Active High Power Conversion Efficiency Rectifier

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184
IEEE TRANSACTIONS ON BIOMEDICAL CIRCUITS AND SYSTEMS, VOL. 2, NO. 3, SEPTEMBER 2008
Active High Power Conversion Efficiency Rectifier
With Built-In Dual-Mode Back Telemetry in
Standard CMOS Technology
Gaurav Bawa, Student Member, IEEE, and Maysam Ghovanloo, Member, IEEE
Abstract—In this paper, we present an active rectifier with high
power conversion efficiency (PCE) implemented in a 0.5- m 5
V standard CMOS technology with two modes of built-in back
telemetry; short- and open-circuit. As a rectifier, it ensures a
, taking advantage of active synchronous rectification technique in the frequency range of 0.125–1 MHz. The
built-in complementary back telemetry feature can be utilized in
implantable microelectronic devices (IMD), wireless sensors, and
radio frequency identification (RFID) applications to reduce the
silicon area, increase the data rate, and improve the reading range
and robustness in load shift keying (LSK).
PCE
80%
Index Terms—Back telemetry, CMOS, full-wave rectifier, implantable microelectronic devices, inductive link, radio frequency
identification (RFID), wireless.
I. INTRODUCTION
S
IZE-CONSTRAINED high power implantable microelectronic devices (IMD) such as retinal and cochlear implants,
low-cost passive radio frequency identification (RFID) tags, and
many wireless sensors cannot accommodate any internal energy
sources in the form of batteries due to their low energy density,
high cost, and limited lifetime [1]–[5]. There is also a need for
data to be transferred from such systems to the outside world
which may include the status of the implant, a feedback loop, or
other stored or collected information [4], [5]–[12]. In applications where high data rates are not necessary, wireless power and
bidirectional data transmission can occur by modulating a single
20 MHz and using load-shift keying (LSK)
carrier at
through an inductive link, as shown in Fig. 1. LSK requires either a good coupling between the transponder and reader coils
or large variations in the impedance seen across the transponder
coil [5], [13].
With the size of the transponder being limited, the small coupling, , between the coils forms a bottleneck in power and
Manuscript received November 07, 2007; revised February 11, 2008 and
April 04, 2008. Current version published October 24, 2008. This work was
supported in part by the College of Engineering at North Carolina State University (NCSU), Raleigh. This paper was recommended by Associate Editor
M. Sawan.
G. Bawa is with the NC-Bionics Laboratory, Department of Electrical and
Computer Engineering North Carolina State University, Raleigh, NC 27695,
USA (e-mail: gbawa@ncsu.edu).
M. Ghovanloo is with the GT-Bionics Laboratory, School of Electrical and
Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30308
USA (e-mail: mgh@gatech.edu).
Color versions of one or more of the figures in this paper are available online
at http://ieeexplore.ieee.org.
Digital Object Identifier 10.1109/TBCAS.2008.924444
Fig. 1. Block diagram of a generic system for wireless power and data transmission across an inductive link. Our focus, here, is on the gray box.
data transmission. On the power front, it is imperative for the
rectifier to be extremely efficient to convert the small received
ac power to dc and present it to the load with minimum dissipation. A more efficient rectifier can deliver a given amount of
power for a lesser voltage induced across the secondary coil.
Thus, it requires a smaller coupling coefficient, , and allows
for a greater relative distance between the coils. Active rectifiers have been proven to be more efficient compared to their
diode-connected passive counterparts in several prior designs
[14]–[17]. They also generate less heat for the same amount of
power being delivered to the load, keeping the IMD and its surrounding tissue cooler [18].
On the data front, it is important to maximize the changes in
transponder impedance variations to compensate for the small
coupling coefficient and overcome noise and interference on the
reader [5]. Most traditional LSK methods rely on the nominal
loading of the transponder to induce the impedance change. If
the loading varies over time, which is the case especially in more
complex systems, the reading range will be adversely affected
because one should always consider the worst-case loading in
designing the back telemetry link.
We hereby present a high power conversion efficiency (PCE)
active back telemetry rectifier (ABTR), which has built-in dualmode LSK capability, both open- and short-circuit, enabling
transfer of data back to the reader at higher rates or over further distances, while accommodating varying load conditions.
This is an improvement over an earlier diode-connected version
of this rectifier described in [19].
