8. Package Information for
Stratix Devices
S5V3008-2.0
Introduction
This data sheet provides package information for Altera® devices. It
includes these sections:
In this data sheet, packages are listed in order of ascending pin count.
Section
Page
Device & Package Cross Reference . . . . . . . . . . . . . . . . . . . . . . 8–1
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3
In this data sheet, packages are listed in order of ascending pin count.
Device &
Package Cross
Reference
Table 8–1 shows which Altera Stratix devices are available in BGA,
FineLine BGA and Ultra FineLine BGA packages.
Table 8–1. Stratix Devices in BGA, FineLine BGA & Ultra FineLine BGA
Packages (Part 1 of 2)
Device
EP1S10
EP1S20
EP1S25
EP1S30
Package
Thermally Enhanced flip-chip FBGA
484
Wire-bond BGA
672
Wire-bond FBGA
672
Thermally Enhanced flip-chip FBGA
780
Thermally Enhanced flip-chip FBGA
484
Wire-bond BGA
672
Wire-bond FBGA
672
Thermally Enhanced flip-chip FBGA
780
Wire-bond BGA
672
Wire-bond FBGA
672
Thermally Enhanced flip-chip FBGA
780
Thermally Enhanced flip-chip FBGA
1,020
Thermally Enhanced flip-chip FBGA
780
Thermally Enhanced flip-chip BGA
956
Thermally Enhanced flip-chip FBGA
Altera Corporation
July 2003
Pins
1,020
8–1
Thermal Resistance
Stratix Device Handbook, Volume 1
Table 8–1. Stratix Devices in BGA, FineLine BGA & Ultra FineLine BGA
Packages (Part 2 of 2)
Device
Package
EP1S40
Thermally Enhanced flip-chip BGA
EP1S60
956
Thermally Enhanced flip-chip FBGA
1,020
Thermally Enhanced flip-chip FBGA
1,508
Thermally Enhanced flip-chip BGA
EP1S80
Thermal
Resistance
Pins
956
Thermally Enhanced flip-chip FBGA
1,020
Thermally Enhanced flip-chip FBGA
1,508
Thermally Enhanced flip-chip BGA
956
Thermally Enhanced flip-chip FBGA
1,020
Thermally Enhanced flip-chip FBGA
1,508
Table 8–2 provides θ JA (junction-to-ambient thermal resistance) and θJC
(junction-to-case thermal resistance) values for Altera Stratix devices.
Table 8–2. Thermal Resistance of Stratix Devices (Part 1 of 2)
θJA (° C/W)
100 ft./min.
θJA (° C/W)
200 ft./min.
θJA (° C/W)
400
ft./min.
θJC (° C/W)
θ JA (° C/W)
Still Air
FBGA
0.38
11.9
9.8
8.4
7.2
BGA
3.2
16.8
13.7
11.9
10.5
17.2
14
12.2
10.8
10.9
8.8
7.4
6.3
9.7
8.3
7.1
12.4
10.7
9.3
Device
Pin Count
Package
EP1S10
484
672
672
FBGA
3.4
780
FBGA
0.43
484
FBGA
0.30
11.8
672
BGA
2.5
15.5
672
FBGA
2.7
16
12.8
11
9.6
780
FBGA
0.31
10.7
8.6
7.2
6.1
672
BGA
2.2
14.8
11.7
10.0
8.7
672
FBGA
2.3
15.3
12
10.4
9
780
FBGA
0.25
10.5
8.5
7.1
6.0
1020
FBGA
0.25
10.0
8.0
6.6
5.5
EP1S20
EP1S25
8–2
Altera Corporation
July 2003
Package Information for Stratix Devices
Package Outlines
Table 8–2. Thermal Resistance of Stratix Devices (Part 2 of 2)
Device
Pin Count
Package
EP1S30
780
FBGA
EP1S40
EP1S60
EP1S80
θJC (° C/W)
θ JA (° C/W)
Still Air
θJA (° C/W)
100 ft./min.
θJA (° C/W)
200 ft./min.
θJA (° C/W)
400
ft./min.
