Connecting People and Technology
July
2016
Product Line Card
Includes J-Devices Corporation Packaging
www.amkor.com
www.j-devices.co.jp
Table of Contents
03
04
12
Locations
23
Power
24
Laminate
04..... PBGA
04..... CABGA
06..... FCBGA
07..... Stacked CSP
08..... fcTMV®
08..... fpfcMEP
09..... fcCSP
11...... fcSCSP
12..... PDIP
12..... PowerSOP® (PSOP3)
13..... SOT-23/TSOT
13..... SSOP/QSOP
13..... TSOP
14..... TSSOP/MSOP
14..... SOIC
15..... ExposedPad TSSOP/
MSOP/SOIC/SSOP
16..... TQFP/LQFP
17..... ExposedPad
TQFP/LQFP
18..... MQFP
19..... MQFP PowerQuad®
19..... PLCC
19..... FusionQuad®
20..... MLF®
23..... PSMC
23..... SOD123-FL
23..... SOD128-FL
23..... SOD323-FL
23..... TO-220
23..... TO-220F
23..... TO-220FP
23..... TO-220SMD
23..... TO-251
23..... TO-252JEDEC
23..... TO-252JEITA
23..... TO-263
23..... TO-263 (7-pin)
23..... HSON8
23..... Mini-HVSON (8-pin)
23..... HVSON (8-pin)
23..... SO8-FL
23..... TSON8-FL
Leadframe
Test
24..... Major Testers Platform
24..... Wafer Prober
25..... Conventional Handler
25..... Strip Test/Film Frame Handler
26..... Wafer Test Roadmap
26..... Package Test Roadmap – PnP
27..... About Us
Amkor Worldwide Presence
Strategically Located Factories and Customer Support Centers
Factory Code Legend
Amkor has twenty-two assembly and test manufacturing facilities worldwide.
The product tables indicate which facility manufactures different packages.
China
C3.................Shanghai
Korea
K1.................Seoul
K4.................Gwangju
Japan
JFI.................Fukui
JFO...............Fukuoka
JHD...............Hakodate
JKM..............Kumamoto
JKT...............Kitsuki
JMG..............Miyagi
JUK...............Usuki
Malaysia
ATM..............Kuala Lumpur
Taiwan
T3.................Hsinchu
Philippines
P1.................Muntinlupa City
P3.................Binan Laguna
Amkor Product Line Card • June 2016
3
Laminate Packages
The higher functional capabilities of Amkor’s laminate package technology benefits high power and high speed ICs that require enhanced electrical and thermal performance.
Laminate packages employ a ball grid array design, which utilizes a plastic or tape laminate substrate rather than a leadframe substrate, and places the electrical connections on
the bottom of the package rather than around the perimeter. A substrate is a laminate of multiple layers of epoxy resin, woven glass fibers and metal conductors. Bumps provide
the electrical connection to the system board. The bumps are typically distributed evenly across the bottom surface of the substrate (called a “ball grid array” format). This allows
greater distance between individual leads and a higher number of interconnects than leadframe packages.
Laminate packages are the ideal solution for high-performance applications such as microprocessors/controllers, gate arrays, memory, chipsets, analog, Flash, SRAM, DRAM,
ASICs, DSPs, RF devices and PLDs.
PBGA Packages – Package Dimensions (mm)
Sample
Body Size
PBGA
Lead Count and Pitch
1.0 mm
324
400
484
576
676
780
900
1156
1296
1521
1.27 mm
–
–
289
–
400
–
576
729
841
957
Factory
Package Outline
Drawing #
Data Sheet #
K4, P3
K4, P3
K4, P3
K4, P3
K4, P3
K4, P3
K4, P3
K4, P3
K4, P3
K4, P3
–
–
–
–
–
–
–
–
–
–
DS520
DS520
DS520
DS520
DS520
DS520
DS520
DS520
DS520
DS520
PBGA
19 x 19
21 x 21
23 x 23
25 x 25
27 x 27
29 x 29
31 x 31
35 x 35
37.5 x 37.5
40 x 40
0.8 mm
529
–
–
–
–
–
–
–
–
–
Legend: Blue = Future Packages – Max full array ball count shown – contact Amkor for custom BGA pattern availability.
CABGA Packages – Package Dimensions (mm)
Body Size
2.5 x 2.5
3x3
3.5 x 3.5
4x4
4.5 x 4.5
0.4 mm
36
49
34, 49
48, 49, 64, 81
72
5x5
97, 100, 121
6x6
76
6x6
96, 121, 127, 140, 155
7x7
187, 191
7x7
209, 211, 256
0.5 mm
–
25
36
40, 41, 48,49
–
36, 44, 48, 52, 56, 57, 64,
65, 66, 68, 72, 76, 81
48, 56, 64, 73, 80, 81, 82, 84, 86,
88, 92
96, 97, 100, 101,
105, 111, 112, 113, 120, 121
64, 80, 86, 100, 104, 107, 108, 112,
113, 116
121, 128, 130, 132, 137, 143, 144,
154, 160
8x8
121, 252
8x8
272, 308
8x8
–
Lead Count and Pitch
0.65 mm
–
20
–
–
–
0.8 mm
–
–
–
24
–
1 mm
–
–
–
–
–
1.27 mm
–
–
–
–
–
41, 49, 61, 64
25
–
–
49, 58
36
–
–
64
–
–
–
64, 80
48, 49, 64
–
–
81, 84, 137
–
–
–
56, 80, 100, 108, 112, 113, 120
72, 81, 105, 112, 113, 121
52, 64, 80, 81
–
–
124, 128, 132, 133, 144,
160, 161, 164, 169, 176, 180
195, 196, 208, 219, 224, 225
140
–
–
–
–
–
–
–
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Factory
Data Sheet #
P3
K4, P3, JKT
C3, K4, P3, JKT
C3, K4, P3, JKT
JKT
C3, K4, P3, JHD,
JKT, JMG
C3, K4, P3, JHD,
JKT, JMG
C3, K4, P3, JHD,
JKT, JMG
C3, K4, P3, JKT,
JMG
C3, K4, P3, JKT,
JMG
C3, K4, P3, JHD,
JKT
C3, K4, P3, JHD,
JKT, JMG
C3, K4, P3, JHD
DS550
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
Amkor Product Line Card • July 2016
4
CABGA
CABGA
Sample
CABGA Packages (Cont.) – Package Dimensions (mm)
Sample
Body Size
Data Sheet #
DS550, DSJD405
–
C3, K4, P3, JKT,
JMG
C3, K4, P3, JHD,
JKT, JMG
C3, K4, P3, JKT,
JMG
–
–
C3, K4, P3, JMG
DS550, DSJD405
–
–
DS550
100
–
–
–
–
168, 177, 193
144, 160, 168, 176, 179
121
–
365, 385, 388, 402, 424
208, 209
180, 192, 196
–
–
697, 714, 745
–
–
–
276
–
–
–
13 x 13
–
280, 281, 282, 289, 294
145
108
–
13 x 13
–
281, 286, 289, 304, 325,
337, 341, 345
356, 368, 384, 385, 400, 401, 409,
416, 420, 424
213, 221, 231, 241, 289
180, 225, 240, 248,
273, 277
–
–
328, 336, 348
177, 201, 217, 224, 225
144
–
13 x 13
–
434, 440, 457, 490, 505
361
256
–
–
14 x 14
270
169, 220
192, 233, 256
166, 169
–
14 x 14
681, 683
409, 456, 480, 506, 516, 521, 538,
554, 562, 616
300, 304, 321, 332,
337, 345
379, 387, 400
–
–
–
C3, K4, P3
C3, K4, P3, JHD,
JKT, JMG
C3, K4, P3, JKT,
JMG
C3, K4, P3, JHD,
JKT, JMG
C3, K4, P3, JHD,
JKT, JMG
C3, K4, P3, JKT
C3, K4, P3, JHD,
JKT
C3, K4, P3, JHD,
JKT, JMG
C3, K4, P3, JHD,
JKT, JMG
C3, K4, P3, JHD,
JKT, JMG
C3, K4, P3, JHD,
JKT, JMG
C3, K4, P3, JHD,
JMG
–
–
C3, K4, P3, JHD,
JKT, JMG
DS550, DSJD405
160, 176, 196
–
C3, K4, P3, JHD,
JKT, JMG
C3, K4, P3, JKT,
JMG
C3, K4, P3, JHD,
JMG
C3, K4, P3, JHD,
JKT, JMG
DS550, DSJD405
0.5 mm
128, 156, 188, 201, 208, 220,
225, 265
216, 360, 384
10 x 10
387, 409
10 x 10
424, 454
10 x 10
456
11 x 11
432, 440, 452
167, 204, 223
11 x 11
476, 576
12 x 12
216, 455, 487, 547
256, 280, 289, 305, 317, 337,
361, 416
232, 236, 244, 260, 272, 273, 291,
304, 308, 320, 329, 337, 343, 345
12 x 12
560, 569, 580, 617
12 x 12
13 x 13
9x9
10 x 10
296, 383
0.8 mm
1 mm
1.27 mm
109, 121, 141, 144
81, 97, 100
–
–
173, 179, 180
145, 164
81
–
181, 192, 200, 209, 216, 221,
224, 225, 233, 235, 240, 241
244, 257, 267, 268, 273, 284,
285, 289, 292, 296, 297, 328
336, 345, 346
96, 100, 104, 112,
120, 121, 128, 144
183
–
–
196
–
–
121, 165, 176, 177,
192, 196
200, 201, 204, 208, 209,
225, 241
–
108, 128, 132, 141,
144, 169
15 x 15
–
393, 400, 464, 481, 543, 586,
603, 605
321, 339, 349, 351
188, 208, 209, 217, 220,
228, 233, 240, 255, 260,
261, 265, 288, 289
15 x 15
–
617, 642, 647, 650
352, 361, 368, 386, 409
319, 324
609, 610, 624, 770
304, 324, 352, 360, 385,
423, 426, 441, 445, 477
224, 260, 280, 288, 285,
360, 361
281, 457
208, 256, 268, 272, 292
16 x 16
17 x 17
–
–
–
17 x 17
–
540, 604, 608, 721
508, 532, 600
18 x 18
–
753, 770, 842, 906
388
19 x 19
21 x 21
–
–
–
–
–
–
308, 316, 318, 320,
324, 326, 358, 364, 400
256, 272, 320, 321, 369,
386, 441
340, 505, 529
440, 449, 490, 537
23 x 23
–
–
–
27 x 27
–
–
31 x 31
–
–
35 x 35
–
–
174, 225
–
199, 208, 224, 228,
252, 256
136, 164
–
–
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
CABGA
CABGA
