Pb-free PWB Materials
Reliability Phase 5
Definition Phase
Project Leader:
Facilitator:
Steve Wilkinson
Alun Morgan
17 February 2016
1
The Problem : Potential Issues Caused By
Pb –Free SMT Reflow
Internal & Surface Delamination
Thru Hole Plating Failure
CAF Failure
Pad Cratering
These issues are more acute at higher peak reflow temperatures
Project Goal
Goal
Assess the impact of the Pb-Free soldering process
on latest generation of PWB laminates.
•Focus on suitability for high layer count / high
thermal mass board design applications in which
board surface could see temperatures up to 260° C
peak reflow temperature.
•Fine tune the testing process between consecutive
phases
•Select recently launched or about to be launched
materials
3
Project Benefits
For the OEM:
• A direct comparison of the performance of a large range of laminates
allowing designers to select (or shortlist) the best materials for specific
product requirements.
• Unique test data on how materials perform under higher SMT reflow
temperatures (260°C peak) typically needed for high layer, densely
populated, high reliability products.
• Independent testing specified by HDP OEM members and appropriate
to current product qualification demands.
For the material contributor:
• An opportunity to showcase materials and demonstrate how they
perform against other suppliers’ materials.
• Extensive independent test data that can be used to enhance in
house qualification data.
• A chance to rank laminate performance against competition for each
type of test performed and identify product strengths and weaknesses
Project History
Phase 1 – Completed 2008
FR4:
•
Isola 370 Turbo
•
Isola 370 HR
•
Isola IS415
•
Nelco N4000-29
•
Shengyi S1000
•
Shengyi S1170
•
ITEQ IT-180
•
ITEQ IT-158
•
TUC TU-752
•
Panasonic R1755
•
Panasonic 1755C
•
Panasonic R1755S
•
EMC EM-827
•
EMC EM-825
•
Hitachi MCL-E-679(W)
•
Grace GA-150LL
Halogen Free:
•
Panasonic R1566W
•
Nanya NPG
•
Nanya NPG-170
•
TUC-862HF
High Speed:
•
Isola FR408
•
Nelco N4000-12
•
Panasonic Megtron 6
Phase 2 Completed 2011
FR4:
• Panasonic R1755V
• Panasonic R2125
• Grace GA-170LE
• Mica Ava HR02
• Hitachi MCL-E-679F(J)
• ITEQ IT180A
• Nanya NP-175F
• TUC TU-768
Halogen Free FR4:
• Grace GA-HF-17
• Isola DE-156
• Nanya NPGN-170
• ITEQ IT-170GR
• TUC TU 862HF
• Hitachi MCL-HE-679G
High Speed:
• Panasonic Megtron 4
• ITEQ IT-150D
• Nanya NP-LD
• TUC TU-872LK
• Hitachi MCL-FX2
• MGC FL-700
Phase 3 Completed 2014
FR4:
• ITEQ IT-180i
• Isola IS185HR
Halogen Free:
• EMC EM-370(D)
• Shengyi S1165
• Ventec VT-447
• EMC EM-828
• ITEQ IT-170GRA
• Panasonic R1577(Megtron2)
High Speed:
• TUC TU-872SLK
• ITEQ IT-200LK
• Shengyi S7038
• Nelco D6000-2
64 Materials
Tested to Date
©HDP User Group International, Inc.