II. CIRCUIT DESCRIPTION
The complete circuit schematic of the ABTR is shown in
Fig. 2, and simulated waveforms at some of the important nodes
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BAWA AND GHOVANLOO: ACTIVE HIGH PCE RECTIFIER
185
Fig. 2. Complete active back-telemetry rectifier (ABTR) schematic for forward power and reverse data transmission over an inductive link.
TABLE I
ACTIVE BACK TELEMETRY RECTIFIER MODES OF OPERATION
Fig. 3. Simulation results showing the coil voltages (V
), gate and bulk voltages for P (V
V voltage (V
). f = 1 MHz.
tively), and the dc output voltage (V
and V
and V
), divided
, respec-
are shown in Fig. 3. The rectifier has three modes of operation
namely, Rectifier, short-coil (SC) , and open-coil (OC), which
are summarized in Table I. When the two ABTR logic inputs
, the circuit operates as a full-wave
are low
rectifier providing an unregulated dc supply to the load. The
basic architecture of the rectifier is similar to [19], wherein the
, while the
main rectifying elements are the pMOS pair,
provide the current path back to the coil. In
nMOS pair,
the positive half-cycle when
, as a result of recto
via
tifier switch activation, current flows from
, from
to Ground (i.e., p-type substrate) via
,
via
. Therefore, during rectifier
and from Ground to
conduction,
and
V by the load current times the channel resistance of the switching elements or
the voltage across drain-substrate parasitic diode, whichever is
smaller. These effects are visible in Fig. 3.
is given by
, which is dyThe bulk potential of
and
namically controlled to be connected to the higher of
, at all times. This helps minimizing latch-up, body effect,
and substrate leakage problems as explained in [20]. However,
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IEEE TRANSACTIONS ON BIOMEDICAL CIRCUITS AND SYSTEMS, VOL. 2, NO. 3, SEPTEMBER 2008
instead of diode-connecting
for rectification, as we did in
[19], leading to dropout voltages across each pMOS above the
, here we actively drive the gates of
threshold voltage,
via a pair of high speed comparators,
, to bias
in the
deep triode region during conduction. This would result in a
significant reduction in the MOS channel resistance and consequently the rectifier dropout voltage [21], [22].
compare the coil voltages
and the output dc
. If
, the gates of
are pulled
voltage
to ground, pushing them deep into the triode region. If
, the gates of
are connected to their dynamically controlled body potential,
, forcing them to cut off. Since at
steady state the switching occurs almost at the peak of the input
coil voltage, depending on the output ripple, the cross-connected
also stay in deep triode while conduction takes place, thus
providing maximum conductance to the current path and minimizing the ABTR dropout voltage.
To ensure proper rectifier operation as described above, we
have employed a pair of comparators with hysteresis, shown
in box-2 of Fig. 2 [21]. Each comparator has a folded cascode
input stage to perform signal comparison even above the rail
with some power dissipation overhead (see Table III). It is followed by an output stage to ensure rail-to-rail swing. The middle
stage is essentially a high-speed latch, which provides noise reduring the conduction
jection and immunity to dips in
phase. This dip, which can be seen in Fig. 3, is due to the curand
, when
rent passing through the rectifying elements
, causing
to become slightly negative and hence
.
lowering
, when
The comparators delay at the onset of
switches are expected to be open, can lead to flow of current from the ripple rejection capacitor,
, back to the coil.
This reverse current can cause coil voltage distortions, increased
due to
power dissipation in the switches, and decrease
. To account for the comparators delay, a
loss of charge from
lossless capacitive divider
is employed which
, at the
generates a reduced version of the coil voltage,
comparator inputs. This would expedite comparators’ toggling,
and has a phase lead effect, which reduces the reverse currents.
A side effect of the capacitive divider is, however, an additional
firing to close
when
(see
delay in
F and
Fig. 3). At nominal loading conditions with
k , the dip in
was observed to be 101 mV in simulations and correspondingly lowered
by 94 mV for an
input division ratio set to 93%. The hysteresis window was,
therefore, set to be 100 mV, as a safe margin.