Lead Count and Pitch
0.65 mm
Factory
0.4 mm
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
–
–
JKT, JMG
DSJD405
260, 321
–
–
–
JHD, JKT, JMG
JHD, JMG
DSJD405
DSJD405
552
324, 352, 484
–
JKT, JMG
DSJD401, DSJD405
–
796
JKT
DSJD401
–
421
JKT
DSJD401
–
–
416, 420, 456, 484, 507, 516
564, 576, 577, 613, 620,
626, 640, 641, 706
729, 814, 868, 1012
256
–
484
JKT
DSJD401
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
5
FCBGA Packages – Package Dimensions (mm)
Sample
Body Size
FCBGA
0.65 mm
196
256
289
361
400
484
529
625
784
961
1156
1369
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Lead Count and Pitch
0.8 mm
121
144
196
225
256
289
361
400
436, 484
472, 604, 625
524, 672, 729
560, 593, 653, 900
815, 831, 832, 873, 1024, 1089
830, 1225, 1225
1369
1600
1764
1936, 2025
–
–
–
–
–
–
–
–
–
–
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
1 mm
81
100
121
144
169
196
225
256
320, 324
400
484
572
576, 605, 625, 676
554, 640, 729, 784
900, 900
961, 1020, 1024
924, 1089, 1136, 1152, 1156
1256, 1262, 1278, 1296, 1369
1444, 1521
1681
1848, 1936
2116
2401
2601
2916
3136
3481
4096
1.27 mm
–
–
–
–
–
–
–
–
–
–
–
360
360
–
304
–
–
784
–
–
–
–
–
–
–
–
–
–
Factory
Data Sheet #
K4, T3
K4, T3
K4, T3, JKM
K4, T3
K4, T3, JKM
K4, T3, JKM
K4, T3
K4, T3, JHD
K4, T3, JKM
K4, T3, JHD, JKM
K4, T3, JHD, JKM
K4, T3, JKM
K4, T3, JHD, JKM
K4, T3, JKM
K4, T3, JHD, JKM
K4, T3, JHD, JKM
K4, T3, JHD, JKM
K4, T3, JHD, JKM
K4, T3, JKM
K4, T3, JHD, JKM
K4, T3, JKM
K4, T3, JHD, JKM
K4, T3
K4, T3
K4, T3
K4, T3
K4, T3
K4, T3
DS831
DS831
DS831, DSJD406
DS831
DS831, DSJD406
DS831, DSJD406
DS831
DS831, DSJD406
DS831, DSJD406
DS831, DSJD406
DS831, DSJD406
DS831, DSJD406
DS831, DSJD406
DS831, DSJD406
DS831, DSJD406
DS831, DSJD406
DS831, DSJD406
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS550, DSJD405
DS831
DS831
DS831
DS831
DS831
DS831
Amkor Product Line Card • July 2016
6
FCBGA
0.4 mm
0.5 mm
10 x 10
576
361
11 x 11
676
441
12 x 12
455, 841
529
13 x 13
961
625
14 x 14
681, 1156
460, 729
15 x 15
1296
605, 647, 841
16 x 16
1521
961
17 x 17
–
–
19 x 19
–
–
21 x 21
–
–
23 x 23
–
–
25 x 25
–
–
27 x 27
–
–
29 x 29
–
–
31 x 31
–
–
33 x 33
–
–
35 x 35
–
–
37.5 x 37.5
–
–
40 x 40
–
–
42.5 x 42.5
–
–
45 x 45
–
–
47.5 x 47.5
–
–
50 x 50
–
–
52.5 x 52.5
–
–
55 x 55
–
–
57.5 x 57.5
–
–
60 x 60
–
–
65 x 65
–
–
Full Array Ball Counts (ball count shown indicates maximum package size produced to date)
Stacked CSP (SCSP) Packages – Package Dimensions (mm)
Body Size
3x3
3.5 x 3.5
4x4
4.5 x 4.5
5x5
6x6
6x8
6.2 x 7.2
6.6 x 6.9
7x7
7 x 10
7.5 x 7.5
0.4 mm
–
–
81
–
97
140
181
–
–
209, 211
–
210
8x8
252
8x9
8 x 9.2
8 x 10
8 x 11
8 x 11.6
8 x 12
9x7
9x9
9 x 11
9 x 12
10 x 10
10 x 11
10 x 12
10 x 13
10 x 13.5
10 x 14
10.5 x 10.5
10.5 x 13
11 x 8
11 x 11
11 x 11.5
11 x 13
11 x 13.5
11 x 14
11.5 x 11.5
11.5 x 13
–
–
–
–
–
–
–
296
–
–
360, 387
–
–
–
–
–
–
–
–
432
–
–
–
–
–
–
0.5 mm
25
48, 49
41, 48
40, 60
56, 64, 65, 72, 76, 77, 81
64, 76, 84, 96, 97, 100, 121
–
96
105
84, 117, 121, 143, 144, 160, 169
52, 210
–
113, 120, 128, 160, 161, 176,
196, 208, 225
153
44
–
–
–
–
–
128, 204, 216, 225, 236
–
–
173, 180, 216, 259, 268, 328, 345
153
–
–
–
–
316
–
133
225, 256
–
–
–
–
–
153, 162, 221
–
–
–
98
–
–
Lead Count and Pitch
0.65 mm
0.75 mm
–
–
–
–
–
–
–
–
49
–
49, 64
–
–
54
–
–
–
–
64, 81, 84
81
–
–
–
–
–
105, 140
92, 100
64
–
–
–
C3, K4
–
DS573
–
–
–
–
–
–
–
–
–
–
130
–
130
–
–
–
–
124, 144, 160
165
132, 192
196
–
–
–
–
–
–
–
–
200
134
–
162
225
134
134
–
–
–
–
–
–
–
121
–
–
144
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
56, 88
73
66,67 ,74
56
81, 100
63, 103, 105
107, 130
100, 121, 128, 144
63
79, 88
63
149
96
–
107, 137
72, 88, 107, 133
144, 169
–
105, 135
–
–
–
–
–
–
–
–
–
44
–
–
–
–
409
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
K4
K4
JKT
C3, K4
K4
K4
K4
K4
C3, K4
JKT
C3, K4
JKT
K4
C3
JKT
K4
K4
C3, K4, JKT
K4
K4
K4
C3, K4
K4
JKT
K4
K4, JKT
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
DS573
DS573
–
DS573
DS573
DS573
DS573
DS573
DS573
–
DS573
–
DS573
DS573
–
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
–
DS573
DS573
0.6 mm
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Factory
Package Outline Data Sheet #
Drawing #
0.8 mm
–
–
–
–
–
–
63
–
–
49
81
–
1 mm
–
–
–
–
–
–
48
–
–
–
–
–
1.27 mm
–
–
–
–
–
–
–
–
–
–
–
–
2 mm
–
–
–
–
–
–
–
–
–
–
–
–
K4
K4
K4
K4
K4
K4
K4
K4
K4
C3, K4
C3, JKT
K4
–
–
–
–
–
–
–
–
–
–
–
–
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
64
–
–
–
–
–
468
–
–
–
–
–
–
Amkor Product Line Card • July 2016
Stacked CSP
Stacked CSP
Sample
7
Stacked CSP (SCSP) Packages (Cont.) – Package Dimensions (mm)
Body Size
0.4 mm
12 x 12
216
12 x 16
12 x 17
12 x 18
13 x 13
14 x 14
14 x 18
14 x 22
15 x 15
17 x 17
19 x 19
–
–
–
–
270
–
–
–
–
–
0.5 mm
168, 228, 260, 272, 277, 289,
318, 385
132, 169
–
169
289, 325, 341, 401, 417
220, 240, 348, 409, 516
169
–
543
–
–
0.6 mm
Lead Count and Pitch
0.65 mm
0.75 mm
–
208
–
–
–
–
–
–
–
–
–
–
–
–
–
199
294
151, 152, 300
–
–
160, 272
–
–
–
–
–
–
–
–
–
–
–
–
0.8 mm
117, 128, 144, 160, 161,
168, 179, 196
224
–
100, 224
225
134
52, 53, 152
–
208, 255, 289
208, 256
361, 484
Package Outline Data Sheet #
Drawing #
Factory
1 mm
1.27 mm
2 mm
–
–
–
C3, K4
–
DS573
–
–
132
144
–
–
–
–
–
–
119
–
–
–
–
60
–
–
–
52
–
–
–
–
K4, JKT
K4
K4, JKT
K4
C3, K4
K4, JKT
K4
K4
K4
K4
–
–
–
–
–
–
–
–
–
–
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
DS573
100, 152
–
196
256
260, 324
Stacked CSP
Stacked CSP
Sample
fcTMV® Packages – Nominal Package Dimensions (mm)
Body Size
Lead
Count
BGA Size
Ball Count
Package Height
Ball Pitch
Tray
Matrix
Units
Per Tray
Factory
Package Outline
Drawing #
Data
Sheet #
9.9 x 5.9
12 x 12
12 x 12
14 x 14
17.25 x 17.10
180
569
745
31
272
0.25
0.25
0.27/0.25
0.25/0.25
N/A
180
569
745
031
272
0.68
1.15
0.78
0.728
0.82
0.5
0.4
0.40/0.566
0.40/0.40
0.772
9 x 32
9 x 21
8 x 21
8 x 19
6 x 15
288
189
168
152
90
K4
K4
K4
K4
K4
595217PO
438336PO
452573PO
740428PO
528556PO
–
–
–
–
–
fcTMV®
fcTMV®
Sample
*Simulated Results @ 100 MHz
Sample
Body Size
Lead
Count
BGA Size
Ball Count
Package Height
Ball Pitch
Tray
Matrix
Units
Per Tray
Factory
Package Outline
Drawing #
Data
Sheet #
N/A
15 x 15.2
15.6 x 15
15.6 x 15
994
44
994
N/A
N/A
N/A
994
1044
994
N/A
N/A
N/A
0.27 (0.50)
0.27 (0.50)
0.40 (0.27)
7 x 17
7 x 17
7 x 17
119
119
119
K4
K4
K4
–
–
–
–
–
–
FPFCMEP
FPFCMEP
fpfcMEP Packages – Nominal Package Dimensions (mm)
*Simulated Results @ 100 MHz
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
8
fcCSP Packages – Nominal Package Dimensions (mm)
17
Body Size
Lead
Count
BGA Size
Ball Count
Package Height
Ball Pitch
Tray
Matrix
Units
Per Tray
Factory
Package Outline
Drawing #
Data
Sheet #
2 x 2.8
2x4
2.21 x 3.05
3x3
3 x 7.5
3x8
3.2 x 2.8
4x4
4.2 x 3.3
5x5
5x5
5x5
5x6
5x6
5x6
5x6
5x7
5x7
5.3x 5.25
5.4 x 6.2
6x6
6x6
6x6
6x6
6 x 6.6
6.2 x 7.8
6.5 x 6.5
6.5 x 6.5
6.6 x 5.8
6.6 x 6.6
6.7 x 8
6.8 x 6.2
6.9 x 7.8
7x7
7x7
7x7
7x7
7x7
7x7
7 x 7.5
7x9
7x9
7.4 x 8.2
7.5 x 7.5
7.5 x 8.5
7.8 x 7.8
24
32
17
40
53
48
21
21
44
33
39
64
53
102
102
102
97
136
36
152
81
105
105
121
364
196
97
144
56
195
136
90
326
64
64
64
191
196
256
277
208
252
302
221
324
251
0.3
0.3
N/A
0.25
0.5
0.5
LGA
LGA
0.3
LGA
LGA
0.3
LGA
0.3
0.25
0.25
0.25
0.3
LGA
0.3
0.3
0.2
0.3
0.3
NA
0.25
0.25
0.3
0.5
0.3
0.3
0.3
0.2
0.5
0.5
0.5
0.3
0.3
0.3
0.3
0.3
0.3
0.2
0.3
0.3
0.3
24
32
17
40
53
48
21
21
44
33
36
64
53
102
102
102
97
136
36
152
81
105
105
121
NA
196
97
144
56
195
136
90
326
64
64
64
191
196
256
277
208
252
302
221
324
251
0.17
0.17
N/A
1.15 max.
