High Frequency Electronics — November 2008 Online Edition

NOVEMBER2008
ALSO PUBLISHED ONLINE:
www.highfrequencyelectronics.com
TEST & MEASUREMENT TRENDS:
NEW TEST REQUIREMENTS,
NEW TECHNOLOGIES
INSIDE THIS ISSUE:
A Wide Dynamic Range Signal Playback System
Evolution of Broadband Signal Measurement and Analysis
A Satellite Telemetry Transmitter with Pre-Modulation Filtering
Tutorial—An Introduction to Defected Ground Structures
Featured Products—SoCs & Modules, Waveguide, Power Products
Online Edition
JUMP DIRECTLY TO THE
TABLE OF CONTENTS
JUMP DIRECTLY TO THE
ADVERTISER INDEX
Copyright © 2008 Summit Technical Media, LLC
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NOVEMBER2008
ALSO PUBLISHED ONLINE AT:
www.highfrequencyelectronics.com
Vol. 7 No. 11
You can view this issue page-by-page, or click on any of
the articles or columns in the Table of Contents below
16
28
42
signal playback system
technology report
space communications
A Wide Dynamic Range
Playback System for
Radar Signals
Trends in Test & Measurement: New Test
Requirements, New
Technologies
A Satellite Telemetry
Transmitting System
with Pre-Modulation
Filtering
David Friedman &
Paul Hiller
D.V. Ramana, R. Jolie, V.S.
Rao & S. Pal
30
measurements
Evolution of Broadband
Signal Measurement
and Analysis
Dennis Handlon
38
product coverage
Featured Products
46
56
tutorial
product coverage
An Introduction to
Defected Ground
Structures in Microstrip
Circuits
New Products
64
design notes
Jitter & Phase Noise
Relationships
Regular Columns
6 Editorial
12 In the News
63 Advertiser Index
8 Meetings & Events
56 New Products
64 Design Notes
November 2008
5
EDITORIAL
Editorial Director
Gary Breed
gary@highfrequencyelectronics.com
Tel: 608-437-9800
Fax: 608-437-9801
Publisher
Scott Spencer
scott@highfrequencyelectronics.com
Tel: 603-472-8261
Fax: 603-471-0716
Working from the
Ground up: A Lesson
from the Election
Associate Publisher
Tim Burkhard
tim@highfrequencyelectronics.com
Tel: 707-544-9977
Fax: 707-544-9375
Associate Editor
Katie Landmark
katie@highfrequencyelectronics.com
Tel: 608-437-9800
Fax: 608-437-9801
Business Office
High Frequency Electronics
7 Colby Court, Suite 7-436
Bedford, NH 03110
Editorial and Production Office
High Frequency Electronics
104 S. Grove Street
Mount Horeb,WI 53572
Also Published Online at
www.highfrequencyelectronics.com
Subscriptions
Sue Ackerman
Tel: 651-292-0629
Fax: 651-292-1517
circulation@highfrequencyelectronics.com
High Frequency Electronics (USPS 024-316) is
published monthly by Summit Technical Media,
LLC, 3 Hawk Dr., Bedford, NH 03110. Vol. 7 No. 11,
November 2008. Periodicals Postage Paid at
Manchester, NH and at additional mailing
offices.
POSTMASTER: Send address corrections to High
Frequency Electronics, PO Box 10621, Bedford,
NH 03110-0621.
Subscriptions are free to qualified technical and
management personnel involved in the design,
manufacture and distribution of electronic
equipment and systems at high frequencies.
Copyright © 2008, Summit Technical Media, LLC
6
High Frequency Electronics
Gary Breed
Editorial Director
R
egardless of your political preferences, the success of Barack Obama’s presidential campaign
is an excellent example of organization and execution in the grass-roots style, from the ground up. At
the beginning of the primaries he was not a major
name in his party, but by working hard at the personto-person level in the Iowa caucuses, he quickly
achieved a place as one of the leading candidates. For
the general election, his campaign had more local
offices than any presidential campaign in history. Beyond Obama’s personality and political message, the operation of his campaign provides
some good lessons.
The primary lesson is that things can work well from the ground up.
It’s not the only route to success, of course. There are many top-notch marketing departments that identify customer needs, communicate their findings to company executives, who in turn direct their product development
staffs to proceed with a particular project. The lesson of ground-up success
is most important to those companies that have not done a good enough job
listening to the ideas of their own staff.
Let’s say you are an individual engineer with an idea that you believe
would be good for your company to pursue. What can you learn from a successful political campaign?
First, you need to have a clear message—and it needs to be clear at several levels. You are probably best at the technical background, so communicating those details with your peers and supervisors is the easiest for
you. With luck, a supervisor may see the value of your idea and send it further up the chain of command. If not, you will need to take the next step,
which takes another lesson from the Obama campaign—organization.
You should back up the technical justification with market information.
There are two aspects that should be addressed together: identifying how
it meets customer needs, and how it can fit with your company’s development and manufacturing capabilities. There have been many, many clever
ideas that few people really need, and there have been many failures when
a company tried to move too far from its core competency. Make sure your
idea isn’t one of those!
Work on communicating the
idea—sell it! Selling an idea
requires full knowledge of the concept, plus an understanding of who
needs to be approached in your particular company. Most of all, be passionate about it. It will keep you
motivated, and it will show others
how strongly you are convinced of
success. As you gather supporters,
create an organized promotional
effort. The old saying about
“strength in numbers” is true.
Finally, be prepared for setbacks. There are a thousand legitimate reasons for a business to
reject an idea for a new product.
Investment cost, market conditions, available personnel and perceived competition are just a few.
Some ideas just need time for the
world to get ready for them!
pany—is exciting and rewarding.
It’s no wonder that many engineers
aspire to this level of achievement!
New Ideas are Needed
Today, there are special challenges that need creative new
ideas. Climate change, energy generation and efficient usage, global-
ization and many other issues
require technological solutions as
well as social and political ones.
It may take many small contributions to reach workable solutions. If you have an idea that may
contribute to those solutions, you
are encouraged to work on it and
promote it—from the ground up.
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Entrepreneurship is a classic
ground-up enterprise, with obvious
similarities to a political campaign.
You need to raise money, convince
people to support you, communicate your ideas to the marketplace,
and effectively sell to the customer!
We have heard many stories of
success and failure concerning new
companies based on a particular
idea. Remember, a start-up company requires more than just a great
idea, so if you take this high risk,
high reward path, make sure you
have the personality and ambition
to make it happen.
If the prospect of starting a
whole new company is daunting,
maybe all you need to do is find a
company that wants your idea.
This is a traditional method, where
the person with the idea seeks out
a company (or partners) with the
necessary resources and expertise
for its development, manufacturing
and marketing.
Like winning a political campaign, developing a new idea into a
successful product—or a new com-
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MEETINGS & EVENTS
CONFERENCES
November 17-19, 2008
MILCOM 2008—Military Communications Conference
San Diego, CA
Information: Conference Web site
http://www.milcom.org
November 24-25, 2008
ARMMS Conference
Northamptonshire, UK
Information: Conference Web site
http://www.armms.org
March 23-27, 2009
EuCAP2009—3rd European Conference on Antennas
and Propagation
Berlin, Germany
Information: Conference Web site
http://www.eucap2009.org
November 30 - December 4, 2008
GLOBECOM 2008—2008 IEEE Global
Telecommunications Conference
New Orleans, LA
Information: Conference Web site
http://www.ieee-globecom.org/2008
April 5-8, 2009
WCNC 2009—IEEE Wireless Communications and
Networking Conference
Budapest, Hungary
Information: Conference Web site
http://www.ieee-wcnc.org/2009
December 9-12, 2008
Fall 2008 ARFTG Microwave Measurement Symposium
72nd ARFTG Conference, NIST/ARFTG Short Courses,
and NVNA Users’ Forum
Portland, OR
Information: ARFTG Web site
http://www.arftg.org
April 20-21, 2009
WAMICON 2009—IEEE Wireless and Microwave
Technology Conference
Clearwater, FL
Information: Conference Web site
http://www.wamicon.org
December 15-17, 2008
2008 IEEE International Electron Devices Meeting
San Francisco, CA
Information: Conference Web site
http://www.ieee-iedm.org
December 16-18, 2008
ICICT 2008—ITI 6th International Conference on
Information & Communications Technology
Cairo, Egypt
Information: Conference Web site
http://icict.gov.eg/ICICT2008/index.html
December 16-19, 2008
Asia-Pacific Microwave Conference 2008
Hong Kong, China
Information: Conference Web site
http://www.apmc2008.org
January 5-8, 2009
National Radio Science Meeting
Boulder, CO
Information: Conference Web site
http://www.nrsmboulder.org
January 18-22, 2009
Radio Wireless Week
San Diego, CA
Information: Conference Web site
http://www.radiowirelessweek.org
8
February 8-13, 2009
4th International Waveform Diversity & Design
Conference
Orlando, FL
Information: Conference Web site
http://www.waveformdiversity.org
High Frequency Electronics
May 4-8, 2009
RadarCon09—2009 IEEE Radar Conference
Pasadena, CA
Information: Conference Web site
http://www.radarcon09.org
June 1-5, 2009
2009 International Symposium on Antennas and
Propagation and the 2009 USNC/URSI National Radio
Science Meeting
North Charleston, SC
Information: Conference Web site
http://www.apsursi2009.org
SHORT COURSES
Besser Associates
201 San Antonio Circle, Suite 115
Mountain View, CA 94040
Tel: 650-949-3300, Fax: 650-949-4400
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Applied RF Techniques II
December 8-12, 2008, San Jose, CA
Wireless System Design and Simulation
December 8-12, 2008, San Jose, CA
Market Challenges of the Cell Phone Industry
December 8-9, 2008, San Jose, CA
IEEE 802.11 Operations
December 9-11, 2008, San Jose, CA
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MEETINGS & EVENTS
Short Range Coexistence RF Transceiver Design
Techniques
December 9-12, 2008, San Jose, CA
RF and Wireless Made Simple
December 10-12, 2008, San Jose, CA
EMC Design, Bench Top Measurements and
Troubleshooting Techniques - A Practical Approach
December 10-12, 2008, San Jose, CA
Kimmel Gerke Associates, Ltd., with Tektronix
628 LeVander Way
South St. Paul, Minnesota 55075
Tel: 1-888-EMI-GURU (364-4878)
http://www.emiguru.com/seminartek.htm
EMC Design/Signal Integrity two-day seminar series
November 17-18, 2008, Phoenix, AZ
Times Microwave Systems
358 Hall Avenue
PO Box 5039
Wallingford, CT 06492-5039
Tel: 800-TMS-COAX (867-2629)
Tel: 203-949-8400
FAX: 203-949-8423
http://www.timesmicrowave.com
Times Microwave Systems now offers an LMR®
Certified Installer Training Program (part number
CITP) covering all installation aspects of LMR coaxial
transmission line cables, connectors and components
including grounding. The one-day program is available
to groups of 10 or more and can be held at a location
convenient to the group, at Times Microwave in
Wallingford, CT or at a participating Times distribution
partner location. The program is $300.00 per person
and can be arranged through any Times distributor.
R.A. Wood Associates
1001 Broad St., Suite 450
Utica, NY 13501
Tel: 315-735-4217
http://www.rawood.com
RF and Microwave Receiver Design
November 17-20, Philadelphia, PA
RF Power Amplifiers, Classes A-S: How the Circuits
Operate, How to Design Them, and When to Use Each
November 24-25, Philadelphia, PA
The Technology Academy
37-39 Southgate Street
Winchester, SO23 9EH, UK
Tel: 0044 1962 855 730; Fax: 0044 1962 854 400
E-mail: enquiries@thetechnologyacademy.com
http://www.thetechnologyacademy.com
Practical Design of Wireless Digital Communications
Systems
January 20-22, 2009, Weybridge, UK
10
High Frequency Electronics
CALLS
FOR
PAPERS
2009 International Symposium on Antennas and
Propagation, and the 2009 USNC/URSI National Radio
Science Meeting
North Charleston, SC
Conference Dates: June 1-5, 2009
Summary Submission Deadline: January 16, 2009
Topics:
This meeting is intended to provide an international
forum for the exchange of information on state-of-theart research in antennas, propagation, electromagnetic engineering, and radio science. A full list of topics is
available on the symposium Web site.
Information:
All paper and abstract submissions must be received
in PDF format via the symposium Web site by no later
than January 16, 2009. Only electronic submissions in
PDF format will be accepted. Please consult the symposium Web site at www.apsursi2009.org for the latest
instructions, templates and format examples.
International Conference on Electromagnetics in
Advanced Applications (ICEAA 09)
Torino, Italy
Conference Dates: September 14-18, 2009
Abstract Submission Deadline: February 28, 2009
Topics:
Suggested topics include, but are not limited to: active
and smart antennas, electromagnetic applications,
finite methods, intentional EMI, metamaterials,
microwave antennas, optoelectronics and photonics,
phased and adaptive arrays, printed and conformal
antennas, radar imaging, radomes, random and nonlinear electromagnetics, wireless communications, etc.
Information:
Authors of invited and contributed papers must submit a full-page abstract by February 28, 2009, containing sufficient information to allow the Scientific
Committee to evaluate their contribution. Each submitted abstract must be accompanied by mailing
address, telephone and fax numbers, and email
address of the corresponding author, as well as the
topic number(s). Authors will be notified of acceptance by April 10, 2009. Please submit abstract and
final
manuscript
electronically
to:
http://
www.iceaa.polito.it.
We are pleased to publish anouncements of
meetings and conferences, short courses and
seminars, plus conference Calls for Papers.
If you would like to see your announcements in
our Meetings & Events section, e-mail information
to: editor@highfrequencyelectronics.com
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IN THE NEWS
Technology News
FreeWave Technologies and Arcadian Networks
announced that they have delivered a new 700 MHz wireless radio to serve the energy industry. The announcement comes just six months after the two companies
announced a joint strategic partnership back in March of
this year. The delivery of the 700 MHz radio to the marketplace provides an opportunity for electric utilities and
oil and gas companies to incorporate an advanced ISM
band radio technology and wireless data solutions on a
700 MHz private, licensed and secure communication
platform as a single, seamless and integrated “Smart
Grid” or “Smart Field” solution. Arcadian Networks and
FreeWave will each market, sell and distribute
FreeWave’s 700 MHz radio, providing electric utilities
and oil and gas companies’ with equipment diversity and
flexible bandwidth and deployment options.
