25706CP 25 GHz Latched Comparator Data Sheet Applications • • • • • • Broadband test and measurement equipment Oscilloscope and logic analyzer front ends Window comparators High speed line receivers and signal regeneration Threshold and/or peak detectors High speed triggers Features • • • • • • Supports clock rates up to 25 GHz 100 ps propagation delay input to output (Clk-Q) Low power consumption: 550 mW typ. Fast rise and fall times: 15 ps typ. Deterministic Jitter: 2.0 ps p-p typ. Random Jitter 0.2 ps RMS typ. • • • • • • Hysteresis <5 mV Output amplitude 1.2 Vpp differential Supports single-ended and differential operation Single –3.3 V power supply Available in LGA package or die Evaluation board available Description The 25706CP is an exceptionally fast latched voltage comparator with very low thermal hysteresis that operates with clock rates from DC to 25 GHz. The part is nominally positive-edge triggered; however, by reversing the positive and negative clock connections, a negative-edge triggered application can be accommodated. All differential analog inputs and differential clock inputs are DC coupled on-chip and terminated with resistors to ground. The differential data outputs should be terminated off chip with 50 Ω resistors to ground. The 25706CP operates from a single -3.3 V power supply and is available in a ceramic land grid array (LGA) package or in die form. The packaged part is also available on an evaluation board with SMA connectors. For customers requiring a comparator that operates from a +3.3 V power supply Inphi offers the 25707CP. Block Diagram GND IN+ IN- In OUTp Out 25706CP Latch OUTn Clk In CLKINp CLKINn VEE 1/31/05 25706CP_DS_1.1 Inphi Proprietary Page 1 of 15 Absolute Maximum Ratings • • • Stresses beyond those listed here may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated in the “Operating Conditions” and “Electrical Specifications” of this datasheet is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameter Min Typ Max Unit VEE –3.6 --- +0.5 V IN+, IN-, CLKIN –2 --- +0.6 V DOUT –3.5 --- +1 V Operating Temperature (Junction) – Die TJ --- --- +175 °C Operating Temperature (Case) – Packaged TC --- --- +125 °C TSTORE --- --- +125 °C RH 0 --- 100 % VEE, GND >1000 --- --- V Outputs >200 --- --- V Clock & analog inputs >100 --- --- V Power Supply Voltage Analog and Clock Input Signals Output Signals Shipping/Storage Temperature Humidity ESD protection (HBM)1 Symbol VESD Conditions Notes: 1 As per JESD22-A114-B. ESD testing has not been completed. Operating Conditions • Important Note: Unused I/O should be terminated with 50 Ω to GND for all specifications to be met. Parameter Symbol Conditions Min Typ Max Unit Power Supply Voltage VEE ± 5% Tolerance –3.465 –3.300 –3.135 V Power Supply Current IEE --- 167 255 mA On-Chip Power Dissipation PD --- 550 800 mW Operating Temperature (Junction) – Die TJ +15 --- +125 °C Operating Temperature (Case) – Packaged TC –5 --- +85 °C 1/31/05 25706CP_DS_1.1 Inphi Proprietary Page 2 of 15 DC Electrical Specifications ! WARNING – To prevent damage to the part: • DC power must be turned off prior to connecting or disconnecting any cables. • Electrical specifications guaranteed when the part is operated within the specified operating conditions Parameter Symbol Conditions Min Typ Max Unit Analog Input Specification Input High Level VIH GND referenced -0.5 --- 0.5 V Input Low Level VIL GND referenced -0.8 --- 0.0 V Input Amplitude1 VINpp Differential peak-to-peak --- --- 1200 Single ended peak-to-peak --- --- 1000 VOS --- ±1.5 ±6 mV ∆VOS/∆T --- 3 --- µV/°C 55 62.5 70 Ω 5 6 mV Input Offset Voltage2 VOS Temperature Coefficient DC input resistance RIN Input to GND Measured with DC input and 100 MHz clock Hysteresis (DC) mVpp Clock Specification Input High Level VIH GND referenced –0.5 --- 0.5 V Input Low Level VIL GND referenced –0.8 --- 0 V Input Amplitude1 VCLKpp Differential peak-to-peak 300 --- 1200 Single ended peak-to-peak 300 --- 1000 RCLKIN Input to GND 45 50 55 Ω Data Output Amplitude DOUT Differential peak-to-peak 1000 1200 1400 mVpp Output High Voltage VOH DC coupled, GND referenced -85 -55 0 mV Output Common Mode VOCM DC coupled, GND referenced -425 -360 -300 mV Output Eye Cross VOEC Single-ended measurement 40 50 60 % DC input resistance Output mVpp Specification3 Notes: 1 Analog and clock input amplitudes <300 mVpp may cause part to fail the following AC electrical specifications: Clock Phase Margin, Deterministic Jitter, Random Jitter, Clock to Data Output Delay. 2 Typical refers to variance or “1-sigma” value. Expectation value is 0 mV. 3 Outputs are CML and must be externally DC terminated with 50 Ω to GND. 1/31/05 25706CP_DS_1.1 Inphi Proprietary Page 3 of 15 AC Electrical Specifications ! WARNING – To prevent damage to the part: • DC power must be turned off prior to connecting or disconnecting any cables. Electrical specifications guaranteed when the part is operated within the specified operating conditions Parameter Symbol Conditions Min Typ Max Unit 0 to 13 GHz 14 15 --- 13 to 25 GHz 11 12 --- Soak time = 0.1 µs --- 2 --- Soak time = 1 µs --- 12 --- Soak time = 100 µs --- 16 --- 25 --- --- GHz Input Specification Input Return Loss Thermal Hysteresis1 RLIN VTHYS dB mV Clock Specification Maximum Clock Frequency fMAX Minimum Clock Slew Rate SMIN At CLKIN zero crossing --- --- 1 V/ns Clock Input Return Loss RLIN 0 to 25 GHz 11 12 --- dB Clock Phase Margin CPM 25 GHz 305 --- --- deg tr/tf 20–80% --- 15 18 ps --- --- --- dB Output Specification Output Rise/Fall Time Output Return Loss6 RLOUT Deterministic Jitter4 JD Peak-to-peak --- 2.0 3.5 ps Random Jitter5 JR RMS --- 0.2 0.3 ps Clock to Data Output Delay2 tQ Die 30 40 50 Packaged 80 100 120 Between 20 and 10 mV overdrive --- TBD --- Clock to Data Output Delay Variation2, 3 ∆tQ Notes: 1 See Hysteresis Specification section. 2 Valid when clock to data phase is near center of CPM window. t and ∆t specifications are not fully characterized. Q Q 3 Increase of t for transition from –0.5-V input voltage to small positive input voltages, V and V , relative to input Q 1 2 threshold voltage, where V1 = 20 mV, V2 = 10 mV. See note 1 for determining the threshold voltage. 4 Deterministic jitter measured with a 12.5 Gbps, 27-1 PRBS pattern. 5 Random jitter measured with a 12.5 Gbps, 1010… pattern. 6 See Figure 1 for minimum output return loss specification. 