1.2
1.15
0.88
0.9
0.93
0.9
0.72
0.88
1.1
0.74
0.73
0.73
1.00 max.
0.88
0.72
0.9
0.85
0.889 max
0.92
0.73
1
1.00 max.
0.77
1
1.17
0.8
1.49
0.88
0.82 max.
1.11
1.596
1.506
0.95
0.88
0.93
0.82
1
0.92
0.79
0.82
0.82
0.88
0.4
0.4
0.5
0.4
0.5
0.65
0.4
0.5
0.4
0.5
0.4
0.7
0.4
0.5
0.452 min.
0.452 min.
0.5
0.4
0.5
0.4
0.5
0.46/0.65
0.5
0.5
NA
0.4
0.4
0.5
0.8
0.4
0.5
0.7
0.4
0.8
0.8
0.8
0.4
0.5
0.4
0.4
0.4
0.5
0.4
0.4
0.4
0.4
14 x 35
14 x 35
14 x 35
14 x 35
14 x 26
14 x 26
14 x 35
14 x 35
14 x 26
14 x 35
14 x 35
N/A
14 x 35
N/A
13 x 31
13 x 31
14 x 26
14 x 26
N/A
14 x 26
13 x 33
12 x 29
14 x 35
14 x 35
14 x 26
12 x 25
10 x 26
N/A
12 x 28
N/A
12 x 25
10 x 26
10 x 26
N/A
N/A
N/A
10 x 26
10 x 26
N/A
12 x 29
N/A
13 x 25
10 x 26
10 x 26
10 x 26
10 x 26
490
490
490
490
364
364
490
490
364
490
490
N/A
490
N/A
403
403
364
364
N/A
364
429
348
490
490
364
300
260
N/A
336
N/A
300
260
260
N/A
N/A
N/A
260
260
N/A
348
N/A
325
260
260
260
260
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
744167PO0C
718064PO0B
No POD
652316PO
607973PO0A
610538PO
421994PO
480926PO
N7170-1
463062PO0A
6439789PO
500693PO0B
411115PO
434380PO0A
437557PO
437557PO
568933PO
VN041-1
477833PO0A
637713PO
568993PO
684126PO
VN346-1
412011PO
N9650-1
358233PO
488013PO
429130PO0A
656455PO
442617PO0A
607179PO
481017PO0A
742710PO
487086PO
495076PO
496907PO
VK575-1
577133PO
429501PO0A
438217PO
445259PO0A
675144PO
757705PO
409303PO
562538PO
N2703-1
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
fcCSP
fcCSP
Sample
*Simulated Results @ 100 MHz
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
9
fcCSP Packages (Cont.)– Nominal Package Dimensions (mm)
Body Size
Lead
Count
BGA Size
Ball Count
Package Height
Ball Pitch
Tray
Matrix
Units
Per Tray
Factory
Package Outline
Drawing #
Data
Sheet #
8 x 13
8 x 13.5
8 x 6.5
8x8
8x8
8x8
8.1 x 8.1
8.5 x 10.5
8.5 x 11
8.6 x 7.7
8.8 x 8.8
9.5 x 7.5
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10.5
10.6 x 10.6
10.7 x 10.7
10.9 x 10.9
10.9 x 10.9
11 x 11
11 x 11
11 x 11
11 x 11
11 x 13.5
11 x 8
11.7 x 11.6
11.7 x 11.7
12 x 12
12 x 12
12 x 12
12 x 12
12 x 12
12 x 12
12 x 12
12 x 12
12 x 12
135
253
53
69
165
188
157
479
269
76
176
314
69
69
116
144
144
235
284
297
391
424
454
521
268
54
337
469
469
169
325
361
576
325
300
539
492
121
121
121
121
288
424
424
425
488
0.46
0.5
LGA
0.8
0.3
0.3
0.3
0.2
0.3
0.4
0.3
0.3
1
0.5
0.3
0.46
0.5
0.3
0.3
0.3
0.3
0.25
N/A
0.3
0.3
0.45
0.2
0.3
0.3
0.4
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.5
0.6
0.64
0.6
0.3
0.3
0.3
0.3
0.3
135
253
50
69
165
188
157
479
269
76
176
314
69
69
116
144
144
235
284
297
391
424
454
521
268
54
337
469
469
169
325
361
576
325
300
539
492
121
121
121
121
288
424
424
425
488
2.36
1.32
1.1
2.91
0.76
0.9
0.99
0.8
0.84
0.94
0.88
0.84 ±0.10
2.91
1.16
1.05
1.91
1.4
0.86 ±0.10
0.98
1
1
0.95 max.
N/A
0.86 ±0.10
0.86 ±0.10
0.85
0.889 max.
0.9
0.9
0.85
0.91
0.89
1.05
1.06
0.84
0.9
0.9
1.51
1.82
2.57
2.09 max.
1.30 max.
1.05
1.05
1.05
0.96
0.8
0.5/0.6
0.4
0.8
0.5
0.5
0.5
0.4
0.5
0.8
0.7
0.4
1
1
0.8
0.8
0.8
0.5
0.5
0.5
0.4
0.4
0.4
0.4
0.5
0.65
0.46/0.65
0.4
0.4
0.8
0.5
0.5
0.4
0.5
0.4
0.4
0.4
1
1
1
1
0.67
0.5
0.5
0.5
0.4
N/A
10 x 17
10 x 26
10 x 26
12 x 29
N/A
10 x 26
22 x 10
10 x 21
12 x 28
10 x 26
10 x 21
8 x 23
8 x 23
N/A
8 x 21
8 x 23
8 x 23
8 x 21
8 x 21
8 x 23
8 x 21
8 x 21
8 x 21
8 x 20
8 x 21
9 x 21
8 x 21
8 x 21
8 x 22
8 x 22
8 x 22
8 x 22
8 x 17
N/A
9 x 21
9 x 21
8 x 21
8 x 19
8 x 20
9 x 21
8 x 20
9 x 21
9 x 21
N/A
8 x 21
N/A
170
260
260
348
N/A
260
220
210
336
26
210
184
184
N/A
168
184
184
168
168
184
168
168
168
160
168
189
168
168
176
176
176
176
136
N/A
189
189
168
152
160
189
160
189
189
N/A
168
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
670744PO
468833PO
476666PO
87180PO
638236PO
492338PO
604909PO
647400PO
497854PO
559715PO
NT90-Y5378-1
472295PO0D
303399PO
443458PO
406269PD0A
464793PO
686544PO
431863PO0A
344519PO
N3944-1
611696PO
438402PO
No POD
451777PO0B
461677PO0A
715264PO
617598PO
636373PO
710371PO
679034PO
583696PO
695725PO
N2970-1
606183PO
439355PO0A
558280PO
640560PO
339265PO
408392PO
585453PO
613853PO
434097PO
VB699-2
VB699-5
491076PO
697685PO
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
fcCSP
fcCSP
Sample
*Simulated Results @ 100 MHz
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
10
fcCSP Packages (Cont.)– Nominal Package Dimensions (mm)
Body Size
Lead
Count
BGA Size
Ball Count
Package Height
Ball Pitch
Tray
Matrix
Units
Per Tray
Factory
Package Outline
Drawing #
Data
Sheet #
12 x 14
12.1 x 13.3
12.2 x 9.8
12.6 x 12.6
13 x 10
13 x 13
13 x 13
13 x 13
13 x 13.4
13.3 x 12.1
13.3 x 12.1
13.3 x 12.1
13.8 x 13.8
13.9 x 12.3
14 x 12
14 x 12
14 x 12
14 x 14
14 x 14
14 x 14
15 x 15
15 x 15
15 x 15
15 x 15
16 x 16
17 x 17
821
597
486
669
517
144
225
357
873
570
570
600
288
255
720
727
760
617
617
625
195
484
990
992
536
358
0.3
0.3
0.25
0.25
0.3
0.5
0.46
0.4
0.25
0.3
0.3
0.3
0.5
0.4
0.3
0.3
0.3
0.3
0.3
0.3
0.6
0.4
N/A
N/A
0.3
0.46
821
597
486
669
517
144
225
357
873
570
570
600
288
255
720
727
760
617
617
625
195
484
990
992
536
358
0.94
0.9
1.00 max.
1.00 max.
1.673
1.51
1.89 max.
1.62
0.90 max.
0.9
0.9
0.9
1.62
1.29 max.
0.15
0.15
0.96
1.21
0.91
0.98
1.8
1.22 max.
N/A
N/A
1.35
1.7 max.
0.4
0.4
0.4
0.4
0.5
1
0.8
0.7
0.4
0.4
0.4
0.4
0.7
0.8
0.4
0.4
0.4
0.5
0.5
0.5
1
0.65
0.40(0.50)
0.4
0.5
0.8
7 x 20
7 x 17
8 x 24
8 x 19
8 x 24
8 x 20
8 x 20
7 x 17
7 x 17
7 x 20
7 x 20
7 x 20
7 x 17
7 x 17
8 x 17
8 x 17
8 x 17
7 x 17
7 x 17
7 x 17
7 x 18
7 x 17
7 x 18
7 x 17
6 x 15
N/A
140
117
192
152
192
160
160
119
119
140
140
140
119
119
136
136
136
119
119
119
126
119
126
119
90
N/A
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
685510PO
629993PO
360006PO
359715PO
548093PO
452287PO
481847PO
500908PO0C
751666PO
591657PO
654178PO
710373PO
NT90-NH568-1
446695PO
769163PO0A
NT90-P1720-1-rev-A
700025PO
465801PO
473925PO
751921PO
607829PO
617815PO
No POD
No POD
637699PO
358903PO
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
DS577
fcCSP
fcCSP
Sample
*Simulated Results @ 100 MHz
fcSCSP Packages – Nominal Package Dimensions (mm)
Body Size
Lead
Count
BGA Size
Ball Count
Package Height
Ball Pitch
Tray
Matrix
Units
Per Tray
Factory
Package Outline
Drawing #
Data
Sheet #
6.7 x 4
8.6 x 8.2
9x9
9 x 8.2
8.6 x 8.4
9.9 x 8.6
12 x 12
13 x 11.5
110
333
383
441
443
460
640
775
0.25
0.25
0.25
N/A
0.195
0.25
0.25
N/A
110
333
383
441
443
460
640
775
1.26
1.00max.
1.11 max.
N/A
0.75 max.
0.65 max.
1.08
N/A
0.4
0.4
0.4
0.35
0.35
0.4
0.4
0.35(0.65)
11 x 35
10 x 26
10 x 26
10 x 26
9 x 23
8 x 22
9 x 21
8 x 21
385
260
260
260
207
176
189
168
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
C3, K4
658535PO
487887PO
446263PO
No POD
638413PO
612182PO
690104PO
No POD
–
–
–
–
–
–
–
–
fcSCSP
fcSCSP
Sample
*Simulated Results @ 100 MHz
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
11
Leadframe Packages
Leadframe packages been an industry standard for many years. Two of Amkor’s most popular traditional leadframe package types are Small Outline Integrated Circuit (SOIC) and
Quad Flat Package (QFP), also commonly known as “dual” and “quad” products, respectively, based upon the number of sides from which the leads extend.
Leadframe packages use wirebond or flip chip technology to interconnect a die to a leadframe package carrier. Leadframe packages are used in many electronic devices and
remain the most practical and cost-effective solution for many low to medium pin count applications.
