A3213 and A3214 Micropower Ultra-Sensitive Hall-Effect Switches Features and Benefits Description ▪ ▪ ▪ ▪ The A3213 and A3214 integrated circuits are ultra-sensitive, pole independent Hall-effect switches with a latched digital output. They are especially suited for operation in batteryoperated, hand-held equipment such as cellular and cordless telephones, pagers, and palmtop computers. A 2.4 to 5.5 V operation and a unique clocking scheme reduce the average operating power requirements – the A3213 to 825 μW, the A3214 to 14 μW (typical, at 2.75 V)! Except for operating duty cycle and average operating current, the A3213 and A3214 are identical. ▪ ▪ ▪ ▪ Micropower operation Operatewith north or south pole 2.4 to 5.5 V battery operation Chopper stabilized ▫ Superior temperature stability ▫ Extremely low switchpoint drift ▫ Insensitive to physical stress High ESD protection Solid state reliability Small size Easily assembly into applications due to magnetic pole independence Packages 3 lead ultramini SIP (suffix UA) 3 contact MLP/DFN (suffix EL) Unlike other Hall-effect switches, either a north or south pole of sufficient strength will turn the output on; in the absence of a magnetic field, the output is off. The polarity independence and minimal power requirement allows these devices to easily replace reed switches for superior reliability and ease of manufacturing, while eliminating the requirement for signal conditioning. Improved stability is made possible through chopper stabilization (dynamic offset cancellation), which reduces the residual offset voltage normally caused by device overmolding, temperature dependencies, and thermal stress. Continued on the next page… 3 pin surface mount SOT23-W (suffix LH) Not to scale Functional Block Diagram SUPPLY SWITCH LATCH OUTPUT SAMPLE & HOLD X DYNAMIC OFFSET CANCELLATION TIMING LOGIC GROUND Dwg. FH-020-5 27622.62-DS Rev. P A3213 and A3214 Micropower Ultra-Sensitive Hall-Effect Switches Description (continued) These devices include, on a single silicon chip, a Hall-voltage generator, small-signal amplifier, chopper stabilization, a latch, and a MOSFET output. Advanced BiCMOS processing is used to take advantage of low-voltage and low-power requirements, component matching, very low input-offset errors, and small component geometries. Range 'E' devices are rated for operation over a temperature range of -40°C to 85°C; range 'L' devices are rated for operation over a temperature range of -40°C to 150°C. Two package styles provide a magnetically optimized package for most applications. ‘LH’ is a miniature low-profile surface-mount package, ‘UA’ is a three-lead SIP for through-hole mounting. For the A3213, a microleadless DFN/MLP package 'EL' also is available. Each package is available in a lead (Pb) free version (suffix, –T) , with a 100% matte tin plated leadframe. Product Selection Guide Part Number Mounting A3213EELLT-T EL package Surface mount A3213ELHLT-T LH package Surface Mount Packing* 7-in. reel 3000 pieces/reel UA package SIP through hole Bulk 500 pieces/bag LH package Surface Mount 7-in. reel 3000 pieces/reel UA package SIP through hole Bulk 500 pieces/bag A3214ELHLT-T LH package Surface Mount 7-in. reel 3000 pieces/reel A3214LLHLT-T LH package Surface Mount 7-in. reel 3000 pieces/reel UA package SIP through hole Bulk 500 pieces/bag A3213EUA-T A3213LLHLT-T A3213LUA-T A3214LUA-T Ambient, TA (ºC) DC (%) IDDAVG(TYP) (μA) 25 460 0.10 11 –40 to 85 –40 to 150 –40 to 85 –40 to 150 *Contact Allegro for additional packing options. