CERAMIC MANUFACTURING PROCESS
RAW MATERIAL COMPOUND
MIXING AND MILLING
SPRAY DRYING
SLIP
TAPE CASTING
ROLL COMPACTION
DRY PRESSING
EXTRUSION
FIRING
DRYING
MACHINING
CUTTING
STAMPING
SINTERING
SINTERING
GLAZING
GRINDING AND LAPPING
FIRING
LASER SCRIBING
INSPECTION
INSPECTION
INSPECTION
PRESSED AND
EXTRUDED PARTS
LASER SCORED
SUBSTRATE
GLAZING
INSPECTION
SMOOTH SUBSTRATE
FOR THIN FILM
TAPE SUBSTRATE
FOR THICK FILM
GLAZED SUBSTRATE
Tape Substrates for Thick Film
We are producing 96% alumina substrates (A-476) and 93% alumina
substrates (A-473T) which have excellent thick film reliability and
consistency.
■Features
Our substrates have excellent thick film reliability and precise
dimensional tolerance control (Super premium: ±0.25%). They
are cost effective for through-hole processes with small diameter
holes (Min. 0.2mm) allowing densification of precision circuitry.
■Application
Hybrid lntegrated Circuit
Resistor Network
Chip Resistor
Potentiometer
Focus Substrate, etc
■Characteristics of Material
Item
Material
Material Code
Alumina (Al2O3)
A-476 (Tape)
White
Color
Alumina Content
Bulk Density
Water Absorption
A-473T (Tape)
Dense
Appearance
%
96
92
kg/m3
3.7 × 103
3.6 × 103
%
0
0
Vickers Hardness (Hv 1.0)
GPa
13.7
12.3
Flexural Strength
MPa
350
310
Young's Modulus
GPa
320
280
40-400˚C
7.2 × 10-6/˚C
6.9 × 10-6/˚C
40-800˚C
7.9 × 10-6/˚C
7.8 × 10-6/˚C
Coefficient of Linear Thermal Expansion
Thermal Conductivity (20˚C)
Dielectric Strenght
Volume Resistivity
Dielectric Constant (1MHz)
Dielectric Loss Angle (1MHz)
Surface Roughness
W/(m ⋅ K)
24
22
V/m
Ω ⋅ cm (20˚C)
12 × 10-6
>1014
12 × 10-6
>1014
(300˚C)
1010
1011
(500˚C)
108
109
–
9.4
8.8
× 10-4
4
6
Ra µm
0.2-0.80
0.2-0.80
■Design Guideline
Unit: Inch (mm)
Surface Roughness
Tape
Manufacturing Method
Punched/Greenscored
Laser Scored
Standard:±0.8%NLT±.004 (0.10)
Premium:±0.5%NLT±.003 (0.08)
Length & Width Tolerance
Super Premium:
±0.25%NLT±.002 (0.05)
+.008 (0.20)
–.002 (0.05)
As Fired Camber
Thickness Availability
Thickness Tolerance
Size Availability
Scribing Tolerance
Standard:±0.8%NLT±.004 (0.10)
Premium:±0.5%NLT±.003 (0.08)
Super Premium:
±0.25%NLT±.002 (0.05)
Edge to Scoreline:
+.008 (0.20) –.002 (0.05)
Scoreline to Scoreline:
±.002 (0.05)
Parallelism
Standard:0.5% of outside dim.
±.002 (0.05)
Perpendicularity
Premium:0.3% of outside dim.
Corner R
Hole Size
Spacing Between Holes
or Edge to Holes
Surface Roughness
.020 (0.51)
*
.008 (0.20) Dia. Min.
*
.015 (0.38) Square Min.
Minimum equal to
*
thickness of substrate
NLT±.020 (0.51)
A-476: 8 to 30 µ inch CLA (Ra 0.2-0.75 µ m)
A-473T: 8 to 30 µ inch CLA (Ra 0.2-0.75 µ m)
A-473T (93% Alumina)
■Application
■Features
● Thick
● Uniform
film hybrid IC
● Focus
grain size and small voids
● Equivalent
substrate, and others
● Less
● Larger
● Tight
SEM (A-473T)
size can be produced (Max. 8" × 10")
tolerance:Standard: ±0.5%
● Same
5.00 µm
to A-476 for thick film characteristics
camber and edge-curl
Premium: ±0.25%
surface roughness on both sides
Pressed and extruded parts
As a leader in ceramic developement and one of the largest
manufacturers of advanced ceramics in the world, Kyocera offers a
complete line of ceramics with features such as; excellent electrical
insulation at high frequency, high mechanical strength, high heat
resistance, high wear resistance, extremely low thermal expansion and
excellent chemical resistance. Kyocera's advanced dry pressing and
extrusion technology can provide complicated designs and precise
dimensional tolerances.
