albrecht, SIEMENS
Dr. R. Becker, Robert BOSCH
1)
Reports also to the Working Group Quality
2)
In collaboration with the SAE
3)
Committee of the ZVEI Cable Division that also reports to the APG
4)
ZVEI delegation to CLEPA Working Group
5)
Working Group of the Technical Committee reports to the APG
6)
In collaboration with the ECPE (European Centre for Power Electronics)
QUALIFICATION
TABLE OF CONTENT
Organigram
Organisation Chart of the Application Group (APG) Automotive .................................................... 3
Introduction
Preface by the Chairman of the Steering Committee APG ............................................................ 5
History of the Application Group (APG) Automotive - Visions and Goals ....................................... 6
Reports
Report by the Chairman of the Application Group (APG) Automotive ............................................ 7
Qualification
Failure Parts Analysis ................................................................................................................ 9
Robustness Validation Forum ................................................................................................... 10
Zero Defect Strategy ................................................................................................................ 11
Supply Chain
Cleanliness of electronic systems and components .................................................................... 12
Customer Specific Requirements .............................................................................................. 13
Part Change Notification Method .............................................................................................. 14
Supply Chain Reliability ........................................................................................................... 15
Technology
Electro-Mechanical Interfaces ................................................................................................... 16
ELV – End of Life Vehicle ......................................................................................................... 17
First-Mate-Last-Break .............................................................................................................. 19
Functional Safety ..................................................................................................................... 20
High Voltage Cables and High Voltage Interconnection Technology ............................................ 21
High Temperature and Power Electronics .................................................................................. 22
Process Reliability ................................................................................................................... 23
Statistics
Automotive Electronics Market .................................................................................................. 24
Public Relations
Public Relations of the ZVEI Application Group Automotive ........................................................ 26
Activities of the ZVEI Centre of Excellence in Electric Mobility .................................................... 28
Members
Active Members of the ZVEI Application Group Automotive ........................................................ 29
Publications
Publications of the ZVEI and of the Application Group (APG) Automotive .................................... 34
P RE F A C E
Preface by the Chairman of the Steering Committee APG
The recent year 2011 was for many ZVEI “Electronics, Components and Systems” member
companies very encouraging regarding both revenues and profits. Yet the Fukushima tragedy
created a drop for those who have operations and / or sales in Japan and wi th Japanese
customers, most industries were stable or growing. Especially the German Automotive industry
which has been the strongest market segment for electronic components and systems for many
years now, benefitted from growth in Asia and recovery of bu siness in the Americas. Allocation of
critical components which created lots of turbulences in 2010 decreased in 2011 to a more
predictable business execution.
Peter Gresch
Nevertheless, ups and downs in the Electronics business seem to appear more frequently and with
larger peaks and drops. This makes it even more important that the entire industry bundles their
activities to optimize processes, supply chains, parts allocation and distribution. And particularly
creates reliable forecasts. Easily said, difficult to achieve over many customers and industries with
very different business life cycles market conditions, and requirements.
Thus, the 2004 founded ZVEI activities in the “Application Group Automotive” (APG) have created
more and more attention e.g. with optimization of processes, the coordination of quality topics
along the entire value chain at a pre-competitive level or the standardization of requirements and
the development of best-practice recommendations. More than 50 recommendations, working
documents and professional articles have been published so far, which find consideration not only
within ZVEI member companies, but are increasingly referenced also by a wide audience in the
global automotive industry.
The Steering Committee of those activities, led by my predecessor Dr. Kallenbach from Bosch for
the last five years, consists now of 30 executives of the largest and most important German – or
Germany based - Automotive Electronics suppliers and members of ZVEI ECS. Representing not
only Vehicle Electronics, but also PC boards, connectors, cables, semiconductors, passive
components… We meet regularly, also with E/E leaders form our customers, to identify new topics
that might justify APG workgroup activities, review the working group results, and support thei r
implementation in the daily business.
The final results are regularly communicated in brochures, articles to the automotive electronics
press and speeches at international conferences. As an example, the APG organises the next ZVEI
conference “Competence in Automotive Electronics”, which will take place in Munich 7./8.
December 2011 in co-operation with the Munich International Trade Fair. Another important part of
the communication strategy is also the organisation of smaller conferences for special topi cs such
as Robustness Validation, Power Electronics…To provide experts a forum for sharing their
experiences and encourage discussions.
And – in the last two years - more and more results from APG e.g. on power electronics, highvoltage cables and connection systems, etc. are brought into the regular meetings and working
groups of the Electro Mobility task force from ZVEI.
Finally, I would like to thank all contributors to this English edition of our APG work progress report
and the outstanding results we achieved in the recent years. Many working group members have
spent significant extra efforts beyond their regular job to move their topics ahead.
Let all of us keep this passion and pace for the future! Enjoy reading the fruitful articles .
Peter Gresch
Chairman of the APG Steering Committee
5
VI SI O N AN D GO AL S
History of the Application Group (APG) Automotive - Visions and Goals
History of the APG
Due to the increasing complexity and variety of the automotive electrical components in recent
years, the ZVEI, as one of the largest association in Germany, has broadened its activities in
automotive electronics on a competitively neutral basis. Already existing activities, mostly driven
by the ZVEI Division Electronics Components and Systems, were bundled in the
Application Group Automotive (APG) in 2004. Meanwhile the APG is a common board of
the Electronic Components and Systems Division and the PCB and Electronic Systems
Division within the ZVEI.
Under the lead of Dr. Martin Stark, Freudenberg & Co. KG, the APG developed in an
outstanding way. Since 2007 Peter Gresch, Brose Fahrzeugteile, has continued this
work successfully. Thus the APG has found a broader recognition and acceptance
within the automotive community by intensifying its public relations activities. In 2011
Jürgen Weyer, Freescale Semiconductors, became Chairman of the APG.
The increasing application of automotive electronics in recent years caused a
substantial shift of development tasks toward the component and system
manufacturers, a trend that is also seen in the work of the APG. The enduring growth
of the APG in terms of members and tasks created a powerful committee authorized
to act in the name of its represented companies. The APG generates an increased
awareness for electronic problems and the development of a common understanding with
the car manufacturers since 2004.
Sensortechnik Wiedemann IAA 2011
Additionally, a Steering Committee with top managing directors of important component
manufacturers and system suppliers has been established in 2005. This Steering Committee
supports and accompanies the structuring process of the tasks within the APG.
The APG working groups, focussing on specific topics in detail, are the basis of the common
activities under the roof of the APG. The final results of these activities are published in form of
brochures, recommendations or guidelines.
Vision und Goals
Our goal is to concentrate and coordinate all automotive-specific activities within the
ZVEI mainly represented by the Electronic Components and Systems Division and
the PCB and Electronic Systems Division.
We strive for an "integral" consideration of the electrical-electronic systems
"as a whole". We intend to collaborate with all stakeholders beyond the
borders of our association. One of our goals, that we pursue, is the
avoidance of double work and divergences in the requirements by an early
reconciliation between all partners of the supply chain.
For the efficiency of our work a co-operation and reconciliation with the VDA
is aspired. Our priority is the consciousness-raising for electronic problems and
the search for common solutions with the OEMs. Substantial topics are: Reliability
and Qualification of the components, series quality, delivery security, long -term supply.
Robert BOSCH - IAA 2011
6
By constantly pursuing these goals, we contribute to the stabilization of the competitive abilities of
our member companies.
A PP L I CAT IO N GR OU P (A PG ) AUT OM OTI V E
Report by the Chairman of the Application Group (APG) Automotive
AUTOMOTIVE INDUSTRY – CHANGING PARADIGMS
What was once being reported as the most stable industry has seen its most dramatic changes
over the last 3 years – from an unprecedented downturn in 2008/2009 we have seen a
rollercoaster ride in the other direction with record growth and supply challen ges.
