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:K\GRHVWKH6L&%-7EHKDYHOLNHD026)(7" +LJKHUGRSLQJ FDXVHVWKH 6L&%-7WREHKDYHOLNHD PDMRULW\FDUULHU GHYLFH UHVXOWLQJLQIDVWHU VZLWFKLQJVSHHGV FRPSDUHGWRVLOLFRQ%-7V 6L&%-7VIHDWXUHORZ RQVWDWHORVVHV GXHWR FDQFHOODWLRQRIWKH MXQFWLRQYROWDJHV $$JDUZDOHWDO³3URVSHFWVRIELSRODUSRZHUGHYLFHVLQVLOLFRQFDUELGH´,(((,(&21SS 1RYHPEHU 7XWRULDO,V6L&D*DPH&KDQJHU" GE 6-75HSHWLWLYH6KRUW&LUFXLWDW9 9P 6-7 VXEMHFWHGWRV VKRUWFLUFXLWSXOVHVZLWK ORZ+]UHSHWLWLRQ IUHTXHQF\ 6-7VZLWFKHGRQXQGHU W\SLFDOEDVHGULYHFRQGLWLRQV DW9 7HVWLVSHULRGLFDOO\ LQWHUUXSWHGDQGWKHGHYLFH SDUDPHWHUVDUHPRQLWRUHG Information courtesy of GeneSiCTM 1RYHPEHU 7XWRULDO,V6L&D*DPH&KDQJHU" GE %LSRODU 8QLSRODU 6L&'HYLFHV 'HYLFH $GYDQWDJHV 'LVDGYDQWDJHV 9ROWDJH5DWLQJ '026)(7 6FDODEOH 026 ,QWHUIDFH N9± N9 7UHQFK026)(7 +LJK97+ /RZ521 +LJK (OHFWULF )LHOG N9± N9 1RUPDOO\2Q -)(7 +LJK7HPS 1RUPDOO\2Q N9± N9 1RUPDOO\2II -)(7 1RUPDOO\2II +LJK 521 N9± N9 %-7 1R*DWH2[LGH &XUUHQW'ULYHQ N9± N9 ,*%7 +LJK9ROWDJH 5HOLDELOLW\ N9± N9 *72 /RZ&RQGXFWLRQ /RVV 'LIILFXOW&RQWURO !N9 6FKRWWN\ 'LRGH 1R5HYHUVH 5HFRYHU\ +LJK/HDNDJH N9 ± N9 -%6'LRGH /RZ/HDNDJH +LJK)RUZDUG 9ROWDJH N9± N9 3L1 'LRGH )RUZDUG9ROWDJH 'HJUDGDWLRQ N9 1RYHPEHU 7XWRULDO,V6L&D*DPH&KDQJHU" GE $GYDQWDJHVRI6L&7UHQFK026)(7V 6L&'026)(73ODQDU 6L&7UHQFK026)(7 /DUJH521 /RZFKDQQHOPRELOLW\ /RZHU521 E\KLJKFHOOGHQVLW\ +LJKFKDQQHOPRELOLW\ 7KH-)(7UHVLVWDQFHFDQQRWEH HOLPLQDWHGIURPWKHSODQDUVWUXFWXUH 7KHUHLVQR-)(7UHJLRQLQWKH WUHQFKJDWHVWUXFWXUH It is expected that the on-resistance can be drastically reduced with the trench gate structure. ³6L&3URGXFWV´52+0&R/WGKWWSZZZWHFQRLPSUHVHLWXVHUB'RF52+06L&3RZHU6HSSGI &52+0&R/WG$OOULJKWVUHVHUYHG 1RYHPEHU 7XWRULDO,V6L&D*DPH&KDQJHU" GE 7KHN9GRXEOHWUHQFK6L&026)(7VKRZVSURPLVLQJ DGYDQWDJHVRYHUSODQDU6L&026)(7V ³5RKPVWDUWVPDVVSURGXFWLRQRIILUVWWUHQFKW\SH6L&026)(7´6HPLFRQGXFWRU7RGD\-XQHKWWSZZZVHPLFRQGXFWRU WRGD\FRPQHZVBLWHPVMXQURKPBVKWPO 1RYHPEHU 7XWRULDO,V6L&D*DPH&KDQJHU" GE 7KHGRXEOHWUHQFKVWUXFWXUHUHGXFHVWKHHOHFWULFILHOGDW WKHJDWH &RQYHQWLRQDO 6LQJOH 7UHQFK6WUXFWXUH 52+0¶V 'RXEOH7UHQFK6WUXFWXUH *DWHWUHQFK EDVH HOHFWULFILHOG FRQFHQWUDWLRQ *DWHWUHQFK EDVH HOHFWULFILHOG FRQFHQWUDWLRQ PLWLJDWHG ³5RKPVWDUWVPDVVSURGXFWLRQRIILUVWWUHQFKW\SH6L&026)(7´6HPLFRQGXFWRU7RGD\-XQHKWWSZZZVHPLFRQGXFWRU WRGD\FRPQHZVBLWHPVMXQURKPBVKWPO 1RYHPEHU 7XWRULDO,V6L&D*DPH&KDQJHU" GE 9³9JURRYH´+6L&026)(7 Unique high-mobility channel Lower RDS(on) with high blocking voltage DMOSFET on (0001) Device structure Source p n Gate oxide Gate Channel layer Drift layer Ŷ{03-38-} faces High quality MOS interface ࣭ High channel mobility ࣭ High threshold voltage electron flow 4H-SiC (0001) substrate ŶBuried p+ region Bottom oxide protection from hard breakdown Drain DMOSFET on (0001) .8FKLGDHODO Proc. of the 27th ISPSDSS SEI Proprietary ©2015 Sumitomo Electric Industries, Ltd. All Rights Reserved 1RYHPEHU 7XWRULDO,V6L&D*DPH&KDQJHU" GE ,9&KDUDFWHULVWLFVRI[PP 9026)(7 ,' !$ZLWK9'6 9 [PP 9026)(7V ID (A) VGS=18 V ,' $ 15 V V'' 9 I' $ R/= : V*6 9 R* : tr = 71 ns tf = 26 ns VDS (V) .8FKLGDHWDO3URFQG$GYDQFHGSRZHUGHYLFHVSS± SEI Proprietary ©2015 Sumitomo Electric Industries, Ltd. All Rights Reserved 1RYHPEHU 7XWRULDO,V6L&D*DPH&KDQJHU" GE /RZ,QGXFWDQFHLQ0RGXOHIRU99026)(7 Items SiC MOSFET New ID 100 A RDS(on) 12 m Eon + Eoff 1.1 mJ Si IGBT IGBT compatible ,*%7 FRPSDWLEOH 1HZ &XVWRPL]HG 100 A 100 A 18 m (21 m) 4.8 mJ 14.5 mJ 9ROXPH 6L& 026)(7 6(, $ % 5* WI QV QV QV WGRII QV QV QV '9 9*6 9 9 9 9'6 9,' $5* ȍ 997M &5HVLVWLYHPRGH 67R\RVKLPDHWDO6(,7HFKQLFDO5HYLHZ1RSS SEI Proprietary ©2015 Sumitomo Electric Industries, Ltd. 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