■Characteristics of Material
Material
ALUMINA
(Al2O3)
Item
Material Code
A-459
A-445
A-473
Appearance
A-476
A-479
A-479SS
A-480S
Dense
Color
Russet
Dark brown
White
Ivory
Al2O3 90% Al2O3 91% Al2O3 92% Al2O3 96% Al2O3 99% Al2O3 99.5% Al2O3 99.7%
Alumina Content
High Mechanical Strength, High Temperature Resistance, High Frequency Insulation, High Chemical Resistance
Good for
Light
Good for Good Surface Hard and
Hard and
Metallizing Intercepting, Metallizing, Smoothness Chemically
Chemically
High Heat Mechanically
Stable
Stable,
Dissipation
Strong
Fine Grain Strong
and Smooth
Electrical
Characteristics
Thermal
Mechanical
Characteristics Characteristics
Main Characteristics
Bulk Density
Water Absorption
Vickers Hardness (HV1.0)
Flexural Strength
Compressive Strength
Young's Modulus
Poisson's Ratio
Fracture Toughness
kg/m3
%
GPa
MPa
MPa
GPa
–
 m
MPa√
40~400˚C
Coefficient of Linear Thermal Expansion
×10 -6/˚C
40~800˚C
Thermal Conductivity
W/m ⋅ K
Specific Heat
J/kg ⋅ K
Heat Shock Resistance (Put in water)
˚C
V/m
Dielectric Strength
20˚C
Ω ⋅ cm
Volume Resistivity
300˚C
500˚C
Dielectric Constant (1MHz)
–
(×10 -4)
Dielectric Loss Angle (1MHz)
Loss Factor
(×10 -4)
JIS C2141
JIS C2141
JIS R1610
JIS R1601
–
JIS R1602
JIS R1607
JIS R1618
JIS R1611
JIS R1611
–
JIS C2141
3.6 x 103
0
11.8
310
–
280
0.23
–
7.0
7.9
14
0.75 x 103
–
12 x 106
>1014
1011
109
8.8
6
53
3.8 x 103
0
12.7
290
–
320
0.24
–
7.3
8.1
12
0.75 x 103
–
12 x 106
>1011
107
106
9.8
25
245
3.6 x 103
0
12.3
310
2,300
280
0.23
–
6.9
7.8
18
0.75 x 103
200
12 x 106
>1014
1012
1010
9.0
6
54
3.7 x 103
0
13.7
350
–
320
0.23
–
7.2
7.9
24
0.75 x 103
200
12 x 106
>1014
1010
108
9.4
4
38
3.8 x 103
0
15.2
270
2,160
360
0.23
4.6
7.2
8.0
29
0.75 x 103
200
12 x 106
>1014
1010
108
9.9
2
20
3.8 x 103
0
15.2
340
2,350
370
0.23
4.2
7.2
8.0
32
0.75 x 103
250
12 x 106
>1014
1013
1010
9.9
1
10
High Purity,
High Chemical
Resistance,
Good
Anti-Plasma,
Wear
Resistance
3.7 x 103
0
16.2
350
–
380
0.23
–
7.2
8.0
32
0.75 x 103
–
12 x 106
>1014
1013
1010
9.9
1
10
MULLITE
(3Al2O3 ⋅ 2SiO 2)
K-690
ML-652
S-210
ZIRCONIA
(PSZ)
FORSTERITE
(2MgO ⋅ SiO 2)
STEATITE
(MgO ⋅ SiO 2)
S-211
Porous
F-1120
F-1023
Z-201N
Dense
White
Dark brown
White
Dark brown
–
–
–
–
–
–
Excellent Thermal Shock Resistance
Thermal Insulator
Good Light Shield
Good Surface
Finish
High Thermal
Expansion
High Mechanical
Strength, Excellent
Wear Resistance,
Good Surface
Finish, High
Fracture
Toughness
2.8 x 103
0
5.4
180
–
120
0.24
–
7.4
8.0
2.2
0.71 x 103
–
13 x 106
>10 14
1010