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 2 A3213 and A3214 Micropower Ultra-Sensitive Hall-Effect Switches Absolute Maximum Ratings Characteristic Symbol Supply Voltage Magnetic Flux Density Rating Units VDD Notes 6 V B Unlimited G Output Off Voltage VOUT 6 V Output Current IOUT 1 mA Range E –40 to 85 ºC Range L –40 to 150 ºC Operating Ambient Temperature TA Maximum Junction Temperature TJ(max) 165 ºC Tstg –65 to 170 ºC Storage Temperature Pin-out Diagrams Number 1 3 2 Description VDD Input power supply; tie to GND with bypass capacitor 2 GND Ground 3 VOUT Output signal LH Package UA Package GND GND EL Package 3 X 3 1 2 VDD VOUT 2 VOUT VDD 1 1 2 3 VOUT 1 Name GND UA VDD EL, LH Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 3 A3213 and A3214 Micropower Ultra-Sensitive Hall-Effect Switches ELECTRICAL CHARACTERISTICS valid over operating voltage and temperature range, unless otherwise noted Characteristic Symbol Test Conditions Supply Voltage Range VDD Operating1) Output Leakage Current IOFF VOUT = 5.5 V, BRPN < B < BRPS IOUT = 1 mA, VDD = 3.0 V Output On Voltage VOUT Awake Time tawake Period tperiod Duty Cycle Chopping Frequency Supply Current Max. Units 2.4 3.0 5.5 V – <1.0 1.0 μA – 100 300 mV – 60 90 μs – 240 360 μs A3214, TA = 25°C, VDD = 3 V – 60 90 ms A3213 – 25 – % A3214 – 0.10 – % – 340 – kHz IDD(EN) Chip awake (enabled) – – 2.0 mA IDD(DIS) Chip asleep (disabled) – – 8.0 μA A3213 – 460 850 μA A3214 – 11 22 μA DC fC IDD(AVG) 1Typical A3213 Typ.1 Min. Data is at TA = 25°C and VDD = 3.0 V and is for design information only. and release points will vary with supply voltage. BOPx = operate point (output turns ON); BRPx = release point (output turns OFF). 2Operate MAGNETIC CHARACTERISTICS valid over operating voltage and temperature range, unless otherwise noted1 Characteristic Operate Points Release Points Hysteresis Symbol2 Test Conditions Min. Typ.3 Max. Units4 BOPS South pole to branded side – 42 70 G BOPN North pole to branded side –70 –48 – G BRPS South pole to branded side 10 32 – G BRPN North pole to branded side – –38 –10 G Bhys |BOPx - BRPx| – 10 – G 1As used here, negative flux densities are defined as less than zero (algebraic convention) and -50 G is less than +10 G. 2B OPx = operate point (output turns ON); BRPx = release point (output turns OFF). 3Typical Data is at T = 25°C and V A DD = 3.0 V and is for design information only. 41 gauss (G) is exactly equal to 0.1 millitesla (mT). Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 4 A3213 and A3214 Micropower Ultra-Sensitive Hall-Effect Switches THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information Characteristic Symbol Test Conditions* Value Units Package LH, 1-layer PCB with copper limited to solder pads RθJA Package Thermal Resistance Package LH, 2-layer PCB with 0.463 connected by thermal vias in.2 of copper area each side Package UA, 1-layer PCB with copper limited to solder pads 228 ºC/W 110 ºC/W 165 ºC/W *Additional thermal information available on Allegro website. Power Derating Curve 6 Maximum Allowable VCC (V) VDD(max) 5 1-layer PCB, Package LH (RQJA = 228 ºC/W) 1-layer PCB, Package UA (RQJA = 165 ºC/W) 4 2-layer PCB, Package LH (RQJA = 110 ºC/W) 3 VDD(min) 2 1 0 20 40 60 80 100 120 140 160 180 Temperature (ºC) Power Dissipation, PD (mW) Power Dissipation versus Ambient Temperature 1900 1800 1700 1600 1500 1400 1300 1200 1100 1000 900 800 700 600 500 400 300 200 100 0 2l (R aye rP QJ C A = 11 B, P 0 º ac 1-la C/ ka W (R yer PC ) ge L QJA = B H 165 , Pac k ºC/ a W) ge U A 1-lay er P (R CB, QJA = 228 Packag ºC/W e LH ) 20 40 60 80 100 120 Temperature (°C) 140 160 180 Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 5 A3213 and A3214 Micropower Ultra-Sensitive Hall-Effect Switches SWITCH POINTS, B (G) TYPICAL OPERATING CHARACTERISTICS as a function of temperature (VDD = 3 V) TEMPERATURE, TA (oC) A3214 AVG, SUPPLY CURRENT, IDD (MA) AVG, SUPPLY CURRENT, IDD (MA) A3213 TEMPERATURE, TA (oC) OUTPUT ON VOLTAGE, V OUT ( m V ) TEMPERATURE, TA (oC) TEMPERATURE, TA (oC) Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 6 A3213 and