By looking at the German vehicle manufacturer, strongly dependant on their export, we observed a
steady increase in the production of passenger cars and heavy goods vehicles since February
2009.
At time of this report we see a stabilization of the market with some early signs of market
slowdowns – all in all it is becoming extremely difficult to predict the future.
In addition we see continued growth of electronic content driven by the request for greener – safer
– more comfortable and interconnected vehicles – the result is a fantastic opportunity for
innovation and growth for the entire automotive supply chain.
Jürgen Weyer
700
60
600
50
Passenger Cars
500
40
400
30
300
20
200
Heavy Goods Vehicles
Vehicle Production in Germany
Jan 08 - Aug 11 (per month in thousends)
10
100
0
0
Jan Mar May Jul Sep Nov Jan Mar May Jul Sep Nov Jan Mar May Jul Sep Nov Jan Mar May Jul
08 08 08 08 08 08 09 09 09 09 09 09 10 10 10 10 10 10 11 11 11 11
Source: VDA
Passenger Cars
Heavy Goods Vehicles
AUTOMOTIVE INDUSTRY – WHAT’S NOT CHANGING – The ZERO ppm challenge
Our quest for ZERO ppm will continue and can only be accomplished by addre ssing the challenge
along the entire value chain – and we have to accept that given, the significant increase in
complexity both in hardware and software. We need to specifically address the interdependencies
of all that content within the entire vehicle.
APPLICATION GROUP (APG) AUTOMOTIVE – meet the challenge
Given those challenges at hand the APG group automotive will continue to drive key critical areas
based on a unique combination of skill sets coming from its supporting members.
A key issue on the way to “ZERO ppm” is a fast reaction on failures and apply lessons learned to
avoid recurrence. A ZVEI workgroup addresses the failure management process along the value
chain and focuses on the “No Trouble Found” (NTF), “failures”, which cannot be verified in the
7
A PP L I CAT IO N GR OU P (A PG ) AUT OM OTI V E
analysis and the root cause cannot be found. An essential aspect will not only be the failure
identification and analysis but also the failure prevention.
Therefore a holistic and continuous Traceability will be mandatory to meet these needs. An
intersectoral ZVEI working group - including members of the APG - has published a
recommendation how such a traceability system can be set up.
Robustness Validation and the many derivative names of it – like “fit for function” or “Robust
Design” – is becoming reality by understanding the true requirement within the application. The
results of the successful joint activities of the ZVEI with international partners SAE and JSAE on
the subject of Robustness Validation have been summarized in five handbooks since 2005.
The knowledge about the component, module or system behaviour within in the application
(mission profile) is helping to prevent failing applications at start of production. Meanwhile German
OEMs have encountered the benefit from the approach and introduced the Robustness Validation
Approach within their qualification framework.
In addition, the recently introduced white paper on FMLB – “First mate – last break” – has shown
additional areas for future improvements with the full potential to be r ealized in future car
architectures.
Broadening the Network – Cooperations and Partnerships
Recent activities of the APG are on the intensification of the cooperation along the value chain particularly on the subject of electro-mobility - with the ZVEI Divisions "Batteries and Cables",
"Installation Technology" and "Energy". Four technical working groups (TWG) have been
established to bundle and coordinate all activities of the ZVEI members in the field of components,
systems and infrastructure regarding electric mobility.
Due to successful partnerships and cooperations with important, thematically related organization
outside of Germany, like CLEPA, SAE, FIEV the APG could strengthening its influence and
awareness on an international scale e.g. in the areas of Robustness Validation, Revision of ELV
Annex II.
Nationally, the discussion with the German OEMs about possibilities of potential cost savings was
intensified. Further issues are for example "load dump" protection, raising ESD specifications,
reverse polarity, or Robustness Validation that was also integrated in the VDA-QMC Training
courses. The collaboration with the European Centre of Power Electronics (ECPE) within the joint
working group "Power Electronics" focuses on Robustness Validation for Power electronics and the
annotation of the VDA delivery specification on reliability tests for power electronics modules.
Mennekes – IAA 2011
Outlook and future Topics of the Application Group Automotive
We are continuously looking for new areas which are relevant to our automotive segment and
believe that specifically looking beyond components into software programming systems and
services will provide values. The APG working group on “ISO 26262 – Functional Safety” is a first
example, where both hardware and software issues have to be considered.
I also believe that the recent crisis in Japan has shown the vulnerability and dependencies of our
industry – new logistic concepts – multi sourcing – a holistic approach – are areas which in my
opinion could be worthwhile for new themes in the working groups of the APG Automotive . These
can be based on the already existing activities and working groups e.g. on the PCN-Method, the
Supply Chain Reliability. New Topic are identified, e.g. Component Cleanliness.
I am excited about the opportunities and convinced that there are many areas where the ZVEI and
specifically the APG automotive will help us to drive innovations for keeping our industry at the
forefront of this market.
8
F AIL UR E PA RT S A NAL Y S IS
Ad-hoc Working Group Failure Parts Analysis
The VDA volume „Field failure analysis”, issued in July 2009 recommends the process and
conditions of the failure analysis between OEM and Tier1 for units returned from the field. The
direct transfer and application of the proposed process throughout the supply -chain including the
component manufacturers is recommended there but seems not feasible. The most critical cases
are returned units, for which the failure cannot be confirmed and called NTF (No Trouble Found).
These NTF represent up to 40% of the failure analysis requests reaching the component suppliers.
Unfortunately, the high cost and workload caused in the supply-chain is very often not
balanced by valuable results. It typically remains very challenging to confirm a defect in
such cases due to lack of detailed information and support. In many cases
a final and clear root cause and resolution cannot be identified.
Based on this experience and environment the ZVEI ad-hoc working
group NTF “field failure analysis” was started.
The above mentioned VDA volume describes which pieces of
information have to be provided on either side and exchanged
between OEM and Tier1. Unfortunately, many details considered significant for the
successful execution of the analysis at the component supplier are shown as optional. They are
either not mandatory or not mentioned at all. Therefore the focus of the working group has been
put on the improvement of the communication process and information exchange along the supplychain.
Proposals have been worked out which technical details are required for a successful electrical
and physical device analysis. The criteria and conditions have been reviewed and described to
start and stop the joint and successful execution of an NTF-process between Tier N and the
component supplier. A recommendation for an optimized communication flow in both directions of
the supply-chain has been prepared.
The actual status of the retrieved and accessible field diagnostic data was presented by a QMrepresentative of a big OEM during a work session beginning of this year. This first achievement to
directly involve the OEMs showed which level of information is available today and may be used f or
further investigations and analysis. Support and three-party reviews were offered by the OEM for
critical NTF-cases.
Further contacts have been established with additional OEMs to include their point of view and
related status as well as availability of diagnostic data.
Important next steps are: How can the basically available data at the OEMs be accessed for the
failure analysis and which additional information should be included? The obligations and
limitations regarding transfer of and protection of diagnostic or personal data of the car users
remain to be reviewed.
Finally we need to jointly define the dedicated analysis flow between Tier N and component
supplier in general and specifically for the case of suspected or verified NTF. This will be done
based on the already achieved results of the previous working group sessions and could finally be
published as recommendations in a brochure.
9
RO BU ST N E S S V ALI DA TI O N FO RU M
Working Group Robustness Validation Forum
Robustness Validation is a procedure for qualification and technical release of electronic
components. In the automotive industry the common release procedure AEC Qxxx
applies unspecific test with a statistical accuracy in the percentage range,
whereas Robustness Validation evaluates the functional und physical
limits of the electronic components using End-of-Life tests and
compare these to the conditions within the application.
Based on the information provided by the customer about the
operational demands within the application (Mission Profile) and a
comparison with the stress limits of the component supplier and
customer can carry out rapidly and verified essential risk
assessments and judgments in a closely dialog.
A procedure commonly applied for mechanical components, e.g. in
breaking load testing und tire testing.
