NXP low VF (MEGA) Schottky
rectifiers in SOD123W and
SOD128
FlatPower Schottky rectifiers :
Small on size. Big on power.
NXP’s new FlatPower packages with clip-bond technology meet the demand for thinner products
with high power capabilities. Today a range of 28 medium power Schottky rectifiers are housed
in new SOD123W and SOD128. They offer high power ratings similar to standard SMA/SMB
packages but occupy only half of the PCB area.
Key features
 Very low forward voltage drop VF
 High forward current capability IF
 High power capability Ptot due to new clip-bonding
technology and optimized die design
Key benefits
 Highest values for power capability
 Highly energy efficient
 Very small dimensions / low profile for economical use
of space
 Pad layout compatible with SMA/SMB for easy drop-in
replacement
 AEC-Q101 qualified
Body dimensions
 SOD123W : 2.6 x 1.7 x 1.0 mm
 SOD128 : 3.8 x 2.5 x 1.0 mm
Key applications
 Power management circuits, especially DC/DC converters
 Step-down and asynchronous converters
 Free-wheeling diodes for inductive loads in motors and relays
Medium power low VF (MEGA) Schottky rectifiers, single
SOD128
SOD123W
Size (mm)
3.8 x 2.5 x 1.0
2.6 x 1.7 x 1.0
P tot (mW)
1050
950
1.0
30
1
low VF
PMEG2010ER
450
0.05
low IR
PMEG2010BER
360
1.5
low VF
PMEG3010EP
PMEG3010ER
450
0.05
low IR
PMEG3010BEP
PMEG3010BER
Optimization
490
0.05
low VF
PMEG4010EP
PMEG4010ER
60
530
0.06
low VF
PMEG6010EP
PMEG6010ER
360
3.0
low VF
PMEG3020EP
2.0
420
1.5
low VF
PMEG3020CEP
450
0.1
low IR
PMEG3020BEP
PMEG3020ER
520
0.05
low IR
PMEG3020DEP
PMEG3020BER
40
490
0.1
low VF
PMEG4020EP
PMEG4020ER
60
530
0.15
low VF
PMEG6020EP
PMEG6020ER
360
5.0
low VF
PMEG3030EP
450
0.15
low IR
PMEG3030BEP
490
0.2
low VF
PMEG4030EP
540
0.1
low IR
530
0.2
low VF
360
8.0
low VF
PMEG3050EP
450
0.25
low IR
PMEG3050BEP
490
0.3
low VF
PMEG4050EP
30
40
60
30
5.0
340
40
30
3.0
IR max (mA)
@ VR max
20
VF max (mV)
@ IF max
IF max (A)
VR max (V)
Package
40
PMEG4030ER
PMEG6030EP
Improved forward characteristics of low VF (MEGA) Schottky rectifiers
NXP low VF Maximum Efficiency General Applications (MEGA) Schotty rectifiers in new FlatPower SOD123W compared
to wire-bonded package.
Improved forward characteristic
Improved forward characteristic
(same reverse current: IR @20 V = 0.05 mA)
(same reverse current: IR @30 V = 1 mA)
1.0
2.0
0.9
forward
current 0.8
IF
[A]
0.7
1.8
forward
current 1.6
IF
[A]
1.4
0.6
1.2
0.5
1.0
0.4
0.8
0.3
0.6
0.2
0.4
0.1
0.2
0
0
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
forward voltage VF [V]
PMEG2010BER with clip-bond technology
Equivalent type 20 V/1 A with wire-bond technology
0.50
brb344
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
forward voltage VF [V]
PMEG3020ER with clip-bond technology
Equivalent type 30 V/2 A with wire-bond technology
0.50
brb345
FlatPower packages
Minimized outline and reflow soldering footprint
4.4
2.9
2.8
solder lands
1.1 1.2
(2×) (2×)
2.1 1.6
solder resist
solder paste
occupied area
1.1
(2×)
1.2
(2×)
SOD123W
Dimensions in mm
sod123w_fr
SOD123W
6.2
4.4
4.2
solder lands
1.9 2.1
(2×) (2×)
3.4 2.5
solder resist
solder paste
occupied area
Dimensions in mm
1.2
(2×)
1.4
(2×)
SOD128
sod128_fr
SOD128
Market comparison
NXP rectifiers compared with competitor rectifiers in equivalent FlatPower packages
Supplier
Type range in SOD123W/equivalent package
IF max (A)
VR max (V)
PMEGxER/BER
1-3
20-40, 60
2.6 x 1.7 x 1.0
Panasonic
MA2x
1-3
20-40
2.6 x 1.6 x 0.8
Diodes Inc.