0.2
10.4
8.4
7.0
5.9
956
BGA
0.2
9.1
7.1
5.8
4.8
1020
FBGA
0.2
9.9
7.9
6.5
5.4
780
FBGA
0.17
10.4
8.3
6.9
5.8
956
BGA
0.18
9.0
7.0
5.7
4.7
1020
FBGA
0.17
9.8
7.8
6.4
5.3
1508
FBGA
0.18
9.1
7.1
5.8
4.7
956
BGA
0.13
8.9
6.9
5.6
4.6
1020
FBGA
0.13
9.7
7.7
6.3
5.2
1508
FBGA
0.13
8.9
7.0
5.6
4.6
956
BGA
0.1
8.8
6.8
5.5
4.5
1020
FBGA
0.1
9.6
7.6
6.2
5.1
1508
FBGA
0.1
8.8
6.9
5.5
4.5
Package
Outlines
Altera Corporation
July 2003
The package outlines on the folowing pages are listed in order of
ascending pin count. Altera package outlines meet the requirements of
JEDEC Publication No. 95.
8–3
Package Outlines
8–4
Stratix Device Handbook, Volume 1
Altera Corporation
July 2003
Package Information
484-Pin Thermally Enhanced FineLine Ball-Grid Array (FBGA)
484-Pin Thermally Enhanced FineLine Ball-Grid Array (FBGA)
■
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
Some devices have a chamfered corner at the A-1 ball location.
M is the maximum solder ball matrix size.
Package Information
Package Outline Figure Reference
Description
Specification
Ordering Code Reference
F
Package Acronym
FBGA
Millimeters
Symbol
A
Min.
Nom.
Max.
–
–
3.50
Lead Material
Tin-lead alloy (63/37)
A1
0.30
–
–
Lead Finish
N/A
A2
0.25
–
3.00
JEDEC Outline
MS-034
A3
–
–
2.50
JEDEC Option
AAJ-1
D/E
Maximum Lead
Coplanarity
0.008 inches (0.20 mm)
b
23.00 BSC
0.50
0.60
Weight
3.6 g
e
1.00 BSC
Moisture Sensitivity Level
Printed on moisture barrier bag
M
22
Altera Corporation
0.70
8–5
484-Pin Thermally Enhanced FineLine Ball-Grid Array (FBGA)
Stratix Device Handbook, Volume 1
Package Outline
D
A
B
Pin A1
22 21 20 19 18 17 16 15 14 13 12 11 10 9
Indicates
location of
Pin A1
8
7
6
5
4
3
2
1
A
C (2.00)
B
C
D
E
F
G
H
J
K
E
L
M
N
P
R
T
U
V
W
Y
AA
AB
b
A A2
e
A3
Heat Sink
A1
Seating Plane
8–6
Altera Corporation
Package Information
672-Pin Non-Thermally Enhanced FineLine Ball-Grid Array (FBGA)
672-Pin Non-Thermally Enhanced FineLine Ball-Grid Array (FBGA)
■
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
Some devices have a chamfered corner at the A-1 ball location.
M is the maximum solder ball matrix size.
Package Information
Package Outline Figure Reference
Description
Specification
Ordering Code Reference
F
Package Acronym
FBGA
Millimeters
Symbol
Min.
Nom.
Max.
A (1)
–
–
3.50
Lead Material
Tin-lead alloy (63/37)
A1
0.30
–
–
Lead Finish
N/A
A2
0.25
–
3.00
JEDEC Outline
MS-034
D/E
JEDEC Option
AAL-1
b
27.00 BSC
0.50
0.60
Maximum Lead Coplanarity
0.008 inches (0.20 mm)
e
1.00 BSC
Weight
3.0 g
M
26
Moisture Sensitivity Level
Printed on moisture barrier bag
Altera Corporation
0.70
(1) Altera's thickness specification for A is
2.6 mm maximum. The Max item for A in
the table reflects the JEDEC specification.
8–7
672-Pin Non-Thermally Enhanced FineLine Ball-Grid Array (FBGA)
Stratix Device Handbook, Volume 1
Package Outline
Represents
A1 Ball Pad
Corner
D
25
26
Indicates
location of
Ball A1
E
23
24
21
22
19
20
17
18
16
15 13 11
9
7
5
3
1
14 12 10
8
6
4
2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
e
b
A2
A
A1
C
Seating Plane
8–8
Altera Corporation
Package Information
672-Pin Thermally Enhanced FineLine Ball-Grid Array (FBGA)
672-Pin Thermally Enhanced FineLine Ball-Grid Array (FBGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
Orientation of the package is shown by a chamfer and/or a pin 1 mark.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
F
Min.
Nom.
Max.