Robert Bosch – IAA 2011
Meanwhile the ZVEI working groups in collaboration with the SAE und the JSAE have
published a great amount of documents:
Handbook for Robustness Validation of SC Devices in Automotive Applications,
Handbook for Robustness Validation of Automotive Electrical/Electronic Modules
Robustness Validation - System Level: Appendix to RV Handbook for EEM
Robustness Validation for MEMS – Appendix to RV Handbook of SC Devices
Robustness Validation Manual – How to use the Handbook in product engineering
For a broader awareness of the Robustness Validation method the ZVEI in collaboration with the
VDA carry out training courses twice a year. In addition a Robustness Va lidation Symposia at the
“Technische Akademie Esslingen” also covers the demands and the application of Robustness
Validation in the Aerospace and Medical industry that are far beyond the requirements within the
Automotive Industry.
Technical trainings with a focus on high temperature und power electronics are organized by the
ECPE (European Centre for Power Electronics).
Fact Sheets
Based on the results of the RV working group specific topic and technical terms will be explained
and published in a compact and condensed form. These “fact sheets” will increase the mutual
understanding of all involved parties and will provide a good basis for further discussions.
Recently a draft version of thirteen single-sided “fact sheets” for technical topic and terms
are available that can be applied for a short briefing of executive level manage rs. A
revised version of the fact sheets will be available in autumn 2011.
For the future it is planned that further topic from other APG working groups will also be
published in a condensed way as fact sheets and thus a ZVEI “Wissenskompendium” will
be established.
The fact sheets will be publicly available for downloading from the ZVEI homepage.
Ford – IAA 2011
10
Z E RO D EF E CT ST RA TE G Y
Working Group Zero Defect Strategy
The increasing number and complexity of electronic applications in cars, the high expectations of
the drivers in the reliability of their cars, as well as the profitability of the Value Chain requires a
new way of thinking for Quality Strategies.
Even despite of the already achieved high Quality of single components and systems, a further
improvement is not unrealistic, but requires a change in the mind set along the entire
Value Chain towards implementing of a holistic Zero Defect Strategy.
The majority of manufacturers have already improved and optimized the
performance of their processes towards the Zero Defect goal. But even
the best optimization of individual processes will not guarantee that a
reliable, zero-defect product reaches the market. Zero Defects
requires a strong cross link of all processes along the entire value
chain and can only be achieved if everyone aspires to this same goal
and works together to implement the measures required.
A comprehensive development process supported by Qualification and
Reliability Standards focusing on failure mechanism specific evaluations
provides the basis for assessments of the maturity, robustness and finally
applicability of the technologies, components and system. Together with VDA
training classes for Robustness Validation are offered to the industry.
ZF – IAA 2011
Another important element on the way to Zero Defects is to react fast on failures and to ta ke
lessons learned out of them.
Summer 2009 VDA published the guideline „Schadteilanalyse Feld“, which addresses the failure
management process along the value chain and focuses on the NTFs, “failures” , which cannot be
verified in the analysis and the root cause cannot be found. NTFs contribute with 40% and even
more to all failures reported in the Automotive Industry. The analysis of them is time -, resourceand finally cost intensive and due to the fact, that at the end there is no result, the value add is
questionable.
A ZVEI workgroup had been installed with the goal to develop a standardized catalogue, which
information and data have to be provided at the interfaces, how to organize the communication and
a conjoint problem analysis. An essential aspect will not only be the failure iden tification and
analysis but also the failure prevention.
The workgroup not only consists of members from the electronic component manufacturers but
also from Tier 1. To get a crosslink to OEMs representatives from ZVEI discussed this topic with
the management of VW Corporate Quality E/E in Wolfsburg February this year. A representative of
VW Corporate Quality E/E, responsible for field diagnosis, joined the following meeting of the
workgroup and presented which information and data are available at the OEM. The essential step
now will be to clarify how to get access to these data and which kind of additional information
would be necessary for an effective and efficient analysis flow.
In this first meeting the new VW concept for supplier management, which con tains a supplier
certification, also was touched and further discussions on this topic agreed. In addition to this the
“Robustness Validation” was also introduced and the training classes announced.
In a second meeting the topic of Traceability in the Electrical and Electronics Industry, published
by ZVEI, was announced and ZVEI was invited to present this at the Conference of the OEM QS
Heads E/E, which was hold in September.
During these two meetings with VW, we could identify several topics, making a joi nt discussion
valuable. To follow the Zero Defect Strategy, we will continue and intensify the contacts.
11
CL EA NL I N E S S OF EL E CT RO NI C S Y S T EM S A ND C O MP ON E NT S
Working Group Cleanliness of electronic systems and components
Technical cleanliness of electronic systems and components in automotive modules (e.g. gearbox,
engine, brake systems) is a further and growing challenge for the automotive industry. Highly
complex mechatronic aggregates and systems are on a higher level of
compactness and include additional functionality for e.g. with regard to
integration of electronics with hydraulics. Microscopically small
particles on the surface of components and systems may be the
root cause for malfunction of such kind of systems during life
cycle. Automotive electronic industry is searching for effective
and efficient solutions to avoid expensive failures in this area.
Mektec Europe
Concerning cleanliness there are different standards and
specifications in the automotive industry, for example ISO
16232: “Road vehicles – Cleanliness of components of fluid
circuits”, VDA 19: “Testing of technical cleanliness” or VDA 19
part 2: “Technical cleanliness of assembly.” To some extent,
these documents describe cleanliness requirements of production
processes. Based on the above mentioned generic standards and
specifications OEM, Tier1, Tier2 or Tier3 suppliers generated own
specific descriptions or standards with different content. All of these standards
require equally high cleanliness in all production and transportation steps of the
supply chain without considering an adapted technical requirement to each process with the target
of keeping the highest requested cleanliness level and taking effectivenes s and efficiency into
account.
ZVEI Application Group Automotive plan to start the working group “Cleanliness of Component”
with the following targets and tasks:
Analyze the cleanliness requirements of components, subsystems and system s within the
whole supply chain
Generate a proposal of harmonization of the requirements, on each level of production in
the supply chain as well as between the suppliers
Find economical proposals for an adaption of production requirements
Define interfaces between the supply chain to keep the achieved level of cleanl iness
Create recommendations for the investigation of remaining particles on electronic systems
and components and guarantee necessary statistical proving
The kick-off meeting for this working group was scheduled for beginning of November 2011.
Material
Method
Human
- Transportation
- Packaging
- Education
- Worker
Machine/
Process
12
Cleanliness
of
component
and system
Infrastructure
Cleanroom
CU ST OM E R S P EC IFI C R E QU IR EM E NT S
Working Group Customer Specific Requirements
ZVEI Position Paper “Customer Specific Requirements (CSRs)” bears fruits
The standard ISO/TS16949 (Quality management systems – special requirements when applying
ISO 9001 for the production of serial products and spare parts in the automotive industry) provides
a common starting point for a QM system in the automotive industry supply chain. ISO/TS 16949
can be applied in precise terms to the supplier's QM system by additional or expanded customerspecific requirements ("CSR" – cf. ISO/TS 16949, section 0.5).
The increasing number of documents and the non-standardised structure of customers'
requirements in relation to ISO/TS 16949 set more and more complex demands on the entire
supply chain, involving tasks which tie up the suppliers' resources.
The much-noticed ZVEI position paper, signed by 30 companies in June 2008 had been the
nucleus for a new VDA Recommendation. This paper demonstrates that suppliers are confronted
by a range of different demands by their customers, covering complex issues such as logistics,
warranty and methods used in the product development process. They are therefo re faced with the
problem of implementing a uniform operating process with several (customer -specific) variants.
This generates extra work and increased costs in the supply chain, without improving the quality of
the products to any significant degree.
Late spring 2009 the VDA kicked off a CSR working group and invited the ZVEI Working Group
Chairman as a regular member.
