iVPX7223 Series 3U VITA 46 VPX & VITA 65 OpenVPX Processor Board Fully rugged 3U SBC for extreme environments nn 2nd generation Intel® Core™ i7 2.20 GHz dual-core integrated processor nn Up to 8GB ECC-protected DDR3-1333, soldered down nn Intel® QM67 platform controller hub (PCH) nn 256Kbytes F-RAM nn PCI Express Fat Pipe data plane nn 1000BASE-BX/KX control plane nn SATA, USB and serial interfaces nn Integrated 2D/3D graphics with digital and VGA output nn One XMC site nn Optional rear transition module nn Extended temperature -40 °C to +85 °C and rugged variants nn Air and conduction cooled nn VITA 48 REDI two-level maintenance (2LM) One of first in a new line of VPX products from Emerson Network Power, the 3U iVPX7223 features the dual-core 2nd generation Intel® Core™ i7 2.20 GHz processor with integrated graphics and memory controller and the mobile Intel® QM67 PCH chipset with leading edge I/O functionality. This high compute density platform offers both high speed fabric connectivity with PCI Express and Gigabit Ethernet control plane connectivity with data transfer rates up to 5Gbps. On-board memory includes 4GB DDR3-1333 memory (designed for 8GB), embedded USB flash, and 256KB non-volatile Ferroelectric Random Access Memory (F-RAM). Additional connectivity includes three USB 2.0 ports, two serial ports, three SATA ports, eight GPIO, DisplayPort, VGA and one XMC site for maximum flexibility. The iVPX7223 is a fully rugged SBC for extreme environments with extended shock, vibration, temperatures and conduction cooling. It is designed for a range of industrial, communication and military/aerospace applications. The iVPX7223 software support includes Solid and Stable BIOS with password protection and a wide range of operating systems including Wind River VxWorks, Linux, Microsoft® Windows® Embedded Standard 2009, Red Hat Fedora, Green Hills INTEGRITY, and LynuxWorks LynxOS. iVPX7223 Block Diagram DDR3 ECC SDRAM Channel A PCIe x8 (Gen 2) DDR3-1333 x12d I/O Intel® Sandy Bridge-Mbl+ECC LV CPU (Up to 8 GB on two channels) DDR3 ECC SDRAM Channel B DDR3-1333 PLX PEX8617 PCIe Switch BIOS/FW Flash 2 8MB SM3252 Flash Controller 1x SATA Gen 2 USB2.0 PCIe x4 (Gen 2) SMBus VPD EEPROM 2Kbit Temp Sensor 1 Config ROM 512Kbit Temp Sensor 2 Intel® Cougar Point-Mbl PCH Config ROM 256Kbit PCIe x4 (Gen 2) Data Plane SPI Config ROM 256Kbit Intel® 82580 Dual GbE Controller 1000BASE-BX Control Plane 1000BASE-BX Control Plane 3x SATA (2x Gen 3, 1x Gen 2) SMBus 3x USB 2.0 8 GPIO TPM IPMC Data Plane SPI SPI SLC NAND Flash 4GB PCIe x4 (Gen 2) DMI PCIe x8 (Gen 2) FDI BIOS/FW Flash 1 8MB WP Override x4 XMC Site VGA DisplayPort LPC Peripheral Clocks UART FRAM 1MB Parallel Bus Merged XDP Port FPGA UART COM0 UART COM1 I2C 2 Dual XCVR SYS_CON#, (RTM Control) RS-232 or RS-422/RS-485 RS-232 or RS-422/RS-485 VPX Backplane P0/P1/P2 Specifications PROCESSOR Dual-core 2nd generation Intel® Core™ i7-2655LE, 2.20 GHz, 4MB L2 cache, 25 W Dual DDR3-800/1066/1333 memory controller Two (2) PCI Express (PCIe) root controllers with 16 lanes Gen2 PCIe (max. 5.0 GT/s) x4 DMI interface to platform controller hub (PCH) CHIPSET Intel® QM67 PCH Eight (8) PCI Express root controllers and 8 lanes Gen2 PCIe (max. 5.0 GT/s) backplane I/O Two (2) 1000BASE-BX/KX Ethernet (Ultra Thin Pipe control plane) Two (2) PCIe x4 Gen2 (Fat Pipe data plane) cc One port configurable with non-transparent bridging capability) One (1) DisplayPort One (1) VGA Three (3) USB 2.0 Three (3) SATA (2x Gen3, 1x Gen2) Two (2) RS-232/RS-422/RS-485 Six (6) 6x SATA controllers Eight (8) GPIO 14 USB 2.0 host controllers XMC X12d I/O Three (3) digital displays (DP/eDP*/HDMI/DVI/ sDVO*) SMBus One (1) analog display (CRT/VGA) Selective Read-Only Override pins SPI interface (2 CS#) RTM control signals LPC interface SMBus Programmable interrupt controller, watchdog timer, real-time clock Gigabit Ethernet controller 10/100/1000BASE-T* * Not utilized in iVPX7223 IPMC I2C front panel i/o (air cooled only) Air cooled cc XMC front panel I/O cc Reset switch cc Status LEDs Conduction-cooled blade MEMORY cc Reset switch 4GB dual-channel DDR3-1333 memory with ECC soldered down cc Status LEDs Support for 8GB memory user flash/nvram memory ethernet controllers x4 PCIe to 2x 1000BASE-BX/KX to OVPX