1/31/05 25706CP_DS_1.1 Inphi Proprietary Page 4 of 15 ps ps Output Return Loss Specification Minimum Output Return Loss Specification Output Return Loss (dB) 16 12 8 4 0 0 5 10 15 20 25 Frequency (GHz) Figure 1. Minimum output return loss specification. Timing Diagram IN - 1 2 3 4 5 IN+ CLKIN = CLKINp - CLKINn 50% 50% 1/fCLK tQ DOUTn 80% 80% 1 2 20% DOUTp tf 1/31/05 25706CP_DS_1.1 Inphi Proprietary 3 20% tr Page 5 of 15 Input and Output Equivalent Circuits GND 62.5 Ω GND 62.5 Ω 50 Ω IN+ CLKINp IN- CLKINn 50 Ω GND 65 Ω 65 Ω DOUTp DOUTn 1/31/05 25706CP_DS_1.1 Inphi Proprietary Page 6 of 15 Typical Operating Characteristics Typical Output Waveforms Figure 2. Output DOUTp data eye from on-wafer measurement (DC coupled). Source is 10 Gbps 27–1 PRBS pattern (scope view is 100 mV/div, 20 ps/div) Figure 3. Output DOUTp data eye from on-wafer measurement (AC coupled). Source is 10 Gbps 27–1 PRBS pattern (scope view is 100 mV/div, 20 ps/div) DC Characteristics Output Amplitude (OutP, single-ended) vs. Supply with Temperature as parameter VOUTp VOH vs. Supply with Temperature as parameter -52 T = -5 C T = -5 C 0.67 -54 T = 25 C VOUTp VOH (mV) OutP Amplitude (V) 0.69 T = 85 C 0.65 0.63 0.61 0.59 T = 25 C T = 85 C -56 -58 -60 -62 0.57 0.55 -64 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.0 Power supply (V) 25706CP_DS_1.1 3.2 3.3 3.4 3.5 3.6 Power supply (V) Figure 4. Output DOUTp amplitude swing (volts pk-pk) vs. VEE and temperature. Source is 25 Gbps 27–1 PRBS pattern. 1/31/05 3.1 Figure 5. Output DOUTp HIGH voltage (volts DC) vs. VEE and temperature. Source is 25 Gbps 27–1 PRBS pattern. Inphi Proprietary Page 7 of 15 Typical Operating Characteristics Eye Crossing (OutP) vs. Supply with Temperature as parameter VOUTp Common Mode Voltage vs. Supply with Temperature as parameter 60.0 -358 Eye Crossing (OutP) (%) VOUTp Common Mode Voltage (mV) -356 -360 -362 -364 -366 T = -5 C -368 T = 25 C -370 T = 85 C -372 55.0 50.0 T = -5 C 45.0 T = 25 C T = 85 C -374 40.0 -376 3.0 3.1 3.2 3.3 3.4 3.5 3.0 3.6 3.1 3.2 3.3 3.4 3.5 3.6 Power supply (V) Power supply (V) Figure 7. Output DOUTp data eye crossing vs. VEE and temperature. Source is 25 Gbps 27–1 PRBS pattern. Figure 6. Output DOUTp common mode voltage (volts DC) vs. VEE and temperature. Source is 25 Gbps 27–1 PRBS pattern. Power Dissipation vs. Supply with Temperature as parameter 0.75 Power Dissipation (W) 0.70 T = -5 C 0.65 T = 25 C T = 85 C 0.60 0.55 0.50 0.45 0.40 3.0 3.1 3.2 3.3 3.4 3.5 3.6 Power supply (V) Figure 8. Power dissipation of the 25706CP (W) vs. VEE and temperature. 1/31/05 25706CP_DS_1.1 Inphi Proprietary Page 8 of 15 Typical Operating Characteristics AC Characteristics Peak-to-Peak Jitter (OutP, 2^7-1 patt.) vs. Supply with Temperature as parameter 3.5 Random Jitter (outp) vs. Supply with Temp. as parameter 220 Random Jitter (RMS in fs) Peak-to-Peak Jitter (ps) T = -5 C 3.0 2.5 2.0 T = -5 C 1.5 T = 25 C T = 85 C 215 T = 25 C T = 85 C 210 205 200 195 190 185 1.0 3.0 3.1 3.2 3.3 3.4 3.5 3.0 3.6 3.1 Power supply (V) 3.3 3.4 3.5 3.6 Power supply (V) Figure 9. Output DOUTp deterministic jitter as measured on the oscilloscope (ps pk-pk) vs. VEE and temperature. Source is 25 Gbps 27–1 PRBS pattern. Measurement includes deterministic jitter of source and test equipment. Figure 10. Output DOUTp random jitter (ps RMS) vs. VEE and temperature. Source is 25 Gbps 27–1 PRBS pattern. Measurement includes random jitter of source and test equipment. Rise Time (OutP) vs. Supply with Temperature as parameter Phase Margin vs. Supply with Temperature as parameter 330 17.0 T = -5 C 16.5 Phase Margin (degrees) Rise Time (OutP) (ps) 3.2 T = 25 C T = 85 C 16.0 15.5 15.0 14.5 328 T = -5 C 326 T = 25 C 324 T = 85 C 322 320 318 316 314 312 310 14.0 3.0 3.1 3.2 3.3 3.4 3.5 3.0 3.6 Figure 11. Output DOUTp rise time (ps) vs. VEE and temperature. Source is 25 Gbps 1010… pattern. 