1
IEEE 2011, Nov 9th
Lｏｗ Transmission Loss Multi-layer Material
for High-Speed & High-Frequency Applications
MCL-FX-2 / FX-3
Hikari Murai, Yasuyuki Mizuno, Hiroshi Shimizu,
Takahiro Tanabe, Ken Ikeda and Tetsuro Irino
Telecommunication Materials Development center
Tsukuba Research Laboratory
Printed Wiring Board Material R&D Dept.
Printed Wiring Board Materials Business Sector
IEEE2011
Roadmap of Infrastructure-Communication Network
Field
Application
Servers
Routers
General
HighFrequency
Properties (Functions)
2
Required Properties of
Base Materials
Transmission Rate: 1.5 Gbps⇒ 3 Gbps Dk:4.0, Df:<0.010 Level
30Layers ⇒ 40 Layers
Lead-Free applicable
Narrow Pitch,
Symmetrical Packaging
Reflow Temp: 260 o C
Super Computers
High-End
Transmission Rate: 5 Gbps⇒
⇒ 10 Gbps
Giga bit Router
30Layers ⇒ 50 Layers
Base Station:Back panel
Reflow Temp: 260 o C
Dk:3.5, Df:<0.005 Level
Heat Resistance for Lead Free
RF modules for
Halogen Free Materials applied
Dk:<3.7, Df:<0.007 Level
Mobile Handset Devices
Frequency: 1.5 GHz ⇒ 3 GHz
High Thickness Accuracy
4Layers ⇒ 6Layers, Higher Density
Laser drill process ability
Reflow Temp: 260 o C
Heat Resistance(Lead Free)
(PA, Filter ,etc)
Halogen Free requirement
Antenna of Base Station
Phase Shifters,
Frequency: 1.5 GHz ⇒ 3 GHz
From Teflon & PPE boards
Anti crash rader on
to Lower Cost Materials
automotive and etc
Frequency: 24 GHz ⇒ 76 GHz
Halogen free material
Dk:<3.5, Df:<0.003 Level
Lower Process Cost
Drift of electric property on
water absorption
IEEE2011
3
Property map of high frequency materials
Dk(1 GHz)
4.4 4.3 4.2 4.1 4.0 3.9 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3.1 3.0 2.9 2.8
0
0.0020
FX-3
Fx-2
Teflon Grade
0.0040
Df(1 GHz)
0.0060
High-End Grade
0.0080
Dk 3.7 / Df 0.007
JPCA-HCL01/21
IEC 61249-2-32/34
0.0100
0.0120
0.0140
Middle-Range Grade
0.0160
Dk 4.1 / Df 0.017
JPCA-HCL02/22
IEC 61249-2-31/33
0.0180
0.0200
Filled High Tg
Standard FR4
0.0220
High Tg FR-4
0.0240
※ JPCA TM001/IPC TM650 2.5.5.5.1
IEEE2011
Requirement of Material for High-Frequency PWBs 4
Important issue in high-frequency circuits
Stripline
Reducing transmission loss
Transmission loss( a ) = Conductor loss( ac ) + Dielectric loss( ad )
ad = 27.3
f
c
Dk
Df
Dk : dielectric constant, Df : Dissipation factor, f : Frequency, c : Light velocity
b
t
w
b : Dielectric layer thickness
w : Conductor width
t : Conductor thickness
Propagation delay time
Td =
Characteristic impedance Zo =
Dk
c
60
In
Dk
4b
0.67p(0.8w + t)
< Solution for Requirement >
/ Reduction of ad
Low Dk & Df Resin Technology
(Excellent dielectric properties & Stable Dk &Df for the wide
range of frequency, temperature, humidity, …..)