, is too low and the comAt startup, the output voltage,
parator outputs are unpredictable. Thus, we employed a small
, similar to [19], in pardiode-connected startup rectifier
allel to the main rectifier to generate a temporary stable supply,
, just for the comparators and the bias-generation circuitry. Once
stabilizes by charging
up to a certain
level ( 3.5 V), a voltage monitor circuit, shown in box-5 of
and
together via , turning the
Fig. 2, connects
startup rectifier off due to its larger dropout. The voltage monitor has no static power dissipation.
, the secondary
In the SC mode of operation
tank is shorted by pulling the gates of
up to the
Fig. 4. Die photo of the active back telemetry rectifier chip fabricated in AMI
0.5-m standard CMOS process (0:45 0:9 mm ).
2
highest on-chip voltage,
. This is accomplished through
a pair of on-chip level-shifting multiplexers,
(box-3,
Fig. 2), which can convert any on-chip logic level to
reduces
Ground. The small resistance presented across
, thereby decreasing the voltage across
its quality factor,
and the current through it. Since
in this mode,
pull the gates of
high and keep them off. This would
from being discharged through
.
eliminate
,
In the OC mode of operation
is opened by connecting the gates of
in the main
and startup rectifiers to their respective bulk potentials using
. This would increase
of
tank, increasing
and the current through .
the voltage across
Drastic changes in
during SC and OC modes with respect to its nominal value in the rectifier mode, which is de, result in similar changes in
and
currents
pendant on
[5]. These changes when
due to their mutual inductance,
captured by a small resistor or a current-sense transformer on
the primary side, as shown in Fig. 1, can be used to demodulate the power carrier amplitude variations and recover the back
telemetry data. Dual-mode back telemetry feature of the proand
posed rectifier can, therefore, provide more variations in
enhance the reading range especially in complex systems where
is variable.
III. MEASUREMENT RESULTS
We have developed a prototype chip for the proposed ABTR
architecture in the AMI 0.5- m 3M/2P n-well 5-V standard
CMOS process. The die photo is shown in Fig. 4, which active
area, excluding the pad frame, is 0.4 mm . The rectifier was
powered by an HP-8111A function generator through a pair of
planar spiral coils fabricated on PCB [23].
The values for the primary and secondary coils were mea, 2.24 ; and
,
,
sured ,
1.56 , using a high precision LCR meter (Instek-LCR819).
and
were adjusted to resonate at each desired carrier frequency in
2 MHz range, while the rectifier was
k and
F. The current flowing
loaded with
into the rectifier was differentially measured across a 10 reand the ABTR input.
sistor connected in series between
The connection between
and Ground was passed through a
,
),
current sense transformer (
as shown in Fig. 1, and the transformer isolated output voltage,
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BAWA AND GHOVANLOO: ACTIVE HIGH PCE RECTIFIER
187
Fig. 6. Measured ABTR waveforms showing consecutive OC , Rectifier, and
and R
SC modes of operation at f
k .
MHz, C
=1
Fig. 5. Measured rectifier PCE and output dc voltage versus (a) carrier frek , and (b) loading R when f
: MHz.
quency when and R
V
V, C
F.
(peak) = 5
=1 =1
( )
= 05
called
, was directly connected to one of the oscilloscope
current.
channels to monitor the changes in
Fig. 5(a) shows the measured performance of the ABTR at
when it is
different frequencies in terms of the PCE and
in the Rectifier mode and
is adjusted at 5 V. We
observed that there exists a fine balance between the input capacitive voltage divider ratio, delay, and hysteresis voltage of
the comparators (see Section IV). In the present design, we oband
V around
tained the peak
MHz, while
was measured in the fre–1 MHz. Fig. 5(b) illustrates the efquency range of
fects of
on the PCE and
for the present ABTR architecture, which also depend on the size of the rectifying elements.
k , PCE decreases due to the increased voltage
For
and
, while the switching duty cycle also
drop across
increases. For
k , the output power becomes comparable to the ABTR losses, hence decreasing the PCE.
Fig. 6 shows the measured transient waveforms when the
MHz and switched between OC,
ABTR is operated at
rectification, and SC modes, consecutively, by changing its digital inputs at 33 kHz. Even though the SC input is not shown,
the effect of each rectifier operating mode and changes in
are quite obvious on
and
. It can also be seen, from
, that
exponentially discharges in
during OC and
SC, and recharges during the normal rectifier operation.
and
Another observation was that the changes in
during OC were smaller than those during SC. This was because of the presence of electrostatic discharge protection cir-
= 144 nF
=1 cuitry,
shown in box-1 of Fig. 2, as part of the pad-frame
structure. These circuits are off during SC mode and normal recincreases
tifier operation. However during OC mode, when
and
go beyond the supply rail,
turn on and form a
rail and eventually
leakage path across the rectifier to the
. This leakage path clamps
at a diode-drop
to the load,
and does not allow
to increase as much as it
above
should.
