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7
-5-
Photovoltaic Series
Planar Diffused Silicon Photodiodes
The Photovoltaic Detector series is utilized for applications requiring high
sensitivity and moderate response speeds, with an additional sensitivity
in the visible-blue region for the blue enhanced series. The spectral
response ranges from 350 to 1100 nm, making the regular photovoltaic
devices ideal for visible and near IR applications. For additional sensitivity
in the 350 nm to 550 nm region, the blue enhanced devices are more
suitable.
These detectors have high shunt resistance and low noise, and exhibit
long term stability. Unbiased operation of these detectors offers stability
under wide temperature variations in DC or low speed applications. For
high light levels (greater than 10mW/cm2), the Photoconductive Series
detectors should be considered for better linearity.
These detectors are not designed to be reverse biased! Very slight
improvement in response time may be obtained with a slight bias.
Applying a reverse bias of more than a few volts (>3V) will permanently
damage the detectors. If faster response times are required, the
Photoconductive Series should be considered.
Refer to the Photovoltaic Mode (PV) paragraph in the “Photodiode
Characteristics” section of this catalog for detailed information on
electronics set up.
18
"
APPLICATIONS
• Colorimeters
• Photometers
• Spectroscopy Equipment
• Fluorescence
"
FEATURES
• Ultra Low Noise
• High Shunt Resistance
• Wide Dynamic Range
• Blue Enhanced
Photovoltaic Series
λp
nm
typ.
Capacitance
(pF)
A/W
min.
Shunt
Resistance
(GΩ)
0V
typ.
typ.
-10 mV
NEP
√Hz)
(W/√
Rise
Time
(ns)
0V
970 nm
0V
632 nm
50 Ω
min.
typ.
typ.
typ.
1.0
10
2.1 e -15
30
Temp*
Range
(°C)
Package
Style ¶
Storage
Responsivity
at
λp
Operating
Dimension (mm)
2
Area (mm )
Model Number
Active Area
Peak
Responsivity
Wavelength
Typical Electro-Optical Specifications at TA=23ºC
‘DP’ Series, Metal Package
PIN-2DPI ‡
1.1
0.81 x 1.37
150
PIN-125DPL
1.6
1.27 sq.
160
3.2
1.27 x 2.54
320
PIN-3CDPI
4 / TO-18
8 / TO-18
0.5
5.0
3.0 e -15
4 / TO-18
50
7 / TO-18
5.1
2.54 φ
500
0.4
4.0
3.4 e -15
60
PIN-5DP
PIN-13DPI
13
3.6 sq
PIN-13DP
PIN-6DPI
16.4
970
0.55
1200
0.60
4.57 φ
2000
0.35
0.2
3.5
2.0
3.6 e -15
3.9 e -15
150
-55 ~ +125
PIN-5DPI
-40 ~ +100
PIN-3CDP
5 / TO-5
2 / TO-5
5 / TO-5
3 / TO-8
220
PIN-6DP
PIN-44DPI
2 / TO-5
6 / TO-8
44
6.6 sq
4300
0.1
1.0
4.8 e -15
3 / TO-8
475
10 / Lo-Prof
100
11.28 φ
9800
0.05
0.2
6.8 e -15
1000
613
27.9 φ
60000
0.002
0.1
3.0 e -14
6600
PIN-10DP
PIN-25DP
-20 ~
+70
6 / TO-8
PIN-10DPI
-10 ~
+60
PIN-44DP
11 / BNC
12 / BNC
3.2
1.27 x 2.54
320
0.75
5.0
3.0 e -15
20
FIL-5V
5.1
2.54 φ
500
0.50
4.0
3.4 e -15
60
FIL-20V
16.4
4.57 φ
2000
0.20
2.0
3.9 e -15
220
FIL-44V
44
6.6 sq
4300
0.10
1.0
4.8 e -15
475
FIL-100V
100
11.28 φ
9800
0.05
0.2
6.8 e -15
1000
PIN-220DP
200
10 x 20
20000
0.02
0.2
1.2 e -14
2200
0.60
Super Blue Enhanced ‘DP/SB’ Series
Model No.
Active
Area/Dimension
2
Responsivity
(A/W)
Capacitance
(pF)
Rsh
(MΩ)
√Hz)
NEP (W/√
Operating Current
(mA)
Rise Time
(µs)
typ.
min.
typ.
max.
typ.
mm
PIN-040DP/SB
0.81
1.02 φ
60
1
2.0 e-14
0.5
0.02
PIN-5DP/SB †
5.1
2.54 φ
450
150
5.2 e -14
2.0
0.2
100
11.28 φ
8800
10
2.0 e -13
10.0
2.0
0.15
typ.
0.20
PIN-10DPI/SB
PIN-220DP/SB
15 / Plastic
(All Specifications @ λ= 410 nm, VBIAS= 0V, RL= 50Ω)
mm
PIN-10DP/SB
min.
