Henkel Solutions
Medical Electronics
2 | Medical Electronics
Overview
Accurate diagnostics, improved alternative treatments
and patient monitoring are all critical needs of the medical
electronics industry. But, none of this is possible without
the high-reliability medical devices used to facilitate these
objectives. Henkel’s advanced semiconductor packaging
and assembly materials are delivering the solutions
needed to address the demanding requirements of nextgeneration medical electronics.
There’s no doubt that improving access to patients’ data
has enabled medical professionals to provide personalized
care and has expanded early intervention programs for
the treatment of chronic conditions. Technologies such
as implantable medical devices and patient monitoring
sensors that make this type of patient care possible
now require a form factor that is only achieved through
advanced electronic devices, materials and assembly
methods. Henkel’s technical expertise, low-risk partnership
proposition, innovation philosophy, world-class global
support infrastructure and history as a leading formulator
of market-leading materials ensure that we will enable the
future advancement of the medical electronics industry.
Medical Electronics | 3
4 | Medical Electronics
Index
Medical
Inks & Coatings
Electrically
Conductive Inks
Silver/
Silver
Chloride
NonConductive
Adhesives
Water-Based
Electrically
Conductive
Pastes
NonConductive
Pastes
Dam
Fill
Glob Tops
General
LOCTITE
ECCOBOND
FP 4451TD
LOCTITE
ECCOBOND
FP 4450HF
LOCTITE
ECCOBOND
EO 1060
LOCTITE
ECCOBOND
FP 4651
LOCTITE
ECCOBOND
EO 1072
LOCTITE
ECCOBOND
FP 4802
LOCTITE
ECCOBOND
FP 4460
PTC
Carbon
Silver
LOCTITE
EDAG 6037SS
E&C
LOCTITE
EDAG 452SS
E&C
Carbon
Silver
Silver/
Silver
Chloride
LOCTITE
ABLESTIK
84-1LMISR4
LOCTITE
ABLESTIK
84-3
LOCTITE
ECI 8001
E&C
LOCTITE
EDAG 109
E&C
LOCTITE
ECI 1001
E&C
LOCTITE
EDAG 6038SS
E&C
LOCTITE
EDAG PD 038
E&C
LOCTITE
EDAG
112 E&C
LOCTITE
ECI 1005
E&C
LOCTITE
EDAG
PE 428 E&C
LOCTITE
ABLESTIK
CA 3556HF
LOCTITE
ABLESTIK
2025D
LOCTITE
EDAG
C 932-51
E&C
LOCTITE
EDAG
479SS
E&C
LOCTITE
EDAG 7019
E&C
LOCTITE
EDAG PF 021
E&C
LOCTITE
EDAG
C 932-74
E&C
LOCTITE
EDAG
725A
E&C
LOCTITE
EDAG PE 007
E&C
LOCTITE EDAG
PF 455B
E&C
LOCTITE
EDAG
PF 407C
E&C
LOCTITE
EDAG
SS 24600
E&C
COB Encapsulants
LOCTITE
ABLESTIK
CE 3103WLV
Medical Electronics | 5
Electronics
PCB Protection
Solder Materials
Underfills
Conformal
Coatings
Low
Pressure
Molding
LOCTITE
5293
MACROMELT
MM 6208
Pb-Free
HalideFree
Pb-Free
HalogenFree
Pb-Free
Water
Wash
SnPb
No-Clean
No-Clean
HalogenFree
Water
Wash
NonReworkable
Reworkable
LOCTITE
ECCOBOND
3128
LOCTIITE
5296
MACROMELT
Q 5353
LOCTITE
MULTICORE
LF 318
LOCTITE
MULTICORE
HF 212
LOCTITE
MULTICORE
WS 300
LOCTITE
MULTICORE
MP 218
LOCTITE
MULTICORE
MF 388
LOCTITE
MULTICORE
C 400
LOCITE
MULTICORE
HYDRO X
LOCTITE
ECCOBOND
E 1216M
LOCTITE
ECCOBOND
UF 3810
LOCTITE
ECCOBOND
3707
LOCTITE
STYCAST
PC 18M
LOCTITE
STYCAST
UV 7993
Liquid
Fluxes
Pastes
LOCTITE
MULTICORE
HF 250DP
LOCTITE
MULTICORE
MFR 301
Wires
Capillary Flow
LOCTITE
ECCOBOND
FP 4531
LOCTITE
ECCOBOND
XE 1218
Edgebond
6 | Medical Electronics
Inks & Coatings
ELECTRICALLY CONDUCTIVE-PTC INKS
PRODUCT
DESCRIPTION
LOCTITE
ECI 8001
E&C
Positive Temperature Coefficient
(PTC), screen printable ink designed
for applications where self-regulating
heaters are required. Formulated to
rapidly heat to a specific threshold
temperature and then maintain constant
temperature for the device.