Dual packages are common in memory, analog ICs and microcontrollers found in consumer and automotive products. They provide an assortment of packaging capabilities,
especially in low pin count devices, at competitive manufacturing costs.
Quad packages are extensively used in ASICs, DSPs, microcontrollers and memory ICs. A wide range of open and closed tools in quad packages offer low cost and reliable
solutions for moderate and low pin count ICs.
PDIP Packages – Nominal Package Dimensions (mils)
Electrical Performance
Lead
Count
Shoulder
Width
Body
Width
Body
Length
Body
Thickness
Standoff
Lead
Pitch
JEDEC
Pad Size
(mm)
Lead
8
14
16
18
20
22
24
24
28
28
40
48
300
300
300
300
300
400
300
600
300
600
600
600
252
252
252
252
252
340
252
540
288
540
540
540
365
750
750
900
1030
1095
1250
1250
1365
1450
2060
2430
130
130
130
130
130
150
130
150
130
150
150
160
15
15
15
15
15
15
15
15
20
15
15
15
100
100
100
100
100
100
100
100
100
100
100
100
MS-001
MS-001
MS-001
MS-001
MS-001
MS-010
MS-001
MS-011
MO-095
MS-011
MS-011
MS-011
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Factory
Package
Outline
Drawing #
Data
Sheet #
–
–
–
–
–
–
–
–
–
–
–
–
P1
P1
P1
P1
P1
P1
P1
P1
P1
P1
P1
P1
00290
00291
30170
00292
00293
30125
30124
00289
30791
00286
00284
30123
DS397
DS397
DS397
DS397
DS397
DS397
DS397
DS397
DS397
DS397
DS397
DS397
Self
Resistance
(mΩ)
30.6
9.42
–
–
–
–
Factory
Package
Outline
Drawing #
Data
Sheet #
P1
41013
DS320
P1
P1
P1
P1
41013
41013
41013
41013
DS320
DS320
DS320
DS320
Self
Bulk
Self
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
PDIP
PDIP
Sample
PowerSOP® 3 (PSOP3) Packages – Nominal Package Dimensions (mm)
Electrical Performance*
Lead
Count
Body
Width
Body
Length
Body
Thickness
Standoff
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC
Pad Size
(mm)
Lead
20
11.0
15.9
3.15
0.20
3.35
1.27
14.2
MO-166
7.5 x 7.9
24
30
36
44
11.0
11.0
11.0
11.0
15.9
15.9
15.9
15.9
3.15
3.15
3.15
3.15
0.20
0.20
0.20
0.20
3.35
3.35
3.35
3.35
1.00
0.80
0.65
0.65
14.2
14.2
14.2
14.2
MO-166
MO-166
MO-166
MO-166
–
–
–
–
Longest
Shortest
–
–
–
–
Self
Inductance
(nH)
3.130
1.540
–
–
–
–
Bulk
Capacitance
(pF)
1.990
0.604
–
–
–
–
*Simulated Results @ 100 MHz
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
12
PSOP3
PSOP3
Sample
SOT-23/TSOT Packages – Nominal Package Dimensions (mm)
TSOT (TSOP)
Body
Width
Body
Length
Body
Thickness
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC/EIAJ
Factory
Package Outline
Drawing #
Data
Sheet #
3
4
5
6
8
3
5
6
8
1.3
1.3
1.6
1.6
1.6
1.6
1.6
1.6
1.6
2.9
2.9
2.9
2.9
2.9
2.9
2.9
2.9
2.9
0.90
0.90
1.15
1.15
1.15
0.88
0.88
0.88
0.88
0.98
0.98
1.23
1.23
1.23
0.96
0.96
0.96
0.96
0.95/1.9
1.92
0.95/1.9
0.95
0.65
0.95/1.9
0.95
0.95
0.65
2.40
2.40
2.80
2.80
2.80
2.75
2.75
2.75
2.75
SOT346/TO-236/SC-59
SOT143/TO-253
MO-178
MO-178
MO-178
N/A
MO-193
MO-193
MO-193
P1
P1
P1
P1
P1
P1
P1
P1
P1
471228
471228
471229
471229
471229
353251/41211
353251/41211
353251/41211
353251/41211
DS581
DS581
DS581
DS581
DS581
DS581
DS581
DS581
DS581
SSOP/QSOP Packages – Nominal Package Dimensions (inches unless otherwise specified)
Body
Width
Body
Length
Body
Thickness
Standoff
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC
14/16
5.3 mm (209 mil)
6.2 mm
1.73 mm
0.13 mm
1.86 mm
0.65 mm
7.80 mm
20
5.3 mm (209 mil)
7.2 mm
1.73 mm
0.13 mm
1.86 mm
0.65 mm
7.80 mm
24
5.3 mm (209 mil)
8.2 mm
1.73 mm
0.13 mm
1.86 mm
0.65 mm
7.80 mm
MO-150
–
28
5.3 mm (209 mil)
10.2 mm
1.73 mm
0.13 mm
1.86 mm
0.65 mm
7.80 mm
MO-150
3.9 x 5.1
16
0.150
0.194
0.058
0.006
0.064
0.0250
0.236
MO-137
20
0.150
0.342
0.058
0.006
0.064
0.0250
0.236
24
0.150
0.342
0.058
0.006
0.064
0.0250
28
0.150
0.391
0.058
0.006
0.064
0.0250
Factory
Package
Outline
Drawing #
Data
Sheet #
–
19.0
9.10
–
21.5
9.57
–
P1
32289
DS360
P1
32289
DS360
P1
32289
DS360
P1
32289
DS360
P1
32864
DS360
–
–
P1
32864
DS360
–
0.463
0.206
–
21.5
9.57
P1
32864
DS360
P1
32864
DS360
Package
Outline
Drawing #
Data
Sheet #
MTPL
DS330
Self
Bulk
Self
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
Pad Size
(mm)
Lead
MO-150
–
MO-150
3.9 x 5.4
–
–
Longest
Shortest
–
Longest
Shortest
–
–
2.260
0.958
–
2.510
0.928
–
–
0.395
0.209
–
0.463
0.206
–
MO-137
2.4 x 3.6
–
–
0.236
MO-137
–
0.236
MO-137
2.4 x 4.8
–
Longest
Shortest
–
2.510
0.928
*Simulated Results @ 100 MHz
QSOP
QSOP
Electrical Performance*
Lead
Count
SSOP
SSOP
Sample
TSOT (TSOP)
Lead
Count
SOT-23
SOT-23
Sample
TSOP Package – Nominal Package Dimensions (mm)
Electrical Performance
Lead
Count
Body
Width
Body
Length
Body
Thickness
Standoff
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC
Pad Size
(mm)
Lead
48
12.00
18.40
1.0
–
1.1
0.50
20.00
MO-142
–
–
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Self
Bulk
Self
Factory
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
–
–
–
C3
Amkor Product Line Card • July 2016
13
TSOP 1
TSOP 1
Sample
TSSOP/MSOP Packages – Nominal Package Dimensions (mm)
MSOP
Body
Width
Body
Length
Body
Thickness
Standoff
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC
Pad Size
(mm)
Lead
8
4.4
3.0
0.90
0.10
1.00
0.65
6.4
MO-153
–
14
16
20
24
4.4
4.4
4.4
4.4
5.0
5.0
6.5
7.8
0.90
0.90
0.90
0.90
0.10
0.10
0.10
0.10
1.00
1.00
1.00
1.00
0.65
0.65
0.65
0.65
6.4
6.4
6.4
6.4
MO-153
MO-153
MO-153
MO-153
–
–
–
–
28
4.4
9.7
0.90
0.10
1.00
0.65
6.4
MO-153
–
38
48
4.4
6.1
9.7
12.5
0.90
0.90
0.10
0.10
1.00
1.00
0.50
0.50
6.4
8.1
MO-153
MO-153
–
–
56
6.1
14.0
0.90
0.10
1.00
0.50
8.1
MO-153
–
8
10
3.0
3.0
3.0
3.0
0.85
0.85
0.10
0.10
0.95
0.95
0.65
0.50
5.0
5.0
MO-187
MO-187
–
–
Longest
Shortest
–
–
–
–
Longest
Shortest
–
–
Longest
Shortest
–
–
SOIC Packages – Nominal Package Dimensions (inches)
Standoff
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC
Pad Size
(mm)
Lead
0.150
0.150
0.150
0.194
0.342
0.391
0.058
0.058
0.058
0.006
0.006
0.006
0.064
0.064
0.064
0.050
0.050
0.050
0.236
0.236
0.236
MS-012
MS-012
MS-012
–
–
–
–
–
–
Longest
Shortest
–
–
–
–
Longest
Shortest
SOIC Narrow
Body
Thickness
8
14
16
8
0.208
0.208
0.071
0.004
0.075
0.050
0.311
N/A
3.6 x 2.3
16
18
20
24
0.300
0.300
0.300
0.300
0.407
0.456
0.505
0.607
0.092
0.092
0.092
0.092
0.009
0.009
0.009
0.009
0.101
0.101
0.101
0.101
0.050
0.050
0.050
0.050
0.406
0.406
0.406
0.406
MS-013
MS-013
MS-013
MS-013
–
–
–
–
28
0.300
0.706
0.092
0.009
0.101
0.050
0.406
MS-013
6.4 x 4.8
*Simulated Results @ 100 MHz
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Self
Bulk
Self
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
–
–
–
1.25
0.718
–
–
–
–
5.05
1.42
–
–
–
0.263
0.218
–
–
–
–
1.09
0.345
–
–
–
8.2
5.1
–
–
–
–
28.7
8.04
38118
DS350
38118
38118
38118
38118
DS350
DS350
DS350
DS350
38118
DS350
38118
38119
DS350
DS350
38119
DS350
DS350
DS350
Factory
Package
Outline
Drawing #
Data
Sheet #
P1
P1
P1
00019
00019
00019
DS370
DS370
DS370
P1
336420
DS370
P1
P1
P1
P1
00020
00020
00020
00020
DS370
DS370
DS370
DS370
P1
00051
DS370
Amkor Product Line Card • July 2016
14
SOIC Wide
Body
Length
Data
Sheet #
SOIC Narrow
Body
Width
Package
Outline
Drawing #
37830