107
6
18
–
3.1 x 103
0
6.4
180
–
130
0.22
–
9.2
10.4
2
0.71 x 103
–
13 x 106
>10 14
107
107
8
750
–
3.0 x 103
0
6.9
160
–
150
0.24
–
9.7
–
5
0.75 x 103
–
13 x 106
>10 14
1010
1010
6.5
5
–
3.0 x 103
0
5.9
160
–
150
0.24
–
10.1
–
5
0.75 x 103
–
13 x 106
>10 14
109
109
6.5
5
–
6.0 x 103
0
12.3
980
5,690
210
0.31
4.5
10.5
11.0
3
0.46 x 103
300
–
–
–
–
–
–
–
Very low Thermal
Expansion
Very low Thermal
Expansion
2.0(Bulk) x 103
10~20
–
30
–
–
–
–
4.1
4.8
1
0.67 x 103
–
–
–
–
–
–
–
–
3.2 x 103
0
10.8
280
–
210
–
–
5.0
5.8
5
0.75 x 103
–
12 x 106
>10 14
1012
109
7.4
20
148
1kgf/mm 2=9.807MPa
Milky white
Light yellow
1cal/cm ⋅ sec ⋅ ˚C=418.7W/(m ⋅ k)
1cal/g ⋅ ˚C=4.187J/ g ⋅ K=4.187x10 3J (kg ⋅ K)
Thin Film Substrates
For thin film deposition, we have 99.6% alumina substrates (A-493,
A-494) which offer excellent surface smoothness.
■Characteristics of Material
Item
Surface Roughness
Unit: Inch (mm)
Unit
Side A: CLA µinch
(Ra µm)
Side B:
kg/m3
Bulk Density
µm
Grain Size Average
Alumina Content
Color
Water Absorption
A-493
A-494
3.0 (.08)
2.0 (.05)
5.0 (.125)
4.0 (.10)
3.86 × 103
< 1.5
< 1.0
Wt%
99.6
–
White
–
Nil
1MHz
9.9±.2
Dielectric Loss Angle
1MHz
Volume Resistivity
Ω ⋅ cm
2 × 10-4
> 1014 (25˚C)
33
30
25
Dielectric Constant
Thermal Conductivity
25˚C
300˚C
500˚C
Wm/ ⋅ k
per˚C
Coefficient Of Linear
25 to 300˚C
7.2 × 10-6
Thermal Expansion
25 to 600˚C
7.4 × 10-6
25 to 800˚C
8.2 × 10-6
MPa
550
Flexural Strength
Design Guideline
Thickness
SEM
A-493
A-494
Thickness
Unit: Inch (mm)
Standard: .010 (0.25), .015 (0.38), .025 (0.635)
Minimum: .005 (0.127)
Maximum: .040 (A493), .027 (A494)
Tolerance
Standard: ±10% NLT±.002 (0.05)
Premium: ±5% NLT±.0008 (0.02)
6.0 µm
6.0 µm
Length, Width
Item
Green Score
Surface Roughness
Tolerance
A-493
Laser Score
4.7" × 4.7" (120 × 120)
Max Size
Standard:
±0.8% NIL±.004"
Premium:
±0.5% NIL±.003"
(0.10) Standard:
+.008"/-.002" (+0.2/-0.05)
Premium:
(Thickness:0.020"orLESS)
(0.08) ±.004"/-.002" (+0.1/-0.05)
Perpendicularity
Straightness
a
100 µm
L
A-494
L
Perpendicularity
b
1 µm
Straightness
Standard:
a=L × 0.5% b=L × 0.5%
Premium:
a=L × 0.3% b=L × 0.3%
.002"
Polished Substrates For Thin Film
■Features
● Excellent
● Tight
surface quality for thin film application.
dimensional tolerances (thickness, flatness).
■Material
● Kyocera
A493, A494 (99.6% alumina)
● Available
● .002"
●8
thickness .010"-.0315" (0.25-0.80mm)
thickness is available with maximum size of 2" × 2" and
µ inch surface finish.
■Visual Defects
● Scratches:
● Voids:
.0003" deep max.