Based on ZVEI elaborations a VDA recommendation “Customer-specific QM systems –
Establishing customer-specific QM system requirements based on ISO/TS 16949” had been
published in 2010 in German and English.
This recommendation covers the documentation and explanatory notes for a
standardization of the format and sequence. As a consequence, "CSR“
documents must set out in precise terms the requirements which are not
closely specified in ISO/TS 16949.
The internal structure of this present
standard is based on ISO 9001 and
ISO/TS 16949 and it may therefore be
used throughout the supply chain.
It is to be hoped that the OEMs and
first Tier Suppliers will strive for a
rapid implementation which will
reduce the still existing waste of
effort along the complete supply
chain.
13
P ART C H AN G E NOT IFI CA T IO N M ET HO D
Ad-hoc Working Group Part Change Notification Method
Changes to electronic components (active and passive devices) can become necessary for many
reasons. E.g. some might be development related; some could have a quality or logistic
background, etc …
According to international agreed standards, changes of electronic components must be notified
and qualified by the manufacturer, and often approved by the customer. For this change process
the PCN guideline from ZVEI describes a maximum processing time of six months. Experiences
show that PCN approval often takes even longer.
Following barriers for the PCN process were identified:
partly insufficient and unclear content of PCN leads to retardation
incomplete description of change information can lead to misunderstanding, and
without additional hints for device change it‟s not clear which influence on functionality /
reliability could be affected.
Most of these barriers affect the communication between 2nd tier (component manufacturer) and
1st tier (electronical control unit manufacturer). To reduce the processing time the working group
“PCN Methodik” proposes to
define and compile a standardised information set for change notification from 2nd tier to
1st tier (standardised systematic) with information of possible impact and
develop a method to evaluate the technical impact of the device changes in the application.
After implementation of this method the 2nd tier will perform the technical evaluation of device
change and send this with the standardised product change notification
to the 1st tier. This will support the 1st tier to assess the change
and to evaluate the impact of the device change on a
technical level for the final application.
This standardised change notification will be
compliant to the current ZVEI PCN guideline.
Opel – IAA 2011
14
S UP PL Y C H AI N R ELI AB I L ITY
Ad-hoc Working Group Supply Chain Reliability
The past downturn situation showed that despite falling sales the production forecasts had been
inflated. Exaggerated inventory costs, material scraping and high fixed costs loaded the entire
supply chain up to insolvency risk.
This followed at the end of 2009 an unexpectedly steep recovery, which raises again huge
challenges for the Supply Chain. In order to participate in the upturn, the suppliers left no stone
unturned, which raises again the issue of costs (e.g. special freight,
material procurement, etc.).
Also in the upturn, the forecasts deviated widely from the
real demand. The uncertain view, delayed necessary
investment and structural measures. Thus the cost
load and the component bottlenecks rose
unnecessary.
DENSO – IAA 2011
The effects of such misleading forecasts become
clear, if one considers the underlying complex supply
and production chains. So the semiconductor industry
for instance, could only follow continuous short term
increases in a limited way, due to the physical production
lead times. For the one to two days of call offs from the OEM the
system manufacturers, faces eight to 16 weeks for the production of
semiconductors, which can increase in allocation times up to twelve months. The same situation
applies also for further commodities such as, special plastics, semi-finished material or also raw
materials.
Today's form of contracts regarding fluctuations requires a supply security, which is de facto not
given.
Recommended measures:
Allocation situation could be avoided by close communication of all partners of the entire
value chain.
A long-term world-wide view with a well-regulated commitment (e.g. a twelve-month rolling
Forecast) over the entire supply chain would improve the basis for planning and
investments and therefore will help to avoid allocations.
Early and open communication about „threatening‟ bottlenecks and relevant changes in the
Forecasts, allows an optimized and efficient matching between customer and material
disposition.
With standardized, simplified and shortened release procedures (see also working groups PCN
Methodology and Robustness Validation Forum) for alternative components the flexibility can be
increased. Co-operation between all partners of the automotive Supply Chain has shown that this
is possible without a reduction in the reliability.
15
EL E CT R O - M E CH A NI CAL I NT ERF A C E S
Working Group Electro-Mechanical Interfaces
Within the application of connectors for vehicles there are numerous topics besides the
requirements of Electro mobility which are partially new and partially constitute optimization s of
already existing systems.
Based on this background that these topics are very technical and for that reason cannot be
discussed within the framework of APG meetings, a specialized work group (AK) was founded. The
description of this work group is as follows: Requirement for validation and processing of terminals
(AVVK). This includes in detail:
Crimping of wires to terminals
Evaluation of customer specific crimp norms and their impact on the manufacturers of
connector systems – standard products of the manufacturers
Usage of crimping tools which are not supplied by the manufacturer of the respective
terminal systems – warranty and liability questions
Slow motion test / head room requirements in connection with smaller wire interfaces –
applicability
Measurability of insulation crimps – new requirements and specifications
KOSTAL Kontakt Systeme
Preparation of a position paper of connector manufacturers
Not specified processing method
The application of various welding and soldering processes to attach w ires to crimp
terminals are partially carried out, however are not tested or approved by the
manufacturers of contact systems – functional / warranty questions
Preparation of a position paper of connector manufacturers
High temperature applications of terminal systems
The question needs to be clarified if in connections with the usage of high temperature
electronic controllers there are also respective requirements for the connectors.
Inclusion of topic in appropriate ZVEI work group
LV 214 (Specification for connectors of the German OEMs)
Evaluation of the contents in terms of feasibility, cost-usage benefit ratio etc. and if
necessary written statement of requested changes. Failures
of semiconductor devices in automotive electronics
are often caused by electrical overstress (EOS).
Kostal
16
KOSTAL Kontakt Systeme
EL V – EN D OF LIF E V E HI CL E
Task Force ELV – End of Life Vehicle
In August 2008 a revision of the ELV Annex II (Directive 2000/53/EC) came into force wherein lead
in solder in electronic circuit boards and other electrical applications is forbidden in general for
cars which are type approved from 1.1.2011 onwards. Even the existing
RoHS exemptions did not have any effect.
Finally due to the concerted appearance of the whole supply chain it was
possible to convince EU COMM to start a new review process for exemptions
8a+8b in Dec. 2008.
The Success of the common efforts from the total industry supply chain in
terms of intensive discussions with EU COMM and Öko and lobbying
activities resulted in the publishing of the Annex ll(ELV) Commission
decision on February 23rd and it entered into force end of February 2010.
BMW Group
Instead of exemption 8a+8b now 10 new exemptions 8a – 8j are implemented. For the component
industry the very important exemption “lead in HMT solder”(8e) has now no expiry date and a
review is planned in 2014. The exemption 8e,f,g,h and 10d will be reviewed in 2014. In addition, it
is to fear that exemptions 10a,b,c may also be included in a revision (even if they do not have a
defined review date yet).
To ensure that Automotive Industry will be better prepared (compared to last review), it is seen as
necessary to already
build up a contact matrix with experts,
coordinate actions between industries and regions,
build up expertise now and to keep it updated on a regular base until 2014.
Source: ACEA/CLEPA, Ökoinstitut
17
EL V – EN D OF LIF E V E HI CL E
Therefore the CLEPA working group set up working groups for each of these exemptions to
support these goals. The main activities of these working groups are to build up a contact matrix
for each exemption, drafting an “expert paper” for each exemption which sums up the technical
state-of-the-art and following up technical development.
In addition the group will negotiating with the EU commission about the permanent AnnexII reviews
including the debate about the reference of the 0,1% level. For the automotive OEMs the lead free
roadmap (see above) showed to the EU commission in 2008 is still valid.
To convince the commission the CLEPA working group has collected data to develop a graph (see
below) which shows the excellent improvement of lead reduction in car electronics the past years.
Source: ACEA
Further arguments are the size reduction of electronic components from 0,5µm to 2µm in the 80ies
to 0,04µm to 0,2µm today; that means more than 90% smaller.