A3214 Micropower Ultra-Sensitive Hall-Effect Switches SWITCH POINTS, B (G) TYPICAL OPERATING CHARACTERISTICS as a function of supply voltage (TA = 25oC) SUPPLY VOLTAGE, VDD (V) A3214 AVG, SUPPLY CURRENT, IDD (MA) AVG, SUPPLY CURRENT, IDD (MA) A3213 SUPPLY VOLTAGE, VDD (V) SUPPLY VOLTAGE, VDD (V) Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 7 A3213 and A3214 Micropower Ultra-Sensitive Hall-Effect Switches FUNCTIONAL DESCRIPTION PERIOD IDD(EN) +V SAMPLE & HOLD Low Average Power. Internal timing circuitry activates the IC for 60 μs and deactivates it for the remainder of the period (240 μs for the A3213 and 60 ms for the A3214). A short "awake" time allows for stabilization prior to the sampling and data latching on the falling edge of the timing pulse. The output during the "sleep" time is latched in the last sampled state. The supply current is not affected by the output state. X 60 μs "AWAKE" "SLEEP" SAMPLE & OUTPUT LATCHED IDD(DIS) Dwg. EH-012-1 0 B Chopper-Stabilized Technique. The Hall element can be considered as a resistor array similar to a Wheatstone bridge. A large portion of the offset is a result of the mismatching of these resistors. These devices use a proprietary dynamic offset cancellation technique, with an internal high-frequency clock to reduce the residual offset voltage of the Hall element that is normally caused by device overmolding, temperature dependencies, and thermal stress. The chopper-stabilizing technique cancels the mismatching of the resistor circuit by changing the direction of the current flowing through the Hall plate using CMOS switches and Hall voltage measurement taps, while maintaing the Hallvoltage signal that is induced by the external magnetic flux. The signal is then captured by a sample-and-hold circuit and further processed using low-offset bipolar circuitry. This technique produces devices that have an extremely stable quiescent Hall output voltage, are immune to thermal stress, and have precise recoverability after temperature cycling. This technique will also slightly degrade the device output repeatability. A relatively high sampling frequency is used in order that faster signals can be processed. +V — HALL VOLTAGE + Dwg. AH-011-2 Operation. The output of this device switches low (turns on) when a magnetic field perpendicular to the Hall element exceeds the operate point BOPS (or is less than BOPN). After turn-on, the output is capable of sinking up to 1 mA and the output voltage is VOUT(ON). When the magnetic field is reduced below the release point BRPS (or increased above BRPN), the device output switches high (turns off). The difference in the magnetic operate and release points is the hysteresis (Bhys) of the device. This built-in hysteresis allows clean switching of the output even in the presence of external mechanical vibration and electrical noise. More detailed descriptions of the circuit operation can be found in Technical Paper STP 97-10, Monolithic Magnetic Hall Sensing Using Dynamic Quadrature Offset Cancellation and As used here, negative flux densities are defined as less than Technical Paper STP 99-1, Chopper-Stabilized Amplifiers With A zero (algebraic convention) and -50 G is less than +10 G. Track-and-Hold Signal Demodulator. