NXP low VF (MEGA) Schottky rectifiers in SOD123W and SOD128 FlatPower Schottky rectifiers : Small on size. Big on power. NXP’s new FlatPower packages with clip-bond technology meet the demand for thinner products with high power capabilities. Today a range of 28 medium power Schottky rectifiers are housed in new SOD123W and SOD128. They offer high power ratings similar to standard SMA/SMB packages but occupy only half of the PCB area. Key features Very low forward voltage drop VF High forward current capability IF High power capability Ptot due to new clip-bonding technology and optimized die design Key benefits Highest values for power capability Highly energy efficient Very small dimensions / low profile for economical use of space Pad layout compatible with SMA/SMB for easy drop-in replacement AEC-Q101 qualified Body dimensions SOD123W : 2.6 x 1.7 x 1.0 mm SOD128 : 3.8 x 2.5 x 1.0 mm Key applications Power management circuits, especially DC/DC converters Step-down and asynchronous converters Free-wheeling diodes for inductive loads in motors and relays Medium power low VF (MEGA) Schottky rectifiers, single SOD128 SOD123W Size (mm) 3.8 x 2.5 x 1.0 2.6 x 1.7 x 1.0 P tot (mW) 1050 950 1.0 30 1 low VF PMEG2010ER 450 0.05 low IR PMEG2010BER 360 1.5 low VF PMEG3010EP PMEG3010ER 450 0.05 low IR PMEG3010BEP PMEG3010BER Optimization 490 0.05 low VF PMEG4010EP PMEG4010ER 60 530 0.06 low VF PMEG6010EP PMEG6010ER 360 3.0 low VF PMEG3020EP 2.0 420 1.5 low VF PMEG3020CEP 450 0.1 low IR PMEG3020BEP PMEG3020ER 520 0.05 low IR PMEG3020DEP PMEG3020BER 40 490 0.1 low VF PMEG4020EP PMEG4020ER 60 530 0.15 low VF PMEG6020EP PMEG6020ER 360 5.0 low VF PMEG3030EP 450 0.15 low IR PMEG3030BEP 490 0.2 low VF PMEG4030EP 540 0.1 low IR 530 0.2 low VF 360 8.0 low VF PMEG3050EP 450 0.25 low IR PMEG3050BEP 490 0.3 low VF PMEG4050EP 30 40 60 30 5.0 340 40 30 3.0 IR max (mA) @ VR max 20 VF max (mV) @ IF max IF max (A) VR max (V) Package 40 PMEG4030ER PMEG6030EP Improved forward characteristics of low VF (MEGA) Schottky rectifiers NXP low VF Maximum Efficiency General Applications (MEGA) Schotty rectifiers in new FlatPower SOD123W compared to wire-bonded package. Improved forward characteristic Improved forward characteristic (same reverse current: IR @20 V = 0.05 mA) (same reverse current: IR @30 V = 1 mA) 1.0 2.0 0.9 forward current 0.8 IF [A] 0.7 1.8 forward current 1.6 IF [A] 1.4 0.6 1.2 0.5 1.0 0.4 0.8 0.3 0.6 0.2 0.4 0.1 0.2 0 0 0 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 forward voltage VF [V] PMEG2010BER with clip-bond technology Equivalent type 20 V/1 A with wire-bond technology 0.50 brb344 0 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 forward voltage VF [V] PMEG3020ER with clip-bond technology Equivalent type 30 V/2 A with wire-bond technology 0.50 brb345 FlatPower packages Minimized outline and reflow soldering footprint 4.4 2.9 2.8 solder lands 1.1 1.2 (2×) (2×) 2.1 1.6 solder resist solder paste occupied area 1.1 (2×) 1.2 (2×) SOD123W Dimensions in mm sod123w_fr SOD123W 6.2 4.4 4.2 solder lands 1.9 2.1 (2×) (2×) 3.4 2.5 solder resist