Phase 4 Completed 2015
FR4:
• Shengyi S1000-2M
Semi-Hi Speed:
• TUC TU865
Tier II Hi-Speed:
• Hitachi MCL-HE-679G(S)
Tier III Hi-Speed:
• Shengyi S7439
• Shengyi S7338
• ITEQ IT-968
• Doosan-7409D(VN)
Tier IV Hi-Speed:
• Panasonic Megtron 7
• Hitachi LW-990G
5
Phase 5 Proposed Material List
No Low Loss Requirement
• High Tg Hal-Free
• EMC EM-370 (Z)
• Hitachi MCL-E-75G
Semi high speed
Df = 0.013-0.017 @10GHz
• High Tg Hal-Free
• TUC TU-862T
Tier 1 high speed
Df = 0.010-0.013 @10GHz
• High Tg Hal-Free
• Hitachi MCL-E-78G
• Nanya NPG-171
• Panasonic R1577E
• TUC TU-863 (Thunderclad-1)
• Shengyi SE50G
Tier IV Hi-Speed
Df = 0.002-0.005 @10GHz
• High Tg
• EMC EM-891 or with Si or NE glass
• Isola Tachyon 100G
• Nelco MeteorWave 4000 with VSP copper
• Nelco N4805-20 with SI or NE glass
• TUC TU-933-SI (ThunderClad-3) with NE
glass + PPE Resin
• Shengyi SE35
• Shengyi SE40
Tier V Hi-Speed
Df < 0.002 @10GHz
• High Tg
• Rogers RO1200/RO1600PP
(Ceramic filled PTFE)
Tier III Hi-Speed
Df = 0.005-0.007 @ 10GHz
• High Tg Hal-Free
• TUC TU-883 (ThunderClad-2)
6
Test Vehicle Sections
Through hole via pitches – 1.0mm
and 0.8mm
MRT-6 Test Vehicle showing 8 sections
MRT-6 TV 20 layer construction
High and low resin contents
©HDP User Group International, Inc.
7
Thermal Analysis
Unprocessed Materials
In parallel
TGA
TTM
Full Testing
As built and after 6 X @ 260C
Td
Volatiles %
TMA
3 – 6 Months
Fabricate Boards
Tg
T260
T288
T300
Z axis CTE
Pre-Tg
Post-Tg
%
50~260℃
DSC
Tg 1
Tg 2
ΔTg
©HDP User Group International, Inc.
18 – 24 Months
Pb-Free PWB Materials Reliability
Proposed Two Stage Test Program
Pb-Free PWB Materials Reliability
Proposed Second Stage Test Program
Fabricate Boards
TTM
Thermal Stress Testing
TTM
DELAM Measurements
PWB Interconnect
Separate Into Individual
coupons
Reflow: 6 X @ 260°C
Celestica
Pad cratering /Pull Testing
IST Analysis
PWB Interconnect
Dk and Df Testing
Introbotix ?
CAF Testing
I3 ?
DSC Testing
TTM
DMA Testing
PWB Interconnect
WIC 20 Testing
Nokia
©HDP User Group International, Inc.
Thermal Analysis
Separate Into Individual
coupons
Pad cratering /Pull Testing
Reflow
6 X @ 260C
IST Analysis
PWB Interconnect
CAF Testing
I3 ?
DSC Testing
TTM
DMA Testing
PWB Interconnect
Project Deliverables
The primary project deliverable will be the final report
which will include all empirical data along with analysis,
conclusions and recommendations for future work.
The working team will consider publication of anonymised
data from the project if deemed appropriate.
10
Project Schedule
Project Task
Thermal Analysis – Unprocessed material
Test Board Fabrication
Pre-Conditioning / DELAM testing
Thermal Stress Testing
WIC 20 testing
Dk and Df testing
Pad Pull Testing*
CAF testing (CAF Coupons)
CAF testing (IST Coupons)
Thermal Analysis*
IST testing
Final Report
* = under consideration
Plan
29-Jul-16
23-Sep-16
31-Jan-17
31-Jan-17
28-Feb-17
28-Feb-17
28-Feb-17
28-May-17
28-May-17
1-May-17
22-Sep-17
31-Dec-17
11
Project Participants
•
•
•
•
•
•
•
•
•
Alcatel-Lucent
Celestica
Ciena
Curtiss Wright
Doosan
Elite Material Company
Hitachi Chemical
IBM
Isola
•
•
•
•
•
•
•
•
•
ITEQ
Juniper Networks
Oracle
Panasonic
PWB Interconnect Solutions
Shengyi
TTM
Universal Instruments
Ventec
12