/ Reduction of ac
Original Profile-Free Conductor
(High adhesion technology for very low surface roughness foil)
IEEE2011
5
Development Concept of New Resin System
< Structure model of cured new resin >
Non-polar & Rigid
Linear polymer
High Tg & High strength
Hardener
Low Dk & Low Df
Thermosetting resin
Low Df Inorganic filler
Low Dk & Low Df
Thermosetting resin system
(Low-polar cross-linking design)
Non-polar & Rigid
Liner polymer
Semi-IPN structure resin
Low Dk / Low Df
by Original polymer alloy technology
Stable Dk & Df
vs. Temperature & Humidity
Low Df Inorganic filler
High heat resistance
Filler/Resin Interface Control
Good insulation reliability
Low Df
Low water absorption
Low Dk / Low Df
High Tg
Low water absorption
High heat resistance
Low CTE
Novel high performance material
IEEE2011
General Properties of New Material
Item
Dielectric Constant (Dk)
Dissipation factor (Df)
Copper peel strength (18 µm)
Glass transition temperature (Tg)
CTE
Heat resistance (T-288)
Heat resistance
(288 oC/20 s dipping)
Water absorption
CAF restraining property ****
Flammability
6
Condition
Unit
FX-2
PTFE/E-Glass
substrate
Conventional
FR-4
1 GHz *
1 GHz **
3 GHz **
1 GHz *
1 GHz **
3 GHz **
Standard (Rz: 5-7 µm)
VLP (Rz: 3-4 µm)
PF (Rz: 1 µm)
TMA
xy
z1
z2
IPC-TM-650 2.4.24.1
PCT*** -3 h
PCT*** -5 h
PCT*** -5 h
UL-94
-
3.50 - 3.55
3.40 - 3.45
3.40 - 3.45
0.0014 - 0.0018
0.0024 - 0.0028
0.0034 - 0.0038
0.7 - 0.9
0.6 - 0.7
0.7 - 0.8
175 - 185
14 - 15
48 - 55
100 - 130
> 60
Good
Good
0.20 - 0.30
> 1000
V-0
2.65 - 2.70
2.60 - 2.65
2.60 - 2.65
0.0005 - 0.0010
0.0024 - 0.0028
0.0030 - 0.0034
1.3 - 1.4
20 - 25
17
100 - 110
290 - 320
Good
Good
0.01 - 0.02
V-0
4.10 - 4.20
4.00 - 4.10
3.95 - 4.05
0.0160 - 0.0180
0.0180 - 0.0200
0.0200 - 0.0220
1.4 - 1.6
120 - 130
14 - 17
50 - 70
240 - 310
<3
NG
NG
1.0 - 1.2
> 1000
V-0
kN/m
o
C
ppm/ oC
min
%
h
-
o
* IPC-TM-650 2.5.5.9: Capacitance method with RF Impedance/Material Analyzer (25 C)
** JPCA-TM001 A test method for copper-clad laminates for printed wiring boards dielectric constanat and dissipation factor.
o
IPC-TM-650 2.5.5.5.1: Triplate-line resonator method with Network Analyzer (25 C)
o
*** Moisture treatment condition: PCT (121 C/0.22 MPa)
o
**** TH/TH wall thickness: 0.3 mm, Condition: 85 C/85%RH, 100 V dc applied
IEEE2011
Dielectric Properties (vs. Frequency)
7
< Measurement Conditions >
/ Method:Triplate-Line Resonator by Vector Network Analyzer/JPCA TM001/IPC-TM-650_2.5.5.5.1
/ Temperature & Humidity: 25 oC / 60 %RH
/ Laminate Thickness: 0.8 mm (Signal-Ground Distance: 0.8 mm), Copper foil:18 µm
/ Signal Conductor Line Width: 1 mm
4.5
0.025
Conventional FR-4
Conventional FR-4
0.020
4.0
FX-2
3.5
Df
Dk
0.015
0.010
3.0
FX-2
0.005
PTFE/E-glass
PTFE/E-glass
0
2.5
0
2
4
6
8
Frequency (GHz)
10
0
2
4
6
8
10
Frequency (GHz)
Excellent stability of dielectric properties in wide frequency bands
IEEE2011
Dielectric Properties (vs. Frequency 1 to 30GHz)
8
< Measurement Conditions >
/ Method:Triplate-Line Resonator by Vector Network Analyzer/JPCA TM001/IPC-TM-650_2.5.5.5.1
/ Temperature & Humidity: 25 oC/ 60 %RH
/ Laminate Thickness: 0.8 mm(Signal-Ground Distance: 0.8 mm), Copper foil:18 µm
/ Signal Conductor Line Width: 1 mm
3.8
0.010
3.7
0.008
FX-2
0.006
FX-2
3.5
Df
Dk
3.6
0.004
3.4
3.3
0.002
3.2
0
0
5
10
15
20
Frequency (GHz)
25
30
0
5
10
15
20
25
30
Frequency (GHz)
IEEE2011
9
Resin / Glass Fabric Effect of Dk/Df
0.04
8
7
Epoxy/Dicy Curing
