FLAT-PAC™ 3
Low Profile Inductors
Description
RoHS
2002/95/EC
• 155°C maximum total temperature operation
• Low profile high current inductors
• Inductance range 0.1uh to 15uh
• Design utilizes high temperature powder iron material with a
non-organic binder to eliminate thermal aging
• Current rating up to 34.7Adc (Higher peak currents may be
attained with a greater rolloff, see rolloff curve)
• Frequency range up to 2MHz
Applications
• Computers and portable power devices
• Energy storage applications
• DC-DC converters
• Input - Output filer application
Environmental Data
• Storage temperature range: -40°C to +155°C
• Operating ambient temperature range: -40°C to +155°C
(range is application specific).
• Solder reflow temperature: +260°C max. for 10 seconds max.
Part
Number
FP3-R10-R
FP3-R20-R
FP3-R47-R
FP3-R68-R
FP3-1R0-R
FP3-1R5-R
FP3-2R0-R
FP3-3R3-R
FP3-4R7-R
FP3-8R2-R
FP3-100-R
FP3-150-R
Rated
Inductance
µH
0.10
0.20
0.47
0.68
1.00
1.50
2.00
3.30
4.70
8.20
10.0
15.0
OCL (1)
µH ± 15%
Irms (2)
Amperes
0.10
0.22
0.44
0.72
1.10
1.50
2.00
3.20
4.70
8.5
10.9
14.9
19.0
15.3
10.9
9.72
6.26
5.78
5.40
3.63
3.23
2.91
2.30
2.22
Isat (3)
Amperes
Approx. 10%
27
16
11.6
9.0
7.4
6.2
5.4
4.3
3.5
2.6
2.3
2.0
1) OCL (Open Circuit Inductance) Test parameters: 100kHz, 0.1Vrms, 0.0Adc
2) DC current for an approximate ∆T of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and
proximity of other heat generating components will affect the temperature rise.
It is recommended that the temperature of the part not exceed 155°C under
worst case operating conditions verified in the end application.
Mechanical Diagrams
TOP VIEW
2.8±0.25
Isat (4)
Amperes
Approx. 15%
34.7
20.8
14.9
11.6
9.5
8.0
6.9
5.5
4.2
3.4
3.0
2.5
DCR
mOhms @ 20°C
(Max.)
1.21
1.88
3.67
4.63
11.2
13.1
15.0
30.0
40.0
74.0
101
127
K-factor (5)
803
482
344
268
219
185
161
127
105
78
69
59
3) Isat Amperes Peak for approximately 10% rolloff @ 20°C
4) Isat Amperes Peak for approximately 15% rolloff @ 20°C
5) K-factor: Used to determine B p-p for core loss (see graph). B p-p =K*L*∆I
B p-p:(Gauss), K: (K factor from table), L: (Inductance in uH), ∆I (Peak to peak
ripple current in Amps).
RECOMMENDED PCB PAD LAYOUT
SIDE VIEW
SCHEMATIC
1
(2x)
FRONT VIEW
1.0 min.
(2x)
FP3
XXX
yww
3.00 Max
Packaging
• Units supplied in tape and reel packaging.
Reel quantity = 1,700 parts per reel.
1
7.25
Max
7.50
2.50 (2x)
2
2.8±0.25
(2x)
2
6.70
Max
Packaging Information
4.50 (2x)
1.5 Dia
min.
0.30
+/-0.05
4.0
2.0
1.5 Dia
+0.1/-0.0
1.75
A
0.3 Rad
max.
1
7.5
Bo
16.0
+/-0.3
2
Dimensions in Millimeters
Ko
SECTION A-A
A
Ao
12.0
0.5 Rad
typ.
Direction of Feed
Ao= 6.6mm
Bo= 7.1mm
Ko= 3.2mm
xxx = Inductance value
yww = Date code
FLAT-PAC™ 3
Low Profile Inductors
Inductance Characteristics
OCL vs. Isat
100
90
% of OCL
80
70
60
50
40
30
20
10
0
0
20
40
60
80
100
120
140
160
180
200
% of Isat
Core Loss
FP3 AC Loss at Frequency, kHz
Frequency (kHz)
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
250
200
300
400
500
600
700
800
900
1000
500
750
1000 1250 1500 1750 2000 2250
B p-p (Gauss)
Temperature Rise vs. Watt Loss
Temperature Rise (C)
CoreLoss (W)
CoreLoss vs. Flux Density
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
0.12
0.24
0.36
0.48
0.61
0.73
0.85
0.97
1.09
Total Loss (W)
1.21
1.33
1.45
1.57
FLAT-PAC™ 3
Low Profile Inductors
PM-4118 3/07
© Cooper Electronic
Technologies 2007
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selected, it should be tested by the user in all possible applications.
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