APPLICATION
Self-regulating heating elements.
CURE SCHEDULE
SHEET RESISTANCE OHM/SQUARE/25μ
10 min. @ 120°C
1,700
CURE SCHEDULE
SHEET RESISTANCE OHM/SQUARE/25μ
ELECTRICALLY CONDUCTIVE-CARBON INKS
PRODUCT
DESCRIPTION
APPLICATION
LOCTITE
EDAG 109
E&C
Carbon ink for flexographic/rotogravure
printing on plastic film (PET, PVC) and
paper substrates.
Bio and medical sensors.
1 min. @ 120°C
<30
LOCTITE
EDAG C 932-51
E&C
Rotary screened and blendable ink.
Printed heaters.
4 min. @ 120°C
10,000-15,000
LOCTITE
EDAG C 932-74
E&C
Rotary screened and blendable ink.
Printed heaters.
4 min. @ 120°C
<50
LOCTITE
EDAG PF 407C
E&C
Screen printable carbon ink for plastic
film and paper substrates.
Membrane touch switches and
keyboards. Bio and medical
sensors.
15 min. @ 120°C
<15
LOCTITE
EDAG SS 24600
E&C
Dispersion of finely divided graphite in a
thermoplastic resin that rapidly air dries
to form a flexible conductive coating.
Bio and medical sensors.
Air dries in approx. 10 min.
<40
CURE SCHEDULE
SHEET RESISTANCE OHM/SQUARE/25μ
10 min. @ 120°C minimum,
in convection oven
<0.030
15 min. @ 95°C
<0.020
ELECTRICALLY CONDUCTIVE-SILVER INKS
PRODUCT
DESCRIPTION
LOCTITE
ECI 1001
E&C
Screen printable, conductive ink
designed for membrane-touch switch
and other flex circuit applications. Offers
excellent balance of flexibility, hardness
and adhesion.
PTF circuits, membrane touch
switches and flexible circuits.
Screen printable silver ink for PET film.
Conductive traces in membranetouch switches and other flexible
circuitry.
LOCTITE
EDAG 479SS
E&C
APPLICATION
Medical Electronics | 7
ELECTRICALLY CONDUCTIVE-SILVER INKS
PRODUCT
DESCRIPTION
APPLICATION
CURE SCHEDULE
SHEET RESISTANCE OHM/SQUARE/25μ
LOCTITE
EDAG 725A
E&C
Silver conductive polymer thick film ink
is designed for use in the production of
low voltage circuitry on polyester film.
Conductive traces in membrane
touch switches and other flexible
circuitry.
15 min. @ 120°C
<0.015
SILVER/SILVER CHLORIDE
PRODUCT
DESCRIPTION
APPLICATION
CURE SCHEDULE
SHEET RESISTANCE OHM/SQUARE/25μ
LOCTITE
EDAG 6037SS
E&C
Conductive screen printable ink. Designed for use as an
electrode material in medical bio-sensing devices.
Bio and medical
sensors.