Die Attach 5 Project – Pb-free Solder D/A -Technology
In parallel to these activities five semiconductor companies (Infineon, Bosch Semiconductor, NXP,
STM, Freescale) started a consortium headed by Infineon in spring 2009, the so called DA5
project, with the objectives of a joint development of semiconductor suppliers to address and
mutually define the direction of Pb-free solder d/a-technology development and demonstrate to the
EU that the industry really has the interest to solve this challenge.
The DA5 is working together with suppliers to find feasible solutions for a lead-free die-attach.
Their suppliers are encouraged to approach DA5 with their solutions, to identify sustainable,
enduring, standardized, reliable and dependable solutions for the customers. A presentation about
the content and the results of the DA5 cooperation are available by sending a request to
bodo.eilken@infineon.com.
At the end the whole supply chain is convinced to find solutions together with the EU which allow
technological progress and entrepreneurial success in strong combination with environment and
health requirements.
18
F IR ST - M AT E- L A ST - BR E A K
Working Group First-Mate-Last-Break
White Paper “First-Mate-Last-Break grounding contacts in the automotive industry”
Electrical Overstress is a common root cause for destroyed automotive semiconductors. Many of
these failures are due to connecting under voltage, “hot plugging”. This is a systematic situation in
modern cars, where a lot of applications are still supplied after switching OFF ignition. When
plugging hot, normally there is no information about current and voltage at the connector. FMLB
contacts safeguard a defined grounding concept in these cases.
The working group describes background information and solutions for the introduction of extended
ground pins in 12v/24v car area. Main idea was to supply quick information for an overview.
Typical daily life situations of car manufacturers and garages
outside are shown. Several real examples can help to
understand the consequences of a mechanical matter for
electronics in cars. Measures are concretized with a lot of
pictures.
Protection elements are no alternatives to FMLB contacts and
increased protection against electrostatic discharge (ESD) is
worthless, too. We describe a scenario for introduction and
roughly estimate the savings due to FMLB contacts.
Afterwards many examples of FMLB contacts from different
industries are shown in an appendix.
All involved 24 companies want to contribute to a
broad and fruitful discussion in the car industry
and try to bring the idea forward.
The white paper is published in several
languages as Chinese, English, French and
German. Japanese, Portuguese, Russian and
Spanish coming soon.
19
F UN CT I O NAL SAF ET Y
Working Group Functional Safety
Functional Safety ISO 26262 – the new challenge
The new automotive safety standard ISO 26262 requires an automotive specific safety lifecycle
and supports tailoring the necessary activities during following lifecycle phases:
management,
development,
production,
operation,
service,
decommissioning.
Therefor the ISO 26262 provides a risk based approach for
determining risk classes (Automotive Safety Integrity Levels,
ASIL´s). The publication as worldwide standard will be end of 2011.
Due to product liability reasons the ISO 26262 is mandatory for the
future.
The ISO 26262 is available since end of April 2011 as “Final Draft
International Standard”. So the content specific work of this standard is
finished. But there are still a lot of open discussions going on how to work with it
in detail:
Daimler – IAA 2011
Which function has which ASIL-level (different levels between different OEM´s for the same
function)?
How is the responsibility managed for safety relevant products between OEM, supplier and
sub-supplier?
How to evaluate “old” products and how to handle changes for them?
Based on the current existing concerns about the new standard the ZVEI decided to establish a
working group “Functional Safety”. Under the lead of Mr. Berthold Arends (Marqua rdt
GmbH) the group worked in several meetings on different topics since September
2010.
Development Interface Agreement (DIA), relative hardware metrics and the
proven in use argument were presented and discussed more in detail based
on different dissertations from Bosch, Marquardt and Kugler-Maag. Furtheron
two sub groups were established. The first sub group is working on hardware
components (intermediate vs. complex level). The task of the second group
is to create an executive summary in order to provide a short management
summary about the ISO 26262.
During the meetings oftenly questions about responsibilities and liability came up.
Based on the setup of the working group it was decided to offer a workshop together
with legal experts in order to discuss the open questions about responsibilities, liability and legal
concequences. This workshop in October 2011 addressed the following topics
legal evaluation of processes in connection with ISO TS 16949 and ISO 26262
product liability and ISO 26262
contract fulfilment according to ISO 26262
The goal of the working group “Functional Safety” is to finalize the tasks (“Executive summary” and
“Hardware components – intermediate vs. complex level”) within the two sub groups. The results
will be provided via ZVEI.
20
HI GH V OL T AG E C AB LE S AN D INT E R CO NN E CTI O N TE CH NO LO G Y
Ad-hoc Working Group High Voltage Cables and High Voltage
Interconnection Technology
The components of the electrical powertrain are connected with high-voltage harnesses, which
transfer high electrical power at high voltages. There are no common standards for high -voltage
components such as cables and connectors at present and interchangeability is consequently often
not given. Furthermore, existing specifications – with limited long-time experience – include
safety factors.
The working group with representatives from the cable industry, connector
manufacturers and harness makers develops proposals for specifications and for
international standardisation. Additional objectives are to exchange experience
independent of specific components and to evaluate as well as comment on
existing specifications.
A joint proposal for a uniform geometric design of high-voltage cables has
meanwhile been worked out, implemented in first draft versions of delivery
specifications and introduced to the international standardisation committee.
This comprises uniform geometries for cables with conductors of different
flexibility including aluminium conductors and reduced tolerances of the cabl es at
the connector interface, especially in the sealing area between cable and connector
and the interconnection of the EMI shielding.
LEONI Kabel
Moreover, the working group exchanges experience concerning essential requirements, e.g.
regarding the voltage level and electromagnetic compatibility.
A multitude of different system voltage levels from 100V up to 1,000V are applied in today´s
hybrid and electric vehicles. However, the voltage level is a major criterion for dimensioning,
i.e. the higher the voltage, the larger size ratio and costs for the high-voltage components will
be. A definition of discrete voltage levels is not in sight. Besides, existing component
specifications are not always synchronized. For instance, the standard for automotive cables (ISO
6722) above 60V specifies a voltage class of 600V. As higher voltages are so far not covered, the
ZVEI working group has meanwhile provided a proposal for voltages up to 1,000VAC/1,500VDC.
The voltage requirement for connectors is different, being specified at 750V and 850V respectively.
Therefore, a verification of existing requirements and a subsequent harmonization can provide
additional benefits for main applications below 600V.
The high-voltage system requires electromagnetic shielding to prevent
interference with other system components. In international comparison,
Germany‟s EMC requirements are the most demanding. At present the
ZVEI working group verifies and substantiates the respective test methods and
evaluates the reproducibility. Previous results showed a need for
changes in the respective IEC norms. The amendments have been
proposed to IEC TC 46 and have been accepted. Improving the
reproducibility will allow to reduce the safety factors in the
specifications further.
KOSTAL Kontakt Systeme
21
HI GH T E M P ER AT UR E A N D PO W E R EL E CTR O NI C S
Working Group High Temperature and Power Electronics
In the mark of the emerging electric traction of motor vehicles and therewith the increasing
meaning of hybrid and full electrified cars, the working group High Temperature and Power
Electronics acts in an ideal environment of impact.
After restructuring in 2008 the working group High Temperature und Power Electronics wit h its
experts from component manufacturers, tier 1 and OEM act jointly in two sub -teams „High
Temperature Electronics‟ and „Power Electronics‟ to meet these new challenges.
Objectives of their work are: components, joining & assembly, packaging and
thermal management, system integration and intelligent testing/system reliability.
The ZVEI team High Temperature Electronics addressed the problem, how to
answer the request for reliability in the complex systemically context of a high
temperature electronics control unit. Therefore several subject matter experts
were invited for contributions that showed up the knowledge in research for
selected technology topics. Basing on that, currently a library of theses for the
reliable design of highly loaded electronics is prepared.