Following the successful launch of the Standards+ package in June 2008, the International Electrotechnical
Commission (IEC) is now proposing a new International
Standard with an annexed “Redline” version that keeps
track of all changes from the previous edition. The sixth
edition of CISPR 22, Information technology equipment—
Radio disturbance characteristics—Limits and methods
of measurement, published in September 2008, establishes uniform requirements for the radio disturbance level of
information technology equipment, to fix limits of disturbance, to describe methods of measurement and to standardize operating conditions and interpretation of
results.
Business News
Agilent Technologies Inc. announced that ST
Microelectronics has selected Agilent’s physical layer
sink test solution to test its devices according to the MIPI
D-PHY standard. This test setup provides the industry’s
first and complete automated physical layer receiver and
transmitter tests and also speeds up and simplifies test.
Agilent also announced that Toshiba Semiconductor
Co. has selected Agilent’s GoldenGate EDA software for
its RFIC design and evaluation. In addition, Agilent
announced that its wholly owned subsidiary,
NetworkFab, has been awarded a five-year, $45 million
Small Business Innovative Research (SBIR) Phase III
Contract with the U.S. Army CommunicationsElectronics Research, Development and Engineering
Center's Intelligence and Information Warfare
Directorate at Fort Monmouth, NJ. This contract is for
Wideband Sensor Systems with hyperfast Direction
Finding (DF) and integrated Signals Intelligence (SIGINT) search, identification and collection of tactical targets.
Digi-Key Corporation and RFM announced that the
companies have entered into a worldwide distribution
agreement. RFM products stocked by and available
directly from Digi-Key are featured in its online catalog
and will be featured in future print catalogs.
12
High Frequency Electronics
M/A-COM Technology Solutions, Inc. (M/A-COM
Tech) has been formed following the 26 September, 2008
purchase by Cobham Defense Electronic Systems of
M/A-COM Inc. The Company will continue to focus on
commercial, industrial and government markets, specializing in RF, microwave and millimeter wave component
and technology solutions that are utilized around the
globe in some of the most challenging applications. These
include wireless infrastructure, handsets, WLAN,
WiMAX, CATV, VSAT, automotive, test and measurement, radar and government solutions and applications.
Headquartered in Lowell, Massachusetts, M/A-COM
Tech will build on some 60 years of experience to develop
and manufacture active and passive products, including
Si and GaAs based semiconductors from facilities in
Lowell, MA and Torrance, CA. Infrastructure products
will continue to be provided by the Company’s facility in
Cork, Ireland, and Laser Diode products continue production in Edison, NJ.
RF Micro Devices, Inc. announced it has captured
design wins on more than 10 upcoming Samsung 3G
handsets, supporting Samsung’s anticipated growth in
3G handset sales. Based upon current customer forecasts,
RFMD® anticipates volume shipments to commence in
the December 2008 quarter.
Richardson Electronics, Ltd. announced that Avago
Technologies has selected Richardson to distribute its
wireless products in the European market. Effective
immediately, this is an expansion of Avago’s existing distribution agreement with Richardson, which previously
covered Southeast Asia, Japan, and the entire western
hemisphere.
Keithley Instruments, Inc. announced that ip.access,
a developer of femtocell and picocell solutions, has purchased Keithley’s award-winning Radio Frequency (RF)
test solutions. ip.access has selected Keithley’s Series
2800 RF Vector Signal Analyzers and Series 2900 RF
Vector Generators as the solution for its production testing of WCDMA femtocell base stations.
TriQuint Semiconductor announced that the Office
of Naval Research (ONR) has awarded TriQuint a 21month, $4.5 million contract to advance manufacturing
methods used to produce high-power, high-frequency gallium arsenide (GaAs) amplifiers. TriQuint was chosen
based on its experience developing high-performance,
high-reliability amplifiers for a wide range of defense and
aerospace applications.
Aeroflex announced a new TM500 TD-LTE test mobile
designed to support Time Division Duplex for 3G LTE
(TD-LTE). Complementing Aeroflex’s highly successful
TM500 LTE-FDD for 3G LTE Frequency Division Duplex,
the TM500 TD-LTE test mobile is designed to enable
infrastructure equipment vendors match the demanding
timescales for TD-LTE trials in China.
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IN THE NEWS
mary manufacturing and design efforts continue in the
company’s headquarters in Horsham, PA, the new
Toronto facility provides an additional clean and stable
environment necessary for precise laser and optical component characterization.
Rochester Electronics announced it has been selected
as an authorized distributor for Gennum Corporation.
Rochester will help Gennum’s customers continue to fill
orders when products reach end-of-life status.
Left to right: Michael J. Gault, Michael Caputo, Frank
Scalzo, Vincent Hrenak. Photo courtesy of Raytheon staff
photographer.
For the second year in a row, Microwave Components, Inc. of Stuart Florida has been selected as a
winner of Raytheon Network Centric Systems (NCS)
Supplier 3 Star Excellence Award. Microwave
Components, Inc. is one of 19 suppliers honored out
of over 4,000 suppliers to Raytheon NCS. The award
is designed to formally recognize suppliers for exemplary performance, consistent quality of service, and
on time delivery. The award was presented by
Vincent Hrenak, Vice President, Supply Chain—
Raytheon NCS and Michael J. Gault, Director,
Quality—Raytheon NCS, and accepted by Frank
Scalzo, President of Microwave Components, Inc. and
Michael Caputo, Vice President of Sales and Marketing
(photo above) at a formal ceremony held this past
September in Dallas, Texas.
Three branches of the United States Military have purchased the new TEGAM Model 1830A RF Power Meter in
the first month of its release and awarded it a national
stock number (NSN) 6625015667703. The largest contract, from the U.S. Army, is for a period of one year and
168 units, totaling more than one million dollars.
Additionally, orders have been received from the U.S.
Navy and The National Guard.
NXP Semiconductors announced it has retained
ATREG, the semiconductor sales division of Colliers
International, to sell its fully operational 200 mm semiconductor manufacturing facility in Fishkill, New York.
The experienced engineering community at the site develops and produces high performance BiCMOS RF and
High Voltage CMOS technologies leveraging stable 200
mm 0.25 µm equipment to deliver a competitive advantage in functionality and cost.
Avo Photonics announces the expansion of its services
through the relocation of its Toronto, Canada facility. The
new facility, with enhanced opto-electronic characterization and prototyping capability, is an ideal location to support ongoing efforts in the Canadian market. While pri-
14
High Frequency Electronics
NTT DOCOMO, INC., Renesas Technology Corp.,
Fujitsu Limited, and Sharp Corporation announced
that they plan to jointly develop the SH-Mobile G4 singlechip LSI device, and a platform incorporating it, to support the HSUPA1/HSDPA2/W-CDMA and GSM/GPRS/
EDGE (2G) mobile telephony standards. Development of
the platform is targeted for completion by the fourth
quarter of fiscal 2009 (January–March 2010).
People in the News
Giga-tronics announced that Malcolm Levy has joined
Giga-tronics as Vice President of Sales and Marketing
effective on September 8th, 2008. Levy has over 25 years
of Sales and Marketing experience in the Test &
Measurement industry. As part of the international
expansion effort, Rodrick Cross will become Vice
President of Japan Business Development. Cross has
spent many years in Japan and is responsible for developing a large number of key accounts there. Additionally,
Giga-tronics has added a Business Development
Manager, Simon Thomas to the Sales and Marketing
team. Thomas has excellent sales experience from companies such as Le Croy, CATC, and SyntheSys Research.
Park Electrochemical Corp. announced the appointment of Thomas A. Pursch as President of Nelco
Products, Inc., Park’s printed circuit materials business
unit located in Fullerton, California. Mr. Pursch will
report to Margaret (“Marty”) M. Kendrick, who was
recently appointed Vice President of North American
Operations of Park Electrochemical Corp. Mr. Pursch had
been Vice President and General Manager of Amphenol
Printed Circuits in Nashua, New Hampshire since 2005
and Vice President and General Manager of Teradyne,
Inc. in Nashua since 2002, prior to Amphenol’s acquisition of Teradyne in 2005. Prior to 2002, Mr. Pursch served
in various management, manufacturing and engineering
positions with Teradyne, Inc. since 1987.
Sales Appointments
International
Manufacturing
Services,
Inc.
announces the appointment of CBC Electronics as its
Florida representative. Since 1972, CBC Electronics has
been addressing the electronic component needs of Florida
at both the design and manufacturing levels. CBC has
offices in Sorrento, Fort Meyers and Odessa. To find out
more, visit www.cbcelectronicsinc.com.
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IF/RF MICROWAVE COMPONENTS
403 Rev J
High Frequency Design
SIGNAL PLAYBACK SYSTEM
A Wide Dynamic Range
Playback System for
Radar Signals
By David Friedman, PhD, and Paul Hiller
Symtx, Inc.
I
mprovements in the
speed and resolution
of both digital to analog converters (DACs)
and analog to digital converters (ADCs) have
resulted in a continual
push to move more functionality into the digital
signal processing arena. RF and analog signal
processing methodologies such as filtering and
frequency translation are being handled
increasingly in the digital domain, where
near-ideal filters are achievable and analog
errors are eliminated.
However, as discussed in the article entitled “A Wide Dynamic Range Radar Digitizer,”
[1] converting to the digital domain introduces
errors which limit overall system performance. One of the most important limitations
is dynamic range, which is the range of signal
amplitudes that can be captured by an ADC.
This is determined by the number of conversion bits as well as by the signal-to-noise ratio
(SNR) of the analog components (amplifiers,
mixers, etc.) which precede the ADC.
This article describes the use of a dual
high-speed 16-bit DAC for reproducing a
Doppler weather radar signal. The signal is
played back from a digital recording produced
using the digitizer described in the preceding
article. A simplified block diagram for the system is shown in Figure 1. Note that the dual
16-bit DAC is used to effectively emulate a 20bit DAC by the means described in this article.
This system is required to digitally record
and reproduce an analog reflection-return
radar signal down-converted to an IF of 30
MHz in a 1-MHz bandwidth. A key require-
Here is a technique for
reproducing a digitally
recorded radar signal
(or other high frequency
analog signal) with 105 dB
amplitude dynamic range
and 16-bit resolution
16
High Frequency Electronics
Figure 1 · Weather radar capture and playback system.
ment is the ability to accommodate a dynamic
range of at least 105 dB between the maximum-capable and minimum-detectable amplitudes that may occur in the course of a single
radar trace.
The actual system operates above 5 GHz
and includes RF mixers, filters, amplifiers,
tunable frequency sources, and other analog
devices that are not shown in the figure.
However, the dynamic range and SNR are set
primarily by the IF devices in this diagram.
Weather Radar Signal Handling
The receiver in the radar itself as originally designed used analog AGC to compress the
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High Frequency Design
SIGNAL PLAYBACK SYSTEM
signal amplitude range prior to digitization. However,
this was found to cause distortion and other undesirable
effects. The AGC was later eliminated by converting to an
all-digital receiver using an arrangement of two 14-bit
ADCs with a 24-dB gain offset. One or the other ADC output is used according to the instantaneous amplitude of
the signal, and the resulting digital value is bit-shifted as
needed to compensate for the gain offset, resulting in an
effective 20-bit ADC. Note that this does not provide 20
bits of resolution, since only 14 bits are used for any given
sample, but the ratio of maximum-to-minimum signal
level is equivalent to that of a 20-bit ADC.
The record-and-playback system developed by Symtx
uses a similar approach. Two 16-bit ADCs are used on the
input side, offset by 24 dB to give a 20-bit data word, with
essentially the reverse procedure at the output. Two 16bit DACs with 24 dB gain offset generate the output signal, switching between the two according to the signal
level.
The details of the DAC output arrangement are the
subject of this article. It should be clear that the basic
approach is not limited to radar applications, but applies
to any case where a wide-dynamic-range analog signal
must be generated.
Dynamic Range
For purposes of this discussion, consider the dynamic
range to be the ratio of maximum-capable to minimumdetectable signal amplitude. In terms of the DAC alone,
the minimum-detectable signal is determined by its
quantization. For example, the dynamic range requirement of 105 dB corresponds to a ratio of approximately
217.5 or a shift of 17.5 bits. This can be shown to be
accommodated by the 20-bit word as follows. Allowing for
a sign bit leaves 19 bits for the peak magnitude of the
largest signal. Shifting right by 17.5 bits leaves 1.5 bits
for the peak of the smallest signal, or 1 bit for the RMS
level, i.e., the RMS of the smallest signal is equal to the
smallest value that can be represented (the magnitude
difference corresponding to the low-order bit).
More generally, the dynamic range is determined by
the SNR, defined as the ratio of the maximum signal
amplitude to the noise floor when a small signal is present (so as to bring quantization noise into account).
Assuming a signal must be above the noise floor by a
certain amount (in dB) in order to be detectable, the
dynamic range will be equal to the SNR less this
amount. The noise present at the DAC output consists
of quiescent (mostly thermal) circuit noise, which is
fixed in absolute level, plus quantization noise and
other noise generated in the DAC (as specified by the
SNR given in the data sheet), both of which are relative
to the DAC’s full-scale output value. For a full-scale
sinusoidal signal, the SNR defined by quantization
18
High Frequency Electronics
Figure 2 · Dual DAC implementation: two 16-bit DACs
aer used to reproduce 20-bit input data.
noise alone is 6.02 × N + 1.76 dB, where N is the number of bits, giving approximately 98 dB for a 16-bit
DAC, or 122 dB for 20 bits. This sets an upper limit on
the data-sheet SNR, which takes all internal noise
sources into account, including nonlinear intermodulation effects which generally will depend on the actual
composition of the signal.
For the purposes of this article, we assume that the
DAC output level is scaled so that the DAC-internal noise
(including quantization noise) is above the quiescent
(thermal) noise, so that the dynamic range is determined
essentially by the DAC noise. If this is not the case, then
the dynamic range is reduced by the amount by which the
DAC noise falls below the quiescent noise.
