I/O Standard Specifications

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ZyGPC01-169I
ZyFLEX General Purpose Controller
Short Form Datasheet
Revision 0.1
Date July, 2014
ZyFLEX
4Fl. No.5-2, Industrial East RD 9,
S.B.I.P., Hsinchu 30077,
Taiwan, R.O.C.
Phone 886-3-5679168
Fax
886-3-5679188
DISCLAIMER
ZyV02-100I Datasheet
Change History
Date
06/12/2014
07/05/2014
Description
First draft for internal review
Version 0.1 for General availability for customer
In this document, the functional specification of ZyGPC01-169I will be described.
Revision History
Date
07/05/2014
Description
Version 0.1 for General availability for customer
DISCLAIMER
ZyFLEX Technologies, Inc. reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or performance and to
supply the best possible product. ZyFLEX does not assume any responsibility for use of any circuitry described other than the circuitry embodied in an ZyFLEX product. The
Company makes no representations that circuitry described herein is free from patent infringement or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent, patent rights or other rights, of ZyFLEX Technologies, Inc.
LIFE SUPPORT POLICY
ZyFLEX Technologies' products are not authorized for use as critical components in life support devices or systems unless a specific written agreement pertaining to such
intended use is executed between the manufacturer and an officer of ZyFLEX.
1. Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform, when
properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2. A critical component is any components of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device
or system, or to affect its safety or effectiveness.
ZyGPC01-169I Datasheet
FEATURES
APPLICATIONS
Highlights
– SPI bus extension and bridge
– Provides two SPI bus slave interfaces and four SPI bus
– RF up-converter circuit control
Master interfaces
– Serial to Parallel conversion
– Provide general purpose input/output GPIO interface that
– Programmable logic card
can access at most 40 I/O signals
– Built-in the SPI device to SPI host interface bridging
function.
– Provide external reset for longer period of reset.
DESCRIPTION
The ZyGPC01-169I is a serial bus controller designed for micro-controller(MCU) to access at most four SPI bus
and 40 independent I/O signals. It functions as a signal aggregator for MCU. This make a hardware designer
easier to plan the PCB layout, greatly reduces signal numbers to/from the MCU and a single board. For most of
application SPI and GPIO oriented are both applied to end component for MCU to access. With the serial bus
controller engineer can dedicate on the application circuit design without considering the complexity of control
signal type. The application of ZyGPC01-169I can meet most of RF transmitter circuit control.
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ZyGPC01-169I Datasheet
FUNCTIONAL BLOCK DIAGRAM
Connected to MCU
nCS_A
SCLK_A
MOSI_A
MISO_A
SPI slave
SPI master
nCS
SCLK
MOSI
MISO
nCS
SCLK
MOSI
MISO
SPI slave
nCS_B
SCLK_B
MOSI_B
MISO_B
nCS0
SCLK0
MOSI0
MISO0
SPI master
nCS
SCLK
MOSI
MISO
nCS
SCLK
MOSI
MISO
nCS1
SCLK1
MOSI1
MISO1
SPI master
GPIO_A[7:0]
GPIO_B[7:0]
GPIO_C[7:0]
GPIO_D[7:0]
GPIO_E[7:0]
nCS
SCLK
MOSI
MISO
GPIO
nCS2
SCLK2
MOSI2
MISO2
SPI master
nCS
SCLK
MOSI
MISO
2
nCS3
SCLK3
MOSI3
MISO3
ZyGPC01-169I Datasheet
PIN ASSIGNMENT
3
ZyGPC01-169I Datasheet
Package Outline
4
ZyGPC01-169I Datasheet
Dimension is in millimeters.
Package Outline Dimension Table
Inches
Symbol
Min.
Nom.
Max.
A
–
–
1.20
A1
0.05
–
0.15
A2
0.95
1.00
1.05
D
16.00 BSC
D1
14.00 BSC
E
16.00 BSC
E1
14.00 BSC
L
0.45
L1
S
0.60
0.75
1.00 REF
–
0.20
5
–
ZyGPC01-169I Datasheet
b
0.17
0.22
0.27
c
0.09
–
0.20
e
q
0.50 BSC
0°
3.5°
7°
Package Information
Description
Specification
Package Acronym
TQFP
Leadframe Material
Copper
Lead Finish (Plating)
Regular: 85Sn:15Pb (Typ.)
JEDEC Outline Reference
MS-026 Variation: AED
Lead Coplanarity
0.003 inches (0.08mm)
Weight
0.6 g (Typ.)
Note :
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional ;size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed 0.25mm per side.
4. Dimensioning and tolerance per ASME Y14.5M
BSC: Basic Dimension. Tolerances is +/- 5%.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Order Information: ZyGPC01-169I
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ZyGPC01-169I Datasheet
 IC Marking Rule
Coding style:
ZyGPC01-169I : Model Number
1442: Date code
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