The ZVEI-ECPE team Power Electronics continued the work to fill the
knowledge matrix on power semiconductor modules with state-ofthe-art information. The topics were: New power semiconductor
devices (GaN-transistors), new packaging technologies (silver
sintering, diffusion soldering, thick copper wire bonding),
advanced cooling (phase change technologies), modelling and
simulation of failure mechanisms (wire bond failures, solder
fatigue, and ceramic substrate cracking), and finally reliability
testing.
DENSO – IAA 2011
In focus are end-of-life tests which are required by the robustness
validation process. Testing becomes more time consuming and costly
when components and technologies are improving. E-mobility today is the
driver towards highly efficient and low cost solutions and many tests are required
because of a lack of field experience. The team has worked out and discussed recommendations
which were given to the OEM working group AK4.9 to support the new delivery specification.
For the National Platform for Electro mobility (NPE) working
in parallel in the period 2010/2011, the working group could
provide essential subjects of need in action and technology.
Backwards the working group took requests from the NPE.
In collaboration with the MunichExpo the experts of the
ZVEI-ECPE team Power Electronics successfully
organized the presentational seminar "Experten
informieren:
Leistungselektronik
bewegt
die
Elektromobilität” on the eCarTec 2011 – 3rd International
Trade Fair for Electric Mobility. More than 65 experts
discussed main topics like system integration, reliability
of power modules, innovative assembling & joining
technologies, EMC, thermal management, power and
thermal cycling tests.
22
P RO C E SS R EL IA BI LIT Y
Working Group Process Reliability
Working group “Components / Printed Circuit Boards (PCBs): Manufacturability /
Processability of Components and PCBs for increased thermal requirements in Pb-free
soldering processes”
The main focus of the working group “Process Reliability” addresses the processability of
components and PCBs in Pb-free manufacturing processes with special focus to automotive
requirements to guarantee thermal, metallurgical and dimensional process compatibility. The
regarding need for action has been stated by the manufacturers of electronic assemblies induced
by the transition phase to Pb-free soldering in the electronics industry. This working group was
founded in January 2009 and consists of members from the complete value chain of electronic
production (component and PCB manufacturer, plating chemistry and PCB base material
manufacturer, OEM and EMS, soldering material manufacturer).
The activities focused on the description of ensured and defined processes leading to the intended
product reliability. This includes a compilation of production and product related requirements for
components and PCBs and a detailed prescription of the process methods and parameters
involving e.g. thermal regimes of the soldering steps. These data are registered in a processability
/ manufacturability checklist that will significantly support the work of all rela ted parties in the value
chain.
The results of this working group are summarized in a technical guideline that was published in
October 2010. In an unprecedented manner, this guideline illustrates the interactions between the
individual elements (component, PCB, interconnect materials, process), focusing on the higher
temperature stress connected with Pb-free assembly
with the objective of manufacturing RoHS-compliant
products for an extended range of field application
conditions. It has been possible to provide a very detailed
picture of the material-related characteristics and hence
produce a good working document for their use in
technical processes. From this perspective and with the
knowledge of the effects of thermal stress on individual
components via different production processes,
compressed overviews for a relative parent population of
components are provided, including a kind of traffic light
system regarding processability and reliability.
The detailed technical interrelations shown in the
guideline are intended to provide a better
understanding with respect to the qualification and
correlations/dependencies between components and
the production process with the objective of facilitating
the decision-making process.
23
AUT OM OT I V E EL E CT RO N I C S MA RK ET
Automotive Electronics Market
An in-depth study of the automotive electronics market from the perspective of semiconductors can
be found in the ZVEI "Mikroelektronik – Trendanalyse“. Published since 2001, this report enjoys an
excellent reputation in the professional world and contemplates the automotive electronics industry
in detail due to the special significance of this market segment in Germany. The following is an
excerpt of the "Mikroelektronik – Trendanalyse bis 2015”.
ZVEI trend analysis provides a positive outlook
There is a tendency that the use of electronic systems will change in the future. Above all, strong
growth will be expected always there where, either the use of electronic systems is enforced by
legal regulations, such as environmental protection, the safety of road users could be improved, or
purely mechanical or hydraulic systems are replaced by electro-hydraulic solutions, as they always
require an relatively expensive electronic control system.
Above-average growing applications
Engine Control Electric Car
Head-Up Display
Start-Stop
LED Head Lamp
Driver Assistance Systems
Brake-by-Wire
Direct Shift Gearbox
Fuel Stratified Injection
Drowsy Driver Warning System
Electric Parking Brake
20%
40%
60%
80%
The reason for the displacement of the purely hydraulic or mechanical systems - in addition to a
performance improvement – is given by the optimisation of the energy input. But also control
systems that reduce fuel consumption directly or reduce the pollutant content of exhaust gas are
on the "hit list". However, systems which no longer meet these requirements are in a strong
decrease.
Through this change, there are some systems that show a very high growth rate, while others will
decline. On average, sales to the top ten increases by 31 percent per year from 5.0 billion in 2010
to 20 billion U.S. dollars in 2015 (compared to the overall system microelectronics aggregates
approximately one half).
For the premium segment there is still a trend towards highly integrated functions in less control
units and an increased use of sensors and actuators.
Furthermore new developments in automotive engineering emerge, such as hyb rid vehicles or the
fuel cell or battery equipped pure electric cars. Here are great development potential intensified by
the governmental support programs in Germany. However, they will not substantially influence th e
market in the next few years.
24
AUT OM OT I V E EL E CT RO N IC S MA RK ET
While in hybrid vehicles, at least in the drive train, the value of the electronics triples, for the pure
electric vehicles the required electronics indeed changes, however not in value (equivalent units
assumed). This will therefore not affect the total value of the vehicle, if the pure electric vehicles
should replace the existing combustion engines.
Ratio of the growth rates:
vehicles to modules to semconductors
220%
Vehicles
Modules
Semiconductors
216%
Growth rates in percentage (2005 = 100%)
Semiconductors
180%
Vehicles : Modules : Semiconductors = 1 : 2 : 3
Modules
187%
140%
Vehicles
145%
100%
60%
2005
2007
2009
2011
2013
2015
In summary, we find that automotive electronics - and especially the microelectronics - are still
growing much faster than the number of vehicles produced. Without that ever -increasing use of
semiconductor devices modern vehicle manufacturing would be unimaginable.
25
P UBL IC R EL ATI O NS
Public Relations of the ZVEI Application Group Automotive
The APG has found a broader recognition and acceptance within the automotive community by
intensifying its public relations activities in recent years. Thus final results of the APG and its
working group activities are published in form of brochures, recommendations or guidelines to
allow for a discussion within the automotive community.
Further activities include presentations at conferences and trade forums, and the (co)organization
of symposia. APG comments on current events and trends in the form of technical articles in
scientific journals. Since 2008 the APG informs regularly about its current activities on the website
of the ZVEI Division Electronic Components and Systems.
In the following more examples of APG public relation activities are presented in detail:
Electronica Automotive Conference 2010 / Electronica Automotive Forum with APG-session
In 2010 automotive electronics and electric mobility were the most innovative topics of the
electronica and the electronica automotive conference. Senior executives of international
automotive manufacturers and suppliers were discussing electronics technologies as well as
solutions and strategies that will meet the challenges of the coming years.
For years a close cooperation between the ZVEI Division Electronic Components
and Systems and the Munich International Trade Fair exists with a strong
commitment to the electronica trade fair. The APG was involved in the program committee and took
an active part in the automotive conference with presentation and the moderation of sessions.
For four days the APG organized the Electronica Automotive Forum with lectures and discussions.
Beside the classical mobility issues, the focus was also on electric mobility. Topics were "key
components for electric vehicles" and the question "How does the electricity come into the
vehicle?”