Dry 30 min. @ 80°C
or 15 min. @ 95°C
or 15 min. @ 120°C
<0.12
LOCTITE
EDAG 6038SS
E&C
Conductive screen printable ink. Designed for use as an
electrode material in medical bio-sensing devices.
Bio and medical
sensors.
Dry 30 min. @ 80°C
or 15 min. @ 95°C
or 15 min. @ 120°C
≤0.04
LOCTITE
EDAG 7019
E&C
Screen printable, silver-filled polymer thick film that also
contains silver chloride. It is based on a thermoplastic
resin and has been formulated to provide excellent
adhesion to the wide variety of substrates used in the
manufacture of electrically conductive medical devices.
Bio and medical
sensors.
5 min. flash,
30 min. bake @ 71°C
<0.05
Silver/silver chloride ink for flexographic/rotogravure
printing on plastic film.
Bio and medical
sensors.
2 min. @ 110°C
<0.100
CURE SCHEDULE
SHEET RESISTANCE OHM/SQUARE/25μ
UV @ 0.5 joule/cm²
<2 x 109
0.5 joule/cm2
>2×109
LOCTITE
EDAG PE 007
E&C
NON-CONDUCTIVE
PRODUCT
DESCRIPTION
LOCTITE
EDAG 452SS
E&C
Screen printable, UV curable dielectric
ink for plastic film and paper substrates.
Excellent flexibility.
Tail coating membrane touch
switches and PC desktop/
notebook keyboards.
LOCTITE
EDAG PD 038
E&C
Screen printable, UV curable dielectric
ink for ITO treated PET film and copperetched circuitry.
Dot spacer for touch screens
and computer/palm-top panels.
Spacer for copper-etched
circuitry.
LOCTITE
EDAG PF 021
E&C
Encapsulating polymer designed to
secure low profile surface mount devices
to rigid or flexible substrates.
Surface mount devices.
0.4 to 1.0 joule/cm²
>1
Screen printable, UV curable dielectric
ink for plastic film. Excellent humidity
resistance.
Crossover dielectric in membrane
touch switches and PC desktop/
notebook keyboards.
UV @ 0.5 joule/cm²
<2 x 109
LOCTITE
EDAG PF 455B
E&C
APPLICATION
8 | Medical Electronics
Inks & Coatings
WATER-BASED-CARBON INKS
PRODUCT
DESCRIPTION
APPLICATION
CURE SCHEDULE
SHEET RESISTANCE OHM/SQUARE/25μ
LOCTITE
EDAG
112 E&C
Air-drying graphite coating of unusually
high conductivity. It provides excellent
static bleed properties and acts as a
protective energy absorbing layer.
EMI shielding, protective coating
on metals and plastics.
Air dry 25 min.
<50
WATER-BASED-SILVER INKS
PRODUCT
DESCRIPTION
APPLICATION
CURE SCHEDULE
SHEET RESISTANCE OHM/SQUARE/25μ
LOCTITE
ECI 1005
E&C
Designed to dry rapidly to form a
flexible, conductive coating. It is suitable
for applications using high speed
flexographic printing techniques.
RFID antenna, electronic circuitry
and bio and medical sensors.
1 min. @ 70°C
<0.050
CURE SCHEDULE
SHEET RESISTANCE OHM/SQUARE/25μ
15 min. @ 95°C
0.0175
WATER-BASED-SILVER/SILVER CHLORIDE INKS
PRODUCT
LOCTITE
EDAG PE 428
E&C
DESCRIPTION
Designed for printing on flexible
substrates. Suitable for applications
using flexographic or rotogravure
printing techniques.
APPLICATION
Body contact pads, medical
sensors.
Medical Electronics | 9
Adhesives
ELECTRICALLY CONDUCTIVE PASTES
PRODUCT
DESCRIPTION
CURE TYPE
SHELF LIFE
CURE SCHEDULES
VOLUME
RESISTIVITY
LOCTITE
ABLESTIK
84-1LMISR4
Conductive adhesive for semi-conductor
packaging applications. Ideal for small
components or high speed dispense
manufacturing.