In order to demonstrate the ABTR back telemetry operation
through SC and OC inputs, and evaluate the effect of dualmode operation on the reading range and bit-error rate (BER),
we generated a 200 kb/s Manchester-encoded serial data bit
stream using a digital I/O card. A sample segment of the original data stream at 100 kb/s and its Manchester-encoded version are shown on traces 1 and 2 of Fig. 7, respectively. In this
experiment, the nominal coils separation, loading, and carrier
mm,
k , and
MHz,
frequency were
respectively. Data recovery on the primary side involved digi(trace-3 in Fig. 7) at 250 MHz using a digital
tization of
oscilloscope (Tektronix DPO4034) and processing it offline in
were detected to indicate the
MATLAB. Zero crossings of
carrier signal period and reconstruct the received carrier envelope.
There were two types of amplitude variations at the primary;
one at high frequency (200 kb/s) due to the rectifier LSK, and the
other at low frequency due to fluctuations in the power amplifier output voltage, coils separation, and other sources of interference. The undesirable low frequency interference was elimi, and subtracting it
nated by running a moving average on
from the carrier envelope information. Thereafter, binarization
that were above
was performed by checking the peaks of
or below the moving threshold. Comparing the resulting waveform, which is shown on trace-4 of Fig. 7, with trace-2 demonstrates the accuracy of the demodulated serial data bits. Finally,
the original symbols were recovered by Manchester decoding
trace-4 via edge detection and retrieval of pulsewidth information (trace 5).
With this setup in place, the BER was measured by comparing
the back scattered and received data bit streams for a total of
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IEEE TRANSACTIONS ON BIOMEDICAL CIRCUITS AND SYSTEMS, VOL. 2, NO. 3, SEPTEMBER 2008
Fig. 7. Waveforms showing (from top) the original and Manchester-encoded data bit streams, primary sensed current, carrier envelope, and recovered back
telemetry data, which was sent through the ABTR OC input at 200 kHz with f
MHz, R
k and d
mm.
=1
2048 bits (256-bit frames in 8 trials). However, no errors were
detected. Considering the facts that a dedicated reader was not
utilized and the coil dimensions were not optimized, we simply
, that could maindefined the maximum coil separation,
as the reading range in our test setup. For
tain
k ,
was 28 and 25 mm for SC and OC modes, reto 300 ,
for SC was respectively. When we reduced
for OC was increased to 26 mm, deduced to 23 mm, while
spite its subdued operation due to the ESD circuitry. This result
was expected because as mentioned in Section I, maximizing
the transponder impedance variations can improve the reading
range in inductively powered devices. Thus, we could conclude
was variable, a combination of SC and OC modes
that when
increased the reading range in our experimental setup by 12%
compared to using only one of these modes similar to the traditional LSK scheme.
=1 = 20
measured differentially in order not to disturb the transponder
isolation from the reader.
and
,
To find the relationship between
we have further simplified the schematic diagram of Fig. 2 to the
is defined
equivalent circuit model in Fig. 8. Here is how
(1)
(2)
(3)
where
is the load -factor and
is the unloaded -factor
of . It is also possible to find the voltage transfer function
, which
across the inductive link,
derivation is given in the appendix, assuming
[24]
IV. DISCUSSION
In this section we take a closer look at some of the specific
characteristics of the proposed ABTR, which can potentially
affect its PCE and performance in back telemetry.