Implementation Details
The scheme employed to obtain increased dynamic
range is shown in Figure 2. It uses two identical 16-bit
DACs in parallel, with an analog gain offset of 24 dB (a
factor of 16) between the two. This results in an effective
data width of 20 bits, compensated by a 4-bit shift
between the two outputs. The “high-level” DAC (upper
path in the figure) is followed by an analog amplifier with
a gain of 16, while the “low-level” DAC (lower path in the
figure) has no added amplification.
Note that only one DAC is active at a time. Data bits
are routed to the active DAC, while a string of zeroes is
supplied to the other DAC. The output from the inactive
DAC consists of quiescent noise alone.
When the signal amplitude is small, the lower 16 bits
of the 20-bit input data stream are sent to the low-level
DAC, with a zero word sent to the high-level DAC. When
the amplitude is large, the upper 16 bits are sent to the
high-level DAC, with the lower four bits of the 20-bit data
effectively truncated, and zeroes sent to the low-level
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High Frequency Design
SIGNAL PLAYBACK SYSTEM
DAC. This can be understood as a 4-bit right shift of the
digital data, with a coarsening of the quantization, followed by an analog gain of 16 to restore the level. Once
again, note that this approach does not provide 20-bit resolution, but it does provide a dynamic range equivalent to
a 20-bit DAC.
The two analog outputs (from the low-level DAC, and
from the high-level DAC via the amplifier) are then
summed to provide the resulting output signal. However,
a simple summation would cause the (amplified) quiescent noise of the high-level DAC to be summed with the
output of the low-level DAC, leading to a degradation of
up to 24 dB in SNR for low-level signals.
To prevent this, an analog switch is inserted in the
high-level path between the amplifier and the summing
point. When the high-level DAC is active, the switch passes its output via the amplifier to the summation point,
and when the low-level DAC is active, the high-level DAC
output is blocked by the switch. Thus, the effective noise
level for a small-amplitude signal is that of the low-level
DAC, while the maximum output signal level is determined by the saturation point of the high-level DAC. This
provides a dynamic range that is 24 dB higher than that
of a single DAC.
Note that there is a performance cost associated with
adding the analog switch, as it introduces its own sources
of error. These are discussed later in this article.
Control for Switching
The “control” block in Figure 2 controls switching
between the two DAC paths according to signal amplitude. One indication of amplitude is given by the five
high-order bits of the 20-bit data word. When all five bits
are equal (either all zeroes or all ones, assuming two’scomplement representation), this means the upper four
bits effectively contribute nothing, and therefore the data
value is within the capability of the low-level DAC alone.
If the bits are not all equal, this means the data word is
outside the range of the low-level DAC, and the high-level
DAC path is required. Alternately, if the upper six bits are
equal, this means the data value is at least 6 dB below the
maximum of the low-level DAC, giving a 6-dB margin. In
either case, this effectively defines a switching threshold
on the signal peak-amplitude envelope.
The control level as defined above is generated by taking the AND of the upper five or six bits, ORed with the
AND of the inversions of the same bits. If the resulting
value equals one (the bits are all equal), the low-level DAC
receives the lower 16 data bits, the high-level DAC receives
zeroes, and the analog switch is set to block the high-level
DAC output. Otherwise, the high-level DAC receives the
upper 16 bits, the low-level DAC receives zeroes, and the
analog switch is set to pass the high-level DAC output. This
describes the switching operation in static terms.
20
High Frequency Electronics
Figure 3 · Switch timing diagram, showing the
sequence of events required for the transition between
the two DACs.
In practice, the high-level-to-low-level switching transition will need to be delayed in time for at least the duration of one signal cycle, to prevent the switching state
from changing sample-to-sample within a cycle.
Timing Considerations
The actual timing of the switching events is shown in
Figure 3 for a typical excursion of signal level past the
switching threshold and back down. The threshold is
exceeded at time A, and digital input is immediately
switched from the low-level DAC to the high-level DAC.
The outputs of the DACs typically show the change only
after a pipeline delay (the processing time of the DAC)
has elapsed, from A to time D.
At time B, the signal level returns below threshold and
remains there through C. An inertial delay (B to C) is
applied to the falling transition to avoid fluctuation when
the signal level is rapidly varying (alternately, hysteresis
can be used). From time C, digital input is again routed to
the low-level DAC, with a pipeline delay to time E, until
the DAC outputs are affected.
The analog switch “pass” time interval, from F to G,
brackets the time during which the high-level DAC output is carrying the signal (D to E), so that the switching
takes place when no signal is present. Therefore, the
block-to-pass transition is delayed by an amount (A to F)
that is less than the DAC pipeline delay, and the pass-toblock transition by an amount (C to G) that is greater
than the pipeline delay.
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High Frequency Design
SIGNAL PLAYBACK SYSTEM
Possible Sources of Error
With the digital data switching between high- and
low-level paths and the addition of the analog switch, the
following factors may give rise to additional noise and/or
distortion components in the analog output:
• High amplitude compression and video feedthrough
in the analog switch
• Crosstalk to the low-level DAC output from the digital data inputs
• Gain, direct current (DC) offset, and/or phase mismatch between the paths
Switch Distortion
The analog switch is required to accommodate the
maximum level of the amplified high-level DAC output
without significant compression or nonlinearity, and
without excessive insertion loss. These are minimized
through proper selection of the analog switch.
In addition, video feedthrough (capacitive coupling of
the switch control transitions into the signal path) will
occur to some degree, depending on the characteristics of
the switch and the speed of the transitions. Use of a
switch with double-rail control inputs may reduce this
coupling through partial cancellation of the oppositepolarity coupling components. The magnitude of these
effects is difficult to analyze, since they are dependent on
the characteristics of the switch.
The effect of video feedthrough can be minimized by
slowing down the edges of the switching signals, and/or
the frequency of switching by increasing the B-to-C inertial delay. For the weather radar, for example, the selection between the two DACs can be made so as to accommodate the maximum signal within a range gate, rather
than on a cycle-by-cycle basis, to reduce the frequency of
switching transitions.
Digital Crosstalk
Crosstalk between the digital inputs to the DAC and
the resulting analog output can cause a significant level
of in-band noise. This is particularly true for small signals. The two’s complement extension of the sign bit
results in many bits changing simultaneously at the signal frequency as the sampled data values pass through
zero.
An interesting characteristic of this crosstalk is that,
since it bypasses the DAC internal circuitry, it is not subject to the internal DAC pipeline delay, and appears to
precede the analog signal being generated by that
amount. The crosstalk can be reduced by proper board
design, but a further improvement can be gained simply
by offsetting the sample values from zero by adding a
small constant value to the digital data. The value should
have zeroes and ones alternating, to reduce the length of
22
High Frequency Electronics
carry propagation for small signal values.
A better approach (but one requiring a change on the
part of the DAC IC vendor) would be to use a sign-andmagnitude representation for the digital input data,
based on two’s-complement but with the non-sign bits
inverted when the sign bit is one. The result would be
that only the sign bit changes at the signal frequency. The
low-order bits would change at even multiples of the signal frequency, since they represent the sample magnitude, while the high-order bits remain at zero.
Gain and Offset Mismatch Error
To reduce gain mismatch between the high-level and
low-level channels, the insertion loss of the switch must
be balanced out as closely as possible, either by increasing the gain of the amplifier or by adding corresponding
attenuation in the low-level path. If possible, a dual DAC
(such as the TI DAC5687) should be used which provides
built-in vernier adjustment of the relative gains (this dual
DAC is intended for I-and-Q communication channel use,
with the two channels intended to be gain-matched).
If the DAC outputs are DC-coupled, any baseline offset
in the high-level DAC output will be modulated on and off
by the analog switch. A trim adjustment may be needed to
prevent a change in the DC offset of the summed output
when the switch changes state. The possibility of phase
mismatch should also be taken into account, depending on
the frequency range. The high- and low-level analog paths
should be matched as closely as possible to reduce phase
differences.
The magnitudes of the possible mismatch error components are calculated below. In this analysis, we assume as
the worst possible case a narrowband signal with mean
frequency fc and nearly constant amplitude fluctuating
around the switching threshold. Switching is assumed to
take place constantly at a mean frequency fsw << fc and
with a duty cycle of approximately 50 percent. The amount
of DC offset mismatch can be represented as a percentage
of the full-scale output value. Likewise, the amount of gain
mismatch can be represented as a percentage difference
between one channel and the other. Phase mismatch for a
narrowband signal is simply the phase difference
expressed in degrees or radians.
DC Offset
Let b be the size of the step change in DC offset at the
output, as a fraction of full scale (–FS to +FS), when the
switch changes state. Then the effect of the continual
switching is to introduce a square wave signal with peakto-peak amplitude b into the output. With a baseline shift
of b/2, this is equivalent to a symmetrical square wave of
amplitude b/2. The wideband level of this square wave is
–20 log10 b – 3 dB relative to a full-scale sinusoid, giving a
wideband SNR of 20 log10 b + 3 dB (the 3 dB term, rather
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High Frequency Design
SIGNAL PLAYBACK SYSTEM
than 6 dB, accounts for the RMS-to-peak of 1.0 for a
square wave vs. 0.7071 for a sinusoid).
The frequency spectrum of a square wave of amplitude
b/2 and frequency fsw consists of terms at the odd multiples, nfsw (n = 1, 3, 5, …), with peak amplitudes (b/2)(π/2n).
The amount of square wave noise power falling within a
band of width ∆f centered at fc would therefore be approximately equal to (1/2) (b/2)2 (π/2nc)2 with nc = fc / fsw, the
power of a harmonic falling in mid-band, times the
approximate number of harmonics falling within the
band, (1/2)(∆f / fsw). This reduces to:
according to the switching state. This is essentially a frequency-shifted version of the square wave in the preceding section, now centered in the signal band itself with
amplitude of –20 log10 d – 6 dB relative to the maximum
signal amplitude, giving SNR of 20 log10 d + 6 dB within
the signal band. The spectrum of the signal will appear to
have noise sidebands spaced by multiples of the frequency fsw of the square wave representing the switching, and
falling off inversely with distance from the signal center
frequency.
Phase Mismatch
(1/2)(b/2)2 (π/2)2 (fsw / fc)2 · (1/2)(∆f / fsw)
= (1/2)2 (b/2)2 (π/2)2 (∆f / fc) (fsw / fc)
In other words, the amount of square-wave noise
power falling in the band is proportional to the DC offset,
times the bandwidth as a fraction of the center frequency,
times the frequency of the square wave as a fraction of the
center frequency. Expressed as SNR relative to the maximum signal amplitude, this gives:
SNR = –0.943 – 20 log10 b + 10 log10 (fc / ∆f) + 10 log10 (fc / fsw)
deducting 9 dB for the RMS/peak-to-peak of the narrowband signal, and with the frequency ratios inverted to
give quantities greater than 1. The actual SNR will likely
be greater since the above assumes an ideal square wave
with zero switching time. A finite switching time will
cause the square-wave harmonics to decrease in amplitude at a rate faster than 1/n, and accelerating as frequency increases.
For ∆f > fsw, as is likely, the in-band noise will appear
in the time domain as a series of transient bursts centered at fc, arising from the individual step changes of the
DC offset convolved with the time response of the ∆f
band-pass. The peak amplitude of the bursts will be independent of fsw and depends only on the amplitude b of the
step changes, the switching time, and the shape of the
band-pass step response.
Gain Mismatch
Let us assume that a particular data bit pattern within
the range of the low-level DAC yields an output of V volts
through one DAC channel, and (1 + d)V volts through the
other, i.e., the path gains are in the ratio 1:(1 + d) where d
is a small value, which may be taken to be positive for the
present. Then, the effect of the continual switching as in
our worst-case example is to introduce an intermittent
term in the output, equal to the narrowband signal multiplied by d or by zero according to the switching state.
For d << 1, this is approximately the same as a term
equal to the narrowband signal multiplied by +d/2 or –d/2
24
High Frequency Electronics
The analysis for gain mismatch also can be applied to
phase. Let d be the difference in phase expressed in radians (i.e., the value in degrees times π/180). Then for d <<
1, this gives a term equal to the narrowband signal multiplied by +d/2 or –d/2 as above, but rotated in phase by
90 degrees, so that it adds in quadrature to the original
narrowband signal. The SNR is again 20 log10 d + 6 dB,
and the added sidebands will behave similarly.
Mismatch Correction
The mismatch errors analyzed above can be corrected
by analog and/or digital means.
Offset error involves only the high-level DAC channel,
and can be corrected by injecting a small DC current at
the switch input using a resistor and trimmer potentiometer. If the DAC is DC-coupled, a small constant
value can be added to the digital input, but this creates
the possibility of overflow if the signal value is close to full
scale. If the DAC output is AC-coupled (i.e., through a
transformer), digital correction will have no effect. The
correction is then adjusted so as to cancel any output step
when the analog switch changes state.
Gain mismatch can be corrected either by introducing
a small amount of analog attenuation in one DAC channel, or by multiplying the digital input to the low-level
DAC by a value (1 + x) where x will likely be a small positive or negative correction value. The multiplication is
done on the full length data word to allow for growth of
the sample value when x is positive, and the amplitude
threshold test is now applied to the result of the multiplication (if the high-level DAC is selected, it is driven with
the high bits of the original unmultiplied data word).
Again, the correction is applied to the low-level channel to
avoid the possibility of overflow in the data to the highlevel DAC. The value of x is chosen by adjusting it so as to
minimize modulation of the output by the switching frequency while applying a constant-level sinusoidal digital
signal a few dB below the saturation level of the low-level
DAC, and with the switching forced at a fixed rate by
applying a square wave from an external source.
The DAC itself may include provision for gain adjustment (this is the case with the TI DAC5687, which
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IF/RF MICROWAVE COMPONENTS
440 Rev A
High Frequency Design
SIGNAL PLAYBACK SYSTEM
Figure 4 · DAC output (spectrum analyzer, zero span
mode)—Positive ramp.
Figure 5 · DAC output (spectrum analyzer, zero span
mode)—Negative ramp.
includes both coarse and fine adjustments, intended to
match the two channel paths in compensation for mismatch in the external circuitry). If so, then the effect is
equivalent to adjusting the analog gain or attenuation in
each channel, and digital overflow need no longer be
taken into account.