37830
Electrical Performance*
Lead
Count
SOIC Wide
Sample
Self
Bulk
Self
Factory
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
1.470
0.224
13.7
P1
0.725
0.177
7.5
–
–
–
P1
–
–
–
P1
–
–
–
P1
–
–
–
P1
2.100
0.368
16.1
P1
0.713
0.180
6.8
–
–
–
P1
–
–
–
P1
4.040
0.631
36.5
P1
1.380
0.213
16.2
–
–
–
P1
–
–
–
P1
MSOP
*Simulated Results @ 100 MHz
Electrical Performance*
Lead
Count
TSSOP
TSSOP
Sample
ExposedPad TSSOP/MSOP/SOIC/SSOP Packages – Nominal Package Dimensions (mm)
ePad SSOP ePad SOIC ePad MSOP
Body
Width
Body
Length
Body
Thickness
Standoff
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC
Pad Size
(mm)
Center
Inductance
(nH)
Corner
Inductance
(nH)
Factory
Package
Outline
Drawing #
Data
Sheet #
8
14
16
20
24
28
38
48
56
4.4
4.4
4.4
4.4
4.4
4.4
4.4
6.1
6.1
3.0
5.0
5.0
6.5
7.8
9.7
9.7
12.5
14.0
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.00
0.65
0.65
0.65
0.65
0.65
0.65
0.50
0.50
0.50
6.40
6.40
6.4 0
6.40
6.40
6.40
6.40
8.10
8.10
MO-153
MO-153
MO-153
MO-153
MO-153
MO-153
MO-153
MO-153
MO-153
–
–
3.0 x 3.0
3.0 x 4.2
–
3.0 x 5.5
–
–
–
–
–
1.58
1.68
–
1.70
–
–
–
–
–
2.28
2.45
–
2.65
–
–
–
P1
P1
P1
P1
P1
P1
P1
P1
P1
38118
38118
38118
38118
38118
38118
38118
38119
38119
DS571
DS571
DS571
DS571
DS571
DS571
DS571
DS571
DS571
8
3.0
3.0
0.85
0.10
0.95
0.65
5.00
MO-187
1.73 x 2.39
1.50
2.20
P1
37830
DS571
10
3.0
3.0
0.85
0.10
0.95
0.50
5.00
MO-187
–
–
–
P1
37830
DS571
8
3.9
4.9
1.47
0.05
1.52
1.27
6.00
MS-012
–
–
–
P1
50396
DS571
16
3.9
9.9
1.47
0.05
1.52
1.27
6.00
MS-012
–
–
–
P1
50396
DS571
36
7.6
10.3
2.28
0.05
2.45
0.50
10.40
MO-271
–
–
–
P1
469970
DS571
*Simulated Results @ 100 MHz
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
15
ePad MSOP ePad SOIC ePad SSOP
N/A
Electrical Performance*
Lead
Count
ePad TSSOP
ePad TSSOP
Sample
TQFP/LQFP Packages – Nominal Package Dimensions (mm)
Lead
Count
Body
Thickness
Lead
Pitch
Lead
Form
Standoff
Foot
Length
JEDEC
Tray
Matrix
Units
Per Tray
Tip-to-Tip
5x5
5x5
32
40
1
1
0.5
0.4
1
1
0.1
0.1
0.6
0.6
7
7
MS-026
MS-026
12 x 30
12 x 30
7x7
32
1.00/1.40
7x7
36
1.4
0.8
1
0.1
0.8
1
0.1
0.6
9
MS-026
0.6
9
–
7x7
48
7x7
64
1.00/1.40
0.5
1
1.00/1.40
0.4
1
0.1
0.6
9
0.1
0.6
9
10 x 10
44
1.00/1.40
0.8
1
0.1
0.6
10 x 10
52
1.00/1.40
0.65
1
0.1
10 x 10
64
1.00/1.40
0.5
1
10 x 10
12 x 12
80
64
1.00/1.40
1.40
0.4
0.65
12 x 12
80
1.00/1.40
12 x 12
14 x 14
14 x 14
100
52
64
1
1.00/1.40
1.00/1.40
14 x 14
80
1.00/1.40
Factory
Package Outline
Drawing #
Data
Sheet #
P1
P1
40138
–
P1, JKM, JUK
32770/34604
JKM
–
P1, JKM, JUK
32770/34604
P1, JUK
32770/34604
–
P1, JUK
32772/34607
–
–
P1, JUK
32772/34607
–
–
–
P1, JKM
32772/34607
–
–
–
–
–
–
–
–
P1
JUK
32772/34607
–
–
–
–
–
–
P1, JKM, JUK
32774/51023
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
JKM
P1
P1
–
–
473943/473945
–
P1, JUK
473943/473945
26.3
17.8
473943/473945
335487
Self
Bulk
Self
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
Pad Size
(mm)
Lead
360
360
–
–
10 x 25
250
5x5
10 x 25
250
5x5
MS-026
10 x 25
250
5x5
–
–
Longest
Shortest
–
Longest
Shortest
–
–
0.904
0.799
–
1.110
0.962
–
–
0.211
0.202
–
0.225
0.200
–
–
9.2
7.8
–
13.8
12.0
MS-026
10 x 25
250
–
–
–
–
–
12
MS-026
8 x 20
160
–
–
–
–
0.6
12
MS-026
8 x 20
160
–
–
–
0.1
0.6
12
MS-026
8 x 20
160
–
–
1
1
0.1
0.1
0.6
0.6
12
14
MS-026
–
8 x 20
7 x 17
160
119
–
–
0.5
1
0.1
0.6
14
MS-026
7 x 17
119
0.4
1
0.8
1
1
1
0.1
0.1
0.1
0.6
0.6
0.6
14
16
16
–
MS-026
MS-026
7 x 17
6 x 15
6 x 15
119
90
90
0.65
1
0.1
0.6
16
MS-026
6 x 15
90
–
–
–
–
2.300
1.520
0.419
0.322
20 x 20
128
1.4
0.5
1
0.1
0.6
22
MS-026
5 x 12
60
–
20 x 20
144
1.00/1.40
0.5
1
0.1
0.6
22
MS-026
5 x 12
60
8.5 x 8.5
–
Longest
Shortest
–
6.430
4.230
–
1.100
1.070
–
62.9
52.6
20 x 20
176
1.00/1.40
0.4
1
0.1
0.6
22
MS-026
5 x 12
60
–
–
–
–
–
24 x 24
160
1.4
0.5
1
0.1
0.6
26
MS-026
4 x 10
40
–
1.4
0.5
1
0.1
0.6
26
MS-026
4 x 10
40
8x8
–
1.270
1.340
–
89.0
64.0
32780
176
–
9.510
5.200
P1
24 x 24
–
Longest
Shortest
P1, JKM, JUK
32780
24 x 24
216
1.4
0.4
1
0.1
0.6
26
MS-026
4 x 10
40
–
–
–
–
–
P1, JKM
32780
28 x 28
208
1.4
0.5
1
0.1
0.6
30
MS-026
4x9
36
11 x 11
0.4
1
0.1
0.6
30
MS-026
4x9
36
–
86.2
64.8
–
DS230, DS232
1.4
1.380
1.210
–
34514
256
9.670
6.190
–
P1
28 x 28
Longest
Shortest
–
DS230
DS230
DS230, DS232,
DSJD408
DSJD408
DS230, DS232,
DSJD408
DS230, DS232,
DSJD408
DS230, DS232,
DSJD408
DS230, DS232,
DSJD408
DS230, DS232,
DSJD408
DS230, DS232
DSJD408
DS230, DS232,
DSJD408
DSJD408
DS230, DS232
DS230, DS232
DS230, DS232,
DSJD408
DS230, DS232,
DSJD408
DS230, DS232,
DSJD408
DSJD408
DS230, DS232,
DSJD408
DSJD408
DS230, DS232,
DSJD408
DS232
DS230, DS232,
DSJD408
DS230, DS232,
DSJD408
DS232
DS230, DS232,
DSJD408
DS230, DS232,
DSJD408
P1
34514
DS230, DS232
1
0.1
0.6
16
MS-026
6 x 15
90
8x8
Longest
Shortest
14 x 14 120/128 1.00/1.40 0.40/0.40
1
0.1
0.6
16
MS-026
6 x 15
90
–
–
–
–
–
16 x 16
120
1.4
0.5
1
0.1
0.6
18
–
6 X 15
90
–
–
–
–
–
P1, JHD,
JKM, JUK
P1, JHD,
JKM, JUK
JUK
16 x 16
144
1
0.4
1
0.1
0.6
18
MS-026
6 x 15
90
–
–
–
–
–
P1, JKM
18 x 18
160
20
–
14 x 14
100
14 x 20 100/128
1.00/1.40
0.5
1
0.4
1
0.1
0.6
1.4
0.65/0.50
1
0.1
0.6
16.0 x 22.0 MS-026
473943/473945
–
–
–
–
–
–
–
–
JHD
–
6 x 12
72
–
–
–
–
–
P1, JKM
45373
P1
473979/473996
P1, JKM
473979/473996
P1, JKM, JUK 473979/473996
*Simulated Results @ 100 MHz
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
16
TQFP/LQFP
TQFP/LQFP
Sample
Electrical Performance*
Body
Size
ExposedPad TQFP/LQFP Packages – Nominal Package Dimensions (mm)
Electrical Performance*
Body
Size
Lead
Count
Body
Thickness
Lead
Pitch
Lead
Form
Standoff
Foot
Length
Tip-to-Tip
JEDEC
Tray
Matrix
Units
Per Tray
5x5
7x7
7x7
7x7
10 x 10
10 x 10
10 x 10
10 x 10
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 20
14 x 20
16 x 16
20 x 20
20 x 20
20 x 20
24 x 24
24 x 24
24 x 24
28 x 28
28 x 28
32
32
48
64
44
52
64
80
52/64
80
100
120
128
100
128
144
128
144
176
160
176
216
208
256
1
1
1
1
1.00/1.40
1.00/1.40
1.00/1.40
1.00/1.40
1.00/1.40
1.00/1.40
1.00/1.40
1
1.4
1.4
1.4
1
1.00/1.40
1.00/1.40
1.00/1.40
1.4
1.4
1.4
1.4
1.4
0.5
0.8
0.5
0.4
0.8
0.65
0.5
0.4
1.00/0.80
0.65
0.5
0.4
0.4
0.65
0.5
0.4
0.5
0.5
0.4
0.5
0.5
0.4
0.5
0.4
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
7
9
9
9
12
12
12
12
16
16
16
16
16
16.0 x 22.0
16.0 x 22.0
18
22
22
22
26
26
26
30
30
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
12 x 30
10 x 25
10 x 25
10 x 25
8 x 20
8 x 20
8 x 20
8 x 20
6 x 15
6 x 15
6 x 15
6 x 15
6 x 15
6 x 12
6 x 12
6 x 15
5 x 12
5 x 12
5 x 12
4 x 10
4 x 10
4 x 10
4x9
4x9
360
250
250
250
160
160
160
160
90
90
90
90
90
72
72
90
60
60
60
40
40
40
36
36
Pad Size
(mm)
Loop
Inductance (nH)
Center
Loop
Inductance (nH)
Corner
Factory
Package Outline
Drawing #
Data
Sheet #
–
–
5x5
–
–
–
7.5 x 7.5
–
–
–
10.3 x 10.3
–
–
–
–
–
–
7x7
–
–
10 x 10
–
11 x 11
–
–
–
2.29
–
–
–
3.04
–
–
–
2.57
–
–
–
–
–
–
4
–
–
5
–
6
–
–
–
2.81
–
–
–
3.78
–
–
–
3.32
–
–
–
–
–
–
5
–
–
6
–
7
–
P1
K1, P1
K1, P1, JUK
K1
K1, P1
K1
K1, JUK
K1
K1, P1
K1, P1
K1, P1, JKM
K1, P1
K1, P1, JKM
P1
P1
P1, JKM
K1, P1
K1, P1, JKM
K1, JKM
K1