Heat
12 months @ -40°C
60 min. @ 175°C
0.0002
LOCTITE
ABLESTIK
CA 3556HF
One-component, highly flexible,
conductive adhesive for applications
with large CTE mismatches between
substrates. Snap cure capability.
Heat
5 months @ -40°C
120 sec. @ 110°C
0.0025
LOCTITE
ABLESTIK
CE 3103WLV
Electrically conductive adhesive with
superior contact resistance stability.
Pb-free alternative to solder attachment
materials. Low viscosity for fine line
dispensing.
Heat
12 months @ -40°C
10 min. @ 120°C or
3 min. @ 150°C
0.0008
NON-ELECTRICALLY CONDUCTIVE PASTES
PRODUCT
DESCRIPTION
CURE TYPE
SHELF LIFE
CURE SCHEDULES
VOLUME
RESISTIVITY
LOCTITE
ABLESTIK
84-3
Electrically insulative, one-component
solvent-free product for die attach
applications. Ideal for either auto
dispense or screen printing.
Heat
12 months @ -40°C
1 hr. @ 150°C
3.5 x 1013
LOCTITE
ABLESTIK
2025D
A hybrid chemistry die attach adhesive
designed for PBGA, FlexBGA and for
stacking BGA packages.
Heat
12 months @ -40°C
30 min. ramp to 175ºC;
hold 15 min. @ 175ºC
1.2 x 1013
10 | Medical Electronics
COB-Encapsulants
DAM
PRODUCT
DESCRIPTION
RECOMMENDED CURE
VISCOSITY
cPs
Tg °C
LOCTITE
ECCOBOND
FP 4451TD
Industry standard material for dam
applications in BGA's. Low ionics. Ideal for tall
and narrow dam dimensions.
30 min. @ 125°C or
90 min. @ 165°C
300,000
150
PRODUCT
DESCRIPTION
RECOMMENDED CURE
VISCOSITY
cPs
Tg °C
LOCTITE
ECCOBOND
FP 4450HF
High flow, industry standard fill material. Also
for use in cavity down BGA applications. Good
for use in fine wire and low alpha applications.
30 min. @ 125°C or
90 min. @ 165°C
32,000
160
LOCTITE
ECCOBOND
FP 4651
Epoxy encapsulant features very low thermal
expansion while retaining syringe dispense
capabilities.
1 hr. @ 125°C +
90 min. @ 165°C
130,000
150
LOCTITE
ECCOBOND
FP 4802
High purity, liquid encapsulant for use in
applications using lead-free solder.
1 hr. @ 120°C +
120 min. @ 165°C
80,000
50
POT LIFE @ 25°C
CURE SCHEDULE
Tg °C
FILL
GLOB TOPS: GENERAL
PRODUCT
DESCRIPTION
LOCTITE
ECCOBOND
EO 1062
High glob formulation with low CTE and
low ionic content. Ideal for more harsh
environment applications.
25 days
4 - 6 hrs. @ 125°C
125
LOCTITE
ECCOBOND
EO 1072
One-component, high performance epoxy
encapsulant with high Tg and low extractable
ionics. Short cure cycle.
30 days
5 min. @ 140°C
135
LOCTITE
ECCOBOND
FP 4460
High purity, low stress glob top semiconductor
encapsulant with excellent moisture resistance
and working life.
2 days
3 hrs. @ 150°C
171
Medical Electronics | 11
PCB Protection
CONFORMAL COATINGS
PRODUCT
DESCRIPTION
RESIN TYPE
VISCOSITY
cPs
CURE SCHEDULE
LOCTITE
5293
Repairable, solvent-free, medium viscosity, UV/moisture cure
silicone suited to brush, dip and selective coating.