APG “Industry Dinner - Automotive Electronics” at the Electronica in 2008 and 2010
At the electronica 2008 and 2010, the APG successfully hosted the ZVEI "Industry Dinner Automotive Electronics". Managers and decision makers from supplier companies of the
automotive sector were invited to inform themselves about the APG and its activities. In 2010 more
than 60 participants were debating lively about current market developments and the benefits of a
successful association work by the ZVEI for their companies.
7th Conference Competence in Automotive Electronics 2011
A significant increase in the external awareness of Conference "Competence in Automotive
Electronics was accomplished with the relocation of the conference to Munich, and the cooperation
with the Munich International Trade Fair beginning with the
“electronic 2006”. Thus ZVEI conference observed a very
promising response in 2007 and 2009.
This ZVEI Conference “Competence in Automotive
Electronics” illustrates the particular importance of this event
for the promotion of the Automotive Application Group and
its activities.
This year‟s “7th Conference Competence in Automotive
Electronics 2011" focuses on key challenges of the future:
electric mobility / alternative powertrain, driver assistance
and safety, multi-platform connectivity and the integration of
consumer electronics.
26
P UBL IC R EL ATI O NS
The importance of this event is underlined through the strategic partnership with the Munich
International Trade Fair, represented by the leading trade fair “electronica 2012”, and through the
support by multiple sponsors. Media partners are three of the most important German journals in
the automotive industry, "Automotive Electronics", "Automotive electronics" and "Hanser
Automotive”.
Articles and conference papers
Since the year 2004 the “ZVEI-Standpunkt” in the "Automotive Electronics" journal has become
firmly established and reports six times a year on current topics of the Application Group
Automotive and their various working groups.
In addition, reports on quality issues and current activities of our working groups were published in
various journals like the “QZ Magazin”, the "Electronics Automotive" and special issues of the
"Automotive Electronics" and "Hanser automotive”.
Many significant contributions to national and international conferences such as Munich, Dresden,
Wiesbaden, Ludwigsburg and Baden-Baden as well as the SAE World Congress in Detroit, are a
key element of the Application Group Automotive and the ZVEI division “Electronic Components
and Systems” in the marketing of their activities and working group results.
Further Activities – International Collaborations
Furthermore, the APG successfully promoted its results on an international scope, by increasing
the dialogue with and through the European suppliers association CLEPA and by the
strengthening of the existing contacts with the French Association FIEV. In addition,
the successful partnership with the SAE (Society of Automotive
Engineers) and the close collaboration with the European
Centre of Power Electronics (ECPE) established
in 2008 were continued.
27
C ENT R E OF E X C ELL EN C E IN E LE CT RI C M O BILIT Y
Activities of the ZVEI Centre of Excellence in Electric Mobility
Environmentally friendly mobility is one of the most challenging tasks for the future of mankind.
The ZVEI Centre of Excellence (CoE) in electric mobility was founded at the end of 2008 and
has started ever since a lot of activities with different partners. Most of the work is
spreading knowledge, understanding policy, spotting opportunities and
bringing people together to solve problems or to make new advances.
The aim is to bundle and to coordinate all activities of the ZVEI
members in the field of components, systems and infrastructure
regarding electric mobility. A few technical working groups (TWG)
have been established: TWG on Storage Technology, TWG on
Infrastructure/Smart Grids, TWG on Standardization. The ZVEI
hereby makes an active contribution to establish a lead market in
electric mobility where we promote the cooperation with the involved
companies.
BMW – IAA 2011
A further aim of the CoE is to identify the market opportunities for the member
companies of the ZVEI and to provide them with the information about it. The CoE
cooperates with other associations like BDEW and VDA. In close collaboration with the four
German Ministries dealing with electric mobility, the CoE tries to readapt and to implement several
parts of the "National Development Plan in Electric Mobility".
In spring 2011 the third symposium at the CoE took place at Cologne in collaboration
with Koelnmesse. It was accompanied by the exhibiton elektro:mobilia with 35
exhibition boots and by a driving parcour where more than 850 rides were made
by different CO2-free vehicles.
28
P ART IC I PAT IN G CO MP A N IE S - AP PL IC AT IO N GR O U P AU T OM OTI V E
Active Members of the ZVEI Application Group Automotive
A
AB Mikroelektronik GmbH, Salzburg, Austria
Agilent Technologies Deutschland GmbH, Böblingen
Analog Devices GmbH, München
Atmel Automotive GmbH, Heilbronn
Audi AG, Ingolstadt
Automotive Lighting GmbH, Reutlingen
B
Baker Hughes INTEQ GmbH, Celle
Behr GmbH & Co. KG, Stuttgart
BMW Group, München
Brose Fahrzeugteile GmbH & Co. KG, Hallstadt
C
cms electronics gmbh, Klagenfurt, Austria
Coroplast Fritz Müller GmbH & Co. KG, Wuppertal
D
Daimler AG, Sindelfingen
Danfoss Silicon Power GmbH, Schleswig
Delphi Delco Electronics Europe GmbH, Wuppertal
Delphi Deutschland GmbH, Wuppertal
Delphi Deutschland GmbH, Wiehl
Diodes Zetex Neuhaus GmbH, Neuhaus am Rennweg
DST Dräxelmaier Systemtechnik GmbH, Vilsbiburg
E
EADS Deutschland GmbH, Ulm
ECPE - European Center for Power Electronics e.V., Nürnberg
Electrovac curamik GmbH, Regensburg
ELMOS Semiconductor AG, Dortmund
EM Test AG Switzerland, Reinach, Switzerland
EPCOS AG, München
EPCOS OHG, Deutschlandsberg, Austria
29
P ART IC I PAT IN G CO MP A N IE S - AP PL IC AT IO N GR O U P AU T OM OTI V E
F
Fairchild Semiconductor GmbH, Fürstenfeldbruck
FCI Connectors Deutschland GmbH, Nürnberg
Forschungszentrum Karlsruhe GmbH, Karlsruhe
Fraunhofer Institut Mikroelektronische Schaltungen & Systeme, Duisburg
Fraunhofer-IISB, Nürnberg
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration, Berlin
Freescale Semiconductor Deutschland GmbH, München
Freudenberg & Co. KG, Weinheim
Freudenberg NOK Mechatronics GmbH & Co.KG, Weinheim
Fujitsu Microelectronics Europe GmbH, Dreieich-Buchschlag
G
GLOBALFOUNDRIES Dresden Module Two GmbH & Co. KG, Dresden
Günther Spelsberg GmbH & Co. KG Elektro-Installationssysteme, Schalksmühle
H
Harman/Becker Automotive Systems GmbH, Karlsbad
HARTING Automotive GmbH & Co.KG, Espelkamp
HARTING Deutschland GmbH & Co. KG, Minden
HARTING Electronics GmbH Co. KG, Espelkamp
HARTING KGaA, Espelkamp
Hella KGaA Hueck & Co., Lippstadt
Heraeus Materials Technology GmbH & Co. KG, Hanau
HKR Seuffer Automotive GmbH & Co. KG, Künzelsau / Gaisbach
Huntsman Advanced Materials GmbH, Basel, Switzerland
I