P1, JKM
P1
P1
P1
40579
32770
32770
32770
32772/430273
32772/430273
32772/430273
32772/430273
–
473943/473945
473943/473945
473943/473945
473943/473945
–
–
335487
473979/473996
473979/473996
473979/473996
32780
32780
32780
34514
34514
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
DS231
*JEDEC Standard Test Boards– Tested @ 1W with die attach pad soldered to PCB
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
17
Exposed Pad LQFP/TQFP
Exposed Pad LQFP/TQFP
Sample
MQFP Packages – Nominal Package Dimensions (mm)
Electrical Performance*
Body
Size
Lead
Count
Body
Thickness
Lead
Pitch
Lead
Form
Standoff
Tip-to-Tip
JEDEC
Tray
Matrix
Units
Per
Tray
Pad Size
(mm)
Lead
10 x 10
44
2.00
0.80
1.60
0.15
13.20
MS-022
6 x 16
96
7.4 x 7.4
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
14 x 14
52
64
44
52
64
52
2.00
2.00
2.00
2.00
2.00
2.00
0.65
0.50
0.80
0.65
0.50
1.00
1.60
1.60
1.95
1.95
1.95
1.60
0.15
0.15
0.15
0.15
0.15
0.15
13.20
13.20
13.90
13.90
13.90
17.20
MS-022
MS-022
MS-112
MS-112
MS-112
MS-022
6 x 16
6 x 16
6 x 16
6 x 16
6 x 16
6 x 14
96
96
96
96
96
84
–
–
–
–
–
–
14 x 14
64
2.00
0.80
1.60
0.15
17.20
MS-022
6 x 14
84
8.9 x 8.9
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
14 x 20
14 x 20
14 x 20
80
100
52
64
80
100
52
64
80
100
64
80
100
2.00
2.00
2.67
2.67
2.67
2.67
2.67
2.67
2.67
2.67
2.71
2.71
2.71
0.65
0.50
1.00
0.80
0.65
0.50
1.00
0.80
0.65
0.50
1.00
0.80
0.65
1.60
1.60
1.60
1.60
1.60
1.60
1.95
1.95
1.95
1.95
1.60
1.60
1.60
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.33
0.33
0.33
17.20
17.20
17.20
17.20
17.20
17.20
17.90
17.90
17.90
17.90
17.2 x 23.2
17.2 x 23.2
17.2 x 23.2
MS-022
MS-022
MS-022
MS-022
MS-022
MS-022
MS-112
MS-112
MS-112
MS-112
MS-022
MS-022
MS-022
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 14
6 x 11
6 x 11
6 x 11
84
84
84
84
84
84
84
84
84
84
66
66
66
–
–
–
–
–
–
–
–
–
–
–
–
–
14 x 20
128
2.71
0.50
1.60
0.33
17.2 x 23.2
MS-022
6 x 11
66
11.0 x 11.0
14 x 20
14 x 20
14 x 20
14 x 20
28 x 28
28 x 28
64
80
100
128
120/128
144/160
2.71
2.71
2.71
2.71
3.37
3.37
1.00
0.80
0.65
0.50
0.80/0.80
0.65/0.65
1.95
1.95
1.95
1.95
1.30
1.30
0.23
0.23
0.23
0.23
0.13
0.13
17.9 x 23.9
17.9 x 23.9
17.9 x 23.9
17.9 x 23.9
30.6
30.6
MS-112
MS-112
MS-112
MS-112
MS-029
MS-029
6 x 11
6 x 11
6 x 11
6 x 11
3x8
3x8
66
66
66
66
24
24
–
–
–
–
–
–
28 x 28
208
3.37
0.50
1.30
0.13
30.60
MS-029
3x8
24
–
28 x 28
28 x 28
28 x 28
28 x 28
28 x 28
256
120/128
144/160
208
256
3.37
3.37
3.37
3.37
3.37
0.40
0.80/0.80
0.65/0.65
0.50
0.40
1.30
1.30
1.30
1.60
1.60
0.13
0.33
0.33
0.33
0.33
30.60
30.6
30.6
31.20
31.20
MS-029
MS-029
MS-029
MS-022
MS-022
3x8
3x8
3x8
3x8
3x8
24
24
24
24
24
–
–
–
–
–
32 x 32
240
3.40
0.50
1.30
0.38
34.60
MS-029
3x8
24
12.7 x 12.7
32 x 32
240
3.40
0.50
1.30
0.32
34.60
MS-029
3x8
24
–
Longest
Shortest
–
–
–
–
–
–
Longest
Shortest
–
–
–
–
–
–
–
–
–
–
–
–
–
Longest
Shortest
–
–
–
–
–
–
Longest
Shortest
–
–
–
–
–
Longest
Shortest
–
Self
Bulk
Self
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
1.660
1.460
–
–
–
–
–
–
5.92
1.319
–
–
–
–
–
–
–
–
–
–
–
–
–
9.29
1.694
–
–
–
–
–
–
9.86
3.723
–
–
–
–
–
16.84
7.87
–
0.322
0.342
–
–
–
–
–
–
0.884
0.548
–
–
–
–
–
–
–
–
–
–
–
–
–
1.227
0.501
–
–
–
–
–
–
7.945
2.948
–
–
–
–
–
9.480
1.513
–
19.8
17.0
–
–
–
–
–
–
123.6
0.164
–
–
–
–
–
–
–
–
–
–
–
–
–
200.0
0.150
–
–
–
–
–
–
0.937
0.325
–
–
–
–
–
217.5
0.543
–
Factory
Package
Outline
Drawing #
Data
Sheet #
P1
–
DS232
P1
P1
P1
P1
P1
P1
–
–
–
–
–
–
DS232
DS232
DS232
DS232
DS232
DS232
P1
–
DS232
P1
P1
P1
P1
P1
P1
P1
P1
P1
P1
P1
P1
P1
–
–
–
–
–
–
–
–
–
–
–
–
–
DS232
DS232
DS232
DS232
DS232
DS232
DS232
DS232
DS232
DS232
DS232
DS232
DS232
P1
–
DS232
P1
P1
P1
P1
P1
P1
–
–
–
–
–
–
DS232
DS232
DS232
DS232
DS232
DS232
P1
–
DS232
P1
P1
P1
P1
P1
–
–
–
–
–
DS232
DS232
DS232
DS232
DS232
P1
–
DS232
P1
–
DS232
*Simulated Results @ 100 MHz
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
18
MQFP
MQFP
Sample
MQFP PowerQuad® 4 Packages – Nominal Package Dimensions (mm)
Electrical Performance
Body
Size
Lead
Count
Body
Thickness
Lead
Pitch
Lead
Form
Standoff
Foot
Length
Tip-to-Tip
JEDEC
Tray
Matrix
Units
Per Tray
28 x 28
28 x 28
28 x 28
28 x 28
120
128
144
160
3.37
3.37
3.37
3.37
0.80
0.80
0.65
0.65
1.30/1.60
1.30/1.60
1.30/1.60
1.30/1.60
0.13/0.33
0.13/0.33
0.13/0.33
0.13/0.33
0.56/0.88
0.56/0.88
0.56/0.88
0.56/0.88
30.6/31.2
30.6/31.2
30.6/31.2
30.6/31.2
MS-029/022
MS-029/022
MS-029/022
MS-029/022
3x8
3x8
3x8
3x8
28 x 28
208
3.37
0.50
1.30/1.60
0.13/0.33
0.56/0.88
30.6/31.2
MS-029/022
28 x 28
256
3.37
0.40
1.30/1.60
0.13/0.33
0.56/0.88
30.6/31.2
MS-029/022
32 x 32
240
3.40
0.50
1.30
0.38
0.56
34.6
MS-029
Pad Size
(mm)
Lead
24
24
24
24
–
–
–
–
3x8
24
9.5 x 9.5
3x8
24
–
3x8
24
10.6 x 10.6
–
–
–
–
Longest
Shortest
–
Longest
Shortest
PLCC Packages – Nominal Package Dimensions (inches unless otherwise specified)
Pkg
Type
Sample
PLCC
–
–
–
–
1.730
1.470
–
2.123
1.841
Package
Outline
Drawing #
Data
Sheet #
P1
P1
P1
P1
–
–
–
–
DS195
DS195
DS195
DS195
P1
–
DS195
P1
–
DS195
P1
–
DS195
–
–
–
–
95.5
81.0
–
227.0
205.7
Body
Size
(inches)
Body
Thickness
(inches)
Lead
Pitch
(inches)
JEDEC
Qty
Per Tube
Pad Size
(mm)
Lead
Self
Inductance
(nH)
Bulk
Capacitance
(pF)
Self
Resistance
(mΩ)
Factory
Package
Outline
Drawing #
Data
Sheet #
20
8.9 x 8.9
.352 x .352
0.152
0.05
MS-018
46
3.7 x 3.7
P1
00060
DS232
0.05
MS-018
26
8.89 x 8.89
P1
00060
DS232
0.152
0.150
0.05
0.05
MS-018
MS-018
23
18
–
–
P1
P1
00060
00060
DS232
DS232
1.152 x 1.152
0.150
0.05
MS-018
15
10.8 x 10.8
P1
00060
DS232
.452 x .552
0.109
0.05
MS-016
30
–
13.5
11.1
–
17.8
13.7
–
–
57.6
43.2
–
DS232
6.6 x 6.6
0.596
0.583
–
0.893
0.681
–
–
1.780
1.750
–
00060
37
2.110
1.780
–
2.900
2.140
–
–
10.900
6.840
–
P1
MS-018
Longest
Shortest
–
Longest
Shortest
–
–
Longest
Shortest
–
28
11.5 x 11.5
.452 x .452
0.152
0.05
44
16.6 x 16.6
.652 x .652
0.152
52
68
–
–
.752 x .752
.952 x .952
84
29.3 x 29.3
32
–
P1
00061
DS232
Factory
Package
Outline
Drawing #
Data
Sheet #
P1
P1
–
–
DS587
DS587
P1
–
DS587
P1
P1
P1
–
–
–
DS587
DS587
DS587
PLCC
Body
Size
(mm)
Rectangular
–
–
–
–
12.000
6.850
–
15.72
12.12
Factory
Electrical Performance*
Lead
Count
Square
Self
Bulk
Self
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
MQFP PowerQuad® 4
MQFP PowerQuad® 4
Sample
*Simulated Results @ 100 MHz
FusionQuad® Packages – Nominal Package Dimensions (mm)
Total Max IO Number Possible
Dual Row Land
Single Row Land
Peripheral Lead
Max Die Pad Size (mm)
Electrical Performance*
0.4 pitch
0.5 pitch
0.4 pitch
0.5 pitch
0.4 pitch
0.5 pitch
0.4 pitch
0.5 pitch
Pkg
Pad Size
(mm)
10 x 10
12 x 12
164
200
132
164
148
176
116
140
88
108
64
80
5.3
6.5
5.3
6.5
–
–
–
–
14 x 14
228
192
204
168
128
100
7.3
7.5
176 ld
6.5 x 6.5
16 x 16
20 x 20
24 x 24
264
316
356
224
264
296
236
280
320
196
228
260
148
184
224
120
144
176
8.5
9.7
9.7
8.7
10
10
–
–
–
–
–
–
*Simulated Results @ 100 MHz
Note: Above are estimates only.
Detailed designs have not yet been implemented for all options.
Actual pin counts are pad size dependent.