Phase mismatch is more difficult to compensate, but
one digital approach that is valid for small error and narrow-band signal is augmenting the (1 + x) factor to
include the sum and difference with the previous sample,
giving the expression [1 + x(1 + z–1) + y(1 – z–1)] for the
multiplier, where z–1 represents a delay by one sample.
Applying the sum and difference (1 + z–1) and (1 – z–1) to
the narrow-band signal gives two components approximately 90 degrees apart in phase, so that adjustments to
the coefficients x and y are essentially orthogonal. Reexpressing the above, if at any time s0 represents the current (full-word) input data sample and s–1 the previous
sample, then
and displayed on a decibel scale using an Agilent E4440A
spectrum analyzer in zero-span mode. The digital sample
rate is 120 MHz, with the DAC output interpolated to 240
MHz.
Since the scale range of the analyzer is only 100 dB,
the lower end of the ramp is not visible. Note that the
ramp is linear and that there is no discernible discontinuity at the switching level (30 dB below the maximum).
s0 is replaced by: s0 + (x + y) s0 + (x – y) s–1
as the input to the low-level DAC (taking the lower bits).
The values x and y then can be adjusted in sequence to
minimize switching-frequency modulation sidebands at
the output, thus cancelling the gain and phase mismatch
errors simultaneously.
Measured Results
Figures 4 and 5 show the envelope of a digitally generated 29.9 MHz signal modulated by a 105 dB exponential ramp. The output is produced using a dual 16-bit
DAC with 24 dB offset according to the method described,
26
High Frequency Electronics
References
1. Ed Crean, Paul Hiller, “A Wide Dynamic Range
Radar Digitizer,” High Frequency Electronics, Sept. 2008.
2. TI DAC5687 data sheet, Texas Instruments,
September 2006.
Author Information
Dr. David Friedman serves as a senior principal engineer for Symtx. He can be reached at: dfriedman@
symtx.com. Paul Hiller is chief technology officer for
Symtx. Located in Austin, Texas, Symtx Inc. is a manufacturer of functional test systems for electronic systems
including engineering, depot, and production line applications; commercial and military satellite systems; and
commercial and military avionics systems.
Online Archives
Readers are reminded that all past technical articles
and columns are available online in PDF format. Just
go to the Archives section of our Web site:
www.highfrequencyelectronics.com
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TECHNOLOGY REPORT
Trends in Test & Measurement:
New Test Requirements,
New Technologies
T
he development of new instrumentation technologies is driven by the needs of the users—the measurements and analyses required to support new
technologies and applications. Among today’s needs are
measurement speed, broadband signal measurements,
modulation and demodulation capabilities within instruments, and greater integration with computer simulation
and analysis. There are also increasing needs for high
performance portable instruments, flexible and fast production test systems and a continuing push for the highest performance in laboratory instruments.
The single biggest recent advance in test equipment is
the inclusion of digitization of signals and computer analysis capabilities. Many instruments now have internal
PC platforms that operate the instrument and perform
the calculations necessary to process the measurement
data (FFT, modulation/demodulation, BER analysis, etc.)
and deliver detailed displays and reports to the user.
Production testing is a significant challenge, with
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systems, the flexibility of production testing has also
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High performance portable instruments is a growing
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new wireless, industrial, automotive and medical systems
can be considered an extension of the manufacturing process, including testing. Once they are operating, maintenance of these systems must use instruments that are
capable of verifying that performance is fully compliant
with the operating specifications.
Finally, the nature of the signals themselves drives
the requirements of test instruments. Complex digital
modulation (such as OFDM), and wide occupied bandwidths are just two factors that have only recently
become commonplace. The technical article that follows
this report expands on issues related to new requirements in the analysis of broadband signals.
28
High Frequency Electronics
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IF/RF MICROWAVE COMPONENTS
457 rev org
High Frequency Design
MEASUREMENTS
Evolution of Broadband
Signal Measurement
and Analysis
By Dennis Handlon
Agilent Technologies
T
he bandwidth of
signals has grown
very quickly over
the years, challenging the
ability to effectively measure and analyze them.
Traditionally,
swept
tuned spectrum analyzers have been used to
measure bandwidth, amplitude, sidebands
and harmonic distortion. In many cases this is
all that is required to characterize a signal.
The information from these measurements
can then be viewed in several ways such as
spectral density and spectral regrowth.
What is missing from the swept tuned
measurements is the ability to analyze the
information contained within these bandwidths. In order to analyze the information,
the signal must be digitized at a high enough
rate to capture the highest frequency component within the band. The challenge is to analyze these signals, which are also broadband
in nature, at high center frequencies. Within
this challenge is the issue of calibration over
The author describes how
signal measurement has
progressed from basic
spectrum analysis to a
combination of frequency
and time domain analysis,
including modulation
Figure 1 · Swept tuned spectrum analysis.
30
High Frequency Electronics
the bandwidth to insure the best possible system error vector magnitude performance.
Swept Tuned Measurements
Swept tuned measurements have been
made for many years, and with the greatly
improved computational power of newer spectrum analyzers, much information can be
obtained about wide bandwidth signals.
Channel power, occupied bandwidth, spectral
density, adjacent channel power, multi-carrier
power, power statistics (CCDF), harmonic distortion, and TOI can easily be measured.
The block diagram in Figure 1 shows a
wideband signal being measured with a swept
tuned spectrum analyzer. A ramp voltage is
applied to the voltage-controlled oscillator,
usually a YIG oscillator, and the oscillator signal is then mixed with the input signal.
Whenever the difference of the input signal
and the oscillator signal equals the frequency
of the IF, a signal is present at the detector
and a response is displayed. If the input signal
is wideband then the response will also
appear to be wideband.
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High Frequency Design
MEASUREMENTS
Figure 2 · Digitized data and FFT.
Wide Bandwidth Measurements
As mentioned previously, we can
obtain a great deal of information
about the signal. But what we do not
know is the information that is contained within the wideband signal.
A different approach must be
taken to extract the information
within the wide bandwidth signal.
Instead of making measurements in
the frequency domain, we digitize the
signal in the time domain and post
process the digitized data. The digitizer must be fast enough to capture
the highest frequency component
within the band. The block diagram
in Figure 2 shows a typical digitizer
and post processor. The local oscillator is stepped and mixed with the
incoming signal the result passes
through a band pass filter then
directly into the digitizer. In the post
processor an FFT can be performed to
view the signal in the frequency
domain or, with the help of more
sophisticated software, view the modulation within the digitized information. Figure 2 shows a typical digitized signal along with an FFT of the
signal in the frequency domain.
The wider the bandwidth (faster
data rates) the faster the digitizer
must be to capture the information
within the band. For example, to sufficiently capture an 80 MHz bandwidth signal a 200 MHz digitizer is
required. As the signal bandwidth
increases, so does the challenge of
32
High Frequency Electronics
measuring it. An alternative method
of measuring wideband signals at
very high center frequencies is to use
a down converter to translate the signal to lower frequencies. These lower
frequency wide bandwidth signals
then can be digitized using a highspeed oscilloscope. The digitized data
can then be analyzed using vector
signal analysis software. The block
diagram in Figure 3 shows the interconnection of a spectrum analyzer,
used as a down converter, an oscilloscope, used as the digitizer, and vector signal analysis (VSA) software
residing on a PC. The spectrum analyzer down converts a wide bandwidth signal between 3 GHz and 50
GHz to 321.4 MHz. The down-converted signal is digitized using channel one on the 4 Gsa/s scope. The digitized data is then analyzed using the
VSA software. The scope and the
spectrum analyzer are controlled
through the VSA software.
Figures 4 and 5 that follow are
some examples of demodulated wide
bandwidth signals, including measurements of satellite signals and linear chirp radar.
Figure 3 · Wideband measurement system.
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High Frequency Design
MEASUREMENTS
Wide Bandwidth Calibration
When we deal with measuring signals having relatively narrow bandwidths (3 or 6 MHz),
the measurement system amplitude flatness
and phase linearity are very constant over the
narrow band. Some calibration is still required.
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completely removed. The system noise will add
to the measured EVM. The signal-to-noise ratio
(SNR) is measured and the best case EVM then
can be determined as follows:
EVM = 10–SNR/20 × 100
Wideband Calibration
The purpose of the calibration process is to
remove linear errors in the system. There are
three different calibration processes used based
on the bandwidth and the system configuration—a wideband calibration process internal
to the spectrum analyzer and two calibration
processes using an external source.
The block diagram in Figure 6 shows the
wideband digitizer (200 Msa/s) and associated
circuitry. The bandwidth of the digitizer is 80
MHz. The calibrator is an 80 MHz comb that is
well characterized in both amplitude and in relative phase. The comb is applied to the digitizer as shown in the inner loop. The comb is then
up converted to a center frequency of 300 MHz
and is applied to the 3rd IF as shown in the
middle loop. The comb is applied to the input
which is the outer loop. The response to the
comb is then measured and corrections are
applied to compensate for any differences
between the expected result and the measured
result. The outer loop is calibrated at 300 MHz
center frequency only.
Figure 4 · Satellite signal, 300 MHz bandwidth.
Figure 5 · Linear chirp radar.
Calibration Using an External Source
The next level of calibration is to calibrate over the 80
MHz bandwidth at the frequency that you are measuring
your DUT using an external source. This method has
many advantages. For example, you can compensate for
amplitude and phase errors of external devices placed in
34
High Frequency Electronics
front of the spectrum analyzer such as an amplifier or
attenuator. Figure 7 shows a measurement system with
an external amplifier and an external source connected
for calibration.
Microwave spectrum analyzers incorporate a
microwave preselector, which is a YIG tuned filter. Each
Figure 6 · Calibration process for 80 MHz information bandwidth.
time the spectrum analyzer is tuned
to a different frequency the
microwave preselector displays a different amplitude and phase linearity
error. These errors can be compensated for by using an external source for
calibration (see Figure 7).
The calibration process is automated using the extended calibration
routine of the VSA software. In general the process requires that the
software controls the signal source
and the spectrum analyzer over LAN
or GPIB. The source is connected to
the input of the spectrum analyzer
and time bases are tied together.
Enter the frequency you wish to
make measurement in the software,
enter the source power in the extended calibration window. Make sure you
have sufficient power to obtain a good
signal-to-noise ratio. Enter the file in
which the corrections will reside. The
VSA software will prompt the signal
source to generate a comb at the center frequency you have entered, the
calibration process is then started,
and a correction file is developed (see
Figure 8).
300 MHz Bandwidth
Measurements and Calibration
Performing 300 MHz bandwidth
measurements uses a different
approach. Instead of using the internal wideband digitizer of the spectrum analyzer, an external wideband
digitizer is used such as a high-speed
scope. In order to capture the information within the 300 MHz bandwidth a 4 Gsa/s or greater is recommended. Figure 3 shows the interconnection of the spectrum analyzer,
scope (digitizer), signal source (for
calibration) and a PC with the VSA
software. If the scope has an internal
Windows® XP operating system
(Windows is a registered trademark
of Microsoft Corporation in the
United States and other countries.),
the VSA software can reside in the
scope eliminating the need of a PC. In
this configuration the spectrum analyzer is used as the down converter
with a maximum frequency range of
3 to 50 GHz.
A limiting factor in achieving 300
MHz bandwidth is the microwave
preselector, which is part of
microwave spectrum analyzers. A
switch can be added to bypass the
microwave preselector so that a
usable 300 MHz bandwidth is available. The switch is controlled from
the front panel of the spectrum analyzer or using a SCPI command. The
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High Frequency Design
MEASUREMENTS
Figure 7 · Wideband calibration using an external source.
spectrum analyzer down converts the
input signal to 321.4 MHz. The 321.4
MHz signal is applied to the digitizer
(a high-speed oscilloscope). The digitized data is then analyzed by the
VSA software.
The VSA software controls the
system over LAN or GPIB. The operator selects the center frequency of
the measurement and sets up the
modulation format to be analyzed.
The DUT is then connected to the
spectrum analyzer.
Before the above measurements
can be made, calibration across the
band should be considered. Even
though the microwave preselector is
bypassed, there are amplitude and
phase linearity errors caused by the
down conversion process. These
errors need to be corrected for. As
always, the goal is to measure the
performance of the DUT and not of
the system.
The calibration process is also
controlled by the VSA software. The
operator connects the signal source
and establishes the center frequency
of the measurement using the VSA
software and then uses the extended
calibration menu to set up the signal
source power. As stated earlier, a file
location is identified to place the corrections. The calibration is somewhat
different from the previous calibration in that the source is stepped
36
High Frequency Electronics
across the band versus developing a
comb. Upon completion of the calibration process an EVM of 2 to 4% can be
realized.
Performing Measurements On
Signals Greater than 300 MHz
Measuring signals with bandwidths greater than 300 MHz
requires a different approach. If the
center frequency of the signal is
below 13 or 14 GHz a 40 Gsa/s highspeed scope along with VSA software
will allow the digitization and analysis of very wide band signals. For
wideband signals greater than 300
MHz BW and with center frequencies
greater than 13 or 14 GHz, a block
down converter can be used to translate the signal down to the range of a
40 Gsa/s oscilloscope.
Conclusion
The use of swept tuned spectrum
analysis to analyze broadband signals can yield a great deal of information about the signal. However,
the data contained within the wideband signal cannot be analyzed,
requiring digitization and analysis of
the data. Depending on the bandwidth and the center frequency of the
signal, there are several methods
available to analyze these signals.
For signals with bandwidths less
than 80 MHz and center frequencies
Figure 8 · Calibration process using
VSA software.
less than 50 GHz, a spectrum analyzer will meet the requirement. For
bandwidths less than 300 MHz, a
spectrum analyzer used as a down
converter and a scope as a digitizer
can be used. For bandwidths greater
than 300 MHz, a high-speed scope or
a combination of a block down converter and a scope can be used to do
signal analysis. Calibration is also
very important to insure that the
measurements are of the DUT and
not the measurement system.
Calibration is done internally in a
wideband spectrum analyzer or with
an external source if a multi-instrument system is used to make the
measurements.