Package Acronym
FBGA
A
–
–
3.50
Lead Material
Tin-lead alloy (63/37)
A1
0.30
–
–
Lead Finish
N/A
A2
0.25
–
3.00
JEDEC Outline
MS-034
A3
–
–
2.50
JEDEC Option
AAL-1
b
0.50
0.60
0.70
Maximum Lead Coplanarity
0.008 inches (0.20 mm)
Weight
4.9 g
7.66 g (2)
Moisture Sensitivity Level
Printed on moisture barrier bag
e
1.00 BSC
D/E
27.00 BSC
M
26
(2) Heavier weight refers to new packages mentioned in PCN 0214.
Altera Corporation
8–9
672-Pin Thermally Enhanced FineLine Ball-Grid Array (FBGA)
Stratix Device Handbook, Volume 1
Package Outline
Represents
A1 Ball Pad
Corner
D
7
5
3
1
25 23 21 19 17 15 13 11 9
26 24 22 20 18 16 14 12 10
8
6
4
2
C (2.00)
C (1.00)
E
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
e
b
A A2 A1
A3
Heat Sink
// 0.35 Z
C
Seating Plane
8–10
Altera Corporation
Package Information
672-Pin Non-Thermally Enhanced Ball-Grid Array (BGA) Cavity Up
672-Pin Non-Thermally Enhanced Ball-Grid Array (BGA) Cavity Up
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
M is the maximum solder ball matrix size.
Package Information
Figure Reference
Description
Specification
Ordering Code Reference
B
Package Acronym
BGA
Millimeters
Symbol
Min.
Nom.
Max.
A (3)
–
–
3.50
Lead Material
Tin-lead alloy (63/37)
A1
0.35
–
–
Lead Finish
N/A
A2
0.25
–
3.00
JEDEC Outline
MS-034
b
0.60
0.75
0.90
JEDEC Option
BAR-2, depopulated
Maximum Lead Coplanarity
Weight
Moisture Sensitivity Level
Printed on moisture barrier bag
Altera Corporation
D/E
35.00 BSC
0.008 inches (0.20 mm)
e
1.27 BSC
5.2 g
M
26
(3) Altera’s thickness specification for A is
2.6 mm maximum. The Max item for A in
the table reflects the JEDEC specification.
8–11
672-Pin Non-Thermally Enhanced Ball-Grid Array (BGA) Cavity Up
Stratix Device Handbook, Volume 1
Package Outline
Represents
A1 Ball Pad
Corner
25
D
26
Indicates
location of
Ball A1
E
45˚ Chamfer
(all 4 corners)
23
24
21
22
19
20
17
18
15
16
13
14
11
12
9
10
7
8
5
6
3
4
1
2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
b
e
o
30 Typical
A
A2
A1
Seating Plane
8–12
Altera Corporation
Package Information
780-Pin Thermally Enhanced FineLine Ball-Grid Array (FBGA)
780-Pin Thermally Enhanced FineLine Ball-Grid Array (FBGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
Orientation of the package is shown by a chamfer and/or a pin 1 mark.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
F
Min.
Nom.
Max.
Package Acronym
FBGA
A
–
–
3.50
Lead Material
Tin-lead alloy (63/37)
A1
0.35
–
–
Lead Finish
N/A
A2
0.25
–
3.00
JEDEC Outline
MS-034
A3
–
–
2.50
JEDEC Option
AAM-1
b
0.50
0.60
0.70
Maximum Lead Coplanarity
0.008 inches (0.20 mm)
Weight
5.8 g
8.9 g (4)
Moisture Sensitivity Level
Printed on moisture barrier bag
e
1.00 BSC
D/E
29.00 BSC
M
28
(4) Note: Heavier weight refers to new packages mentioned in
PCN 0214.
Altera Corporation
8–13
780-Pin Thermally Enhanced FineLine Ball-Grid Array (FBGA)
Stratix Device Handbook, Volume 1
Package Outline
Represents
A1 Ball Pad
Corner
D
27
28
C (2.00)
C (1.00)
25 23 21 19 17 15 13 11 9
7
5
3
1
26 24 22 20 18 16 14 12 10
8
6
4
2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
Indicates
location of
Ball A1
E
e
b
A A2 A1
A3
Heat Sink
// 0.35 Z
C
Seating Plane
8–14
Altera Corporation
Package Information
956-Pin Thermally Enhanced Ball Grid Array (BGA) Cavity Up
956-Pin Thermally Enhanced Ball Grid Array (BGA) Cavity Up
■
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
Orientation of the package is shown by a chamfer and/or a pin 1 mark.