14 / Plastic
27 / Plastic
Package
Style ¶
-20 ~ +70
0.55
-10 ~ +60
970
-20 ~ +70
FIL-3V
-10 ~ +60
‘DP’ Series, Plastic Package §
1/ TO-18
5 / TO-5
11 / BNC
10 / Metal
200
10 x 20
17000
5
2.9 e -13
10.0
4.0
27 / Plastic
‡ The ‘I’ suffix on the model number is indicative of the photodiode chip being isolated from the package by an additional pin connected to the case.
§ The photodiode chips in “FIL” series are isolated in a low profile plastic package. The have a large field of view as well as “in line” pins.
¶ For mechanical drawings please refer to pages 55 thru 66.
† Operating Temperature: -40 to +100 ºC, Storage Temperature: -55 to +125 ºC.
* Non-Condensing temperature and Storage Range, Non-Condensing Environment.
19
Photodiode Care and Handling Instructions
AVOID DIRECT LIGHT
Since the spectral response of silicon photodiode includes the visible light region, care must be taken to avoid photodiode exposure to high ambient
light levels, particularly from tungsten sources or sunlight. During shipment from UDT Sensors, your photodiodes are packaged in opaque, padded
containers to avoid ambient light exposure and damage due to shock from dropping or jarring.
AVOID SHARP PHYSICAL SHOCK
Photodiodes can be rendered inoperable if dropped or sharply jarred. The wire bonds are delicate and can become separated from the photodiode’s
bonding pads when the detector is dropped or otherwise receives a sharp physical blow.
CLEAN WINDOWS WITH OPTICAL GRADE CLOTH / TISSUE
Most windows on UDT Sensors photodiodes are either silicon or quartz. They should be cleaned with isopropyl alcohol and a soft (optical grade) pad.
OBSERVE STORAGE TEMPERATURES AND HUMIDITY LEVELS
Photodiode exposure to extreme high or low storage temperatures can affect the subsequent performance of a silicon photodiode. Storage temperature
guidelines are presented in the photodiode performance specifications of this catalog. Please maintain a non-condensing environment for optimum
performance and lifetime.
OBSERVE ELECTROSTATIC DISCHARGE (ESD) PRECAUTIONS
UDT Sensors photodiodes, especially with IC devices (e.g. Photops) are considered ESD sensitive. The photodiodes are shipped in ESD protective
packaging. When unpacking and using these products, anti-ESD precautions should be observed.
DO NOT EXPOSE PHOTODIODES TO HARSH CHEMICALS
Photodiode packages and/or operation may be impaired if exposed to CHLOROTHENE, THINNER, ACETONE, or TRICHLOROETHYLENE.
INSTALL WITH CARE
Most photodiodes in this catalog are provided with wire or pin leads for installation in circuit boards or sockets. Observe the soldering temperatures and
conditions specified below:
Soldering Iron:
Soldering 30 W or less
Temperature at tip of iron 300°C or lower.
Dip Soldering:
Bath Temperature:
Immersion Time:
Soldering Time:
Vapor Phase Soldering:
DO NOT USE
Reflow Soldering:
DO NOT USE
260±5°C.
within 5 Sec.
within 3 Sec.
Photodiodes in plastic packages should be given special care. Clear plastic packages are more sensitive to environmental stress than those of black
plastic. Storing devices in high humidity can present problems when soldering. Since the rapid heating during soldering stresses the wire bonds and can
cause wire to bonding pad separation, it is recommended that devices in plastic packages to be baked for 24 hours at 85°C.
The leads on the photodiode SHOULD NOT BE FORMED. If your application requires lead spacing modification, please contact UDT Sensors
Applications group at (310)978-0516 before forming a product’s leads. Product warranties could be voided.
54
1. Parameter Definitions:
A
a
B
c
=
=
=
=
Distance from top of chip to top of glass.
Photodiode Anode.
Distance from top of glass to bottom of case.
Photodiode Cathode
(Note: cathode is common to case in metal package products unless otherwise noted).
W = Window Diameter.
F.O.V. = Filed of View (see definition below).
2. Dimensions are in inches (1 inch = 25.4 mm).
3. Pin diameters are 0.018 ± 0.002" unless otherwise specified.
4. Tolerances (unless otherwise noted)
General: 0.XX ±0.01"
0.XXX ±0.005"
Chip Centering: ±0.010"
Dimension ‘A’: ±0.015"
5. Windows
All ‘UV’ Enhanced products are provided with QUARTZ glass windows,
0.027 ± 0.002" thick.
All ‘XUV’ products are provided with removable windows.
All ‘DLS’ PSD products are provided with A/R coated glass windows.
All ‘FIL’ photoconductive and photovoltaic products are epoxy filled instead of
glass windows.
For Further Assistance
Please Call One of Our Experienced
Sales and Applications Engineers
310-978-0516
- Or On the Internet at
www.udt.com
55
Mechanical Specifications
All units in inches. Pinouts are bottom view.
56
Mechanical Specifications
All units in inches. Pinouts are bottom view.
57
Mechanical Specifications
All units in inches. Pinouts are bottom view.
59