.0008"dia max.
● Contamination:
Not allowed (by naked eye)
Surface Roughness Data
100µm
0.5µm
A-493 Standard
A-493 Premium
■Surface Roughness
Unit: Inch (mm)
Standard
1.2 µ inch CLA (Ra0.03 µ m)
Premium
0.4 µ inch CLA (Ra0.01 µ m)
A-494 Standard
■Thickness Tolerance
Unit: Inch (mm)
Size
Less than 3"
3" or more
Standard
±.0008 (0.02)
±.0020 (0.05)
Premium
±.0004 (0.01)
±.0008 (0.02)
A-494 Premium
■Flatness
Size (inch)
Unit: Inch (mm)
Standard
One side polished
Premium
Both sides polished
One side polished
Both sides polished
2 × 2 × .010
.0020 (0.05)
2 × 2 × .015
.0016 (0.04)
.0012 (0.03)
.0010 (0.025)
.0006 (0.015)
2 × 2 × .025
.0008 (0.02)
.0006 (0.015)
.0005 (0.013)
.0004 (0.01)
3 × 3 × .010
.0036 (0.09)
.0030 (0.075)
.0020 (0.05)
.0016 (0.04)
3 × 3 × .015
.0032 (0.08)
.0024 (0.06)
.0016 (0.04)
.0012 (0.03)
3 × 3 × .025
.0024 (0.06)
.0016 (0.04)
.0012 (0.03)
.0008 (0.02)
4 × 4 × .010
.0200 (0.50)
.0120 (0.30)
.0100 (0.25)
.0050 (0.13)
4 × 4 × .015
.0100 (0.25)
.0060 (0.15)
.0050 (0.13)
.0032 (0.08)
4 × 4 × .025
.0032 (0.08)
.0024 (0.06)
.0020 (0.05)
.0016 (0.04)
4.5 × 4.5 × .015
.0200 (0.50)
.0140 (0.35)
.0120 (0.30)
.0080 (0.20)
4.5 × 4.5 × .025
.0080 (0.20)
.0060 (0.15)
.0050 (0.13)
.0040 (0.10)
max.
.0016 (0.04)
max.
.0014 (0.035)
max.
.0010 (0.025)
max.
Glazed Substrates for Thermal Printheads
■Features
Kyocera glazed substrates consist of 96% alumina with a glass
overcoat. They have superior flatness and fewer surface
defects so it is very applicable for thermal printheads used in
advanced and downsized facsimile machines. Kyocera can
provide various types of glazed substrates for each application
such as partial glazed, full glazed and serial glazed substrates.
Glazed Substrates
1.Partial Glazed Substrates
Used in both thin and thick film types of thermal printheads for high speed G3 and G4
type facsimiles and color printers. Heater elements are put on a 1 to 3 mm narrow
glazed portion to allow thermal printheads to closely fit a sheet of thermal paper and
provide very clear and crisp printing.
Glazed Part
2.Full Glazed Substrates
Used in thick film type of thermal printheads for regular type of facsimiles. The glazed
surface is quite flat and the meniscus at the edges are low, so the full glazed
substrates allow thermal printheads print very clear words.
Glazed Part
3.Serial Glazed Substrates
Used in thermal printheads for wordprocessors and bar code printers. The dimensional
tolerances of glaze pitch are very tight allowing the distance between the substrate
edge and the glazed portion for heater elements to be short and the width of the
glazed portion to be narrow so high speed printing is possible.
Glazed Part
■Glazed Substrate Material Specification
Item
Unit
Condition
GS-5
GS-71
Glass Transition Temperature
˚C
–
669
680
Glass Softening Temperature
˚C
–
856
1/˚C
R. T. to 400˚C
6.6 × 10
6.8 × 10-6
W/m ⋅ k
20˚C
0.83
0.75
20˚C
>1014
>1014
300˚C
>1014
>1014
500˚C
2.8 × 1010
2.1 × 1010
Coefficient of Linear Thermal Expansion
Thermal Conductivity
Ω ⋅˚C
Volume Resistivity
870
-6
Dielectric Constant
–
1MHz 20˚C
7.2
8.7
Dielectric Loss Angle
–
1MHz 20˚C
14.6 × 10-4
10.0 × 10-4
Surface Roughness
Ra µm
<0.02
<0.02
■Glazed Substrate Design Guideline
Unit: Inch (mm)
STD Dimensions
Item
Thickness
STD Tolerance
Premium Tolerance
.025 (0.635)
±.0024 (±0.06)
±.0016 (±0.04)
.032 (0.800)
±.0032 (±0.08)
±.0024 (±0.06)
.040 (1.000)
±.0040 (±0.10)
±.0032 (±0.08)
±.080 (±0.20)
±.040 (±0.10)
±.080 (±0.20)
±.040 (±0.10)
Full Glaze
.024 max. (0.6 max.)