Silicone
One-Component
600
20 sec. @ 70 mW/cm2 +
72 hrs. @
room temperature
LOCTITE
5296
Heat cure silicone can be applied with brush, dip, or spray.
High reliability for automotive. Clear.
Silicone
One-Component
200
Heat 7 min. @ 125°C
LOCTITE
STYCAST
PC 18M
Flexible solvent-based, one-component urethane coating.
Provides good thermal shock resistance. MIL-I-46058C.
Urethane
One-Component
350
2 hrs. @ 60°C
LOCTITE
STYCAST
UV 7993
Solvent-free , 100% solids, one-component, dual UV cure
and secondary moisture cure conformal coating providing
excellent protection against moisture and other harsh
environments.
Urethane Acrylate
One-Component
120
5 sec. UV + 4 days @
room temperature
LOW PRESSURE MOLDING
PRODUCT
DESCRIPTION
OPERATING
TEMP, °C
VISCOSITY @
210°C MPA.S
cP
SOFETENING
POINT, °C
Tg °C
MACROMELT
MM 6208
Moldable polyamide
with excellent adhesion
to tough substrates.
Great flexibility offers
incredible strain relief on
cables and wires. Ideal
for encapsulation of heat
producing components in
appliance and consumer
electronics. UL RTI 95°C.
-40 to 130
3,200
150 to 160
-37
193
79
570
MACROMELT
Q 5353
Hot melt adhesive
for general assembly
appications in cable
industry, especially for
bonding and coating
polypropylene and other
polyolefins.
-20 to 120
10,500
151 to 161
-20
N/A
90
Approx. 400
CTE ABOVE TG SHORE A
(PPM/°C)
HARDNESS
ELONGATION AT
BREAK, %
12 | Medical Electronics
Solder Materials
PASTES-Pb-FREE HALIDE-FREE
PRODUCT
DESCRIPTION
ALLOY
METAL
LOADING
(% WEIGHT)
PARTICLE SIZE
DISTRIBUTION
LOCTITE
MULTICORE
LF318
A halide-free, no-clean, Pb-free solder
paste that has excellent humidity
resistance and a broad process window
for both reflow and printing. Offers high
tack to resist component movement
during high-speed placement, long printer
abandon times and excellent solderability
over a wide range of reflow profiles in air
and N2 reflow ovens and across a wide
range of surface finishes.
90iSC (Hi-Rel)*
96SC (SAC387)
97SC (SAC305)
88.5
AGS (type 3)
DAP (type 4)
IPC TACK
APPLICATION
(g/MM2)
1.8
2.3
Printing
25-150mms-1
IPC/J-STD-004B
CLASSIFICATION
ROL0
PASTES-Pb-FREE HALOGEN FREE
PRODUCT
DESCRIPTION
ALLOY
METAL
LOADING
(% WEIGHT)
PARTICLE SIZE
DISTRIBUTION
JIS TACK
(gF)
APPLICATION
IPC/J-STD-004B
CLASSIFICATION
LOCTITE
MULTICORE
HF 212
Halogen-free, no-clean, low voiding Pbfree solder paste. Excellent wetting to a
broad range of metallization. Wide process 90iSC (Hi-Rel)*
window for printing amd minimal slump
97SC (SAC305)
with abandon time of 1 hour. Optimize for
long soak reflow.
88.5
AGS (type 3)
DAP (type 4)
62
Printing
40 -120mms-1
ROL0
LOCTITE
MULTICORE
HF 250DP
Halogen-free, no-clean, Pb-free solder
paste shows excellent humidity resistance 90iSC (Hi-Rel)*
and solderability when reflowed in both air 96SC(SAC387)
and nitrogen across a wide range of surface 97SC (SAC305)
finishes including OSP copper.