Author Information
Dennis Handlon is a product manager in Agilent Technologies’ Signal
Sources Division. He can be reached
at: dennis_handlon@agilent.com
Get info at www.HFeLink.com
High Frequency Products
FEATURED PRODUCTS
SoC and Modules
GPS Front-End Module
TriQuint
Semiconductor
has
announced the release of its newest
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noise amplifier (LNA) functions in
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The TQM640002 includes TriQuint’s smallest two-in-one SAW
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TQM640002 is now sampling.
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ISM band RF module series
Radiocrafts AS now expand their
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and 915 MHz. The new modules
have numerous applications in
38
High Frequency Electronics
M2M communication, sensor and
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2.4 GHz wireless modules
Ultra low power (ULP) RF specialist Nordic Semiconductor ASA
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unit cost for volume orders. The
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Nordic Semiconductor ASA
www.nordicsemi.com
RF, Acquisition and
Processing Platform
Semtech Corp. announced the
SX1282, the first device in a new
product platform of high-performance ISM-band system-on-chips
(SoC) that integrates RF, acquisition and processing capabilities.
The part was developed in collaboration with the Hager Group SAS
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transceivers, a CoolRISC® MCU,
and a variable 10 to 16-bit
Zooming ADC, to deliver a singlechip solution that can operate from
a single 1-volt battery cell. The
SX1282 offers up to 300% longer
battery life than competitive solutions, and has the ability to communicate on both the 400 MHz and
800 MHz ISM bands simultaneously. The SX1282 is available
today for pre-qualified customers.
Semtech Corporation
www.semtech.com
Waveguide Products
Ka-Band Waveguide LNA
MITEQ Inc. introduces a new addition to its family of waveguide
LNAs. The AMFW-8F-17702130120-23P is a very low noise, high
dynamic range Ka-band waveguide
front end. Isolator protected at both
the WR-42 waveguide input and
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housing is environmentally sealed
and comes with a mounting plate.
EMI shield and weather-resistant
packaging options are available.
LNA includes reverse voltage, over
current and over temperature protection in addition to full internal
regulation.
MITEQ, Inc.
www.miteq.com
Channel surfing.
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T wo Channels: 14.4 – 15.4 Ghz
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High Frequency Products
FEATURED PRODUCTS
Power Products
and power range. All include builtin triggering, which eliminates the
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measurements or synchronizing
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include a Hi-Speed USB 2.0 interface for quick plug-and-play setup.
The five new sensors are “B” and
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starts at $2,603.
Agilent Technologies, Inc.
www.agilent.com
USB-Based Power Sensors
Agilent
Technologies
Inc.
announced the release of five new,
higher-power members of the
Agilent U2000 Series of USBbased power sensors. The U2000
Series now covers a power range of
–60 dBm to +44 dBm and a frequency range of 9 kHz to 24 GHz.
Each of the nine models that make
up the Agilent U2000 Series is
optimized for a specific frequency
Broadband Driver Amplifier
CAP
Wireless,
Inc.
(CAP)
announced the KS5388 broadband
driver amplifier, a high perfor-
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mance, solid state, power amplifier that is ideally-suited for use as
a broadband driver or moderate
power output stage in instrumentation and electronic warfare
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CAP Wireless
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High Power, Rack Mount,
S Band Amplifier
Aethercomm Model Number SSPA
3.1-3.5-1300-RM is a high power,
pulsed RF amplifier that operates
from 3.1 to 3.5 GHz in a rack
mounted configuration. This PA is
ideal for S band military radars. It
is packaged in a 3-unit high, 19inch rack mounted enclosure. This
amplifier has a minimum peak
output power of 1300 watts at a 5%
duty cycle with a 64 µs pulse
width. It offers a typical saturated
gain of 38 dB with a typical power
flatness of ±1.0 dB with an input
drive of 24 dBm ±1.0 dB. Input and
output VSWR is 1.5:1 maximum.
This RF rack mounted amplifier
operates from 208 to 220 VAC. A
forward power RF sample port is
available, along with an output forward detected voltage pulse.
Aethercomm
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from 1030 MHz to 1090 MHz, the
HVV1011-035 power transistor
operates at 48V and delivers 35W
of pulsed output power. The 200W
HVV1214-200 extends the capabilities of HVVi’s growing portfolio of
power transistors for L-band
pulsed radar applications in the
1.2 to 1.4 GHz band. The
HVV1011-035 is sampling now and
comes in a compact SM200 style
surface mount package with a
ceramic lid. Samples of the
HVV1214-200 are also available
now. Orders may be placed with
Richardson Electronics.
HVVi Semiconductors, Inc.
www.hvvi.com
Richardson Electronics
www.rfwireless.rell.com
RF Power Transistor Portfolio
HVVi Semiconductors, Inc. has two
new additions to its growing line of
products based on their High
Voltage Vertical Field Effect
Transistor (HVVFET™) architecture. HVVi has introduced the
HVV1011-035, a 35W surface
mount RF power transistor for IFF,
TCAS and Mode-S applications,
and the HVV1214-200, a 200W RF
power transistor for ground-based
radar applications. Like their predecessors, the new devices are
designed to operate at 48V. For
avionics applications in the L-band
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High Frequency Design
SPACE COMMUNICATIONS
A Satellite Telemetry
Transmitting System with
Pre-Modulation Filtering
By D.V. Ramana, R. Jolie, V.S. Rao and S. Pal
ISRO Satellite Centre
T
he total allotted
bandwidth available for space-toearth data transmission
is 20 MHz in S-band, 375
MHz in X-band and 1500
MHz in Ka-band for
Indian Remote Sensing
(IRS) Satellites. The band allotted to communication satellites for space to earth communication in GEO missions is C-band (3.7-4.2
GHz). In this band, a small portion is identified for telemetry (TM) data transmission to
ground. There is a need to transmit 1 Mbps
payload data from a geostationary satellite
using a C-band carrier. The interference
between the regular TM data and the proposed payload data is reduced by adopting a
premodulation filtering technique. The side
lobe levels of the proposed system are low and
a reduction in interference is expected.
The author describes the
design of a space telemetry transmitter with special
filtering techniques to
reduce the potential for
out-of-band interference
Description of the System
The proposed data transmission system is
for GSAT-4 satellite. It accepts data from the
payload system, processes and modulates it on
a C-band carrier. A QPSK modulator is used in
this system. The modulated carrier is transmitted to the ground station after suitable
amplification to meet the RF link margin.
The data transmission system consists of
two identical transmitters operating at
4192.888MHz. One of the transmitters will be
ON at a time, the other providing redundancy.
It is possible to select any one transmitter by
ground command. The carrier from the transmitter which is ON, is modulated by the data
from the payload. The specifications of the
transmitter are given in Table 1.
42
High Frequency Electronics
Carrier frequency:
Frequency stability:
Modulation:
Date rate:
Data & clock interface:
4192.888 MHz
±2 × 10-6
QPSK
1 Mbps
RS 422
Table 1 · Specifications of the C-band data
transmitter.
Figure 1 · Block diagram of C-band data
transmission system.
Sharp transitions in Non-Return-Zero data
in the time domain lead to a relatively wide
PSD that rolls off quite slowly [1]. The first
null occurs at a frequency equal to half data
rate away from the carrier. It may be noted
that 90% of the transmitted power of an unfiltered QPSK signal is within a bandwidth
equal to the bit rate. The first and second side
lobes of the QPSK spectrum are 13 dB and 18
dB down respectively from its value at the
main lobe. Filtering can greatly reduce the
side lobes levels. Here a pre-modulation filtering technique is chosen for the purpose. With
this technique, interference with adjacent TM
channels can be reduced.
The paper primarily focuses on the data
processing system. The block diagram of the
C-band data transmission system is shown in
NOTE FOR NOTE, THESE SUPER DIVAS
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5 Watt Model 9165A
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5 WATT MODEL 9165A
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PARAMETER
MIN
Operating Frequency
Gain
P1dB
P5dB
IP3 /IP2
Noise Figure
In/Out VSWR
Maximum Input
DC Power
Operating Voltage
20
37
28.0
Humidity
Altitude
Operating Temperature
RF/DC Connectors
Dimensions
TYP
40
28.5
30
MAX
MIN
3000
43
20
45
36.0
40/50
48
36.5
37
MAX
UNITS
3000
51
MHz
dB
dBm
dBm
dBm
dB
46/60
2.8
500
12
0
0
-20
TYP
3.0
1.5:1/2:1
+18
600
100
0
50,000
0
65
-20
SMA/Pins
2.212” x 1.625” x 0.565”
2.8
725
24
3.0
1.5:1/2:1
+18
800
100
50,000
65
CONDITIONS
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mA
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May Specify for 1 watt: 10V to 15V,
5 watt: 20V to 28V
Non-Condensing
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5 watt 1.813”
Common specifiations to both models are in lighter type face.
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High Frequency Design
SPACE COMMUNICATIONS
Figure 2 · Photographs of the data
transmission system.
Figure 4 · Schematic of the serial to parallel converter and differential
encoder circuit.
pair of signals received to TTL compatible levels. The schematic of the
line receiver is shown in Figure 3.
The design takes care of proper resistive network at the input to produce
an adequate input differential voltage in the open line fault condition.
The output of the line receiver is fed
to a serial to parallel converter.
The serial to parallel converter
circuit accepts the data at 1 Mbps
along with clock and splits it into two
parallel data streams (2×500 kbps),
i.e., the I and Q data. The data is then
differentially encoded. The schematic
of the serial to parallel converter and
differential encoder are shown in
Figure 4. Data is passed through two
D- flip-flops ( 54LS74) to get one and
two bit delays in the data stream. The
delayed data are synchronized with
respect to half the input clock frequency to obtain two output data
streams, the odd and even data bits
at half the input data rate. The input
and output waveforms of the serial to
parallel converter are shown in
Figure 5.
The circuit also consists of a differential encoder circuit, which is
required to eliminate phase ambiguity during demodulation. There are
eight different algorithms [2] for realizing the differential encoder for a
QPSK modulator. The algorithm used
in this system is given below.
A multiplexer IC (54LS153) is
Figure 5 · Input and outputs of the
serial to parallel converter.
Figure 6 · Inputs and outputs of the
differential encoder.
Serial to Parallel Converter and
Differential Encoder
Figure 3 · Schematic of the line
receiver circuit.
Figure 1 and its photograph in Figure
2. The data transmitter consists of
two compartments connected back to
back. A line receiver, serial to parallel
converter, differential encoder, level
converters and premodulation filters
are housed in the top compartment.
The bottom compartment consists of
the QPSK modulator assembly. A
brief description of each stage is
given in the following sections.
Line Receiver
The clock and data signals are
received from the payload using RS
422 interface. A line receiver (IC
26CLV32) converts the differential
44
High Frequency Electronics
Get info at www.HFeLink.com
High Frequency Design
SPACE COMMUNICATIONS
used to realize the differential
encoder. Figure 6 shows the input
and output waveforms of the differential encoder.
Level Converter
The differentially encoded data
has TTL levels. This is converted to
bipolar levels to provide suitable bias
to the diodes in the modulator. The
level converter circuit shown in
Figure 7 is used for each data stream.
Here, switching transistor 2N2905 is
used. Different bias levels can be
achieved by varying the potentiometers. Figure 8 shows the input and
output waveforms.
Figure 7 · Schematic diagram of
the level converter.
Figure 8 · Input and output of the
level converter.
Pre-Modulation Filter
In most wireless communication
systems, the spectrum would be too
wide to meet the Frequency
Coordinate Committee (FCC) regulations and causes unwanted interference by spilling into adjacent channels. Placing a very narrow band pass
filter at the output of the modulator
could narrow the spectrum [3].
However, this is usually not practical
since the quality factor (Q) of the filter must be very high, since the
transmitted carrier frequency is
much higher than the data rate. Such
a high Q filter is difficult to realize,
expensive and can cause significant
distortion on the transmitted signal
due to large phase variations at the
band edges. A better technique to
limit the output spectrum is to filter
the base band I and Q signals before
they are applied to the modulator.
Many authors have tried various
pulse shaping methods [4, 5, 6]. Here,
we propose a new five-element filter
for base band pulse shaping. The filters are designed at 350 kHz. The
outputs of the level converters of the
previous stage are fed to these premodulation filters. The schematic of
the filter is shown in Figure 9 and its
frequency response in Figure 10. The
random data applied at the filter
input and the resultant output are
shown in Figure 11.
46
High Frequency Electronics
Figure 9 · Schematic of the premodulation filter.
Figure 10 · Response of the premodulation filter.
Figure 11 · Input and output of the
premodulation filter.
QPSK Modulator
The QPSK modulator is realized
using a 3 dB, 90° hybrid, two double
balanced mixers and a power combiner [7]. The 3 dB/90º hybrid coupler
and Wilkinson power combiner were
designed at C-band on alumina substrate. A QPSK signal is generated by
the linear addition of two BPSK signals in quadrature.
The RF carrier at 4192.888 MHz
is fed to the QPSK modulator. The 3dB hybrid produces quadrature carriers for the I and Q channels. These
are fed to double balanced mixers.
The I and Q data outputs of the premodulation filters are fed to the mixers and modulate onto the carriers.
Figure 12 · QPSK modulated spectrum with pre-modulation filtering.
Figure 13 · Encoded input to modulator & output of demodulator.
The outputs of these mixers are combined using in-phase Wilkinsons
power combiner to give a QPSK mod-
ulated output. With this configuration, a QPSK spectrum
with very low side lobe levels is achieved. From Figure 12,
it can seen that the first and second side lobes are 35 dB
and 43 dB down, respectively, compared to main lobe.
Thus, premodulation filtering technique is useful for
reducing the side lobe levels. With the low side lobe levels,
interference with other TM channels is reduced.
Demodulator
In order to evaluate the data quality, the modulated
carrier at 4192.888 MHz was down converted to 70 MHz.
and fed to a demodulator. The demodulated output consists of recovered two data streams. Figure 13 shows one
of the differentially encoded inputs to the modulator and
the output of the demodulator. It can be seen that the
demodulated data is identical to the input data except for
the pulse shaping and a small time delay due to signal
path difference.
Conclusion
The new QPSK data transmission system at C-band
was developed to transmit data from space to ground.
Premodulation filtering technique was used here to
reduce the bandwidth of the spectrum. A simple filter at
the input provided the desired effect. The reduction in the
side lobe levels of the QPSK spectrum is very important
to reduce unwanted interference caused by spilling of signals into adjacent channels. The concept can be applied to
remote sensing satellites also where adjacent channel
interference is important.