.020 max. (0.5 max.)
Partial Glaze
.020 max. (0.5 max.)
.016 max. (0.4 max.)
Full Glaze
.020 max. (0.5 max.)
.016 max. (0.4 max.)
Partial Glaze
.016 max. (0.4 max.)
.012 max. (0.3 max.)
±.0006 (±15µm)
±.0004 (±10µm)
±.0004 (±10µm)
±.00028 (±7µm)
.0008 max. /.120
.0006 max. /.120
L:12.44 max.
(316 max.)
Outside Dimensions
W:3.15 max.
(80 max.)
Thickness
.025/.032
Camber
(0.635/0.8)
Substrate Size: 9 × 3.1 (230 × 80)
Glaze Thickness: .0027 (70 µm)
Thickness
.040 (1.0)t
Full Glaze:
.0018 to .0032
Glaze Thickness
(45 to 80µm)
Partial Glaze:
.0012 to .0024
(30 to 60µm)
Meniscus of Full Glazed Substrates
.120" from all edges
Glaze thickness of partial glazed substrate with width of less than .035" is .002" max.
(3mm)
(20µm max./3mm)
(15µm max./3mm)
Microwave Dielectric Ceramics
1.Filter, Isolator, MIC
■Features
●
Miniaturization of circuit size is possible due to the ceramic's
■Features
high dielectric constant.
● Downsizing
● High
●
Q values even at high frequencies.
Stable circuit operation can be obtained due to the low
temperature coefficient of the dielectric constant.
●
Because of a wide range of dielectric values, circuit design
can be tailored to fit the application more easily.
●
Surface finish can be selected to allow use with thin film or
thick film technologies.
●
2.Dielectric Resonator (DR) (Satellite Broadcast,
Base Station)
Numerous custom designs such as holes, complicated 3
dimensional shapes, and snaplines are available due to
Kyocera's advanced dry press technology.
of DR or cavity is possible because of high ε γ and
high Q value.
● Stable
electrical characteristics
■Characteristics of Material
Material Code
Dielectric Constant
Q value
SM200
εγ
(GHz)
SM210
SH790
SH890
SH110
SB350
SL390
SV430
35~37
39~42
43~46
20±1
21±1
79±1
89±1
110±3
>8000
>8000
>1500
>1800
>1200
(6)
(6)
(2.6)
(2.6)
(2.3)
4500
6500
4400
(10)
(10)
(10)
τε
τε
τε
τε
τε
τf
τf
τf
-25±30
-25±30
-35±30
-35±30
-70±30
0±1~8±1
-3±1~8±1
-7±1~8±1
1/˚C
9.2 × 10-6
9.2 × 10-6
10.1 × 10-6
9.0 × 10-6
W/m ⋅ k
7.5
7.5
2.1
2.1
2.1
2.9
2.9
2.9
Bulk Density
kg/m3
3.7 × 103
3.7 × 103
5.7 × 103
5.7 × 103
5.7 × 103
4.6 × 103
5.6 × 103
4.8 × 103
Flexural Strength
MPa
190
190
180
180
180
180
100
290
Water Absorption
%
0
0
0
0
0
0
0
0
Temperature Coefficient (τ ε or τ f)
Coefficient of Linear Thermal Expansion (40~400˚C)
Thermal Conductivity
ppm/˚C
Application
MIC Filter/Isolator/MIC
■Shapes
● Snaplines
and via holes can be added by the pressing
process.
● Products
10.1 × 10-6 10.1 × 10-6
can be designed to the customer's individual
specifications and requirements.
10.3 × 10-6 10.2 × 10-6
DR
Aluminum Nitride Substrates
■Features
● High
thermal conductivity (7 to 8 times as much as Al2O3)
● Thermal
expansion is close to Silicon wafer.