A. Variations in Loaded
from measured or simulated
If we calculate
to give
the above equation can be solved for
(5)
in Different Modes of Operation
We talked about variations in the secondary -factor when
tank loading in its 3 modes of
the ABTR changes the
(loaded
operation. Here we would like to understand how
) changes and in what range. This in turn depends on the linearized equivalent resistance,
, seen through the rectifier
and
during ABTR
input port. Direct measurement of
operation is not feasible. Therefore, we calculated them indirectly from other measurable parameters in the setup shown in
Figs. 1 and 2. A straight forward set of measurable values could
and , which are named
and ,
be the voltages across
respectively, when other variable parameters such as , , and
are held constant. Obviously,
needs to be
(4)
, then
We combined the realistic off-chip component and parasitic
values from the test setup described in Section III with postat
layout extracted ABTR model in SPICE to simulate
and
MHz. Table II summarizes the
and
variations in different modes of ABTR operation.
changes in a wide range and
It can be seen that
assumption holds true with
k in the Rectifier and OC
modes, where (4) and (5) will be valid, but not the SC mode.
and
when the
With this setup, we have also simulated
ESD protection circuits are not present and there are no undein the OC mode (in a high voltage
sired leakage currents to
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BAWA AND GHOVANLOO: ACTIVE HIGH PCE RECTIFIER
189
Fig. 8. Simplified and linearized equivalent circuit description for the inductive
wireless link shown in Fig. 2.
Q
AND
R
TABLE II
VARIATIONS IN VARIOUS MODES OF RECTIFIER OPERATION
FOR
K = 0:1
Z
Fig. 9. Imaginary, real, and magnitude of the transponder impedance, , and
its loaded quality factor,
, versus the linearized resistance seen through
in Fig. 8.
ABTR input port
R
process for example). It can be seen that
in this case is inwith respect to the Rectifier mode
creased and extended
even further. This would results in easier back telemetry data demodulation and extended reading range. It should also be noted
,
tends to decrease
that with heavier loading, i.e., lower
in the Rectifier mode, while it stays the same in the OC mode,
.
thereby increasing
for the SC or the Rectifier modes with small
cannot
be computed using (4) and (5) since
. In this case Fig. 8
should be analyzed or simulated without the simplifications discussed in the Appendix. According to the simulations using the
typical model in the AMI 0.5- m CMOS process, the effective
resistance of
across
is
3 for a gate voltage of
is 0.03 for this mode of opera3 V. Hence, the resulting
if
k compared to
tion, which results in a larger
the OC mode.
Z
Fig. 10. Reflected impedance ( ) at the primary shown in the complex plane
as a function of equivalent loading at the secondary (
), with
ascending from left to right in the range 1 1 k
[5].
0
B. Reflected Impedance in Back Telemetry
The reflected impedance on to the primary side,
, is the key
parameter in back telemetry and a function of the impedance at
in Fig. 8. It is given by
the secondary,
(6)
(7)
(8)
Using (1),
Q
in (7) can be converted to a more useful form
(9)
change
Fig. 9 shows how the imaginary and real parts of
as
varies from short to 1 k in our setup at
MHz.
and
change with
. It can be
Fig. 9 also shows how
, which corresponds
observed that when
, the imaginary part of
will be negligible
to
at resonance. In this region, which includes the Rectifier and
R
R
OC modes of operation according to Table II, an increase in
(e.g., when switching from Rectifier to OC) results in a
, and a reduction in . This is
reduction in , an increase in
evident in Fig. 6 waveforms. On the other hand, when
(e.g., switching from Rectifier to SC),
is highly inductive and
largely contributed by the inductance of . Similarly,
will
be highly reactive and therefore, results in both amplitude and
phase modulation on the primary side.
It can also be inferred from Fig. 9 that for very small values
there is a complete dominance of
and any changes
of
would produce little change in . The real part of
in
peaks at
, which corresponds to
. Therefore, for heavily loaded transponders that result in
, the existence of the OC mode in the proposed ABTR
seems to be an effective way in extending the reading range.
It is also instructive to look at the locus curve of the reflected
impedance in different ABTR modes of operation, which are
shown in Fig. 10 for our experimental setup. Reducing
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Fig. 11. Pie-chart showing the simulation results of the ABTR distribution of
input power in the Rectifier mode at maximum efficiency (90.4%) and nominal
loading of R
k .V
V, f
: MHz, and C
F.
=1 =5
=05
=1
TABLE III
ACTIVE BACK TELEMETRY RECTIFIER SPECIFICATIONS
Fig. 12. Simulated rectifier PCE and output dc voltage versus R when ideal
are used in the ABTR of Fig. 2 (compare with Fig. (5b).
comparators A
Operating conditions: V
V, f
: MHz, C
F.