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 8 A3213 and A3214 Micropower Ultra-Sensitive Hall-Effect Switches Applications. Allegro's pole-independent sensing technique allows for operation with either a north pole or south pole magnet orientation, enhancing the flexibility of the device in application assembling. The state-of-the-art technology provides the same output polarity for either pole face. It is strongly recommended that an external bypass capacitor be connected (in close proximity to the Hall element) between the supply and ground of the device to reduce both external noise and noise generated by the chopper-stabilization technique. This is especially true due to the relatively high impedance of battery supplies. The simplest form of magnet that will operate these devices is a bar magnet with either pole near the branded surface of the device. Many other methods of operation are possible. Extensive applications information on magnets and Hall-effect devices is also available in the Allegro Electronic Data Book AMS-702 or Application Note 27701, or at www.allegromicro.com OUTPUT OFF 5V MAX VOUT B OPS OUTPUT OUTPUT VOLTAGE B OPN 10 pF GND 50 k Ω VDD X SUPPLY (3 V BATTERY) 0.1 μF OUTPUT ON BRPS BRPN OUTPUT ON 0 -B 0 +B MAGNETIC FLUX Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 9 A3213 and A3214 Micropower Ultra-Sensitive Hall-Effect Switches Package EL, 3-Contact MLP/DFN 2.00 ±0.15 1.250 0.325 E 1.12 0.30 F 3 E 3 E 0.138 0.78 2.40 2.00 ±0.15 0.925 A 0.65 2 1 1 0.30 3X D 0.50 ±0.05 0.08 C 0.25 C SEATING PLANE 0.50 C +0.07 –0.05 PCB Layout Reference View 1.00 BSC 0.40 ±0.05 1 2 0.138 YWW NN +0.050 0.925 –0.150 B 1 G 3 1.25 +0.10 –0.15 Standard Branding Reference View Y = Last two digits of year of manufacture W = Week of manufacture N = Last two digits of device part number 0.325 For Reference Only, not for tooling use (reference DWG-2865; reference JEDEC MO-229UCCD) Dimensions in millimeters Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Exposed thermal pad (reference only, terminal #1 identifier appearance at supplier discretion) C Reference land pattern layout (reference IPC7351); All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances; when mounting on a multilayer PCB, thermal vias at the exposed thermal pad land can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5) D Coplanarity includes exposed thermal pad and terminals E Hall Element (not to scale) F Active Area Depth, 0.18 mm NOM G Branding scale and appearance at supplier discretion Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 10 A3213 and A3214 Micropower Ultra-Sensitive Hall-Effect Switches Package LH, 3-Pin (SOT-23W) +0.12 2.98 –0.08 1.49 D 4°±4° 3 A +0.020 0.180–0.053 0.96 D +0.10 2.90 –0.20 +0.19 1.91 –0.06 2.40 0.70 D 0.25 MIN 1.00 2 1 0.55 REF 0.25 BSC 0.95 Seating Plane Gauge Plane 8X 10° REF B PCB Layout Reference View Branded Face 1.00 ±0.13 +0.10 0.05 –0.05 0.95 BSC 0.40 ±0.10 For Reference Only; not for tooling use (reference dwg. 802840) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Active Area Depth, 0.28 mm REF B Reference land pattern layout All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances C Branding scale and appearance at supplier discretion D Hall element, not to scale NNT 1 C Standard Branding Reference View N = Last two digits of device part number T = Temperature code Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 11 A3213 and A3214 Micropower Ultra-Sensitive Hall-Effect Switches Package UA, 3-Pin SIP +0.08 4.09 –0.05 45° B C E 2.07 1.52 ±0.05 1.33 E Mold Ejector Pin Indent +0.08 3.02 –0.05 E Branded Face 45° 1 2.16 MAX D Standard Branding Reference View = Supplier emblem N = Last two digits of device part number T = Temperature code 0.79 REF A 0.51 REF NNT 1 2 3 +0.03 0.41 –0.06 15.75 ±0.51 For Reference Only; not for tooling use (reference DWG-9049) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Dambar removal protrusion (6X) B Gate burr area C Active Area Depth, 0.50 mm REF +0.05 0.43 –0.07 D Branding scale and appearance at supplier discretion E Hall element, not to scale 1.27 NOM Copyright ©2003-2010, Allegro MicroSystems, Inc. Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the failure of that life support device or system, or to affect the safety or effectiveness of that device or system. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 12