● High
mechanical strength and high density.
● High
chemical durability.
■Characteristics of Material
Item
Materials
AN215
AN217
Color
–
Black
Light Russet
3
Bulk Density
g/cm
Thermal Conductivity
Thermal
Characteristics
Coefficient of Linear
Thermal Expansion
Electrical
3.4
W/m ⋅ k
150
170
×10-6/˚C
RT~400˚C
4.8
~800˚C
5.4
Dielectric Strength
V/m
Volume Resistivity
Ω ⋅ cm
■Characteristics Comparison (AIN/AL2O3)
Thermal Conductivity (W/m ⋅ K)
200
12 × 10-6
150
Dielectric Strength
V/m × 106
14
>10
Characteristics
Dielectric Constant
1MHz
Dielectric Constant
(1MHz)
10
100
20
15
8.7
50
10
5
5
Dielectric Loss Angle 1MHz (×10-4)
Hardness (Hv1.0)
3
GPa
100
Flexural Strength
MPa
10.8
400
500
Mechanical
Characteristics
Flexural Strength
MPa
310
Young's Modulus
GPa
300
2.5
5
Dielectric
Loss Angle
1MHz (×10-4)
5max
AIN
Al2O3
10
Thermal Expansion *10-6/˚C (RT-400˚C)
■Thermal Characteristics
■Thermal Conductivity VS Temperature
300
300
SiC
250
BeO
Thermal Conductivity (W/mK)
Thermal Conductivity (W/mK)
200
300
200
ALN
150
100
Si
50
GaAs
BN
Al2O3
0
BeO
250
200
AN217
150
AN215
100
50
Al2O3
0
1
2
3
4
5
6
Thermal Expansion (10-6/˚C)
7
8
9
1
50
100
150
Temperature (˚C)
200
250
Multiform Glass
■Features
● High
thermal resistivity
● Excellent
● Sealing
dielectric strength
● High
mechanical strength
● High
electrical resistivity
operation is made simple
■Characteristics of Material
Item
Unit
Characteristics
Material Code
Coefficient of Linear
Thermal Expansion
G901
1/˚C
G902
30~380˚C 24.0±1.5 (×10-7)
27.5±1.5 (×10-7)
Annealing Temperature
˚C
525
520
Softening Temperature
˚C
825
820
Strain Point
˚C
470
3
465
3
Bulk Density
kg/m
2.15±0.05×10
Flexural Strength
MPa
45
20˚C
Volume Resistivity
Dielectric Strength
>1014
Ω ⋅ cm 300˚C
1012
500˚C
109
V/m
Viscosity-Temperature Curve
25 (120) × 10
-6
(120) is measured by direct current using .010 thickness test piece.
Strain point
14
Annealing point
12
Cathode-Ray Tube
Log Viscosity (poise)
10
8
Softtening point
6
Working-point
4
2
0
400
600
800
1000
1200
Temperature (˚C)
1400
1600
Magnetic materials
Ferrite
Soft magnetic materials
Ferrite
■Features
● Manufactured
by the highest technical ceramic manufacturer
in the world.
● Many
standard materials to fit your application.
● Complex
shapes, high precision are no problem with Kyocera
outstanding pressing technology and are available at
competitive prices.
● The
industry's best selection for magnetic shielding for SMT
components or entire circuit.
● Metallization
is also available.
■Characteristics of Material
Code No.
NZ001A NZ021A NZ112A NZ131A NZ221A NZ241A NZ273B NZ311A NZ312B NZ341A NZ411A NZ411B NZ511A NZ511G
100kHz
1
7
65
160
370
480
150
650
490
900
800
1,100
2,000
450
1MHz
1
7
65
160
370
480
150
650
500
950
800
1,200
1,500
430
10MHz
1
7
65
160
220
300
160
270
260
330
200
250
240
220
26,000
200
150
30
15
120
20
15
15
50
15
15
80
3,600
130
80
60
30
50
55
60
65
80
120
360
210
1,300
180
280
3,000
2,700
80
4,500
3,200
4,400
4,700
5,300
9,600
4,400
35
0
50
4
15
15
20
0
20
25
15
7
8
35
0
35
2
7
10
10
–1
9
15
6
2
–2
Saturated Magnetic Flux Density Bs (mT)
80
380
370
290
350
250
390
290
360
380
380
320
230
Residual Magnetic Flux Density Br (mT)
20
230
160
110
120
90
210
110
160
190
170
100
130
108
108
108
108
108
108
108
108
108
108
108
108
108
Initial Permeability
100kHz
(×10-6)
Relative loss factor
1MHz
(tan δ / µ)
(×10-6)
10MHz
(×10-6)
–25~20˚C
Relative Temperature
Coefficient (α µ r)
(×10-6)
20~80˚C
(×10-6)
Electrical Resistivity (Ω ⋅ cm)
108
■DESIGN GUIDELINE
DR CORE
SQUARE CORE
● Both
● Both
● d,
alumina and ferrite are available.