DLFSxL
20-40
2.8 x 1.78 x 1.0
KEC
SMFBx
30-40
2.6 x 1.6 x 0.98
MCC
SM5/DxPL
ON Semi
MBRxSFx
NXP
1-2
Body dimensions (mm)
20-40, 60
2.7 x 1.6 x 1.15
20-40
2.7 x 1.65 x 0.95
Rohm
RBxM-x / RSX101M-30
20-40, 60
2.6 x 1.6 x 0.8
Toshiba
CRSx
20-40, 60
2.6 x 1.6 x 0.98
Vishay
SSxPx
30-40
3.4 x 2.0 x 1.0
IF max (A)
VR max (V)
Body dimensions (mm)
PMEGxEP/BEP series
1-3, 5
30, 40, 60
3.8 x 2.5 x 1.0
CMSxx
1-3, 5
30, 40, 60
3.8 x 2.4 x 0.98
MA24Dx
2-3
30, 40, 60
3.8 x 2.4 x 0.9
RBxLA-x / RSX301LA-30
3
30, 40
3.8 x 2.6 x 0.95
Supplier
NXP
Toshiba
Panasonic
Rohm
Type range in SOD128/equivalent package
➜ NXP advantage: Best-in-class forward current, wide voltage range
FlatPower versus SMA/SMB packages: easy drop-in replacements
Typical deviation from SMA/SMB
-50%
-50%
SOD123W*
*
SOD128*
-48%
inside view
showing
clip-bonding
structure
-24%
Footprint comparison: NXP SOD123W/128 on recommended solder pad
Competitor SMA
solder layout
NXP SOD128
solder layout
Competitor SMA
solder layout
NXP
SOD123W
NXP
SOD128
NXP
SOD128
Competitor SMB
solder layout
NXP SOD123W
solder layout
NXP
SOD123W
NXP
SOD128
2 mm
Scale
Solder stencil opening and solder deposit volume must be considered.
Market comparison
NXP low VF (MEGA) Schottky rectifier in SOD123W/128 compared with rectifiers in SMA/SMB packages
Supplier
Type range in SOD123W/128/SMA package
IF max (A)
VR max (V)
Body dimensions (mm)
PMEGxER/BER
PMEGxEP/BEP
B1x / B2x0A / B3xA
SSx-LT / SK3xA-LT
MBRA1x / SS16 / BRAx
RSXx / RBx
Bx(L)A / SS(A)x
SK1x / SK3xSMA
SS1x / FMKAx
SMAB3x
1, 2, 3
1, 2, 3, 5
20, 30, 40, 60
30, 40, 60
2.6 x 1.7 x 1.0
3.8 x 2.5 x 1.0
4.3 x 2.6 x 2.15
4.3 x 2.58 x 2.22
4.32 x 2.6 x 2.17
4.5 x 2.6 x 2.0
4.25 x 2.6 x 2.1
4.6 x 2.7 x 2.1
4.38 x 2.73 x 2.05
4.5 x 2.6 x 2.0
Type range in SOD128/SMB package
IF max (A)
VR max (V)
PMEGxEP/BEP
1, 2, 3, 5
30, 40, 60
3.8 x 2.5 x 1.0
B340LB
3
40
4.32 x 3.62 x 2.31
NXP
NXP
Diodes Inc.
MCC
ON Semi
ROhM
Vishay
Diotec
Fairchild
KEC
Supplier
NXP
Diodes Inc.
ON Semi
Vishay
Fairchild
1, 2, 3
20, 30, 40, 60
1, 3
1
3
30, 40, 60
Body dimensions (mm)
MBRSx/SS26
1, 2
30, 40, 60
4.32 x 3.56 x 2.13
SL23/SS2x/B3x(L)B
2, 3
30, 40, 60
4.32 x 3.62 x 2.29
SSx/MBRS140
1, 2
30, 40, 60
4.4 x 3.63 x 2.18
➜ NXP advantage: Smallest package with competitive electrical characteristics. For SOD128 types, broadest forward-current range
from 1 - 5 A.
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© 2010 NXP B.V.
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Date of release: February 2010
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Document order number: 9397 750 16866
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