88.5
AGS (type 3)
DAP (type 4)
DAP+ (type 4.5)
16
Printing
50 -140mms-1
ROL0
PASTES-Pb-FREE WATER WASH
PRODUCT
DESCRIPTION
ALLOY
% METAL
LOADING
IPC TACK
(g/MM2)
APPLICATION
IPC/J-STD-004B
CLASSIFICATION
LOCTITE
MULTICORE
WS 300
Flux system specially formulated for
lead-free alloys. High performance, water
washable solder paste. Residues are easily
removed with DI water, without the need
for a saponifier. Good open time with
excellent print definition and soldering.
96SC (SAC387)
97SC (SAC305)
87
0.8
Printing
25-100mms-1
ORH1
* High reliability.
Medical Electronics | 13
PASTES-Sn-Pb NO CLEAN
PRODUCT
LOCTITE
MULTICORE
MP 218
DESCRIPTION
ALLOY
High activity, soft residue, colorless, halidefree, no-clean solder paste that displays
outstanding resistance to high temperature
Sn62/Sn63/63S4
and humidity environments. Suitable for a
(anti-tombstoning)
large range of assembly processes, including
rheo pump, proflow, large high-den.
% METAL
LOADING
IPC TACK
(g/MM2)
APPLICATION
IPC/J-STD-004B
CLASSIFICATION
89.5
1.6
Printing
25-150mms-1
ROL0
LIQUID FLUXES-NO-CLEAN
PRODUCT
DESCRIPTION
SOLIDS
CONTENT (%)
ACID VALUE
(MG KOH/G)
APPLICATION
IPC/J-STD-004B
CLASSIFICATION
LOCTITE
MULTICORE
MF 388
Sustained activity in high preheats for dual wave and lead-free
processes. High PTH fill, low residues. High reliability. Solventbased flux may be thinned with IPA.
3.5
20
Spray
ROL0
LOCTITE
MULTICORE
MFR 301
Higher solids, halide-free flux for better wetting on reduced
solderability surfaces and to minimize bridging on complex
geometries. Fully lead-free and dual wave compatible. Solventbased flux may be thinned with IPA.
6.0
40
Spray/Foam
ROM0
WIRES-HALOGEN-FREE
PRODUCT
LOCTITE
MULTICORE
C 400
DESCRIPTION
Halide-free, no-clean, clear residue, cored solder wire with
increased flux content for improved wetting.
ALLOY
(SnPb)
ALLOY
(Pb-FREE)
IPC/J-STD-004B
CLASSIFICATION
Sn60
Sn62
Sn63
96SC (SAC387)
97SC (SAC305)
99C (SnCu)
ROL0
ALLOY
(SnPb)
ALLOY
(Pb-FREE)
IPC/J-STD-004B
CLASSIFICATION
Sn60
Sn62
Sn63
96SC (SAC387)
97SC (SAC305)
99C (SnCu)
ORH1
WIRES-WATER WASH
PRODUCT
LOCTITE
MULTICORE
HYDRO X
DESCRIPTION
High activity, water washable-flux cored solder wire with
excellent wetting on difficult substrates.
14 | Medical Electronics
Underfills
CAPILLARY FLOW-NON-WORKABLE
PRODUCT
DESCRIPTION
VISCOSITY cPs
POT LIFE @25°C
RECOMMENDED CURE
LOCTITE
ECCOBOND
E 1216M
Filler filled non-reworkable, high reliability with 10 mm filler
size.
3,252
4 days @ 25 ºC
3.5 min. @ 150ºC
LOCTITE
ECCOBOND
FP 4531
A snap curable lower CTE Uunderfill for flip chip for rigid
laminate and ceramic.
10,000
24 hr. @ 25 ºC
7 min. @ 160ºC
LOCTITE
ECCOBOND
XE 1218
Reworkable, snap cure, void free, fast flowing underfill,
which also provides excellent adhesion and reliability
benefits.
1,100
10 days
10 min. @ 110°C
CAPILLARY FLOW-REWORKABLE
PRODUCT
DESCRIPTION
VISCOSITY cP
POT LIFE @25°C
RECOMMENDED CURE
LOCTITE
ECCOBOND
UF 3810*
Reworkable, epoxy underfill for CSP and BGA applications.