solder paste occupied area Dimensions in mm 1.2 (2×) 1.4 (2×) SOD128 sod128_fr SOD128 Market comparison NXP rectifiers compared with competitor rectifiers in equivalent FlatPower packages Supplier Type range in SOD123W/equivalent package IF max (A) VR max (V) PMEGxER/BER 1-3 20-40, 60 2.6 x 1.7 x 1.0 Panasonic MA2x 1-3 20-40 2.6 x 1.6 x 0.8 Diodes Inc. DLFSxL 20-40 2.8 x 1.78 x 1.0 KEC SMFBx 30-40 2.6 x 1.6 x 0.98 MCC SM5/DxPL ON Semi MBRxSFx NXP 1-2 Body dimensions (mm) 20-40, 60 2.7 x 1.6 x 1.15 20-40 2.7 x 1.65 x 0.95 Rohm RBxM-x / RSX101M-30 20-40, 60 2.6 x 1.6 x 0.8 Toshiba CRSx 20-40, 60 2.6 x 1.6 x 0.98 Vishay SSxPx 30-40 3.4 x 2.0 x 1.0 IF max (A) VR max (V) Body dimensions (mm) PMEGxEP/BEP series 1-3, 5 30, 40, 60 3.8 x 2.5 x 1.0 CMSxx 1-3, 5 30, 40, 60 3.8 x 2.4 x 0.98 MA24Dx 2-3 30, 40, 60 3.8 x 2.4 x 0.9 RBxLA-x / RSX301LA-30 3 30, 40 3.8 x 2.6 x 0.95 Supplier NXP Toshiba Panasonic Rohm Type range in SOD128/equivalent package ➜ NXP advantage: Best-in-class forward current, wide voltage range FlatPower versus SMA/SMB packages: easy drop-in replacements Typical deviation from SMA/SMB -50% -50% SOD123W* * SOD128* -48% inside view showing clip-bonding structure -24% Footprint comparison: NXP SOD123W/128 on recommended solder pad Competitor SMA solder layout NXP SOD128 solder layout Competitor SMA solder layout NXP SOD123W NXP SOD128 NXP SOD128 Competitor SMB solder layout NXP SOD123W solder layout NXP SOD123W NXP SOD128 2 mm Scale Solder stencil opening and solder deposit volume must be considered. Market comparison NXP low VF (MEGA) Schottky rectifier in SOD123W/128 compared with rectifiers in SMA/SMB packages Supplier Type range in SOD123W/128/SMA package IF max (A) VR max (V) Body dimensions (mm) PMEGxER/BER PMEGxEP/BEP B1x / B2x0A / B3xA SSx-LT / SK3xA-LT MBRA1x / SS16 / BRAx RSXx / RBx Bx(L)A / SS(A)x SK1x / SK3xSMA SS1x / FMKAx SMAB3x 1, 2, 3 1, 2, 3, 5 20, 30, 40, 60 30, 40, 60 2.6 x 1.7 x 1.0 3.8 x 2.5 x 1.0 4.3 x 2.6 x 2.15 4.3 x 2.58 x 2.22 4.32 x 2.6 x 2.17 4.5 x 2.6 x 2.0 4.25 x 2.6 x 2.1 4.6 x 2.7 x 2.1 4.38 x 2.73 x 2.05 4.5 x 2.6 x 2.0 Type range in SOD128/SMB package IF max (A) VR max (V) PMEGxEP/BEP 1, 2, 3, 5 30, 40, 60 3.8 x 2.5 x 1.0 B340LB 3 40 4.32 x 3.62 x 2.31 NXP NXP Diodes Inc. MCC ON Semi ROhM Vishay Diotec Fairchild KEC Supplier NXP Diodes Inc. ON Semi Vishay Fairchild 1, 2, 3 20, 30, 40, 60 1, 3 1 3 30, 40, 60 Body dimensions (mm) MBRSx/SS26 1, 2 30, 40, 60 4.32 x 3.56 x 2.13 SL23/SS2x/B3x(L)B 2, 3 30, 40, 60 4.32 x 3.62 x 2.29 SSx/MBRS140 1, 2 30, 40, 60 4.4 x 3.63 x 2.18 ➜ NXP advantage: Smallest package with competitive electrical characteristics. For SOD128 types, broadest forward-current range from 1 - 5 A. www.nxp.com © 2010 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. Date of release: February 2010 The information presented in this document does not form part of any quotation or contract, is believed to be accurate and Document order number: 9397 750 16866 reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Printed in the Netherlands Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.