Low Dk Glass（＊
＊）
5
Df
Dk
0.03
E Glass（＊
＊）
6
Epoxy/Dicy Curing
4
3
0.01
PTFE
2
0.02
Low Dk Glass（＊
＊）
E Glass（＊
＊）
PTFE
0
1
1M
10M
100M
1G
Freqency: Hz
10G
1M
10M
100M
1G
10G
Frequency: Hz
＊） Glass Fabric Data by suppler
IEEE2011
Dk & Df of new material
10
Relationship between Dk&Df and resin content of laminates
＜ Measurement Conditions ＞
/ Method：
：Triplate-Line Resonator by Vector Network Analyzer (JPCA tm001/IPC-TM-650_2.5.5.5.1)
/ Temperature & Humidity：
：25 ℃/ 60 %RH
/ Laminate Thickness：
：1.6 mm (Signal/Ground: 800 μm apart), Copper foil：
：18 μm
/ Signal Conductor Line Width：
：1 mm (Zo: ca. 50 Ω)
0.025
4.4
Conventional FR-4
4.0
Low Dk Epoxy
3.8
3.6
3.4
3.2
3.0
0.020
Df(1GHz)
Df
(1 GHz)
Dk(1GHz)
Dk (1 GHz)
4.2
0.015
Conventional FR-4
Low Dk Epoxy
0.010
Current Low Dk
Current Low Dk
0.005
FX-2
2.8
0
FX-2
50 55 60 65 70 75 80 85 90
50 55 60 65 70 75 80 85 90
Resin Content(vol%)
Resin Content(vol%)
IEEE2011
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Filler/Resin-Composite Technology(1)
Interface Control between Filler and Resin (FICS)
Matrix resin
Inorganic
Filler
Optimization of filler / resin-interface
High Dispersion & Excellent adhesion
/ Low water absorption
/ Excellent heat resistance
/ Excellent electric insulation
and CAF restraining property
Aggregation
/ Increase in water absorption
/ Poor heat resistance
/ Poor electric insulation
and CAF restraining property
IEEE2011
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Filler/Resin-Composite Technology(2)
Effect by Optimal Interface Control on Df of the Cured Resin
0.0050
Df of the cured resin after PCT
< Cross section of cured resin >
Df after
(1 GHz)
Df(1GHz,
PCT-5h)
Untreated
Filler
0.0045
0.0040
0.0035
0.0030
Optimally treated
0.0025
0.30
0.35
0.40
0.45
0.50
Excellent dispersion & adhesion
Water Abshorption
Water absorption
(%, after PCT-5 h)
(mass% ， after PCT-5h)
IEEE2011
Dk, Df Deviation Analysis (- Filler size impact)
13
Df
Conventional
Filler used
Dk
F value 221
F value 55.0
Frequency GHz
Frequency GHz
Dk
Smaller particle
filler used
Df
F value 363
F value 91.0
Frequency GHz
Frequency GHz
Dk Standard Dev. of small filler is 22% lower than that of conventional
Df Standard Dev. of small filler is 18% lower than that of conventional
IEEE2011
Dk, Df Deviation Analysis
(- Fiber wave Impact: #1078 vs. #1080)
14
Df
Conventional Glass
(#1080×
×13ply
RC:57.9%)
Dk
F value243
F value 46.9
Frequency GHz
Frequency GHz
F value 244
Df
Dk
Spread out Glass
(#1078×
×13ply
RC:55.5%)
F value 81.8
Frequency GHz
Frequency GHz
Dk standard Dev. Of 1078 is equivalent to that of 1080
Df Standard Dev. of 1078 is 24% lower than that of 1080
IEEE2011
15
Copper Roughness
● Surface
shape of matt side by SEM
5.0 µm
Standard Rz : 6-8 µm
● Surface
Rz=7 µm
5.0 µm
5.0 µm
VLP Rz : 3-4 µm
Profile-free Rz : 0.5-1.5 µm
shape of matt side by AFM
Rz=2.5 µm
Rz=0.5 µm
IEEE2011
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Copper Roughness ; Etching Effect
● ClossCloss-section
of stripe line : Line width 100 µm, Thickness 18 µm
Standard
VLP
100μm
10μm
Profile-free
100μm
10μm
100μm
10μm
IEEE2011
Transmission Loss Evaluation (Up to 20 GHz)
(- Copper Impact)
17
(1) Copper Foils
Base Material
Copper
Supplier
MCL-FX-2
PF foil
HVLP foil
VLP foil
Std. foil
Hitachi original
F
M
N
(2) Measurement Method
Agilent：E8364B
Measurement condition：Strip-line resonator method S21 (Zo:50 Ω)
Prepreg (100 μm)
18 μm Copper (1/2 Oz.)