W&w depends on D&t.
alumina and ferrite are available.
● Complicated
shape, high precision are no problem with
D 7.0
(d)
0.8
D' 7.0
(D)
1.0
(t)
1.0
(W)
0.2
(w)
0.25
d
t
d 1.5
d' 1.5
w
W
Minimum
Dimension
UNITS:mm
D
KYOCERA out-standing press technology.
t
φd
φD
0.4
d'
D'
l 1.0
t
l
t
2t+l 7.0
UNITS:mm
PUSHPIN CORE
CAP CORE
● Suitable
● Suitable
● Using
for magnetic shielding components.
with cap core, low-height is possible.
● Square
● Using
for magnetic shielding components.
type is suitable for auto mounting system.
with pushpin core, low-height is possible.
2.5 A 10.0, 1.0 C 5.0
A = φ2.2~6.0
A
4.5
UNITS:mm
D 0.3
D 0.5
atC 3.0
at3.0 C 5.0
Minimum dimension of B&D in round pot cores
as follows
B 0.4
D 0.3
NOTE:B&D depends on A&C
A
METALIZATION
(2520)
0805
(2012)
A
B
0.45±0.15
0.2MAX.
0.40±0.15
0.1MAX.
normal metalization
0603
0.15
(1608)
+0.25/–0.10
0402
0.15
(1005)
+0.25/–0.10
side metalization
flat metalization
figure
0.3-0.8
0.1-0.35
A
1008
Ag(Ag/Pd)+Ni+Sn/Pb(Au)
Alumina & Ferrite core with metalization
alumina and ferrite are available.
B
● Both
B 0.8
at6.0 A
C
0.5
D
B 0.5
at4.0 A 6.0
D
C
B 0.3
atA 4.0
D
φ1.2
C
B
B
B
0.1
0.1MAX.
0.1MAX.
Ag(AgPd)+Ni+Sn/Pb
good point
alumina
––––
good adhesion
higt Q (45 at 25MHz)
ferrite
––––
good adhesion
higt Q (28 at 8MHz)
Single Crystal Sapphire Substrates
■Sapphire
■Features
● Perfect
● Mirror
● Low
● High
control of crystal orientation. (Fig. 1)
polished surface.
dielectric loss: Tan δ <10-4.
thermal conductivity.
● Excellent
chemical durability.
Crystal Orientation (Fig.1)
■SOS Substrates
■Features
● SOS
■Characteristics of Material
Material Code
SA-100
Appearance
Dense
Color
Transparent
Principle Materials
Al2O3
3.97 × 103
Bulk Density (kg/m3 )
Water Absorption (%)
22.5
Flexural Strength (MPa)
690
Young's Modulus (GPa)
470
Coefficient of Linear
Parallel to C-axis
5.3 × 10-6/˚C
Thermal Expansion at 25˚C (1/˚C)
Vertical to C-axis
4.5 × 10-6/˚C
Thermal Conductivity (W/mk)
41.9
48 × 106
Dielectric Strength (V/m)
20 ˚C
1016
300 ˚C
–
500 ˚C
1011
Parallel to C-axis
11.5
Dielectric Constant (1MHz)
Vertical to C-axis
Dielectric Loss Angle (1MHz)
circuit miniaturization. (Fig.2)
● Applicable
● Excellent
● Simplify
for high speed circuits.
radiation hardness.
IC designing and process.
0
Vickers Hardness (GPa, Hv 1.0)
Volume Resistivity (Ω ⋅ cm)
(Silicon On Sapphire) structure.
● Enable
9.3
<10-4
Comparsion in structure and individual chip size of SOS and
bulk silicon