HITFET BTS 117 Smart Lowside Power Switch Features Product Summary • Logic Level Input Drain source voltage VDS 60 • Input Protection (ESD) On-state resistance RDS(on) 100 mΩ • Thermal Shutdown Current limit ID(lim) 7 A • Overload protection Nominal load current ID(ISO) 3.5 A • Short circuit protection Clamping energy EAS V 1000 mJ • Overvoltage protection • Current limitation • Status feedback with external input resistor • Analog driving possible Application • All kinds of resistive, inductive and capacitive loads in switching or linear applications • µC compatible power switch for 12 V and 24 V DC applications • Replaces electromechanical relays and discrete circuits General Description N channel vertical power FET in Smart SIPMOS chip on chip technology. Fully protected by embedded protected functions. V bb + LOAD M Drain 2 dv/dt limitation 1 IN ESD Overload protection Current Overvoltage protection lim itation Overtemperature protection Short circuit circuit Short protection protection Source HIT F ET Semiconductor Group Page 1 3 13.07.1998 BTS 117 Maximum Ratings at Tj = 25 °C unless otherwise specified Parameter Symbol Value Drain source voltage VDS 60 Drain source voltage for short circuit protection Continuous input current 1) VDS(SC) 32 Unit V mA IIN -0.2V ≤ VIN ≤ 10V no limit | IIN | ≤ 2 VIN < -0.2V or VIN > 10V Operating temperature Tj - 40 ... +150 Storage temperature Tstg - 55 ... +150 Power dissipation Ptot 50 W EAS 1000 mJ 3000 V °C TC = 25 °C Unclamped single pulse inductive energy ID(ISO) = 3.5 A Electrostatic discharge voltage (Human Body Model) VESD according to MIL STD 883D, method 3015.7 and EOS/ESD assn. standard S5.1 - 1993 Load dump protection VLoadDump2) = VA + VS V VLD VIN=low or high; VA=13.5 V td = 400 ms, RI = 2 Ω, ID=0,5*3.5A 75 td = 400 ms, RI = 2 Ω, ID= 3.5A 70 DIN humidity category, DIN 40 040 E IEC climatic category; DIN IEC 68-1 40/150/56 Thermal resistance junction - case: R thJC 2.5 junction - ambient: R thJA 75 R thJA 45 SMD version, device on PCB: 3) K/W 1A sensor holding current of 500 µA has to be guaranted in the case of thermal shutdown (see also page 3) 2V Loaddump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 3Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 µm thick) copper area for Drain connection. PCB is vertical without blown air. Semiconductor Group Page 2 13.07.1998 BTS 117 Electrical Characteristics Symbol Parameter at Tj=25°C, unless otherwise specified Values Unit min. typ. max. 60 - 73 V - - 5 µA 1.3 1.7 2.2 V IIN(1) - 30 60 µA Input current - current limitation mode, ID=ID(lim) : IIN(2) - 120 300 800 2200 4000 Tj = 25 °C 500 - - Tj = 150 °C 300 - - Characteristics Drain source clamp voltage VDS(AZ) Tj = - 40 ...+ 150°C, ID = 10 mA Off state drain current IDSS VDS = 32 V, Tj = -40...+150 °C, VIN = 0 V Input threshold voltage VIN(th) ID = 0.7 mA Input current - normal operation, ID <ID(lim) : VIN = 10 V VIN = 10 V Input current - after thermal shutdown, ID =0 A: IIN(3) VIN = 10 V Input holding current after thermal shutdown On-state resistance IIN(H) RDS(on) mΩ ID = 3.5 A, VIN = 5 V, Tj = 25 °C - 90 120 ID = 3.5 A, VIN = 5 V, Tj = 150 °C - 180 240 On-state resistance RDS(on) mΩ ID = 3.5 A, VIN = 10 V, Tj = 25 °C - 80 100 ID = 3.5 A, VIN = 10 V, Tj = 150 °C - 160 200 3.5 - - Nominal load current (ISO 10483) ID(ISO) A VIN = 10 V, VDS = 0.5 V, TC = 85 °C Semiconductor Group Page 3 13.07.1998 BTS 117 Electrical Characteristics Parameter Symbol at Tj=25°C, unless otherwise specified Values Unit min. typ. max. ID(SCp) - 25 - ID(lim) 7 10 15 ton - 40 70 toff - 70 150 -dVDS /dton - 1 3 dVDS/dtoff - 1 3 150 165 - Characteristics Initial peak short circuit current limit A VIN = 10 V, VDS = 12 V Current limit 1) VIN = 10 V, VDS = 12 V, tm = 350 µs, Tj = -40...+150 °C Dynamic Characteristics Turn-on time VIN to 90% ID : µs RL = 4.7 Ω, VIN = 0 to 10 V, Vbb = 12 V Turn-off time VIN to 10% ID : RL = 4.7 Ω, VIN = 10 to 0 V, Vbb = 12 V Slew rate on 70 to 50% Vbb: V/µs RL = 4.7 Ω, VIN = 0 to 10 V, Vbb = 12 V Slew rate off 50 to 70% Vbb: RL = 4.7 Ω, VIN = 10 to 0 V, Vbb = 12 V Protection Functions Thermal overload trip temperature Tjt Unclamped single pulse inductive energy EAS °C mJ ID = 3.5 A, Tj = 25 °C, Vbb = 32 V 1000 -- -- ID = 3.5 A, Tj = 150 °C, Vbb = 32 V 225 -- -- - 1 - Inverse Diode Inverse diode forward voltage VSD V IF = 5*3.5A, tm = 300 µs, VIN = 0 V 1Device switched on into existing short circuit (see diagram Determination of I D(lim) . Dependant on the application, these values might be exceeded for max. 50 µs in case of short circuit occurs while the device is on condition Semiconductor Group Page 4 13.07.1998 BTS 117 Package and ordering code all dimensions in mm Ordering Code: Q67060-S6500-A2 Ordering code: Q67060-S6500-A3 Semiconductor Group Page 9 13.07.1998