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Lead
–
–
Longest
Shortest
–
–
–
Self
Bulk
Self
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
–
–
5.99
1.42
–
–
–
–
–
0.82
0.23
–
–
–
–
–
209
81
–
–
–
Amkor Product Line Card • July 2016
19
FusionQuad®
FusionQuad®
Sample
Body
Size
MicroLeadFrame® MLF®/QFN/SON/DFN Packages – Nominal Package Dimensions (mm)
Body
Size
MLF®/QFN/
SON/DFN
Leads
Pitch (mm)
Dual Row
Lead Count
Pitch (mm)
1x1
1x1
2x2
2x2
2x2
2x2
3x3
3x3
3x3
3x3
4
6
6
8
10
12
4
6
8
10
0.35, 0.65
0.35, 0.65
0.50, 0.65
0.50, 0.65
0.50, 0.65
0.50, 0.65
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
–
–
–
–
–
–
–
–
–
3x3
12
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
3x3
3x3
3x3
4x4
4x4
4x4
4x4
4x4
4x4
4x4
4x4
4x4
5x5
5x5
5x5
5x5
5x5
5x5
5x5
5x5
5x5
6x5
6x5
6x5
6x5
6x6
6x6
6x6
6x6
6x6
6x6
6x6
16
20
24
8
10
12
16
20
24
28
32
40
8
16
20
28
32
36
40
44
52
18
24
36
42
16
20
28
30
32
36
40
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
–
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
1.00, 0.65, 0.5, 0.4, 0.35
0.8
1.00, 0.65, 0.5, 0.4, 0.35
1.00, 0.65, 0.5, 0.4, 0.35
1.00, 0.65, 0.5, 0.4, 0.35
1.00, 0.65, 0.5, 0.4, 0.35
1.00, 0.65, 0.5, 0.4, 0.35
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
0.5
0.5
–
–
–
–
–
–
–
–
–
–
–
Electrical Performance*
Lead
Self
Inductance
(nH)
Bulk
Capacitance
(pF)
Self
Resistance
(mΩ)
Factory
Data
Sheet #
–
–
–
–
–
.052
–
.460
–
–
.078
–
.134
–
–
2.4
–
2.0
–
–
–
–
–
–
Longest
Shortest
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
0.564
0.531
–
–
–
–
–
.044
–
–
–
–
–
–
–
–
.048
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
.052
–
–
–
–
–
0.203
0.220
–
–
–
–
–
.189
–
–
–
–
–
–
–
–
.144
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
.175
–
–
–
–
–
141.8
138.9
–
–
–
–
–
1.9
–
–
–
–
–
–
–
–
2.2
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
2.5
–
K1, P3
K1, P3
K1, P3
K1, P3
K1, P3
K1, P3
K1, P1, P3, JHD
K1, P3, JHD
K1, P1, P3, JHD
K1, P1, P3, JHD
DS572
DS572
DS572
DS572
DS572
DS572
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
K1, P1, P3, JHD
DS572, DSJD409
K1, P1, P3, JHD
K1, P1, P3, JHD
K1, P1, P3, JHD
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3
C3, K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
C3, K1, P1, P3, JHD, JKM
JKM, JHD
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572
DS572
DS572
DS572
DS572
DS572
DS572, DSJD409
DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
*Simulated Results @ 12 GHz. Values dependent on specific die and wire configurations.
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
20
MicroLeadFrame® MLF®/QFN/SON/DFN
MicroLeadFrame® MLF®/QFN/SON/DFN
Sample
MicroLeadFrame® MLF®/QFN/SON/DFN Packages (Cont.) – Nominal Package Dimensions (mm)
Body
Size
MLF®/QFN/
SON/DFN
Leads
Pitch (mm)
Dual Row
Lead Count
Pitch (mm)
6x6
6x6
6x6
6x6
6x6
6x6
6x6
7x7
7x7
44
48
56
60
60
64
68
32
36
1.00, 0.65, 0.5, 0.4, 0.35
1.00, 0.65, 0.5, 0.4, 0.35
1.00, 0.65, 0.5, 0.4, 0.35
1.00, 0.65, 0.5, 0.4, 0.35
–
1.00, 0.65, 0.5, 0.4, 0.35
–
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.5
–
–
–
0.5
–
0.5
–
–
7x7
44
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
7x7
7x7
7x7
7x7
7x7
7x7
7x7
8x8
8x8
8x8
8x8
8x8
8x8
8x8
8x8
8x8
8x8
8x8
8x8
8x8
8x8
9x9
9x9
9x9
9x9
9x9
9x9
9x9
9x9
9x9
9x9
9x9
9x9
48
52
56
68
76
80
84
4
16
32
36
40
52
56
64
68
76
84
88
92
100
36
44
48
60
64
76
88
100
104
108
104
116
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.4
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
2.00, 1.42, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
2.00, 1.42, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
2.00, 1.42, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
2.00, 1.42, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
2.00, 1.42, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
2.00, 1.42, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.4
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
–
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
–
–
–
–
0.5
–
0.5
–
–
–
–
–
–
–
–
–
–
0.5
–
0.5
0.5
–
–
–
–
–
–
–
0.5
–
0.5
–
0.5
Electrical Performance*
Lead
Self
Inductance
(nH)
Bulk
Capacitance
(pF)
Self
Resistance
(mΩ)
Factory
Data
Sheet #
–
–
–
–
–
–
–
–
–
Longest
Shortest
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
1.766
1.194
–
–
–
–
–
–
–
–
–
–
–
–
–
.049
–
–
–
–
–
–
–
–
–
–
–
–
.051
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
0.326
0.289
–
–
–
–
–
–
–
–
–
–
–
–
–
.137
–
–
–
–
–
–
–
–
–
–
–
–
.129
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
315.1
234.5
–
–
–
–
–
–
–
–
–
–
–
–
–
2.3
–
–
–
–
–
–
–
–
–
–
–
–
2.4
–
–
–
–
–
–
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572
DS572
DS572
DS572
DS572, DSJD409
DS572, DSJD409
C3, K1, P1, P3, JHD, JKM
DS572, DSJD409
C3, K1, P1, P3, JHD, JKM
JKM, JHD
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
JKM, JHD
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
C3, K1, P1, P3, JHD, JKM
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
DS572, DSJD409
DSJD409
DS572, DSJD409
DS572, DSJD409
DS572
DS572
DS572
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DSJD409
DS572, DSJD409
DS572, DSJD409
DS572
DS572
DS572
DS572
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
DS572
DS572
DS572
DS572
DS572
*Simulated Results @ 12 GHz. Values dependent on specific die and wire configurations.
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
21
MicroLeadFrame® MLF®/QFN/SON/DFN
MicroLeadFrame® MLF®/QFN/SON/DFN
Sample
MicroLeadFrame® MLF®/QFN/SON/DFN Packages (Cont.) – Nominal Package Dimensions (mm)
Body
Size
MLF®/QFN/
SON/DFN
Leads
Pitch (mm)
Dual Row
Lead Count
Pitch (mm)
10 x 10
10 x 10
10 x 10
44
52
56
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
–
–
10 x 10
64
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
10 x 10
68
72
84
88
100
116
124
132
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.4
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
–
–
–
–
–
–
–
11 x 11
132
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
11 x 11
11 x 11
12 x 12
12 x 12
12 x 12
12 x 12
12 x 12
12 x 12
12 x 12
12 x 12
140
148
48
60
84
88
100
108
124
144
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
0.8, 0.65, 0.5, 0.4, 0.35, 0.3
–
–
–
–
–
–
–
–
–
–
12 x 12
148
0.65, 0.5
0.5
12 x 12
156
0.65, 0.5
0.5
12 x 12
164
–
0.5
13 x 13
164
0.65, 0.5
0.5
13 x 13
13 x 13
172
180
–
–
0.5
0.5
Electrical Performance*
Lead
Self
Inductance
(nH)
Bulk
Capacitance
(pF)
Self
Resistance
(mΩ)
Factory
Data
Sheet #
–
–
–
Longest
Shortest
–
–
–
–
–
–
–
–
Longest
Shortest
–
–
–
–
–
–
–
–
–
–
Longest
Shortest
Longest
Shortest
–
Longest
Shortest
–
–
–
–
–
2.179
1.475
–
–
–
–
–
–
–
–
0.766
0.277
–
–
–
–
–
–
–
–
–
–
0.802
0.279
0.787
0.276
–
0.497
0.208
–
–
–
–
–
0.518
0.409
–
–
–
–
–
–
–
–
0.462
0.342
–
–
–
–
–
–
–
–
–
–
0.479
0.342
0.468
0.332
–
0.325
0.318
–
–
–
–
–
337.5
250.8
–
–
–
–
–
–
–
–
28.4
9.4
–
–
–
–
–
–
–
–
–
–
30.5
9.4
30.4
9.8
–
20.0
7.7
–
–
K1, P1, P3, JHD
K1, P1, P3, JHD
K1, P1, P3, JHD
DS572, DSJD409
DS572, DSJD409
DS572, DSJD409
C3, K1, P1, P3, JHD
DS572, DSJD409
K1, P1, P3, JHD
K1, P1, P3, JHD
JHD
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
K1, P1, P3
DS572, DSJD409
DS572, DSJD409
DSJD409
DS572
DS572
DS572
DS572
DS572
C3, K1, P1
DS572
C3, K1, P1
C3, K1, P1
C3, K1, P1
C3, K1, P1
C3, K1, P1
C3, K1, P1
C3, K1, P1
C3, K1, P1
C3, K1, P1
C3, K1, P1
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
DS572
C3, K1, P1
DS572
C3, K1, P1
DS572
C3, K1, P1
DS572
C3, K1, P1
DS572
C3, K1, P1
C3, K1, P1
DS572
DS572
*Simulated Results @ 12 GHz. Values dependent on specific die and wire configurations.
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
22
MicroLeadFrame® MLF®/QFN/SON/DFN
MicroLeadFrame® MLF®/QFN/SON/DFN
Sample
Power Packages
Amkor’s portfolio of power packages serves diversified markets and applications, including automotive, communications and industrial.
Optimized for power sensitive and mobile applications, Amkor’s high performance power devices use a leadframe as the package carrier and primarily use wirebond interconnect
technology. A majority of packages will use a Cu clip interconnect, which provides the best known electrical properties for power devices. With technology focused on electrical
and thermal improvement, products include advanced power packaging, advance copper clip attached and modules.
Power Packages – Nominal Package Dimensions (mm)
Package
Lead
Count
Body
Width
Body
Length
Body
Thickness
Overall
Height
Lead
Pitch
Tip-to-Tip
JEDEC/JEITA
Factory
Package Outline
Drawing #
Data
Sheet #
PSMC
2
4.4
6.1
1.1
1.1
-
6.5
–
ATM
–
DS616
PSMC
3
4.4
6.1
1.1
1.1
2.13
6.5
–
ATM
–
DS617
SOD123-FL
2
1.6
2.6
0.98
0.98
–
3.5
–
ATM
–
DS614
SOD128-FL
2
2.4
3.8
0.98
0.98
–
4.7
–
ATM
–
DS613
SOD323-FL
2
1.25
1.9
0.6
0.6
–
2.5
–
ATM
–
DS615
TO-220
3
10
9.6
4.6
–
2.54
28.2
–
JFI
–
DSJD410
DSJD411
TO-220F
3
10
15
4.5
–
2.54
28.5
–
JFI
–
TO-220FP
3
10
15
4.5
-
2.54
28
-
ATM
–
DS610
TO-220SMD
3
10.2
8.5
4.6
–
2.54
12.5
–
JFI
–
DSJD412
TO-251
3
6.5
5.5
2.3
–
2.3
13.7
–
JFI
–
DSJD413
TO-252JEDEC
3
6.5
6.1
2.3
–
2.3
9.8
JEDEC
JFI
–
DSJD414
TO-252JEITA
3
6.5
5.5
2.3
–
2.3
9.5
JEITA
JFI
–
DSJD415
TO-263
3
10
9.15
4.45
–
2.04/3.04
15.25
–
JFI
–
DSJD416
TO-263 (7-pin)
7
10
8.5
4.8
–
1.27
12.5
–
JFI
–
DSJD417
HSON8
8
5
5.4
1.45
1.45
1.27
5.15 x 6
–
JFI
–
DSJD407
Mini-HVSON
(8-pin)
8
3.15
3
0.9
0.9
0.65
3.3 x 3.3
–
JFI
–
DSJD403
HVSON (8-pin)
8
5
5.4
1
1
1.27
5.15 x 6
–
JFI
–
DSJD402
SO8-FL
6
4.9
5.75
1
1
1.27
6.1
JEDEC
ATM
–
–
SO8-FL
8
5
5
0.95
0.95
1.27
6
JEITA
ATM
–
DS611
SO8-FL
8
4.9
5.75
1
1
1.27
6.1
JEDEC
ATM
–
DS611
TSON8-FL
8
3.1
3.1
0.85
0.85
0.65
3.3
JEDEC
ATM
–
DS612
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
Power
Power
Sample
23
Test Services
Amkor Technology provides a complete range of semiconductor testing services including wafer testing, various types of final testing, system level testing, strip testing and
complete end-of-line services up to and including final shipping. We offer a full range of test software, hardware, integration and product engineering services, and we support a
range of business models and test capabilities.