1/31/05 25706CP_DS_1.1 3.1 3.2 3.3 3.4 3.5 3.6 Power supply (V) Power supply (V) Figure 12. Analog input to clock input phase margin (degrees) vs. VEE and temperature. Source is 25 Gbps 27–1 PRBS pattern. Inphi Proprietary Page 9 of 15 Typical Operating Characteristics Hysteresis Characteristics Hysteresis versus Soak Time Delta VOUT versus Delta VIN 20.00 0.8 16.00 55 C 0.4 Delta Vout (V) 18.00 25 C 85 C 0.2 0.0 -0.2 -10 -5 0 5 10 Data Hysteresis (mV) 0.6 -5 C -0.4 14.00 12.00 10.00 8.00 6.00 4.00 2.00 -0.6 0.00 (µs) 0.001 (Mbps) 1000 -0.8 Delta Vin (mV) Figure 13. Typical analog input (IN+) DC hysteresis on the 25706CP. For this measurement, the offset voltage was calculated from the swept data by taking the average of the threshold for the positive and negative sweep. The difference between the thresholds is the hysteresis. 0.01 100 0.1 10 Data Soak 1 1 10 0.1 100 0.01 Figure 14. Analog input (IN+) thermal hysteresis on the 25706CP is shown as a function of input soak time in µs (and equivalent data rate in Mb/s). Input used was a 1010… square wave pattern at varying data rates. Clock frequency set to 1 GHz. S-Parameter Characteristics Data Output S22 Amplitude 0 0 -5 -5 -10 -10 S22 amplitude (dB) S11 amplitude (dB) Analog Input S11 Amplitude -15 -20 -25 -30 -35 -15 -20 -25 -30 -35 -40 -40 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 5 Frequency (GHz) 25706CP_DS_1.1 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 Frequency (GHz) Figure 15. Input Return Loss under typical VEE and temperature conditions. 1/31/05 6 Figure 16. Output Return Loss under typical VEE and temperature conditions. Inphi Proprietary Page 10 of 15 0.980 mm Die Pad Layout GND VEE VEE GND GND VEE VEE GND 1 24 23 22 21 20 19 18 GND GND 2 17 IN- DOUTp 3 16 IN+ DOUTn 4 15 65 ± 5 µm (4 sides) GND GND 5 14 GND GND 6 7 CLKINp 8 CLKINn GND VEE VEE GND 9 10 11 12 13 1.280 mm Notes: 1. 2. 3. Numbers correspond to 100 µm squares on 150 µm pitch. Pad outer dimensions fit either to squares or to rectangles enclosing two adjacent squares. Die thickness = 150 ± 10 µm. Name Pad Square Number IN- 3 Inverting analog input. Internally terminated 65 Ω to GND. Input IN+ 4 Non-inverting analog input. Internally terminated 65 Ω to GND. Input CLKINp 8 Non-inverting clock input. Analog input is latched onto the rising edge of this input signal. Internally terminated 50 Ω to GND. Input CLKINn 9 Inverting clock input. Analog input is latched onto the falling edge of this input signal. Internally terminated 50 Ω to GND. Input DOUTp 16 Non-inverting data output. Back terminated 60 Ω to GND. Always terminate to 50 Ω to GND. Output DOUTn 15 Inverting data output. Back terminated 60 Ω to GND. Always terminate to 50 Ω to GND. Output GND VEE 1/31/05 Description 1, 2, 5, 6, 7, 10, 13, 14, 17, 18, Ground. 21, 22 11, 12, 19, 20, Power Supply: Connect to –3.3 V. 23, 24 25706CP_DS_1.1 Inphi Proprietary Function Supply Supply Page 11 of 15 Die Pad Locations For dimensioning purposes, reference origin (0, 0) is the lower left corner of the lower left pad. Pad Lower Left Corner 1/31/05 Pad # Signal X Y 1 GND 0 750 2 GND 0 600 3 IN- 0 450 4 IN+ 0 300 5 GND 0 150 6 GND 0 0 7 GND 150 0 8 CLKINp 300 0 9 CLKINn 450 0 10 GND 600 0 11 VEE 750 0 12 VEE 900 0 13 GND 1050 0 14 GND 1050 150 15 DOUTn 1050 300 16 DOUTp 1050 450 17 GND 1050 600 18 GND 1050 750 19 VEE 900 750 20 VEE 750 750 21 GND 600 750 22 GND 450 750 23 VEE 300 750 24 VEE 150 750 