ISRO in 1971. He is Distinguished Scientist/Deputy
Director, Digital & Communication Area.
References
1. Lawrence Burns, “Digital modulation and demodulation,” 3 COM Corporation, INS, A-Prentice-Hall company, Reston, Virginia, 1975.
2. Sasikumar et.al, “Phase ambiguity resolution in
QPSK communication systems,” Journal of Spacecraft
Technology, Vol III, No.1, January 1993.
3. W. L. Martin et.al, “Efficient modulation methods”
study at NASA/JPL SFCG meeting, Galveston, Texas,
1997.
4. D. V. Ramana, “New base band pulse shaping technique and new window function for space communication,” National Conference on Communication, NCC2004, Indian Institute of Science, Bangalore.
5. R. Caballero, “8-PSK signaling over non-linear
satellite channels,” NTIS report-1996.
6. J. D. Oetting, “CCSDC-SFCG Efficient Modulation
Study, A comparison of modulation schemes,” Phase 1-3,
May 1993-95.
7. V. S. Rao, D. V. Ramana et.al “X-band high bit rate
QPSK modulator,” IETE special issue on Antennas &
Microwaves, May-June 1993.
Author Information
Dr. D. Venkata Ramana holds M.Tech degree from
National Institute of Technology, Surathkal and Ph.D
from Indian Institute of Science, Bangalore, India. He is
Deputy Project Director for Resourcesat-2 / Indian Mini
Satellite Projects at ISRO Satellite Centre. He can be
reached at: dhooliepala@ gmail.com
R. Jolie received her B.Tech from Kerala University
and M.Tech from Cochin University. She joined ISRO
Satellite Centre, Bangalore in 2000. Currently, she is
Project Manager for Resourcesat-2/Meghatropiques
Projects. Her research includes development of high bit
rate modulators and X-band data transmitters.
V. Sambasiva Rao is presently Associate Director,
Satellite technologies at Indian Space Research
Organisation. He is responsible for the development of
high bit rate data transmitters for all IRS satellites and
various RF and microwave systems for IRS and INSAT
missions. He can be reached by e-mail at:
vssrao@gmail.com.
Dr. S. Pal received his B.Sc in 1966, M.Sc(Physics) in
1968 and M.Sc(Tech) in Electronics from BITS, Pilani in
1974 and Ph.D from IISc, Bangalore in 1984. He joined
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IF/RF MICROWAVE COMPONENTS
448 Rev Org
High Frequency Design
DEFECTED GROUND
An Introduction to
Defected Ground Structures
in Microstrip Circuits
By Gary Breed
Editorial Director
I
n recent years, there
have been several
new concepts applied
to distributed microwave
circuits. One such technique is defected ground
structure or DGS, where
the ground plane metal of
a microstrip (or stripline, or coplanar waveguide) circuit is intentionally modified to
enhance performance.
The name for this technique simply means
that a “defect” has been placed in the ground
plane, which is typically considered to be an
approximation of an infinite, perfectly-conducting current sink. Of course, a ground
plane at microwave frequencies is far removed
from the idealized behavior of perfect ground.
Although the additional perturbations of DGS
alter the uniformity of the ground plane, they
do not render it defective.
Here is an overview of a
recent development in
distributed circuit design
that offers improved performance in many filter and
antenna applications
MICROSTRIP LINE
GROUND PLANE
(a) Slot
(b) Meander lines
DGS Element Characteristics
The basic element of DGS is a resonant
gap or slot in the ground metal, placed directly under a transmission line and aligned for
efficient coupling to the line. Figure 1 shows
several resonant structures that may be used.
Each one differs in occupied area, equivalent
L-C ratio, coupling coefficient, higher-order
responses, and other electrical parameters. A
user will select the structure that works best
for the particular application.
The equivalent circuit for a DGS is a parallel-tuned circuit in series with the transmission
line to which it is coupled [1] (see Figure 2). The
input and output impedances are that of the
line section, while the equivalent values of L, C
and R are determined by the dimensions of the
50
High Frequency Electronics
(c) Slot variations
(d) Various dumbbell shapes
Figure 1 · Some common configurations for
DGS resonant structures.
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High Frequency Design
DEFECTED GROUND
Figure 2 · Equivalent circuit of a
DGS element. The values of L, C
and R are determined by the
dimensions and location relative to
the “through” transmission line.
DGS structure and its position relative to the transmission line. The
range of structures—of which Figure 1
is only a small sample—arises from
different requirements for bandwidth
(Q) and center frequency, as well as
practical concerns such as a
size/shape that does not overlap other
portions of the circuit, or a structure
that can be easily trimmed to the
desired center frequency.
Figure 3 shows the frequency
response of a single resonator [2].
This one-pole “notch” in frequency
response can be used to provide additional rejection at the edges of a filter
passband, or at an out-of-band frequency such as a harmonic, mixer
image, or any frequency where the
filter structure has poor rejection due
to re-entry or moding effects.
Similarly, DGS resonators can also be
used to remove higher-order responses in directional couplers and power
combiner/dividers.
Being a physical structure, analysis of DGS circuits is best accomplished using electromagnetic simulation with multi-layer 2-D or 3-D
tools. It is also important to construct
and measure circuits that are intended for production. Common microstrip considerations, such as variations in dielectric constant or etched
line dimensional tolerance, tend to
have greater effect with narrow
bandwidth circuits such as DGS.
52
High Frequency Electronics
Figure 3 · Structure of a specific DGS type and its frequency response,
obtained by electromagnetic simulation [2].
Example: A DGS-Enhanced Filter
DGS allows the designer to place
a notch (zero in the transfer function)
almost anywhere. When placed just
outside a bandpass filter’s passband,
the steepness of the rolloff and the
close-in stopband are both improved.
Simple microstrip filters have asymmetrical stopbands, and the need for
a more complex design can be avoided if DGS elements are used to
improve stopband performance.
This can be seen in the filter
example of Figure 4 [2]. This filter
has two DGS elements, placed the
input and output of a simple coupled
line bandpass filter. The filter’s cen-
ter frequency is 3.0 GHz, while the
DGS resonators are designed for a
notch at 3.92 GHz. The plot of Fig. 4
shows a fast rolloff on the high frequency side of the passband, which is
much greater than that of the basic
coupled line filter.
A classic characteristic of distributed filters is higher order
responses, with the most trouble
some being at twice the center frequency. This can be seen clearly at
the upper frequency edge of the plot
in Fig. 4. If the application requires
elimination of this “second passband,” additional filter elements are
required. This can be accomplished
Figure 4 · Layout, simulation and measurements of a coupled-line bandpass filter centered at 3.0 GHz [2]. The filter includes two 3.92 GHz DGS elements, located adjacent to the input and output.
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RF/IF MICROWAVE COMPONENTS
346 rev N
High Frequency Design
DEFECTED GROUND
Figure 5 · Layout and performance of the example bandpass filter, which
is now further enhanced with a DGS element that reduces the unwanted
second harmonic response.
simply by adding another DGS element resonant at the second harmonic frequency. The rejection of this resonant notch will greatly reduce the
filter’s unwanted response.
The example in [2] includes this
scenario, adding a DGS at the center
of the filter. Its design frequency of
5.9 GHz places it in the offending
region. The filter layout and performance plots for this further enhancement are shown in Figure 5. When
compared with the response of the
simpler filter in Fig. 4, it is easy to
see the improvement near 6 GHz.
Disadvantages of DGS
The main disadvantage of the
defected ground technique is that it
radiates. The top illustration of Fig.1
is not only a DGS element, it is a slot
antenna—a highly efficient radiator.
Although much of the incident energy
at the resonant frequency is reflected
back down the transmission line,
there will be significant radiation.
Radiation
within
enclosed
microwave circuits can be difficult to
include in simulation. Boundary conditions are usually set to be absorbing (no reflections), which simplifies
calculations, but excludes the structures around the circuit being exam54
High Frequency Electronics
ined. In some cases, the size of the
enclosure will make the problem too
large to achieve a solution in a reasonable time, and the details of the
physical structure may take a very
long to determine and enter into the
software.
EM simulation is certainly accurate for the circuit itself, but with
uncertainty of radiation effects, the
construction and careful evaluation
of a prototype is strongly recommended. An experienced designer
may be able to create a simplified
model of the enclosure for more accurate simulation, but measurement
remains essential for verification.
A lesser disadvantage is that DGS
structures increase the area of the
circuit. However, the additional area
will usually be less than that of alternative solutions for achieving similarly improved performance.
Additional Applications of DGS
Delay lines—Placement of DGS
resonators along a transmission line
introduce changes in the propagation
of the wave along the line. The DGS
elements do not affect the odd mode
transmission, but slows the even
mode, which must propagate around
the edges of the DGS “slot.” With this
change in the phase velocity of the
wave, the effective dielectric constant
is effectively altered, creating a type
of slow-wave structure.
Delay lines and phase shifters can
be simplified in many cases. Also, the
common capacitive-loaded microstrip
line sometimes used for these type of
slow-wave applications can be
enhanced with the addition of DGS
resonators.
Antennas—The filtering characteristics of DGS can be applied to
antennas, reducing mutual coupling
between antenna array elements, or
reducing unwanted responses (similar to filters). This is the most common application of DGS for antennas,
as it can reduce sidelobes in phased
arrays, improve the performance of
couplers and power dividers, and
reduce the response to out-of-band
signals for both transmit and receive.
An interesting application combines the slot antenna and phase
shift behaviors of DGS. An array of
DGS elements can be arranged on a
flat surface and illuminated by a feed
antenna, much like a parabolic reflector antenna. Each element re-radiates the exciting signal, but a phase
shift can be built into the structure to
correct for the distance of each element from the feed. The re-radiating
elements introduce additional loss,
but the convenience of a flat form factor is extremely attractive for transportable equipment or applications
where a low-profile is essential.
References
1. I. Chang, B. Lee, “Design of
Defected Ground Structures for
Harmonic
Control
of
Active
Microstrip Antennas,” IEEE AP-S
International Symposium, Vol. 2, 852855, 2002.
2. J. Yun, P. Shin, “Design
Applications of Defected Ground
Structures,” Ansoft Corporation, 2003
Global Seminars. Available at
www.ansoft.com. Figures 3, 4 and 5
are reproduced from this reference,
courtesy Ansoft, LLC.
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High Frequency Products
NEW PRODUCTS
New Full Line Catalog
Samtec has released its F-209 Full
Line Catalog that is newly reformatted for even easier access to
applications, specifications, and
ordering information for Micro
Board-to-Board, High Speed Cable
Assembly, Panel & I/O, Rugged,
Power, and Custom High Speed
Transmission Line Solutions.
Principal new High Speed products include a second generation Q
Series® Power/Signal Combination
and a 0.8 mm (.0315") system with
Rugged Tiger Eye contacts. Other
new board level products include a
High Speed socket/terminal with
Signal Integrity-optimized contacts and right angle Edge Rate
(connectors and space saving .4
mm super fine pitch strips
(SS4/ST4).
Samtec, Inc.
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subsystem includes two transceiver blocks. The block A transmits at
the frequency of 71-76 GHz and
receives at 81-86 GHz, while the
block B works at the opposite frequency ranges. Each block has
transmitter (TX), receiver (RX),
local oscillator (LO) chain and
phase locked dielectric resonator
oscillator (PLDRO) modules.
Ducommun Technologies
www.dt-usa.com
7-16 Bullet Adaptor
Introducing a new 7-16 bullet
adaptor from Times Microwave
Systems designed to facilitate RF
testing at the cell tower top. The
new Times TuffGrip Adaptor (stock
code 3191-291) 7-16 female bullet
adaptor features the patented
TuffGrip handle that provides a
secure way to grip the device during use. It has superior RF characteristics through 6.0 GHz and is
manufactured from 100% stainless
steel. The rugged adaptor has a
stainless steel ring for attachment
to a tool belt with a carabineer
hook. The adaptor also comes
equipped with attached, heavyduty end caps to protect the 7-16
interfaces.
Times Microwave Systems
www.timesmicrowave.com
E-band Radio Link RF
Subsystem
DTI has announced the release of
E-band Radio link RF subsystem.
This subsystem operates over the
E-band frequency spectrum from
71-86 GHz. One of its applications
can be found in the E-band multigigabit wireless communication
system, which offers local area networks and “Virtual Fiber” local
loop for wireless transmission of
data, voice and video at 1-10 Gbps
speed. DTI’s E-band radio link RF
56
High Frequency Electronics
14-Bit 125 Msps ADC
Linear Technology introduces a
low-power 14-bit, 125 Msps ADC
that dissipates only 127 mW, less
than one-third the power of prior
solutions. Operating from a low
1.8V analog supply, the LTC2261
achieves significant power savings
without sacrificing AC performance. This ADC offers signal to
noise ratio (SNR) performance of
73.4dB and spurious free dynamic
range (SFDR) of 85 dB at baseband. Ultralow jitter of 0.17 ps
RMS allows undersampling of IF
frequencies with excellent noise
performance. The LTC2261 family
comprises six pin-compatible members, offering 14-bit resolution at
125 Msps, 105 Msps and 80 Msps
and 12-bit resolution at 125 Msps,
105 Msps and 80 Msps, with full
production planned for December
2008. Each device is offered in commercial and industrial temperature grades, and is competitively
priced beginning at $9.50 each in
1,000-piece quantities.
Linear Technology Corporation
www.linear.com
Network Test Platform
Anritsu Company introduces the
CMA5000a Multi-Layer Test
Platform for installing and maintaining Next Generation Networks
(NGNs). Combining a compact
design with in-depth testing capability, the CMA5000a provides field
technicians with a single instrument to accurately, quickly, and
cost-efficiently test all aspects of
network installation and maintenance on SONET/SDH/PDH, OTN
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installation and maintenance support of each network layer is provided by the CMA5000a, which
means faster rollout of services
and lower total costs. The
CMA5000a offers all the test applications required for comprehensive
physical layer characterization.
The CMA5000a is available now.
Complete systems start at $13,000.