394
3 days
≤8 min. @ 130°C
EDGEBOND
PRODUCT
DESCRIPTION
CURE TYPE
COLOR
CURE
SCHEDULES
VISCOSITY
cPs
POT LIFE
SHELF LIFE
LOCTITE
ECCOBOND
3128
Drive IC Chip reinforcement after drop test.
Heat Cure
Black
20 min. @ 80°
60 min. @ 60°
15,000
14 days
@ room
temperature
1 year @ -40°C
LOCTITE
ECCOBOND
3707**
UV curable edgebond designed for bonding
various types of electronic components on
a PCB.
UV Cure
Opaque
White
>30 sec. @ 100 m/
Wcm2
9,595
< 7 days
@ room
temperature
N/A
* High Tg.
** UV cure.
Medical Electronics | 15
Across The Board
Encapsulants
(Dam & Fill)
CSP Underfills
(Cornerbond)
Non-Conductive
Pastes
Potting
Compounds
Electrically
Conductive
Pastes
Gasketing
Conformal
Coatings
Low
Pressure
Molding
Printed
Inks
Sealants
Surface Mount
Adhesives
Thermal
Management
Materials
Solder
Materials
Assembly Film
Adhesives
AMERICAS
ASIA-PACIFIC
HEADQUARTERS:
UNITED STATES
Henkel Electronic Materials LLC
14000 Jamboree Road
CHINA
No. 332 Meigui South Road
WaiGaoQiao Free Trade Zone
Shanghai 200131, P.R. China
Tel: +86.21.3898.4800
Fax: +86.21.5048.4169
Irvine, CA 92606
USA
Tel: +1.714.368.8000
Tel: +1.800.562.8483
Customer Support: +1.888.943.6535
Fax: +1.714.368.2265
Henkel Electronic Materials LLC
20021 Susana Road
Rancho Dominguez, CA 90221
USA
Tel: +1.310.764.4600
Fax: +1.310.605.2274
BRAZIL
Henkel Brazil
Av. Prof. Vernon Krieble, 91
06690-250 Itapevi,
Sao Paulo, Brazil
Tel: +55.11.3205.7000
Across the Board,
Around the Globe.
www.henkel.com/electronics
Henkel Huawei Electronics CO. LTD
Songtiao Industrial Park Lianyungang
Jiangsu Province 222006 China
Tel: +86.518.8515.5336
Fax: +86.518.8515.3801
JAPAN
Henkel Japan Ltd.
27-7, Shin Isogo-cho
Isogo-ku Yokohama, 235-0017
Japan
Tel: +81.45.758.1800
KOREA
Henkel Technologies (Korea) Ltd.
6th Floor
Dae Ryung Techno Town II
569-21 Gasan-dong,
Geumcheon-gu, Seoul 153-771
Korea
Tel: +82.2.6675.8000
Except as otherwise noted, all marks are trademarks and/or registered trademarks of Henkel and/or its affiliates in the U.S. and elsewhere.
© Henkel Corporation, 2013. All rights reserved. 9786/LT-5892 (1/13)
MALAYSIA
Henkel (Malaysia) Sdn Bhd
Lot 973, Jalan Kampung Baru Hicom
Persiaran Tengku Ampuan, Lion Industrial
Park
Section 26, 40400 Shah Alam
Selangor Darul Ehsan
Tel: +603-51926200
Fax: +603-51926211
TAIWAN
Henkel Taiwan Ltd
Room A4, 19F-1, No.6, Sihwei 3rd Rd,
Lingya Dist., Kaohsiung, Taiwan
Tel: 886-7-335-7970
Fax: 886-7-335-1057
EUROPE
BELGIUM
Henkel Electronic Materials (Belgium) N.V.
Nijverheidsstraat 7 B-2260 Westerlo
Tel: +32.1457.5611
Fax: +32.1458.5530