Core (100 μm)
Strip-Line Structure
Test Board
IEEE2011
18
Transmission Loss (- Copper Impact)
Transmission Loss (dB/m)
MCL-FX-2 Transmission Loss (Various Copper foils)
0
PF foil
HVLP foil
-10
VLP foil
Std. foil
-20
-30
-40
-50
-60
-70
0
5
10
Frequency (GHz)
15
20
IEEE2011
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General Properties of FX-3
Item
Cond.
Unit
FX-2
FX-3
-
-
E
NE
3.40 - 3.45
3.15 - 3.20
3.40 - 3.45
3.15 - 3.20
0.0024 - 0.0029
0.0020 - 0.0025
0.0034 - 0.0039
0.0024 - 0.0028
Glass Fabric Type
Dk
1 GHz
-
3 GHz
Df
IPC-TM650
2.5.5.1
1 GHz
-
3 GHz
Copper Peel Strength
Standard (18 µm)
0.8 - 0.9
kN/m
MCL-LX-67Yの一般特性
VLP (18 µm)
0.6 - 0.7
0.8 - 0.9
0.6 - 0.7
PF (18 µm)
0.7 - 0.8
0.7 - 0.8
Td
TGA 5 % loss
o
C
370 - 390
370 - 390
Tg
TMA
o
C
175 - 185
175 - 185
CTE
αx1
14 - 17
14 - 17
45 - 55
45 - 55
100 - 130
100 - 130
>5h
>5h
0.20 - 0.30
0.20～0.30
o
αz1
ppm/ C
αz2
Solder Resistance
o
288 C/20 s
Water Absorption
PCT-5 h
*1
wt%
o
*1) PCT(121 C/0.22 MPa)
IEEE2011
Dielectric Properties (vs. Frequency)
20
＜ Measurement Conditions ＞
/ Method： Triplate-Line Resonator by Vector Network Analyzer (JPCA-TM0001,IPC-TM-650 2.5.5.1)
/ Temperature & Humidity： 25 ℃/ 60 %RH
/ Laminate Thickness： 0.8 mm (Signal-Ground Distance: 800 µm), Copper foil：18 µm
/ Signal Conductor Line Width： 1 mm (Zo: approx.50 Ω)
0.010
3.8
0.008
Dissipation factor (Df)
Dielectric Constant (Dk)
3.7
3.6
3.5
3.4
FX-2 (VLP)
3.3
FX-2 (PF)
0.006
0.004
FX-2 (PF)
FX-2 (VLP)
0.002
3.2
FX-3 (VLP)
FX-3 (VLP)
0
3.1
0
2
4
6
Frequency (GHz)
8
10
0
2
4
6
8
Frequency(GHz)
Excellent stability of dielectric properties in wide frequency bands
IEEE2011
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21
Electrical Performance in High Frequencies
Transmission Loss（
（S-Parameter(S21)）
）
＜ Measurement Conditions ＞
/ Dimension Parameters
/ Evaluation PWB： Strip-Line Structure
・Line-Width (w)：0.124～0.138 mm
w
/ Material： FX-2, FX-3
・Dielectric Thickness (b)：0.26 mm
t
b
/ Temperature & Humidity： 25 ℃/60 %RH
・Copper Thickness (t)：18 µm
/ Characteristic Impedance： 50 Ω
・Line-Length：500 mm
/ Connection：Though Hole-SMA （by Solder）
Frequency (GHz)
/ Inner Layer Surface Treatment： Reduction Treatment
0
Transmission Loss (dB/m)
Testing Board
2
3
4
5
6
0
＜ Evaluation System ＞
V-NA
1
-5
-10
FX-3＋
＋VLP
-15
FX-3+HVLP
-20
FX-2＋
＋VLP
-25
-30
FR-4
-35
-40
IEEE2011
Conclusions
22
1. Several factor need to be considered for 100G
channel construction
(1) Resin system, resin content
(2) Filler, filler size and coating
(3) Copper foil roughness
(4) Glass wave impact
2. Demonstrated two materials (FX-2/FX-3) can meet
1M channel objective reach.
IEEE2011