(
)
(peak) = 5
=05
=1
consumed mainly in the buffers employed after the comparator
switches (see Fig. 2). The dissipablocks to drive large
and
ON-resistance
tion in the main rectifying elements
(P_SWITCHES) is 7.4%, i.e., the bottleneck to a highest achievable PCE. This is despite operating these switches in deep triode
region. Even though it is possible to reduce P_SWITCHES by
increasing the size of the rectifying elements, it comes at the expense of silicon area and increased parasitic capacitance of these
switches. Hence, there needs to be a compromise between the
rectifier size, comparator drive capability, and carrier frequency,
which is out of the scope of this paper. A detailed theoretical
analysis and optimization of the active integrated CMOS rectifiers can be found in [25].
D. Limits to Rectifier Output Voltage
reduces the resistive component of
(moving from right to
left), resulting in load modulation [5].
C. Power Distribution in Rectifier Mode
A post-layout simulation of the ABTR circuit in Fig. 2 was
performed to analyze the power distribution in various power
dissipating elements in the Rectifier mode when it provides the
V,
maximum PCE based on Section III measurements (
MHz,
F, and
k ). Fig. 11 shows
the result of this simulation in a pie-chart. The rectifier PCE,
obtained by dividing the power delivered to the load by the total
input power, was 90.4%, which is 5.6% higher than the measured value in Fig. 4. We believe that this discrepancy was resulted from the additional parasitic components, which were not
included in the rectifier model, especially those from interconnects and measurement instrumentation. In a real application,
such as in Interestim-2B [2], since the rectifier block is going to
be part of a system-on-a-chip (SoC), its efficiency is likely to be
closer to the higher simulated value.
in
driver
The static dissipation
comparators) and bias generator is the quiescent
circuitry (
current supplied from
(see Table III). The dynamic power
in the rectifier is caldissipation
culated by subtracting the static power from the total dissipation in the driver circuitry when operating the rectifier. This is
As mentioned in Section II, we have introduced a phase-lead
when
is being switched OFF to account for the comparator
delay and eliminate reverse currents [15], [19]. On the other
hand, the loss-less capacitive divider also introduces a phase-lag
is being switched ON. The comparator delay also adds
when
to this lag and results in a notable reduction in the switching duty
cycle. In the present design, for example, the input capacitive divider has a ratio of 0.93, which corresponds to a 350 mV dropout
voltage at 5-V input. Thus, a lower dropout can be achieved in
this architecture by employing a faster comparator and reducing
the phase-lead accordingly.
E. Limits to Rectifier Efficiency
In active rectifiers the comparator characteristics such as
delay, power consumption, and output drive capability have a
significant effect on the maximum achievable efficiency. To
observe the effect of comparator delay on efficiency, we ran
simulations on the ABTR post-layout extraction in the same
with ideal
conditions as in Section IV-C, while replacing
comparators that had zero delay, unlimited drive capability, and
was swept in Fig. 12 from 10 to
no power dissipation.
100 k similar to the measured results described in Fig. 5. The
same trend can be observed with the PCE reaching 96.2% for
10 k . This shows that there is only 3.8% power
dissipation in the rectifying elements, which is almost half of
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BAWA AND GHOVANLOO: ACTIVE HIGH PCE RECTIFIER
191
the amount shown in Fig. 11 with realistic comparators that
have 33 ns delay.
The reduced power dissipation in the rectifying elements can
,
be attributed to the increased rectifier switching duty cycle,
as a result of eliminating the phase-lead capacitive voltage diand
in Fig. 2). This in turn reduces the
vider (
and
to replenish the
average current passing through
charge in
that is delivered to
in every carrier cycle.
also depends on the
and affects the
ripple.
Hence, the RC load can also affect the amount of power that is
dissipated in the switching elements as can be seen in Fig. 12.
and that the primary and secondary tanks
Assuming
are often tuned at the carrier frequency, we can substitute (8) in
(14) and reach at
(15)
Using this in (10) and (11) leads to
(16)
(17)
V. CONCLUSION
An integrated active full-wave rectifier with dual-mode back
telemetry has been implemented in a 0.5- m 5-V standard
CMOS process and successfully tested. Being able to both
short- and open-circuit the transponder LC tank, results in
changing the secondary loaded -factor in a wide range, and
potentially improves the system reading range. It can also
improve the back telemetry data bandwidth in inductively
powered devices such as biomedical implants and RFID tags
by adding more symbols. The rectifier employs dynamic
body voltage regulation, synchronous gate control, and active
switches to minimize the dropout voltage across the rectifying
elements and increase the ac–dc PCE. Wide-range high speed
hysteresis comparators are used with phase-lead to block the
reverse current from load to LC-tank, and improve the rectifier
efficiency. Most of the rectifier internal power is dissipated in
the ON resistance of the switching elements. Faster comparators
can potentially reduce the dropout voltage and improve the
ABTR efficiency. Table III summarizes some of the ABTR
specifications.