backplane through 82580 Ethernet controller 256KB F-RAM (NVRAM) One (1) XMC site (1x SATA Gen2 routed to the XMC for an optional mutually-exclusive SSD mezzanine card) boot flash memory openvpx profiles Dual UEFI in dual 8MB SPI flash devices Payload module profile 4GB embedded USB flash Support for crisis recovery cc MOD3-PAY-2F2U-16.2.3-3 Payload slot profile cc SLT3-PAY-2F2U-14.2.3 cc SLT3-PAY-1F1F2U-14.2.4 optional transition modules Mini DisplayPort, VGA, USB 2.0, Ethernet, Serial, I2C, GPIO, SATA, XMC IO, write protect override switches 3 other features mtbf Watchdog unit Calculated per Telcordia SR-332, Issue 1 and based on a ground fixed, controlled environment assuming an inlet air temperature of between 0 °C and 50 °C. 200,000 hours Trusted Platform Module (TPM) Intel® vPro™ Technology capable (supports Intel® TXT, VT, and TPM) VITA 46.11 system management IPMI V1.5 compliant Multiple 32-bit timers Temperature sensors electromagnetic compatibility (emc) Intended for use in systems meeting the following regulations: cc US: FCC Part 15, Subpart B, Class A (non-residential) cc Canada: ICES-003, Class A (non-residential) Status and user LEDs Reset switch Locking ejector handles One of the CPU’s two PCI Express ports is set up for future Gen3 compliance (going to the XMC site) BIOS UEFI BIOS cc CE Mark per European EMC Directive 89/336/EEC with Amendments; Emissions: EN55022 Class B; Immunity: EN55024 documentation Installation Guide and Technical Reference Manual power requirements Maximum for 2.20 GHz (iVPX7220), 4GB memory variant cc Emerson board products are tested in a representative system to the following standards: Hardware Release Notes Linux Installation and Programmer’s Guides 5.0 V 58 W (Estimated) ENP2 and ENP4 available for this product line. Environmental Requirements Ruggedization Level3 Method Operating Temperature ENP1 ENP2 ENP3 ENP4 Forced Air Forced Air Conduction Conduction 0°C to +55°C -40°C to +71°C -40°C to +71°C -40°C to +85°C Storage Temperature -40°C to +85°C -50°C to +100°C -50°C to +100°C -50°C to +125°C Vibration Sine (10min/axis) 2G, 5 to 500Hz 5G, 15 to 2000Hz 10G, 15 to 2000Hz 10G, 15 to 2000Hz Vibration Random (1hr/axis) .002g2/Hz, 15 to 2000Hz .04g2/Hz, 15 to 2000Hz (8GRMS)1 0.1g2/Hz, 15 to 2000Hz (12GRMS) 2 0.1g2/Hz, 15 to 2000Hz (12GRMS)2 Shock 20g/11mS 30g/11mS 40g/11mS 40g/11mS Humidity to 95% RH4 to 95% RH4 to 95% RH4 to 95% RH4 Optional Optional Optional Optional Conformal Coating Note 1: Flat 15-1000 Hz, -6db/octave 1000-2000 Hz [MIL-STD 810F Figure 514.5C-17] Note 2: +3db/octave 15-300 Hz, Flat .1g2 300-1000 Hz, -6db/octave 1000-2000 Hz [MIL-STD 810F Figure 514.5C-8] Note 3: Component and/or assembly screening shall be employed to satisfy feature/functional requirement (where feasible) when components are not available that meet ruggedization level requirements. 4 Ordering Information Part Number Description iVPX7223-220402 Intel® Core™ i7 2.20 GHz, 4GB DDR3 ENP2 .8” pitch iVPX7223-220422 Intel Core i7 2.20 GHz, 4GB DDR3 ENP2 1” pitch iVPX7223-220414 Intel Core i7 2.20 GHz, 4GB DDR3 ENP4 .85” pitch iVPX7223-220414L Intel Core i7 2.20 GHz, 4GB DDR3 ENP4 .85” pitch 2LM iVPX7223-RTM2 7223 rear transition module ENP2 Please contact your sales representative for additional processor and memory variants. Solution Services Emerson Network Power provides a portfolio of solution services optimized to meet your needs throughout the product lifecycle. Design services help speed time-to-market. Deployment services include global 24x7 technical support. Renewal services enable product longevity and technology refresh. Intel and Core are trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Microsoft and Windows are trademarks of Microsoft Corporation. All other product or service names are the property of their respective owners. This document identifies products, their specifications, and their characteristics, which may be suitable for certain applications. It does not constitute an offer to sell or a commitment of present or future availability, and should not be relied upon to state the terms and conditions, including warranties and disclaimers thereof, on which Emerson Network Power may sell products. 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