M is the maximum solder ball matrix size.
Package Information
Table 8–3. Figure Reference
Description
Specification
Ordering Code Reference
B
Package Acronym
BGA
Millimeters
Symbol
A
Min.
Nom.
Max.
–
–
3.5
Lead Material
Tin-lead alloy (63/37)
A1
0.35
–
–
Lead Finish
N/A
A2
0.25
–
3.00
JEDEC Outline
MS-034
A3
–
–
2.5
JEDEC Option
BAU-1
b
0.60
0.75
0.90
Maximum Lead Co-planarity 0.008 inches (0.20 mm)
Weight
8.7 g
15.30 g (5)
Moisture Sensitivity Level
Printed on moisture barrier bag
D/E
40.00 BSC
e
1.27 BSC
M
31
(5) Note: Heavier weight refers to new packages mentioned in
PCN 0214.
Altera Corporation
8–15
956-Pin Thermally Enhanced Ball Grid Array (BGA) Cavity Up
Stratix Device Handbook, Volume 1
Package Outline
D
Indicates Location
of Ball A1
Y
E
X
31
30
29
28 27 26 25 24 23 22
21
20
16
19 18 17
15
14
13
12 11 10 9
8
7
6
5 4 3 2 1
Representing A1 Ball
Pad Corner
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
e
b
A
A3 A2
e
Heat Sink
A1
Seating Plane
8–16
Altera Corporation
Package Information
1020-Pin Thermally Enhanced FineLine Ball-Grid Array (FBGA)
1020-Pin Thermally Enhanced FineLine Ball-Grid Array (FBGA)
■
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
Orientation of the package is shown by a chamfer and/or a pin 1 mark.
M is the maximum solder ball matrix size.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
F
Package Acronym
FBGA
Lead Material
Lead Finish
JEDEC Outline
MS-034
A3
JEDEC Option
AAP-1, depopulated
b
Min.
Nom.
Max.
A
–
–
3.50
Tin-lead alloy (63/37)
A1
0.35
–
–
N/A
A2
0.25
–
3.00
–
–
2.50
0.50
0.60
0.70
Maximum Lead Coplanarity
0.008 inches (0.20 mm)
Weight
7.7 g
11.54 g (6)
Moisture Sensitivity Level
Printed on moisture barrier bag
e
1.00 BSC
D/E
33.00 BSC
M
32
(6) Note: Heavier weight refers to new packages mentioned in
PCN 0214.
Altera Corporation
8–17
1020-Pin Thermally Enhanced FineLine Ball-Grid Array (FBGA)
Stratix Device Handbook, Volume 1
Package Outline
D
32 313029 28 27 26 2524 23 22 21 20 19 18 17 16 1514 13 1211 10 9 8 7 6 5 4 3 2 1
C (2.00)
C (1.00)
E
A1 Ball
Pad Corner
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
e
b
A
A3 A2
Heat Sink
A1
8–18
Altera Corporation
Package Information
1508-Pin Thermally Enhanced FineLine Ball-Grid Array (FBGA)
1508-Pin Thermally Enhanced FineLine Ball-Grid Array (FBGA)
■
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
Orientation of the package is shown by a chamfer and/or a pin 1 mark.
M is the maximum solder ball matrix size.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
F
Package Acronym
FBGA
Lead Material
Lead Finish
JEDEC Outline
MS-034
A3
–
–
2.50
JEDEC Option
AAU-1
b
0.50
0.60
0.70
Maximum Lead Coplanarity
0.008 inches (0.20 mm)
Weight
9.3 g
15.30 g (7)
Moisture Sensitivity Level
Printed on moisture barrier bag
Min.
Nom.
Max.
A
–
–
3.50
Tin-lead alloy (63/37)
A1
0.35
–
–
N/A
A2
0.25
–
3.00
e
1.00 BSC
D/E
40.00 BSC
M
39
(7) Heavier weight refers to new packages mentioned in PCN 0214.
Altera Corporation
8–19
1508-Pin Thermally Enhanced FineLine Ball-Grid Array (FBGA)
Stratix Device Handbook, Volume 1
Package Outline
D
C (2.00)
C (1.00)
E
A1 Ball
Pad Corner
39 383736 35 34 33 32 3130 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 1110 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AT
AU
AV
AW
e
b
A
A3 A2
Heat Sink
A1
8–20
Altera Corporation