Using (14)–(17), we can write the voltage transfer function as
(18)
(19)
Taking the magnitude of the above equation
(20)
Substituting (8) and rearranging (20),
(21)
Since
, (21) can be simplified further to give
APPENDIX
In this section, we have derived the voltage transfer func, in Fig. 9 which was used in
tion across the inductive link,
Section IV. We can write the KVL equations for the currents in
and , shown as and , respectively
(10)
(11)
(22)
ACKNOWLEDGMENT
The authors would like to thank U.-M. Jow from GT-Bionics
Lab for helping with the test setup. They also appreciate the
free fabrication opportunity provided to them by the MOSIS
educational program (MEP).
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where
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(12)
(13)
The secondary coil voltage is related to its current by
(14)
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Gaurav Bawa (S’07) was born in Punjab, India, in
1981. He received the B.Tech. degree in electrical
engineering from the Indian Institute of Technology,
Delhi, India, in 2003. He is currently working
towards the M.S. degree in electrical engineering at
North Carolina State University, Raleigh.
In the summer of 2002, he was an Intern in the Microelectronics Group at University of Udine, Italy,
and in fall 2003, at National Instruments, India, in
the Motion Control Group. From 2003 to 2006, he
worked as a Design Engineer at ST Microelectronics,
India. During this period, he was involved in the design and validation of Flash
Memory test vehicles in submicron NVM technology, for which he received
corporate recognition, and subsequently in the design of analog-to-digital converters for the product division. His current research interests include low-power
RF, analog and digital circuit design for biomedical applications.
Mr. Bawa is a member of Phi Kappa Phi and Tau Beta Pi.
Maysam Ghovanloo (S’00–M’04) was born in
1973. He received the B.S. degree in electrical
engineering from the University of Tehran, Tehran,
Iran, in 1994, the M.S. (hons.) degree in biomedical
engineering from the Amirkabir University of
Technology, Tehran, Iran, in 1997, and the M.S. and
Ph.D. degrees in electrical engineering from the University of Michigan, Ann Arbor, in 2003 and 2004,
respectively. His Ph.D. research was on developing
a wireless microsystem for Micromachined neural
stimulating microprobes.
From 1994 to 1998, he worked part-time at IDEA Inc., Tehran, Iran, where he
participated in the developing a modular patient care monitoring system. In December 1998, he founded Sabz-Negar Rayaneh Co. Ltd., Tehran, Iran, to manufacture physiology and pharmacology research laboratory instruments. In the
summer of 2002, he was with the Advanced Bionics Inc., Sylmar, CA, working
on the design of spinal-cord stimulators. From 2004 to 2007, he was an Assistant Professor at the Department of Electrical and Computer Engineering,
North Carolina State University, Raleigh, where he founded and directed the
NC Bionics Laboratory. In June 2007, he joined the faculty of Georgia Institute
of Technology, Atlanta, where he is currently an Assistant Professor in the Department of Electrical and Computer Engineering.
Dr. Ghovanloo is an Associate Editor for the IEEE TRANSACTIONS ON
CIRCUITS AND SYSTEMS II: EXPRESS BRIEFS. He has been a member of the
technical program committee for the IEEE Midwest Circuits and Systems
(MWSCAS), International Symposium on Circuits and Systems (ISCAS), and
Biomedical Circuits and Systems (BioCAS) conferences. He has received
awards in the operational category of the 40th and 41st DAC/ISSCC student
design contest in 2003 and 2004, respectively. He has served as a Technical
Reviewer for major IEEE and IoP journals in the areas of circuits, systems,
and biomedical engineering. He is a member of Tau Beta Pi, Sigma Xi, and
IEEE Solid-State Circuits, IEEE Circuits and Systems, and IEEE Engineering
in Medicine and Biology Societies.
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