25706CP_DS_1.1 Inphi Proprietary Page 12 of 15 LGA Pinout Name Pin Description Function IN- 5 Inverting analog input. Internally terminated 65 Ω to GND. Input IN+ 3 Non-inverting analog input. Internally terminated 65 Ω to GND. Input CLKINp 26 Non-inverting clock input. Analog input is latched onto the rising edge of this input signal. Internally terminated 50 Ω to GND. Input CLKINn 24 Inverting clock input. Analog input is latched onto the falling edge of this input signal. Internally terminated 50 Ω to GND. Input DOUTp 17 Non-inverting data output. Back terminated 60 Ω to GND. Always terminate to 50 Ω to GND. Output DOUTn 19 Inverting data output. Back terminated 60 Ω to GND. Always terminate to 50 Ω to GND. Output GND 1, 2, 4, 6, 7, 9, 12, 13, 16, 18, 20, 21, 23, 25, Ground 27, Paddle VEE 10, 11, 22 NC 8, 14, 15, 28 1/31/05 25706CP_DS_1.1 Power Supply: Connect to –3.3 V Not Connected Inphi Proprietary Supply Supply NC Page 13 of 15 LGA Package Mechanical Drawing Top View Side View Side View 1/31/05 25706CP_DS_1.1 Bottom View Inphi Proprietary Page 14 of 15 Order Information Part No. Description 25706CP-S01D 25 GHz Latched Comparator (–3.3 V Supply) – Die 25706CP-S01L 25 GHz Latched Comparator (–3.3 V Supply) in LGA Package 25706CP-S01LEVB 25 GHz Latched Comparator (–3.3 V Supply) in LGA Package on an Evaluation Board with SMA Connectors Contact Information • Phone: • Fax: • E-mail: Inphi Corporation 2393 Townsgate Road, Suite 101 Westlake Village, CA 91361 (805) 446-5100 (805) 446-5189 products@inphi-corp.com Visit us on the Internet at: http://www.inphi-corp.com For each customer application, customer’s technical experts must validate all parameters. Inphi Corporation reserves the right to change product specifications contained herein without prior notice. No liability is assumed as a result of the use or application of this product. No circuit patent licenses are implied. Contact Inphi Corporation’s marketing department for the latest information regarding this product. Limited Qualification Notification NOTE: The 25706CP has been tested to meet the DC and AC electrical specifications outlined in this data sheet and a characterization report is available. While the 25706CP has not undergone full qualification testing (i.e. it has not been subjected to high temperature operation life test), a number of other products fabricated in the same semiconductor process and packaged in the same ceramic LGA package have completed full qualification testing and have been demonstrated to be reliable. Contact Inphi Corporation for more details. Updates To Version 1.0 1. Corrected block diagram on page 1. 2. Changed DC electrical specification tables on page 3 based upon recommendations in the characterization report. Specs changed are: Input VIH, Input VIL, Input VOS, Input ∆VOS/∆T, Clock Input VIL, Output DOUT, Output VOH, Output VOCM. 3. Changed AC electrical specification tables on page 4 based upon recommendations in the characterization report. Specs changed are: Clock CPM, Output RLOUT. 4. Added figure 1 – minimum output return loss specification – on page 5. 5. Added data on DC hysteresis (spec on page 3 and new diagram on figure 12). 6. Clarified previous “hysteresis” spec entries as “thermal hysteresis” (page 4 and figure 13). 7. Removed “Hysteresis Specification” section – moved to the application note instead. 1/31/05 25706CP_DS_1.1 Inphi Proprietary Page 15 of 15