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IF/RF MICROWAVE COMPONENTS
432 Rev B
High Frequency Products
NEW PRODUCTS
movements to menu options and
dialog boxes; and more. Agilent
EMPro is expected to be available
in November 2008, with prices
starting at approximately $50,000.
Agilent Technologies Inc.
www.agilent.com
Fiber Optic Products Catalog
MITEQ announces their new 64page Fiber Optic Products catalog.
The individual data sheets offer
product descriptions, applications,
electrical specifications, optical
performance specifications, power
requirements, typical test data,
block diagrams, and outline drawings on their full-line of fiber optic
links, optical receivers and transmitters. To download our catalog,
please visit our website.
MITEQ, Inc.
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3D Electromagnetic Design
Platform
Agilent Technologies Inc. introduced Electromagnetic Professional (EMPro), a new design platform for analyzing the electromagnetic (EM) effects of RF and
microwave components such as
high-speed IC packages, antennas,
on-chip embedded passives and
PCB interconnects. Key features of
EMPro’s environment include: efficient, time-saving design entry
through the 3D drawing environment, importing of 3D CAD data
files or integration with ADS; intelligent “one-time” materials assignment, allowing designers to “set it
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minimizing back-and-forth mouse
58
High Frequency Electronics
Broadband Quadrature
Modulator
Analog Devices, Inc. (ADI) introduced the industry’s first high-performance broadband I/Q quadrature modulator to integrate automatic gain control (AGC) circuitry
within a compact 6 × 6 mm LFCSP
(lead-frame chip-scale package).
ADI’s ADL5386 provides a unique
combination of performance and
unmatched integration levels for
low IF and RF transmitters within
broadband wireless access systems, microwave radio links, cable
modem termination systems and
cellular infrastructure equipment.
Operating over a 50-MHz to 2200MHz
frequency
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ADL5386 supports high-data-rate
complex modulation for next-generation communication infrastructure equipment. Functionally complete, the ADL5386 integrates a 25
dB dynamic range output power
detector and a VVA. The ADL5386
is in full-production and is available in a 40-pin LFCSP. The
ADL5386 is priced at $5.29 per
unit in 1,000-unit quantities.
Analog Devices, Inc.
www.analog.com
GaAs MMIC Design Incentive
Program
AWR and United Monolithic
Semiconductors (UMS) announced
“Try the Power,” an incentive program to provide new customers
with the opportunity to bring gallium arsenide (GaAs) microwave
monolithic integrated circuit
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United Monolithic Semiconductors
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AWR
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New Product Selection Guide
Hittite Microwave Corporation
announces the release of the
November 2008 Product Selection
Guide, which summarizes over 700
products including 34 new products. New for this publication is an
expanded Frequency Generation
section. The Guide also contains
expanded Market and Application
sections featuring automotive,
broadband, cellular infrastructure,
fiber optics, microwave and millimeterwave communications, with
competitor cross reference tables.
In addition, the latest Off-theShelf Newsletter and an updated
version of Hittite’s 2008 Designer’s
Guide CD-ROM are now available.
Hittite Microwave Corporation
www.hittite.com
Oscillators and Attenuators
Ferrite Chip Beads
Laird Technologies, Inc. announced
its new line of EIA 0201 Ferrite
Chip Beads that extends the existing 0402 to 3312 surface-mounted
monolithic EMI suppression product families. The LI0201 chip
beads’ miniature foot-prints make
them ideal for advanced handheld
electronic devices such as cellular
phones, Bluetooth® handsets,
PDAs, GPS, MP3 players, and digital cameras. The monolithic assembly and 0.6 × 0.3 × 0.3 mm footprint
offers approximately 40% mounting space savings over the existing
0402 products, making them ideal
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construction. The chip beads provide a superior EMI noise filtering
effect and space efficiency; and can
be placed close to the EMI source
or receptor of the external interface or the internal signal interconnection.
Laird Technologies, Inc.
www.lairdtech.com
M/A-COM Technology Solutions,
Inc. (M/A-COM Tech) announced a
new product line of high-performance oscillators and a voltage
variable attenuator. The broadband voltage variable attenuator is
designed for applications that
require high dynamic range linearity. The RoHS compliant QFN
package is compatible with 260°
reflow temperatures and has an
MSL 1 rating. The point-to-point
voltage controlled oscillator product line is an InGaP HBT-based
VCO designed for frequency generation without the need for external
matching components. The VCO is
easily integrated into a phase lock
loop using the divide–by-two output.
M/A-COM Technology Solutions, Inc.
www.macom.com/default.asp
SMT Discrete Semiconductors
4 I/O RF Switch Matrix
Renaissance Electronics Corp.
announces their latest switch product, 18A1NAI, a 4 I/O RF matrix
with 4 coupled ports that operate
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Extremely Low Cost
< $10,000 US
DC/RF/Microwave Test
Very Low Cost
High Function
A compact full featured, modestly priced, manually operated probe
station developed for engineers and scientists.
Measure Microwave, RF and DC parameters of Semiconductor Devices,
Packages and Assemblies with NIST traceability .
A ultra compact, manually operated probe station for engineers,
scientists and students. Measure Microwave, RF and IV parameters of
Semiconductor Devices. Characterize MEMS, wireless, photonic and
nanoelectronic components and assemblies.
• Benchtop Size(<1ft2) • Vacuum chuck • X-Y-Ø stage•
•X-Y-Z probe positioners •Top Plate Z-lift •Vacuum Accessory Manifold•
•6.5X-112.5X Stereo Zoom Microscope • Adjustable Halogen Illuminator •
•Vacuum Accessories • Compatible with 40GHz+ probes•
• Accessories for Thermal Chucks and Probe Cards•
•Compatible with Magnetic Mount Positioners•
• Benchtop Size(1ft2) • 2” Vacuum chuck with pump• 1” X-Y-Ø stage with z-lift•
•2 ea. 0.5” X-Y-Z probe positioners, includes 2 ea. 18 GHz probes & DC needles•
•10X/30X Stereo Zoom Trinocular Microscope • Flourescent Illuminator •
•Compatible with additional Magnetic Mount Positioners(optional)•
•Compatible with industry standard microwave probes(optional)•
•Cost effective for research projects•
•Test wafers, microstrip packages and surface mount components•
J microTechnology
J micro Technology
3744 NW Bluegrass Pl
Portland, OR 97229
(503) 614-9509
(503) 531-9325 [FAX]
www.jmicrotechnology.com
A Probe Station On Every Bench
between 100 and 55 MHz. The
maximum input power level at any
I/O port is 1 W and the unit is full
programmable using GPIB commands. Following are the characteristics
of
this
matrix:
Operational frequency band: 100550 MHz; Input power level: 1
watt; 4 I/O ports with 4 coupled
ports; All paths have 90 dB / 1 dB
or 130 dB / 1 dB programmable
attenuators; Computer remote
interface: GPIB; Isolation between
I/O ports: > 100 dB.
Renaissance Electronics
Corporation
www.rec-usa.com
J micro Technology
Skyworks Solutions, Inc. introduced the industry’s smallest and
lowest profile packaged silicon
radio frequency (RF) Schottky
diodes in a 0201 surface mount
technology (SMT) footprint. This
new family of ultra-miniature and
high-performance packaged diodes
is ideal for a wide range of highvolume and cost-sensitive applications including CATV/DBS set-top
ProbePoint™ CPW-µStrip
Adapter Substrates
Adapt
er S
ubst
rates
Probe Tip
FET
•Precision CPW to µStrip Adapter Substrates•
•Companion Calibration Substrates and Standards•
•Standard & custom Carriers•
•Accurate Electrical Data to Frequencies >50 GHz•
• 5,10,& 15 mil thickness•
•Compatible with 40GHz+ probes•
•Standard and Custom Calibration Standards•
J microTechnology
J microTechnology
3744 NW Bluegrass Pl
Portland, OR 97229
(503) 614-9509
(503) 531-9325 [FAX]
www.jmicrotechnology.com
3744 NW Bluegrass Pl
Portland, OR 97229
(503) 614-9509
(503) 531-9325 [FAX]
www.jmicrotechnology.com
Research Performance / Student Price
J micro Technology
Test Tooling for the Untestable
Get info at www.HFeLink.com
November 2008
59
High Frequency Products
NEW PRODUCTS
boxes, microwave radios, RFID
tags, wireless infrastructure and
embedded WLAN 802.11a/b/g/n
modules. The SMS7621-096 is a
low barrier silicon RF Schottky
diode that is well suited for a variety of applications including high
sensitivity RF power detection,
video sampling circuits, and low
conversion loss balanced mixers.
The SMS7630-093 is a very low
barrier zero bias silicon RF
Schottky diode that is ideal for
ultra-sensitive video detectors and
sampling applications. Sample
quantities are available now in
bulk and tape and reel packaging
with volume production release
scheduled for November 2008.
Skyworks Solutions, Inc.
www.skyworksinc.com
addition to cable plugs and jacks,
Delta’s SMK field replaceable
receptacles are available in three
mounting flange configurations.
Both the flange-mounted and
thread-in (spark plug) connectors
are available for use with hermetic
seals or accessory pins with diameters of .009, .012, .015, and .020
inches.
Delta Electronics Manufacturing
Corp.
www.deltarf.com
Clock Jitter Cleaners
SMK Connectors
Delta Electronics Manufacturing
Corp. has released a new line of
SMK series microwave connectors
that operate to 40 GHz mode-free.
Delta SMK (2.92 mm) series connectors feature maximum VSWR
for cable connectors of 1.15:1 from
DC to 18 GHz, and 1.3:1 from 18 to
40 GHz. The maximum VSWR for
receptacles and adapters is 1.15:1
from DC to 18 GHz, and 1.25:1
from 18 to 40 GHz. Their interface
is similar to that of SMA connectors, but utilizes an air dielectric
and a Noryl support bead for higher cutoff frequency than SMA connectors. The internal design is optimized
using
state-of-the-art
Electromagnetic Finite Element
Analysis model simulation to provide low reflection coefficient, with
mode free operation to 40 GHz. In
60
High Frequency Electronics
National Semiconductor Corp.
introduced the industry’s first family of clock jitter cleaners capable
of providing ultra low-noise clocks
without external high-performance
voltage-controlled crystal oscillator
modules. Using a simple external
crystal and cascaded PLLatinum®
architecture, the new clock jitter
cleaners provide sub-200 fs RMS
jitter to improve system performance and accuracy. The new
LMK04000 family consists of five
precision
clock
conditioners:
LMK04000B,
LMK04001B,
LMK04011B, LMK-04031B and
LMK04033B. These devices feature power-to-noise specifications
that place them among National’s
PowerWise® family of energy-efficient products. The LMK04000B
and LMK04001B offer 24.4 mW-ps
per
channel,
while
the
LMK04031B and LMK04033B are
rated at 25.4 mW-ps per channel
and the LMK004011B is 37.4 mWps per channel. The LMK04011B,
LMK04031B and LMK04033B are
available
now
and
the
LMK04000B, LMK04001B are
sampling now with production volumes expected in the first quarter
of 2009. All devices are $14.50 each
in 1,000-unit quantities.
National Semiconductor Corp.
www.national.com
SiGe Power Amplifier
SiGe
Semiconductor,
Inc.
announced the availability of the
SE2597L power amplifier (PA)
designed specifically for 2.4 GHz
ISM band applications. This highly
integrated silicon device is the latest PA in SiGe Semiconductor’s
successful line of discrete 2.4 GHz
silicon power amplifiers. The
SE2597L integrates a reference
voltage generator and a load-insensitive power detector in a popular 3
× 3 × 0.9 mm 16-pin QFN package.
Designed for use in the 2.4 GHz
ISM band including 802.11 b/g/n
WLAN applications, the SE2597L
is a general purpose fully input
matched PA that is well suited for a
wide range of applications.
Optimized for high performance, it
delivers +20dBm output power at
3% error vector magnitude (EVM).
Operating from 3.3 VDC supply, the
SE2597L consumes only 170mA at
+20dBm. The SE2597L is available
now and is less than $0.45 in 10k
quantities.
SiGe Semiconductor
www.sige.com
Arbitrary Waveform/Function
Generator
Keithley Instruments, Inc. introduces the Model 3390 50 MHz
Arbitrary
Waveform/Function
Generator, featuring the highest
waveform resolution and best
2009 EDITORIAL CALENDAR
Issue
January
Product Coverage
RF/MW Connectors
EDA Tools
mm-Wave Components
Technology Report
Tutorial Topic
Ad Close
Bonus Distribution
Component Modeling
Advances
Broadband
Matching
December 15
DesignCon 2009
(Materials Dec. 19)
January Product & Technologies Supplement — TEST EQUIPMENT
Analyzers, Signal Generators, Automated Systems, Test Accessories ...
February
Crystals & Oscillators
Antennas
Substrates & Laminates
Update on MEMS and
Micromachining
High Speed Digital
Interconnections
(Materials Jan. 19)
March
Power Amplifiers
ADCs and DACs
Switches
Government/Military
Research
Patch Antenna Basics
February 16
April
Capacitors & Inductors
Couplers
New Literature
Short-Range Wireless:
ZigBee, 802.15.4, UWB
Defining
Signal Integrity
(Materials Feb. 19)
Signal Sources
Manufacturing
Signal Integrity EDA
June
Transistors
Military & Space
Wireless Test
July
EMI/EMC Products
High Speed Connectors
Microwave Assemblies
March 16
Cables, Connectors, Assemblies, Installation Tools ...
Understanding
Component Models
(Materials Apr. 20)
IEEE IMS 2009
AP-S/URSI Symposium
Packaging—MMIC, RFIC,
SoC and more
Specifying Cable
Assemblies
May 15
DAC 2009
(Materials May 19)
Broadband Wireless:
3G, 4G, WiMAX & more
Fundamentals of
OFDM
(Materials Jun. 19)
mm-Wave Applications
July Product & Technologies Supplement — EDA TOOLS
Signal Analyzers
Modular Test Systems:
Mixers / Modulators
August
VXI and PXI
Test Accessories
April 15
June 15
Power Management
Methods
July 15
(Materials Jul. 20)
RFICs and MMICs
Test Instruments
High Speed Digital
Update on Standards
and Regulations
Notes on Selecting
Test Equipment
(Materials Aug. 20)
October
Wireless RFICs
High Power Products
Optical Products
EDA Tools for
IC Design
RF Connector
Specifications
(Materials Sep. 18)
October Product & Technologies Supplement — PASSIVE COMPONENTS
Cable & Assemblies
Signal Processing
Packaging
December
MMIC Amplifiers
Combiners/Splitters
New Literature
Military Technology
Digital Signals:
DACs, ADCs and DSP
Regular Columns
Meetings & Events · In the News · Design Notes
High Frequency Applications
Editorial Submissions
Press releases for our various informational columns should be sent at
least 6 weeks in advance of the desired publication date.