Infineon Technologies AG, München, Neubiberg, Regensburg
Infineon Technologies Dresden GmbH & Co. OHG, Dresden
J
Johnson Controls GmbH, Burscheid
K
Keller Consulting Engineering Services, Reutlingen
Kostal Ireland GmbH, Co. Limerick, Ireland
KOSTAL Kontakt Systeme GmbH, Hagen
KOSTAL Kontakt Systeme GmbH, Lüdenscheid
KRISTRONICS GmbH, Harrislee-Flensburg
30
P ART IC I PAT IN G CO MP A N IE S - AP PL IC AT IO N GR O U P AU T OM OTI V E
L
Lackwerke Peters GmbH + Co.KG, Kempen
Lear Corporation GmbH, Remscheid
Lear Corporation GmbH, Kronach
LEONI Kabel GmbH, Roth
Leopold Kostal GmbH & Co. KG, Lüdenscheid
Liebherr-Elektronik GmbH, Lindau
Lenze Automation GmbH, Aerzen
M
Marquardt GmbH, Rietheim-Weilheim
Mektec Europe GmbH, Weinheim
Melexis GmbH, Erfurt
MENTOR GmbH & Co. Präzisions-Bauteile KG, Erkrath
MICRONAS GmbH, Freiburg
Microsystems Engineering GmbH & Co., Berg
MURATA ELEKTRONIK GMBH, Nürnberg
N
National Semiconductor GmbH, Fürstenfeldbruck
NXP Semiconductors Germany GmbH, Hamburg
NXP Semiconductors Niederlande, AB Nijmengen, Netherlands
O
ODU Automotive GmbH, Mühldorf
OSRAM AG, München
OSRAM Opto Semiconductors GmbH, Regensburg
P
Panasonic Industrial Europe GmbH, Haar
PANCON GmbH, Neu-Anspach
Porsche AG, Stuttgart
Preh GmbH, Bad Neustadt a. d. Saale
PRETTL Electronics AG, Radeberg
Q
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P ART IC I PAT IN G CO MP A N IE S - AP PL IC AT IO N GR O U P AU T OM OTI V E
R
REFU Elektronik GmbH, Metzingen
Renesas Electronics Europe GmbH, Ratingen
Robert Bosch GmbH, Stuttgart, Reutlingen
Robert Seuffer GmbH & Co. KG, Calw
ROHM Semiconductor GmbH, Willich
RUWEL International GmbH, Wetter, Geldern
S
SAE International, SAE Automotive Headquarters, Troy, USA
SANMINA-SCI Germany GmbH, Gunzenhausen
Schoeller-Electronics GmbH, Wetter/Hessen
SEHO Systems GmbH, Kreuzwertheim
Semikron Elektronik GmbH & Co. KG, Nürnberg
Siegert electronic GmbH, Cadolzburg
SIEMENS AG, München
Siemens AG - Corporate Technology, München
SMA Solar Technology AG, Niestetal
STMicroelectronics Application, Aschheim-Dornach
T
TE Connectivity (Tyco Electronics AMP GmbH), Bensheim
Texas Instruments Deutschland GmbH, Freising
TRW Automotive Electronics, Koblenz
TU Dresden, Dresden
U
Universität Rostock, Rostock
V
VACUUMSCHMELZE GmbH & Co.KG, Hanau
Valeo CEE Electronic Sourcing, Créteil, France
vancom GmbH & Co. KG, Landau
Vishay Electronic GmbH, Heide
Vishay Semiconductor GmbH, Heilbronn, Itzehoe
Visteon Belgien, Genk, Belgium
Visteon Deutschland, Kerpen
Volkswagen AG, Wolfsburg
VTI Technologies Oy Niederlassung Frankfurt, Frankfurt am Main
32
P ART IC I PAT IN G CO MP A N IE S - AP PL IC AT IO N GR O U P AU T OM OTI V E
W
Wieland-Werke AG, Ulm
Würth Elektronik GmbH & Co. KG, Rot am See
X
X-FAB Semiconductor Foundries AG, Erfurt
Y
Z
ZF Friedrichshafen AG Electronic Systems, Auerbach
ZF Friedrichshafen AG, Friedrichshafen
Zollner Elektronik AG, Zandt
33
P UBL IC AT I O NS OF TH E Z V EI / A P PLI CAT IO N GR O U P AUT OM OTI V E
Publications of the ZVEI and of the Application Group (APG) Automotive
Medium
Price + VAT,
postage & packing
Members Non-Members
34
White Paper: First-Mate-Last-Break grounding
contacts in the automotive industry
- available in German, English and Chinese (p. 28, July 2011)
Download
Free of
charge
Free of
charge
Influencing factors on components and printed
circuit boards resulting from the increased thermal
requirements of Pb-free packaging and assembly
processes - in English - (p. 194, June 2011)
Handbook
200 €
320 €
Vorträge 3. Kompetenztreffen Elektromobilität
- only available in German - (March 2011)
CD-ROM
60 €
60 €
Praxisleitfaden Gemeinsame Lieferantenaudits
- only available in German - (p. 16, July 2010)
CD-ROM
20 €
40 €
Vorträge 2. Kompetenztreffen Elektromobilität
- only available in German - (March 2010)
CD-ROM
60 €
60 €
Implementation Guide Robustness Validation
Manual - only available in English (p. 30, January 2010)
Download
Free of
charge
Free of
charge
Robustness Validation - System Level
- only available in English - (p. 24, January 2010)
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charge
Free of
charge
6th Conference „Competence in Automotive
Electronics 2009“
- only available in English - (December 2009)
CD-ROM
40 €
60 €
Progress Report 2009/10 of the ZVEI Application
Group Automotive - only available in English (p. 32, December 2009)
Download
Free of
charge
Free of
charge
Guideline for an Application of PPAP Procedure for
Automotive Electronic Components
- only available in English - (p. 30, December 2009)
CD-ROM
20 €
40 €
Identifikation und Traceability in der Elektro- und
Elektronikindustrie – available in English and
German - (p. 91, November 2009)
Handbook with
CD-ROM
180 €
280 €
Fertigung von Hochtemperatur-Baugruppen –
Wechselwirkungen und Einflussfaktoren
- only available in German (p. 28, November 2009)
CD-ROM
30 €
50 €
P UBL IC AT I O NS OF TH E Z V EI / A P PLI CAT IO N GR O U P AUT OM OTI V E
Medium
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postage & packing
Members Non-Members
Handbook for Robustness Validation for MEMS
- available in English only - (p. 38, October 2009)
CD-ROM
20 €
40 €
Technologieroadmap 2020 - Elektronische
Komponenten und Systeme – only available in
German - (p.187, September 2009)
CD-ROM
180 €
280 €
1. ZVEI Kompetenztreffen Elektromobilität 2009
- only available in German - (May 2009)
CD-ROM
40 €
40 €
Leitfaden Archivierung von Dokumenten
- only available in German - (p. 17, May 2009)
Download
Free of
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Free of
charge
Pressure Sensor Qualification beyond AEC Q100 –
a Best Practice Guideline
- only available in English - (p. 15, November 2008)
Handbook
30 €
50€
Handbook for Robustness Validation of Automotive
Electrical/Electronic Modules
- only available in English - (p. 148, June 2008)
Handbook with
CD-ROM
90 €
150 €
5th Conference „Competence in Automotive
Electronics 2007"
- only available in English - (p.174, February 2008)
CD-ROM
40 €
60 €
Progress Report of the ZVEI Application Group
Automotive - (p. 38, December 2007)
Download
Free of
charge
Free of
charge
Handbook for Robustness Validation
- only available in English - (p. 60, April 2007)
CD-ROM
60 €
90 €
Mikroelektronik Trendanalyse bis 2015
- only available in German - (p. 60, April 2011)
(Previous versions are available on request)
CD-ROM
400 €
400 €
For further information or ordering please contact:
Frau Patricia Lutz, ZVEI, Lyoner Straße 9, 60528 Frankfurt am Main
Tel. +49 (0) 69 / 6302 - 396
Fax. +49 (0) 69 / 6302 - 407
Mail: Bestellung_FV-ECS@zvei.org
Internet: http://www.zvei.org/index.php?id=347
35
P UBL IC AT I O NS OF TH E Z V EI / A P PLI CAT IO N GR O U P AUT OM OTI V E
36
P UBL IC AT I O NS OF TH E Z V EI / A P PLI CAT IO N GR O U P AUT OM OTI V E
37
NOT E S
38
NOT E S
39
ZVEI - Zentralverband Elektrotechnikund Elektronikindustrie e.V.
Fachverband Electronic Components and Systems
Fachverband PCB and Electronic Systems
Lyoner Straße 9
60528 Frankfurt am Main
Fon: +49 69 6302-276
Fax: +49 69 6302-407
Mail: zvei-be@zvei.org
www.zvei.org