We test a variety of device types across all of our package families including radio frequency, analog and mixed signal, digital, power management, memory and various
combinations such as application-specific integrated circuits (ASICs), multichip modules (MCMs), System-in-Package (SiP) and 3D stacked packaging. We also test biometric
devices, accelerometers, gyrometers, haptics, pressure sensors and other types of microelectromechanical systems MEMS devices.
Major Testers Platform
Manufacturer
Advantest
Teradyne
Xcerra
Tester Model
T2000
T5XXX (Memory)
T65XX (Logic)
93000 Series
Eagle Series
U Flex/Flex Series
J750 Series
Magnum
X-Series, Diamond
Application
Digital
Mixed
RF











–
–
–








–
Memory
–

–
–
–



–


–
–
Wafer Prober
Wafer Size
200 mm
300 mm
Prober
Pin to Pad
Accuracy
Temp Range
(°C)
Min.
Pad Size/Pitch
Comments
TEL P8XL
TEL Precio Octo
± 4 µm
± 2 µm
Ambient ~ 150°C
Ambient ~ 150°C
Z-force 20 kg
Z-force 40 kg
EG 4090µ, 4090µ+
± 4 µm/± 3 µm
Ambient ~ 130°C
TSK UF200/200A
± 4 µm
TEL P12XLn+
± 1.8 µm
38 µm/58 µm
Max Z-force 100 kg
TEL Precio/
Precio Nano
EG 6000
± 1.8 µm/
± 0.8 µm
± 2.5 µm
27 µm/41 µm
45 µm/67 µm
Max Z-force 200 kg/
Max Z-force 300 kg
Max Z-force 150 kg
TSK UF3000ex
± 1 µm
30 µm/45 µm
Max Z-force 200 kg
Semics OPUS3/
OPUS3 SP
± 1.5 µm/
± 1.0 µm
Ambient ~ 160°C
Ambient ~ 150°C
(*-55°C ~ 150°C)
Ambient ~ 150°C
(*-55°C ~ 150°C)
Ambient ~ 150°C
Ambient ~ 150°C
(*-55°C ~ 200°C)
Ambient ~ 150°C
(*-40°C ~ 150°C)
50 µm/75 µm
40 µm/60 µm
50 µm/75 µm,
48 µm/72 µm
50 µm/75 µm
37 µm/56 µm
30 µm/45 µm
Max Z-force 300 kg
Max Z-force 450 kg
18 kg
–
*Direct docking, cold test is optional
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
24
Conventional Handler
Type
of Handler
Manufacturer
Pkg Size (mm)
Pkg Type
Temp
Input/Output
Docking
55 x 72
BGA/LGA/CSP/POP/
TSV/MLF®/TQFP
Ambient/
Hot/Cold
Tray
Direct or
Soft Dock
2x2
21 x 21
TQFP/SOIC/
TSSOP/MLF®
Ambient/
Hot/Cold
1 x 0.6
12 x 12
BGA/QFP/
SOIC/MLF®
Ambient/
Hot
Min
Max
Pick & Place
Hontech
Seiko Epson,
MT/Delta (cold)
Advantest, Techwing
3.0 x 3.0
Gravity
MT, Rasco
Xceltron
Turret
Ismeca, SRM
ASM
Strip Test
MCT, Rasco
Film Frame
MCT
Not limited; below 1 mm with
130 µm pad size & 0.25 mm pitch
Ambient/
Hot/Cold
Ambient
Leaded Pkg
sMLF®
Tube,
Bowl/Tube,
TNR
Bulk,
Bowl/Canister,
TNR
Direct or
Soft Dock
Soft Dock
Strip/Singulated
Direct
Film Frame
Direct
Strip Test/Film Frame Handler
Assembly
Format
Std Leadframe
(MCT SH5000/
Rasco SO3000)
Film Frame
(FH1200)
Handler
Temp Range
(°C)
Contact Force
Packages
-50 to +150 (± 3)
77kgf
(option 194 kgf)
TQFP up to 64 lead, 10 x 10 mm
SOIC-N 150 mil, SOIC-W 300 mil,
SOIC std 208 mil
TSSOP up to 28 lead
(3.0 and 4.4 mm body sizes)
PDIP up to 8 lead
Ambient
77kgf
(option 120 kgf)
Saw MLF® up to 7 x 7 mm
MCT H5000
Rasco SO3000
MCT FFC
(Film Frame)
FH1200
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
25
Wafer Test Roadmap
Available
2015
2016
2017
Max. Wafer Size (mm)
300
300
300
450
Parallelism (# of sites)
128
256
256
256
Max. Chuck Force (kgf)
450
500
500
500
Overall Accuracy (µm)
X,Y: ± 0.8
X,Y: ± 0.8
X,Y: ± 0.8
X,Y: ± 0.8
Temperature Range (°C)
Min. Pitch (µm)
Pad Wafer (In-Line)
Bump Full Array
WLCSP
Min. Pad Size (µm)
-55 ~ 200
-55 ~ 200
-55 ~ 200
-55 ~ 200
40
75
250
30 x 30
40
60
225
30 x 30
35
60
200
25 X 25
30
50
200
25 x 25
Available
2015
2016
2017
16
32
32
32
Memory product excluded
PackageTest Roadmap – PnP
Parallelism (# of sites) - P&P
Max. ContactForce (kgf)
520
650
650
650
Min/Max Package Size (mm) - P&P
3.0*3.0/55*72
3.0*3.0/55*72
2.5*2.5/55*72
2.5*2.5/55*72
Package Thickness (µm)
350
300
250
250
Temperature Range (°C)
-55 ~ 175
-55 ~175
-55 ~175
-55 ~175
Contactor Min. Pitch (mm)
FCBGA/QFP/MLF® (QFN)
CSP/vfBGA//PoP/TMV®
0.35
0.35
0.3
0.3
0.3
0.3
0.25
0.25
Contact Method
Direct/Chamber
Direct/Chamber
Direct/Chamber
Direct/Chamber
Memory product excluded
Automotive capability available on most packages.
Packages are not shown actual size and are a representation of available packages. Contact Amkor sales for information on additional products offered.
Amkor Product Line Card • July 2016
26
Amkor Technology by the Numbers
26,700+
Founded
1968
3,000+
Number of Employees
Package
Portfolio
Assembly
$3.7B
10%
Automotive
Amkor + J-Devices
22
%
2,464
Number of Patents
Test
End
Market
Distribution
Computing
7%
Design
Communications
46
16
ü
Networking
NET SALES
Top
Turnkey
Services
%
Consumer
15%
Bumping
8,000,000+
Sales & Customer
Support Centers
Square Foot
Manufacturing
Space
22
Assembly
& Test Facilities
Amkor Worldwide Sales Offices
CORPORATE HEADQUARTERS
Tempe, AZ
2045 E. Innovation Circle
Tempe, AZ 85284
USA
Tel: 480-821-5000
Fax: 480-821-8276
US MAIN SALES OFFICE
San Jose, CA
25 Metro Drive
Suite #700
San Jose, CA 95110
Tel: 408-496-0303
Fax: 408-496-0392
Irvine, CA
3 Corporate Park
Suite 230
Irvine, CA 92606
Tel: 949-724-9370
Fax: 949-724-8925
San Diego, CA
5465 Morehouse Drive
Suite 210
San Diego, CA 92121
Tel: 858-320-6280
Fax: 858-622-1841
Austin, TX
8140 N. Mopac
Suite 150
Austin, TX 78759
Tel: 512-953-0701
Fax: 512-953-0717
Dallas, TX
1101 Central Expressway South
Suite 215
Allen, TX 75013
Tel: 469-342-9964
Fax: 469-342-9956
Boston, MA
105 Central Street
Suite 2300
Stoneham, MA 02180
Tel: 781-438-7800
Fax: 781-438-8414
EUROPEAN SALES OFFICE
KOREA SALES OFFICE
Amkor Technology Euroservices s.a.s
Archamps Technopole
60 Avenue Marie Curie
74160 Archamps
France
Tel: 33-4-50-31-88-00
Fax: 33-4-50-31-88-01
Site K1 - Main Plant
151, Dongil-ro, Seongdong-gu
Seoul 04799
Korea
Tel: 822-460-5114
Fax: 822-460-6007
GERMANY SALES OFFICE (Munich)
Amkor Technology Holding B.V., Germany
Werner-Eckert-Straße 14,
81829 Munich
Germany
Tel: +49 (0)89-1241498-40
Fax: +49 (0)89-1241498-49
CHINA SALES OFFICE (Shanghai)
Zhangjiang Hi Tech Park
2889 Jinke Road, Room #504
Bldg. E, Chamtime Square
Pudong, Shanghai 201203
China
Tel: 8621-5064-4590 ext. 2340 or 2344
Fax: 8621-5048-2522
SE ASIA SALES OFFICE
Amkor Technology Singapore Holding Pte. Ltd.
491B River Valley Road, #15-02/04
Valley Point Office Tower
Singapore 248373
Tel: 65-6211-3333
Fax: 65-6211-3388
TAIWAN SALES OFFICE
Amkor Technology Taiwan, Inc.
3F-1, No.1, Tai Yuen 2nd St.
Zhubei City, Hsinchu County
Taiwan 302
Tel: 886-3-598-2000
Fax: 886-3-560-1269
CHINA SALES OFFICE (Beijing)
Room 3-2-308,
Zhujiang Moore International Center,
No. 1 Beiqing Road, Changping District,
Beijing, China
CHINA SALES OFFICE (Shenzhen)
Room 2907, Building A,
Xinghe Century Mansion,
Caitian Road, Futian District,
Shenzhen, China
JAPAN SALES OFFICE
Shibakoen Front Tower 14F
2-6-3, Shibakoen
Minoto-Ku, Tokyo 105-0011
Japan
Tel: 81-3-5425-2830
Fax: 81-3-5425-2831
Visit Amkor Technology online for locations and
to view the most current product information.
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor
shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend
or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without
notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2016, Amkor Technology Incorporated.
All Rights Reserved. 7/16
Questions? Contact us: sales@amkor.com