IEEE EMC Symposium
Simulation, Analysis, Synthesis, Verification, Layout ...
September
November
10th WAMICON
CTIA Wireless
NAB 2009
(Materials Mar. 19)
April Product & Technologies Supplement — INTERCONNECTIONS
May
January 15
August 17
European Microwave
AOC Symposium
September 15
Couplers, Combiners, Splitters, Attenuators, Circulators ...
The 90-Degree
Hybrid Coupler
(Materials Oct. 19)
Choices for
Continuing Education
(Materials Nov. 19)
October 15
November 16
IEEE RWS 2010
Article Contributions
We encourage the submission of technical articles, application notes
and other editorial contributions. These may be on the topics noted
above, or any other subject of current interest.
Send press releases and other communications to our general editorial
e-mail address: editor@highfrequencyelectronics.com.
www.highfrequencyelectronics.com
High Frequency Products
NEW PRODUCTS
price-to-performance value in its
class. The Model 3390 is a flexible,
easy-to-use programmable signal
generator with advanced function,
pulse, and arbitrary waveform
capabilities.
Superior
signal
integrity, faster rise and fall times,
lower noise, and greater waveform
memory combine to provide high
quality output signals. High resolution waveforms are supported by
four times the waveform memory
of any competitive waveform generator on the market. Keithley is
offering the Model 3390 for a special introductory price of $1,325
USD, valid through December
2008.
Keithley Instruments, Inc.
www.keithley.com
ing. The 3500A is P25 ready for
support of P25 testing as additional features are added, and is MIL28800F Class II certified. The
3500A can be purchased for
$14,995 from any Aeroflex sales
office or authorized distribution or
representative.
Aeroflex, Inc.
www.aeroflex.com
DIO® (CST MWS). Users of CST
MWS version 2009 will benefit
from the total revision of its tetrahedral frequency domain solver’s
mesh adaptation scheme. With the
release of CST MWS version 2009,
CST is the only commercial vendor
to offer a high frequency Finite
Element type solver that accurately converges to the real solution,
even for rounded structures.
Computer Simulation Technology AG
www.cst.com
Thin Film Attenuators
Hand-held Radio Test Set
Aeroflex announced the release of
the new, lightweight 3500A 1 GHz
Hand-held Radio Test Set. The
3500A improves upon the success
of the Aeroflex 3500, the industry’s
first 1 GHz handheld test set. With
improved audio analysis and operation, the 3500A offers lighter
weight, integrated audio test connections and a new microphone
interface for easier operation. With
a new cast magnesium alloy case,
the 3500A weighs almost one
pound less than its predecessor the
3500. The 3500A includes testing
capabilities for AM and FM radio
systems including power measurements, RSSI, frequency error, FM
deviation, AM modulation index,
SINAD, distortion and AF level.
Optionally, the 3500A supports a
single-channel scope and a spectrum analyzer for extended test-
62
High Frequency Electronics
International
Manufacturing
Services, Inc. (IMS) has added a 63
mW 0603 size to their cost-effective line of precision thin film
attenuators. The A-Series attenuators are now available in 0402,
0603, 0805, 1206 and 1612 sizes
with dB values from –0 db to –10
dB. These “Pi” attenuators feature
a low VSWR of 1.3:1 and a thin
film attenuation element operating
in the DC-10 GHz range. RoHS
compliant 100% tin terminations
with a nickel barrier layer provide
excellent
solderability
and
mechanical integrity. The A-Series
from IMS has a 50 piece MOQ for
bulk and 1,000 piece MOQ for tape
and reel. More information on the
A-Series attenuators and samples
are available on the IMS website.
International Manufacturing
Services, Inc.
www.ims-resistors.com
Frequency Domain Mesh
Adaptation
Computer Simulation Technology
AG
(CST)
announces True
Geometry Adaptation. This represents a breakthrough in high frequency tetrahedral frequency
domain solver mesh adaptation
schemes. This new mesh technique
will be available with version 2009
of the electromagnetic simulation
software CST MICROWAVE STU-
Microwave Signal Generator
and Power Amplifier
Giga-tronics offers special pricing on a high-performance
Microwave Signal Generator and
M i c r o wa v e Po w e r A m p l i f i e r
package, providing high power,
high purity signals from 2 GHz
to 20 GHz. The success of the
recent introduction of the GT1000A 2 GHz to 20 GHz
Microwave Power Amplifier and
the demand from customers to
offer this packaged with a
microwave signal geerator has
motivated the company to develop special pricing for the two
units if purchased together. The
Giga-tronics 2420B is a high
performance synthesizer with
low phase noise and low harmonics and spurious and is an
ideal match to the GT-1000A.
The combination of Giga-tronics
2420B and GT-1000A features 2
GHz to 20 GHz output signals
with power levels as high as
+40 dBm. The US list price is
$57,900 for the combination
with no modulation, and
$64,900 for the combination
with modulation.
Giga-tronics
www.gigatronics.com
Advertiser Index
Company.......................................................................Page
Company.......................................................................Page
Aethercomm.........................................................................37
Analog Devices ....................................................................21
Applied Wave Research (AWR)...........................................19
AR RF/Microwave Instrumentation...................................31
Besser Associates ................................................................55
California Eastern Laboratories ........................................33
C.W. Swift & Associates .............................................Cover 2
DAICO .................................................................................43
Emerson Network Power ......................................................4
Hittite Microwave Corporation ............................................9
Hus-Tsan .............................................................................40
J microTechnology...............................................................59
J microTechnology...............................................................59
J microTechnology...............................................................59
Krytar ..................................................................................41
Labtech Microwave .............................................................35
Linear Technology ...............................................................13
Micro Lambda Wireless ......................................................17
Microwave Components ......................................................51
Microwave Development Labs............................................39
Mini-Circuits ......................................................................2-3
Mini-Circuits .......................................................................11
Mini-Circuits .......................................................................15
Mini-Circuits .......................................................................25
Mini-Circuits .......................................................................29
Mini-Circuits ..................................................................48-49
Mini-Circuits .......................................................................53
Mini-Circuits .......................................................................57
MITEQ ...................................................................................1
MITEQ ........................................................................Cover 4
Molex RF.....................................................................Cover 3
RelComm .............................................................................45
Rohde & Schwarz ................................................................23
RLC Electronics ..................................................................27
SGMC Microwave................................................................47
Teledyne Cougar....................................................................7
■ FIND OUR ADVERTISERS’ WEB SITES
USING
HFELINK™
1. Go to our company information Web site: www.HFeLink.com
(from www.highfrequencyelectronics.com, just click on the HFeLink reminder on home page)
2. Companies in our current issue are listed, or you can choose one of our recent issues
3. Find the company you want to know more about ... and just click!
4. The Web site of each company you choose will open in a new browser window
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ACTIVE
AND INTERESTED
AND
SIMPLY CLICK
ON THEIR
AD!
READERSHIP
Contact one of our advertising professionals today:
ADVERTISING SALES — EAST COAST
ADVERTISING SALES — WEST
Gary Rhodes
Tim Burkhard
Tel: 631-274-9530
Fax: 631-667-2871
E-mail: grhodes@highfrequencyelectronics.com
Tel: 707-544-9977
Fax: 707-544-9375
E-mail: tim@highfrequencyelectronics.com
ADVERTISING SALES — CENTRAL
PUBLISHER — OTHER REGIONS & INTERNATIONAL
Keith Neighbour
Scott Spencer
Tel: 773-275-4020
Fax: 773-275-3438
E-mail: keith@highfrequencyelectronics.com
Tel: 603-472-8261
Fax: 603-471-0716
E-mail: scott@highfrequencyelectronics.com
Advertising and media information is available online at www.highfrequencyelectronics.com
November 2008
63
DESIGN NOTES
Jitter and Phase Noise Relationships
Jitter represents the timing error of digital signals,
while phase noise describes the spectral content of
noise in analog systems. There are some key relationships between these two factors, as described below.
While jitter and phase noise are related, they are not
precisely equivalent, i.e., there are no closed-form
mathematical expressions that describe the conversion between them. However, good approximations are
possible, which is how they are usually handled in
analytic environments such as design software.
Figure 1 shows graphical definitions of jitter and
phase noise. Jitter is the time deviation from periodto-period of the clock waveform. RMS jitter is the most
common specification, although there are uses for
peak-to-peak jitter values. Also, jitter is most commonly defined as cycle-to-cycle; as the RMS value of the
deviation from the average period. In some cases, jitter
may also be analyzed as the deviation from the ideal
period.
Phase noise is specified as a plot of amplitude versus offset from the center frequency. A plot is required
because phase noise is not a predictable function.
However, there are three general regions where
approximations can be made. The first is close to fc
where 1/f noise is present. Bipolar transistor oscillators have a 1/f “corner frequency” (where 1/f noise falls
below other noise contributors) around 1 kHz, while
MOSFETs (e.g., CMOS ICs) may have a corner frequency as high as 1 MHz. The next region, which is the
major contributor to total noise, has an amplitude
rolloff of approximately 1/(foffset)3. The final region,
which is farther from fc and lower in amplitude, has a
rolloff of approximately 1/(foffset)2.
A reasonably accurate correlation of phase noise
and jitter can be achieved with a piecewise linear
approximation using these three regions of phase
noise (Fig. 2). The 1/(foffset)3 region is dominant in most
oscillators, and may be used as a first-order approximation as shown in the following equations [2]:
(a) Jitter – time domain
(b) Phase Noise – frequency domain
Figure 1 · Diagrams defining jitter (a) and phase
noise (b).
Region 1
Region 2
Region 3
)3
1/(foffset)2
1/(foffset
L(f)
1/f noise +
phase noise
Frequency: Log (foffset)
Figure 2 · Three regions with generally consistent
phase noise amplitude slopes.
more in-depth mathematical explanations, readers are
directed to the References and other resources.
References
where f = foffset , L(f ) is the phase noise at foffset, and σ
is the jitter. Note that other references may use different notations or derive relationships differently. For
64
High Frequency Electronics
1. “Clock (CLK) Jitter and Phase Noise
Conversion,” Application Note 3359, Maxim Integrated
Products, www.maxim-ic.com
2. Rick Poore, “Phase Noise and Jitter,” Agilent
Technologies, Agilent EEsof EDA, www.agilent.com
The choice is clear
for all your RF needs.
Custom solutions and
standard products from
a single source.
With decades of experience in the
interconnect industry, we know
what’s important to engineers.
That’s why Molex manufactures
the world’s broadest line of radio
frequency connectors, cable
assemblies and custom products.
Our RF solutions can be optimized
to minimize signal loss over a
www.molex.com/product/rf.html
wide range of frequencies in a
broad spectrum of sizes and styles
of connectors. Plus, our serviceoriented team can turn around
drawings in 48 hours and deliver
custom products in less than eight
weeks –– so you can get your
products to market faster.
For the industry’s largest array of
product options backed by reliable
service, turn to Molex –– your
clear choice for RF interconnect
products and solutions.
Get info at www.HFeLink.com
Model
Number
Gain
Noise
VSWR Output DC Power
Frequency
Gain
Flatness
Figure In/Out
Power
@15V
(GHz)
(±dB, Max.) (±dB, Max.) (dB, Max.) (Max.) (dBm, Min.) (mA, Nom.)
AMF-2B-00030300-150-32P 0.03-3
AMF-4D-00100100-30-30P
0.1-1
AMF-3B-00500100-13-33P
0.5-1
AMF-4D-00500200-25-33P
0.5-2
AMF-4B-00800250-50-34P
0.8-2.5
AMF-3B-01000200-35-30P
1-2
AMF-3B-01000200-20-33P
1-2
AMF-5D-01000200-15-33P
1-2
AMF-3D-01000400-45-30P
1-4
AMF-4D-01000400-35-30P
1-4
AMF-4D-01000800-85-30P
1-8
AMF-3B-02000400-20-30P
2-4
AMF-4B-02000400-15-33P
2-4
AMF-5B-02000600-70-33P
2-6
AMF-4B-02000600-70-37P
2-6
AMF-4B-02000800-80-36P
2-8
AMF-3B-02001800-30-30P
2-18
AMF-3B-02001800-60-32P
2-18
AMF-3B-02002000-60-30P
2-20
AMF-5B-04000800-60-30P
4-8
AMF-4B-04000800-50-33P
4-8
AMF-6B-06001800-80-33P
6-18
AMF-2B-06001800-65-35P
6-18
AMF-6B-06001800-120-40P
6-18
20
44
43
40
40
30
35
50
28
39
28
35
50
34
35
40
35
35
40
33
36
35
45
43
2.5
1
1.5
2
3
1
1
1.5
1.5
1.5
2
1
1.5
2
2
2.5
2
2.5
2.5
1.5
1
2.5
3
5
15
3
1.3
2.5
5
3.5
2
1.5
4.5
3.5
8.5
2
1.5
7
7
8
3
6
6
6
5
8
6.5
12
* Negative supply required.
Get info at www.HFeLink.com
2:1/2.5:1
2.2:1
2:1
2:1/2.3:1
2:1/2.3:1
1.8:1
1.5:1
2:1/2.3:1
2:1/2.3:1
2:1/2.3:1
2.2:1
2:1
2:1
2:1
2:1/2.8:1
2:1/2.8:1
2.2:1
2:1/2.3:1
2:1/2.5:1
2:1
2:1
2.1:1/2.2:1
2.1:1/2.2:1
2:1/2.3:1
32
30
33
33
34
30
33
33
30
30
30
30
33
33
37
36
30
32
30
30
33
33
35
40
650*
850
1700
1400
2700
900
1200
1500
800
900
1100
950
1600
2200
4800
4800
2000
4500
4500
1400
1500
3500
6500
12,500